KR20260003181A - Vacuum deposition systems and methods for depositing stacks of layers on substrates - Google Patents

Abstract

A vacuum deposition system (100) for processing essentially vertically oriented substrates is described. The vacuum deposition system (100) comprises a plurality of deposition chambers (150) arranged in a row along a main transport direction (T) and housing a plurality of vacuum deposition sources (155) for depositing a stack of layers comprising at least one organic material on the substrates, wherein a first transport track (T1) and a second transport track (T2) extend parallel to each other in the main transport direction through the plurality of deposition chambers; a carrier transport system for transporting substrate carriers along the first transport track past the plurality of vacuum deposition sources (155) and along the second transport track; A first track switch module (121) and a second track switch module (122) for translating substrate carriers from a first transport track to a second transport track, or vice versa, in a track switch direction (S) transverse to a main transport direction (T), wherein a plurality of deposition chambers (150) are arranged between the first track switch module (121) and the second track switch module (122); and a substrate loading chamber (111) having a substrate input opening (402) for inputting substrates (10) in a non-vertical orientation, the substrate loading chamber including an orientation actuator for changing the substrate orientation from a non-vertical orientation to an essentially vertical orientation. Methods of depositing a stack of layers on a substrate in any one of the vacuum deposition systems described in the present application are also provided.

Description

Vacuum deposition systems and methods for depositing stacks of layers on substrates

Embodiments of the present disclosure relate to a vacuum deposition system for inline processing of essentially vertically oriented substrates. In particular, embodiments of the present disclosure relate to systems and methods for evaporating OLED layer stacks on vertically oriented substrates. Embodiments of the present disclosure also relate to systems and methods for depositing layer stacks, particularly OLED layer stacks, on substrates in a vacuum deposition system. In particular, large-area substrates carried by substrate carriers are processed in an essentially vertical orientation in an inline processing system according to embodiments described herein.

An organic light-emitting diode (OLED) is a light-emitting diode, a film of organic compounds whose electroluminescent layer emits light in response to an electric current. Because OLEDs emit light directly without any backlight or color filters, the color gamut and viewing angles achievable with OLED displays are superior to those of conventional LCD displays. Furthermore, OLEDs can be manufactured on flexible substrates, making them suitable for a wide range of applications. OLEDs are used to manufacture television screens, computer monitors, cell phones, and other handheld devices for displaying information. OLEDs can also be used for general space lighting. For example, an OLED display may comprise one or more layers of organic material positioned between two electrodes deposited on a substrate, forming a matrix display panel with individually energized pixels.

To manufacture OLEDs, organic and metallic materials are deposited on a substrate in a vacuum deposition system. Metallic materials are used, for example, as electrode materials or electron transport layer (ETL) materials. Materials to be deposited are evaporated from a material deposition source, and the evaporated materials are deposited onto the substrate through nozzles. Metallic materials are evaporated from the material deposition source at temperatures above about 1,000°C or above about 1,500°C.

The process of manufacturing OLED displays involves thermal evaporation of organic and/or metallic materials and deposition of these materials on a substrate in a high-vacuum environment. Deposition systems for depositing OLED layer stacks are typically large and complex. For example, rotating modules used to rotate substrates occupy a large installation space and require extensive maintenance. It would be advantageous to provide a more compact vacuum deposition system with reduced installation space and complexity, enabling high-volume OLED manufacturing.

Given the trend toward ever-increasing substrate sizes for display manufacturing, it would be beneficial to provide improved systems and methods for depositing a layer stack comprising at least one organic material on a substrate.

In view of the above, a vacuum deposition system for inline processing of essentially vertically oriented substrates carried by substrate carriers, as well as methods for depositing a stack of layers comprising at least one organic material on a substrate in a vacuum deposition system, are provided. Additional aspects, embodiments, features, and details may be derived from the dependent claims, drawings, and specification.

According to an aspect, a vacuum deposition system for inline processing of essentially vertically oriented substrates carried by substrate carriers is provided. The vacuum deposition system comprises a plurality of deposition chambers arranged in a row along a main transport direction and housing a plurality of vacuum deposition sources for depositing a stack of layers comprising at least one organic material on the substrates, wherein a first transport track and a second transport track extend parallel to each other through the plurality of deposition chambers in the main transport direction; a carrier transport system for transporting the substrate carriers along the first transport track past the plurality of vacuum deposition sources and in opposite directions along the second transport track; a first track switch module and a second track switch module for translating the substrate carriers from the first transport track to the second transport track, or vice versa, in a track switch direction transverse to the main transport direction, the plurality of deposition chambers being arranged between the first track switch module and the second track switch module, such that the substrate carriers can be transported along a closed loop through the vacuum deposition system; and a substrate loading chamber having a substrate input opening for receiving substrates in a non-vertical orientation in a vacuum deposition system, wherein the substrate loading chamber includes an orientation actuator for changing the substrate orientation from a non-vertical orientation to an essentially vertical orientation.

According to an aspect, a method is provided for depositing a stack of layers comprising at least one organic material on a substrate in a vacuum deposition system, particularly in any one of the vacuum deposition systems described in the present application. The vacuum deposition system comprises a plurality of deposition chambers arranged in a row along a main transport direction, wherein a first transport track and a second transport track extend parallel to each other in the main transport direction through the plurality of deposition chambers.

The method comprises the following steps, in particular in the order specified by (a) to (g): (a) introducing a substrate in a non-vertical orientation into a vacuum deposition system, in particular into a substrate loading chamber of the vacuum deposition system, and loading the substrate onto a substrate carrier; (b) changing the substrate orientation from a non-vertical orientation to an essentially vertical orientation; (c) translating a substrate carrier carrying the substrate from a second transport track to a first transport track, in particular in a track switch direction in a first track switch module; (d) transporting a substrate carrier carrying the substrate along the first transport track in a first direction through a plurality of deposition chambers past a plurality of vacuum deposition sources for depositing a stack of layers comprising at least one organic material on the substrate; (e) translating a substrate carrier carrying the substrate from the first transport track back to a second transport track, in particular in a second track switch module; (f) changing the substrate orientation from an essentially vertical orientation to a non-vertical orientation; and (g) unloading the substrate from the substrate carrier and outputting the substrate in a non-vertical orientation from the vacuum deposition system, particularly the substrate unloading chamber of the vacuum deposition system.

The method may further comprise the step of (h) transporting the substrate carrier in a second direction opposite to the first direction through a plurality of deposition chambers along a second transport track (T2), wherein step (h) may be performed between steps (b) and (c) (as schematically illustrated in FIG. 8), between steps (e) and (f) (as schematically illustrated in FIG. 2), or after step (g) (as schematically illustrated in FIG. 1).

In accordance with an aspect, a method of fabricating a substrate, more particularly a display, having a device, particularly an OLED layer stack, in any one of the vacuum deposition systems described in the present application is provided. The method comprises the steps of: inputting a substrate into the vacuum deposition system in a non-vertical orientation; changing the substrate orientation to an essentially vertical orientation; depositing a stack of layers comprising at least one organic material on the substrate while the substrate is in the essentially vertical orientation; changing the substrate orientation to the non-vertical orientation; and outputting the substrate from the vacuum deposition system in the non-vertical orientation.

According to an aspect, a substrate carrier for use in a vacuum deposition system, particularly a vacuum deposition system according to any one of the embodiments described in the present application, is provided. The substrate carrier is configured to transport a substrate through the vacuum deposition system in an essentially vertical orientation and comprises a carrier body having a substrate support surface; a chucking device, particularly an electrostatic chuck and/or a magnetic chuck, for securing the substrate to the substrate support surface; and a removable deposition protection shield at least partially surrounding the substrate support surface and covering portions of the carrier body to prevent material from being deposited thereon.

Embodiments also relate to devices for performing the disclosed methods, including device parts for performing each described method aspect. The method aspects may be performed by hardware components, a computer programmed with appropriate software, any combination of the two, or in any other manner. Furthermore, embodiments according to the present disclosure also relate to methods for manufacturing devices in the described systems, using the described methods, and operating the described systems. The described embodiments include method aspects for performing all the functions of the described devices.

