TWI867717B - Pressing mechanism, testing mechanism, and processing machine - Google Patents

Abstract

The pressing mechanism includes a supporter, a pressing member, and a contact structure. The supporter drives the pressing member and the contact structure to move along a pressing axis. The contact structure has a contact member and a deformation control unit. The contact member is disposed on the pressing member and has a deformation area having a contact face. The deformation control unit softens or solidifies the deformation area according to the temperature. When the deformation area is softened, the contact face contacts the arc shaped top face of the electronic component. When the deformation area is solidified, the contact face can press the electronic component under a predetermined pressure. Thereby, the pressing member and the contact structure make the electronic component be pressed evenly to undergo the testing process. Thus, the accuracy of the testing process is improved.

Description

Crimping machine, testing device and operating machine

The present invention provides a crimping mechanism, a testing device and an operating machine for uniformly testing electronic components to improve the test quality.

Nowadays, after the electronic components are manufactured, they must be tested by testing equipment to eliminate defective products. The testing equipment uses a tester to hold and test the electronic components, and uses the lower pressing fixture of the crimper to press the top surface of the electronic components with a preset lower pressure to perform the testing operation. However, the top surfaces of some electronic components are non-planar shapes such as concave arcs or convex arcs. When the crimper uses a lower pressing fixture with a flat bottom surface to press an electronic component with a concave arc or convex arc top surface, the bottom surface of the lower pressing fixture cannot fit the top surface of the electronic component at all, resulting in the crimper being unable to apply force evenly to press the electronic component, causing the electronic component to be unevenly stressed, causing some contacts of the electronic component to be unable to accurately contact the probe of the tester, thereby affecting the test accuracy and quality.

The first object of the present invention is to provide a crimping mechanism, comprising a mounting device, at least one crimping device and at least one joining structure; the mounting device is provided with the crimping device, the crimping device is provided with at least one connecting surface, the joining structure is provided with at least one joining piece and at least one control deformation unit, the joining piece is mounted on the connecting surface of the crimping device , and is provided with a deformation zone with a joining surface for crimping electronic components, the control deformation unit can soften or solidify the deformation zone of the joining piece, when the deformation zone softens and deforms, the joining surface is attached to the curved top surface of the electronic component, when the deformation zone is solidified and fixed, the joining surface is pressed against the electronic component with a preset lower pressure; so as to The crimper is combined with the joint structure to make the electronic components evenly pressurized during the test, thereby improving the test yield of the electronic components.

The second object of the present invention is to provide a testing device, including a testing mechanism and the crimping mechanism of the present invention; the testing mechanism is provided with at least one tester for testing electronic components; the crimping mechanism of the present invention is provided with a mounting device, at least one crimper and at least one joining structure for crimping electronic components, so that the electronic components are uniformly pressurized to perform testing operations, thereby improving the test yield.

The third object of the present invention is to provide an operating machine, including a machine, a feeding device, a receiving device, a testing device of the present invention, a conveying device and a central control device. The feeding device is arranged on the machine and is provided with at least one feeder for accommodating at least one electronic component to be tested; the receiving device is arranged on the machine and is provided with at least one receiver for accommodating at least one tested electronic component; the testing device of the present invention is arranged on the machine and is provided with a testing mechanism and a crimping mechanism for crimping and testing electronic components; the conveying device is arranged on the machine and is provided with at least one conveyor for conveying electronic components; the central control device controls and integrates the actions of each device to perform automated operations.

In order to enable you to have a further understanding of the present invention, a preferred embodiment is given below with accompanying drawings:

Please refer to FIG. 1 , which shows a first embodiment of the crimping mechanism of the present invention. The crimping mechanism includes a mounting device, at least one crimping device and at least one coupling structure.

The mounting device is a fixed configuration or a movable configuration. For example, the mounting device is a fixed frame, so that the tester (not shown) can be relatively displaced toward the mounting device; for example, the mounting device is driven by a mounting driver to displace in at least one direction, so that the mounting device can be relatively displaced toward the tester. Furthermore, the mounting driver is a cylinder, a linear motor, or includes a motor and at least one transmission group, and the transmission group is a pulley group or a screw seat group. In this embodiment, the mounting device is a moving arm 11, which is driven by a mounting driver (not shown) to displace along the compression axis (such as the Z axis).

