WO2013166933A1 - Water-cooling combined heat dissipation device for heat pipe - Google Patents

Water-cooling combined heat dissipation device for heat pipe Download PDF

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Publication number
WO2013166933A1
WO2013166933A1 PCT/CN2013/075104 CN2013075104W WO2013166933A1 WO 2013166933 A1 WO2013166933 A1 WO 2013166933A1 CN 2013075104 W CN2013075104 W CN 2013075104W WO 2013166933 A1 WO2013166933 A1 WO 2013166933A1
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Prior art keywords
water
heat
heat pipe
cooling
component
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French (fr)
Chinese (zh)
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周哲明
周发明
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    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/40—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids
    • H10W40/47—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids by flowing liquids, e.g. forced water cooling
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/73—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control for cooling by change of state
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
    • G06F2200/20—Indexing scheme relating to G06F1/20
    • G06F2200/201—Cooling arrangements using cooling fluid

Definitions

  • the present invention relates to electronic devices, and more particularly to the dissipation of heat generated by computer devices such as servers, network devices, PCs, and notebook computers.
  • the most common water-cooling method for the current computer case is to install a water-cooled head on each of the main heat-generating components in the chassis, and connect the water-cooling head to the heat-dissipating water tank with a water pipe.
  • the disadvantage is that the water-cooled head is directly mounted on the electronic device. After the cooling water leaks, it can flow directly to the electronic equipment. The risk of damage to the electronic equipment due to leakage of the cooling water is high.
  • the heat exchange area between the cooling water and the heat source is limited to the area where the water cooling head contacts the electronic equipment, and the heat dissipation efficiency is not high.
  • the present invention provides a heat pipe water cooling combined heat dissipation device, which comprises a heat pipe component and a water blocking component.
  • the water-cooling component the heat pipe component is installed on each of the main heat-generating components in the chassis, and the water pipe is installed on the heat pipe to isolate the evaporation end and the condensation end of the heat pipe, and the water-blocking component is installed on the watertight plate of the chassis shell or the chassis. Install the water-cooled component outside the chassis or in a space inside the chassis that is isolated from the electronics.
  • the advantage of this scheme is that the water-cooled part is isolated from the electronic equipment, which reduces the risk of damage of the electronic equipment due to leakage of cooling water, and can increase the heat exchange area of the cooling water and the heat source by utilizing the adjustable heat flux density of the heat pipe, thereby improving The heat dissipation efficiency.
  • a heat pipe water-cooling combined heat dissipating device comprises a heat pipe component, a water blocking component and a water cooling component, wherein the heat pipe component is installed on each main heat-generating component in the chassis, and a water-blocking component is installed on the heat pipe, and the evaporation end and the condensation end of the heat pipe are isolated and separated
  • the water component is installed on the airtight board inside the chassis shell or the chassis, so that the water-cooled component is installed outside the chassis or in the space separated from the electronic device in the chassis, so as to reduce the risk of damage of the electronic device due to leakage of cooling water, and
  • the heat flux density of the heat pipe is used to increase the heat exchange area between the cooling water and the heat source, thereby improving heat dissipation efficiency.
  • the heat pipe component is mainly composed of a heat pipe, and the evaporation end of the heat pipe is connected with the main heat-generating component in the chassis, and the main heat-generating component is a CPU, a north-south bridge chip of the motherboard, a graphics card, a memory, a hard disk, a power supply, etc., and a condensation end of the heat pipe
  • the water-cooled parts are connected.
  • the water blocking member is mounted on the heat pipe to isolate the evaporation end and the condensation end of the heat pipe.
  • the water barrier can be mounted on the chassis enclosure or on the water barrier inside the enclosure.
  • One type of water-cooling component is a water tank, which includes a water inlet hole, a water outlet hole, a water tank, and a condensation end of the heat pipe is inserted into the water tank.
  • the heat of the heat pipe can be directly exchanged into the cooling water.
  • Another type of water-cooling component is a water-cooling head, which comprises a water inlet hole, a water outlet hole, and a heat conduction plate, and the condensation end of the heat pipe is connected to the heat conduction plate.
  • the beneficial effects of the invention are: separating the water-cooled portion from the electronic device, reducing the risk of the electronic device being damaged by the leakage of the cooling water, and simultaneously increasing the heat of the cooling water and the heat source by utilizing the adjustable heat flux density of the heat pipe. Exchange area, which improves heat dissipation efficiency.
  • FIG. 1 is a schematic structural view of a heat pipe and a water tank combined heat sink according to the present invention.
  • FIG. 2 is a schematic structural view of a combined heat sink and water-cooled head heat sink according to the present invention.
  • FIG. 3 is a schematic view showing the installation of a heat pipe water-cooled combined heat sink according to the present invention.
  • an embodiment of the present invention is a heat pipe and a water tank combined heat sink.
  • a combination heat pipe and water tank heatsink includes (1) a heat pipe, (2) a water tank, and (3) a water barrier.
  • the water tank contains (6) water inlet holes, (7) water outlet holes, (8) water tanks, (1) heat pipes (5) condensing ends are inserted into (2) water tanks (8) water tanks.
  • an embodiment of the present invention is a combination heat pipe and water-cooling head heat sink.
  • a combination heat pipe and water cooling head heatsink includes (1) a heat pipe, (9) a water cooling head, and (3) a water blocking plate. (9)
  • the water-cooled head contains (6) inlet holes, (7) outlet holes, (10) heat-conducting plates, and (1) the (5) condensation ends of the heat pipes are connected to the (10) heat-conducting plates.
  • an embodiment of the present invention is a heat pipe water-cooled combined heat sink mounted on a PC.
  • a heat pipe water-cooling combination radiator mounted on a PC includes (1) a heat pipe, (2) a water tank, and (3) a water barrier. (3) The water barrier is installed on the (11) chassis water barrier.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Human Computer Interaction (AREA)
  • General Physics & Mathematics (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

