TWI867716B - Electronic component, intermediary mechanism, testing device, and processing machine - Google Patents

Abstract

The present invention provides an electronic component and an intermediary mechanism. The top of the base of the electronic component is arc shaped. The intermediary mechanism has a supporter to receive the base of the electronic component, a coating member to spread an intermediary layer on the top of the base, and a solidification member to solidify the intermediary layer having flat support face to give the electronic component the intermediary layer. Thereby, the support face of the intermediary layer can be used to contact the pressing device to be pressed by the pressing device so that the electronic component can be pressed evenly while testing. Thus, the accuracy of testing is improved.

Description

Electronic components, intermediaries, test equipment and operating machines

The present invention provides an electronic component with an intermediate layer, so that the electronic component can be evenly stressed during testing, thereby improving the test quality of the electronic component, intermediate mechanism, test device and operating machine.

Nowadays, after the electronic components are manufactured, they must be tested by testing equipment to eliminate defective products. The testing equipment uses a tester to hold and test the electronic components, and uses the lower pressing fixture of the crimper to press the top surface of the electronic components with a preset lower pressure to perform the testing operation. However, the top surfaces of some electronic components are non-planar shapes such as concave arcs or convex arcs. When the crimper uses a lower pressing fixture with a flat bottom surface to press an electronic component with a concave arc or convex arc top surface, the bottom surface of the lower pressing fixture cannot fit the top surface of the electronic component at all, resulting in the crimper being unable to apply force evenly to press the electronic component, causing the electronic component to be unevenly stressed, causing some contacts of the electronic component to be unable to accurately contact the probe of the tester, thereby affecting the test accuracy and quality.

The first object of the present invention is to provide an electronic component, comprising a substrate and at least one intermediate layer. The substrate is provided with at least one contact, and the top surface is curved. At least one intermediate layer is detachably arranged on the top surface of the substrate, and has a pressure-bearing surface and a bonding surface opposite to each other. The pressure-bearing surface is flat to bear the downward pressure, and the bonding surface is attached to the top surface of the substrate. The electronic component uses the pressure-bearing surface of the intermediate layer to evenly bear the downward pressure to perform the test operation, and the intermediate layer is removed after the test is completed, thereby improving the test quality of the electronic component.

The second object of the present invention is to provide an intermediate mechanism, including at least one support, at least one coater and at least one curing device; the support is used to support the substrate of the electronic component; the coater is used to coat the curved top surface of the electronic component with an intermediate layer having a flat pressure-bearing surface; the curing device is used to cure the intermediate layer of the electronic component so that it can withstand downward pressure; the intermediate mechanism can set the intermediate layer in a cured state on the electronic component, so that the electronic component can evenly withstand the downward pressure to perform the test operation, and the intermediate layer is removed after the test is completed, thereby improving the test quality of the electronic component.

The third object of the present invention is to provide an intermediary mechanism, further comprising at least one softener, which can soften the intermediary layer after the electronic component completes the testing operation, so as to facilitate the removal of the intermediary layer on the electronic component, thereby improving the convenience of use.

The fourth object of the present invention is to provide an interposer mechanism, further comprising at least one cleaner, which can separate and remove the interposer from the electronic component after the interposer is softened, so as to facilitate subsequent operations on the electronic component.

The fifth object of the present invention is to provide a testing device, including a testing mechanism, a crimping mechanism and an intermediate mechanism; the testing mechanism is provided with at least one tester for testing electronic components; the crimping mechanism is provided with at least one crimper for crimping the electronic components of the tester; the intermediate mechanism is provided with a holder, a coater and a curing device for coating and curing an intermediate layer with a flat pressure-bearing surface on the curved top surface of the electronic component, so that the crimper can apply an even force to crimp the electronic component, thereby improving the test yield.

