TWI872727B - Surface topography measuring device - Google Patents
Surface topography measuring device Download PDFInfo
- Publication number
- TWI872727B TWI872727B TW112137546A TW112137546A TWI872727B TW I872727 B TWI872727 B TW I872727B TW 112137546 A TW112137546 A TW 112137546A TW 112137546 A TW112137546 A TW 112137546A TW I872727 B TWI872727 B TW I872727B
- Authority
- TW
- Taiwan
- Prior art keywords
- light beam
- spectroscopic
- transmitted
- light source
- beam splitter
- Prior art date
Links
Images
Landscapes
- Instruments For Measurement Of Length By Optical Means (AREA)
Abstract
Description
本發明是有關於一種量測裝置,尤其是有關於一種表面形貌量測裝置。 The present invention relates to a measuring device, and in particular to a surface morphology measuring device.
現今工業發展越趨精密,對表面性質包含表面形貌、電性、磁性、力學性質等的要求也已提升至微米、奈米,甚至是原子等級,因此量測表面性質的需求應運而生。在表面性質中針對表面形貌量測大致可分為三類:探針式、光學干涉式和掃描探針式,其中光學干涉式因為可以直接量測試件的全場形貌、不會和試件接觸因此不會對試件造成傷害,以及精度可達奈米等級等優點,相較於其他兩類量測方式越來越受到歡迎。 As the industrial development becomes more and more precise, the requirements for surface properties including surface morphology, electrical properties, magnetic properties, mechanical properties, etc. have also been raised to the micron, nanometer, and even atomic levels, so the need to measure surface properties has arisen. Among surface properties, surface morphology measurement can be roughly divided into three categories: probe type, optical interferometry, and scanning probe type. Optical interferometry is becoming more and more popular compared to the other two measurement methods because it can directly measure the full-field morphology of the specimen, does not contact the specimen and therefore does not cause damage to the specimen, and has an accuracy of nanometers.
現有光學干涉式表面形貌量測方法中,常見使用的相位移(Phase-Shifting)技術是利用不同相位值的干涉條紋影像進行分析,具有分析快速與精確的優點,然而習知在量測過程中需要使用高精度移動平台推動試件,上述移動過程較為耗時,因此使量測時間拉長,且高精度移動平台設備成本高昂。 Among existing optical interferometric surface topography measurement methods, the commonly used phase-shifting technology uses interference fringe images with different phase values for analysis, which has the advantages of fast and accurate analysis. However, it is known that a high-precision moving platform is required to push the specimen during the measurement process. The above-mentioned moving process is relatively time-consuming, thus prolonging the measurement time, and the high-precision moving platform equipment is expensive.
習知使用光學干涉進行表面形貌量測方式具有量測速度較慢與設備成本高昂的缺點,因此發展量測速度快且可降低設備成本的表面形貌量測裝置有其需要。 It is known that the surface topography measurement method using optical interferometry has the disadvantages of slow measurement speed and high equipment cost. Therefore, it is necessary to develop a surface topography measurement device with fast measurement speed and low equipment cost.
本發明所提供的表面形貌量測裝置適於對待檢測物進行表面形貌量測,表面形貌量測裝置包括光源系統、分光組件、相位差膜和解相系統,其中光源系統適於提供光束。分光組件設置於光源系統一側。相位差膜設置於分光組件及待檢測物之間。解相系統設置於分光組件一側。其中光源系統提供的光束適於通過分光組件轉換為反射光束與穿透光束,穿透光束適於通過相位差膜進行第一次相位延遲後傳遞至待檢測物,並適於被待檢測物反射後,再次通過相位差膜進行第二次相位延遲後傳遞至分光組件,經過第一次相位延遲及第二次相位延遲的穿透光束通過分光組件,並與反射光束干涉形成干涉光束,干涉光束經分光組件傳遞至解相系統,解相系統適於分析干涉光束,並獲得待檢測物的表面形貌。 The surface morphology measuring device provided by the present invention is suitable for measuring the surface morphology of an object to be detected. The surface morphology measuring device includes a light source system, a spectroscopic component, a phase difference film and a phase separation system, wherein the light source system is suitable for providing a light beam. The spectroscopic component is arranged on one side of the light source system. The phase difference film is arranged between the spectroscopic component and the object to be detected. The phase separation system is arranged on one side of the spectroscopic component. The light beam provided by the light source system is suitable for being converted into a reflected light beam and a transmitted light beam through the spectroscopic component. The transmitted light beam is suitable for being transmitted to the object to be detected after the first phase delay through the phase difference film, and is suitable for being reflected by the object to be detected, and then being transmitted to the spectroscopic component after the second phase delay through the phase difference film again. The transmitted light beam after the first phase delay and the second phase delay passes through the spectroscopic component and interferes with the reflected light beam to form an interference light beam. The interference light beam is transmitted to the phase separation system through the spectroscopic component. The phase separation system is suitable for analyzing the interference light beam and obtaining the surface morphology of the object to be detected.
