TWI325872B - Roll-to-roll embossing tools and processes - Google Patents

Roll-to-roll embossing tools and processes Download PDF

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TWI325872B
TWI325872B TW94111821A TW94111821A TWI325872B TW I325872 B TWI325872 B TW I325872B TW 94111821 A TW94111821 A TW 94111821A TW 94111821 A TW94111821 A TW 94111821A TW I325872 B TWI325872 B TW I325872B
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polymer
shim
generation model
polyfunctional
composition
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TW94111821A
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TW200602394A (en
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Gary Y M Kang
Scott C J Tseng
Hongmei Zang
Rong-Chang Liang
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Sipix Imaging Inc
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丄 九、發明說明: 【發明所屬之技術領域】 本發明係有關於—種聚合物薄塾片(shim)以及用於 製造該聚合物薄墊片的滾帶式方法。 【先前技術】 - 相關技藝之敘述 在過去,已經有揭露過影像壓花工具。美國專利案第 4,923,572號(以下均稱為,572 #利)揭示了一種大體上 為圓柱型的影像壓花工具,可以用來將一材料壓花於一腹 板上。製造該影像壓花工具的方法,包含了多重的步驟, 其包括(1 )將-個可壓花材料放置在實心圓柱體的表面 周圍,(2 )利用-個壓印器,將一個希冀的影像或者是 圖案’壓印在該可壓花之層上’ (3)電鑄成形以形成一 層鎳電鑄成形層於該可壓花之層的外部表面上,(4)將 -層強化層塗佈於該電鑄成形層上,(5)將該實心圓柱 _體移除,(6)將該可壓花之層脫除,以形成一電鑛心轴 (7)藉由將一金屬電沉積於該電鍍心軸之内部上,來形 -成-層第二電鑄成形層’以及(8)將該第二電鑄成形層 移除。根據該,572專利,以相同的方式可以製備出多重複 -製的第二電鑄成形層,然後可以將其放置在一個載體圓柱 . 體或者是複數個滾輪上方,以形成一個壓花工具來進行連 續的壓花。然而,此壓花工具與其製造方法,承受了許多 的缺點。舉例而^,該方法需要一種圓柱狀或者是帶狀型 式的壓花工具,而該壓印器之壓印表面,必須具有—“ 5 1325872 二確對應在该實心圓柱體上之可壓花材料的彎曲 二:達成是很困難的。第二,該第-與第二電禱 為金屬材料,諸如Ni。要將該圓柱體形式 中之-層電鑄成形層分離,可能是很困難的,特別 複製南縱橫比之複雜結構的時候。此外,如果在金屬 片的製備當中牽涉到切割步驟的話,要將該切片重新社人 =成一個無縫隙的壓花圓柱體或者是圓桶,都將是:; 難的。更進一步而言,如果欲藉由此方法而形成之 ㈣的3D輪廓,諸如大於1G微米的深度以及小 於1 0。的傾斜角度,要保持一均句並且精細 困難的。 疋非吊 美國專利案第5,327, 825號(以下均稱為,825專利), 係揭示-種透過壓花或者是微壓花而形成一模具的方法。 更具體而3 s亥方法係透過使用一種凹面形狀的壓印表 面,將一圖案或者是設計壓花至一層塗佈在一圓柱狀表面 上的銀層上,而該壓印表面承載著預被提供至該銀層上方 的圖案或設計’並且具有與該圓柱狀表面之半徑相一致的 半^此微麼花步驟係進行多次’以使得從該方法所製備 模具具有來自於該凹面形狀之壓印表面的重複圖案 或者疋叹计。此方法所具有的缺點相似於該,專利的 ‘沾(例如,與該壓印表面以及該圓柱狀表面之半徑相符 。的困難度、維持精確且均勻的表面輪廓、以及形成用於 複雜結構之無縫隙工具’都具有其困難度,特別是那些具 有深3 D輪廓的複雜結構)。 1325872 美國專利案第.5, 156, 863 (以下均稱為,863專利), 係揭示—種用於製造連續壓花帶(belt )的方法。該方法 包含了將—系列「主體」或者是「複製品」結合成—族群, 以提供一希冀的圖案於一固定裝置中,並且由該族群形成 一電禱成形條(electroform strip )。從主體族群固定 裝置開始的多重電鑄成形步驟以後,才形成該壓花帶。此 方法的缺點之一,就是要產生用於該具有均勻高度(或者 是厚度)之族群的主體或複製品,都是很困難的。此外, 在此方法當中’還需要一個研磨的步驟,以消除表面的瑕 疯。於此方法當中,想要在該經電鑄成形之鎳薄墊片從其 錄心軸分離的期間,避免該心轴與薄墊片的損害,同樣是 很困難的’特別是當其牽涉到一個具有深3 D輪廓的複雜 結構時。 更進—步而言,在以上所討論之所有的方法當中,都 僅能在同一時間内生產一種壓花工具。 【發明内容】 發明概述 本發明之第一方面’係有關於一種用於製備聚合物薄 墊片的組成物。 本發明之第二方面,係有關於一種用於製備聚合物薄 塾片的可脫離組成物。 本發明之第三方面,係有關於一種用於生產聚合物薄 塾片的滾帶式方法。 本發明之第四方面,係有關於一種用於製造金屬壓花 7 1325872 模型或者是薄墊片之聚合物薄墊片的用途。 本發明之第五方面,係有關於一種用於製造具有寬廣 格式之聚合物薄墊片的結合方法,其係具有均勻表面輪廓 以及低缺陷率。 本發明具有許多的優點’將會於以下之「發明詳細敘 述」當中加以討論。 本發明之詳細敘述 為了更清楚明白,在本案中所使用的術語均說明於圖 1之中。 1_主模(master mold)的製備 在本案文字中的術語「主模」,係意指一種模型(圖 1中的1),其可以被用來製備本發明之聚合物薄墊片(圖 1中的2 )。如果該主模係為凸模版本,本發明之之該聚 合物薄墊片則會成為對應的凹模版本。 該主模通常是藉由光石印刷方&、或者是鑽石車削方 ,所製備而成。用於電鑄成形之典型的材料,彳包括(但 疋不侷限於)錄H以及其他合金。在電鑄成形之後, 再將光阻劑或者是鑽石切削主體移除,以形成該主模。 主模可以由鎮,益山Λτ# # ^ ^ 藉由乳基碩酸鎳電鑄成形或者是無電 鑛錦沉積來加以形成,如「 战如 溥覆盍板光學介質的連續製造 {Manufacturing nf τα,· ^ t Thin Cover Sheet Optical Media) j SPIE Proc. , Vol. ] β R ^ Λ 丄 b63 ,第 324 頁(1992)中 所敘述。 其他用於製備主模 的方法, 包括了為微型工程技術, 8 1325872 諸如電子束微影(e — beam writing )、乾燥蝕刻、化學 轴刻、雷射書寫、或者是雷射干涉,如同「用於微光學的 氣篥扠銜 Q Replication Techniques for MicrooptiCSA Δ , SPIE Proc· ,Vol· 3099,第 76 頁(1997)中所敘 述。 此外,該主模同樣可以藉由使用塑膠、陶瓷、或者是 金屬進行光學切削(photomachining)而形成。 II.聚合物薄墊片的製備 (i )用於聚合物薄墊片的組成物 本發明之聚合物薄墊片係由一種可壓花組成物所形 成。 在一種所謂的「硬式—壓花」系統當中,該可壓花組 成物可以是一種熱塑性聚合物。該熱塑性聚合物可以藉由 一種適當的塑化劑或者是溶劑來加以塑化,諸如乙酸丁 醋、環己酮、丁醇、乙二醇的二酯或二醚、磷苯二曱酸二 烧基醋、或者是磷酸三烷基酯。有用的可壓花熱塑性聚合 物’可以包括(但是不侷限於)乙酸丁酸纖維素(CAB )、 乙酸丙酸纖維素(CAP )、乙酸纖維素、玻璃紙(經產生 的纖維素)、聚甲基丙烯酸曱酯(pMMA )、聚乙基丙烯酸 甲醋(ΡΕΜΑ)、聚碳酸酯(PC )、聚氣乙烯(PVC )、聚 苯乙烯(PS)、聚酯 '聚醯胺、聚氨基曱酸酯、聚烯烴、 聚乙烯醇縮丁醛、以及其共聚物。 另外’還可以使用一種「軟式一壓花」系統。在此例 子當中’該可壓花組成物可以是一種包括多官能單體、或 9 1325872 者是寡聚物之轄射可固化(特別是uv可固化)經成物。 有用的多官能單體或者是寡聚物,可以包括(但是不 侷限於)多官能丙烯酸酯、多官能曱基丙烯酸酯、多官能 乙烯基、多官能乙烯醚、多官能烯丙基、多官能環氧化物、 以及其他包含可交聯之多官能基的單體或者是寡聚物。在 較佳的情形下,是使用丙烯酸酯化的單體或者是募聚物, 諸如丙烯酸酯化之聚氨基甲酸酯、聚酯、矽氧烷、丙烯酸 φ 類樹脂、酚醛清漆樹脂、以及具有從大約3 0 ◦至大約5 〇,0 0 0之平均分子量的環氧化物,較佳為從大約5 〇 0至大約10, 〇〇〇。 為了改良薄膜完整性並且控制該塗層的滯彈特性,該 輕射可固化組成物可更進一步包括一個聚合物黏著劑或者 是增稠劑。有用的黏著劑或者是增稠劑,可以包括(但是 不侷限於)那些在以上所提及之「硬式_壓花」系統當中 所使用的熱塑性聚合物。 Φ 該組成物同樣可以包括一種光起始劑、光敏劑、或者 是共起始劑。適當的光起始劑、光敏劑、或者是共起始劑, 可以包括(但是不侷限於)來自於Ciba Specialty Chemicals 的 Norrish Type 1、Type 2 以及 Type 3 的光起 始劑,諸如 ITX (異丙基1¾ 吨 _ ) 、Irgacure 651 ( 2,2 - -二曱氧基一1,2 —二苯基乙烷)、907 (2-甲基一 1—[4 —(甲硫基)苯基]—2 -嗎啉代一1-丙酮)、3 69 (2 -苯甲基一2 —(二甲胺基)一1 一 [4 — (4- 嗎啉基)苯基]—1 — 丁_)、以及1 8 4 ( 1 —經基環己 10 1325872 基本基嗣)。 當牵涉到具有深3 D輪廓之複雜結構的模型或者是薄 墊片,該輻射可固化組成物係特別有用。可以在該輻射可 固化組成物當中添加一種脫離劑、或者是反應性脫離單體 或寡聚物,諸如蠟、矽氧烷油、全氟化液體或粉末、丙烯 馱知化之矽氧烷、氟化丙烯酸酯、或者是氟化環氧化物, 以促進該聚合物薄墊片從該主模上脫離,並且延長該主楔BRIEF DESCRIPTION OF THE INVENTION [Technical Field] The present invention relates to a polymer thin shim and a roll-to-roll method for producing the polymer shim. [Prior Art] - Description of Related Art In the past, image embossing tools have been disclosed. U.S. Patent No. 4,923,572 (hereinafter referred to as 572 #利) discloses a substantially cylindrical image embossing tool that can be used to emboss a material onto a web. The method of making the image embossing tool comprises a plurality of steps comprising: (1) placing an embossable material around the surface of the solid cylinder, and (2) using a stamper to give a hopeful The image or pattern is 'embossed on the layer of embossable' (3) electroformed to form a layer of nickel electroformed layer on the outer surface of the layer of embossable, (4) layer-strength layer Applying to the electroformed layer, (5) removing the solid cylinder, and (6) removing the embossable layer to form an electroless mandrel (7) by using a metal Electrodeposition is performed on the interior of the plating mandrel to form a second electroformed layer and to remove the second electroformed layer. According to this, the 572 patent, a multi-repetition second electroformed layer can be prepared in the same manner, and then can be placed on a carrier cylinder or a plurality of rollers to form an embossing tool. Perform continuous embossing. However, this embossing tool and its manufacturing method suffer from a number of disadvantages. For example, the method requires a cylindrical or strip-shaped embossing tool, and the stamping surface of the stamper must have - " 5 1325872 2 corresponds to the embossable material on the solid cylinder Bending 2: It is very difficult to achieve. Second, the first and second electric prayers are metal materials, such as Ni. It may be difficult to separate the electroformed layer in the cylindrical form. In particular, when copying the complex structure of the south aspect ratio, in addition, if the cutting step is involved in the preparation of the metal sheet, the slice should be reincorporated into a seamless embossed cylinder or a drum. It is difficult to: Further, if the 3D