The present invention relates to an electronic device, and more particularly relates to dissipation of heat generated by computer devices, such as a server, a network device, a PC, and a notebook computer. A water-cooling combined heat dissipation device for a heat pipe comprises a heat pipe member, a water-resisting member, and a water-cooling member. The heat pipe member is mainly formed by a heat pipe (1), and is installed on each main heat generating member in a case. The heat pipe (1) is installed with a water-resisting member, so as to isolate an evaporating end (4) of the heat pipe (1) from a condensing end (5). The water-resisting member is a water-resisting board (3), installed on a case housing or a water-resisting board of the case, so as to enable the water-cooling member to be installed out of the case or in a space of the case isolated from electronic devices. One type of the water-cooling member is a water tank (2), comprising a water inlet hole (6), a water outlet hole (7), and a water bath (8), the condensing end (5) of the heat pipe (1) is inserted into the water bath (8) of the water tank (2), and heat of the heat pipe (1) may be directly exchanged into cooling water. Another type of the water-cooling member is a water-cooling head, comprising a water inlet hole, a water outlet hole, and a heat-conducting board, and the condensing end of the heat pipe is connected to the heat-conducting board. An advantage of the solution is that the water-cooling part is isolated from the electronic devices, so as to lower a risk that the electronic devices are destroyed because of leak of the cooling water, and meanwhile, a heat flow density adjustable characteristic of the heat pipe may be used to increase a heat exchange area between the cooling water and a heat generating source, so as to improve heat dissipation efficiency.

Description

说 明 书 一种热管水冷组合散热设备 技术领域  Description A heat pipe water-cooling combined heat dissipation device

[0001] 本发明涉及电子设备， 特别是涉及服务器、 网络设备、 PC、 笔记本电脑等电脑设备产 生的热量的排散。  [0001] The present invention relates to electronic devices, and more particularly to the dissipation of heat generated by computer devices such as servers, network devices, PCs, and notebook computers.