The sixth object of the present invention is to provide an operating machine, comprising a machine, a feeding device, a receiving device, a testing device, a conveying device and a central control device, wherein the feeding device is arranged on the machine and is provided with at least one feeder for accommodating at least one electronic component to be tested; the receiving device is arranged on the machine and is provided with at least one receiver for accommodating at least one tested electronic component; the testing device is arranged on the machine and is provided with a testing mechanism, a crimping mechanism and an intermediate mechanism for testing electronic components; the conveying device is arranged on the machine and is provided with at least one conveyor for conveying electronic components; the central control device controls and integrates the actions of each device to perform automated operations.

In order to enable you to have a further understanding of the present invention, a preferred embodiment is given below with accompanying drawings:

Referring to FIG. 1 , the electronic component 10 of the present invention includes a substrate 11 and at least one interposer 12 .

The substrate 11 is provided with at least one contact, and the top surface is curved; depending on the type of electronic component, the contact of the substrate 11 can be a solder ball or a pin, and the top surface is concave or convex. In this embodiment, the substrate 11 of the electronic component 10 is provided with a plurality of contacts 112, which are solder balls, on the bottom surface 111 for electrical connection to a test socket (not shown), and the top surface 113 of the substrate 11 is concave.

At least one intermediate layer 12 is disposed on the top surface 113 of the substrate 11 and has a bonding surface 121 and a pressure-bearing surface 122 opposite to each other. The bonding surface 121 is bonded to the top surface 113 of the substrate 11 and the pressure-bearing surface 122 is flat to withstand downward pressure. Furthermore, the intermediate layer 12 is detachably disposed on the top surface 113 of the substrate 11.

In this embodiment, the intermediate layer 12 can be made of thermoplastic plastic, light-curing resin or low-temperature alloy. The bottom surface of the intermediate layer 12 is a bonding surface 121, and the top surface is a pressure-bearing surface 122. The bonding surface 121 of the intermediate layer 12 is bonded to the top surface 113 of the substrate 11. When the intermediate layer 12 is not yet solidified, the bonding surface 121 can be deformed to fit along the concave arc shape of the top surface 113 of the substrate 11 so as to completely fit and cover the top surface 113 of the substrate 11. The pressure-bearing surface 122 of the intermediate layer 12 is a plane. When the intermediate layer 12 is solidified, the pressure-bearing surface 122 can withstand a certain pressure.

Furthermore, after the pressure under the intermediate layer 12 is released, the intermediate layer 12 can be softened by high temperature and easily separated from the substrate 11, so that the intermediate layer 12 can be removed from the substrate 11.

Please refer to Figures 2 to 6. The intermediary mechanism of the present invention is applied to set an intermediary layer 12 on an electronic component 10. The intermediary mechanism includes at least one support, at least one coater and at least one curing device; at least one support is used to support the substrate 11 of the electronic component 10; at least one coater is used to coat the intermediary layer 12 on the curved top surface 113 of the substrate 11 of the electronic component 10, and the intermediary layer 12 has a planar pressure-bearing surface 122; at least one curing device is used to cure the intermediary layer 12 of the electronic component 10, and the pressure-bearing surface 122 of the intermediary layer 12 can withstand downward pressure.

According to the operation requirements, the intermediary mechanism can set the intermediary layer 12 on the substrate 11 before the electronic component 10 is moved into the tester, or set the intermediary layer 12 on the substrate 11 after the substrate 11 of the electronic component 10 is placed in the tester and before the test, which is not limited to this embodiment.

According to the operation requirements, the electronic component 10 can be moved by the conveyor to other devices or operating machines to remove the intermediate layer 12 after completing the testing operation, or the intermediate mechanism is equipped with a softener and/or a remover, and the softening and/or removal of the intermediate layer 12 is performed on the same operating machine according to the operation sequence, which is not limited to this embodiment.

According to the operation requirements, the holder can be an independent holder or a test holder for holding the electronic component 10. In this embodiment, the holder is an independent holder 21, and the holder 21 is used for a conveyor (not shown) to move the substrate 11 of the electronic component 10.