contour to be formed by this method, such as a depth greater than 1 Gm and a tilt angle less than 10, is to maintain a uniform sentence and is finely difficult. U.S. Patent No. 5,327,825 (hereinafter referred to as the '825 patent) discloses a method of forming a mold by embossing or micro-embossing. More specifically, the 3 s method is used. One kind The embossed surface of the face shape embosses a pattern or design onto a layer of silver coated on a cylindrical surface carrying a pattern or design that is pre-provided over the silver layer. And having a half of the micro-flowering step in accordance with the radius of the cylindrical surface is performed a plurality of times such that the mold prepared from the method has a repeating pattern or an astigmatism from the embossed surface of the concave shape. This method has the disadvantages similar to this, the patent's 'dip (for example, the degree of difficulty with the embossed surface and the radius of the cylindrical surface), maintaining a precise and uniform surface profile, and forming for complex structures Seamless gap tools' have their difficulty, especially those with deep 3D contours. 1325872 US Patent No. 5, 156, 863 (hereinafter referred to as 863 patent), reveals that A method of making a continuous embossed belt (belt) comprising combining a series of "subjects" or "replicas" into a group to provide a hopeful pattern in a fixture And forming an electrical Prayer shaped bars (electroform strip) from this group. The embossed tape is formed after the multiple electroforming step from the main group fixing device. One of the disadvantages of this method is that it is difficult to produce a body or replica for the population of uniform height (or thickness). In addition, in this method, a grinding step is required to eliminate surface madness. In this method, it is also difficult to avoid damage to the mandrel and the shim during the separation of the electroformed nickel shim from its mandrel, especially when it is involved A complex structure with a deep 3D contour. Further, in all of the methods discussed above, only one embossing tool can be produced at the same time. SUMMARY OF THE INVENTION A first aspect of the present invention is directed to a composition for preparing a polymer shims. A second aspect of the invention relates to a detachable composition for preparing a polymeric thin sheet. A third aspect of the invention relates to a roller belt method for producing a polymer sheet. A fourth aspect of the invention relates to the use of a polymer shims for making metal embossed 7 1325872 models or shim. The fifth aspect of the invention relates to a bonding method for producing a polymer shims having a wide format, which has a uniform surface profile and a low defect rate. The invention has many advantages which will be discussed in the "Detailed Description of the Invention" below. DETAILED DESCRIPTION OF THE INVENTION For the sake of clarity, the terms used in this case are all illustrated in FIG. 1_Master mold preparation The term "master mold" in the context of the present text means a model (1 in Figure 1) which can be used to prepare the polymer shim of the present invention (Figure 1 2 in 1). If the master mold is a male mold version, the polymer shim of the present invention will be the corresponding female mold version. The master mold is usually prepared by a light stone printing side & or a diamond turning side. Typical materials used in electroforming include, but are not limited to, H and other alloys. After electroforming, the photoresist or diamond cutting body is removed to form the master mold. The main mode can be formed by the town, Yishan Λτ# # ^ ^ by electroforming of the lacquer-based nickel electroformed or by electroless gold deposits, such as "continuous manufacturing of warfare-coated slab optical media {Manufacturing nf τα, · ^ t Thin Cover Sheet Optical Media) j SPIE Proc. , Vol. ] β R ^ Λ 63b63, page 324 (1992). Other methods for preparing master molds, including micro-engineering techniques, 8 1325872 Such as electron beam lithography (e-beam writing), dry etching, chemical axis engraving, laser writing, or laser interference, like "Q-ray technique for micro-optics Q Replication Techniques for MicrooptiCSA Δ , SPIE Proc., Vol. 3099, page 76 (1997). In addition, the master mold can also be formed by photomachining using plastic, ceramic, or metal. II. Polymer shim Preparation (i) Composition for Polymer Shim The polymer shim of the present invention is formed from an embossable composition. In a so-called "hard-embossing" system, the compressible flower The composition can be a thermoplastic polymer. The thermoplastic polymer can be plasticized by a suitable plasticizer or solvent, such as butyl acetate, cyclohexanone, butanol, diester or diether of ethylene glycol, and pyromellitic acid. Base vinegar or trialkyl phosphate. Useful embossable thermoplastic polymers' may include, but are not limited to, cellulose acetate butyrate (CAB), cellulose acetate propionate (CAP), cellulose acetate, cellophane (produced cellulose), polymethyl Ethyl acrylate (pMMA), polyethyl methacrylate (ΡΕΜΑ), polycarbonate (PC), polyethylene (PVC), polystyrene (PS), polyester 'polyamide, polyamino citric acid Esters, polyolefins, polyvinyl butyral, and copolymers thereof. In addition, a "soft one embossing" system can also be used. In this example, the embossable composition can be an achievable curable (particularly uv curable) composition comprising a polyfunctional monomer, or 9 1325872. Useful polyfunctional monomers or oligomers, which may include, but are not limited to, polyfunctional acrylates, polyfunctional thiol acrylates, polyfunctional vinyls, polyfunctional vinyl ethers, polyfunctional allylic groups, polyfunctional Epoxides, as well as other monomers comprising crosslinkable polyfunctional groups, are also oligomers. In the preferred case, an acrylated monomer or a merging polymer such as an acrylated polyurethane, a polyester, a decane, an acrylic φ resin, a novolac resin, and the like are used. The epoxide having an average molecular weight of from about 30 Torr to about 5 Å, preferably from about 5 〇 0 to about 10 Å. In order to improve film integrity and control the ballistic properties of the coating, the light-curable composition may further comprise a polymeric binder or a thickening agent. Useful adhesives or thickeners can include, but are not limited to, those thermoplastic polymers used in the "hard embossing" systems mentioned above. Φ The composition may also include a photoinitiator, a photosensitizer, or a co-initiator. Suitable photoinitiators, photosensitizers, or co-initiators may include, but are not limited to, Norrish Type 1, Type 2, and Type 3 photoinitiators from Ciba Specialty Chemicals, such as ITX (different) Propyl 13⁄4 ton _), Irgacure 651 (2,2-dioxaoxy-1,2-diphenylethane), 907 (2-methyl-1-[4-(methylthio)phenyl) ]—2-morpholino- 1-propanone), 3 69 (2-benzyl-3-carboyl)-1-yl[4-(4-morpholinyl)phenyl]-1 _), and 1 8 4 (1 - via the base ring 10 1325872 basic basis). The radiation curable composition is particularly useful when it involves a model having a complex structure with a deep 3D profile or a shim. A release agent or a reactive detachment monomer or oligomer such as a wax, a decyl alkane oil, a perfluorinated liquid or a powder, an acrylonitrile-based oxime, or the like, may be added to the radiation curable composition. a fluorinated acrylate, or a fluorinated epoxide, to facilitate detachment of the polymer shim from the master mold and to extend the main wedge

