Metz et al., 2017 - Google Patents

New parallelogram 3D-displacement sensor for micro probing and dimensional metrology

Metz et al., 2017

View PDF
Document ID
2111655168533675823
Author
Metz D
Dietzel A
Publication year
Publication venue
2017 19th International Conference on Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS)

External Links

Snippet

For the use in dimensional metrology a novel micro probing system composed of three silicon parallelogram linkages was developed. The parallelogram structure is assured by elastic silicon hinge and allows displacement in only one direction. For each parallelogram …
Continue reading at www.researchgate.net (PDF) (other versions)

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2203/00Investigating strength properties of solid materials by application of mechanical stress
    • G01N2203/02Details not specific for a particular testing method
    • G01N2203/026Specifications of the specimen
    • G01N2203/0286Miniature specimen; Testing on micro-regions of a specimen
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01LMEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L1/00Measuring force or stress in general
    • G01L1/20Measuring force or stress in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electro-kinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress
    • G01L1/22Measuring force or stress in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electro-kinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress using resistance strain gauges
    • G01L1/2287Measuring force or stress in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electro-kinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress using resistance strain gauges constructional details of the strain gauges
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01LMEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L5/00Apparatus for, or methods of, measuring force, e.g. due to impact, work, mechanical power, or torque, adapted for special purposes
    • G01L5/16Apparatus for, or methods of, measuring force, e.g. due to impact, work, mechanical power, or torque, adapted for special purposes for measuring several components of force
    • G01L5/161Apparatus for, or methods of, measuring force, e.g. due to impact, work, mechanical power, or torque, adapted for special purposes for measuring several components of force using variations in ohmic resistance
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/06Measuring leads; Measuring probes
    • G01R1/067Measuring probes
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2203/00Investigating strength properties of solid materials by application of mechanical stress
    • G01N2203/02Details not specific for a particular testing method
    • G01N2203/026Specifications of the specimen
    • G01N2203/0262Shape of the specimen
    • G01N2203/0278Thin specimens
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01LMEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L1/00Measuring force or stress in general
    • G01L1/14Measuring force or stress in general by measuring variations in capacitance or inductance of electrical elements, e.g. by measuring variations of frequency of electrical oscillators
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01BMEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B7/00Measuring arrangements characterised by the use of electric or magnetic means
    • G01B7/16Measuring arrangements characterised by the use of electric or magnetic means for measuring deformation in a solid, e.g. by resistance strain gauge
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01LMEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L5/00Apparatus for, or methods of, measuring force, e.g. due to impact, work, mechanical power, or torque, adapted for special purposes
    • G01L5/0047Apparatus for, or methods of, measuring force, e.g. due to impact, work, mechanical power, or torque, adapted for special purposes measuring forces due to residual stresses
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2203/00Investigating strength properties of solid materials by application of mechanical stress
    • G01N2203/0058Kind of property studied
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01BMEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B5/00Measuring arrangements characterised by the use of mechanical means
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01MTESTING STATIC OR DYNAMIC BALANCE OF MACHINES OR STRUCTURES; TESTING STRUCTURES OR APPARATUS NOT OTHERWISE PROVIDED FOR
    • G01M7/00Vibration-testing of structures; Shock-testing of structures
    • G01M7/08Shock-testing
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N3/00Investigating strength properties of solid materials by application of mechanical stress
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01BMEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B21/00Measuring arrangements or details thereof in so far as they are not adapted to particular types of measuring means of the preceding groups
    • G01B21/02Measuring arrangements or details thereof in so far as they are not adapted to particular types of measuring means of the preceding groups for measuring length, width, or thickness
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01MTESTING STATIC OR DYNAMIC BALANCE OF MACHINES OR STRUCTURES; TESTING STRUCTURES OR APPARATUS NOT OTHERWISE PROVIDED FOR
    • G01M5/00Investigating the elasticity of structures, e.g. deflection of bridges, air-craft wings

Similar Documents

Publication Publication Date Title
Sharpe Jr et al. Tensile testing of polysilicon
Park et al. Development of a coordinate measuring machine (CMM) touch probe using a multi-axis force sensor
US7311009B2 (en) Microelectromechanical systems contact stress sensor
Dai et al. A high precision micro/nano CMM using piezoresistive tactile probes
Zhang et al. Design and characterization of a novel T-shaped multi-axis piezoresistive force/moment sensor
EP1970714A1 (en) Device including a contact detector
Bütefisch et al. Micromechanical three-axial tactile force sensor for micromaterial characterisation
Tibrewala et al. Simulation, fabrication and characterization of a 3D piezoresistive force sensor
Okatani et al. A tactile sensor for simultaneous measurements of 6-axis force/torque and the coefficient of static friction
JP5148219B2 (en) Tactile sensor unit and manufacturing method thereof
Metz et al. Integration of an isotropic microprobe and a microenvironment into a conventional CMM
Metz et al. New parallelogram 3D-displacement sensor for micro probing and dimensional metrology
CN119197856A (en) Six-dimensional force sensor based on planar semiconductor technology and preparation method thereof
Nesterov et al. Modelling and investigation of the silicon twin design 3D micro probe
EP2764341A1 (en) Sub-millinewton capacitive mems force sensor for mechanical testing on a microscope
Han et al. Mechanical properties of Au thin film for application in MEMS/NENS using microtensile test
CN102175361A (en) Three-dimensional micro-force sensor capable of measuring sub micro Newton force and packaging method of three-dimensional micro-force sensor
Tibrewala et al. Development, fabrication and characterization of a 3D tactile sensor
Sohgawa et al. Tactle array sensor with inclined chromium/silicon piezoresistive cantilevers embedded in elastomer
US20140060207A1 (en) Versatile, flexible, and robust mems/nems sensor for decoupled measuring of three-dimensional forces in air or liquids
Gaspar et al. Wafer-scale microtensile testing of thin films
Nesterov et al. Modelling and investigation of the mechanical and electrical characteristics of the silicon 3D-boss microprobe for force and deflection measurements
Metz et al. 3-D isotropic tactile microprobe based on a silicon parallelogram kinematic: From concept to fabrication
CN100356160C (en) Improved method for testing elastic coefficient of micro-cantilever beam
Ferreira et al. Reducing the probe ball diameters of 3D silicon-based microprobes for dimensional metrology