WO2023222196A1

WO2023222196A1 - Carrier transport system, vacuum deposition system, and method of transporting carriers

Info

Publication number: WO2023222196A1
Application number: PCT/EP2022/063280
Authority: WO
Inventors: Ralph Lindenberg; Oliver Heimel; Klaus SCHÜHLER; Christian Wolfgang Ehmann
Original assignee: Applied Materials Inc
Current assignee: Applied Materials Inc
Priority date: 2022-05-17
Filing date: 2022-05-17
Publication date: 2023-11-23
Anticipated expiration: 2024-11-17
Also published as: CN119213544A; KR20250007657A

Abstract

A carrier transport system (100) for transporting carriers in a vacuum processing system in a main transport direction (T) along a first transport path (T1) and along a second transport path (T2) extending next to the first transport path (T1) and for transferring carriers in a path switch direction (S) between the first transport path (T1) and the second transport path (T2) is described. The carrier transport system comprises a common movable support (119) at which a first carrier holder (110) and a second carrier holder (120) are provided spaced apart from each other in the path switch direction (S). In a first transport state (i) of the common movable support (119), the first carrier holder (110) is configured to hold a first carrier (10) in alignment with the first transport path (T1) and the second carrier holder (120) is configured to hold a second carrier (20) in alignment with the second transport path (T2) laterally spaced apart from the first carrier (10). The common movable support is movable in the path switch direction (S) for moving the first carrier holder (110) and the second carrier holder (120) synchronously in the path switch direction (S). Further described is a vacuum deposition system with such a carrier transport system as well as methods of transporting carriers in a vacuum processing system.

Description

CARRIER TRANSPORT SYSTEM, VACUUM DEPOSITION SYSTEM, AND METHOD OF TRANSPORTING CARRIERS

TECHNICAL FIELD

[0001] Embodiments of the present disclosure relate to systems and methods for transportation of carriers, particularly carriers for carrying large area substrates. More specifically, embodiments of the present disclosure relate to systems and methods for transportation of carriers employable, e.g., in vacuum processing systems for vertical substrate processing, particularly for material deposition on large area substrates for display manufacturing. Specifically, embodiments of the present disclosure relate to carrier transport systems, vacuum deposition systems, and methods of transporting carriers.

BACKGROUND

[0002] Techniques for layer deposition on a substrate include, for example, sputter deposition, physical vapor deposition (PVD), chemical vapor deposition (CVD) and thermal evaporation. Coated substrates may be used in several applications and in several technical fields. For instance, coated substrates may be used in the field of displays. Displays can be used for the manufacture of television screens, computer monitors, mobile phones, other hand-held devices, and the like for displaying information. Typically, displays are produced by coating a substrate with a stack of layers of different materials.

[0003] In order to deposit one or more material layers on a substrate, a vacuum deposition system with an arrangement of vacuum processing chambers can be used, such as deposition chambers and optionally further processing modules, e.g., cleaning modules, etching modules, loading modules, and/or transport modules. A plurality of substrates can continuously or quasi-continuously be processed in the vacuum deposition system which may for example be an in-line processing system or a cluster system.

[0004] A substrate is typically carried by a substrate carrier, i.e. a carrying device for carrying the substrate. The carrier that carries the substrate is typically transported through the vacuum deposition system in a main transport direction T along one or more transport paths, for example into or through a vacuum processing chamber that houses a deposition source or another processing device. At least two transport paths can be provided next to each other in the vacuum deposition system, e.g. a first transport path for transporting the carrier in a forward direction into the vacuum processing chamber and a second transport path for transporting the carrier after substrate processing in a return direction opposite to the forward direction. A carrier transport system may be provided for moving the carrier between the first transport path and the second transport path in a path switch direction S transverse to the main transport direction T, particularly perpendicular to the main transport direction.

[0005] However, such a path switch of a carrier between two transport paths may be time-consuming and may therefore reduce the throughput of the system. Further, the processing tact may be increased by the fact that a path switch of a first carrier in a vacuum chamber needs to be completed before a subsequent carrier can be loaded in the vacuum processing chamber and/or a first carrier may need to be unloaded from a track section of a path switch device before a subsequent carrier can be transported onto the track section. Further, particle generation due to wear of moving parts during a path switch can cause deterioration of the manufacturing process. Accordingly, there is a demand for the transportation of carriers in a vacuum chamber in a path switch direction that is transverse to the main transport direction in a quick and time-saving manner.

[0006] Accordingly, it would be beneficial to provide improved systems and methods for carrier transport, particularly in a vacuum processing chamber, as well as improved vacuum deposition systems, which overcome at least some of the above problems. SUMMARY

[0007] In light of the above, carrier transport systems, vacuum deposition systems, as well as methods of transporting carriers according to the independent claims are provided. Further aspects, advantages, and features are apparent from the dependent claims, the description, and the accompanying drawings.

[0008] According to an aspect of the present disclosure, a carrier transport system is provided for transporting carriers in a vacuum processing chamber in a main transport direction T along a first transport path T1 and along a second transport path T2 extending next to the first transport path as well as for transferring carriers in a path switch direction S between the first transport path T1 and the second transport path T2. The carrier transport system includes: a common movable support at which a first carrier holder defining a first track section and a second carrier holder defining a second track section are provided laterally spaced apart from each other in the path switch direction. In a first transport state of the common movable support, the first carrier holder is configured to hold a first carrier in alignment with the first transport path and the second carrier holder is configured to hold a second carrier in alignment with the second transport path, i.e. laterally spaced apart from the first carrier. The common movable support is movable in the path switch direction for moving the first carrier holder and the second carrier holder synchronously in the path switch direction S.

[0009] In some embodiments, by moving the common movable support in the path switch direction, a first carrier held by the first carrier holder can switch the transport path from the first transport path to the second transport path, and/or vice versa, or may be moved to a processing position D that is laterally offset from the first and second transport paths. Alternatively or additionally, by moving the common movable support in the path switch direction, a second carrier held by the second carrier holder can switch the transport path from the second transport path to the first transport path, or vice versa, or may be moved to the processing position D that is laterally offset from the first and second transport paths. [0010] In some embodiments, the carrier transport system may be configured for a carrier transport in an essentially vertical orientation. Specifically, the carriers and the substrates carried by the carriers may be essentially vertically oriented when held by the first carrier holder and/or by the second carrier holder, and during transport along the first and second transport paths.

[0011] According to a further aspect of the present disclosure, a vacuum deposition system that includes a carrier transport system as disclosed herein is provided. The vacuum deposition system includes a first vacuum processing chamber that houses a first processing device, particularly a first deposition source, and a second vacuum processing chamber that houses a second processing device, particularly a second deposition source. The first transport path T1 and the second transport path T2 extend linearly in the main transport direction T and next to each other through the first and second vacuum processing chambers. The common movable support of the vacuum transport system is configured to move carriers in the first vacuum processing chamber at least between the first transport path T1 and the second transport path T2, and optionally to a processing position D for coating a substrate that is carried by a carrier with the first deposition source, the processing position D being offset from the first and second transport paths in the path switch direction S.