的壽命。 以下將顯示對於本發明之聚合物薄墊片的行程很有用 的輻射可固化組成物的一個實施例。 一種用於形成聚合物薄墊片的輻射可固化組成物 成伤 曲β ® 較佳範圍 黏著劑或增稠劑 丄 u — y u% 5-60% 脫離劑或反應性脫離單體/寬费物 一 0—10%_ 〇 · 1 — 5 % 光起始劑、光敏劑、或共起始劊 20-75% 25—45% 1-8% 1-3% ^ /ft. "0 W I 1 丁 稀釋或溶解,已達到良好的可塗佈性。適當的溶劑可以包 括(但是不侷限於)酮類,諸如甲乙嗣(MEK)、甲丙鲷 (MPK)、甲丁酮_ (MBK)、環己酮、或者是两_ ;酯類, 諸如乙酸乙酯、乙酸丙酯、或者是乙酸丁酯;醇類,諸如 乙醇、丙醇、或者是丁醇;醚類,諸如四氫呋喃 (tetrahydrofuran )、或者是二烷氧乙烷 (dialkoxyethane);醯胺類,諸如二甲基乙醯胺;烷基 苯類,諸如甲笨、或二甲苯,及其相似者^ 本發明之聚合物薄墊片 墊片(圖1中的3 )的形成, 4第一代模型或薄墊片,通 構。 ’可以被用於第一代模型或薄 其通常是由金屬材料所形成。 常是被用來製備所想要的微結 為了要促使該聚合物蓮叙 離^ 物溥墊片層該第一代金屬模型上分 級成物,可以是以上所钦的。這樣的一種可脫離 ^ ^ 斤敘述之輻射可固化組成物,包括一 ·*者劑、或者是增稠劑β 有 有用的黏著劑或者是增稠劑在一 的。 液虽中,係為可溶或者是可分散 的$ ^ 劑,可以是一種具有羧基官能性 = 適當之黏著劑或者是增稠劑的實施例,可以包 磨龄 丙婦酸、甲基丙烯酸、衣康酸、衣 次者疋順丁烯二野的共聚物。該黏著 大通常佔去了該可脫離組成物之大約5至 大約6 〇重量%。 下帛^樣的一種可脫離組成物時在大多數的情形 以在該聚合物薄墊片所製備而成的第一代金屬模型可 下進"I下任何聚合物殘餘物或者是熔渣於金屬上的情形 進—步从離^有必要的1^,該第一A金屬模型可以更 液,球9 ^使用一驗性溶液來加以清潔或脫離,該鹼性溶 大約1 η氣氧化四甲録溶液’濃度範圍從大約0 · 1 Ν至 Ν ’較佳為從大約〇 . 5 Ν至大約5 Ν。 壽命:亦。曰加用於該聚合物薄墊片之輻射可固化組成物的 。乂添加抑制劑或者是抗氧化劑。適當的抑制劑 12 1325872 或抗氧化劑,可以包括Γ/ _ (仁疋不侷限於):Β Η T (丁基 化羥基〒苯)、ΜΕΗη ,匕 ψ ^ Q (氫醌單甲基醚)、以及四[亞 甲基 ~3 (3,,5’~~ 二筮二丁讨, ψ ^ 第—丁基—4~羥苯基)丙酸酯] 。該抑制劑或抗氧化劑 ς ^ θ 削了以大約〇 · 1重量%至大約 b重ϊ%的數量存在,軔祛 %。 較佳為大約0 . 1 %至大約1重量 可以將空氣抽進該輻射可固化組成物當中,以預防在 儲存期間該多官能單體或寡聚物進行聚合作用。 (ii)用於製造聚合物薄墊片的方法 圖2係A机私圖,說明形成本發明之聚合物 的方法》 將以上所敘述之該可壓花組成物(2 〇 )塗佈在一基 反上(2 1),並且將其乾燥以達到適合用於壓花的滞 特性。 對本發明有用的基板,可以包括(但是不侷限於): 稀對苯二甲酸3旨(PET),聚丁烯對苯二f酸醋(p :丁)、聚萘酸乙醋(PEN)、三乙酸纖維素、聚碳酸 知、聚醯亞胺、聚楓、聚醯胺、以及聚烯烴。 該可壓花組成物(2 〇 )典型地係藉由一主模(2 2 ) 來進行壓花’參照上述章節ί ’以滾輪、薄板、或帶子的 形式,在高於該可壓花組成物之熱變形溫度(Hdt)或 者是玻璃轉換溫度(Tg)的溫度下進行。該用於典型可^ 花組成物之HDT或者是Tg,其範圍可以從大約—7〇艺 至大約1 5 (TC,較佳為從大約一2 〇。(:至大約丄〇 。 13 1325872 可以使用-種經加熱之主模、或者是經加熱之外殼基板(装 受到模型擠壓),來控制壓花溫度與壓力。 、 本發明之主模’其表面突出的高度,可介於大約〇 〇 1至大約100微米之間’較佳為介於大約〇1至大約 5 0微米之間。該經壓花之結構的縱橫比(高度,寬度的 比率),可介於大約至大約20,較佳為介於大約 0 · 1至大約1 〇。 φ _可乂有|選擇性的底漆層、或者是表面處理層(未 顯示)介於該基板以及該可壓花組成物層之間以強化其 黏著性或者是塗佈品質。該底漆層或者是表面處理層的組 成’可以包括(但是不侷限於):聚氨基甲酸酯、環氧化 物、預固化之環氧丙烯酸6旨、聚胺醋丙稀酸醋、聚酯丙稀 酸醋、以及其相似者。另外,其可包含利用(舉例而言) 電暈、電漿、或火談來對該基板層進行表面的預處理。 在該可壓花組成物藉由輻射、熱、或者是溶劑基發來 φ 進行硬化之後,形成了—層聚合物薄塾片(23)。該聚 &物薄墊片係為該主模之相對應的凹模版本。 纟發明之該聚合物薄塾片,可以藉由薄板接著薄板的 .方式加以生產’或者較佳是以滾輪的方式生產,其可以為 •任何的長度。該薄板或者是滾輪的寬度,通常範圍是在大 約1时至大約9 0忖之間。此外,還可以連續地在一腹板 上生產多薄板的(例如百片或者是千片)聚合物薄墊片。 III.該聚合物薄墊片之切割與接合 如果在該聚合物薄墊片上面有一個缺陷,則該劇有缺 U25872 陷的部份可以很輕易地將它切 品暂 ^ _ 吟了具備有良好的切匈 例如兩ΓΓΓ合物薄塾片失在兩片厚的塑膠板之間: 札=b0 以’然'後再利用—台鏜孔 卻:= 先利用(舉例而言)液態氮來加以冷 割機器來加以切割。 $者疋任何其他精確的切 所盤:以:多片的聚合物薄塾片接合在-起,而由此方法 =備而成之不同的聚合物薄墊片,其高度差(或 度=可以被控制在小於1微米之下。舉例而言,從借由 -連,,方法所製備而成的聚大滾輪聚合物薄墊片 :選:兩片聚合物薄塾片’並加以切割,以消除任何的缺 = ',、:後再將該兩片加以接合在一起,較佳是以該圖案面 朝下。將-黏著劑塗佈在該縫隙線上,並藉由毛細管 其吸入至該縫隙之中。適當的黏著劑可以包括(但是不侷 限於)·明Β可固化黏著劑、環氧化物、矽氧烷、氰基 丙烯醋、聚氨基f酸醋、丙婦酸黏著劑、以及其相似者。 該黏著劑之黏度範圍較佳係從大約5〇cps至大約〇 00cps,更佳為從大約"〇〇至大約1〇〇〇0cps。 黏著劑的塗佈可以藉由注射器、繞線棒、或者是摻合到刀 來進行’以及選擇性地使用一種自動分配号 (autodlspe贿)。要被接合在—起的兩片聚合物薄塾 片,可以被放置在一個非常平坦的表面上,諸b LCD玻璃 板’並且以機械的方式將其支托在一起,或者是藉由真空、 15 1325872 靜態吸引力、或者是一臨時黏著劑薄層(之後可以藉由例 如熱、溶劑、或者是UV來加以移除)來將其黏附在-平 坦的基板上。 藉由將任何-塊有缺陷的區域切除,再將其餘的部分 如以上所敛述加以接合在-起,這種方法的優點就在於可 以從一個具有缺陷的主模上,製備 墊片 衣爾出大數量相當完美的薄 IV.第一代模型或薄墊片的製備 該第一代模型或薄墊片(圖1 ^ 的3)具有相同於主 模的結構,且其可以由本發明 义該I合物薄墊片來加以製 備0 A·平坦的第一代模型或薄墊片 如果有必要的話,一旦產4 生了聚合物薄墊片,就可以 參照以上所敘述之程序,將且 往斤將其切割成任何形狀及尺寸,並 再將其接合在一起。 該第一代模型或薄墊片的报 守坚乃的形成包含了數個步驟,其包 括表面處理(24)、導雷括 〇… #電種子層塗佈(2 5 )、以及電 鑄成形(26),如圖2中所顯示。 就該表面處理(2 4 )而言,可以你田♦ θ ^ ^ ° 0J以使用電暈、叆雪游 處理、或UV輻射,來增加該 〆 歙合物溥墊片與隨即之導雷 種子層塗佈兩者之間的黏著性。 該導電種子層塗你f 9 R、 W )可以包含銀、鎳、或鎳、 鉻合金之溽層塗佈,其係藉 1舉例而δ)濺鍍、物理或 夺氣相沉積、蒸發、或者是 疋錯由還原反應所進行的無電 16 1325872 鍍。通#疋使用銀或鎳種子塗層,而銀種子塗層係為更佳 的0 在該聚合物薄墊片之表面塗佈上銀(如圖2中所顯示) 以後’該第一代模型或薄墊片(通常是由鎳所形成)可以 由該聚合物薄墊片’藉由電鑄成形方法來加以製備。該銀 種子塗層(2 5) 供了-導電功能,以用於接下來的電 鑄成形步驟。不是濺鍍方法就是蒸發方法,可以被用於銀 的塗佈。該銀塗層較佳具有大約〇 〇丄至大約丄微米的 厚度,更佳為大約〇.〇5至大約〇·5微米。 可以在該銀塗層的表面上選擇性地進行鈍化處理,以 降低介於該銀塗層以及後來的鎳層之間的黏著性。 最後將一鎳層(2 6 )沉積於該塗佈銀的聚合物薄墊 片之上,之後再將該聚合物薄墊片從該第一代Μ模型或 者是薄墊片(27)上分離。 、 由於藉由本發明之滾帶式方法,可以在高速之下生產 多片的聚合物薄墊片(23),因此使得具有相同於該主 糢(22)之結構的第一代模型或薄墊片可以進 行大量生產》 可選擇地’該經生產之第一代模型或薄墊片(圖丄中 的3)可以被用來進行大量生產第二代聚合物薄塾片的製 造當中。 以外’還可以藉由 检狀或者是滾輪型 B.滾輪型式之第一代模型或薄塾片 除了該平坦的第一代凸模或薄塾片 (例如)圖3中所說明的方法來製備圓 17 1325872 式之第-代模型或薄塾片(34),其中係將本發明平拍 塗佈銀之聚合物薄塾片(3〇)的兩個邊緣接合在一起, 將鍍銀的圖案面向内,而所採取的接合方法如以上所敘述 中的-種。選擇性地在該縫隙線上使用一黏著劑,以將該 經接合之圓柱狀聚合物薄塾片(31)插人並且緊貼地安 裝於一圓柱狀外殼(3 2)之内。 將-個陽極棒或圓柱狀藍(33)插入至中央處,並 且在-陰極聚合物薄塾片(31)上進行電鑄成形。然後 將該圓柱狀第一代模型或薄塾片以及塗佈銀的聚合物薄塾 片(3 0 )的複合物,從該外殼(3 2 )上移除。然後再 以物理的方式將該塗佈銀之聚合物薄墊片(3〇)分離, 例如藉由切割該聚合物薄墊片,之後再藉由剝離或者是以 :學的方式將該聚合物薄塾片(30)從該第一代模型或 薄墊片(34)上脫除^ 脱除另外,在該聚合物薄墊片裝配至 圓柱體外殼⑴)中以後(如以上所敘述),還可以藉 由(例如)濺鍍來完成在該聚合物薄塾片(3〇)上㈣ 塗層(3 5 )。藉由此方法所製備而成的該第一代模型或 薄塾片’不具有—條可見的縫隙或者S焊接線。 外’還可以使用一種具有缺口垂直於圓形表面之 可調式圓柱狀外殼支架1缺口可以支托在一起, 加以栓緊…將該聚合物薄塾片精確切 二^種子層、並且播入至該具有面向内之種 :^^—可調式圓柱狀外殼支架。藉由將螺絲拾緊, …合物溥墊片的兩個端點接合在一起。可以將該經 18 1325872 接合之聚合物薄墊片直接地運用在之後的電鑄成形步驟當 . 中’而不需要一種邊緣黏著劑。使用這種可調式圓柱狀支 架,可以藉由將該螺絲鬆脫而讓該經電鑄成形的部件從該 圓桎體取回。在電鑄成形之後、以及在將該第一代模型或 • · 薄塾片從該圓柱狀外殼移除之後,可能會需要將該縫隙線 - 進行拋光。 本發明可以運用來製備任何一種壓花方法當中所使用 鲁 之壓花工具’包括揭示於2000年三月三日提出申請之 共同繫屬美國序號第09/518/ 488號(相對應於wool/ 67170)當中的微壓花方法’而其中的内容將完整併於此 作為參考文獻。更具體而言,可以將該第_代模型或薄塾 片運用來製備此處所指的微形杯。 V.該模型表面的拋光 雖然由本發明所製備之該第一代模型或薄墊片,一般 而言具有一平滑表面,以及均勻深度的溝槽但是其可以 • 藉由將該模型表面進行後—拋光來更進一步改良。在之後 的討論當中,由該聚合物薄墊片所直接製備而成的模型或 '薄塾片,係稱為「第一代模型或薄墊片」,以區別之後代 . 的模型或薄塾片。 圖6係說明本發明所生產之第一代模型的橫截面, 其係顯示突出元件(6 〇 )以及溝槽(6工)。在共同繫 屬案USSN 09/ 518, 488當中所敘述之微形杯的製造當中, 該突出元件係對應於微形杯,而該溝槽則係對應於介在該 微形杯之間的分隔邊壁。 1325872 該模型表面之後抛光處理’可以在多重步驟當中進行 • 並由一極平坦第一代模型開始。該第一代模型中之突出元 件的高度、或該溝槽之深度,可以利用(例如)表面輪廓 來加以量測。然後再將該第一代模型安裝在一個精確平坦 • 表面的薄板上。這個步驟很重要是因為背面(6 2)被用 •-來作為高度的參考點。然後將具有表面薄板之第一代模 型,安裝在一個連接至一拋光系統之線性階梯上,諸如 φ Buehler Automet 2拋光系統。該系統係使用一種動力 頭(power head) ’其係具有一附加裝置,用於各種不同 等級之拋光布料、在各種不同之速度下旋轉、以適用於各 種不同之拋光程度。該第一代模型將會在該拋光頭下移 動,而該拋光頭會變成和該模型表面(6 3 )相接觸。 在一個具體態樣當中,係使用一種6微米之Metadi Supreme Polycrystalline Diamond Suspension 以及 Buehler Texmet 1000拋光布料。在較佳的情形下,係以 φ 種移動式載體的形式,於一理想的壓力下加以使用,以 進行該表面的連續拋光。為了要避免不希冀的來自於該拋 光步驟之沙礫或粉末的汙染,可以將一種可移除掩膜塗層 • 或者是填充材料塗佈至該結構上,特別是該溝槽上,諸如 蠟、矽氧烷、或者是其他溶劑可溶解、或者是水可溶解之 聚合物。 可以重複進行該抛光步帮,直到該表面平滑或者是 該突出元件之高度均勻的時候;高度的平均差係小於大約 1微米,更佳為小於大約0. 5微来。然後,再將由拋光 20 1325872 所留下之磨耗性微粒、沙礫、碎片、以及掩膜塗層(如果 - 存在的話)’藉由機械清潔、之後再用溶劑清洗、超音波 浴、或沖洗來加以移除。 通常會需要準備該模型或薄墊片之後的生產。該第二 • 代模型或薄墊片(相對應於圖1中的4,並且同樣顯示於 - 圖7之中)具有相同於該聚合物薄墊片的結構,並且與該 第一代模型相當類似。擁有第二代模型的目的,不只是在 φ 於將尖銳角度的端點(70)磨掉,也在於更進一步確保 該分隔邊壁之高度(71)的一致性。 該拋光步驟係相似於那些用於該第一代模型之拋光的 抛光步驟。