在本發明的一實施例中,上述之分光組件包括第一分光元件與第二分光元件,第一分光元件設置於光源系統與第二分光元件之間,第二分光元件設置於第一分光元件與相位差膜之間,相位差膜設置於第二分光元件與待檢測物之間。 In one embodiment of the present invention, the above-mentioned spectroscopic component includes a first spectroscopic element and a second spectroscopic element, the first spectroscopic element is arranged between the light source system and the second spectroscopic element, the second spectroscopic element is arranged between the first spectroscopic element and the phase difference film, and the phase difference film is arranged between the second spectroscopic element and the object to be detected.
在本發明的一實施例中,上述之光束適於通過第一分光元件且傳遞至第二分光元件,並經由第二分光元件轉換為反射光束與穿透光束,當穿透光束完成第二次相位延遲後傳遞至第二分光元件,接著干涉光束經第一分光元件傳遞至解相系統。 In one embodiment of the present invention, the above-mentioned light beam is suitable for passing through the first beam splitter and transmitted to the second beam splitter, and is converted into a reflected light beam and a transmitted light beam by the second beam splitter. After the transmitted light beam completes the second phase delay, it is transmitted to the second beam splitter, and then the interference light beam is transmitted to the dephasing system through the first beam splitter.
在本發明的一實施例中,上述之表面形貌量測裝置更包括擴束組件,擴束組件包括濾波器、第一透鏡和第二透鏡,其中濾波器設置於光源系統與第一分光元件之間,第一透鏡設置於第一分光元件與第二分光元件之間,第二透鏡設置於第一分光元件與解相系統之間且位於干涉光束的傳遞路徑上。 In one embodiment of the present invention, the surface morphology measuring device further includes a beam expansion component, which includes a filter, a first lens and a second lens, wherein the filter is disposed between the light source system and the first beam splitter, the first lens is disposed between the first beam splitter and the second beam splitter, and the second lens is disposed between the first beam splitter and the dephasing system and is located on the transmission path of the interference beam.
在本發明的一實施例中,上述之濾波器為空間濾波器。 In one embodiment of the present invention, the above-mentioned filter is a spatial filter.
在本發明的一實施例中,上述之表面形貌量測裝置更包括擴束組件,擴束組件包括第一透鏡和第二透鏡,其中第一透鏡設置於光源與第一分光元件之間,第二透鏡設置於第一透鏡與第一分光元件之間。 In one embodiment of the present invention, the surface topography measurement device further includes a beam expansion assembly, which includes a first lens and a second lens, wherein the first lens is disposed between the light source and the first beam splitter, and the second lens is disposed between the first lens and the first beam splitter.
在本發明的一實施例中,上述之光源系統包括雷射光源,適於提供光束。 In one embodiment of the present invention, the above-mentioned light source system includes a laser light source suitable for providing a light beam.
在本發明的一實施例中,上述之光源系統更包括線偏振片,設置於雷射光源與分光組件之間。 In one embodiment of the present invention, the above-mentioned light source system further includes a linear polarizer disposed between the laser light source and the spectroscopic component.
在本發明的一實施例中,上述之解相系統包括波片與偏振相機,其中偏振相機適於擷取干涉光束的四種偏振態。 In one embodiment of the present invention, the above-mentioned dephasing system includes a wave plate and a polarization camera, wherein the polarization camera is suitable for capturing four polarization states of the interfering light beam.
在本發明的一實施例中,上述之波片為四分之一波片。 In one embodiment of the present invention, the wave plate mentioned above is a quarter wave plate.
本發明因採用相位差膜使穿透光束經過相位延遲,讓反射光束與穿透光束的相位差不同,並搭配使用解相系統擷取不同偏振態的干涉條紋影像,因此測量過程中可以不需要使用高昂的設備移動待檢測物,提升量測速度並降低設備成本。 The present invention uses a phase difference film to delay the penetrating light beam, so that the phase difference between the reflected light beam and the penetrating light beam is different, and a phase resolution system is used to capture interference fringe images of different polarization states. Therefore, during the measurement process, it is not necessary to use expensive equipment to move the object to be tested, thereby improving the measurement speed and reducing the equipment cost.