[0012] According to a further aspect of the present disclosure, a method of transporting carriers in a vacuum processing system is provided, particularly with a carrier transport system described herein. The method includes (a) transporting a carrier along a first transport path in a main transport direction T onto a second carrier holder (or onto a first carrier holder) arranged in a first vacuum processing chamber, the first carrier holder and the second carrier holder being provided spaced apart from each other at a common movable support and being respectively configured to hold a carrier; (b) moving the common movable support in the path switch direction for moving the first carrier holder and the second carrier holder synchronously in the path switch direction, until the carrier is positioned at a processing position; (c) processing a substrate carried by the carrier at the processing position; (d) moving the common movable support in the path switch direction for moving the first carrier holder and the second carrier holder synchronously in the path switch direction, until the carrier is positioned on a second transport path, or alternatively on the first transport path; and (e) transporting the carrier off the second carrier holder (or off the first carrier holder) along the second transport path, or alternatively along the first transport path.

[0013] Embodiments are also directed at apparatuses for carrying out the disclosed methods and include apparatus parts for performing each described method aspect. These method aspects may be performed by way of hardware components, a computer programmed by appropriate software, by any combination of the two or in any other manner. Furthermore, embodiments according to the disclosure are also directed at methods for operating the described apparatus. The methods for operating the described apparatus include method aspects for carrying out every function of the apparatus. Embodiments are also directed at methods of manufacturing processed substrates, particularly coated substrates, in a vacuum deposition system described herein and/or using a carrier transport system described herein.

BRIEF DESCRIPTION OF THE DRAWINGS

[0014] So that the manner in which the above recited features of the present disclosure can be understood in detail, a more particular description of the disclosure, briefly summarized above, may be had by reference to embodiments. The accompanying drawings relate to embodiments of the disclosure and are described in the following:

FIG. 1 shows a schematic top view of a carrier transport system according to embodiments described herein, the common movable support being in a first transport state (i);

FIG. 2 shows a schematic top view of the carrier transport system of FIG. 1, the common movable support being in a second transport state (ii);

FIG. 3 shows a schematic top view of the carrier transport system of FIG. 1, the common movable support being in a third transport state (iii);

FIG. 4 shows a schematic top view of the carrier transport system of FIG. 1, the common movable support being in a fourth transport state (iv); FIG. 5 shows a schematic sectional view of a carrier transport system according to embodiments described herein;

FIG. 6 shows a schematic sectional view of the carrier transport system of FIG. 5 in the fourth transport state (iv);

FIGS. 7A and 7B show schematic top views of a vacuum deposition system according to embodiments described herein for carrying out methods of transporting carriers according to embodiments described herein;

FIG. 8 shows a schematic top view of a vacuum deposition system according to embodiments described;

FIGS. 9 shows a flow diagram for illustrating methods of transporting carriers according to embodiments described herein; and

FIG. 10 shows a schematic top view of a vacuum deposition system for illustrating a method of transporting carriers according to embodiments described herein.

DETAILED DESCRIPTION OF EMBODIMENTS

[0015] Reference will now be made in detail to the various embodiments of the disclosure, one or more examples of which are illustrated in the figures. Within the following description of the drawings, same reference numbers refer to same components. Only the differences with respect to individual embodiments are described. Each example is provided by way of explanation of the disclosure and is not meant as a limitation of the disclosure. Further, features illustrated or described as part of one embodiment can be used on or in conjunction with other embodiments to yield yet a further embodiment. It is intended that the description includes such modifications and variations.

[0016] A carrier transport system may be configured for transporting carriers in a vacuum environment, particularly in a vacuum chamber or in a vacuum processing system including a plurality of vacuum chambers arranged next to each other, e.g., in a linear arrangement. One, two or more transport paths may be arranged next to each other in the vacuum chamber, wherein the carriers can be moved or conveyed along the one or more transport paths in a main transport direction T. A first transport path T1 may extend adjacent to a second transport path T2, e.g., essentially parallel to the first transport path Tl, in or through the vacuum processing chamber. The first transport path Tl and the second transport path T2 may respectively extend in the main transport direction T which may be an essentially horizontal direction. Optionally, as is indicated in FIG. 1, the first and second transport paths may linearly extend through two, three or more vacuum chambers that are arranged essentially in a line setup.

[0017] A plurality of carrier drive units 301, such as for example drive rollers and/or linear motors, for propelling the carriers in the main transport direction T may be arranged along the first transport path Tl and along the second transport path T2, e.g. at regular spacings. The plurality of carrier drive units 301 may be configured to move the carriers between several vacuum chambers of a vacuum processing system along the first and second transport paths.

[0018] The first transport path Tl and the second transport path T2 may be spaced apart from each other by a distance X in the path switch direction S, which is a direction transverse or perpendicular to the main transport direction T. The distance X between the first transport path Tl and the second transport path T2 in the path switch direction S may be 1 cm or more, particularly 2 cm or more, and/or 50 cm or less, particularly 20 cm or less. For example, the distance X may be 5 cm or more and 10 cm or less.

[0019] The carrier transport system 100 described herein can be a part of a vacuum processing system, particularly a vacuum deposition system configured for depositing a material on a substrate carried by a carrier. The vacuum deposition system may be an in-line processing system, such that substrates can be continuously or quasi- continuously processed. The carrier transport system may be configured to transfer a carrier from a first position on the first transport path Tl away from the first transport path Tl to at least one of a second transport path T2 and a processing position D, in which the substrate that is carried by the carrier faces toward a processing device 105, particularly toward a deposition source, and can be processed. Specifically, the carrier transport system can laterally displace the carrier from a first position on the first transport path T1 to a second position away from the first transport path in the path switch direction S. When the carrier is moved from one transport path to another transport path or to a processing position D in the path switch direction S, said lateral movement can also be referred to as a “path switch”.

[0020] FIG. 1 is a schematic sectional view of a carrier transport system 100 according to embodiments described herein. The carrier transport system 100 includes a common movable support 119 at which a first carrier holder 110 that defines a first track section and a second carrier holder 120 that defines a second track section are provided. The first carrier holder 110 and the second carrier holder 120 are provided at the common movable support 119 laterally spaced apart from each other in the path switch direction S. In particular, the first carrier holder 110 and the second carrier holder 120 may respectively be mounted at or integrally formed with the common movable support 119, such that a movement of the common movable support 119 leads to a corresponding movement of both the first and second carrier holders. In particular, the first carrier holder 110 and the second carrier holder 120 may be fixedly mounted at the common movable support 119, such as to follow a movement of the common movable support 119 in the path switch direction S.

[0021] For example, the common movable support 119 may include a movable support arm or support bar extending in the path switch direction S at least partially through the vacuum processing chamber 101, and the first carrier holder 110 may be fixed at the support arm or support bar at a first position and the second carrier holder 120 may be fixed at the support arm or support bar at a second position offset from the first position in the patch switch direction S, particularly essentially with the distance X therebetween that corresponds to the distance between the first transport path T1 and the second transport path T2.

[0022] In some embodiments, which can be combined with other embodiments described herein, the movable support arm or support bar may extend through a side wall of the vacuum processing chamber 101. Optionally, a flexible element such as a bellows (not shown) may be provided for allowing a relative movement between the movable support arm or support bar and the side wall of the vacuum chamber, while maintaining a vacuum separation between an interior of the vacuum chamber and the surrounding environment, where the motor 118 may be located. The first and second carrier holders may be connected to the movable support arm or support bar inside the vacuum chamber, particularly fixedly connected.

