CN117368227A - Matrix type integrated circuit surface defect detection device based on visual detection - Google Patents

Abstract

The invention relates to the technical field of integrated circuit detection, and discloses a matrix type integrated circuit surface defect detection device based on visual detection, which includes a detection workbench. The detection workbench is provided with a double-sided flipping detection mechanism and a matrix visual detection mechanism; The matrix visual inspection mechanism includes a hollow inspection box and a inspection plate. The inspection plate is fixed in the hollow inspection box. Multiple visual camera heads are installed at the bottom of the inspection plate. The multiple visual camera heads are arranged in a rectangular array. The double-sided flipping detection mechanism can automatically detect the flipping of integrated circuit boards. The output of integrated circuits that pass the double-sided inspection is packaged, which reduces the exposure time of the integrated circuits and reduces the risk of scratches on the integrated circuit boards caused by being exposed for too long. Risk; Multiple vision camera heads divide the integrated circuit board into multiple rectangular areas in sequence. The vision camera head magnifies and detects the area, which can obtain a magnified and clear image, and can magnify and detect precise and small components.

Description

A matrix integrated circuit surface defect detection device based on visual inspection

Technical field

The invention relates to the technical field of integrated circuit detection, specifically a matrix integrated circuit surface defect detection device based on visual detection.

Background technique

An integrated circuit is a miniature electronic device or component. Using a certain process, the transistors, resistors, capacitors, inductors and other components and wiring required in a circuit are interconnected together, made on a small or several small semiconductor wafers or dielectric substrates, and then packaged in a tube shell , into a microstructure with the required circuit functions. Integrated circuits must be inspected during the production process. The inspection includes performance inspection and appearance inspection. Appearance inspection items include scratches and dent defects that may cause performance problems of integrated circuits. With the rapid development of machine vision inspection, visual inspection Detection is also widely used in the appearance inspection of integrated circuit boards, replacing the traditional manual inspection method. It has the advantages of high detection accuracy and fast detection efficiency. Machine vision inspection: the product to be inspected is photographed through an industrial camera, and the captured pictures are imaged. After processing, compare it with the standard picture to determine whether there are defects. Machine vision inspection technology is becoming more and more mature in surface defect detection, but the supporting inspection equipment is not perfect. First, the integrated circuit board is integrated with transistors, resistors, capacitors, etc. Components, the current visual inspection can only collect the overall image of the integrated circuit board to determine the defects of the integrated circuit board, but it cannot conduct more precise surface defect detection on precision components such as transistors, resistors, capacitors, etc., and there is a large detection error; Secondly, the existing inspection equipment cannot inspect both sides of the integrated circuit at one time. After inspection of one side, it needs to be manually turned over and then re-entered into the inspection equipment to detect defects on the other side. To ensure inspection efficiency, a After one side of the batch of integrated circuit boards is inspected, the other side of the batch of integrated circuit boards is then uniformly inspected. However, this method increases the exposure time and transportation path of the integrated circuit boards, and increases the risk of scratches or damage to the integrated circuit boards. .

Contents of the invention

The purpose of the present invention is to overcome the shortcomings of the existing technology and provide a matrix integrated circuit surface defect detection device based on visual inspection to solve the problems mentioned in the above background technology.

The object of the present invention is achieved through the following technical solutions: a matrix integrated circuit surface defect detection device based on visual detection, including a detection workbench, the detection workbench is provided with a double-sided flipping detection mechanism and a matrix vision Detection mechanism, the double-sided flipping detection mechanism includes a left flipping plate, a right flipping plate, a two-way threaded screw and a belt transmission assembly. Two sets of mounting support plates are fixed on the detection workbench. They are arranged at intervals perpendicular to the conveying direction of the integrated circuit. The two ends of the two-way threaded screw are rotatably connected to the two sets of mounting support plates. The left flipping plate and the right flipping plate are threadedly sleeved on the two-way threaded screw. On the two threaded sections of the bar with opposite thread directions, the end surface of the left flipping plate close to the right flipping plate and the end surface of the right flipping plate close to the left flipping plate are equipped with the belt transmission assembly, so The belt transmission assembly is located above the two-way threaded screw. The belt transmission assembly includes an upper conveyor belt mechanism and a lower conveyor belt mechanism. The upper conveyor belt mechanism and the lower conveyor belt mechanism are spaced apart along the height direction of the left flip plate;

The matrix visual detection mechanism includes a hollow detection box and a detection plate. The hollow detection box has a degree of freedom to move along the height direction of the detection workbench. The detection plate is fixed in the hollow detection box. The detection plate A plurality of vision camera heads are installed on the bottom of the board, and a plurality of the vision camera heads are arranged in a rectangular array.

In some embodiments, the double-sided flip detection mechanism also includes a flip switching mechanism, which includes a rotation limit plate and a limit cone, and the rotation limit plate is threaded on the two-way threaded screw. , the bottom of the rotation limit plate contacts the top surface of the detection workbench, the left flip plate is located between the rotation limit plate and the right flip plate, and the rotation limit plate is close to the left flip plate The end face of the plate slides through and is provided with the limiting cone, which moves along the axial direction of the two-way thread screw. The end face of the left flipping plate close to the rotation limiting plate is symmetrically provided with cones. The left flipping plate is connected to the right flipping plate through a telescopic rod. When the limiting cone is adapted to one of the tapered holes, the double-sided flipping detection mechanism is in a horizontal state.

In some embodiments, the rotation limiting plate is sequentially provided with small diameter holes and large diameter holes in a direction away from the left flip plate, and the limiting cone is slidably adapted in the small diameter hole, and the A drive plate is provided on the side of the rotation limit plate away from the left flip plate. One end of the limit cone is fixedly connected to the drive plate. A spring is provided in the large diameter hole. The spring is sleeved on the On the limiting cone, one end of the spring is connected to the step formed by the small diameter hole and the large diameter hole, the other end of the spring is connected to the driving plate, and a pushing cylinder is provided on the rotating limiting plate. One end of the drive plate close to the rotation limit plate is located on the telescopic path of the push cylinder. Friction rings are fixed on the left flipping plate and the right flipping plate. An elastic friction sleeve is fixed inside the friction ring. The elastic friction sleeve is sleeved on the two-way thread screw through its own deformation interference.