為讓本發明之上述和其他目的、特徵和優點能更明顯易懂,下文特舉實施例,並配合所附圖式,作詳細說明如下。 In order to make the above and other purposes, features and advantages of the present invention more clearly understood, the following is a detailed description of the embodiments with the accompanying drawings.
100、100a:表面形貌量測裝置 100, 100a: surface morphology measurement device
110:光源系統 110: Light source system
111:雷射光源 111:Laser light source
112:線偏振片 112: Linear polarizer
120:分光組件 120: Spectroscopic component
121:第一分光元件 121: First spectroscopic element
122:第二分光元件 122: Second spectroscopic element
130:相位差膜 130: Phase difference film
140:解相系統 140: Phase Decomposition System
141:波片 141: Wave plate
142:偏振相機 142: Polarization camera
150、150a:擴束組件 150, 150a: expansion assembly
151、151a:第一透鏡 151, 151a: First lens
152、152a:第二透鏡 152, 152a: Second lens
153:濾波器 153:Filter
200:待檢測物 200: Object to be tested
H:表面形貌 H: Surface morphology
L:光束 L: beam
L1:反射光束 L1: reflected beam
L2、L2'、I2":穿透光束 L2, L2', I2": penetrating beam
M:反射鏡 M: Reflector
圖1為本發明一實施例的表面形貌量測裝置的配置示意圖。 Figure 1 is a schematic diagram of the configuration of a surface morphology measurement device according to an embodiment of the present invention.
圖2為本發明另一實施例的表面形貌量測裝置的配置示意圖。 Figure 2 is a schematic diagram of the configuration of a surface morphology measurement device of another embodiment of the present invention.
圖1為本發明一實施例的表面形貌量測裝置的配置示意圖。請參考圖1,本實施例的表面形貌量測裝置100適於對待檢測物200進行表面形貌量測,表面形貌量測裝置100包括光源系統110、分光組件120、相位差膜130和解相系統140,其中光源系統110適於提供光束L。分光組件120設置於光源系統110一側。相位差膜130設置於分光組件120及待檢測物200之間。解相系統140設置於分光組件120一側。其中光源系統110提供的光束L適於通過分光組件120轉換為反射光束L1與穿透光束L2,穿透光束L2適於通過相位差膜130進行第一次相位延遲後傳遞至待檢測物200,並適於被待檢測物200反射後,再次通過相位差膜130進行第二次相位延遲後傳遞至分光組件120,經過第一次相位延遲及第二次相位延遲的穿透光束L2"通過分光組件120,並與反射光束L1干涉形成干涉光束Li(亦即L2"和L1干涉形成Li),干涉光束Li經分光組件120傳遞至解相系統140,解相系統140適於分析干涉光束Li,並獲得待檢測物200的表面形貌H。
FIG1 is a schematic diagram of the configuration of a surface morphology measuring device of an embodiment of the present invention. Referring to FIG1 , the surface
具體來說,本實施例的表面形貌量測裝置100的光源系統110提供的光束L為線偏振光,當光束L通過分光組件120轉換成反射光束L1和穿透
光束L2,其中反射光束L1自分光組件120反射後傳遞至解相系統140,穿透光束L2則在穿過分光組件120後適於通過相位差膜130進行第一次相位延遲,形成經第一次相位延遲的穿透光束L2'。穿透光束L2'傳遞至待檢測物200的表面後被反射,此時待檢測物200的表面形貌H的資訊形成於被待檢測物200反射的穿透光束L2',接著穿透光束L2'再次通過相位差膜130進行第二次相位延遲形成穿透光束L2"。亦即,相較於反射光束L1,穿透光束L2"穿透兩次相位差膜130並被待檢測物200反射,因此穿透光束L2"不僅和反射光束L1的相位差不同,且穿透光束L2"也帶有待檢測物200表面形貌H的資訊(亦即待檢測物200改變穿透光束L2"的相位)。接續前述,穿透光束L2"通過分光組件120後與被分光組件120反射的反射光束L1干涉形成干涉光束Li,干涉光束Li再經分光組件120傳遞至解相系統140。
Specifically, the light beam L provided by the
另一方面,本實施例的相位差膜130例如是四分之一波片,使得通過相位差膜130的光會延遲45°的相位,因此經過兩次相位延遲的穿透光束L2"因相位差膜130延遲90°的相位。需要說明的是,由於穿透光束L2"和反射光束L1之間有相位差,因此待檢測物200的表面形貌H的資訊會形成於干涉光束Li的相位中,如此一來本實施例的表面形貌量測裝置100即可藉由解相裝置140將待檢測物200所引入的相位分析出來,而得到待檢測物200的表面形貌H。
On the other hand, the
詳細來說,解相系統140適於擷取干涉光束Li的光強度,其中,上述α為解相系統140的偏振方向,為待檢測物200引入的相位,其中本實施例中的解相系統140的偏振方向例如有4個,例如分別為0°、45°、90°和135°。接著經由解相方程式
求得相位差分布,再將上述計算求得的帶入方程式中即可求得待檢測物200的表面形貌H的資訊,上述λ為光束的波長,h(x,y)為待檢測物200表面各點的相對高度,亦即表面形貌H。
Specifically, the
在本實施例的表面形貌量測裝置100中,因採用相位差膜130使穿透光束L2進行相位延遲,讓反射光束L1與經過兩次相位延遲的穿透光束L2"的相位差不同,並搭配使用解相系統140擷取干涉光束Li在不同偏振態的干涉條紋影像,在測量過程中可以不需要使用高昂的設備移動待檢測物200,因此可提升量測速度並降低設備成本。