[0023] The first carrier holder 110 is configured to hold a first carrier 10, particularly in an essentially vertical orientation, and defines a first track section extending along the main transport direction T, such that the first carrier can be transported onto or off the first track section in the main transport direction T along the first or second transport path. The second carrier holder 120 is configured to hold a second carrier 20, particularly in an essentially vertical orientation, and defines a second track section extending in the main transport direction T, such that the second carrier can be transported onto or off the second track section in the main transport direction T along the first or second transport path. The first track section defined by the first carrier holder 110 and the second track section defined by the second carrier holder 120 may be spaced apart from each other in the path switch direction S essentially by the distance X.

[0024] The common movable support 119 is configured to be movable in the path switch direction S for moving the first carrier holder 110 and the second carrier holder 120 synchronously in the path switch direction S. In particular, a motor 118 or other drive, particularly one single motor, may be provided for moving the common movable support 119, together with the first and second carrier holders fixed thereon (and optionally the carrier(s) held by the carrier holders), in the path switch direction S.

[0025] In FIG. 1, the common movable support 119 is provided in a first transport state (i), in which the first carrier holder 110 is held in alignment with the first transport path Tl, such that the first carrier 10 can be transported on or off the first carrier holder 110 along the first transport path Tl in the main transport direction T, e.g., via carrier drive units 301, and in which the second carrier holder 120 is held in alignment with the second transport path T2, such that the second carrier 20 can be transported on or off the second carrier holder 120 along the second transport path T2 in the main transport direction T, e.g. via carrier drive units 301. Specifically, in the first transport state (i), the first and second track sections that are defined by the first and second carrier holders, respectively, are arranged in alignment with the first and second transport paths, such that carriers can be transported into and/or through the first vacuum processing chamber 101 along the first transport path T1 and along the second transport path T2 on or over the first and second track sections. The carrier drive units 301, such as drive rollers or linear motors, may be provided along the first and second transport paths for propelling the carriers along the first and second transport paths over the first and second track sections.

[0026] A movement of the common movable support 119 in the path switch direction S leads to a corresponding movement of both the first and second carrier holders in the path switch direction, because the carrier holders are fixedly mounted at the common movable support 119. Therefore, the carrier transport system can also be referred to as a “dual movable track” (or “DMT”), because two track sections provided at a fixed lateral spacing from each other can be moved in synchrony in the path switch direction via a common drive. The advantages of such a path switch arrangement as compared to other path switch arrangements are, for example, as follows:

[0027] (1) Since, in the first transport state (i) shown in FIG. 1, two track sections are arranged on the first and second transport paths at the distance X corresponding to the distance between the first and second transport paths, the carrier transport system 100 can be used as a transit module that allows a linear carrier routing through the first vacuum processing chamber 101 along two transport paths over the two track sections. For example, the first carrier 10 (e.g., carrying a first substrate 11 that is not yet processed) can be linearly transported through the vacuum processing chamber 101 in a forward direction on the first transport path T1 over the first track section into a second vacuum processing chamber 102, while a second carrier (e.g., carrying a second substrate 21 having undergone processing in the second vacuum processing chamber 102, as is schematically depicted in FIG. 1) can be linearly transported through the vacuum processing chamber 101 in a return direction on the second transport path T2 over the second track section into another vacuum chamber 103, e.g. for unloading. Specifically, the path switch functionality may be at least temporarily unused and a (possibly simultaneous) linear carrier transit over the two track sections (possibly in opposite directions) through the vacuum processing chamber 101 can be carried out. A “single movable track” that has only one laterally movable track section does not enable such a carrier transfer, because a “single movable track” does not allow for the simultaneous transport of two carriers next to each other.

[0028] (2) Since the common movable support 119 is movable in the path switch direction S, a carrier can switch position from the first transport path T1 to the second transport path T2 and/or vice versa, by a lateral movement of the common movable support. The “track switch functionality” increases the flexibility and enables further or different carrier transport sequences, without a considerable increase in complexity. Further, a “dual movable track” as described herein having a fixed distance between the two track sections is less complex and less cost-intensive as compared to a carrier transport system with two laterally movable track sections that are movable also relative to each other, since the number of drives, the number of supports, and/or the number of vacuum feed-throughs can be reduced. Other path switch mechanisms that allow two individually movable track sections to be moved past each other in the path switch direction are typically complex, and maintenance-intensive. The DMT described herein is more robust and enables a more reliable carrier support and transfer.

[0029] (3) Since the common movable support 119 is movable in the path switch direction S, it may also be possible to move at least one of the first and second carrier holders to a processing position D laterally offset from the first and second transport paths for processing substrates carried by the carriers in the vacuum processing chamber 101, e.g. for coating substrates with a material. Accordingly, the first vacuum processing chamber 101 can not only be used as a transit module for carrier transport in the main transport direction T, but optionally also for conducting path switches and/or as a layer deposition module for coating a substrate at a processing position D (or as a module for conducting another processing action on a substrate at a processing position D). A single movable track is less flexible in this respect, because the respective vacuum chamber cannot be otherwise used when the single movable track is occupied with a carrier, while the dual movable track has a free track section, e.g. for linear substrate transit through the vacuum chamber, even if one of the two tracks is occupied, e.g., for carrier transport or substrate processing. [0030] Accordingly, the dual movable track described herein allows for a flexible carrier routing to efficiently use a system layout and constitutes a cost-efficient and robust design that is suitable for reaching a high throughput without expensive and complex design solutions that may be more maintenance-intensive. The uptime of the system can be increased and the tact time of an in-line processing system can be decreased.

[0031] In some embodiments, which can be combined with other embodiments described herein, the common movable support 119 is movable together with the first carrier holder 110 and the second carrier holder 120 in the path switch direction S between two or more of the following transport states: the first transport state (i) shown in FIG. 1, in which the first track section is aligned with the first transport path T1 and the second track section is aligned with the second transport path T2; a second transport state (ii) shown in FIG. 2, in which the second track section is positioned at a processing position D offset from the first and second transport paths, and/or a third transport state (iii) shown in FIG. 3, in which the second track section is aligned with the first transport path Tl, e.g., for moving the second carrier 20 along the first transport path Tl. Optionally, in the second transport state (ii), the first track section may be aligned with the second transport path T2, e.g., for moving the first carrier 10 along the second transport path T2 (see FIG. 2).

[0032] FIG. 2 shows the carrier transport system 100 after movement of the common movable support 119 in the path switch direction S to the second transport state (ii). From the first transport state (i) shown in FIG. 1, the common movable support 119 may, e.g., be moved by the distance X or by a distance different from X toward the processing device 105, until the second carrier holder 110 is positioned at a processing position D. Here, a second substrate 21 carried by the second carrier 20 held on the second carrier holder 120 faces toward the processing device 105 for being processed (shown by arrows in FIG. 2 that illustrate the material deposition on the second substrate 21).

[0033] If the distance between the second transport path T2 and the processing position D corresponds to the distance X between the first and second transport paths (as is illustrated in the figures), the first carrier holder 110 may be essentially aligned with the second transport path T2 at the second transport state (ii). At least one of the first and second carrier holders may support a carrier during the movement of the common movable support 119 in the path switch direction S.

