CN204272568U - Radiation cooling device for multiple heat sources - Google Patents

Abstract

The utility model relates to a heat dissipation cooling device suitable for multiple heat sources, which comprises a first heat absorbing piece, a water pump with a liquid pumping chamber, a metal pipe and a second heat absorbing piece; the first heat absorbing piece is contacted with the first heat source; the water pump is combined on the first heat absorbing piece and is provided with a water inlet and a water outlet, and the water pump and a cooling device form pumping circulation of cooling liquid; the first end of the metal pipe is connected to the water inlet or the water outlet of the water pump, and the cooling liquid passes through the metal pipe and leaves from the second end of the metal pipe; the second heat absorbing member is in contact with the second heat source, wherein the metal tube is coupled to the second heat absorbing member. The utility model discloses a configuration of second heat absorbing piece for only can be used for dispelling the refrigerated water pump to first heat source originally, can further solve the heat dissipation cooling of one or more second heat sources, thereby the heat dissipation cooling efficiency of full play water pump.

Description

Radiation cooling device for multiple heat sources

technical field

The utility model relates to a heat dissipation device of an electronic device, in particular to a heat dissipation cooling device suitable for multiple heat sources. the

Background technique

Existing electronic devices are provided with many high-power chips. High-power chips have excellent data-processing performance, but they also generate staggering amounts of heat. If the heat is not properly dissipated and cooled, the temperature of the aforementioned high-power chip will be too high, exceeding its safe operating temperature.

Many circuit boards, such as motherboards or graphics cards, are usually configured with more than two high-power chips. Taking a motherboard as an example, the CPU is the main high-power chip, but the system chipset or built-in graphics chip adjacent to the CPU is usually also a high-power chip. Taking the display card as an example, the display chip is the main high-power chip, but the memory of the display card and even another display chip are also high-power chips that generate high heat.

No matter the existing water pumps are air-cooled or water-cooled water pumps, they all have excellent cooling performance. A high-efficiency air-cooled water pump requires a large installation space. Taking the aforementioned display card as an example, if a high-efficiency air-cooled water pump is installed on the display chip, it will be difficult to install it on the memory of the adjacent display card or another display chip. Another high-efficiency air-cooled water pump is set. Taking the water-cooled water pump as an example, individual high-power chips need to be equipped with water-cooling heads, which makes the entire water-cooling system huge and complicated, and increases the risk of pipeline leakage.

Contents of the invention

In view of this, the purpose of the present invention is to provide a heat radiation cooling device suitable for multiple heat sources, through a single high-efficiency water pump, simultaneously solve the problem of heat radiation and cooling of multiple heat sources.

In order to achieve the above-mentioned purpose, the utility model provides a heat radiation cooling device suitable for multiple heat sources, which forms a cooling liquid pumping cycle with a cooling device and cools a first heat source and a second heat source, the first heat source Separated from the second heat source by a distance, the cooling device suitable for multiple heat sources includes:

a first heat sink, which is in contact with the first heat source;

A water pump with a liquid pumping chamber, which is combined on the first heat absorbing member; wherein, the water pump has a water inlet and a water outlet, and the cooling liquid enters the liquid pumping chamber through the water inlet and communicates with The first heat absorbing member performs heat exchange, and the cooling liquid leaves the liquid pumping chamber through the water outlet, and forms a pumping cycle of the cooling liquid with the cooling device;

a metal tube, which has a first end and a second end, the first end is connected to the water inlet or the water outlet of the water pump, and the cooling liquid exits from the second end through the metal tube; and

A second heat sink is in contact with the second heat source, wherein the metal tube is combined with the second heat sink, and the coolant in the metal tube exchanges heat with the second heat sink.

As a preferred solution of the heat radiation cooling device applicable to multiple heat sources, the heat radiation cooling device suitable for multiple heat sources further includes a fixing part, and the fixing part presses the first heat absorbing part on the first heat source.

As a preferred solution of the above-mentioned heat dissipation and cooling device suitable for multiple heat sources, the fixing part includes:

a frame, which carries the first heat sink, and the first heat sink passes through the frame to contact the first heat source; and

A plurality of fixing feet extend on the edge of the frame.

As a preferred solution of the heat radiation cooling device applicable to multiple heat sources, the metal pipe is directly connected to the water pump.

As a preferred solution of the heat dissipation and cooling device applicable to multiple heat sources, the metal pipe is connected to the water pump through a connecting water pipe.

As a preferred solution of the above-mentioned heat radiation cooling device applicable to multiple heat sources, the second heat absorbing member is a metal block.