In some embodiments, a driving mechanism is provided on one side of the double-sided flipping detection mechanism. The driving mechanism includes a motor base and a motor. The motor base is fixedly installed on the detection workbench, and the motor is installed on the detection workbench. On the motor base, the output shaft of the motor is drivingly connected to one end of the bidirectional thread screw.

In some embodiments, a lifting positioning mechanism is provided on the detection workbench, and the lifting positioning mechanism is located directly below the hollow detection box. The lifting positioning mechanism includes a lifting column and a lifting plate. A lifting window is provided on the detection workbench, and a first cylinder is vertically arranged below the detection workbench. The lifting column moves through the lifting window and is connected to the telescopic shaft of the first cylinder. The lifting plate shape is hinged on the top of the lifting column. A second cylinder is provided below the lifting plate. The base of the second cylinder is hinged on the side wall of the lifting column. The telescopic shaft of the second cylinder is hinged at a corner of the lifting plate, and a small vibrator is provided on the lifting column.

In some embodiments, a negative pressure chamber is provided in the lifting plate, and a number of negative pressure holes are provided on the upper surface of the lifting plate. The negative pressure holes are connected to the negative pressure chamber. The lifting plate is connected to the negative pressure pump through a negative pressure pipe, and the negative pressure pipe is connected to the negative pressure chamber.

In some embodiments, the lower conveyor belt mechanism includes a first pulley, a second pulley and a first tension pulley that are rotated. The first pulley and the second pulley are spaced apart along the conveying direction of the integrated circuit. The first pulley The endless belt is set on the first pulley, the second pulley and the first tensioning pulley. The first pulley on the left flipping plate is connected to the first pulley on the right flipping plate through the first telescopic shaft. The second pulley on the left flipping plate is connected to the second pulley on the right flipping plate through a second telescopic shaft, and the shaft of the first pulley is drivingly connected to the output shaft of the first motor.

In some embodiments, the upper conveyor belt mechanism includes a third pulley and a fourth pulley that are rotated, the third pulley and the fourth pulley are spaced apart along the conveying direction of the integrated circuit, and the second endless belt is sleeved on the On the third pulley and the fourth pulley, the third pulley on the left flipping plate is connected to the third pulley on the right flipping plate through the third telescopic shaft, and the fourth pulley on the left flipping plate is connected through the fourth telescopic shaft. The shaft is connected to the fourth pulley on the right flipping plate. Two sets of tensioning mechanisms are symmetrically arranged between the third pulley and the fourth pulley along the transportation direction of the integrated circuit. The tensioning mechanism includes a tensioning slider, A tensioning wheel and a third cylinder, the tensioning slider is slidably disposed along the height direction of the detection workbench, the tensioning wheel is rotatably disposed on the tensioning slider, and the second ring-shaped belt moves from The bottom of the tensioning wheel is bypassed, and the telescopic shaft of the third cylinder is connected to the tensioning slider.

In some embodiments, the two ends of the double-sided flipping detection mechanism are respectively provided with a feeding conveyor belt and a discharging conveyor belt, and the input end of the feeding conveyor belt and the output end of the discharging conveyor belt are both provided with circuit board loading and unloading mechanisms, so The circuit board loading and unloading mechanism includes a first rotating motor, a second rotating motor and a negative pressure feeding tube. The first rotating motor and the second rotating motor are spaced apart along the conveying direction perpendicular to the integrated circuit. The first rotating motor The output shaft of the rotating electrical machine and the output shaft of the second rotating electrical machine are respectively connected to a first rotating base and a second rotating base, and a first rotating arm is fixed to the side wall of the first rotating base and the side wall of the second rotating base respectively. and a second rotating arm. An end of the first rotating arm away from the first rotating base is hinged to a first execution arm. An end of the first executing arm away from the first rotating arm is hinged to the negative pressure. On the material tube, one end of the second rotating arm away from the second rotating seat is hinged to a second execution arm, and one end of the second executing arm away from the second rotating arm is hinged to the negative pressure feeding tube. superior.

In some embodiments, the matrix visual inspection mechanism further includes an inspection frame, a inspection cylinder is installed vertically on the inspection frame, and the telescopic shaft of the inspection cylinder is connected to the side wall of the hollow inspection box.

The beneficial effects of the present invention are:

1. The integrated circuit board is visually inspected through multiple visual camera heads arranged in a matrix. The multiple visual camera heads divide the integrated circuit board into multiple rectangular areas in sequence. The visual camera head magnifies the area and detects it, which can be magnified. A clear and clear image can be used to cover the integrated circuit board for amplified detection. It can amplify and detect precise and small components, and adopt a full coverage method for detection, which greatly improves the detection accuracy.

2. The double-sided flipping detection mechanism can automatically detect the flipping of the integrated circuit board, and the output of the integrated circuit that has passed the double-sided inspection is packaged, so that the double-sided inspection of the integrated circuit can be completed at one time, reducing the exposure time of the integrated circuit. , reducing the risk of scratches on the integrated circuit board caused by being exposed for too long.

3. The left flipping plate and the right flipping plate can move along the axial direction of the two-way threaded screw, thereby adjusting the distance between the two sets of belt transmission components, and can transport and inspect integrated circuit boards of different sizes, with a larger Scope of use.