就第一步驟而言,係量測該分隔邊壁之高度, 然後決定參考點。然後將具有表面薄板之第二代模型,安 裝在一個連接至一拋光系統之線性階梯上,並且在該拋光 頭下移動,而該拋光頭會變成和該頂部表面相接觸,以將 該尖銳角度的端點(70)(如果存在的話)、以及額外 • 的高度(72)磨掉,以確保該分隔邊壁之高度的一致性。 該第二代模型進行拋光的條件(也就是設定和期間), 係相似於那些用於第一代模型之拋光的條件。 .纟該第二代模型進行拋光與清潔之冑,可以進行模型 之更之後的生產(如果有必要的話),以確保最終模型的 - 高品質。 【實施方式】 以下的實施例係用於提供熟習該項技術者能夠更明白 的瞭解’並且實施本發明。這些實施例不應該被視為侷限 21 1325872 本發明之範疇,而僅能用來作為本發明之說明及代表。 實施例1 A .底漆層 在一個包含5公克脂肪族聚氨基甲酸酯的燒杯當中 (P9815,Huntsman,紐澤西州),添加647 3公克之MEK、 與300公克之環己酮(CH〇) 、3〇公克之CN983 ( uv寡聚 物,來自於Sartomer ’賓夕法尼亞州)、i 5公克之EB129〇 (UV券聚物,來自於UCB Chemicals,喬治亞州)、1. 72 公克之IrgaCure 369 (2 —苯甲基—2 (二甲胺基)—i —[4 _ ( 4 -嗎啉基)苯基]—丁酮,Ciba Specialty Chemicals,賓夕法尼亞州)、〇 35公克之ιτχ (SarCure SR1124,2—異丙基噻吨酮(is〇pr〇pyl αίοχΜΗοΜ), 來自於Sartomer,賓夕法尼亞州)、以及〇 43公克之Life expectancy. One embodiment of a radiation curable composition useful for the travel of the polymer shim of the present invention will now be shown. A radiation curable composition for forming a polymer shim into a wounded beta ® preferred range of adhesives or thickeners 丄u - yu% 5-60% release agent or reactive detachment monomer / wide fee A 0-10% _ 〇 · 1 - 5 % photoinitiator, photosensitizer, or co-starting 刽 20-75% 25-45% 1-8% 1-3% ^ / ft. "0 WI 1 Diluted or dissolved, good coatability has been achieved. Suitable solvents may include, but are not limited to, ketones such as methyl ethyl hydrazine (MEK), propylene glycol (MPK), methyl ketone ketone (MBK), cyclohexanone, or two ketones such as acetic acid. Ethyl ester, propyl acetate, or butyl acetate; alcohols such as ethanol, propanol, or butanol; ethers, such as tetrahydrofuran, or dilkoxyethane; guanamines , such as dimethyl acetamide; alkyl benzenes, such as methyl or xylene, and the like. ^ The formation of the polymer shims of the present invention (3 in Figure 1), 4 first Generation model or shim, general construction. ' can be used for first generation models or thin. It is usually formed of a metallic material. Often used to prepare the desired microjunction. In order to promote the polymer to be separated from the first generation metal model, it can be as above. Such a radiation curable composition which can be deducted from the formula, includes a *, or a thickener, a useful adhesive or a thickener. Although the solution is a soluble or dispersible agent, it may be an embodiment having a carboxyl functionality = a suitable adhesive or a thickener, which may be used to coat the aged glycerin, methacrylic acid, A copolymer of itaconic acid and a benzoic acid. The adhesion typically takes up from about 5 to about 6 weight percent of the detachable composition. When a detachable composition is used, in most cases, the first generation metal model prepared in the polymer shim can be slid into any polymer residue or slag. In the case of metal, the first A metal model can be more liquid, the ball 9 can be cleaned or detached using an assay solution, and the alkaline solution is about 1 η gas oxidation. The concentration of the tetramethrin solution is from about 0 · 1 Ν to Ν ' preferably from about 〇 5 Ν to about 5 Ν. Life expectancy: also. The radiation curable composition for the polymer shim is added. Add an inhibitor or an antioxidant. A suitable inhibitor 12 1325872 or an antioxidant may include Γ/ _ (ingredients are not limited to): Β Η T (butylated hydroxy benzene), ΜΕΗη, 匕ψ ^ Q (hydroquinone monomethyl ether), And four [methylene ~ 3 (3,, 5 '~ ~ bismuth dibutyl, ψ ^ butyl -4- 4 hydroxyphenyl) propionate]. The inhibitor or antioxidant ς ^ θ is cut in an amount of from about 1% by weight to about 5% by weight, 轫祛%. Preferably, from about 0.1% to about 1 weight, air can be drawn into the radiation curable composition to prevent polymerization of the multifunctional monomer or oligomer during storage. (ii) Method for producing a polymer shim Figure 2 is a private diagram of the machine A, illustrating the method of forming the polymer of the present invention. The embossed composition (2 〇) described above is coated on a The base is reversed (2 1) and dried to achieve a hysteresis characteristic suitable for embossing. Substrates useful in the present invention may include, but are not limited to, diphenyl terephthalate (PET), polybutylene terephthalate (p:butyl), polyethyl naphthalate (PEN), Cellulose triacetate, polycarbonate, polyimine, poly maple, polyamine, and polyolefin. The embossable composition (2 〇) is typically embossed by a master mold (2 2 ). Referring to the above section ί 'in the form of a roller, a sheet, or a belt, above the embossable composition The heat distortion temperature (Hdt) of the object or the temperature of the glass transition temperature (Tg) is carried out. The HDT or Tg for a typical flower composition may range from about -7 to about 1 5 (TC, preferably from about 2 to about 〇. (: to about 丄〇. 13 1325872 The embossing temperature and pressure are controlled using a heated main mold or a heated outer casing (loaded by a model). The height of the surface of the main mold of the present invention may be between approximately 〇 Between 1 and about 100 microns is preferably between about 〇1 and about 50 microns. The aspect ratio (height, width ratio) of the embossed structure can range from about to about 20, Preferably, it is between about 0. 1 and about 1 〇. φ _ may have a selective primer layer, or a surface treatment layer (not shown) interposed between the substrate and the embossable composition layer. To enhance the adhesion or coating quality. The composition of the primer layer or the surface treatment layer may include, but is not limited to: polyurethane, epoxy, pre-cured epoxy acrylic acid 6 , polyamine acetoacetate, polyester acrylate vinegar, and the like Additionally, it may include surface pretreatment of the substrate layer using, for example, corona, plasma, or fire. The embossable composition is irradiated, heat, or solvent based. After φ is hardened, a layer of polymer thin ruthenium (23) is formed. The poly& shims are the corresponding embossed versions of the main dies. It can be produced by means of a thin plate followed by a thin sheet. Or it can preferably be produced in the form of a roller, which can be any length. The width of the thin plate or the roller is usually in the range of about 1 to about 90 忖. In addition, it is also possible to continuously produce a multi-thin (for example, one hundred or one thousand) polymer shim on a web. III. Cutting and bonding of the polymer shim if in the polymer There is a defect on the shim. If there is a U25872 trapped part of the play, it can be easily cut. _ 吟 具备 有 有 有 有 有 有 有 有 有 有 有 有 有 有 有 有 有 有 有 有 有 有 有 有 有 有 有 有 有 有 有 有 有 有 有 有 有 有 有 有 有 有 有 有 有 有 有 有 有 有 有 有 有 有 有 有 有 有 有 有 有Between the plastic plates: Zha = b0 to 'Ran' and then profit —The boring hole is:= First use, for example, liquid