[0034] A “processing position D” may be understood as a position offset from the first and second transport paths, at which a substrate carried by a carrier is to be positioned for undergoing processing, particularly for being coated with a coating material. Specifically, the “processing position D” may be arranged between the second transport path T2 and a processing device 105, and the second transport path T2 may be arranged between the first transport path T1 and the processing position D. It is not necessary, but possible, that the distance between the first and second transport paths corresponds to the distance between the second transport path T2 and the processing position D.

[0035] The processing device 105 may be a deposition source, particularly a sputter source, and the second substrate 21 held on the second carrier holder 120 can be coated with a material, when the common movable support 119 is in the second transport state (ii). Accordingly, the common movable support 119 can be moved from the first transport state (i) to the second transport state (ii) for transferring the second carrier holder 120 from the second transport path T2 to the processing position D for processing the second substrate 21 that is carried by the second carrier 20. Optionally, the first carrier holder 110 can at the same time carry out a track switch from the first transport path T1 to the second transport path T2.

[0036] FIG. 3 shows the carrier transport system 100 after movement of the common movable support 119 in the path switch direction S to a third transport state (iii). From the first transport state (i) shown in FIG. 1, the common movable support 119 may, e.g., be moved by the distance X away from the processing device 105, until the second carrier holder 120 is essentially aligned with the first transport path Tl. The second carrier holder 120 may be occupied with a carrier during the movement.

[0037] In some embodiments, the second carrier holder 120, but not the first carrier holder 110, can hold a carrier in the third transport state (iii). In particular, in the third transport state (iii), the first carrier holder 110 may be positioned at a first park position Pl, which may be a position close to a chamber wall of the vacuum processing chamber. The first carrier holder 110 positioned at the first park position Pl may be in an idle state (not usable for carrier support), when the common movable support is in the third transport state (iii).

[0038] Optionally, in some embodiments, the common movable support 119 can be moved to a fourth transport state (iv) that is depicted in FIG. 4, specifically by moving the common movable support 119 from the second transport state (ii) further toward the processing device 105, in particular by the distance X. Accordingly, in the fourth transport state (iv), the first track section may be positioned at the processing position, such that the first substrate 11 carried by the first carrier 10 that is held by the first carrier holder 110 can be processed, particularly coated with a material (shown by arrows in FIG. 4 that illustrate the material deposition on the first substrate 11).

[0039] In some embodiments, which can be combined with other embodiments described herein, the second track section may be positioned at a (second) park position P2, when the common movable support 119 is in the fourth transport state (iv). The second park position P2 may be a position close to the processing device 105. For example, the second track section may be arranged in proximity to or even partially overlapping with the processing device 105 (when viewed from above). In some embodiments, the second carrier holder 120 may for example be at least partially arranged below the processing device 105 or below a mask, when the common movable support 119 is in the fourth transport state (iv), as it is schematically depicted in FIGS. 4 and 6.

[0040] The fourth transport state (iv) may enable a processing of a substrate with the processing device 105, when the carrier carrying the substrate is on the first carrier holder 110 (which is the carrier holder that is more distant from the processing device 105). In some embodiments, the first carrier holder 110, but not the second carrier holder 120, can hold a carrier in the fourth transport state (iv), because the second carrier holder 120 may be in second park position P2 that may not be meant for holding a carrier, e.g., because an available space above the second carrier holder 120 may not be sufficient at the second park position P2 (see FIG. 6). [0041] In some embodiments, the common movable support 119 may be movable at least between the following transport states: the first transport state (i), in which the carrier transport system can be used as a transit module for linear carrier transport along the first and second transport paths through the first vacuum processing chamber, the second transport state (ii), in which the second track section is positioned at the processing position D, and the first track section is optionally aligned with the second transport path T2; the third transport state (iii), in which the second track section is aligned with the first transport path T1 and the first track section may be positioned at a first park position Pl, and, optionally, a fourth transport state (iv), in which the first track section is positioned at the processing position (D), wherein the second track section may optionally be positioned at a second park position P2.

[0042] In particular, the common movable support 119 may be movable in the path switch direction S such that both the first track section and the second track section can be transferred between the first transport path Tl, the second transport path T2, and the deposition position D.

[0043] A “park position” as used herein may be understood as a position of a carrier holder, in which the carrier holder is in an idle state, i.e., not usable for holding a carrier.

[0044] FIG. 5 shows a schematic sectional view of a carrier transport system 100 according to embodiments described herein. The sectional plane is designated as “Y” in FIG. 1. The carrier transport system 100 of FIG. 5 may include some of or all the features of the embodiment of FIG. 1, such that reference can be made to the above explanations, which are not repeated here.

[0045] In particular, the carrier transport system 100 includes the common movable support 119 at which the first carrier holder 110 and the second carrier holder 120 may be fixedly mounted at a relative distance corresponding to the distance between the first transport track Tl and the second transport track T2. In the first transport state (i) that is depicted in FIG. 5, the first carrier holder 110 is configured to hold a first carrier 10 in alignment with the first transport path Tl, such that the first carrier can be transported into or through the vacuum processing chamber 101 along the first transport path Tl, which may be a forward path. The second carrier holder 120 is configured to hold a second carrier 20 in alignment with the second transport path T2, such that the second carrier can be transported into or through the vacuum processing chamber 101 along the second transport path T2, which may be a return path. The common movable support 119 can be moved in the path switch direction S for moving the first carrier holder 110 and the second carrier holder 120 in the path switch direction S.

[0046] As is depicted in the sectional view of FIG. 5, the first carrier 10 (and the first substrate 11 that is carried by the first carrier 10) and the second carrier 20 (and the second substrate 21 that is carried by the second carrier 20) have an essentially vertical orientation V during the transport by the carrier transport system 100. “Essentially vertical” as used herein may be understood as an exactly vertical orientation or an orientation deviating from an exactly vertical orientation by +/-10⁰ or less. A carrier transport in an essentially vertical orientation and/or a substrate processing in the essentially vertical orientation are particularly space-saving and reduce the footprint and the costs of the vacuum deposition system.

[0047] The carrier transport system 100 includes the first carrier holder 110 that is configured to hold the first carrier 10, particularly in an essentially vertical orientation and the second carrier holder 120 that is configured to hold the second carrier 20, particularly in an essentially vertical orientation. A first drive unit 112 may be provided for transporting the first carrier 10 in the main transport direction T onto or off the first carrier holder 110, and a second drive unit 122 may be provided for transporting the second carrier 20 in the main transport direction T onto or off the second carrier holder 120.

[0048] In some implementations, at least one of the first drive unit 112 and the second drive unit 122 includes a linear motor (linear electric motor) configured to contactlessly drive the respective carrier along the main transport direction T. In some embodiments, a plurality of first drive units 112 and a plurality of second drive units 122 may be arranged along the main transport direction T, respectively, e.g., at regular spacings. Alternatively or additionally, the drive units may include a mechanical drive, such as one or more drive rollers that can be driven in rotation by a motor for moving the respective carrier in the main transport direction T on the one or more drive rollers.