背景技术 Background technique

[0002] 目前的电脑机箱最常用的水冷散热方式是在机箱内的各个主要发热部件上安装水冷 头， 用水管将水冷头与散热水箱等连接起来， 其缺点是水冷头直接安装在电子设备上， 冷却 水泄漏后可以直接流到电子设备上， 电子设备因冷却水泄漏而损坏的风险较高； 另外冷却水 与发热源的热交换面积局限于水冷头与电子设备接触的面积， 散热效率不高。  [0002] The most common water-cooling method for the current computer case is to install a water-cooled head on each of the main heat-generating components in the chassis, and connect the water-cooling head to the heat-dissipating water tank with a water pipe. The disadvantage is that the water-cooled head is directly mounted on the electronic device. After the cooling water leaks, it can flow directly to the electronic equipment. The risk of damage to the electronic equipment due to leakage of the cooling water is high. In addition, the heat exchange area between the cooling water and the heat source is limited to the area where the water cooling head contacts the electronic equipment, and the heat dissipation efficiency is not high.

发明内容 Summary of the invention

[0003] 为解决现有技术中的电子设备因冷却水泄漏而损坏的风险较高和散热效率不高的问 题， 本发明提出一种热管水冷组合散热设备， 该设备包含热管部件、 隔水部件和水冷部件， 热管部件安装在机箱内的各个主要发热部件上， 热管上安装隔水部件， 将热管的蒸发端和冷 凝端隔离， 隔水部件安装在机箱外壳或者机箱内的隔水板上， 使水冷部件安装在机箱外或者 是机箱内与电子设备相隔离的空间内。 该方案的优点是使水冷部分与电子设备相隔离， 降低 了电子设备因冷却水泄漏而损坏的风险， 同时可以利用热管的热流密度可调特性增加冷却水 与发热源的热交换面积， 从而提高了散热效率。  [0003] In order to solve the problem that the electronic device in the prior art has high risk of damage due to leakage of cooling water and low heat dissipation efficiency, the present invention provides a heat pipe water cooling combined heat dissipation device, which comprises a heat pipe component and a water blocking component. And the water-cooling component, the heat pipe component is installed on each of the main heat-generating components in the chassis, and the water pipe is installed on the heat pipe to isolate the evaporation end and the condensation end of the heat pipe, and the water-blocking component is installed on the watertight plate of the chassis shell or the chassis. Install the water-cooled component outside the chassis or in a space inside the chassis that is isolated from the electronics. The advantage of this scheme is that the water-cooled part is isolated from the electronic equipment, which reduces the risk of damage of the electronic equipment due to leakage of cooling water, and can increase the heat exchange area of the cooling water and the heat source by utilizing the adjustable heat flux density of the heat pipe, thereby improving The heat dissipation efficiency.

[0004] 本发明解决其技术问题所采用的技术方案是： [0004] The technical solution adopted by the present invention to solve the technical problem thereof is:

一种热管水冷组合散热设备， 包含热管部件、 隔水部件和水冷部件， 热管部件安装在机箱内 的各个主要发热部件上， 热管上安装隔水部件， 将热管的蒸发端和冷凝端隔离， 隔水部件安 装在机箱外壳或者机箱内的隔水板上， 使水冷部件安装在机箱外或者是机箱内与电子设备相 隔离的空间内， 以降低电子设备因冷却水泄漏而损坏的风险， 同时可以利用热管的热流密度 可调特性增加冷却水与发热源的热交换面积， 从而提高散热效率。 A heat pipe water-cooling combined heat dissipating device comprises a heat pipe component, a water blocking component and a water cooling component, wherein the heat pipe component is installed on each main heat-generating component in the chassis, and a water-blocking component is installed on the heat pipe, and the evaporation end and the condensation end of the heat pipe are isolated and separated The water component is installed on the airtight board inside the chassis shell or the chassis, so that the water-cooled component is installed outside the chassis or in the space separated from the electronic device in the chassis, so as to reduce the risk of damage of the electronic device due to leakage of cooling water, and The heat flux density of the heat pipe is used to increase the heat exchange area between the cooling water and the heat source, thereby improving heat dissipation efficiency.