As a preferred solution of the above-mentioned heat radiation cooling device applicable to multiple heat sources, the metal tube is attached to the surface of the second heat absorbing member.

In order to achieve the above object, the utility model provides another heat radiation cooling device suitable for multiple heat sources, which forms a cooling liquid pumping cycle with a cooling device and cools a first heat source and a second heat source. The heat source is separated from the second heat source by a distance, and the cooling device suitable for multiple heat sources includes:

a first heat sink, which is in contact with the first heat source;

A water pump with a liquid pumping chamber, which is combined on the first heat absorbing member; wherein, the water pump has a water inlet and a water outlet, and the cooling liquid enters the liquid pumping chamber through the water inlet and communicates with The first heat absorbing member performs heat exchange, and the cooling liquid leaves the liquid pumping chamber through the water outlet, and forms a pumping cycle of the cooling liquid with the cooling device;

a water pipe connected at one end to the water inlet or outlet of the water pump; and

A second heat sink, which is in contact with the second heat source, wherein the second heat sink has a coolant channel inside, passing through the second heat sink, and the other end of the water pipe is connected to the coolant channel, And the cooling liquid flows through the cooling liquid channel, and the cooling liquid exchanges heat with the second heat absorbing element.

As another preferred solution of the above-mentioned heat radiation cooling device suitable for multiple heat sources, the heat radiation cooling device suitable for multiple heat sources further includes a fixing part, and the fixing part presses the first heat absorbing part on the first heat source superior.

As another preferred solution of the above-mentioned heat dissipation and cooling device suitable for multiple heat sources, the fixing part includes:

a frame, which carries the first heat sink, and the first heat sink passes through the frame to contact the first heat source; and

A plurality of fixing feet extend on the edge of the frame.

As another preferred solution of the heat dissipation and cooling device applicable to multiple heat sources, the second heat sink is a metal block.

Through the configuration of the second heat-absorbing part, the utility model makes the water pump, which can only be used for heat dissipation and cooling of the first heat source, further solve the heat dissipation and cooling of one or more second heat sources, thereby giving full play to the heat dissipation and cooling performance of the water pump .

Description of drawings

Fig. 1 is an exploded view of the first embodiment of the utility model;

Fig. 2 is a perspective view of the first embodiment of the utility model;

3 is a schematic diagram of the first embodiment of the utility model installed on a circuit board;

Fig. 4 is an exploded view of the first heat absorbing member, the water pump and the fixing frame in the first embodiment of the present utility model;

Fig. 5 is a perspective view of the second embodiment of the present invention.

Main part name:

100-the first heat-absorbing part; 1000-radiating cooling device suitable for multiple heat sources;

200 - water pump with a liquid pumping chamber;

300-metal pipe; 310-first end; 320-second end;

400 - second heat sink; 400a - second heat sink;

500-fixer; 510-frame; 520-fixed foot;

600 - water pipe;

800 - cooling device;

900-circuit board; 910-first heat source; 920-second heat source.

Detailed ways

In order to make the above and other objects, features, and advantages of the present invention more obvious, the following will be described in detail with reference to the accompanying drawings.

Please refer to FIG. 1 , FIG. 2 and FIG. 3 , which are a heat dissipation and cooling device 1000 suitable for multiple heat sources according to the first embodiment of the present invention, which is used to be installed on a circuit board 900 . The circuit board 900 has a first heat source 910 and a second heat source 920 , and the first heat source 910 and the second heat source 920 are separated by a distance. The circuit board 900 may be a graphics card, and the first heat source 910 and the second heat source 920 may be a graphics chip and a graphics card memory module respectively. However, the circuit board 900 is not limited to a display card, and may also be a motherboard or any functional circuit board 900 , and the first heat source 910 and the second heat source 920 are high-power chips on the aforementioned motherboard or circuit board 900 . The aforementioned first heat source 910 and second heat source 920 are not limited to be disposed on the same circuit board 900 .

As shown in Fig. 1, Fig. 2 and Fig. 3, the heat dissipation and cooling device 1000 suitable for multiple heat sources includes a first heat absorber 100, a water pump 200 with a liquid pumping chamber, a metal pipe 300 and a second heat absorber 400 pieces.

As shown in FIG. 1 , FIG. 2 and FIG. 3 , the first heat absorbing member 100 is used to contact the first heat source 910 to absorb heat from the first heat source 910 . Usually, the first heat absorbing element 100 is a metal block made of high thermal conductivity material such as aluminum or copper; the shape of the first heat absorbing element 100 is not limited to a disc shape, and may also be a square plate or other shapes.