In the surface
請續參圖1所示,本實施例的光源系統110例如包括雷射光源111及線偏振片112,雷射光源111適於提供光束L。線偏振片112例如設置於雷射光源111與分光組件120之間,使雷射光源111提供的光束L變成線偏振光,但本發明不以此為限。在另一實施例中,光源系統110可以直接提供為線偏振光的光束L。本實施例的光源系統110例如更包括反射鏡M設置於雷射光源111與線偏振片112之間,但本發明不對此做具體限制。此外,本實施例的解相系統140例如包括波片141與偏振相機142,其中偏振相機142例如適於擷取干涉光束Li的四種偏振態,波片141例如為四分之一波片,但本發明不以此為限。上述的偏振相機142擷取的四種偏振態例如是干涉光束Li分別在0°、45°、90°和135°的偏振態,但本發明不對此做具體限制。
Continuing with FIG. 1 , the
請繼續參考圖1,本實施例的分光組件120例如包括第一分光元件121與第二分光元件122,第一分光元件121例如設置於光源系統110與第二分光元件122之間,第二分光元件122例如設置於第一分光元件121與相位差膜130之間,相位差膜130例如設置於第二分光元件122與待檢測物200之
間。本實施例的光束L適於通過第一分光元件121且傳遞至第二分光元件122,並經由第二分光元件122轉換為反射光束L1與穿透光束L2,當穿透光束L2"完成第二次相位延遲後傳遞至第二分光元件122,接著干涉光束Li經第一分光元件121傳遞至解相系統140。
Please continue to refer to FIG. 1 . The
具體來說,本實施例的第一分光元件121可以使光束L通過並傳遞至第二分光元件122,並讓干涉光束Li能夠經由第一分光元件121傳遞至解相系統140。上述的第一分光元件121可以是分光鏡,但本發明不對此做具體限制。本實施例的第二分光元件122主要用於將光束L轉換為反射光束L1和穿透光束L2,並適於讓穿透光束L2"通過。上述的第二分光元件122例如是半反射鏡,但本發明不以此為限。需要說明的是,本實施例中第二分光元件122和相位差膜130例如為分開的,但本發明不對此做具體限制。在本發明另一實施例中,第二分光元件122和相位差膜130可以是貼合在一起的(圖未繪示),此時光束L傳遞路徑和圖1相似,亦即光束L經由第二分光元件122轉換成反射光束L1和穿透光束L2之後,穿透光束L2隨即通過相位差膜130進行第一次相位延遲形成穿透光束L2',後續路徑同圖1,在此不再贅述。
Specifically, the
本實施例表面形貌量測裝置100可以更包括擴束組件150,擴束組件150例如包括濾波器153、第一透鏡151和第二透鏡152,其中濾波器153例如設置於光源系統110與第一分光元件121之間,第一透鏡151例如設置於第一分光元件121與第二分光元件122之間,第二透鏡152例如設置於第一分光元件121與解相系統140之間且位於干涉光束Li的傳遞路徑上。上述之濾波器153例如為空間濾波器,但本發明不對此做具體限制。具體來說,藉由
設置濾波器153與第一透鏡151,使得光束L擴束,亦即讓光束L的照射範圍變大,因此當穿透光束L2'傳遞至待檢測物200時能夠大範圍照射待檢測物200,有助於表面形貌量測裝置100可以分析大範圍內多個點的表面形貌H。另外,本實施例中的第二透鏡152可以將從第一分光元件121傳遞至解相系統140之間的干涉光束Li變為準直,但本發明不對此做具體限制。
The surface
圖2為本發明另一實施例的表面形貌量測裝置的配置示意圖,如圖2所示,第一分光元件121與解相系統140之間可以不設置如圖1的第二透鏡152。換句話說,在圖2所示的實施例中,擴束組件150a例如包括第一透鏡151a和第二透鏡152a,其中第一透鏡151a例如設置於光源系統110與第一分光元件121之間,第二透鏡152a例如設置於第一透鏡151a與第一分光元件121之間。詳言之,本實施例使光束L在通過第一分光元件121之前,透過第一透鏡151a和第二透鏡152a先將光束L擴束,因此當光束L轉換為反射光束L1與穿透光束L2,乃至於形成干涉光束Li並傳遞至解相系統140時,反射光束L1、穿透光束L2、L2'、L2"和干涉光束Li不會聚焦,因而在此實施例中無須再於解相系統140前設置使干涉光束Li變成準直的光學元件(如圖1中的元件標號152)。
FIG2 is a schematic diagram of the configuration of a surface topography measurement device according to another embodiment of the present invention. As shown in FIG2 , the
綜合上述,本發明因採用相位差膜使穿透光束經過相位延遲,讓反射光束與穿透光束的相位差不同,並搭配使用解相系統擷取不同偏振態的干涉條紋影像,因此測量過程中可以不需要使用高昂的設備移動待檢測物,提升量測速度並降低設備成本。 In summary, the present invention uses a phase difference film to delay the penetrating light beam, so that the phase difference between the reflected light beam and the penetrating light beam is different, and uses a phase separation system to capture interference fringe images of different polarization states. Therefore, during the measurement process, it is not necessary to use expensive equipment to move the object to be tested, thereby improving the measurement speed and reducing the equipment cost.
雖然本發明已以實施例揭露如上,然其並非用以限定本發明,本發明所屬技術領域中具有通常知識者,在不脫離本發明之精神和範圍內, 當可作些許之更動與潤飾,因此本發明之保護範圍當視後附之申請專利範圍所界定者為準。 Although the present invention has been disclosed as above by the embodiments, it is not intended to limit the present invention. Those with common knowledge in the technical field to which the present invention belongs may make some changes and modifications within the spirit and scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the scope defined in the attached patent application.