[0049] In some implementations, the first and second drive units may be provided at the first and second carrier holders and may move together with the common movable support 119 in the path switch direction S during a path switch (see, for example, the first drive unit 112 and the second drive unit 122 of FIG. 5 that are respectively supported on the common movable support 119). Alternatively or additionally, a plurality of drive units (e.g. linear motors or rollers) may be stationarily arranged in the vacuum processing chamber 101 for driving the first carrier 10 along the first or second transport path on or off the first carrier holder 110 and/or for driving the second carrier 20 along the first or second transport path on or off the second carrier holder 120 (see, for example, the carrier drive units 301 in FIG. 1).

[0050] As is depicted in FIG. 5, the first carrier holder 110 and the second carrier holder 120 may have an essentially corresponding setup and corresponding features. In the following, the first carrier holder 110 will be described in more detail, but it is to be understood that the second carrier holder 120 may be constructed analogously.

[0051] In some embodiments, at least one of the first carrier holder 110 and the second carrier holder 120 includes at least one magnetic levitation unit 114 for magnetically counteracting at least a part of a carrier weight force. Specifically, the first carrier holder 110 may include at least one first magnetic levitation unit, particularly a levitation magnet, for magnetically counteracting at least a part of the weight force of the first carrier 10 when held by the first carrier holder 110, and/or the second carrier holder 120 may include at least one second magnetic levitation unit, particularly a levitation magnet, for magnetically counteracting at least a part of the weight force of the second carrier 20 when held by the second carrier holder 120.

[0052] Specifically, 10% or more, particularly 30% or more, or even 50% or more of the weight of the first carrier may be magnetically held by one or more magnetic levitation units, when the first carrier is supported on the first carrier holder 110. In some embodiments, the first carrier 10 may be completely levitated, i.e. held in a floating state contactlessly relative to the first carrier holder 110 by the at least one magnetic levitation unit 114 and/or by further magnetic levitation units.

[0053] In some embodiments, a first part of the weight of the first carrier 10 (e.g., between 20% and 60%, particularly between 30% and 50%) supported on the first carrier holder 110 is magnetically held by the at least one magnetic levitation unit 114, and a second part of the weight of the first carrier 10 (e.g., between 20% and 60%, particularly between 30% and 50%) is supported on a mechanical support, such as on at least one support roller 116, as it is schematically depicted in FIG. 5. Optionally, a third part of the weight force of the first carrier (e.g. between 10% and 50%, particularly between 20% and 30%) may be magnetically held by a first carrier top holder 201 that may be at least partially arranged above the first carrier. In some embodiments, also the first carrier top holder 201 can move in the path switch direction S, e.g., by moving a common upper support 203 on which the first carrier top holder 201 may be mounted.

[0054] A (partial or complete) magnetic support of a carrier on a carrier holder can reduce friction of the carrier during the transport and during a path switch, such that the generation of small particles that may negatively affect the substrate processing in the vacuum processing chamber can be reduced or avoided. The quality of the substrate processing, particularly the layer deposition quality, can be improved.

[0055] In some embodiments, which can be combined with other embodiments described herein, the at least one magnetic levitation unit 114, particularly the at least one first magnetic levitation unit of the first carrier holder and/or the at least one second levitation unit of the second carrier holder, is a passive magnet, particularly a permanent magnet. A passive magnet may attract the first carrier upwardly, e.g. by exerting an attractive magnetic force on a countermagnet 15 or on a ferromagnetic material (such as steel) of the carrier in an upward direction.

[0056] In some embodiments, an active levitation magnet may be provided in alternative or in addition to a passive magnet at the first carrier holder 110, particularly if the first carrier holder is arranged at least partially above the first carrier. An active levitation magnet is a levitation magnet, such as a coil, the strength of which is actively controlled to maintain a predetermined gap distance between the at least one first carrier holder and the first carrier. A passive levitation magnet is a levitation magnet, the strength of which is not actively controlled.

[0057] In some embodiments, which can be combined with other embodiments described herein, at least one of the first carrier holder 110 and the second carrier holder 120 comprises at least one support roller 116 for mechanically supporting at least a part of a carrier weight force. Specifically, the first carrier holder 110 may include at least one first support roller for mechanically supporting at least a part of the weight force of the first carrier, and the second carrier holder 120 may include at least one second support roller for mechanically supporting at least a part of the weight force of the second carrier.

[0058] As mentioned above, a part of the weight force of the first carrier 10 may be magnetically held by the at least one first magnetic levitation unit of the first carrier holder 110, and a second part of the weight force of the first carrier 10 may be mechanically supported on the at least one first support roller of the first carrier holder 110. A mechanical support may further stabilize the respective carrier in the path switch direction S. The at least one support roller 116 may be rotatable around a rotation axis that extends in the path switch direction S. A completely contactless levitation of a carrier by magnetic forces is challenging and typically uses an active control of the magnetic levitation unit(s) for maintaining a stable position of the levitated carrier, which is more complex. On the other hand, by magnetically holding (only) a part of the carrier weight and mechanically supporting the remaining part of the carrier weight, the carrier can be held in a stable position via the mechanical support while at the same time reducing problems associated with frictional forces via the partial magnetic levitation. Accordingly, the carrier transport system shown in FIG. 5 allows for a reliable path switch of a carrier in the path switch direction S between two or more transport paths while reducing the generation of small particles that would have a negative effect on the substrate processing without unnecessary complexity.

[0059] As is schematically depicted in FIG. 5, the common movable support 119 may be at least partially arranged below a carrier transportation space, through which the first carrier and/or the second carrier can be transported along the first and second transport paths. Specifically, the first carrier holder and/or the second carrier holder may support the respective carrier “from below”, e.g. magnetically interacting with a lower part or lower surface of the carrier and/or supporting a lower carrier portion via at least one support roller. Alternatively or additionally, the common movable support 119 may be at least partially arranged above the carrier transportation space, for holding the first and/or second carriers “from above”, e.g. via one or more magnetic levitation units configured to magnetically interact with an upper surface of the carrier.

[0060] In the exemplary embodiment of FIG. 5, the common movable support 119 is arranged below the carrier transportation space, supporting the carriers “from below”, i.e., the first carrier holder 110 is configured to support a lower portion of the first carrier and the second carrier holder 120 is configured to support a lower portion of the second carrier. In addition, a common upper support 203 (shown in dashed lines as being optional) is provided for holding and/or stabilizing the carriers “from above”.

[0061] In some embodiments, which can be combined with other embodiments described herein, the carrier transport system 100 includes a first carrier top holder 201 for holding and/or stabilizing an upper portion of the first carrier 10 held on the first carrier holder 110 and a second carrier top holder 202 for holding and/or stabilizing an upper portion of the second carrier 20 held on the second carrier holder 120. The first carrier top holder 201 and the second carrier top holder 202 may be fixedly mounted at a common upper support 203, e.g. at a support arm or support bar that may extend substantially in the path switch direction S and that is movable in the path switch direction S, particularly together with the common movable support 119.