Description of the drawings

Figure 1 is a schematic diagram of the overall structure of a matrix integrated circuit surface defect detection device based on visual detection according to the present invention;

Figure 2 is a perspective view of a double-sided flipping detection mechanism in a matrix integrated circuit surface defect detection device based on visual detection according to the present invention;

Figure 3 is a top view of the double-sided flipping detection mechanism in a matrix integrated circuit surface defect detection device based on visual detection according to the present invention;

Figure 4 is a schematic diagram of the internal structure of the rotating limit plate in a matrix integrated circuit surface defect detection device based on visual detection according to the present invention;

Figure 5 is a schematic diagram 2 of the overall structure of a matrix integrated circuit surface defect detection device based on visual detection according to the present invention;

Figure 6 is an enlarged view of B in Figure 5;

Figure 7 is a bottom view of the hollow detection box in a matrix integrated circuit surface defect detection device based on visual detection according to the present invention;

Figure 8 is a schematic diagram 3 of the overall structure of a matrix integrated circuit surface defect detection device based on visual detection according to the present invention;

Figure 9 is an enlarged view of point A in Figure 8;

Figure 10 is a schematic diagram 4 of the overall structure of a matrix integrated circuit surface defect detection device based on visual detection according to the present invention;

In the picture, 1-inspection workbench, 2-double-sided flipping inspection mechanism, 3-matrix visual inspection mechanism, 4-left flipping plate, 5-right flipping plate, 6-bidirectional thread screw, 7-installation support plate, 8-hollow detection box, 9-detection plate, 10-visual camera head, 11-rotating limit plate, 12-limit cone, 13-tapered hole, 14-telescopic rod, 15-small diameter hole, 16-large Diameter hole, 17-driving plate, 18-spring, 19-push cylinder, 20-friction ring, 21-motor base, 22-motor, 23-first ring belt, 30-jacking column, 31-jacking plate, 32-First cylinder, 33-Second cylinder, 34-Small vibrator, 35-Negative pressure hole, 36-Negative pressure tube, 37-First pulley, 38-Second pulley, 39-First tensioner Pulley, 40-third pulley, 41-fourth pulley, 42-second ring belt, 43-tension slider, 44-tension pulley, 45-third cylinder, 46-feed conveyor belt, 47-discharge conveyor belt , 48-the first rotating motor, 49-the second rotating motor, 50-negative pressure feeding tube, 51-the first rotating seat, 52-the second rotating seat, 53-the first rotating arm, 54-the second rotating arm , 55-first actuator arm, 56-second actuator arm, 57-detection frame, 58-detection cylinder, 59-first telescopic shaft, 60-second telescopic shaft, 61-third telescopic shaft, 62-th Four telescopic axes.

Detailed ways

The technical solution of the present invention will be described in further detail below in conjunction with the accompanying drawings, but the protection scope of the present invention is not limited to the following description.

Embodiment 1. As shown in Figures 1 to 10, a matrix-type integrated circuit surface defect detection device based on visual inspection includes a detection workbench 1. The detection workbench 1 is provided with a double-sided flipping detection mechanism 2 and a matrix-type integrated circuit surface defect detection device. The visual inspection mechanism 3 and the double-sided flip inspection mechanism 2 include a left flip plate 4, a right flip plate 5, a two-way thread screw 6 and a belt transmission assembly. Two sets of mounting support plates 7 are fixed on the inspection workbench 1, and two sets of mounting supports are fixed on the inspection workbench 1. The plates 7 are arranged at intervals along the conveying direction perpendicular to the integrated circuit. The two ends of the two-way threaded screw 6 are respectively rotatably connected to two sets of mounting support plates 7. The left flipping plate 4 and the right flipping plate 5 are respectively threaded on the two-way threaded screw. On the two threaded sections of 6 with opposite thread directions, the end surface of the left flipping plate 4 close to the right flipping plate 5 and the end face of the right flipping plate 5 close to the left flipping plate 4 are equipped with a belt transmission assembly, and the belt transmission assembly is located on the two-way thread. Above the bar 6, the belt transmission assembly includes an upper conveyor belt mechanism and a lower conveyor belt mechanism. The upper conveyor belt mechanism and the lower conveyor belt mechanism are spaced apart along the height direction of the left flip plate 4. The integrated circuit board is carried out between the upper conveyor belt mechanism and the lower conveyor belt mechanism. The integrated circuit board is transported to the inspection station of the matrix visual inspection mechanism 3, and one side of the integrated circuit board is visually inspected for defects through the matrix visual inspection mechanism 3. After the inspection of one side is completed, the two-way thread screw 6 rotates , since the rotational freedom of the left flipping plate 4 and the right flipping plate 5 is not restricted, when the two-way threaded screw 6 rotates, it will drive the left flipping plate 4 and the right flipping plate 5 to rotate synchronously, and the two-way threaded screw 6 rotates 180°. As a result, the upper conveyor belt mechanism and the lower conveyor belt mechanism drive the integrated circuit board to rotate 180°, so that the other side of the integrated circuit board is at the inspection station. After the double-sided inspection of the integrated circuit board is completed, the double-sided flipping inspection mechanism 2 outputs the inspection. Qualified integrated circuit boards are packaged and processed at the next work station, so that double-sided inspection of integrated circuits can be completed at one time, and qualified integrated circuit boards are packaged and protected in a timely manner, which reduces the exposure time of integrated circuits and reduces the cost of integrated circuits. There is a risk of scratches if the board is exposed for too long; the matrix visual inspection mechanism 3 includes a hollow inspection box 8 and a inspection plate 9. The hollow inspection box 8 has the freedom to move along the height direction of the inspection workbench 1, and the inspection plate 9 is fixed on In the hollow detection box 8, multiple visual camera heads 10 are installed at the bottom of the detection board 9. The multiple visual camera heads 10 are arranged in a rectangular array. The integrated circuit board is visually inspected through multiple visual camera heads 10 arranged in a matrix. Multiple vision camera heads 10 divide the integrated circuit board into multiple rectangular areas in sequence. The vision camera heads 10 enlarge and detect the area, and can obtain an enlarged and clear image, thereby covering the integrated circuit board for enlarged inspection, which can accurately detect Small and small components are amplified and detected, and the detection is carried out in a full coverage manner, which greatly improves the detection accuracy.