At least one crimper 12 is mounted on the mounting device and is provided with at least one connection surface. Furthermore, the crimper is provided with at least one pressing fixture, and the bottom of the pressing fixture has at least one connection surface. According to the operation requirements, the pressing fixture can be fixed or movable, for example, a floating structure is provided inside the crimper, and the floating structure drives the pressing fixture to perform floating buffer displacement. In this embodiment, the crimper 12 is mounted on the moving arm 11, and can be driven by the moving arm 11 to perform Z-direction displacement. A floating structure (not shown) is provided inside the crimper 12, and the floating structure is used for the pressing fixture 121 to perform Z-direction floating displacement, and the bottom surface of the pressing fixture 121 is provided with a connection surface 122.

According to the operation requirements, the crimper further includes a temperature control unit (not shown), which can be arranged above the crimper, on the crimper or on the lower pressing fixture, and is provided with at least one heating element, cooling chip or a seat with fluid, so that the electronic components can perform testing operations in a simulated future application temperature environment.

The joint structure is provided with at least one joint member 131 and at least one control deformation unit. The joint member 131 is provided with a receiving surface for being assembled on the connection surface 122 of the crimper 12, and is provided with a deformation zone with a joint surface. The joint surface is provided for crimping the electronic component. The control deformation unit can soften or solidify the deformation zone of the joint member. When the deformation zone is softened and deformed, the joint surface is attached to the curved top surface of the electronic component, and when the deformation zone is solidified and fixed, the joint surface is pressed against the electronic component with a preset lower pressure.

Depending on the work requirements, the control deformation unit can make the deformation zone soften or solidify with the temperature change. Depending on the material of the joint, the control deformation unit can use a temperature controller (such as a heater, cooler or cooling chip), an illuminator or an electric power supplier, etc., so that the deformation zone of the joint can be softened or solidified in different forms according to the work sequence.

According to the operation requirements, the crimper 12 and the joint piece are made of different materials.

According to the operation requirements, the deformation control unit can directly configure at least one temperature controller on the joint to perform the operation of heating or cooling the deformation zone; or independently configure a temperature controller or an illuminator outside the joint to perform the operation of heating or cooling the deformation zone; or at least one temperature controller is respectively set on the joint and outside the joint, and multiple temperature controllers respectively perform the operation of heating or cooling the deformation zone; it is not limited to this embodiment.

In this embodiment, the joint member 131 of the joint structure is made of alloy material (e.g., low-temperature alloy ), which is different from the material of the pressing fixture 121. The top surface of the joint member 131 is a receiving surface 1311 for being assembled on the connecting surface 122 of the pressing fixture 121 of the crimper 12, so that the joint member 131 can be synchronously displaced with the pressing fixture 121; the joint member 131 is provided with at least one deformation zone 1312 far away from the receiving surface 1311, and the bottom surface of the deformation zone 1312 is used as a joint surface 1313, and the joint surface 1313 can be pressed and connected with electronic components (not shown) with a preset downward pressure. However, the arc size of the top surface of the electronic component is relatively small. Relatively speaking, the arc area size of the deformation zone 1312 of the joint member 131 is relatively small, that is, the area size of the joint surface 1313 to be softened is relatively small, and it can be softened and deformed quickly. According to the type of electronic component, the deformation zone 1312 of the joint member 131 can be flat before it is softened and deformed, and can also be pre-formed in a slightly convex arc shape or a slightly concave arc shape, so as to facilitate rapid deformation and fit the arc-shaped top surface of the electronic component. In this embodiment, the deformation zone 1312 of the joint member 131 is slightly convex arc-shaped before it is softened and deformed, so as to facilitate the application of fitting and pressing an electronic component with a concave arc-shaped top surface.

The control deformation unit is configured with a plurality of temperature controllers for cooling chips 132 in the deformation zone 1312 of the joint 131. The plurality of cooling chips 132 can be switched according to the operation sequence to heat or cool the deformation zone 1312 to soften or solidify, so that the joint surface 1313 of the deformation zone 1312 is softened and deformed to completely fit the concave arc-shaped top surface of the electronic component; or the joint surface 1313 of the deformation zone 1312 is solidified and fixed to press the electronic component under a preset pressure, so that the electronic component is evenly pressed. However, the softening referred to in this case does not require the deformation zone 1312 of the joint 131 to be liquefied, but only requires the joint surface 1313 of the deformation zone 1312 to be softened to the point where it can be deformed and fit along with the shape of the curved arc-shaped top surface of the electronic component.

According to the operation requirements, the cooling chip 132 can also be arranged in the non-deformation area 1312, which is not limited to this embodiment.