[0062] The common movable support 119 and the common upper support 203 may be movable in the path switch direction S via one common drive. Alternatively, a first motor or drive may be provided for moving the common movable support 119, and a second motor or drive may be provided for moving the common upper support 203. The first and second motors may be adapted for moving the upper and lower supports simultaneously, such that upper and lower parts of the held carrier(s) can be supported and moved in synchrony in the path switch direction S. [0063] FIG. 6 shows the carrier transport system 100 of FIG. 5 in a different transport state, namely after movement of the common movable support 119 in the path switch direction S, together with the first carrier holder 110 and the second carrier holder 120 mounted thereon. In the depicted transport state, the first track section defined by first carrier holder 110 is positioned at the processing position D, such that a substrate that is carried by the first carrier 10 held on the first carrier holder 110 can be processed with the processing device 105, particularly coated with a material. The second track section defined by the second carrier holder 120 may be arranged at the second park position P2, which may be in proximity to and/or partially below (or above) the processing device 105 or a deposition area. After the processing, the common movable support 119 can be moved toward the left side in FIG. 6, until the first track section is arranged in alignment with the second transport track T2, that may be a return path, such that the processed substrate can be transported off the first carrier holder 110 along the second transport path T2, e.g., for unloading from the vacuum processing system.

[0064] The carrier transport system 100 described herein may be configured for a carrier transport along the first transport path T1 and along the second transport path T2 as well as in the path switch direction S, while the carriers being transported are essentially vertically oriented. In other words, the carrier transport system 100 may be adapted for the transport of vertically oriented carriers.

[0065] Embodiments described herein can be used for transporting carriers carrying at least one of large-area substrates, glass substrates, wafers, semiconductor substrates, masks, shields, and other objects. Embodiments particularly relate to the transport and coating of large-area glass substrates with a surface area of 1 m² or more. Embodiments may also be used for semiconductor manufacture and processing, such as for wafer transport, wafer processing and/or wafer coating. The carriers can carry one single object, e.g., a large-area substrate with a size of 1 m² or more, particularly 5 m² or 10 m² or more, or a plurality of objects having a smaller size, e.g. a plurality of semiconductor wafers. The carrier may include a chucking device configured to hold at least one substrate at the carrier, e.g., a magnetic chuck, an electrostatic chuck, and/or a mechanical holder, such as a clamp or mechanical chuck. [0066] The carriers that are transported may be carriers for carrying a large area substrate having a surface area of 1 m² or more, particularly 5 m² or more. Accordingly, each of the carriers may have a surface area for carrying a substrate thereon of 1 m² or more, particularly 5 m² or more. A carrier may have a dimension in the main transport direction T of 1 m or more, e.g., 2 m or more.

[0067] The carrier transport system 100 according to any of the embodiments described herein may be used in a vacuum deposition system 1000 that includes at least a first vacuum processing chamber 101 that houses a first processing device 105 that may be a first deposition source for depositing a material on a substrate carried by a carrier. The carrier transport system 100 may be configured to transfer a carrier carrying a substrate inside the first vacuum processing chamber 101 between the first transport path Tl, the second transport path T2, and a processing position D for depositing a layer on the substrate with the deposition source.

[0068] FIGS. 7A and 7B show schematic top views of a vacuum deposition system 1000 according to embodiments described herein. The vacuum deposition system 1000 includes a first vacuum processing chamber 101 that houses a first processing device 105 that may be a first deposition source and a second vacuum processing chamber 102 that houses a second processing device 106 that may be a second deposition source. The first vacuum processing chamber 101 may be arranged next to the second vacuum processing chamber 102, particularly with a closable opening 109 or closable lock for closing the transition between the first and second vacuum processing chambers.

[0069] The first vacuum processing chamber 101 may be arranged on a first side (upstream) of the second vacuum processing chamber 102. Specifically, the first vacuum processing chamber 101 may be arranged between the second vacuum processing chamber 102 and one or more vacuum loading modules 103 which may be configured for loading carriers into the vacuum processing system and/or for unloading the carriers from the vacuum processing system after the processing. One, two or more vacuum loading modules may be positioned for acting as one or more vacuum sluices for improving the vacuum conditions in the first and second vacuum processing chambers during carrier loading and unloading from the vacuum system. [0070] In some embodiments, the vacuum deposition system 1000 may include one or more vacuum loading modules 103 arranged on a first (upstream) side of the first vacuum processing chamber 101, the second vacuum processing chamber 102 being arranged on a second (downstream) side of the first vacuum processing chamber 101 opposite the first side. The second vacuum processing chamber 102 may optionally be the last vacuum chamber along the first and second transport paths, as it is depicted in FIGS. 7A and 7B. Alternatively, more than two vacuum processing chambers may be arranged in a line setup.

[0071] The first transport path T1 may be configured as a forward path (or “entrance path”) for moving carriers into the vacuum deposition system from the one or more vacuum loading modules 103 through the first vacuum processing chamber 101 into the second vacuum processing chamber 102 for processing. The second transport path may be configured as a return path (or “exit path”) for moving carriers out of the vacuum deposition system 1000 from the second vacuum processing chamber 102 through the first vacuum processing chamber 101 and through the one or more vacuum loading modules 103 for unloading.

[0072] The first transport path T1 and the second transport path T2 may extend linearly in the main transport direction T through the first and second vacuum processing chambers, particularly with a distance X therebetween. The carrier transport system 100 described herein may include the common movable support 119 configured to move carriers in the first vacuum processing chamber 101 at least between the first transport path T1 and the second transport path T2, enabling a path switch and/or a carrier transfer to a processing position D for substrate processing with the first processing device 105.

[0073] In some embodiments, which can be combined with other embodiments described herein, a second carrier transport system 200 (a path switch device) may be provided that is configured for a carrier transfer in the second vacuum processing chamber 102 in the path switch direction S between the first transport path T1 and the second transport path T2, and optionally to a second processing position D2 offset from the first and second transport paths for substrate processing with the second processing device 106. At the second processing position DI, a substrate carried by the respective carrier can be coated with a material.

[0074] The second carrier transport system may include a dual movable track (DMT) as described herein, i.e., the second carrier transport system 200 may essentially correspond to the carrier transport system 100 in the first vacuum processing chamber 101. In other embodiments, the second carrier transport system 200 may be a single movable track (SMT) that includes one single track section that can be transferred between the first transport path Tl, the second transport path T2, and the second processing position D2 in the path switch direction. An SMT may be less complex and may be more robust as compared to a DMT. The second vacuum processing chamber 102 may not be used as a transit module for carrier transport into a further subsequent vacuum chamber, such that an SMT may be sufficient here.

[0075] Alternatively, as it is schematically depicted in FIG. 8, the second carrier transport system 300 for carrier transfer in the second vacuum processing chamber 102 may include two laterally movable track sections which can also be moved relative to each other and optionally even past each other. Such a second carrier transport system 300 is more complex as compared to the carrier transport system 100 with a DMT as described herein, but can potentially further reduce the tact time of the system, because a subsequent carrier can already be loaded on a second carrier holder, while the first carrier holder may still be occupied, e.g. being processed.

[0076] FIG. 9 shows a flow diagram for illustrating a method of transporting carriers in a vacuum processing system, particularly in a vacuum deposition system for depositing one or more material layers on substrates, according to embodiments described herein. The method illustrated in FIG. 9 can, for example, be carried out in the vacuum deposition system of FIG. 7A and FIG. 7B, of FIG. 8, or in another vacuum processing system described herein.