Embodiment 2. As shown in Figures 1 to 6, since the left flipping plate 4 and the right flipping plate 5 need to move linearly along the axial direction of the two-way threaded screw 6 to adjust the distance between the two sets of belt transmission assemblies, In order to adapt to integrated circuit boards of different sizes, it is necessary to limit the rotational freedom of the left flip plate 4 and the right flip plate 5. To this end, based on the first embodiment, the double-sided flip detection mechanism 2 also includes a flip The switching mechanism, the flip switching mechanism includes a rotating limit plate 11 and a limiting cone 12. The rotating limit plate 11 is threaded on the two-way thread screw 6, and the bottom of the rotating limit plate 11 contacts the top surface of the detection workbench 1. The left flipping plate 4 is located between the rotating limiting plate 11 and the right flipping plate 5. The rotating limiting plate 11 slides through the end face of the left flipping plate 4 and has a limiting cone 12. The limiting cone 12 follows the two-way threaded lead screw 6. When moving axially, the end face of the left flipping plate 4 close to the rotation limiter plate 11 is symmetrically provided with tapered holes 13. The left flipping plate 4 is connected to the right flipping plate 5 through the telescopic rod 14. When the limiter cone 12 is adapted to one of the cones When inside the shaped hole 13, the double-sided flipping detection mechanism 2 is in a horizontal state. Since the sizes of integrated circuit boards are various, in order to reduce the detection area of the integrated circuit board and the double-sided flipping detection mechanism 2, the belt on the left flipping plate 4 is conveyed The belt transmission components on the components and the right flip plate 5 respectively act on both sides of the integrated circuit board for support and transportation, so that the area where precision components are located in the middle of the integrated circuit board is exposed to avoid damage caused by contact transportation of the integrated circuit board. , based on this design, the distance between the two sets of belt conveying components needs to meet the size requirements of the integrated circuit board. In order to ensure that the double-sided flipping detection mechanism 2 can transport and flip integrated circuit boards of different sizes, the left flipping plate 4 The distance between the left flipping plate 4 and the right flipping plate 5 can be adjusted according to the size of the integrated circuit board. By setting a flipping switching mechanism, the rotational freedom of the left flipping plate 4 and the right flipping plate 5 is limited, so that the left flipping plate 4 and the right flipping plate 5 can be adjusted. The plate 5 can switch between the degree of freedom of rotation and the degree of freedom of linear movement. The rotation limit plate 11 is provided with a small diameter hole 15 and a large diameter hole 16 in the direction away from the left flip plate 4. The limit cone 12 is slidably adapted. In the small diameter hole 15, a drive plate 17 is provided on the side of the rotation limit plate 11 away from the left flip plate 4. One end of the limit cone 12 is fixedly connected to the drive plate 17. A spring 18 is provided in the large diameter hole 16. The spring 18 It is sleeved on the limiting cone 12. One end of the spring 18 is connected to the step formed by the small diameter hole 15 and the large diameter hole 16. The other end of the spring 18 is connected to the driving plate 17. The rotating limiting plate 11 is provided with a pushing cylinder 19. , one end of the drive plate 17 close to the rotation limit plate 11 is located on the telescopic path of the push cylinder 19. A friction ring 20 is fixed on the left flip plate 4 and the right flip plate 5. An elastic friction sleeve is fixed inside the friction ring 20. The elastic friction The sleeve is sleeved on the two-way threaded screw 6 through its own deformation interference. The specific switching process is: when the double-sided flipping detection mechanism 2 is in the normal state, the limit cone 12 is adapted in the tapered hole 13. At this time, the spring 18 is in compression state, because the bottom of the rotation limiter plate 11 contacts the top surface of the detection workbench 1, the rotational freedom of the rotation limiter plate 11 is restricted by the detection workbench 1, so that the rotation limiter plate 11 cannot follow the bidirectional thread. The rods 6 rotate together and only have the freedom to move linearly along the axial direction of the two-way threaded screw 6. When the limiting cone 12 is adapted in the tapered hole 13, the left flip plate 4 is connected to the rotation limiting plate 11. Together, the rotational freedom of the left flipping plate 4 is limited by the rotation limit plate 11, and the rotational freedom of the right flipping plate 5 is limited by the telescopic rod 14, so that the left flipping plate 4 and the right flipping plate 5 both follow the two-way thread. The screw 6 moves linearly in the axial direction. Since the left flipping plate 4 and the right flipping plate 5 are respectively threaded on the two threaded sections of the two-way threaded screw 6 with opposite thread directions, the left flipping plate 4 moves The direction is opposite to the moving direction of the right flip plate 5. The distance between the left flip plate 4 and the right flip plate 5 is adjusted by forward and reverse rotation of the two-way thread screw 6, and then the distance between the two sets of belt transmission components is adjusted to suit The size of the integrated circuit board, because the rotation limit plate 11 is also threaded on the two-way thread screw 6, the rotation limit plate 11 moves synchronously with the left flip plate 4, so that the limit cone 12 continues to fit in the tapered hole 13 to ensure that the left flipping plate 4 and the right flipping plate 5 can move stably in a straight line. When it is necessary to flip the left flipping plate 4 and the right flipping plate 5, push the cylinder 19 to push the driving plate 17 to move away from the left flipping plate 4, and the driving plate 17 The limiting cone 12 is driven to separate from the tapered hole 13. At this time, the limiting cone 12 will no longer restrict the rotational freedom of the left flipping plate 4. At this time, the bidirectional thread screw 6 is rotated to drive the left flipping plate 4 to flip with the right. The plate 5 rotates, thereby driving the integrated circuit board to flip 180° to detect the other side. At this time, since the left flipping plate 4 will not follow the rotation limiter plate 11 to move in a straight line, the left flipping plate 4 and the right flipping plate 5 will follow. The two-way threaded screw 6 deflects, and the rotating limit plate 11 moves linearly. In order to ensure that after the left flip plate 4 is deflected, the limit cone 12 can smoothly fit into another tapered hole 13 on the left flip plate 4, bidirectionally. The rotation direction of the threaded screw 6 causes the rotation limit plate 11 to move linearly away from the left flip plate 4. When the limit cone 12 is adapted to the previous tapered hole 13, the spring 18 is in a compressed state. Therefore, even if the left flip plate 4 The rotation limit plate 11 has moved a certain distance away, but under the action of the spring 18, the limit cone 12 can still fit with the other tapered hole 13, limiting the rotational freedom of the left flip plate 4 and maintaining double-sided flip detection. The stability of the mechanism 2 enables the integrated circuit board to be stably transported on the double-sided flipping detection mechanism 2. When the double-sided detection of the integrated circuit board is completed, the two-way thread screw 6 reverses, and at the same time, the cylinder 19 is pushed to push the limit The cone 12 detaches from the tapered hole 13, and the left flipping plate 4 and the right flipping plate 5 rotate in opposite directions to reset. At this time, the rotation limit plate 11 moves close to the left flipping plate 4 to reset. The left flipping plate 4 is in the process of flipping. , push the cylinder 19 to drive the limiting cone 12 to reset, so that the limiting cone 12 is located on the rotation path of the left flipping plate 4. Since the surface of the limiting cone 12 is tapered, when the left flipping plate 4 is reset, the left flipping plate 4 Squeeze the limiting cone 12, and under the guidance of the tapered surface of the limiting cone 12, the limiting cone 12 presses the spring 18 and moves away from the left flipping plate 4. When the left flipping plate 4 deflects to the horizontal, the tapered hole 13 is located at On the moving path of the limiting cone 12, the limiting cone 12 is adapted to the tapered hole 13 under the reaction force of the spring 18, thereby locking the left flipping plate 4, so that the left flipping plate 4 and the right flipping plate 5 are stably level. state. Further, a driving mechanism is provided on one side of the double-sided flipping detection mechanism 2. The driving mechanism includes a motor base 21 and a motor 22. The motor base 21 is fixedly installed on the detection workbench 1, and the motor 22 is installed on the motor base 21. The motor 22 The output shaft transmission is connected to one end of the two-way thread screw 6, and the two-way thread screw 6 is driven to rotate through the motor 22. The motor 22 adopts a stepper motor and can control the rotation angle, so that the double-sided flipping detection mechanism 2 can perform 180° flipping.