To facilitate a more detailed understanding of the features of the present disclosure, a more detailed description of the present disclosure, briefly summarized above, can be made by reference to the embodiments. The accompanying drawings relate to the embodiments and are described below:
FIG. 1 is a schematic plan view of a vacuum deposition system according to embodiments of the present disclosure;
FIG. 2 illustrates a schematic plan view of a modified vacuum deposition system according to embodiments of the present disclosure;
FIG. 3 is a schematic plan view of a modified vacuum deposition system according to embodiments of the present disclosure;
FIG. 4 illustrates a perspective view of a substrate loading chamber of a vacuum deposition system according to embodiments of the present disclosure;
FIG. 5 illustrates a cross-sectional view of a substrate loading chamber of a vacuum deposition system according to embodiments of the present disclosure;
FIG. 6 is a schematic side view of a substrate carrier transported using a carrier transport system according to embodiments of the present disclosure;
FIG. 7 is a flowchart illustrating methods of depositing a stack of layers on a substrate according to embodiments of the present disclosure;
FIG. 8 illustrates a schematic plan view of a vacuum deposition system according to embodiments of the present disclosure.

Reference will now be made in detail to various embodiments, one or more of which are illustrated in the drawings. Throughout the following description of the drawings, like reference numerals designate like elements. Generally, only differences between individual embodiments are described. Each example is provided for illustrative purposes and is not intended to limit the present disclosure. Furthermore, features illustrated or described as part of one embodiment may be used in other embodiments or in combination with other embodiments to yield still further embodiments. The description is intended to encompass such modifications and variations.

Before describing various embodiments of the present disclosure in more detail, aspects related to some terms and expressions used in the present application are described.

In the present disclosure, a "vacuum deposition system" should be understood as a system or arrangement configured to vacuum-deposit materials onto a substrate. In particular, a "vacuum deposition system" may be understood as a system configured to vacuum-deposit organic and/or metallic materials, for example, for the manufacture of OLED displays.

In the present disclosure, a "deposition module" or "deposition chamber" may be understood as a vacuum chamber or vacuum chamber compartment that accommodates at least one deposition source configured for vacuum deposition. As used herein, the term "vacuum" may be understood to mean a technical vacuum having a vacuum pressure of, for example, less than 10 mbar. Typically, the pressure of the vacuum chamber described in the present application may be between 10-5 mbar and about 10-8 mbar, in particular between 10-5 mbar and 10-7 mbar. The deposition chambers are arranged in rows alongside each other, in particular in a linear row configuration, allowing in-line processing of substrates. Accordingly, the deposition chambers may also be referred to as "in-line deposition chambers."

In the present disclosure, a "vacuum deposition source" may be understood as an arrangement configured for depositing a material on a substrate in a vacuum deposition chamber, i.e., under pressure conditions below atmospheric pressure. The vacuum deposition source may be an evaporation source configured for thermal evaporation of a material. The vacuum deposition source may have one or more crucibles configured to evaporate the source material to be deposited and one or more distribution assemblies or distribution pipes configured to direct the evaporated material toward the substrate. For example, the distribution tube or distribution pipe described in the present application may provide a line source with a plurality of openings and/or nozzles arranged in a row along the length of the distribution tube. Thus, the distribution assembly may comprise, for example, a linear distribution showerhead having a plurality of openings (or elongated slits) arranged therein. A showerhead as understood in the present application may have an enclosure, hollow space, or tube through which the evaporated material may be provided or guided, for example, from the evaporation crucible to the substrate.

A "track switch module" or simply a "track switch" may be understood as a vacuum chamber or a vacuum chamber compartment having a movable support for transporting substrate carriers in a parallel translational motion between different transport tracks. A "rotation module" may be understood as a vacuum chamber or a vacuum chamber compartment having a rotatable substrate carrier support for rotating the substrate carriers about an essentially vertical rotational axis. A "substrate (un)loading module" or a "substrate (un)loading chamber" may be understood as a vacuum chamber or a vacuum chamber compartment configured to input (or output) substrates to (or from) a vacuum deposition system. In the substrate (un)loading module, substrates can be loaded onto or unloaded from substrate carriers in a first orientation, and the orientation of the substrate carriers can be changed by means of an orientation actuator between a first orientation suitable for substrate (un)loading and a second orientation suitable for carrier transport through the vacuum system.

The embodiments described in the present application relate particularly to the deposition of materials on large-area substrates, for example, for display manufacturing. According to some embodiments, the large-area substrates and the substrate carriers supporting one or more substrates may have a size of at least 0.5 m ² , particularly at least 1 m ² . For example, the deposition system can be configured to ^process large area substrates such as GEN 4.5 corresponding to about 0.67 m ² substrates (0.73 × 0.92 m), GEN 5 corresponding to about 1.4 m ² substrates (1.1 m × 1.3 m), GEN 6 corresponding to about 2.7 m ² substrates (1.5 m × 1.8 m), GEN 7.5 corresponding to about 4.29 m ² substrates (1.95 m × 2.2 m), GEN 8.5 corresponding to about 5.7 m ^{2 substrates (2.2 m × 2.5 m), or even GEN 10 corresponding to about 8.7 m 2} substrates (2.85 m × 3.05 m). Larger generations and corresponding substrate areas such as GEN 11 and GEN 12 can be similarly implemented. In other implementations, half the sizes of the substrate generations mentioned above may be processed. Alternatively or additionally, semiconductor wafers may be processed and coated in deposition systems according to the present disclosure.

According to some embodiments that may be combined with other embodiments described in the present application, the substrate thickness may be from 0.1 mm to 1.8 mm. The substrate thickness may be about 0.9 mm or less, for example, 0.5 mm. As used herein, the term "substrate" may particularly include substantially inflexible substrates, such as glass plates or other substrates. However, the present disclosure is not limited thereto, and the term "substrate" may also include flexible substrates, such as webs or foils. The term "substantially inflexible" is to be understood as distinct from "flexible." Specifically, a substantially inflexible substrate may have a certain degree of flexibility, for example, a glass plate having a thickness of 0.9 mm or less, for example, 0.5 mm or less, and the flexibility of the substantially inflexible substrate is less than that of the flexible substrates.

FIG. 1 illustrates a vacuum deposition system (100) for inline processing of substrates according to embodiments described in the present application, particularly an OLED manufacturing system, and more particularly an OLED manufacturing system for large-area substrates. Substrates (10) to be coated can be transported on substrate carriers (50) via the vacuum deposition system (100). The substrate carriers (50) can be transported through the inline processing system in an essentially vertically oriented state using a carrier transport system.

As used herein, "essentially vertically" means an orientation of the substrates (or the orientation of the substrate carriers) that corresponds to a vertical orientation or that deviates from a vertical orientation by +/- 20° or less, for example, +/- 10° or less. This deviation may be provided because, for example, a substrate support that deviates slightly from a vertical orientation may result in a more stable substrate position. Additionally, when the substrate is tilted forward, fewer stray particles may reach the substrate surface. However, during deposition of materials such as organic or metallic materials onto a substrate in a high vacuum, for example, the substrate orientation is considered to be substantially vertical, which is different from a horizontal substrate orientation. As used herein, "essentially horizontal" relates to an orientation that corresponds to a horizontal orientation or an orientation that deviates from a horizontal orientation by +/- 20° or less, for example, +/- 10° or less. For example, substrate carriers may be configured to hold individual substrates, such as glass plates, in an essentially vertical orientation not only during transport through the vacuum deposition system but also during deposition of materials onto the substrates. Alternatively, the substrates may be inserted into the vacuum deposition system in a non-vertical orientation, which is typically an essentially horizontal orientation.

In an "inline" processing system, substrates are moved past (stationary) processing devices, such as (stationary) deposition sources, to be coated with a stack of layers. In particular, the stack of layers is deposited on the substrates while the substrates are moved past the deposition sources, in particular at a substantially constant velocity of motion, and the deposition sources may be configured to deposit different materials, such as one or more metals and one or more organic materials, on the substrates to coat the substrates with the stack of layers.

The vacuum deposition system (100) described in the present application comprises a plurality of deposition chambers (150) arranged in a row along a main transport direction (T). Each deposition chamber comprises a vacuum chamber that accommodates at least one vacuum deposition source, for example, two vacuum deposition sources, as schematically illustrated in FIG. 1. The plurality of vacuum deposition sources (155) are configured to deposit a stack of layers comprising at least one organic material on substrates (10) as the substrates (10) are moved past the plurality of vacuum deposition sources (155). At least some of the vacuum deposition sources may be evaporation sources configured for thermal evaporation of one or more materials, particularly at least one organic material for OLED fabrication.