nitrogen for the cold cutting machine to cut. $ 疋 其他 any other precise cutting:: multiple pieces of polymer thin 接合 接合 接合And the difference in height (or degree = can be controlled below 1 micron) of the different polymer shim prepared by this method = for example, by the method of As a large roller polymer gasket: choose: two pieces of polymer thin bracts' and cut to eliminate any missing = ',,: then join the two pieces together, preferably The pattern is facing down. An adhesive is applied to the slit line and sucked into the gap by a capillary. Suitable adhesives may include (but are not limited to) alum-curable adhesives, rings Oxide, decane, cyanopropene vinegar, polyamino acid vinegar, propylene glycol adhesive, and the like. The viscosity of the adhesive preferably ranges from about 5 〇 cps to about 00 00 cps, more preferably from about 〇〇 〇〇 to about 1 〇〇〇 0 cps. The application of the adhesive can be carried out by means of a syringe, a wire rod, or blended into a knife' and optionally using an automatic dispensing number (autodlspe bribe). The two sheets of polymer sheets to be joined together can be placed on a very flat surface, and the b LCD glass sheets are mechanically supported together, or by vacuum, 15 1325872 Static attraction, or a thin layer of temporary adhesive (which can then be removed by, for example, heat, solvent, or UV) to adhere it to a flat substrate. By removing any defective areas of the block and then joining the remaining parts as described above, the advantage of this method is that the gasket can be prepared from a defective main mold. Producing a large number of relatively perfect thin IV. Preparation of the first generation model or shim The first generation model or shim (3 of Fig. 1 ^) has the same structure as the main mold, and it can be I compound thin gasket to prepare 0 A · flat first generation model or shim. If necessary, once the polymer shim is produced, you can refer to the procedure described above. Pinch it into any shape and size and join it together. The formation of the first generation model or shim of the Guardian Kennedy consists of several steps, including surface treatment (24), guide shovel... #电籽层涂(2 5 ), and electroforming (26), as shown in Figure 2. In the case of the surface treatment (2 4 ), you can use the corona, 叆 游 游, or UV radiation to increase the 溥 溥 gasket and the immediate thyro seed. The layer coats the adhesion between the two. The conductive seed layer is coated with a coating layer of silver, nickel, or nickel or a chrome alloy, which is exemplified by δ) sputtering, physical or vapor deposition, evaporation, or It is the electroless 16 1325872 plating carried out by the reduction reaction. Use silver or nickel seed coating, while silver seed coating is better. 0 Apply silver on the surface of the polymer shim (as shown in Figure 2). Or a shim (usually formed of nickel) can be prepared from the polymer shim ' by electroforming. The silver seed coating (25) provides a conductive function for the subsequent electroforming step. Instead of the sputtering method or the evaporation method, it can be used for silver coating. The silver coating preferably has a thickness of from about 〇 〇丄 to about 丄 micron, more preferably from about 〇.〇5 to about 〇·5 μm. A passivation treatment may be selectively performed on the surface of the silver coating to reduce the adhesion between the silver coating and the subsequent nickel layer. Finally, a layer of nickel (26) is deposited on the silver coated polymer shim, and then the polymer shim is separated from the first generation of the niobium model or the shim (27). . By the roll-on method of the present invention, it is possible to produce a plurality of sheets of polymer shim (23) at a high speed, thus enabling a first generation model or thin pad having the same structure as the main mold (22). The sheet can be mass produced. Alternatively, the first generation model or shim produced (3 in the figure) can be used in the mass production of second generation polymer sheets. It can also be prepared by a first generation model or a thin sheet of the type B. roller type by inspection or roller type except for the flat first generation punch or thin sheet (for example) as illustrated in FIG. A first-generation model or a thin sheet (34) of the type 17 1325872 in which the two edges of the flat coated silver polymer thin sheet (3 inch) of the present invention are joined together to form a silver-plated pattern Inwardly, the bonding method employed is as described above. An adhesive is selectively applied to the slit line to insert the bonded cylindrical polymer web (31) and fit snugly within a cylindrical outer casing (32). An anode rod or a cylindrical blue (33) was inserted into the center, and electroforming was carried out on the cathode polymer sheet (31). The composite of the cylindrical first generation model or the thin tantalum sheet and the silver coated polymer sheet (30) is then removed from the outer shell (32). The silver coated polymer shim (3〇) is then physically separated, for example by cutting the polymer shim, and then by stripping or by learning the polymer The thin sheet (30) is removed from the first generation model or shim (34). In addition, after the polymer shim is assembled into the cylindrical casing (1)) (as described above), It is also possible to complete (iv) a coating (35) on the polymer web (3 Å) by, for example, sputtering. The first generation model or the batt sheet produced by this method does not have a visible slit or S weld line. It is also possible to use an adjustable cylindrical outer casing bracket 1 having a notch perpendicular to the circular surface to be supported together, to be fastened... the polymer thin crucible is precisely cut into two seed layers and broadcasted to The inward-facing species: ^^—adjustable cylindrical housing bracket. By tightening the screws, the two ends of the compound gasket are joined together. The 18 1325872 bonded polymer shim can be used directly in the subsequent electroforming process without the need for an edge adhesive. Using such an adjustable cylindrical support, the electroformed part can be retrieved from the round body by loosening the screw. After the electroforming, and after removing the first generation of the mold or the thin web from the cylindrical outer casing, it may be necessary to polish the slit line. The present invention can be applied to the preparation of any of the embossing methods used in the embossing tool' includes the common US-original number 09/518/488 filed on March 3, 2000 (corresponding to wool/ The microembossing method of '67170) and the contents thereof will be complete and incorporated herein by reference. More