Embodiment 3. Based on Embodiment 2, as shown in Figures 1 and 2, the lower conveyor belt mechanism includes a first pulley 37, a second pulley 38 and a first tension pulley 39 that are rotated, that is, the left flip plate 4 The first pulley 37, the second pulley 38 and the first tension pulley 39 are all rotatably arranged on the right flip plate 5. The first pulley 37 and the second pulley 38 are arranged at intervals along the conveying direction of the integrated circuit. The first endless belt 23 is set on the first pulley 37, the second pulley 38 and the first tensioning pulley 39. The first pulley 37 on the left flip plate 4 is connected to the first pulley 37 on the right flip plate 5 through the first telescopic shaft 59. The second pulley 38 on the flip plate 4 is connected to the second pulley 38 on the right flip plate 5 through the second telescopic shaft 60. The shaft of the first pulley 37 is connected to the output shaft of the first motor, and the first motor drives the first pulley. 37 rotates, the first pulley 37 drives the second pulley 38 to rotate through the first annular belt 23, thereby causing the first annular belt 23 to rotate cyclically, and the integrated circuit board is transmitted through the first annular belt 23; it is worth noting that the two The axes of the first set of pulleys 37 are connected through the first telescopic shaft 59, and the axes of the two sets of second pulleys 38 are connected through the second telescopic shaft 60, so that the transmission of the lower conveyor belt mechanism will be through the first telescopic shaft 59 and the second telescopic shaft. 60 drives another lower conveyor belt mechanism to operate synchronously, and then the two lower conveyor belt mechanisms only need to be provided with a first motor to drive the lower conveyor belt mechanisms on the left flip plate 4 and the right flip plate 5 to operate synchronously, ensuring synchronization while making the structure more compact. .

Embodiment 4. Based on Embodiment 3, as shown in Figures 2 and 3, the upper conveyor belt mechanism includes a third pulley 40 and a fourth pulley 41 that are rotated, that is, both the left flipping plate 4 and the right flipping plate 5 have A third pulley 40 and a fourth pulley 41 are rotatably connected. The third pulley 40 and the fourth pulley 41 are spaced apart along the conveying direction of the integrated circuit. The second endless belt 42 is sleeved on the third pulley 40 and the fourth pulley 41. The third pulley 40 on the left flip plate 4 is connected to the third pulley 40 on the right flip plate 5 through the third telescopic shaft 61, and the fourth pulley 41 on the left flip plate 4 is connected to the right flip plate 5 through the fourth telescopic shaft 62. The fourth pulley 41, similarly, through the third telescopic shaft 61 and the fourth telescopic shaft 62, the two sets of upper conveyor belt mechanisms can be operated synchronously. It only needs to be provided with a second motor, so that the second motor can be connected with one of the third pulleys. 40 or the shaft connection of the fourth pulley 41, the two sets of upper conveyor belt mechanisms can be synchronously driven by a driving mechanism. Two sets of tensioning mechanisms are symmetrically arranged between the third pulley 40 and the fourth pulley 41 along the conveying direction of the integrated circuit. , the tensioning mechanism includes a tensioning slider 43, a tensioning wheel 44 and a third cylinder 45. The tensioning slider 43 is slidably arranged along the height direction of the detection workbench 1, that is, both the left flipping plate 4 and the right flipping plate 5 are A chute is provided vertically, the tensioning slider 43 is slidably arranged in the chute, the tensioning wheel 44 is rotated and set on the tensioning slider 43, the second annular belt 42 is bypassed from the bottom of the tensioning wheel 44, and the third The telescopic shaft of the cylinder 45 is connected to the tensioning slider 43. When the integrated circuit board is normally transported on the first ring belt 23, there is a certain distance between the first ring belt 23 and the second ring belt 42, so that the integrated circuit board will not Contacting the second annular belt 42, only the first annular belt 23 drives the integrated circuit board to the inspection station. When one side of the integrated circuit is inspected, the third cylinder 45 drives the tensioning slider 43 to move close to the first annular belt 23. , the tensioning wheel 44 drives the second ring-shaped belt 42 to move close to the first ring-shaped belt 23. On the one hand, the second ring-shaped belt 42 is in a tensioned state, and on the other hand, the integrated circuit board is squeezed between the first ring-shaped belt 23 and the third ring-shaped belt 23. Between the two annular belts 42, at this time, the left flip plate 4 and the right flip plate 5 are flipped 180°, thereby limiting the integrated circuit board before deflecting, ensuring that the integrated circuit board will not fall and be damaged during the deflection process.