Please refer to Figures 2 to 5. The crimping mechanism of the present invention is applied to a test device 10. The test device 10 includes a test mechanism and a crimping mechanism. The test mechanism is provided with at least one tester for testing electronic components. The crimping mechanism is provided with a mounting device, at least one crimping device and at least one joint structure for crimping electronic components. In this embodiment, the tester of the test mechanism includes an electrically connected circuit board 141 and a test seat 142. The test seat 142 has a plurality of probes and is used to hold and test electronic components. A conveyor (not shown) moves the electronic component 20 into the test seat 142 of the test mechanism, so that the contact 21 of the electronic component 20 faces downward and contacts the probe of the test seat 142, and the concave arc-shaped top surface 22 faces upward. The crimping mechanism is arranged above the testing mechanism, and the bonding surface 1313 of the bonding member 131 of the bonding structure faces the electronic component 20 on the testing seat 142.

In order to make the bonding surface 1313 of the bonding member 131 of the press-fit mechanism completely fit the top surface 22 of the electronic component 20, before the bonding member 131 presses the electronic component 20, the bonding structure first heats the deformation zone 1312 with a plurality of cooling chips 132 of the control deformation unit, so that the bonding surface 1313 of the deformation zone 1312 is slightly softened to a state that can be deformed by pressure; the press-fit mechanism is mounted with a driver (not shown in the figure) (out) drives the moving arm 11 to drive the crimper 12 and the joint member 131 to move downward in the Z direction, so that the slightly softened joint surface 1313 of the joint member 131 fits the concave arc-shaped top surface 22 of the electronic component 20. The joint surface 1313 is compressed and deformed along the concave arc curve of the top surface 22, so that the joint surface 1313 of the joint member 131 and the top surface 22 of the electronic component 20 have a matching arc.

The crimping mechanism can control the plurality of cooling chips 132 of the deformation unit to solidify the deformation zone 1312 of the bonding member 131 when the bonding member 131 is attached to or separated from the top surface 22 of the electronic component 20 according to the operation requirements, which is not limited to this embodiment. In this embodiment, the crimping mechanism drives the moving arm 11 with a mounting driver (not shown) to drive the crimper 12 and the bonding member 131 to move upward in the Z direction, so that the bonding member 131 is separated from the top surface 22 of the electronic component 20, and the plurality of cooling chips 132 of the deformation unit are controlled to change and cool the deformation zone 1312 of the bonding member 131, so that the bonding surface 1313 of the deformation zone 1312 is solidified.

The crimping mechanism uses a mounting driver (not shown) to drive the moving arm 11 to drive the crimper 12 and the connector 131 to move downward in the Z direction, so that the pressing fixture 121 below the crimper 12 presses the electronic component 20 on the test socket 142 through the connector 131 with a preset downward pressure. When the bonding surface 1313 of the connector 131 is completely in contact with the top surface 22 of the electronic component 20, the electronic component 20 can evenly withstand the downward pressure, so that the contact 21 of the electronic component 20 can electrically contact the probe of the test socket 142 to effectively perform the test operation, thereby improving the yield rate of the electronic component.

Please refer to Figure 6, the second embodiment of the crimping mechanism of the present invention is different from the first embodiment in that the control deformation unit of the joint structure independently configures a plurality of temperature controllers outside the joint 131, and the plurality of temperature controllers and the joint 131 are relatively displaced according to the operation requirements; further, the control deformation unit is provided with at least one deformation driver to drive the plurality of temperature controllers to displace in at least one direction. In this embodiment , multiple temperature controllers are heaters 133 and coolers 134, and are driven to move by multiple deformation drivers 135 and 136. The deformation unit is controlled according to the actuation sequence. A deformation driver 135 drives the heater 133 to move to the joint 131, so that the heater 133 heats the deformation zone 1312 of the joint 131, so that the joint surface 1313 of the deformation zone 1312 softens and can be deformed along the curvature of the top surface of the electronic component, and another deformation driver 136 drives the cooler 134 to move to the joint 131, so that the cooler 134 cools the deformation zone 1312 of the joint 131, so that the joint surface 1313 of the deformation zone 1312 is solidified and fixed for pressing the electronic component.