The coater 22 is driven by a coating driver (not shown) to move in at least one direction to coat the electronic component 10 with the intermediate layer 12. According to the operation requirements, the coater 22 can be provided with a material for forming the intermediate layer 12, and the material can be thermoplastic plastic, photocurable resin or low-temperature alloy, etc. The material has the characteristics of being able to be cured on the top surface 113 of the substrate 11 of the electronic component 10 before testing to form the intermediate layer 12, and being able to be softened and removed from the substrate 11 after testing. In this embodiment, the coater 22 is used to input a material which may be a photocurable resin, and is driven by a coating driver to move above the support 21 to perform a coating operation on the substrate 11 of the electronic component 10, so as to coat the photocurable resin on the top surface 113 of the substrate 11 to form an intermediate layer 12. One surface of the intermediate layer 12 is a planar pressure-bearing surface 122 facing upward, and the other opposite surface is a bonding surface 121 facing downward and completely bonding to the top surface 113 of the substrate 11.

According to the operation requirements, the curing device 23 can be a light curing device or a cooler, etc., which can cure the interlayer 12 of the electronic component 10 by light irradiation or cooling. For example, if the curing device 23 is a light curing device, it can cure the interlayer 12 of the photocurable resin by ultraviolet light irradiation; for example, if the curing device 23 is a cooler, it can cure the interlayer 12 of the thermoplastic plastic by low temperature cooling. Furthermore, the curing device 23 can be arranged around or above the support, or driven by a curing driver (not shown) to move around or above the support, so as to perform a curing operation on the interlayer 12 of the electronic component 10 on the support. In this embodiment, the curing device 23 has at least one ultraviolet light fixture, and is driven by a curing driver to move above the support 21, and uses the ultraviolet light fixture to irradiate the intermediate layer 12 of the electronic component 10 for curing, so that the electronic component 10 can use the planar pressure-bearing surface 122 of the intermediate layer 12 to withstand the pressure.

According to the operation requirements, the interposer mechanism further includes a softener for softening the interposer 12 on the electronic component 10. Furthermore, the softener has at least one heating element for softening the interposer 12.

According to the operation requirements, the intermediary mechanism further includes a remover, which is used to remove the intermediary layer 12 on the electronic component 10. Furthermore, the remover can be a suction device, a clamp or a brush.

The intermediary mechanism of the present invention is applied to a test device 20, which includes a test mechanism, a crimping mechanism and an intermediary mechanism. The test mechanism is provided with at least one tester for testing an electronic component 10; the crimping mechanism is provided with at least one crimping device for crimping the electronic component 10 of the tester; the intermediary mechanism is provided for coating an intermediary layer 12 having a planar pressure-bearing surface 122 on the top surface 113 of the substrate 11 of the electronic component 10, and curing the intermediary layer 12, so that the electronic component 10 can evenly bear the pressure under the crimping device with the pressure-bearing surface 122 of the intermediary layer 12.

According to the operation requirements, the crimping mechanism further includes at least one temperature controller for temperature control of electronic components. The temperature controller can be arranged above the crimper, the crimper or the lower pressing fixture, and is provided with at least one temperature control part for the electronic components to perform test operations in the simulated future application temperature environment. Furthermore, the temperature control part can be a heating element, a cooling chip or a seat with a fluid.

In this embodiment, the tester of the testing mechanism includes an electrically connected circuit board 241 and a test socket 242, the test socket 242 has a plurality of probes, and is used to hold and test the electronic component 10. The crimping mechanism is arranged above the testing mechanism, and is provided with a crimping device 25 that can be driven by a crimping driver (not shown) to move in at least one direction (for example, the Z direction), and the crimping device 25 has a lower crimping fixture 251 with a flat bottom surface for crimping the electronic component 10. Furthermore, the crimping driver is a pressure cylinder, a linear motor, or includes a motor and at least one transmission group, and the transmission group is a belt pulley group or a screw seat group, etc.