Embodiment 5. Based on Embodiment 4, as shown in Figures 1, 8 and 9, a lifting positioning mechanism is provided on the detection workbench 1, and the lifting positioning mechanism is located directly below the hollow detection box 8. The lifting positioning mechanism includes a lifting column 30 and a lifting plate 31. A lifting window is provided on the detection workbench 1. A first cylinder 32 is vertically arranged below the detection workbench 1. The lifting column 30 moves through the lifting window. Connected to the telescopic shaft of the first cylinder 32, the lifting plate 31 is spherically hinged on the top of the lifting column 30. A second cylinder 33 is provided below the lifting plate 31, and the base of the second cylinder 33 is hinged on the side of the lifting column 30. On the wall, the telescopic shaft of the second cylinder 33 is hinged at a corner of the lifting plate 31. A small vibrator 34 is provided on the lifting column 30. A negative pressure chamber is provided in the lifting plate 31. The upper part of the lifting plate 31 A number of negative pressure holes 35 are provided on the surface. The negative pressure holes 35 are connected to the negative pressure chamber. The lifting plate 31 is connected to the negative pressure pump through the negative pressure tube 36. The negative pressure tube 36 is connected to the negative pressure chamber. The matrix visual detection mechanism 3 It also includes a detection frame 57. A detection cylinder 58 is installed vertically on the detection frame 57. The telescopic shaft of the detection cylinder 58 is connected to the side wall of the hollow detection box 8. In order to ensure a good detection effect, the integrated circuit board needs to be sealed in the hollow The detection is carried out in the detection box 8 to isolate the external environment so that the detection light source can effectively act on the integrated circuit board. Secondly, it is also necessary to avoid the obstruction of the integrated circuit board by the double-sided flipping detection mechanism 2, so that the detection of the integrated circuit board The surface is completely exposed. To this end, a lifting positioning mechanism is set up on the detection station. Specifically, when the double-sided flipping detection mechanism 2 transports the integrated circuit board to the detection station, the first cylinder 32 extends to drive the lifting plate. 31 moves upward, so that the lifting plate 31 lifts the integrated circuit board, so that the integrated circuit board and the first annular belt 23 and the second annular belt 42 are in a separated state, and then the limiting cone 12 is adapted in the tapered hole 13 , the motor 22 starts to move the left flip plate 4 and the right flip plate 5 away from the integrated circuit board. Then, the hollow detection box 8 moves downward, and the bottom of the hollow detection box 8 contacts the detection workbench 1, thereby moving the integrated circuit The plate is closed in the hollow detection box 8 for inspection. Then, the second cylinder 33 contracts, driving the lifting plate 31 to deflect downward. Since the telescopic shaft of the second cylinder 33 is hinged at the corner position of the lifting plate 31, the lifting plate 31 is lifted. The plate 31 tilts in two directions. At this time, the small exciter 34 is started to vibrate the lifting plate 31. Cooperating with the gravity of the integrated circuit board, the integrated circuit board moves in two tilt directions, causing the two sides of the integrated circuit board to vibrate. The positioning is completed by fitting the two inner walls of the hollow detection box 8. Then, the negative pressure pump is started to generate negative pressure in the negative pressure chamber through the negative pressure tube 36, and acts on the integrated circuit board through the negative pressure hole 35 to maintain the integration. The stability of the circuit board, and then the second cylinder 33 and the first cylinder 32 are reset, so that the lifting plate 31 fits in the lifting window, and the lifting window is sealed, so that the integrated circuit board is neatly placed on the inspection workbench 1 Then, the detection cylinder 58 drives the hollow detection box 8 to move downward, so that the hollow detection box 8 contacts the top surface of the detection workbench 1, so that multiple vision camera heads 10 can accurately correspond to multiple detections on the integrated circuit board. The position is visually inspected. After the inspection is completed, the lifting plate 31 pushes the integrated circuit board again so that it is located between the first annular belt 23 and the second annular belt 42. Then, the left flipping plate 4 and the right flipping plate 5 are reset. , then the first cylinder 32 is reset, so that the integrated circuit board is placed on the first annular belt 23, and then the integrated circuit board is turned over 180° through the double-sided flipping detection mechanism 2, because the detection station needs to avoid the two-way thread screw 6 , the two-way threaded screw 6 needs to be set in the middle of the left flipping plate 4, then the detection station is located on one side of the two-way threaded screw 6. Therefore, after the integrated circuit board is flipped 180°, the double-sided flipping detection mechanism 2 will The integrated circuit board is transported to the inspection station, and then the lifting plate 31 is moved upward to repeat the above operation to organize the integrated circuit board, so that the integrated circuit board is positioned and organized before inspection to improve the accuracy of inspection.