[0077] In box 911, a carrier carrying a substrate is transported along a first transport path Tl, which may be a forward path, in a main transport direction T onto the second carrier holder 120 (or alternatively onto the first carrier holder 110), the first and second carrier holders being arranged in the first vacuum processing chamber 101. The first carrier holder 110 and the second carrier holder 120 are provided (fixedly mounted) at a common movable support 119 at two positions spaced apart in the path switch direction S. In particular, the first carrier holder 110 and the second carrier holder 120 are mounted at a common movable support arm or support bar that extends in the path switch direction S partially through the first vacuum processing chamber 101. The distance between the first and second carrier holders essentially corresponds to the distance X between the first and second transport paths. The first carrier holder 110 and the second carrier holder 120 are respectively configured to hold a carrier, particular having an essentially vertical orientation.

[0078] In box 912, the common movable support 119 is moved in the path switch direction S for moving the first carrier holder 110 and the second carrier holder 120 synchronously in the path switch direction S toward a first processing device 105 for positioning the carrier at a processing position D. For example, in FIG. 7B, such a state is shown in which a second carrier 20 held on the second carrier holder 120 has been transferred from the first transport path T1 to the processing position D. At the processing position D, the carrier faces toward the first processing device 105, particularly toward a deposition source.

[0079] In box 913, the substrate carried by the carrier is processed, particularly coated with a material, at the processing position D.

[0080] In box 914, the common movable support 119 is moved backward in the path switch direction S for moving the first carrier holder 110 and the second carrier holder 120 synchronously in the path switch direction S away from the first processing device 105, until the carrier is positioned on the second transport path T2, which may be a return path that is arranged between the first transport path T1 and the processing position D (see FIG. 7B).

[0081 ] In box 915, the carrier that carries the processed substrate is transported off the first carrier holder along the second transport path T2, particularly into one or more vacuum loading modules 103 for unloading from the vacuum deposition system. [0082] In some embodiments, which can be combined with other embodiments described herein, at least a part of the weight force of the carrier that is held by the second (or first) carrier holder is magnetically counteracted, particularly by at least one levitation magnet of the carrier holder. Alternatively or additionally, at least a part of the weight force of the carrier that is held by the second (or first) carrier holder is supported on at least one support roller of the carrier holder.

[0083] The vacuum deposition system may further include a second vacuum processing chamber 102 that houses a second processing device 106, particularly a second deposition source, arranged next to (e.g., downstream of) the first vacuum processing chamber 101. The first transport path T1 and the second transport path T2 may extend linearly and laterally spaced apart from each other through the first vacuum processing chamber 101 and through the second vacuum processing chamber 102 (see FIGS. 7A and 7B, showing such a system).

[0084] The method illustrated in FIG. 9 may particularly be carried out when the second vacuum processing chamber 102 is not operational, not under vacuum, and/or undergoing service or maintenance. For example, as it is schematically depicted in FIG. 7B, the closable opening 109 between the first and second vacuum processing chambers may be closed, and the second vacuum processing chamber 102 may not be under vacuum conditions, e.g. flooded with a gas, for example for servicing the second processing device 106.

[0085] On the other hand, as is depicted in FIG. 7A, if the second vacuum processing chamber 102 is operational, the first vacuum processing chamber 101 may be used as a transit module for transporting the carriers into the second vacuum processing chamber 102 through the first vacuum processing chamber 101. Here, substrate coating may be conducted (exclusively or additionally) in the second vacuum processing chamber 102 and the common movable support 119 may remain in the first transport state (i) that is depicted in FIG. 7A, enabling a transit passage in the main transport direction T over the first and second track sections.

[0086] Specifically, in the transport state (i) of FIG. 7A, carriers can be transported through the first vacuum processing chamber 101 over the first track section that is defined by the first carrier holder 110 along the first transport path T1 (acting as a forward path), can undergo processing in the second vacuum processing chamber 102, and can then be transported back through the first vacuum processing chamber 101 over the second track section that is defined by the second carrier holder 120 along the second transport path (acting as a return path). The dual movable track in the first vacuum processing chamber 101 reduces the tact time as compared to a single movable track, because a subsequent carrier to be processed can already wait on the first track section, while the second movable track can be loaded with a carrier having undergone processing in the second vacuum processing chamber.

[0087] In some embodiments, the first vacuum processing chamber 101 may provide redundancy. Coating can be conducted in the second vacuum processing chamber 102, if operational, and the first and second track sections may remain in the first transport position (i) for providing a transit passage through the first vacuum processing chamber 101. If the second vacuum processing chamber 102 is not operational, coating can be conducted in the first vacuum processing chamber 101, and the second track section that is defined by the second carrier holder 120 (or alternatively the first carrier holder 110) can be used for carrier transfer from the first transport path (acting as a forward path) to the processing position D for processing, and back to the second transport path (acting as a return path) in the path switch direction S, in accordance with the method illustrated in FIG. 9.

[0088] In particular, the vacuum deposition system 1000 can be used for depositing one (single) layer on substrates (“one-layer coating”) in the second vacuum processing chamber 102, or alternatively in the first vacuum processing chamber 101 (e.g., if the second vacuum chamber 102 is not operational). Since the two vacuum processing chambers provide redundancy, the uptime of the system can be increased and processing can continue also during maintenance of the second vacuum processing module.

[0089] The vacuum deposition system can alternatively or additionally be used for depositing two layers on substrates (“two-layer coating”). In particular, a first material may be deposited with the first deposition source in the first vacuum processing chamber 101 and a second material may be deposited over the first material in the second vacuum processing chamber 102, or vice versa, utilizing both the carrier transport system 100 and the second carrier transport system 200 for carrier transfer toward the respective deposition source in the respective vacuum processing chamber. A possible substrate transport sequence is illustrated by the arrows of FIG. 10. The dual movable track in the first vacuum processing chamber reduces the tact time as compared to a single movable track and is less cost-intensive and more robust as compared to two relatively movable tracks. It is alternatively also possible to deposit the first material in the second vacuum processing chamber and the second material over the first material in the first vacuum processing chamber.

[0090] The vacuum deposition system can alternatively or additionally be used for depositing three layers on substrates (“three-layer coating”). For example, a first material may be deposited with the first deposition source in the first vacuum processing chamber 101, a second material may be deposited over the first material with the second deposition source in the second vacuum processing chamber 102, and the first material may again be deposited over the second material in the first vacuum processing chamber 101.

[0091] The above carrier transport sequences and yet further carrier transport sequences through the vacuum deposition system are possible, e.g. for depositing two, three or more layers on substrates, since the dual movable track DMT as described herein provided in at least one or more of the vacuum processing chambers of the vacuum deposition system increases the flexibility of substrate routing and substrate transfer, is robust and reliable, and requires less space as compared to other designs. Further, a reduced number of drives (e.g., only one drive) may be required, because the first and second track sections can be moved together. Also redundancy systems as described herein are possible.

[0092] According to some embodiments described herein, the processing device in the first and/or second vacuum processing chamber may be a sputter source configured to deposit a material on a substrate at a processing position by sputtering. One or more of the following materials may be deposited on the substrate in the vacuum processing chamber(s), particularly by sputtering: ITO, IGZO, a metal, Al, Cu, Ti, Mb and MbNi. [0093] While the foregoing is directed to embodiments, other and further embodiments may be devised without departing from the basic scope, and the scope is determined by the claims that follow.