A first transport track (T1) and a second transport track (T2) extend parallel to each other in the main transport direction (T) through a plurality of deposition chambers (150), for example with a distance of 300 mm or less, in particular 150 mm or less, between each other. Optionally, a separating wall may be arranged between the first transport track (T1) and the second transport track (T2) in the plurality of deposition chambers (150) to retain the deposition material in the deposition area through which the first transport track (T1) extends.

A carrier transport system is provided for transporting substrate carriers (50) along a first transport track (T1) past a plurality of vacuum deposition sources (155) and in the opposite directions along a second transport track (T2). In some embodiments, the first transport track may be a forward track and the second transport track may be a return track along which the substrate carriers are returned to a starting position of a closed loop within the vacuum deposition system.

In particular, the carrier transport system can transport substrate carriers (50) along a first transport track (T1) in a first direction to deposit a stack of layers on substrates (10), and can transport the substrate carriers (50) along a second transport track (T2) in a second direction opposite to the first direction, and in particular without depositing layers on the substrates on the second transport track (T2). Specifically, the vacuum deposition sources can be arranged only next to the first transport track (T1) to coat the substrates on the first transport track (T1), and not next to the second transport track (T2). In some embodiments, the second transport track (T2) can be a return track to return the substrate carriers (carried or not carried) back to the starting position along the closed loop.

In some embodiments that may be combined with other embodiments described herein, the carrier transport system comprises a magnetic levitation system, particularly a magnetic levitation system comprising actively controlled levitation magnets, configured to magnetically transport at least a portion of the carrier weight during transport. The use of the magnetic levitation system may reduce or prevent the generation of small particles due to frictional forces. Additionally, one or more drive units, for example one or more linear motors, may be provided to propel the magnetically levitated substrate carriers along first and second transport tracks.

As schematically illustrated in FIG. 1, a first track switch module (121) and a second track switch module (122) are provided to move substrate carriers in parallel in a track switch direction (S) transverse to the main transport direction (T) from a first transport track (T1) to a second transport track (T2), or vice versa. A plurality of deposition chambers (150) are arranged between the first track switch module (121) and the second track switch module (122) along the main transport direction (T), so that the substrate carriers can be continuously transported along a closed path (or a closed loop in which the substrate carriers are repeatedly transported) through the vacuum deposition system (100). The track switch direction (S) may be a direction transverse to the main transport direction (T), and in particular, may be a direction essentially perpendicular to the main transport direction. The track switch modules can translate substrate carriers between transport paths, in particular by linearly moving the substrate carriers in the track switch direction (S), without rotational movement or orientation change of the substrates. Both the main transport direction (T) and the track switch direction (S) can be essentially horizontal directions, i.e., substrate carrier transport is performed horizontally throughout the system.

In particular, the first track switch module (121) may be configured to move the substrate carriers (50) parallel from the second transport track (T2) to the first transport track (T1), and the second track switch module (122) may be configured to move the substrate carriers (50) parallel from the first transport track (T1) back to the second transport track (T2), or vice versa, so that the substrate carriers can be transported along a closed loop, particularly along a closed loop having an elongated rectangular shape when viewed from above.

As schematically illustrated in FIG. 1, substrate carriers (50) can be transported in a first direction along the first transport track (T1) past a plurality of vacuum deposition sources (155) to deposit a stack of layers by switching the tracks from the second transport track (T2) to the first transport track (T1) in a first track switch module (121), and then transported in a second direction along the second transport track (T2) until they reach the first track switch module (121) where the tracks can be switched back from the first transport track (T1) to the second transport track (T2) in a second track switch module (122) and the closed-loop transport sequence can be restarted from the beginning. This can shorten the tact time of the system and provide a simplified transport sequence with reduced complexity. It can provide a mass production system for manufacturing OLED layer stacks on substrates.

In at least some implementations described herein, the vacuum deposition system does not include any device or module for rotating the substrate carriers about an essentially vertical rotational axis (commonly referred to as a "rotation module"). The rotation module can be used to change the transport direction of vertically oriented substrates or substrate carriers and/or to turn vertically oriented substrates toward another aspect of the system where additional vacuum deposition sources may be arranged. However, although rotation modules can facilitate substrate transport in some applications, rotation modules typically entail a large installation space, complexity, and require significant maintenance, and therefore it would be advantageous to provide a vacuum deposition system without a rotation module.

In some embodiments described herein, the substrate orientation, once vertical, can be maintained continuously during transport and deposition in a vacuum deposition system. For example, in the embodiment of FIG. 1, the substrates (10) - once vertically oriented - face the same lateral side of the system where the plurality of vacuum deposition sources (155) are sequentially positioned. Specifically, the track switch modules described herein are suitable for switching tracks without any substrate carrier rotation, so that the substrate orientation is maintained even when switching between transport tracks.

A track switch module may comprise a vacuum chamber, a track switch actuator, and a movable carrier support, in particular a mechanical support arranged within the vacuum chamber. A substrate carrier may be supported on the carrier support. The track switch actuator may move the carrier support together with the substrate carrier supported thereon in a parallel translational movement (i.e. without rotation of the carrier) in a track switch direction (S), in particular from a first position on a first transport track to a second position on a second transport track, or vice versa. In some embodiments, at least a portion of the carrier weight may be magnetically fixed during the track switch movement. In other embodiments, the entire substrate carrier weight is supported on the movable carrier support during the track switch movement.

The vacuum deposition system (100) further comprises a substrate loading chamber (111) having a substrate input opening, through which substrates (10) can be introduced from an ambient environment into the vacuum deposition system (100) in a non-vertical orientation, particularly through a load lock chamber or a load lock compartment. In the substrate loading chamber, substrates (10) can be loaded onto substrate carriers (50). The substrate loading chamber (111) comprises an orientation actuator for changing the substrate orientation from a non-vertical orientation to an essentially vertical orientation. In particular, the substrates (10) can be supplied to the vacuum deposition system through the substrate input opening in a non-vertical orientation, particularly in an essentially horizontal orientation, and loaded onto substrate carriers within the substrate loading chamber (111), and the orientation of the substrates can be changed to essentially vertical by the orientation actuator of the substrate loading chamber (111).

In some embodiments, the vacuum deposition system may be configured to continuously maintain a constant substrate orientation during transport from the substrate loading chamber to the substrate unloading chamber. Specifically, the orientation of the substrate carriers may be changed only by the orientation actuators for substrate loading and unloading, but when essentially vertical for transport through the vacuum deposition system, the orientation of the substrate carriers may not be changed, so that the substrate holding surfaces of the substrate carriers always face the same direction, i.e., the direction in which the plurality of vacuum deposition sources are arranged.

Vacuum deposition systems configured to transport and coat vertically oriented substrates are suitable for inline processing and are generally more compact, i.e., have a reduced installation space, compared to horizontal coating and transport systems.

In some embodiments, the first transport track (T1) and the second transport track (T2) extend linearly (i.e., essentially along their respective straight lines) through the vacuum deposition system from the first track switch module (121) through the plurality of deposition chambers (150) to the second track switch module (122). The first transport track (T1) and the second transport track (T2) may also extend linearly through the substrate loading chamber (111) and/or through the substrate unloading chamber (112), as schematically illustrated in FIG. 1 . Transporting the substrate carriers along straight lines is easier and less error-prone than repeatedly changing the substrate carrier direction. In particular, the closed loop along which the substrate carriers are transported may have the shape of an elongated rectangle when viewed from above, with the short rectangular sides being positioned at the track switch modules and extending in the track switch direction (S), and the long rectangular sides corresponding to the first and second transport tracks extending along the main transport direction (T).