Embodiment 6. Based on Embodiment 5, as shown in Figures 1, 5, 8 and 10, a feeding conveyor belt 46 and a discharging conveyor belt 47 are respectively provided at both ends of the double-sided flipping detection mechanism 2. The feeding conveyor belt The input end of 46 and the output end of the discharging conveyor belt 47 are equipped with a circuit board loading and unloading mechanism. The circuit board loading and unloading mechanism includes a first rotating motor 48, a second rotating motor 49 and a negative pressure feeding tube 50. The first rotating motor 48 and the second rotating motor 49 are spaced apart along the conveying direction perpendicular to the integrated circuit. The output shaft of the first rotating motor 48 and the output shaft of the second rotating motor 49 are connected to a first rotating base 51 and a second rotating base 52 respectively. , a first rotating arm 53 and a second rotating arm 54 are fixed to the side walls of the first rotating base 51 and the second rotating base 52 respectively, and the first rotating arm 53 is hingedly connected to one end of the first rotating base 51 away from the first rotating base 51 . Execution arm 55, the end of the first execution arm 55 away from the first rotating arm 53 is hinged to the negative pressure feeding tube 50, the end of the second rotation arm 54 away from the second rotation base 52 is hinged to the second execution arm 56, the second One end of the execution arm 56 away from the second rotating arm 54 is hinged on the negative pressure feeding pipe 50. A material tray is provided on one side of the feeding conveyor belt 46. The integrated circuit board to be tested is placed in this material tray. Both sides of the discharging conveyor belt 47 There are empty material trays on both sides. The empty material tray on one side is placed with qualified integrated circuit boards, and the empty material tray on the other side is placed with unqualified integrated circuit boards. The integrated circuit boards are loaded through the circuit board loading mechanism. For blanking, specifically, the first rotary motor 48 and the second rotary motor 49 rotate in cooperation, thereby respectively driving the first rotary arm 53 and the second rotary arm 54 to cooperate in deflection, thereby causing the first actuator arm 55 and the second actuator arm to deflect. 56 deflects at different angles, driving the negative pressure feeding tube 50 to deflect to different directions. The deflection of the first rotating arm 53 will drive the first actuator arm 55 to deflect, because the first actuator arm 55 and the second actuator arm 56 are both hinged. On the negative pressure feeding pipe 50, the deflection of the first actuator arm 55 will drive the second actuator arm 56 to deflect. Similarly, the deflection of the second rotating arm 54 will drive the first actuator arm 55 to deflect. Thus, by controlling the first rotating arm 53 With the deflection angle of the second rotating arm 54, adjust the position of the negative pressure feeding pipe 50. The negative pressure feeding pipe 50 is connected to the negative pressure pump through a hose, thereby completing the loading and unloading of the integrated circuit board through negative pressure. .

In the description of the present invention, it should be understood that the terms "coaxial", "bottom", "one end", "top", "middle", "other end", "upper", "one side", "top" ", "inner", "front", "center", "both ends", etc. indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description. It does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be construed as a limitation of the present invention; and those of ordinary skill in the art will know that the beneficial effects to be achieved by the present invention are only To achieve a better beneficial effect in a specific situation than the current implementation in the prior art, rather than to directly achieve the best use effect in the industry.

The above are only preferred embodiments of the present invention. It should be understood that the present invention is not limited to the form disclosed herein and should not be regarded as excluding other embodiments, but can be used in various other combinations, modifications and environments, and Modifications can be made within the scope of the ideas described herein through the above teachings or technology or knowledge in related fields. Any modifications and changes made by those skilled in the art that do not depart from the spirit and scope of the present invention shall be within the protection scope of the appended claims of the present invention.

Claims (10)