[0005] 热管部件主要由热管组成， 热管的蒸发端与机箱内的主要发热部件相连接， 主要发热 部件是 CPU、 主板南北桥芯片、 显卡、 内存、 硬盘、 电源等部件， 热管的冷凝端与水冷部分 相连接。  [0005] The heat pipe component is mainly composed of a heat pipe, and the evaporation end of the heat pipe is connected with the main heat-generating component in the chassis, and the main heat-generating component is a CPU, a north-south bridge chip of the motherboard, a graphics card, a memory, a hard disk, a power supply, etc., and a condensation end of the heat pipe The water-cooled parts are connected.

[0006] 隔水部件安装在热管上， 将热管的蒸发端和冷凝端隔离。 隔水部件可以安装在机箱外 壳或者机箱内的隔水板上。  [0006] The water blocking member is mounted on the heat pipe to isolate the evaporation end and the condensation end of the heat pipe. The water barrier can be mounted on the chassis enclosure or on the water barrier inside the enclosure.

[0007] 水冷部件的一种是水箱， 包含有进水孔、 出水孔、 水槽， 热管的冷凝端插入到水箱的 水槽内， 热管的热量可以直接交换到冷却水中。 [0007] One type of water-cooling component is a water tank, which includes a water inlet hole, a water outlet hole, a water tank, and a condensation end of the heat pipe is inserted into the water tank. In the water tank, the heat of the heat pipe can be directly exchanged into the cooling water.

[0008] 水冷部件的另一种是水冷头， 包含有进水孔、 出水孔、 导热板， 热管的冷凝端与导热 板相连接。  [0008] Another type of water-cooling component is a water-cooling head, which comprises a water inlet hole, a water outlet hole, and a heat conduction plate, and the condensation end of the heat pipe is connected to the heat conduction plate.

[0009] 本发明的有益效果是： 使水冷部分与电子设备相隔离， 降低了电子设备因冷却水泄漏 而损坏的风险， 同时可以利用热管的热流密度可调特性增加冷却水与发热源的热交换面积， 从而提高了散热效率。  [0009] The beneficial effects of the invention are: separating the water-cooled portion from the electronic device, reducing the risk of the electronic device being damaged by the leakage of the cooling water, and simultaneously increasing the heat of the cooling water and the heat source by utilizing the adjustable heat flux density of the heat pipe. Exchange area, which improves heat dissipation efficiency.

附图说明 DRAWINGS

[0010] 图 1是根据本发明的热管与水箱组合散热器的结构示意图。  1 is a schematic structural view of a heat pipe and a water tank combined heat sink according to the present invention.

说  Say

[0011] 图 2是根据本发明的热管与水冷头组合散热器的结构示意图。 2 is a schematic structural view of a combined heat sink and water-cooled head heat sink according to the present invention.

[0012] 图 3是根据本发明的热管水冷组合散热器的安装示意图。 3 is a schematic view showing the installation of a heat pipe water-cooled combined heat sink according to the present invention.

书  Book

[0013] 图中， 1.热管， 2.水箱， 3.隔水板， 4.蒸发端， 5.冷凝端， 6.进水孔， 7.出水孔， 8.水槽， 9.水冷头， 10.导热板， 11.机箱隔水板。  [0013] In the figure, 1. heat pipe, 2. water tank, 3. water blocking plate, 4. evaporation end, 5. condensation end, 6. water inlet hole, 7. water outlet hole, 8. water tank, 9. water cooling head, 10. Thermal plate, 11. Chassis water barrier.

具体实施方式 detailed description

[0014] 下面结合附图和实施例对本发明进一步说明。  [0014] The present invention will be further described below in conjunction with the accompanying drawings and embodiments.

[0015] 在图 1中， 本发明的实施例是一种热管与水箱组合散热器。  [0015] In FIG. 1, an embodiment of the present invention is a heat pipe and a water tank combined heat sink.