specifically, the first generation model or sheet can be used to prepare the microcups referred to herein. V. Polishing of the surface of the model Although the first generation of the model or shim prepared by the present invention generally has a smooth surface and a uniform depth of the groove, it can • by post-facing the surface of the model - Polished to further improve. In the discussion that follows, the model or 'thin slab, which is directly prepared from the polymer shims, is called the "first generation model or shim" to distinguish the model of the future generation. sheet. Figure 6 is a cross section showing the first generation model produced by the present invention, showing the protruding elements (6 〇 ) and the grooves (6 work). In the manufacture of the microcups described in the commonly-owned USSN 09/518,488, the protruding elements correspond to the microcups, and the grooves correspond to the dividing edges interposed between the microcups. wall. 1325872 The surface of the model after polishing can be performed in multiple steps • and begins with a very flat first generation model. The height of the protruding element in the first generation model, or the depth of the groove, can be measured using, for example, a surface profile. The first generation model is then mounted on a precisely flat • surface sheet. This step is important because the back (6 2) is used as a reference point for height. The first generation model with the surface sheet is then mounted on a linear step connected to a polishing system, such as the φ Buehler Automet 2 polishing system. The system uses a power head that has an attachment for a variety of different grades of polishing cloth, rotating at various speeds to suit a variety of different degrees of polishing. The first generation model will move under the polishing head and the polishing head will become in contact with the model surface (63). In one specific aspect, a 6 micron Metadi Supreme Polycrystalline Diamond Suspension and a Buehler Texmet 1000 polishing cloth were used. In the preferred case, it is used in the form of φ mobile carriers at a desired pressure for continuous polishing of the surface. In order to avoid undesired contamination of the gravel or powder from the polishing step, a removable mask coating or a filling material may be applied to the structure, in particular the groove, such as wax, A siloxane, or a solvent that is soluble in other solvents or water-soluble. 5微米来。 The polishing step is repeated until the surface is smooth or the height of the protruding element is uniform; the average height difference is less than about 1 micron, more preferably less than about 0.5 micro. Then, the abrasive particles, gravel, debris, and mask coating (if - present) left by polishing 20 1325872 are then mechanically cleaned, then solvent washed, ultrasonic bathed, or rinsed. Remove. Production after the model or shim is usually required. The second generation model or shim (corresponding to 4 in Figure 1 and also shown in Figure 7) has the same structure as the polymer shim and is comparable to the first generation model similar. The purpose of having a second-generation model is not only to sharpen the end point (70) of the sharp angle in φ, but also to further ensure the consistency of the height (71) of the dividing side wall. This polishing step is similar to those used for the polishing of the first generation model. For the first step, the height of the dividing side wall is measured and then the reference point is determined. A second generation model having a surface sheet is then mounted on a linear step connected to a polishing system and moved under the polishing head, and the polishing head becomes in contact with the top surface to sharpen the angle The end point (70) (if present), and the extra height (72) are worn away to ensure the consistency of the height of the dividing side wall. The conditions under which the second generation model is polished (i.e., set and period) are similar to those used for the polishing of the first generation model. After the second generation model is polished and cleaned, the model can be further produced (if necessary) to ensure the high quality of the final model. [Embodiment] The following embodiments are intended to provide a better understanding of and to practice the invention. These examples are not to be considered as limiting the scope of the invention, but only as a description and representative of the invention. Example 1 A. Primer layer In a beaker containing 5 grams of aliphatic polyurethane (P9815, Huntsman, New Jersey), 647 3 grams of MEK, and 300 grams of cyclohexanone (CH) were added. 〇), 3〇 gram of CN983 (uv oligo from Sartomer 'Pennsylvania), i 5 gram of EB129 〇 (UV valency polymer from UCB Chemicals, Georgia), 1. 72 gram IrgaCure 369 (2-Benzyl-2(dimethylamino)-i-[4 _(4-morpholinyl)phenyl]-butanone, Ciba Specialty Chemicals, Pennsylvania), 35 gram of ιτχ (SarCure SR1124) , 2-isopropyl thioxanthone (is〇pr〇pyl αίοχΜΗοΜ), from Sartomer, Pennsylvania), and 〇43 grams

Irganox 1 035 (硫二乙烯-二(3,5 二(叔)-丁基一 4 —羥基苯基丙酸十八碳醇酯),(:iba specialty Chemicals,賓夕法尼亞州),並均質地混合。利用具有 大約為0 . 4微米之目標乾燥厚度的# 3 Meyer垂伸棒, 將最終所產生之底漆溶液塗佈在一 pET基板上。將該經乾 燥化之薄膜暴露於1 · 5 J/Cm2之空氣中的uv光(Fusi〇n UV ’ D燈)之下。 B .聚合物薄墊片 22 1325872 表1 :聚合物薄墊片的組成 成份 實施例1(份數) PBMA-IBMA 30 · 00 EB810 15-75 HDDA 47-25 EM360 7-00 Irgacure 369 1 · 2 5 Irgacure 1035 0 · 5 0 利用MEK將實施例1 B (表1 )的組成物加以稀釋,並 將其塗佈在該經底漆層塗佈之PET( 10 mil),以具有 2 5微米之目標乾燥厚度。將該塗層進行乾燥,然後再於 1 6 0 °F以及5 0 ps i下,利用一個主模進行壓花,以用 於形成微形杯(110微米高度和2 5. 5微米的深度), 利用UV透過該PET基板的背部而進行曝光(0. 068 J/cm2, F u s i ο n U V,D燈),最後再從該可壓花組成物的一側進行 UV 後固化(2 J/cm2)。Irganox 1 035 (thiodiethylene-bis(3,5 di(tert-)-butyl-4-hydroxyphenylpropionic acid octadecyl alcohol), (: iba specialty Chemicals, Pennsylvania), and homogeneously mixed. The resulting primer solution was coated onto a pET substrate using a #3 Meyer drawbar having a target dry thickness of about 0.4 microns. The dried film was exposed to 1 · 5 J/ Under the uv light in the air of Cm2 (Fusi〇n UV 'D lamp) B. Polymer shim 22 1325872 Table 1: Composition of polymer shim Example 1 (parts) PBMA-IBMA 30 · 00 EB810 15-75 HDDA 47-25 EM360 7-00 Irgacure 369 1 · 2 5 Irgacure 1035 0 · 5 0 The composition of Example 1 B (Table 1) was diluted with MEK and applied to it. The primer layer coated PET (10 mil) to have a target dry thickness of 25 microns. The coating was dried and then subjected to a master mold at 160 °F and 50 psi. Embossing for forming a microcup (110 micron height and 2 5. 5 micron depth), using UV to pass through the back of the PET substrate Exposure line (0. 068 J / cm2, F u s i ο n U V, D lamp), and finally post curing UV (2 J / cm2) from the side of the embossable composition of.