In some embodiments, four, five, or more in-line deposition chambers are arranged in a row, side by side, each deposition chamber housing at least one vacuum deposition source. Two adjacent deposition chambers in a row may be arranged adjacent to each other, i.e., no additional vacuum chambers or modules may be arranged between two adjacent deposition chambers. A stack of four, five, eight, ten, or more layers may be deposited on a substrate while being transported along a first transport track (T1) past a plurality of vacuum deposition sources (155). For example, the stack of layers may include one or more electrode layers, an electron transport layer (ETL), and at least one optically active organic layer. In some embodiments, the substrate carriers are transported past the plurality of vacuum deposition sources (155) at an essentially constant rate. Idle or downtime may be reduced, and deposition efficiency and material utilization may be improved, which may be beneficial for high-volume manufacturing.

In some embodiments, the carrier transport system is configured to transport subsequent substrate carriers "edge to edge" past a plurality of vacuum deposition sources (155) on a first transport track (T1). In particular, the distance between two subsequent substrate carriers during transport past the deposition sources may be less than 10 cm, or the subsequent substrate carriers may contact other carriers on the first transport track (with the trailing edges of the carriers contacting the leading edge of each subsequent carrier), as schematically illustrated in FIG. 1 Transporting subsequent substrate carriers "edge to edge" past the plurality of vacuum deposition sources is advantageous because it eliminates the need to temporarily stop or redirect the deposition sources to prevent material from depositing on the chamber walls. Rather, subsequent substrates can be coated essentially unimpeded by the plurality of deposition sources. This can further improve material utilization and cycle time of the system.

Fig. 4 is a perspective view of a substrate loading chamber (111) of a vacuum deposition system according to any one of the embodiments described in the present application. Fig. 5 is a cross-sectional view of the substrate loading chamber (111).

The substrate loading chamber (111) includes a vacuum chamber (401) having a substrate input opening (402) for receiving substrates (10) in an input direction parallel to the track switch direction (S). In particular, the substrate input opening (402) may be configured to receive the substrates (10) in a horizontally elongated orientation. In other words, rectangular substrates are inserted into the vacuum chamber (401) such that their long sides enter the vacuum chamber first (as opposed to a "longitudinal orientation" in which rectangular substrates enter the vacuum chamber with their short sides first). The substrate input opening (402) may be an essentially horizontal slit opening configured to insert substrates into the vacuum chamber in a horizontally elongated orientation. Horizontal loading in a horizontally elongated orientation is counterintuitive and is generally avoided. However, system footprint and cycle time advantages warrant a departure from horizontally elongated handling.

Horizontally oriented substrates (10) can be inserted into the substrate loading chamber (111) in a horizontally long orientation in the track switch direction (S) and loaded onto substrate carriers (50) as schematically illustrated in FIG. 5. An orientation actuator is provided in the vacuum chamber (401) for changing the orientation of the substrate carrier together with the substrate supported thereon. The orientation actuator (illustrated by an arrow (651) in FIG. 5) can include a support for supporting the substrate carrier (50). The carrier includes a first end (653) and a second end (655) opposite to the first end (653). The support can be configured to support the substrate carrier (50) between the first end (653) and the second end (655). The orientation actuator can be configured to change the substrate orientation by moving the substrate carrier about a pivot axis at an angle, wherein the pivot axis can extend parallel to the main transport direction (T). As schematically illustrated in FIG. 5, the orientation actuator can tilt the substrate carrier upward to an essentially vertical orientation. After the orientation change, the substrate carrier can be positioned in an essentially vertical orientation on the second transport track (T2).

After the orientation change, the substrate carrier can be positioned on the second transport track (T2), and the substrate carried by the substrate carrier (50) can be directed toward the first transport track (T1) away from the orientation actuator (651). Since the deposition sources can be arranged next to (only) the first transport track (T1) (which may also be referred to as a “deposition track”), a track switch of the substrate carrier onto the second transport track (T2) is performed to coat the substrate.

The substrate carriers can be transported from the substrate loading chamber (111) along the second transport track (T2) when they are essentially vertically oriented on the second transport track (T2). As can be seen from FIG. 4, insertion of substrates from the atmosphere into the substrate loading chamber (111) along the track switch direction (S) does not interfere with substrate carrier transport through the substrate loading chamber (111) along the main transport direction (T), so that carrier transport into and out of the substrate loading chamber (111) along the second transport track (T2) is possible.

In some embodiments, the substrate input opening (402) is a non-vertical slit opening through which substrates (10) can be input into the substrate loading chamber (111), for example, using a substrate loading robot. In some embodiments, first and second transport tracks (T1, T2) can extend through the substrate loading chamber (111). For example, the substrate loading chamber can have a first pair of openings (403), particularly essentially vertical slit openings, along the first transport track (T1) in opposite side walls (405) of the vacuum loading chamber, and a second pair of openings (404), particularly essentially vertical slit openings, along the second transport track (T2) in opposite side walls (405) of the vacuum loading chamber. A substrate input opening (402) for substrate insertion may be provided between the opposing side walls (405) of the other side wall (406) of the vacuum loading chamber, through which the first and second transport tracks extend.

Referring to FIG. 1, a substrate loading chamber (111) can be arranged on a first side of the plurality of deposition chambers (150) between a first track switch module (121) and a plurality of deposition chambers (150), and a second track switch module (122) can be arranged on a second side of the plurality of deposition chambers (150) opposite the first side. This positioning of the substrate loading chamber (111) is advantageous because substrate carriers (50) can be transported from the deposition chambers to the first track switch module (121) through the substrate loading chamber (111). The substrate carriers (50) can enter the substrate loading chamber (111) from one side to load substrates, and the substrate carriers loaded with substrates can exit the substrate loading chamber (111) from the opposite side to switch from the second transport track (T2) to the first transport track (T1). The tact time of the system can be improved, and the substrate carriers can be transported quickly and conveniently along a closed loop. Alternatively, it is also possible to arrange the first track switch module (121) between the substrate loading chamber (111) and the plurality of deposition chambers (150), i.e., the positions of the first track switch module and the substrate loading chamber in FIG. 1 can be switched. However, the arrangement in FIG. 1 is advantageous in terms of reducing the tact time.

In some embodiments that may be combined with other embodiments described herein, the vacuum deposition system (100) further includes a substrate unloading chamber (112) for unloading substrates (10) from the substrate carriers (50) and outputting the substrates (10) from the vacuum deposition system in a non-vertical orientation, particularly in an essentially horizontal orientation. The substrate unloading chamber (112) may include an orientation actuator for changing the substrate orientation from an essentially vertical orientation to a non-vertical orientation.

In some embodiments, the substrate unloading chamber (112) has a generally similar configuration to the substrate loading chamber (111) detailed in FIGS. 4 and 5 , and thus reference may be made thereto. In particular, the substrate unloading chamber (112) may include a vacuum chamber (401) having a substrate output opening for outputting substrates (10) from the vacuum deposition system in an output direction parallel to the track switch direction (S), and in particular, the substrate output opening is configured to output the substrates in a horizontally elongated orientation. As schematically illustrated in FIG. 1 , the substrate input direction and the substrate output direction may be opposite directions.

In some embodiments, the substrate output opening may be a non-vertical slit opening for outputting substrates from the vacuum deposition system, particularly an essentially horizontal slit opening configured to output substrates (10) from the vacuum deposition system (100) in a longitudinal orientation, i.e., so that the longer side of the rectangular substrates exits the vacuum chamber first.

In some embodiments, the first transport track (T1) and the second transport track (T2) may extend linearly through both the substrate loading chamber (111) and the substrate unloading chamber (112). In particular, the substrate unloading chamber (112) may have a first pair of openings, particularly essentially vertical slit openings, in opposite side walls of the vacuum unloading chamber along the first transport track (T1), and a second pair of openings, particularly essentially vertical slit openings, in opposite side walls of the vacuum unloading chamber along the second transport track (T2). In some embodiments, the substrate output opening may be provided in another side wall of the vacuum unloading chamber between the opposite side walls.

In some embodiments that may be combined with other embodiments described herein, a first transport track (T1) is provided between a second transport track (T2) and a plurality of vacuum deposition sources (155), and/or a second transport track (T2) is provided between the first transport track (T1) and openings for substrate input and output. After loading and orientation changes, the substrate carriers can be positioned on the second transport track (T2). Switching to the first transport track (T1) for substrate coating (i.e., the “deposition track”) and back to the second transport track (T2) for unloading the coated substrates can be performed in the first and second track switch modules.