Claims

1. A carrier transport system (100) for transporting carriers in a vacuum processing chamber in a main transport direction (T) along a first transport path (Tl) and along a second transport path (T2) extending next to the first transport path (Tl) and for transferring carriers in a path switch direction (S) between the first transport path (Tl) and the second transport path (T2), comprising: a common movable support (119) at which a first carrier holder (110) defining a first track section and a second carrier holder (120) defining a second track section are provided spaced apart from each other in the path switch direction (S), wherein, in a first transport state (i) of the common movable support (119), the first carrier holder (110) is configured to hold a first carrier (10) in alignment with the first transport path (Tl) and the second carrier holder (120) is configured to hold a second carrier (20) in alignment with the second transport path (T2), the common movable support being movable in the path switch direction (S) for moving the first carrier holder (110) and the second carrier holder (120) synchronously in the path switch direction (S).

2. The carrier transport system of claim 1, wherein the common movable support (119) is movable together with the first carrier holder (110) and the second carrier holder (120) in the path switch direction (S) between two or more of the following states: the first transport state (i), in which the first track section is aligned with the first transport path (Tl) and the second track section is aligned with the second transport path (T2), a second transport state (ii), in which the second track section (120) is positioned at a processing position (D) offset from the first and second transport paths for processing of a substrate carried by the second carrier with a processing device (105), and a third transport state (iii), in which the second track section (120) is aligned with the first transport path (Tl) for moving the second carrier (20) along the first transport path (Tl).

3. The carrier transport system of claim 2, wherein, in the second transport state (ii), the first track section is aligned with the second transport path (T2) for moving the first carrier (10) along the second transport path.

4. The carrier transport system of claim 2 or 3, wherein, in the third transport state (iii), the first track section is positioned at a first park position (Pl) in proximity to a chamber wall of the vacuum processing chamber and is in an idle state.

5. The carrier transport system of any of claims 2 to 4, wherein the common movable support (119) is movable together with the first carrier holder (110) and the second carrier holder (120) in the path switch direction (S) at least between the following states: the first transport state (i), the second transport state (ii), in which the second track section is positioned at a processing position (D), wherein the first track section is optionally aligned with the second transport path (T2) in the second transport state (ii); the third transport state (iii), in which the second track section is aligned with the first transport path (Tl) and the first track section is positioned at a first park position (Pl); and optionally a fourth transport state (iv), in which the first track section is positioned at the processing position (D).

6. The carrier transport system of claim 5, wherein, in the fourth transport state (iv), the second track section is positioned at a second park position (P2) in proximity to and/or partially below a processing device (105) and is in an idle state.

7. The carrier transport system of any of claims 1 to 6, wherein at least one of the first carrier holder (110) and the second carrier holder (120) comprises at least one magnetic levitation unit (114) for magnetically counteracting at least a part of a carrier weight force.

8. The carrier transport system of claim 7, wherein the at least one magnetic levitation unit (114) is a passive magnet, particularly a permanent magnet.

9. The carrier transport system of any of claims 1 to 8, wherein at least one of the first carrier holder (110) and the second carrier holder (120) comprises at least one support roller (116) for mechanically supporting at least a part of a carrier weight force.

10. The carrier transport system of any of claims 1 to 9, further comprising a first drive unit (112) for transporting the first carrier (10) in the main transport direction (T) onto or off the first carrier holder (110), and/or a second drive unit (122) for transporting the second carrier (10) in the main transport direction (T) onto or off the second carrier holder (120).

11. The carrier transport system of claim 10, wherein at least one of the first drive unit (112) and the second drive unit (122) comprises a linear motor configured to contactlessly drive the first carrier (10) or the second carrier (20) along the main transport direction (T).

12. The carrier transport system of any of claims 1 to 11, wherein the common movable support (119) includes a movable support arm or support bar extending through a side wall of the vacuum processing chamber (101) and being movable in the path switch direction (S) via a motor (118) arranged outside the vacuum processing chamber (101).

13. The carrier transport system of any of claims 1 to 12, further comprising a first carrier top holder (201) for holding or stabilizing an upper portion of the first carrier (10) held by the first carrier holder (110) and a second carrier top holder (202) for holding or stabilizing an upper portion of the second carrier (20) held by the second carrier holder (120), the first carrier top holder and the second carrier top holder being fixed at a common upper support (203) that is movable in the path switch direction (S) synchronously with the common movable support (119).

14. The carrier transport system of any of claims 1 to 13, being configured for a carrier transport along the first transport path (Tl) and along the second transport path (T2) as well as in the path switch direction (S), while the carriers being transported are essentially vertically oriented.

15. A vacuum deposition system (1000) with the carrier transport system (100) of any of claims 1 to 14, comprising: a first vacuum processing chamber (101) that houses a first processing device (105) that is a first deposition source; a second vacuum processing chamber (102) that houses a second processing device (106) that is a second deposition source, wherein the first transport path (Tl) and the second transport path (T2) extend linearly in the main transport direction (T) and next to each other through the first and second vacuum processing chambers; wherein the common movable support (119) of the carrier transport system (100) is configured to move carriers in the first vacuum processing chamber (101) between the first transport path (Tl) and the second transport path (T2).

16. The vacuum deposition system of claim 15, further comprising a second carrier transport system (200) configured for a carrier movement in the second vacuum processing chamber (106) in the path switch direction (S) between the first transport path (Tl), the second transport path (T2) and a second processing position (D2) for processing a substrate with the second processing device (106).

17. The vacuum deposition system of claim 15 or 16, further comprising one or more vacuum loading modules (103) arranged on a first side of the first vacuum processing chamber (101), the second vacuum processing chamber (102) being arranged on a second side of the first vacuum processing chamber (101) opposite the first side.

18. A method of transporting carriers in a vacuum processing system, comprising: (a) transporting a carrier along a first transport path (Tl) in a main transport direction (T) onto a second carrier holder (120) or onto a first carrier holder (110) arranged in a first vacuum processing chamber (101), the first carrier holder and the second carrier holder being provided at a common movable support (119) spaced apart from each other in a path switch direction (S) and being respectively configured to hold a carrier;

(b) moving the common movable support in the path switch direction (S) for moving the first carrier holder and the second carrier holder synchronously in the path switch direction (S), until the carrier is positioned at a processing position (D);

(c) processing a substrate carried by the carrier;

(d) moving the common movable support in the path switch direction (S) for moving the first carrier holder (110) and the second carrier holder (120) synchronously in the path switch direction (S), until the carrier is positioned on a second transport path (T2), or alternatively on the first transport path (Tl); and

(e) transporting the carrier off the second carrier holder (120) or off the first carrier holder (110) along the second transport path (T2), or alternatively along the first transport path (Tl).

19. The method of claim 18, further comprising: magnetically counteracting at least a part of a weight force of the carrier held by the first carrier holder (110) or the second carrier holder (120); and supporting at least a part of the weight force of the carrier on at least one support roller (116) of the first carrier holder or the second carrier holder.

20. The method of claim 18 or 19, wherein a second vacuum processing chamber (102) that houses a second processing device (106) is arranged next to the first vacuum processing chamber (101), the first transport path (Tl) and the second transport path (T2) extending linearly and laterally spaced apart from each other through the first vacuum processing chamber (101) and the second vacuum processing chamber (102); wherein (a) to (e) are conducted when the second vacuum processing chamber (102) is any one or more of not operational, not under vacuum, and/or undergoing service or maintenance.