100:表面形貌量測裝置 100: Surface morphology measurement device
110:光源系統 110: Light source system
111:雷射光源 111:Laser light source
112:線偏振片 112: Linear polarizer
120:分光組件 120: Spectroscopic component
121:第一分光元件 121: First spectroscopic element
122:第二分光元件 122: Second beam splitter element
130:相位差膜 130: Phase difference film
140:解相系統 140: Phase Decomposition System
141:波片 141: Wave plate
142:偏振相機 142: Polarization camera
150:擴束組件 150:Expansion component
151:第一透鏡 151:First lens
152:第二透鏡 152: Second lens
153:濾波器 153:Filter
200:待檢測物 200: Object to be tested
H:表面形貌 H: Surface morphology
L:光束 L: beam
L1:反射光束 L1: reflected beam
L2、L2'、L2":穿透光束 L2, L2', L2": Penetrating beam
Li:干涉光束 Li : Interference beam
M:反射鏡 M: Reflector
Claims (8)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW112137546A TWI872727B (en) | 2023-09-28 | 2023-09-28 | Surface topography measuring device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW112137546A TWI872727B (en) | 2023-09-28 | 2023-09-28 | Surface topography measuring device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TWI872727B true TWI872727B (en) | 2025-02-11 |
| TW202514065A TW202514065A (en) | 2025-04-01 |
Family
ID=95557263
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW112137546A TWI872727B (en) | 2023-09-28 | 2023-09-28 | Surface topography measuring device |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TWI872727B (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20080180689A1 (en) * | 2003-03-24 | 2008-07-31 | Gernot Brasen | Interferometric Height Measurement |
| US20090153873A1 (en) * | 2005-12-07 | 2009-06-18 | Kabushiki Kaisha Topcon | Optical Image Measuring Apparatus |
| US20120140235A1 (en) * | 2010-12-06 | 2012-06-07 | Cheng-Chung Lee | Method for measuring the film element using optical multi-wavelength interferometry |
| TW201504596A (en) * | 2013-07-18 | 2015-02-01 | Univ Nan Kai Technology | An interferometric configuration based of synchronous measurement of dynamic surface profile |
| US20170229829A1 (en) * | 2012-05-22 | 2017-08-10 | Kla-Tencor Corporation | Inspection System Using 193nm Laser |
| US20220187161A1 (en) * | 2019-04-24 | 2022-06-16 | Lambda-X | Deflectometry Measurement System |
-
2023
- 2023-09-28 TW TW112137546A patent/TWI872727B/en active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20080180689A1 (en) * | 2003-03-24 | 2008-07-31 | Gernot Brasen | Interferometric Height Measurement |
| US20090153873A1 (en) * | 2005-12-07 | 2009-06-18 | Kabushiki Kaisha Topcon | Optical Image Measuring Apparatus |
| US20120140235A1 (en) * | 2010-12-06 | 2012-06-07 | Cheng-Chung Lee | Method for measuring the film element using optical multi-wavelength interferometry |
| US20170229829A1 (en) * | 2012-05-22 | 2017-08-10 | Kla-Tencor Corporation | Inspection System Using 193nm Laser |
| TW201504596A (en) * | 2013-07-18 | 2015-02-01 | Univ Nan Kai Technology | An interferometric configuration based of synchronous measurement of dynamic surface profile |