[0016] 如图 1所示：  [0016] As shown in Figure 1:

一种热管与水箱组合散热器， 包含 （1 ) 热管、 （2) 水箱和 （3 ) 隔水板。 （2) 水箱包含 （6) 进水孔、 （7) 出水孔、 （8) 水槽， （1 ) 热管的 （5 ) 冷凝端插入到 （2) 水箱的 （8) 水槽内。 A combination heat pipe and water tank heatsink includes (1) a heat pipe, (2) a water tank, and (3) a water barrier. (2) The water tank contains (6) water inlet holes, (7) water outlet holes, (8) water tanks, (1) heat pipes (5) condensing ends are inserted into (2) water tanks (8) water tanks.

[0017] 在图 2中， 本发明的实施例是一种热管与水冷头组合散热器。 [0017] In FIG. 2, an embodiment of the present invention is a combination heat pipe and water-cooling head heat sink.

[0018] 如图 2所示： [0018] As shown in Figure 2:

一种热管与水冷头组合散热器， 包含 （1 ) 热管、 （9) 水冷头和 （3 ) 隔水板。 （9) 水冷头包 含（6)进水孔、 （7) 出水孔、 （10)导热板， （1 )热管的 （5 )冷凝端与 （10)导热板相连接。 A combination heat pipe and water cooling head heatsink includes (1) a heat pipe, (9) a water cooling head, and (3) a water blocking plate. (9) The water-cooled head contains (6) inlet holes, (7) outlet holes, (10) heat-conducting plates, and (1) the (5) condensation ends of the heat pipes are connected to the (10) heat-conducting plates.

[0019] 在图 3中， 本发明的实施例是一种热管水冷组合散热器， 安装在 PC机上。 [0019] In FIG. 3, an embodiment of the present invention is a heat pipe water-cooled combined heat sink mounted on a PC.

[0020] 如图 3所示： [0020] As shown in Figure 3:

一种热管水冷组合散热器， 安装在 PC机上， 包含 （1 ) 热管、 （2) 水箱和 （3 ) 隔水板。 （3 ) 隔水板安装在 （11 ) 机箱隔水板上。 A heat pipe water-cooling combination radiator mounted on a PC includes (1) a heat pipe, (2) a water tank, and (3) a water barrier. (3) The water barrier is installed on the (11) chassis water barrier.

Claims

权 利 要 求 书 Claim 1.一种热管水冷组合散热设备， 其特征是： 包含热管部件、 隔水部件和水冷部件； 所述热管 部件主要由热管组成， 所述热管的蒸发端与机箱内的主要发热部件相连接， 所述热管的冷凝 端与所述水冷部件相连接。  A heat pipe water-cooling combined heat dissipating device, comprising: a heat pipe component, a water blocking component and a water cooling component; the heat pipe component is mainly composed of a heat pipe, and an evaporation end of the heat pipe is connected with a main heat-generating component in the chassis, The condensation end of the heat pipe is connected to the water-cooling component. 2. 根据权利要求 1所述的热管水冷组合散热设备， 其特征是： 所述隔水部件安装在所述热管 上， 将所述热管的蒸发端和冷凝端隔离； 所述隔水部件可以安装在机箱外壳或者机箱内的隔 水板上。  2 . The heat pipe water-cooling combined heat dissipation device according to claim 1 , wherein: the water blocking component is mounted on the heat pipe to isolate an evaporation end and a condensation end of the heat pipe; and the water blocking component can be installed. On the chassis enclosure or on the water barrier inside the enclosure. 3. 根据权利要求 1所述的热管水冷组合散热设备，其特征是：所述的水冷部件的一种是水箱， 包含有进水孔、 出水孔、 水槽， 所述热管的冷凝端插入到所述水槽内。  3. The heat pipe water-cooling combined heat dissipating device according to claim 1, wherein: one of the water-cooling components is a water tank, comprising a water inlet hole, a water outlet hole, and a water tank, wherein the condensation end of the heat pipe is inserted into the water tank. Said inside the sink. 4. 根据权利要求 1所述的热管水冷组合散热设备， 其特征是： 所述的水冷部件的一种是水冷 头， 包含有进水孔、 出水孔、 导热板， 所述热管的冷凝端与所述导热板相连接。  4. The heat pipe water-cooling combined heat dissipating device according to claim 1, wherein: one of the water-cooling components is a water-cooling head, and includes a water inlet hole, a water outlet hole, a heat conduction plate, and a condensation end of the heat pipe. The heat conducting plates are connected.
PCT/CN2013/075104 2012-05-10 2013-05-03 Water-cooling combined heat dissipation device for heat pipe Ceased WO2013166933A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201220208750.4U CN202587734U (en) 2012-05-10 2012-05-10 Water-cooling combined heat dissipation equipment for heat pipe
CN201220208750.4 2012-05-10