In this embodiment, a conveyor (not shown) moves the electronic component 10 having the substrate 11 and the intermediary layer 12 into the test seat 242 of the test mechanism, so that the contact 112 of the substrate 11 faces downward and contacts the probe of the test seat 242, and the pressure-bearing surface 122 of the intermediary layer 12 faces upward; the crimping mechanism drives the crimper 25 to move downward in the Z direction with a crimping driver (not shown), and the crimping fixture 251 under the crimper 25 presses the electronic component 1 with a preset downward pressure. 0, because the pressure-bearing surface 122 of the intermediary layer 12 is a plane, the lower pressing fixture 251 of the crimper 25 can completely fit the pressure-bearing surface 122 of the intermediary layer 12, and evenly apply force to press the electronic component 10. When the electronic component 10 evenly bears the lower pressure, the contact 112 of the substrate 11 of the electronic component 10 can electrically contact the probe of the test socket 242 to effectively perform the test operation, thereby improving the test yield.

After the test is completed, a conveyor (not shown) takes out the electronic component 10 with the interposer 12 from the test seat 242 and transfers it to the support seat 21 of the interposer mechanism.

The intermediate mechanism is provided with a softener 26 for softening the intermediate layer 12 of the electronic component 10; for example, the softener 26 is a high-temperature box for placing the electronic component 10 to soften the intermediate layer 12; for example, the softener 26 has a heating element to contact the intermediate layer 12 with the heating element, which is not limited to this embodiment. In this embodiment, a heating element 261 is provided near the bottom of the softener 26, and the intermediate mechanism drives the softener 26 to move to the top of the electronic component 10 with a softening driver (not shown). The bottom surface of the softener 26 contacts the intermediate layer 12 of the electronic component 10 to transfer the high temperature of the heating element 261 to soften the intermediate layer 12 of the electronic component 10, so that the intermediate layer 12 is in a softened state and can be easily separated from the substrate 11 of the electronic component 10.

When the interposer 12 of the electronic component 10 is in a softened state, the interposer mechanism is provided with a cleaner 27 to remove the interposer 12 on the electronic component 10; the interposer mechanism drives the cleaner 27 to move to the top of the electronic component 10 with a cleaning driver (not shown), so that the cleaner 27 cleans the interposer 12 on the substrate 11, so as to facilitate the electronic component 10 to proceed to the next process or be discharged and stored.

According to the operation requirements, the softener 26 of the intermediate mechanism can also be integrated with the crimper 25 of the crimping mechanism. After the test is completed, the softener 26 located on the crimper 25 can be used to perform a softening operation on the intermediate layer 12 of the electronic component 10.

Please refer to Figures 1 to 8. The test device 20 of the present invention is applied to an electronic component processing machine, which includes a machine 30, a feeding device 40, a receiving device 50, a testing device 20, a conveying device 60 and a central control device (not shown); the feeding device 40 is mounted on the machine 30 and is provided with at least one feeder to accommodate at least one electronic component 10 to be tested; the receiving device 50 is mounted on the machine 30 and is provided with at least one receiving device , to accommodate at least one tested electronic component 10; the test device 20 of the present invention is arranged on the machine 30, including a test mechanism, a crimping mechanism and an intermediate mechanism, the test mechanism is provided with at least one tester for testing the electronic component 10; the crimping mechanism is provided with at least one crimping device 25 for crimping the electronic component 10 of the tester; the intermediate mechanism is provided with at least one support, at least one coating device 22 and at least one curing device 23 for coating the curved top surface of the substrate 11 of the electronic component 10 with a flat surface The intermediate layer 12 of the pressure-bearing surface 122 is pressed and solidified, and the supply press 25 uniformly applies force to press the intermediate layer 12 of the electronic component 10; the conveying device 60 is assembled on the machine 30, and is provided with at least one conveyor to convey the electronic component 10. In this embodiment, the conveying device 60 uses the first conveyor 61 to take out the electronic component 10 to be tested from the feeding device 40, and transfers it to the second conveyor 62. The third conveyor 63 takes out the electronic component 10 to be tested from the second conveyor 62 and transfers it to the intermediate layer 12; The intermediate mechanism coats the intermediate layer 12 on the substrate 11 of the electronic component 10 with the coater 22, and cures the intermediate layer 12 with the curing device 23. The third conveyor 63 then moves the electronic component 10 with the intermediate layer 12 into the test seat 242 of the test mechanism. The crimping mechanism crimps the intermediate layer 12 of the electronic component 10 with the crimping device 25 to perform the test operation. After the test is completed, the third conveyor 63 takes out the tested electronic component 10 and transfers it to the holder 21. The intermediate mechanism softens the intermediate layer 12 with the crimping device 25. The device 26 and the cleaner 27 soften and remove the interlayer 12 of the electronic component 10 respectively, and the third conveyor 63 then transfers the electronic component 10 to the second conveyor 62, so that the first conveyor 61 can take out the tested electronic component 10 from the second conveyor 62, and according to the test results, the tested electronic component is transported to the receiving device 50 for classification and storage; the central control device (not shown) is used to control and integrate the actions of each device to perform automated operations, so as to achieve the practical benefits of improving the operation efficiency.