表2:化學物質與供應商 全名 供應商 PBMA-IBMA 聚(丁基甲基丙烯酸酯一共一異丁基曱基丙烯酸酯) Aldrich EB810 Ebecryl 81 0 (聚酯丙稀酸酯寡聚物) UCB chemical HDDA HD0DA (1, 6—己二醇二丙烯酸酯) UCB chemical Ebl360 Ebecryl 1360 (丙烤酸酯化之石夕氧坑寡聚物) UCB chemical Irgacure 369 Irgacure 369 Ciba Specialty Chemial Irgacure 1035 Irgacure 1035 Ciba Specialty Chemial MEK 曱乙酮 EM Science 23 1325872 利用一台Wyko NT1000表面輪廓器,來量測該聚合物 薄墊片之深度與街道寬度,作為橫跨該腹板方向之位置的 函數。圖4 係顯示該經製備之聚合物薄墊片,具有非常 一致的微形杯深度以及街道寬度。 • 藉由竣錄(Perkin Elmer模型2400 ),將一層銀的薄 - 層(大約2〇〇 nm)沉積在該聚合物薄墊片上,以使其 具有導電性。在該濺鍍步驟之前,先將該聚合物薄墊片進 φ 订電晕的處理。然後’利用5 %重鉻酸鉀(A1 dr i ch,密 棘里州)溶液於5 0 °C下將該銀層進行鈍化大約3分 釦’以改良之後所電鑄成形之Ni薄墊片從該聚合物薄墊 片上的分離。 貫施例2 藉由電禱成形製備該第一代模型 在4 5 C下’於一種氨基磺酸鎳(來自於MacDermid, 力口州 1 、、々、々 + '合文中,將該經鈍化之塗佈銀之聚合物薄墊片進行 成形,到達一希冀的厚度,其中該溶液包含大約7 5 /ft^鎳離子以及大約3Q gm/L 酸,並具有15 amp 成步之之電流密度’以及PH值等於4。然後,將該經電鎢 崎入第代模型,藉由剝離或脫除該聚合物層,而從該 t合物薄墊片上分離開來。 實施例3 將二片聚合物薄墊片接合 將兩片聚合物薄势Η 士 & 其圖 墊片比鄰放置在一個玻璃板上,並使 阐案的一侧面向下。右 社塗佈—層黏著劑以前,藉由1 〇 24 1325872 kv之靜電產生器將靜電力施加到該兩片聚合物薄塾片上。 將該黏著劑(ΝΟΑ 68,來自於NQrUnd pr論…⑻·, 組澤西州)塗佈至該缝隙線上,然後再藉由uv加以固化。 該經接合之聚合物薄墊片@ 3D表面輪廓係顯示於圖5 中。介於縫隙線之兩侧的高度差,量測出來係小於1微 米(圖4 )。 實施例4Table 2: Chemicals and suppliers full name supplier PBMA-IBMA Poly(butyl methacrylate mono-isobutyl methacrylate) Aldrich EB810 Ebecryl 81 0 (polyester acrylate oligomer) UCB chemical HDDA HD0DA (1,6-hexanediol diacrylate) UCB chemical Ebl360 Ebecryl 1360 (acrylic acid ester of urethane) UCB chemical Irgacure 369 Irgacure 369 Ciba Specialty Chemial Irgacure 1035 Irgacure 1035 Ciba Specialty Chemial MEK Ethyl Ketone EM Science 23 1325872 A Wyko NT1000 surface profiler was used to measure the depth of the polymer shim and the width of the street as a function of the position across the web. Figure 4 shows the prepared polymer shim with a very consistent microcup depth and street width. • A thin layer of silver (approximately 2 〇〇 nm) was deposited on the polymer shim by electroporation (Perkin Elmer Model 2400) to make it electrically conductive. Prior to the sputtering step, the polymer shim is first processed into a corona treatment. Then, 'the passivation of the silver layer at 50 ° C with a solution of 5 % potassium dichromate (A1 dr i ch, Tiberia) is about 3 deductions' to improve the electroformed Ni thin shim after the electroforming Separation from the polymer shim. Example 2: The first generation model was prepared by electro-pray shaping at 4 5 C' in a nickel sulfamate (from MacDermid, Likou Prefecture 1, 々, 々 + ', which was passivated The silver coated polymer shim is shaped to a thickness of about 5% of the nickel ion and about 3 Q gm/L of acid and has a current density of 15 amp steps. And the pH is equal to 4. Then, the electro-tungsten is introduced into the first generation model, and the polymer layer is peeled off or removed, and separated from the t-compound. Example 3 The polymer shim joints are placed on two sheets of polymer thinner & the spacers are placed next to each other on a glass plate with the side of the illustration facing down. An electrostatic force was applied to the two sheets of polymer crucible by an electrostatic generator of 1 〇 24 1325872 kv. The adhesive (ΝΟΑ 68, from NQrUnd pr... (8)·, Group Jersey) was applied to the The slit line is then cured by uv. The bonded polymer shim @ 3D surface profile The system is shown in Figure 5. The difference in height between the two sides of the slit line is less than 1 micrometer (Figure 4).

可脫除之聚合物薄墊片 表3:鹼性可脫離之聚合物薄墊片的組成 成份 份數 AC 3 1 5 40 · 〇〇 EB8 10 13-25 HDDA 39 · 75 Eb 1 360 7 · 00 Irgacure 369 1 · 25 Irganox 1035 0 · 50 表4:化學物質與供應商Removable polymer shims Table 3: Composition of alkaline detachable polymer shims AC 3 1 5 40 · 〇〇EB8 10 13-25 HDDA 39 · 75 Eb 1 360 7 · 00 Irgacure 369 1 · 25 Irganox 1035 0 · 50 Table 4: Chemicals and Suppliers

(丙烯酸酯共聚物) 州) 成份 AC3 1 5 進行實施例1的程序,除了使用一箱 種包括鹼性可溶黏 著劑Avalure AC315的組成物以外,如| 表3中所顯示。將 該組成物進行塗佈、乾燥、 然後再於2 5 0 °F以及8 0 psi下, 利用一個主模進(Acrylate Copolymer) State) AC3 1 5 The procedure of Example 1 was carried out except that a box of a composition including the alkaline soluble adhesive Avalure AC315 was used, as shown in Table 3. The composition was coated, dried, and then subjected to a master mold at 2500 °F and 80 psi.

25 1325872 . 行壓花’以用於形成微形杯(1 1 〇微米高度和2 2微米 - 的深度),利用UV透過該PET基板的背部而進行曝光(〇 , 0 6 8 J/cm2’FusionUV,D燈),最後再從該可壓花 組成物的一侧進行UV後固化(2 J/cm” ^從輪廓計量 . 測來看,很明顯該主模之微結構很精確地被轉換成該聚合 - 物薄塾片。 一個第一代模型,同樣是使用此實施例之聚合物薄墊 φ 片,並以相同於實施例1中的方式進行製造。利用微調MF CD-2 6 (來自於Rohra Hass)(其係為一種〇 26N氫氧 化四甲銨溶液)將該聚合物層剝離或脫除,而輕易地將該 經電鑄成形之第一代模型從該聚合物薄墊片分離。. ,雖然本發明已參考其特定具體態樣而被說明但應為 热習本技藝之人士所瞭解地是,在不背離本發明之精神與 範疇的狀況下,可做各種改變並可以相當物取代。此外:、 可做許多的改良,而將一特定的情況、材料、組成、方法、 鲁方法步驟或諸步驟適用於本發明之目的、精神與範嘴。所 有的該改良希冀落於所附申請專利範圍的範疇中。 【圖式簡單說明】 圖1係說明本發明之術語。 圖2係為為形成一聚合物薄墊片的圖式方法流程。 圓3係為無焊縫之薄塾片製備方法的概要圖式說明。 深度圖4係、顯示根據本發明之接合薄墊片的寬度或者是25 1325872 . Row embossing 'for forming a microcup (1 1 〇 micron height and 2 2 micron - depth), using UV to penetrate the back of the PET substrate for exposure (〇, 0 6 8 J/cm2' FusionUV, D lamp), and finally UV post-cure from the side of the embossable composition (2 J/cm) ^ From the profile measurement. It is obvious that the microstructure of the main mode is accurately converted. The polymer-thin film was used. A first-generation model, also using the polymer thin pad φ sheet of this example, was fabricated in the same manner as in Example 1. Using fine-tuning MF CD-2 6 ( The polymer layer was peeled off or removed from Rohra Hass (which is a 〇26N tetramethylammonium hydroxide solution), and the electroformed first generation model was easily removed from the polymer shims. The present invention has been described with reference to the specific embodiments thereof, and it is understood by those skilled in the art that various changes can be made without departing from the spirit and scope of the invention. Substitute substitution. In addition: many improvements can be made, and a specific situation will be The materials, compositions, methods, methods, steps, or steps are applicable to the purpose, spirit, and scope of the present invention. All such modifications are intended to fall within the scope of the appended claims. The terminology of the present invention is illustrated in Figure 2. Figure 2 is a schematic flow diagram of a method for forming a polymer shim. Round 3 is a schematic illustration of a method for preparing a thin tantalum without a weld. The width of the joint shim of the present invention is either