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20190239386A1 (en) * 2018-01-30 2019-08-01 Quanta Computer Inc. Server water cooling modules prevent water leakage device
EP3568644A1 (en) * 2017-01-16 2019-11-20 Minnoy BVBA A heating system and a heating method
EP3760959A1 (en) * 2019-07-03 2021-01-06 Giga-Byte Technology Co., Ltd. Heat dissipation device
CN116931676A (en) * 2022-04-07 2023-10-24 讯凯国际股份有限公司 Combined water-cooling heat radiation casing, connecting piece and communicating pipe body thereof

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN202587734U (en) * 2012-05-10 2012-12-05 周哲明 Water-cooling combined heat dissipation equipment for heat pipe
CN103260384B (en) * 2013-04-25 2015-10-28 奇瑞新能源汽车技术有限公司 A kind of electric machine controller cooling structure
CN103411192B (en) * 2013-08-14 2015-09-23 中南大学 A kind of solar LED (Light Emitting Diode) lamp combined radiating device

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1456038A (en) * 2001-09-04 2003-11-12 株式会社日立制作所 Electronic device
CN1455954A (en) * 2001-09-07 2003-11-12 株式会社日立制作所 Electronic device
CN2640041Y (en) * 2003-08-19 2004-09-08 林项武 Heat pipe water-cooling heat-sink system
CN1921093A (en) * 2005-08-24 2007-02-28 讯凯国际股份有限公司 A kind of heat dissipation device and heat dissipation method thereof
TW201218936A (en) * 2010-10-29 2012-05-01 Ind Tech Res Inst Cooling structure of electronic device
CN202587734U (en) * 2012-05-10 2012-12-05 周哲明 Water-cooling combined heat dissipation equipment for heat pipe

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1456038A (en) * 2001-09-04 2003-11-12 株式会社日立制作所 Electronic device
CN1455954A (en) * 2001-09-07 2003-11-12 株式会社日立制作所 Electronic device
CN2640041Y (en) * 2003-08-19 2004-09-08 林项武 Heat pipe water-cooling heat-sink system
CN1921093A (en) * 2005-08-24 2007-02-28 讯凯国际股份有限公司 A kind of heat dissipation device and heat dissipation method thereof
TW201218936A (en) * 2010-10-29 2012-05-01 Ind Tech Res Inst Cooling structure of electronic device
CN202587734U (en) * 2012-05-10 2012-12-05 周哲明 Water-cooling combined heat dissipation equipment for heat pipe

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3568644A1 (en) * 2017-01-16 2019-11-20 Minnoy BVBA A heating system and a heating method
US20190239386A1 (en) * 2018-01-30 2019-08-01 Quanta Computer Inc. Server water cooling modules prevent water leakage device
US10694640B2 (en) * 2018-01-30 2020-06-23 Quanta Computer Inc. Server water cooling modules prevent water leakage device
EP3760959A1 (en) * 2019-07-03 2021-01-06 Giga-Byte Technology Co., Ltd. Heat dissipation device
CN116931676A (en) * 2022-04-07 2023-10-24 讯凯国际股份有限公司 Combined water-cooling heat radiation casing, connecting piece and communicating pipe body thereof

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