10: electronic components 11: substrate 111: bottom surface 112: contact point 113: top surface 12: interlayer 121: bonding surface 122: pressure-bearing surface 20: test device 21: support 22: coater 23: curing device 241: circuit board 242: test seat 25: crimper 251: press jig 26: softener 261: heating element 27: remover 30: machine 40: feeding device 50: receiving device 60: conveying device 61: first conveyor 62: second conveyor 63: third conveyor

Figure 1: Schematic diagram of electronic components and interposer. Figures 2 to 7: Schematic diagram of the interposer used in the test device. Figure 8: Schematic diagram of the operating machine.

10: Electronic components

11: Matrix

113: Top

12: Intermediate layer

121: Fitting surface

122: Pressure-bearing surface

21: Seat

22:Applicator

Claims (11)

An electronic component includes: a substrate having at least one contact and a curved top surface; at least one intermediate layer disposed on the top surface of the substrate and having a pressure-bearing surface and a bonding surface opposite to each other, the pressure-bearing surface being in a plane and defining the top surface of the electronic component, and being able to withstand downward pressure when the intermediate layer is solidified, and the bonding surface of the intermediate layer being bonded to the top surface of the substrate. As described in claim 1, the interlayer can withstand high temperature and soften to separate from the substrate after the downward pressure is released. An intermediary mechanism comprises: at least one support: for supporting at least one substrate of the electronic component as described in claim 1; at least one coating device: for coating the intermediary layer of the electronic component as described in claim 1 on the curved top surface of the substrate of the electronic component, the intermediary layer having a planar pressure-bearing surface; at least one curing device: for curing the intermediary layer of the electronic component, the pressure-bearing surface of the intermediary layer being able to withstand downward pressure. As for the intermediate mechanism described in claim 3, the coater can be displaced in at least one direction to coat the intermediate layer on the substrate of the electronic component. As for the intermediary mechanism described in claim 3, the curing device can be fixedly configured or displaced in at least one direction to cure the intermediary layer of the electronic component. The interposer as described in claim 3 further includes a softener, which is used to soften the interposer of the electronic component. The intermediate mechanism as described in claim 6, wherein the softener has at least one heating element to soften the intermediate layer at high temperature. The intermediary mechanism as described in claim 3 further includes a remover for removing the intermediary layer of the electronic component. A testing device, comprising: a testing mechanism: at least one tester is provided for testing electronic components; a crimping mechanism: at least one crimping device is provided for crimping the electronic components of the tester; at least one intermediary mechanism as described in claim 3: for coating an intermediary layer with a planar pressure-bearing surface on the top surface of the substrate of the electronic component, and curing the intermediary layer, so that the electronic component can evenly bear the pressure under the crimping device with the pressure-bearing surface of the intermediary layer. As described in claim 9, the crimping mechanism further includes at least one temperature controller for temperature control of the electronic component. A processing machine comprises: a machine; a feeding device: arranged on the machine and provided with at least one feeder for accommodating at least one electronic component to be tested; a receiving device: arranged on the machine and provided with at least one receiver for accommodating at least one electronic component that has been tested; at least one testing device as described in claim 9: arranged on the machine for testing electronic components; a conveying device: arranged on the machine and provided with at least one conveyor for conveying electronic components; a central control device: for controlling and integrating the actions of various devices to perform automated operations.

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