In some embodiments that may be combined with other embodiments described herein, the substrate loading chamber (111) and the first track switch module (121) are arranged on a first side of the plurality of deposition chambers (150), and the substrate unloading chamber (112) and the second track switch module (122) are arranged on a second side of the plurality of deposition chambers (150) opposite the first side. For example, as illustrated in FIG. 1 , the substrate unloading chamber (112) may be arranged on the second side between the second track switch module (122) and the plurality of deposition chambers (150), and/or the substrate loading chamber (111) may be arranged on the first side between the first track switch module (121) and the plurality of deposition chambers (150). Such an arrangement enables improved tact time of the system. Alternatively, the second track switch module (122) may be arranged between the substrate unloading chamber (112) and the plurality of deposition chambers (150). In the chamber arrangement of FIG. 1, empty carriers, i.e., carriers not loaded with substrates, are returned from the substrate unloading chamber to the substrate loading chamber via the plurality of deposition chambers (150) along the second transport track (T2). Thus, in the embodiment of FIG. 1, the second transport track (T2) is used as a return track for returning the (empty) substrate carriers to the substrate loading chamber.

In some embodiments that may be combined with other embodiments described herein, the carrier transport system is configured to move substrate carriers (50) along a first transport track (T1) past a plurality of vacuum deposition sources (155) to enable the deposition of a plurality of successive layers on substrates (10). As used herein, a "continuously deposited layer" or "continuous layer" is deposited without the use of a fine metal mask or shadow mask, i.e., continuously deposited over a large area of the substrate surface, rather than only in a pattern defined by a mask aperture structure or only locally. The topography of the continuously deposited layer depends on the underlying topographic structure of the substrate, and therefore, the "continuously deposited layer" is not necessarily uniform or flat. For example, pixels may be formed from the continuously deposited layer by first applying a patterning layer on the substrate, then depositing the patterning layer over the patterning layer, and subsequently etching the deposited layer and/or the patterning layer to provide the pixels.

A vacuum deposition system can be configured to deposit a stack of successive layers on a substrate without using a shadow mask or a micro-metal mask. Shadow or micro-metal masks with a plurality of small holes can be used to deposit a plurality of pixels or other patterns on the substrate, and are also referred to herein as "pixel generating masks." To ensure that the pixels are deposited at the correct locations on the substrate, the shadow masks and micro-metal masks must be aligned with the substrate prior to deposition. Depositing successive layers without using shadow masks or micro-metal masks, as provided herein, reduces system complexity because alignment between the substrate and the mask for depositing pixels or depositing a predetermined material pattern on the substrate may be eliminated. Furthermore, mask handling, mask transport, and mask attachment may be eliminated. In particular, the vacuum deposition systems described herein may be free of mask handling chambers, mask alignment devices, mask carriers, and/or mask or mask carrier transport tracks, thereby reducing installation space and improving tact rates.

In particular, the vacuum deposition system may not include any mask handling device or mask handling module, and in particular may not include a mask handling module for handling shadow masks or fine metal masks. Rather, the vacuum deposition system may be configured to provide a stack of layers, particularly a stack of sequentially deposited layers, on a substrate without using a fine metal mask or shadow mask.

In some embodiments, the carrier transport system may include a magnetic levitation system configured to magnetically transport at least a portion of the weight of the substrate carrier during transport, particularly a magnetic levitation system comprising actively controlled levitation magnets. The actively controlled levitation magnets enable a controlled levitation force whose strength varies depending on a measured gap distance between the substrate carrier and a fixed floor of the magnetic levitation system.

In some implementations, the plurality of vacuum deposition sources (155) comprises at least one evaporation source, particularly a vertically extending line source, having an essentially vertically extending distribution pipe with a plurality of nozzles. In particular, five, ten or more of the plurality of evaporation sources may be arranged adjacent to the first transport track (T1) to coat the substrates in a stack of layers.

In some embodiments, a plurality of vacuum deposition sources (155) are arranged in a row side by side with a distance of no more than 200 cm, in particular no more than 150 cm (distance "D1" in FIG. 1) between two adjacent vacuum deposition sources, only on one side of the first transport track (T1). A compact vacuum deposition system having densely arranged vacuum deposition sources can be provided.

FIG. 2 illustrates a schematic plan view of a modified vacuum deposition system (200) according to embodiments of the present disclosure. The vacuum deposition system (200) is similar to the vacuum deposition system (100) of FIG. 1 , and thus the descriptions therein may be referred to, and will not be repeated here. Only the differences will be described below.

The vacuum deposition system (200) includes a first track switch module (121) and a second track switch module (122) on both sides (first and second sides) of a plurality of deposition chambers (150). In addition, the vacuum deposition system (200) includes a substrate loading chamber (111) and a substrate unloading chamber (112), both of which are arranged on the first side, i.e., the same side, of the plurality of deposition chambers (150).

The substrate loading chamber (111) and the substrate unloading chamber (112) may be arranged directly adjacent to each other, or alternatively, at least one vacuum chamber, such as a vacuum spacer chamber, may be arranged between the substrate loading chamber (111) and the substrate unloading chamber (112). Alternatively, the substrate loading chamber (111) and the substrate unloading chamber (112) may be integrated into one single module having one single vacuum chamber.

In the embodiment illustrated in FIGS. 2 and 8, the substrate loading chamber (111), the substrate unloading chamber (112), and one of the first and second track switch modules are arranged on a first side of the plurality of deposition chambers (150), and the other of the first and second track switch modules is arranged on a second side opposite the first side.

In particular, both the substrate loading chamber (111) and the substrate unloading chamber (112) can be arranged between the first track switch module (121) (or alternatively the second track switch module (122)) and the plurality of deposition chambers (150), on the same side of the plurality of deposition chambers. As illustrated in FIG. 2 , the tact time of the system can be further improved by arranging the substrate unloading chamber (112) between the substrate loading chamber (111) and the first track switch module (121). In this arrangement, after unloading a coated substrate from a substrate carrier in the substrate unloading chamber (112), a new substrate can be loaded onto the substrate carrier in the substrate loading chamber (111) arranged downstream of the substrate unloading chamber (112), and then the substrate carrier can be transported to the first track switch module (121) for switching transport tracks. Thereafter, the substrate carriers can be transported along the first transport track (T1) to coat the substrates within the deposition chambers. Thus, the substrate carriers can be transported clockwise (or alternatively, continuously counterclockwise) along a closed loop (continuously).

In some embodiments, an additional vacuum chamber, such as a substrate carrier storage chamber or substrate carrier shelf (125), may be provided, for example, on the first side of the plurality of deposition chambers (150). The first transport track (T1) and/or the second transport track (T2) may extend to the additional vacuum chamber via the first track switch module (121), as schematically illustrated in FIG. 2 .

In the vacuum deposition systems illustrated in FIGS. 1, 2, and 8, substrate carriers can be transported "edge to edge" past a plurality of vacuum deposition sources, with subsequently transported substrate carriers contacting each other without gaps therebetween. To reduce contamination of the substrate carrier bodies with deposition materials, the substrate carriers (50) used in the vacuum deposition systems described herein can include a deposition protection shield that covers and shields portions of the carrier bodies.

FIG. 6 is a schematic side view of a substrate carrier (50) having a deposition protection shield (55) according to embodiments described herein, secured beneath a carrier transport system (250) having a magnetic levitation system (251). Such a substrate carrier (50) described herein constitutes a separate aspect of the present disclosure.

A substrate carrier (50) is configured to transport a substrate in an essentially vertical orientation through a vacuum deposition system. The substrate carrier (50) comprises a carrier body (52) having a substrate support surface (51) and a chucking device (57), in particular an electrostatic chuck or a magnetic chuck, for securing the substrate to the substrate support surface (51). The carrier further comprises a removable deposition protection shield (55) that at least partially surrounds the substrate support surface (51) and covers portions of the carrier body to prevent material from being deposited thereon. In particular, the deposition protection shield (55) can cover portions of the carrier body that are in front of and behind the substrate support surface (51) in the main transport direction (T) and/or portions of the carrier body that are above and below the substrate support surface. Optionally, the deposition protection shield (55) can completely surround the substrate support surface (51), for example, in a frame-like manner (as schematically illustrated in FIG. 6 ). Since the carrier body is partially covered and shielded by the deposition protection shield (55), deposition of material on the carrier body during coating of the substrate is reduced or prevented.

