Zhang et al., 2016 - Google Patents
Design and characterization of a novel T-shaped multi-axis piezoresistive force/moment sensorZhang et al., 2016
View PDF- Document ID
- 8479359156097814030
- Author
- Zhang W
- Lua K
- Senthil K
- Lim T
- Yeo K
- Zhou G
- et al.
- Publication year
- Publication venue
- IEEE Sensors Journal
External Links
Snippet
In this paper, a T-shaped piezoresistive multi-axis force sensor fabricated by the semiconductor technology is developed. The sensor's design, simulation, piezoresistors arrangement, and characterization are discussed. Fourteen piezoresistors are arranged on …
- 238000010192 crystallographic characterization 0 title abstract description 6
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L5/00—Apparatus for, or methods of, measuring force, e.g. due to impact, work, mechanical power, or torque, adapted for special purposes
- G01L5/16—Apparatus for, or methods of, measuring force, e.g. due to impact, work, mechanical power, or torque, adapted for special purposes for measuring several components of force
- G01L5/161—Apparatus for, or methods of, measuring force, e.g. due to impact, work, mechanical power, or torque, adapted for special purposes for measuring several components of force using variations in ohmic resistance
- G01L5/162—Apparatus for, or methods of, measuring force, e.g. due to impact, work, mechanical power, or torque, adapted for special purposes for measuring several components of force using variations in ohmic resistance of piezoresistors
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L1/00—Measuring force or stress in general
- G01L1/20—Measuring force or stress in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electro-kinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress
- G01L1/22—Measuring force or stress in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electro-kinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress using resistance strain gauges
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L1/00—Measuring force or stress in general
- G01L1/14—Measuring force or stress in general by measuring variations in capacitance or inductance of electrical elements, e.g. by measuring variations of frequency of electrical oscillators
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
- G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
- G01P15/125—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values by capacitive pick-up
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2203/00—Investigating strength properties of solid materials by application of mechanical stress
- G01N2203/02—Details not specific for a particular testing method
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/18—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration in two or more dimensions
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B7/00—Measuring arrangements characterised by the use of electric or magnetic means
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N3/00—Investigating strength properties of solid materials by application of mechanical stress
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| Zhang et al. | Design and characterization of a novel T-shaped multi-axis piezoresistive force/moment sensor | |
| Duc et al. | Piezoresistive cantilever beam for force sensing in two dimensions | |
| Wei et al. | Design and testing of a new force-sensing cell microinjector based on small-stiffness compliant mechanism | |
| US7921731B2 (en) | Two-axis direct fluid shear stress sensor | |
| Dao et al. | Silicon piezoresistive six-degree of freedom force-moment micro sensor | |
| Nallathambi et al. | Design and analysis of MEMS based piezoresistive pressure sensor for sensitivity enhancement | |
| Amarasinghe et al. | Design and fabrication of a miniaturized six-degree-of-freedom piezoresistive accelerometer | |
| Zhe et al. | A microfabricated wall shear-stress sensor with capacitative sensing | |
| Kane et al. | CMOS-compatible traction stress sensor for use in high-resolution tactile imaging | |
| Ling et al. | A novel semiconductor piezoresistive thin-film strain gauge with high sensitivity | |
| Nallathambi et al. | Design of diaphragm based MEMS pressure sensor with sensitivity analysis for environmental applications | |
| Gao et al. | A high-resolution MEMS capacitive force sensor with bionic swallow comb arrays for ultralow multiphysics measurement | |
| Bahari et al. | Micromachined three-axis thermal accelerometer with a single composite heater | |
| Nesterov et al. | Modelling and investigation of the mechanical and electrical characteristics of the silicon 3D-boss microprobe for force and deflection measurements | |
| Chen et al. | A novel flexure-based uniaxial force sensor with large range and high resolution | |
| Metz et al. | New parallelogram 3D-displacement sensor for micro probing and dimensional metrology | |
| Kanekal et al. | Prefabrication analysis and numerical modeling of freely supported MEMS piezoresistive pressure sensor employing square shaped silicon diaphragm | |
| Rauscher et al. | Electrical contact resistance force sensing in SOI-DRIE MEMS | |
| Dao et al. | Six-degree of freedom micro force-moment sensor for application in geophysics | |
| Patil et al. | Characterization of MEMS piezoresistive pressure sensors using AFM | |
| Xue et al. | Development of a novel two axis piezoresistive micro accelerometer based on silicon | |
| Li et al. | Monolithic integration of a micromachined piezoresistive flow sensor | |
| Nallathambi et al. | Performance analysis of slotted square diaphragm for MEMS pressure sensor | |
| Chen et al. | A sidewall piezoresistive force sensor used in a MEMS gripper | |
| Dao et al. | Micro force-moment sensor with six-degree of freedom |