圖5係為本發明之接合聚合物薄墊片的密封線的SEM 26 1325872 照片。 圖6係說明第一代模型的橫截面觀圖,其係顯示突出 元件以及溝槽。 圖7係說明第二代模型。 【主要元件符號說明】 1 ·主模 2 ·聚合物薄墊片 3 ·第一代模型或薄墊片 4 ·第二代模型或薄墊片 2 0 ·可壓花組成物 2 1 ·基板 2 2 *主模 2 3 ·聚合物薄墊片 2 4 .表面處理 2 5 ·導電種子層塗佈 2 6 *電鑄成形 2 7 ·薄墊片 3 1 ·聚合物薄墊片 3 2 ·外殼 3 3 ·陽極棒或圓柱狀籃 3 4 ·第一代模型或薄墊片 3 5 ·銀塗層 6 0 ·突出元件 6 1 ·溝槽 27 1325872Figure 5 is a SEM 26 1325872 photograph of a sealing line for a bonded polymer shim of the present invention. Figure 6 is a cross-sectional view showing the first generation model showing the protruding elements and the grooves. Figure 7 illustrates the second generation model. [Description of main component symbols] 1 ·Main mold 2 ·Polymer gasket 3 ·First generation model or shim 4 ·Second generation model or shim 2 0 ·Compressible composition 2 1 ·Substrate 2 2 *Main mold 2 3 ·Polymer shim 2 4 .Surface treatment 2 5 ·Electrical seed layer coating 2 6 *Electroforming 2 7 ·Mask 3 1 ·Polymer gasket 3 2 ·Shell 3 3 · Anode rod or cylindrical basket 3 4 · First generation model or shim 3 5 · Silver coating 6 0 · Protruding element 6 1 · Groove 27 1325872

6 2 ·背面 6 3 ·模型表面 7 0 ·端點 71·分隔邊壁之高度 7 2 ·額外的高度 286 2 ·Back 6 3 ·Model surface 7 0 ·End point 71·Separate height of the side wall 7 2 ·Extra height 28

Claims (1)

Hf 正姒 j . ju〕: 十、申請專利範圍: ι^ί:_j 1^§^ι ———. ,j u種用於製備第一代模型的方法,其包括: 人a )攸包含選擇性地經塑化劑或溶劑塑化之熱塑性聚 合物的組成物形成聚合物薄墊片; b)塗佈一層導電種子層;以及 c )電鑄成形以形成該第一代模型。 2·種用於製備第一代模型的方法,其包括: a)從包含多官能單體或寡聚物的組成物形成聚合物 薄墊片; b)塗佈一層導電種子層;以及 c )電鱗成形以形成該第一代模型。 3·根據中請專利範圍第1或2項之方法,其+在〇和 b)之間進一步包括:將任何的缺陷從該聚合物薄墊片上 切除’並且將剩餘的聚合物薄墊片接合。Hf 正姒j. ju]: X. Patent application scope: ι^ί:_j 1^§^ι ———. , ju method for preparing the first generation model, including: person a) 攸 contains selection The composition of the thermoplastic polymer plasticized by a plasticizer or solvent forms a polymer shim; b) coating a layer of conductive seed; and c) electroforming to form the first generation model. 2. A method for preparing a first generation model comprising: a) forming a polymer shim from a composition comprising a polyfunctional monomer or oligomer; b) coating a layer of a conductive seed; and c) The scale is shaped to form the first generation model. 3. According to the method of claim 1 or 2 of the patent application, the + between 〇 and b) further comprises: removing any defects from the polymer shim 'and leaving the remaining polymer shim Engage. 4.根據中請專利^圍第項之方法,其中在和 b)之間進一步包括:將該聚合物薄墊片表面處理。 5·根據中請專利範圍第項之方法其中在之 後進一步包括:將該第一代模型拋光。 6.根據申請專利範圍第4項之方 電晕或電聚處理或uv輻射。 中該表面處理為 ^根據中請專利範圍第項之方法,其中該導電種 子層為銀、鎳或鎳一鉻合金之薄層。 8 ·根據申請專利範圍第 為一層銀薄層。 7項之方法,其中該導 電種子層 29 f1325872 反應所進行的無電鍍來加以塗佈4. The method of claim 2, wherein between b) and b) further comprising: surface treating the polymeric shim. 5. The method of claim 2, wherein the method further comprises: polishing the first generation model. 6. Corona or electropolymerization or uv radiation according to item 4 of the scope of the patent application. The surface treatment is according to the method of claim 1, wherein the conductive seed layer is a thin layer of silver, nickel or nickel-chromium alloy. 8 · According to the scope of the patent application, a thin layer of silver. The method of item 7, wherein the conductive seed layer 29 f1325872 is subjected to electroless plating for coating 1 〇.根據申請專利範圍第 成形係以一層鎳層來執行。 11·根據申請專利範圍第 銀塗層之表面的鈍化處理。 12·根據申請專利範圍第 代模型係平坦的。 1或2項之方法’其中該電鑄 8項之方法,更進—步包括該 1或2項之方法,其中該第一 13.根據申請專利範圍第…項之方法,#中該第一 代模型為圓柱狀或者是滾輪形式。 14· 一種用於製備第一代模型的方法其包括: a)以包括多官能單體或寡聚物及可溶於或可分散於 有機溶劑或鹼性溶液中的黏著劑或增稠劑的組成物形成聚 合物薄墊片,其中該多官能單體或寡聚物係選自於由多官 能丙烯酸酯、多官能甲基丙烯酸酯、多官能乙烯基、多官 能乙烯醚、多官能烯丙基、多官能環氧化物及其他包含可 交聯官能基的單體或寡聚物所組成之群組; )從該聚合物薄墊片形成第一代模型;以及 c)將該聚合物薄墊片脫除。 15·根據申請專利範圍第14項之方法,更進一步包括利 用鹼性溶液來清潔該第一代模型。 16.根據申請專利範圍第15項之方法,其中該鹼性溶液 為氫氧化四甲錢。 30 1325872 17· 一種用於製借 ’備t s物薄墊片的士、 a)從包含選樓 法,其包括: 遷擇性地纟、 合物的組成物形成至小— & $ '合劑塑化之熱塑性聚 夕 片聚合物薄整片. b )將缺陷從所 ’ 有的斌合物薄墊片上.、 c )將實質上不包含 ’、,以及 +匕3缺陷的聚合物薄墊片 18.—種用於製備奄人 茌。在一起。 稱聚合物薄墊片的方法,其 a) 從包含多官能單 . 月匕早體或养聚物的組成物 片聚合物薄墊片; > 一 b) 將缺陷從所有的聚合物薄墊片上切除;以及 c) 將實質上不包含缺陷的聚合物薄墊片接合在一起。 Η—、圖式: 如次頁1 〇. According to the scope of the patent application, the forming system is performed with a layer of nickel. 11. Passivation treatment of the surface of the silver coating according to the patent application. 12. The model of the first generation is flat according to the scope of the patent application. The method of 1 or 2, wherein the method of electroforming 8 or more includes the method of the 1 or 2, wherein the first 13. according to the method of the patent application scope, the first The generation model is cylindrical or in the form of a roller. 14. A method for preparing a first generation model comprising: a) comprising an adhesive or thickener comprising a polyfunctional monomer or oligomer and being soluble or dispersible in an organic solvent or alkaline solution; The composition forms a polymer shim, wherein the polyfunctional monomer or oligomer is selected from the group consisting of polyfunctional acrylates, polyfunctional methacrylates, polyfunctional vinyls, polyfunctional vinyl ethers, polyfunctional olefins Group of polyfunctional epoxides and other monomers or oligomers comprising crosslinkable functional groups; ) forming a first generation model from the polymer shims; and c) thinning the polymer The gasket is removed. 15. The method of claim 14, further comprising cleaning the first generation model with an alkaline solution. 16. The method of claim 15, wherein the alkaline solution is tetramethyl hydroxide. 30 1325872 17· A method for the manufacture of a sluice shims, a) from the inclusion of a house selection method, which includes: the formation of a selective sputum, the composition of the composition to a small - & Plasticized thermoplastic polythene polymer thin sheet. b) Defects from the 'battery's thin shim. · c) will not contain ',, and +匕3 defects in the polymer thin Gasket 18. - used to prepare cockroaches. Together. A method of weighing a polymer shim, which a) a sheet of polymer from a composition comprising a polyfunctional single. sputum precursor or an oligomer; > a) a defect from all of the polymer thin pads On-chip resection; and c) joining together polymer shim substantially free of defects. Η—, schema: as the next page 31 1325872 V ·· * f.r* : c .. 本 A 5S K i' 補先 七、指定代表圖: —----d (一) 本案指定代表圖為:第(1 )圖。 (二) 本代表圖之元件符號簡單說明: 1 ·主模 2 ·聚合物薄墊片 3 ·第一代模型或薄墊片 4·第二代模型或薄墊片31 1325872 V ·· * f.r* : c .. This A 5S K i' Supplementary VII. Designated representative figure: —----d (1) The representative representative figure of this case is: (1). (2) The symbol of the symbol of this representative figure is simple: 1 · main mold 2 · polymer shim 3 · first generation model or shim 4 · second generation model or shim 八、本案若有化學式時,請揭示最能顯示發明特徵的化學式: (無)8. If there is a chemical formula in this case, please disclose the chemical formula that best shows the characteristics of the invention: (none)
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