The deposition protection shield (55) can be separated from the substrate carrier, for example at regular intervals, for cleaning purposes, for example, outside the vacuum deposition system.

As schematically illustrated in FIG. 6, the substrate carrier (50) may optionally further comprise a magnetic counterpart (53), for example comprising a metal rail attracted by a magnet and/or comprising one or more permanent magnets configured to magnetically interact with actively controlled levitation magnets (252) of the magnetic levitation system (251). The magnetic counterpart (53) may be arranged on top of the substrate carrier (50), such that the substrate carrier may be magnetically secured from above (partially or fully) by the magnetic levitation system (251). The carrier transport system (250) may further comprise one or more drive units (253), such as one or more linear motors, configured to propel the substrate carrier (50) along the first and second transport tracks via the vacuum deposition system.

The deposition protection shield (55) provided on the substrate carrier (50) is removably mounted to the substrate carrier and thus moves with the substrate carrier through the vacuum deposition system, thereby accumulating different deposition materials from different vacuum deposition sources. This accumulation of mixed materials on the surface of the substrate carrier may be detrimental in some applications, depending on the materials being deposited. For example, in some applications, there may be a risk that some of the overlapping deposited materials may peel off, which may negatively affect the deposition process. Figure 3 illustrates a vacuum deposition system that prevents the accumulation of mixed materials on the surfaces of the substrate carriers, but at an increased tact time.

FIG. 3 schematically illustrates a plan view of a modified vacuum deposition system (300) according to embodiments of the present disclosure. The vacuum deposition system (300) is similar to the vacuum deposition system (100) of FIG. 1 , and thus the descriptions therein may be referred to, and will not be repeated here. Only the differences will be described below.

In the vacuum deposition system (300) of FIG. 3, the substrate carriers may be transported past a plurality of vacuum deposition sources (155) at a longer distance to prevent mixed deposition materials from accumulating on the surfaces of the substrate carriers.

The vacuum deposition system (300) includes a shield transport track (T3) extending between a first transport track (T1) and a plurality of vacuum deposition sources (155) in one or more of the deposition chambers. The shield transport track (T3) may extend parallel to and offset from the first transport track (T1), particularly close to the first transport track (T1).

At least one protective shield (201) can be movably arranged on a shield transport track (T3), and a shield actuator (202) is configured to move the at least one protective shield (201) back and forth between a first shield position and a second shield position on the shield transport track (T3) by means of a parallel movement, to prevent material from being deposited on portions of the substrate carriers while the substrate carriers are moving past the vacuum deposition sources.

For example, a protective shield may be assigned to one of the vacuum deposition sources and configured to move temporally and synchronously in front of the substrate carrier, such that the substrate is coated by the associated vacuum deposition source, such that portions of the substrate carrier shielded by at least one protective shield (201) are protected from the deposition material. In some embodiments, each vacuum deposition source may have an associated protective shield configured to move back and forth on a shield transport track (T3) in front of each vacuum deposition source in synchronization with the respective substrate carrier movements. As the substrate carrier moves with the associated protective shield past one of the vacuum deposition sources, the associated protective shield may move back to the first shield position to shield the subsequent substrate carrier, which will be coated while being transported past the vacuum deposition source. The deposition of coating material on the substrate carriers may be reduced or prevented by the movable protective shields, and since each movable protective shield only accumulates deposition material from one associated vacuum deposition source, the accumulation of mixed materials on surfaces proximate the substrates may be reduced or prevented. The quality of layer stacks can be improved.

To prevent mixed deposition of different materials on one of the protective shields, the distance between adjacent vacuum deposition sources in the embodiment of FIG. 3 is typically greater. In particular, the distance between adjacent vacuum deposition sources may be greater than the width of the substrate carrier, depending on the size of the substrates to be coated, and may, for example, exceed 2.5 m.

The plurality of vacuum deposition sources (155) may include at least one evaporation source. The evaporation source includes an evaporation crucible and an essentially vertically extending distribution pipe having a plurality of nozzles in fluid communication with the evaporation crucible. In some embodiments that may be combined with other embodiments described herein, the evaporation source is rotatable between a coating position in which the plurality of nozzles are directed toward the first transport track (T1) for coating a substrate and an idle position in which the plurality of nozzles are directed away from the first transport track (T1) toward an idle shield.

FIG. 3 illustrates an evaporation source in a coating position (156) for substrate coating and an evaporation source in an idle position (158) with a plurality of nozzles directed toward an idle shield (157). For example, the evaporation source can be rotated between the coating position (156) and the idle position (158) by an angle of 40° to 120°, and in particular by an angle of about 90°. Specifically, the evaporation source can be rotated to or maintained in the idle position (158) when a substrate to be coated is not currently arranged on the first transport track (T1) in front of the evaporation source. Additionally, the evaporation source can be provided in the idle position during startup and/or shutdown of the evaporation source, for example, during heating of the source material in the evaporation crucible.

Alternatively or additionally, a shutter (159) may be provided that is movable to a position between the plurality of nozzles of the evaporation source and the first transport track (T1) to block vapor from the plurality of nozzles. Specifically, the shutter (159) may be moved to or maintained in a blocking position to block vapor from the evaporation source when no substrates to be coated are currently arranged on the first transport track (T1) in front of the evaporation source and/or during startup or shutdown of the evaporation source. The shutter (159) may be moved away from the blocking position to coat substrates arranged in front of the evaporation source on the first transport track.

According to an aspect described in the present application, an evaporation source is provided. The evaporation source includes an evaporation crucible, a distribution pipe extending essentially vertically with a plurality of nozzles, and a shutter movable between a first position forward of the plurality of nozzles for blocking vapor from the plurality of nozzles during idle periods of the evaporation source and a second position in which vapor from the plurality of nozzles can propagate unimpeded from the nozzles to a deposition area for coating a substrate. The evaporation source may include additional features described herein and may be used in any of the vacuum deposition systems described herein. For example, the evaporation source may also be rotatable between a deposition position and an idle position, wherein the plurality of nozzles may be directed toward an idle shield as described herein. Alternatively or additionally, the evaporation source may have an associated movable protective shield (201) as described herein that is movable forward of the source on a shield transport track for shielding portions of a substrate carrier from deposition material. In some embodiments, the evaporation source may be an organic source for depositing an organic material onto a substrate or a metal source for depositing a metal onto a substrate.

The vacuum deposition systems described herein can be used to deposit a stack of layers comprising at least one organic material on a substrate carried in an essentially vertical orientation by a substrate carrier.

Figure 7 is a flow chart illustrating the deposition methods described in the present application.

In box (610), the substrate is input into the vacuum deposition system in a non-vertical orientation, particularly in an essentially horizontal orientation, and the substrate is loaded onto a substrate carrier, particularly in a vacuum loading chamber of the substrate deposition system. The substrate can be input into the vacuum loading chamber in an input direction parallel to the track switch direction, particularly in a horizontally long orientation for rectangular substrates.

In box (620), the substrate orientation is changed from a non-vertical orientation to an essentially vertical orientation, particularly using an orientation actuator arranged in a vacuum chamber of the substrate loading chamber. A substrate carrier carrying a substrate in an essentially vertical orientation can be arranged on a second transport track after the orientation is changed. The substrate carrier can then be transported along the second transport track (particularly in a direction away from the plurality of deposition chambers) to a first track switch module.

In the box (630), the substrate carrier carrying the substrate is moved parallel from the second transport track to the first transport track in the track switch direction (S) of the first track switch module.

In box (640), a substrate carrier carrying a substrate is transported through a plurality of deposition chambers along a first transport track past a plurality of vacuum deposition sources to deposit a stack of layers comprising at least one organic material on the substrate.

In box (650), a substrate carrier carrying a substrate is moved parallel from a first transport track to a second transport track in a second track switch module. The method may proceed to box (660) or box (660'). Thereafter, in particular, the substrate carrier may be transported along the second transport track to a substrate unloading chamber to unload the coated substrate from the substrate carrier.

In box (660), the substrate orientation is changed from essentially vertical to non-vertical in the substrate unloading chamber.