As shown in FIG. 1 , FIG. 2 and FIG. 3 , the water pump 200 is combined with the first heat absorbing element 100 , and the water pump 200 has a water inlet 210 and a water outlet 220 .

As shown in FIG. 2 and FIG. 3 , the water inlet 210 allows a cooling liquid to enter the liquid pumping chamber and conduct heat exchange with the first heat sink 100 , thereby absorbing the heat generated by the first heat source 910 and taking away the absorbed heat. , and the water outlet 220 is used for the cooling liquid to leave the liquid pumping chamber, and forms a cooling liquid pumping cycle with a cooling device 800, and the cooling device 800 can be a radiator.

As shown in FIG. 4 , the cooling device 1000 suitable for multiple heat sources further includes a fixing part 500 disposed on the circuit board 900 and pressing the first heat absorbing part 100 on the first heat source 910 .

The fixing member 500 includes a frame 510 and a plurality of fixing feet 520 . The frame 510 is used to carry the first heat sink 100 , and the first heat sink 100 passes through the frame 510 to contact the first heat source 910 . The fixing feet 520 extend from the edge of the frame 510 and are fixed on the circuit board 900 , so that the first heat sink 100 can reliably contact the first heat source 910 .

As shown in Figure 1, Figure 2 and Figure 3, the metal pipe 300 has a first end 310 and a second end 320, the first end 310 is connected to the water outlet 220 of the water pump 200, so that the cooling liquid passes through the metal pipe 300 The second end 320 exits. The second heat sink 400 is used to contact the second heat source 920 to absorb the heat generated by the second heat source 920. The metal tube 300 is combined with the second heat sink 400 so that the coolant in the metal tube 300 and the second heat sink 400 performs heat exchange, so that the cooling liquid can take away the heat generated by the second heat source 920 . The second heat sink 400 is a metal block, and the metal tube 300 is attached to the surface of the second heat sink 400 by welding or other fixing.

In the first embodiment, the first end 310 is connected to the water outlet 220 of the water pump 200 as a specific implementation mode. Actually, the first end 310 of the metal pipe 300 may also be connected to the water inlet 210 of the water pump 200 . In addition, in the first embodiment, the metal pipe 300 is connected to the water pump 200 through a connecting water pipe 600. The flexible water pipe 600 can make the arrangement position of the metal pipe 300 or the second heat absorbing member 400 more flexible. For example, the second heat source 920 may be located on another circuit board. Of course, the metal pipe 300 can also be directly connected to the water pump 200 .

Through the above combination, the heat generated by the second heat source 920 can be further taken away by the cooling liquid of the metal tube 300 after being absorbed by the second heat sink 400 , so that the second heat source 920 is separated from the first heat source 910 At a certain distance, the second heat source 920 can still be cooled by the water pump 200 , so as to give full play to the cooling performance of the water pump 200 and simplify the cooling structure on the circuit board 900 .

It should be noted that although the embodiment of the present invention is described with a single metal tube 300, a single second heat sink 400 and a single second heat source 920 as an example, in fact, there may be more than two second heat sources 920, There are more than two metal tubes 300 and more than two second heat sinks 400 , and the first ends 310 of the multiple metal tubes 300 can be simultaneously connected to a single water inlet 210 or a single water outlet 220 through a branch pipe device.

As shown in Figure 5, the heat radiation cooling device 1000 suitable for multiple heat sources according to the second embodiment of the present invention includes a first heat absorbing member 100, a water pump 200 with a liquid pumping chamber, a water pipe 600 and a The second heat sink 400a.

As shown in FIG. 5 , the first heat absorbing element 100 and the water pump 200 are substantially the same as those of the first embodiment, and the description will not be repeated below.

One end of the water pipe 600 is connected to the water inlet 210 or the water outlet 220 of the water pump 200 .

The second heat sink 400a is used to contact the second heat source 920 to absorb the heat generated by the second heat source 920 . The second heat absorbing element 400a can be a metal block, which has a coolant channel 410a inside, passing through the second heat absorbing element 400a. The other end of the water pipe 600 is connected to the cooling liquid channel 410a, so that the cooling liquid can flow through the cooling liquid channel 410a, so that the cooling liquid can exchange heat with the second heat absorbing member 400, so that the cooling liquid can take away the second heat source 920 to generate hot.

It should be noted that although the second embodiment of the present utility model is described with a single water pipe 600, a single second heat sink 400a and a single second heat source 920 as an example, in fact, there may be more than two second heat sources 920 , with more than two water pipes 600 and more than two second heat absorbing elements 400a, and multiple water pipes 600 can be simultaneously connected to a single water inlet 210 or a single water outlet 220 through a branch pipe device. Certainly, a single second heat absorbing element 400 may also have multiple coolant passages 410 a at the same time, connect multiple water pipes 600 , and then connect to a single water inlet 210 or a single water outlet 220 simultaneously through a branch pipe device.