| US20220187161A1 (en) * | 2019-04-24 | 2022-06-16 | Lambda-X | Deflectometry Measurement System |
Also Published As
| Publication number | Publication date |
|---|---|
| TW202514065A (en) | 2025-04-01 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US7808648B2 (en) | Method and device for optical determination of physical properties of features, not much larger than the optical wavelength used, on a test sample | |
| TWI671501B (en) | Method and white light interferometer for characterizing a sample, method for processing white light interferometric data from a sample with a patterned structure, and white light interferometer for measuring a sample with a patterned structure | |
| US7061623B2 (en) | Interferometric back focal plane scatterometry with Koehler illumination | |
| US6188482B1 (en) | Apparatus for electronic speckle pattern interferometry | |
| US10635049B2 (en) | Ellipsometry device and ellipsometry method | |
| CN110118537B (en) | Deformation and strain synchronous measurement system and measurement method based on speckle interference | |
| KR102902636B1 (en) | Ellipsometer and inspection device for inspecting semiconductor device | |
| CN104748835A (en) | Interference-mount separating type nonlinear error correcting method and device for laser interference vibration tester | |
| JP2000510951A (en) | Optical measurement | |
| CN114136976A (en) | Polarization coaxial illumination laser shearing speckle interference measurement system and measurement method thereof | |
| CN108982510A (en) | Utilize 90 ° of optics mixer Surface profiling dynamic detection systems and method | |
| CN205538736U (en) | Optical element surface defect detection device based on transmission dual-wavelength synthetic aperture holography | |
| Shimizu et al. | Measurement of the apex angle of a small prism by an oblique-incidence mode-locked femtosecond laser autocollimator | |
| CN107923735B (en) | Method and apparatus for deriving the topography of an object surface | |
| TWI872727B (en) | Surface topography measuring device | |
| EP2535679A1 (en) | Improvements in or relating to interferometry | |
| JP2000329535A (en) | Simultaneous measurement system for phase shift interference fringes | |
| CN110926360A (en) | A device for measuring free-form surfaces with full-field heterodyne phase-shifting | |
| KR100769214B1 (en) | Apparatus for measuring light beam | |
| US7466426B2 (en) | Phase shifting imaging module and method of imaging | |
| CN205538708U (en) | Optical component high depth of field surface defect detection device for transmission dual-wavelength holography | |
| US20090262335A1 (en) | Holographic scatterometer | |
| CN116625269A (en) | A Method for Absolute Detection of Plane Shape of Large-aperture Optical Components | |
| Fu et al. | Comparative analysis of grating reconstruction: deep learning versus Levenberg-Marquardt methods | |
| CN114577111A (en) | Surface shape detection system and detection method |