Please refer to Figures 1 to 5 and Figure 7. The test device 10 of the present invention is applied to an electronic component processing machine, which includes a machine 30, a feeding device 40, a receiving device 50, a test device 10, a conveying device 60 and a central control device (not shown in the figure); the feeding device 40 is mounted on the machine 30 and is provided with at least one feeder to accommodate at least one electronic component 20 to be tested; the receiving device 50 is mounted on the machine 30 and is provided with at least one receiving device to accommodate at least one electronic component 20 that has been tested; the test device 10 of the present invention is arranged at The machine 30 includes a testing mechanism and a crimping mechanism of the present invention. The testing mechanism is provided with at least one tester for testing the electronic component 20. The crimping mechanism is provided with a mounting device, at least one crimping device 12 and at least one joining structure for crimping the electronic component 20 of the tester. The conveying device 60 is mounted on the machine 30 and is provided with at least one conveyor for conveying the electronic component 20. In this embodiment, the conveying device 60 uses a first conveyor 61 to take out the electronic component 20 to be tested from the feeding device 40 and transfer it to the second conveyor 62, and the third conveyor 64 is used to transfer the electronic component 20 to the feeding device 40. The conveyor 63 takes out the electronic component 20 to be tested from the second conveyor 62 and transfers it to the test seat 142 of the test device 10. The moving arm 11 of the test device drives the crimper 12 and the joint structure to move in the Z direction, and cooperates with the control deformation unit of the joint structure to perform softening and curing actions on the joint member 131 according to the action sequence, so that the joint surface 1313 of the joint member 131 is softened and deformed to completely fit the curve of the top surface 22 of the electronic component 20, and the joint surface 1313 is cured and shaped so that it can be crimped to the top surface 22 of the electronic component 20. The surface 22 makes the electronic component 20 evenly pressurized and performs the test operation on the test seat 142; after the test is completed, the third conveyor 63 takes out the tested electronic component 20 and transfers it to the second conveyor 62, so that the first conveyor 61 can take out the tested electronic component 20 from the second conveyor 62, and according to the test results, the tested electronic component is transported to the receiving device 50 for classification and storage; the central control device (not shown) is used to control and integrate the actions of each device to perform automated operations and achieve the practical benefit of improving the operating efficiency.

10: Test equipment

11: Mobile arm

12: Crimper

121: Press down fixture

122:Connection surface

131:Joint

1311: Mounting surface

1312: Deformation Zone

1313:Joint surface

132: Cooling chip

133: Heater

134: Cooler

135, 136: Deformation drive

141: Circuit board

142: Test seat

20: Electronic components

21: Contact

22: Top

30: Machine

40: Feeding device

50: Material receiving device

60: Transport device

61: First conveyor

62: Second conveyor

63: The third conveyor

Figure 1: Schematic diagram of the first embodiment of the crimping mechanism of the present invention. Figures 2 to 5: Schematic diagrams of the crimping mechanism used in a test device. Figure 6: Schematic diagram of the second embodiment of the crimping mechanism of the present invention. Figure 7: Schematic diagram of the operating machine.

11: Mobile arm

12: Crimper

131:Joint parts

1312: Deformation zone

1313:Joint surface

132: Refrigeration chip

20: Electronic components

22: Top

Claims (8)

A crimping mechanism includes: a mounting device; at least one crimping device: mounted on the mounting device and provided with at least one connecting surface; at least one joint structure: provided with at least one joint piece and at least one controlled deformation unit, the joint piece is mounted on the connecting surface of the crimping device and provided with a deformation zone with a joint surface, the joint surface is used to fit and crimp electronic components, the controlled deformation unit can soften or solidify the deformation zone with temperature changes, and a plurality of temperature controllers are provided on the outside of the joint piece, the plurality of temperature controllers are used to heat or cool the deformation zone respectively, when the deformation zone softens and deforms, the joint surface fits the curved top surface of the electronic component, and when the deformation zone is solidified, the joint surface is pressed to the electronic component. As described in claim 1, the compression mechanism, the deformation control unit is provided with at least one temperature controller inside the joint to heat or cool the deformation zone of the joint. As described in claim 1, the compression mechanism, the control deformation unit is provided with at least one deformation driver to drive the plurality of temperature controllers to move in at least one direction. In the crimping mechanism described in claim 1, the crimper and the joint are made of different materials. As in the crimping mechanism described in claim 1, the joining surface of the joining member is flat or curved before softening. As in the crimping mechanism described in claim 1, the mounting device is driven by a mounting actuator to move in at least one direction. A testing device, comprising: a testing mechanism: at least one tester is provided for testing electronic components; at least one crimping mechanism as described in claim 1: for crimping the electronic component on the tester. A processing machine comprises: a machine; a feeding device: arranged on the machine and provided with at least one feeder for accommodating at least one electronic component to be tested; a receiving device: arranged on the machine and provided with at least one receiver for accommodating at least one electronic component that has been tested; at least one testing device as described in claim 7: arranged on the machine for testing electronic components; a conveying device: arranged on the machine and provided with at least one conveyor for conveying electronic components; a central control device: for controlling and integrating the actions of various devices to perform automated operations.

Images