In box (670), the substrate is unloaded from the substrate carrier in the substrate unloading chamber and output from the vacuum deposition system in a non-vertical orientation. The substrate can be output from the substrate unloading chamber in an output direction parallel to the track switch direction, particularly in a horizontally elongated orientation.

In box (680), the (empty) substrate carrier is transported back through the plurality of deposition chambers along the second transport track to the substrate loading chamber, where the next substrate to be coated is loaded onto the substrate carrier (i.e., the method can be restarted in box (610) and the closed loop transport sequence can be continued).

The method exemplified by boxes (610 to 680) can be performed, for example, in a vacuum deposition system as illustrated in FIG. 1.

Alternatively, after the substrate carrier carrying the substrate in the box (650) is translated back to the second transport track, the method may proceed as follows:

In box (660'), the substrate carrier carrying the coated substrate is transported back through the plurality of deposition chambers along the second transport track to the substrate unloading chamber (which may be arranged directly adjacent to the plurality of deposition chambers, see FIG. 2).

In box (670'), the substrate orientation is essentially changed from vertical to non-vertical in the substrate unloading chamber.

In box (680'), the substrate is unloaded from the substrate carrier in the substrate unloading chamber and output from the vacuum deposition system in a non-vertical orientation. The substrate can be output from the substrate unloading chamber in an output direction parallel to the track switch direction, particularly in a horizontally elongated orientation.

The (empty) substrate carrier can be transported from the substrate unloading chamber to the substrate loading chamber along the second transport path (T2), and the subsequent substrate to be coated can be loaded onto the substrate carrier (i.e., the method can be restarted at box (610) and the closed loop transport sequence can be continued from the beginning).

The method illustrated in boxes (610 to 650, 660' to 680') can be performed, for example, in a vacuum deposition system as illustrated in FIG. 2.

Alternatively, as schematically illustrated in FIG. 8 which illustrates a vacuum deposition system (800) according to embodiments described in the present application, the method comprises, in particular, in the sequence specified: (a) inputting a substrate into a vacuum deposition system, in particular a vacuum loading chamber (111), in a non-vertical orientation, and loading the substrate onto a substrate carrier; (b) changing the substrate orientation from the non-vertical orientation to an essentially vertical orientation; (h) transporting a substrate carrier carrying the substrate along a second transport track through a plurality of deposition chambers; (c) translating a substrate carrier carrying the substrate from the second transport track to the first transport track, in particular in the track switch direction in a first track switch module (121); (d) transporting a substrate carrier carrying the substrate along the first transport track (T1) through a plurality of deposition chambers (150) past a plurality of vacuum deposition sources (155) for depositing a stack of layers comprising at least one organic material on the substrate; (e) translating a substrate carrier carrying a substrate from a first transport track back to a second transport track, particularly in a second track switch module (122); (f) changing the substrate orientation from an essentially vertical orientation to a non-vertical orientation; and (g) unloading the substrate from the substrate carrier and outputting the substrate in a non-vertical orientation from a vacuum deposition system, particularly a vacuum unloading module (112) of the vacuum deposition system. Thereafter, the empty substrate carrier can be transported along the second transport track (T2) from the vacuum unloading chamber (112) to the vacuum loading chamber (111) for loading a subsequent substrate onto the substrate carrier, and the sequence can be started again from the beginning in operation (a).

According to some of the methods described in the present application, the substrate carrier is transported along a closed path through a vacuum deposition system, particularly, the closed path has a shape resembling an elongated rectangle when viewed from above. Transport along the closed path can be performed continuously, for example, in a clockwise direction, or alternatively, in a counterclockwise direction.

In some implementations, the substrate is input into the vacuum deposition system at a substrate input location between one of the first and second track switch modules and the plurality of deposition chambers, and/or the substrate is output from the vacuum deposition system at a substrate output location between one of the first and second track switch modules and the plurality of deposition chambers. In particular, the substrate loading chamber and the substrate unloading chamber may be arranged between one of the first and second track switch modules and the plurality of deposition chambers, respectively.

For example, as schematically illustrated in FIG. 1, a substrate is input into the vacuum deposition system at a substrate input location on a first side of the plurality of deposition chambers between a first track switch module (121) and a plurality of deposition chambers (150), and/or the substrate is output from the vacuum deposition system at a substrate output location on a second side of the plurality of deposition chambers between a second track switch module (122) and a plurality of deposition chambers.

For example, as schematically illustrated in FIGS. 2 and 8, a substrate is input into a vacuum deposition system at a substrate input location and is output from a vacuum deposition location at a substrate output location, both of which are located between one of the first and second track switch modules and a plurality of deposition chambers, in particular close to each other. The substrate input location can be arranged downstream of the substrate output location in the transport direction along the second transport path (T2). In particular, the substrate loading chamber (111) and the substrate unloading chamber (112) can both be arranged close to each other between one of the first and second track switch modules and a plurality of deposition chambers, in particular with an optional spacer chamber therebetween. The substrate loading chamber (111) can be arranged downstream of the substrate unloading chamber (112) in the transport direction along the second transport path (T2).

For example, as schematically illustrated in FIG. 8, a substrate is input into the vacuum deposition system at a substrate input location on a second side of the plurality of deposition chambers between the second track switch module (122) and the plurality of deposition chambers (150), and the substrate is output from the vacuum deposition system at a substrate output location on a second side of the plurality of deposition chambers, similarly between the second track switch module (122) and the plurality of deposition chambers (150). The substrate input location may be located between the substrate output location and the plurality of deposition chambers, and thus the substrate input location is arranged downstream of the substrate output location along the second transport path. The substrate input location may correspond to a location of the substrate loading chamber (111), and the substrate output location may correspond to a location of the substrate unloading chamber (112).

The substrate may be input to and output from the vacuum deposition system at the same side of a plurality of deposition chambers. In particular, the substrate unloading chamber and the substrate loading chamber may be arranged at the same side of the plurality of deposition chambers, particularly between one of the track switch modules and the plurality of deposition chambers.

The stack of layers deposited in the vacuum deposition system may be a stack of continuous layers deposited sequentially on the substrate, particularly without the use of a shadow mask or a fine metal mask. In particular, maskless deposition may be performed on the substrate. The stack of layers may comprise at least one organic material, particularly for OLED fabrication.

In some embodiments, the deposition methods described herein transport vertically oriented substrate carriers without any rotation about a vertical rotational axis. In other words, the orientation of the substrate carriers—if vertical—can remain constant during transport and substrate processing.

In some embodiments, subsequent substrate carriers are transported "edge-to-edge" past multiple vacuum deposition sources to deposit stacks of layers. As described herein, substrate carriers comprising removable deposition protection shields are advantageously used for "edge-to-edge" carrier transport. This can provide a compact vacuum deposition system that enables improved material utilization.

Alternatively or additionally, movable protective shields on separate shield transport tracks may be used to prevent the accumulation of mixed materials on carrier surfaces close to the substrate. Here, the substrate carriers are typically transported past multiple vacuum deposition sources at a greater inter-distance to prevent or at least reduce mixing of materials at the protective shields.

Devices, such as OLED devices, can be fabricated according to the methods described herein. In particular, a method of fabricating a device in any one of the vacuum deposition systems described herein comprises: inputting a substrate into the vacuum deposition system in a non-vertical orientation; changing the substrate orientation to an essentially vertical orientation; depositing a stack of layers comprising at least one organic material on the substrate while the substrate is in the essentially vertical orientation; changing the substrate orientation to a non-vertical orientation; and outputting the substrate from the vacuum deposition system in the non-vertical orientation.

A substrate input into a vacuum deposition system for coating may include one or more structures having an upper surface of the substrate or an upper surface of an element disposed on the substrate, at least two side walls on each side, and at least two protruding structures having a width-to-height ratio of at least 1:2. A stack of layers may be deposited on the upper surface and the at least two side walls.

While the foregoing relates to some embodiments, other and additional embodiments may be devised without departing from the scope thereof, and the scope thereof is determined by the claims that follow.