The utility model makes the water pump 200, which can only be used to dissipate heat and cool the first heat source 910, through the configuration of the second heat absorbing parts 400 and 400a, and can further solve the heat dissipation and cooling of one or more second heat sources 920, thereby fully The heat dissipation and cooling performance of the water pump 200 is utilized, and the problem of an overly complicated heat dissipation structure in the case of multiple heat sources is solved.

The above is only a preferred embodiment of the utility model, and does not limit the scope of patent protection of the utility model. Therefore, all equal changes and modifications made by using the specification and accompanying drawings of the utility model are all protected by the utility model. covered by the scope of protection.

Claims (11)

1. A heat dissipation cooling device suitable for multiple heat sources, which constitutes a pumping cycle of cooling liquid with a cooling device and cools a first heat source and a second heat source, and the first heat source and the second heat source are separated by a distance , characterized in that the cooling device suitable for multiple heat sources includes: a first heat sink, which is in contact with the first heat source; A water pump with a liquid pumping chamber, which is combined on the first heat absorbing member; wherein, the water pump has a water inlet and a water outlet, and the cooling liquid enters the liquid pumping chamber through the water inlet and communicates with The first heat absorbing member performs heat exchange, and the cooling liquid leaves the liquid pumping chamber through the water outlet, and forms a pumping cycle of the cooling liquid with the cooling device; a metal tube, which has a first end and a second end, the first end is connected to the water inlet or the water outlet of the water pump, and the cooling liquid exits from the second end through the metal tube; and A second heat sink is in contact with the second heat source, wherein the metal tube is combined with the second heat sink, and the coolant in the metal tube exchanges heat with the second heat sink. 2 . The heat radiation cooling device suitable for multiple heat sources as claimed in claim 1 , further comprising a fixing part, the fixing part presses the first heat absorbing part on the first heat source. 3 . 3. The heat radiation cooling device suitable for multiple heat sources as claimed in claim 2, wherein the fixing part comprises: a frame, which carries the first heat sink, and the first heat sink passes through the frame to contact the first heat source; and A plurality of fixing feet extend on the edge of the frame. 4. The heat radiation cooling device suitable for multiple heat sources as claimed in claim 1, wherein the metal pipe is directly connected to the water pump. 5. The heat radiation cooling device suitable for multiple heat sources as claimed in claim 1, wherein the metal pipe is connected to the water pump through a connecting water pipe. 6 . The heat radiation cooling device suitable for multiple heat sources as claimed in claim 1 , wherein the second heat sink is a metal block. 6 . 7 . The heat radiation cooling device suitable for multiple heat sources according to claim 1 , wherein the metal tube is attached to the surface of the second heat sink. 8 . 8. A heat radiation cooling device suitable for multiple heat sources, which forms a pumping cycle of cooling liquid with a cooling device and cools a first heat source and a second heat source, and the first heat source and the second heat source are separated by a distance , characterized in that the cooling device suitable for multiple heat sources includes: a first heat sink, which is in contact with the first heat source; A water pump with a liquid pumping chamber, which is combined on the first heat absorbing member; wherein, the water pump has a water inlet and a water outlet, and the cooling liquid enters the liquid pumping chamber through the water inlet and communicates with The first heat absorbing member performs heat exchange, and the cooling liquid leaves the liquid pumping chamber through the water outlet, and forms a pumping cycle of the cooling liquid with the cooling device; a water pipe connected at one end to the water inlet or outlet of the water pump; and A second heat sink, which is in contact with the second heat source, wherein the second heat sink has a coolant channel inside, passing through the second heat sink, and the other end of the water pipe is connected to the coolant channel, And the cooling liquid flows through the cooling liquid channel, and the cooling liquid exchanges heat with the second heat absorbing element. 9 . The heat radiation cooling device suitable for multiple heat sources as claimed in claim 8 , further comprising a fixing part, the fixing part presses the first heat absorbing part on the first heat source. 10 . 10. The heat radiation cooling device suitable for multiple heat sources as claimed in claim 9, wherein the fixing part comprises: a frame, which carries the first heat sink, and the first heat sink passes through the frame to contact the first heat source; and A plurality of fixing feet extend on the edge of the frame. 11 . The heat radiation cooling device suitable for multiple heat sources as claimed in claim 8 , wherein the second heat sink is a metal block. 12 .