1. A matrix-type integrated circuit surface defect detection device based on visual inspection, characterized in that it includes a detection workbench (1), and the detection workbench (1) is provided with a double-sided flipping detection mechanism (2) and a matrix Type visual inspection mechanism (3), the double-sided flipping inspection mechanism (2) includes a left flipping plate (4), a right flipping plate (5), a two-way threaded screw (6) and a belt transmission assembly, and the inspection workbench (1) Two sets of mounting support plates (7) are fixed on the top. The two sets of mounting support plates (7) are spaced apart along the conveying direction perpendicular to the integrated circuit. The two ends of the two-way threaded screw (6) are respectively Two sets of mounting support plates (7) are rotatably connected. The left flipping plate (4) and the right flipping plate (5) are respectively threaded on the two threads of the two-way threaded screw (6) with opposite directions. On the threaded section, the end surface of the left flipping plate (4) close to the right flipping plate (5) and the end surface of the right flipping plate (5) close to the left flipping plate (4) are equipped with the belt transmission The belt transmission assembly is located above the two-way threaded screw (6). The belt transmission assembly includes an upper conveyor belt mechanism and a lower conveyor belt mechanism. The upper conveyor belt mechanism and the lower conveyor belt mechanism are along the left flip plate. (4) Height direction interval setting; The matrix visual inspection mechanism (3) includes a hollow inspection box (8) and a inspection plate (9). The hollow inspection box (8) has the degree of freedom to move along the height direction of the inspection workbench (1), so The detection plate (9) is fixed in the hollow detection box (8). A plurality of visual camera heads (10) are installed at the bottom of the detection plate (9). The plurality of visual camera heads (10) are in a rectangular shape. Array settings. 2. A matrix integrated circuit surface defect detection device based on visual inspection according to claim 1, characterized in that the double-sided flipping detection mechanism (2) also includes a flipping switching mechanism, and the flipping switching mechanism includes Rotating limit plate (11) and limiting cone (12). The rotating limiting plate (11) is threaded on the two-way thread screw (6), and the bottom of the rotating limiting plate (11) contacts The top surface of the detection workbench (1) is set, and the left flip plate (4) is located between the rotation limit plate (11) and the right flip plate (5). The rotation limit plate (11) The limiting cone (12) is slidably passed through the end surface close to the left flip plate (4), and the limiting cone (12) moves along the axial direction of the two-way threaded screw (6). The end face of the left flipping plate (4) close to the rotation limiting plate (11) is symmetrically provided with tapered holes (13). The left flipping plate (4) is connected to the right flipping plate (14) through a telescopic rod (14). 5), when the limiting cone (12) is adapted in one of the tapered holes (13), the double-sided flipping detection mechanism (2) is in a horizontal state. 3. A matrix integrated circuit surface defect detection device based on visual inspection according to claim 2, characterized in that the rotation limit plate (11) is sequentially moved in a direction away from the left flip plate (4). A small diameter hole (15) and a large diameter hole (16) are provided, the limiting cone (12) is slidably adapted in the small diameter hole (15), and the rotating limiting plate (11) is away from the A driving plate (17) is provided on one side of the left flipping plate (4), one end of the limiting cone (12) is fixedly connected to the driving plate (17), and a spring (17) is provided in the large-diameter hole (16). 18), the spring (18) is sleeved on the limiting cone (12), and one end of the spring (18) is connected to the step formed by the small diameter hole (15) and the large diameter hole (16) on, the other end of the spring (18) is connected to the drive plate (17), a push cylinder (19) is provided on the rotation limit plate (11), and the drive plate (17) is close to the rotation limit plate (11). One end of the position plate (11) is located on the telescopic path of the push cylinder (19). A friction ring (20) is fixed on the left flip plate (4) and the right flip plate (5). The friction ring (20) ) has an elastic friction sleeve fixed inside, and the elastic friction sleeve is sleeved on the two-way threaded screw (6) through its own deformation interference. 4. A matrix integrated circuit surface defect detection device based on visual inspection according to claim 3, characterized in that a driving mechanism is provided on one side of the double-sided flipping detection mechanism (2), and the driving mechanism It includes a motor base (21) and a motor (22). The motor base (21) is fixedly installed on the detection workbench (1), and the motor (22) is installed on the motor base (21). The output shaft of the motor (22) is drivingly connected to one end of the two-way thread screw (6). 5. A matrix integrated circuit surface defect detection device based on visual inspection according to claim 1, characterized in that a lifting positioning mechanism is provided on the detection workbench (1), and the lifting positioning mechanism Located directly below the hollow detection box (8), the lifting positioning mechanism includes a lifting column (30) and a lifting plate (31), and a lifting window is provided on the detection workbench (1). A first cylinder (32) is arranged vertically below the detection workbench (1), and the lifting column (30) moves through the lifting window to connect to the telescopic shaft of the first cylinder (32), so The lifting plate (31) is spherically hinged on the top of the lifting column (30). A second cylinder (33) is provided below the lifting plate (31). The base of the second cylinder (33) Hinged on the side wall of the lifting column (30), the telescopic shaft of the second cylinder (33) is hinged on a corner of the lifting plate (31), and the lifting column (30) is provided with There are small exciters (34). 6. A matrix integrated circuit surface defect detection device based on visual inspection according to claim 5, characterized in that a negative pressure chamber is provided in the lifting plate (31), and the lifting plate (31) ) is provided with a number of negative pressure holes (35) on the upper surface. The negative pressure holes (35) are connected to the negative pressure chamber. The lifting plate (31) is connected to the negative pressure through a negative pressure tube (36). Pump, the negative pressure pipe (36) communicates with the negative pressure chamber. 7. A matrix integrated circuit surface defect detection device based on visual inspection according to claim 1, characterized in that the lower conveyor belt mechanism includes a first pulley (37) and a second pulley (38) that are rotated. and the first tensioning pulley (39), the first pulley (37) and the second pulley (38) are arranged at intervals along the conveying direction of the integrated circuit, and the first endless belt (23) is set on the first pulley (38) 37), the second pulley (38) and the first tensioning pulley (39), the first pulley (37) on the left flip plate (4) is connected to the right flip plate through the first telescopic shaft (59) (5) on the first pulley (37), the second pulley (38) on the left flip plate (4) is connected to the second pulley on the right flip plate (5) through the second telescopic shaft (60) (38), the shaft of the first pulley (37) is drivingly connected to the output shaft of the first motor. 8. A matrix integrated circuit surface defect detection device based on visual inspection according to claim 7, characterized in that the upper conveyor belt mechanism includes a third pulley (40) and a fourth pulley (41) that are rotated. , the third pulley (40) and the fourth pulley (41) are arranged at intervals along the conveying direction of the integrated circuit, and the second annular belt (42) is set on the third pulley (40) and the fourth pulley (41) on the left flip plate (4), the third pulley (40) on the left flip plate (4) is connected to the third pulley (40) on the right flip plate (5) through the third telescopic shaft (61). The fourth pulley (41) on 4) is connected to the fourth pulley (41) on the right flip plate (5) through the fourth telescopic shaft (62), and the third pulley (40) and the fourth pulley (41) ) are symmetrically arranged along the conveying direction of the integrated circuit. The tensioning mechanism includes a tensioning slider (43), a tensioning wheel (44) and a third cylinder (45). The slider (43) is slidably arranged along the height direction of the detection workbench (1), the tensioning wheel (44) is rotationally arranged on the tensioning slider (43), and the second annular belt ( 42) Bypassing from the bottom of the tensioning wheel (44), the telescopic shaft of the third cylinder (45) is connected to the tensioning slider (43). 9. A matrix integrated circuit surface defect detection device based on visual inspection according to claim 1, characterized in that, the two ends of the double-sided flipping detection mechanism (2) are respectively provided with a feeding conveyor belt (46) and a Discharging conveyor belt (47), the input end of the feeding conveyor belt (46) and the output end of the discharging conveyor belt (47) are equipped with a circuit board loading and unloading mechanism, and the circuit board loading and unloading mechanism includes a first rotating motor (48 ), a second rotating motor (49) and a negative pressure feeding tube (50), the first rotating motor (48) and the second rotating motor (49) are spaced apart along the conveying direction perpendicular to the integrated circuit, and the The output shaft of the first rotating electrical machine (48) and the output shaft of the second rotating electrical machine (49) are respectively connected to a first rotating base (51) and a second rotating base (52). The first rotating base (51) A first rotating arm (53) and a second rotating arm (54) are respectively fixed on the side wall and the side wall of the second rotating seat (52). The first rotating arm (53) is away from the first rotating seat (51). ) is hinged to one end of the first execution arm (55), and one end of the first execution arm (55) away from the first rotating arm (53) is hinged to the negative pressure feeding tube (50). A second actuating arm (56) is hinged to an end of the second rotating arm (54) away from the second rotating base (52), and an end of the second actuating arm (56) away from the second rotating arm (54) is hinged. Hinged on the negative pressure feeding tube (50). 10. A matrix integrated circuit surface defect detection device based on visual inspection according to claim 1, characterized in that the matrix visual inspection mechanism (3) also includes a detection frame (57), and the detection A detection cylinder (58) is installed vertically on the frame (57), and the telescopic shaft of the detection cylinder (58) is connected to the side wall of the hollow detection box (8).