Claims (22)

A vacuum deposition system (100) for processing essentially vertically oriented substrates carried by substrate carriers (50),
A plurality of deposition chambers (150) arranged in a row along a main transport direction (T) and accommodating a plurality of vacuum deposition sources (155) for depositing a stack of layers comprising at least one organic material on the substrates, wherein a first transport track (T1) and a second transport track (T2) extend parallel to each other in the main transport direction through the plurality of deposition chambers (150);
A carrier transport system for transporting the substrate carriers along the first transport track (T1) past the plurality of vacuum deposition sources (155) and in opposite directions along the second transport track (T2);
A first track switch module (121) and a second track switch module (122) for moving the substrate carriers in parallel in a track switch direction (S) crossing the main transport direction (T) from the first transport track (T1) to the second transport track (T2), or vice versa, wherein the plurality of deposition chambers (150) are arranged between the first track switch module (121) and the second track switch module (122); and
A vacuum deposition system comprising a substrate loading chamber (111) having a substrate input opening (402) for receiving substrates (10) in a non-vertical orientation in the vacuum deposition system (100), wherein the substrate loading chamber (111) includes an orientation actuator (651) for changing the substrate orientation from the non-vertical orientation to an essentially vertical orientation. A vacuum deposition system, wherein in the first paragraph, the substrate input opening (402) is configured to receive the substrates in an input direction parallel to the track switch direction (S), and in particular, the substrate input opening is configured to receive the substrates in a horizontally long orientation. In the first or second paragraph, the substrate loading chamber (111) is arranged on the first side of the plurality of deposition chambers (150) between the first track switch module (121) and the plurality of deposition chambers (150),
A vacuum deposition system, wherein the second track switch module (122) is arranged on the second side of the plurality of deposition chambers (150) opposite the first side. A vacuum deposition system according to any one of claims 1 to 3, further comprising a substrate unloading chamber (112) having a substrate output opening for outputting the substrates from the vacuum deposition system (100) in the non-vertical orientation, wherein the substrate unloading chamber includes an orientation actuator for changing the substrate orientation from the essentially vertical orientation to the non-vertical orientation. A vacuum deposition system in claim 4, wherein the substrate output opening is configured to output the substrates in a horizontally elongated orientation. In claim 4 or 5, the substrate loading chamber (111) and the first track switch module (121) are arranged on the first side of the plurality of deposition chambers (150),
A vacuum deposition system, wherein the substrate unloading chamber (112) is arranged on the second side of the plurality of deposition chambers opposite the first side between the second track switch module (122) and the plurality of deposition chambers (150). In the fourth or fifth paragraph, both the substrate loading chamber (111) and the substrate unloading chamber (112) are arranged on the first side of the plurality of deposition chambers between one of the first and second track switch modules and the plurality of deposition chambers (150).
A vacuum deposition system, wherein another one of the first and second track switch modules is arranged on a second side of the plurality of deposition chambers (150) opposite the first side. A vacuum deposition system according to any one of claims 1 to 7, wherein the vacuum deposition system is configured to maintain a constant substrate orientation during transport from the substrate loading chamber to the substrate unloading chamber, and in particular, the vacuum deposition system (100) does not include a rotation module for rotating the substrate carriers about a vertical rotation axis. A vacuum deposition system according to any one of claims 1 to 8, wherein the carrier transport system (100) is configured to move the substrate carriers (50) along the first transport track (T1) past the plurality of vacuum deposition sources (150) to enable deposition of a plurality of successive layers on the substrates without using a shadow mask or a fine metal mask. A vacuum deposition system according to any one of claims 1 to 9, wherein the plurality of vacuum deposition sources (150) comprises at least one evaporation source having an essentially vertically extending distribution pipe having a plurality of nozzles, the evaporation source being rotatable between a coating position (156) in which the plurality of nozzles are directed toward the first transport track (T1) for coating a substrate and an idle position (158) in which the plurality of nozzles are directed away from the first transport track (T1) toward an idle shield (157). In any one of claims 1 to 9, the plurality of vacuum deposition sources include at least one evaporation source, wherein the at least one evaporation source:
an essentially vertically extending distribution pipe having multiple nozzles; and
A vacuum deposition system comprising a shutter (159) movable to a position between the plurality of nozzles and the first transport track (T1) to block steam coming from the plurality of nozzles. A vacuum deposition system according to any one of claims 1 to 11, wherein the carrier transport system comprises a magnetic levitation system (250) configured to magnetically transport at least a portion of the substrate carrier weight during transport, in particular a magnetic levitation system comprising actively controlled levitation magnets (252). In any one of claims 1 to 12,
A shield transport track (T3) between the first transport track (T1) and the plurality of vacuum deposition sources (155) in one or more deposition chambers (150);
At least one protective shield (201) movably arranged on the shield transport track (T3); and
A vacuum deposition system further comprising a shield actuator (202) configured to move the at least one protective shield (201) back and forth between a first shield position and a second shield position on the shield transport track (T3) by means of parallel movement to prevent material from being deposited on portions of the substrate carriers (50). In any one of claims 1 to 13, further comprising one or more substrate carriers (50) for transporting the substrates (10) through the vacuum deposition system (100), each of the substrate carriers comprising:
A carrier body (52) having a substrate support surface (51);
A chucking device (57) for fixing the substrate (10) to the substrate support surface (51); and
A vacuum deposition system comprising a removable deposition protection shield (55) that at least partially surrounds the substrate support surface (51) and covers portions of the carrier body (52) to prevent material from being deposited thereon. A vacuum deposition system according to any one of claims 1 to 14, wherein the plurality of vacuum deposition sources (155) are arranged in a row side by side with a distance (D1) of 200 cm or less between two adjacent vacuum deposition sources, only on one side of the first transport track (T1). A method for depositing a stack of layers comprising at least one organic material on a substrate in a vacuum deposition system comprising a plurality of deposition chambers arranged in a row along a main transport direction (T), wherein a first transport track and a second transport track extend parallel to each other in the main transport direction through the plurality of deposition chambers, the method comprising:
(a) a step of inputting a substrate into the vacuum deposition system in a non-vertical orientation and loading the substrate into a substrate carrier;
(b) changing the substrate orientation from the non-vertical orientation to an essentially vertical orientation;
(c) a step of moving the substrate carrier carrying the substrate parallel from the second transport track to the first transport track in the track switch direction (S) in the first track switch module;
(d) transporting the substrate carrier through the plurality of deposition chambers in a first direction along the first transport track (T1) past the plurality of vacuum deposition sources to deposit a stack of the layers comprising the at least one organic material on the substrate;
(e) a step of moving the substrate carrier carrying the substrate parallel from the first transport track (T1) to the second transport track (T2) in the second track switch module;
(f) changing the substrate orientation from the essentially vertical orientation to the non-vertical orientation; and
(g) a method comprising the step of unloading the substrate from the substrate carrier and outputting the substrate from the vacuum deposition system in the non-vertical orientation. In Article 16,
(h) a method further comprising the step of transporting the substrate carrier in a second direction opposite to the first direction through the plurality of deposition chambers along the second transport track (T2), wherein step (h) is performed between steps (b) and (c), between steps (e) and (f), or after step (g). A method according to claim 16 or 17, wherein the substrate carrier is transported along a closed path through the vacuum deposition system, and in particular, the closed path has a shape like an elongated rectangle when viewed from above. In any one of claims 16 to 18, the substrate is input into the vacuum deposition system in a horizontally long orientation in an input direction parallel to the track switch direction;
A method wherein the substrate is output from the vacuum deposition system in a horizontally elongated orientation in an output direction parallel to the track switch direction. In any one of Articles 16 to 19,
The substrate is input into the vacuum deposition system at a substrate input location between one of the first and second track switch modules and the plurality of deposition chambers;
A method wherein the substrate is output from the vacuum deposition system at a substrate output location between one of the first and second track switch modules and the plurality of deposition chambers. A method according to any one of claims 16 to 20, wherein the layers of the stack are continuously deposited on the substrate without using a shadow mask or a fine metal mask. A method for manufacturing a device in the vacuum deposition system described in any one of claims 1 to 21,
A step of inputting a substrate into the vacuum deposition system in a non-vertical orientation;
A step of changing the substrate orientation to essentially vertical orientation;
Depositing a stack of layers comprising at least one organic material on said substrate while said substrate is essentially vertically oriented;
a step of changing the substrate orientation to the non-vertical orientation; and
A method comprising the step of outputting the substrate in the non-vertical orientation from the vacuum deposition system.