TW200603930A - Method of providing consistent quality of target material removal by lasers having different output performance characteristics - Google Patents

Method of providing consistent quality of target material removal by lasers having different output performance characteristics

Info

Publication number
TW200603930A
TW200603930A TW094117475A TW94117475A TW200603930A TW 200603930 A TW200603930 A TW 200603930A TW 094117475 A TW094117475 A TW 094117475A TW 94117475 A TW94117475 A TW 94117475A TW 200603930 A TW200603930 A TW 200603930A
Authority
TW
Taiwan
Prior art keywords
lasers
target material
performance characteristics
material removal
different output
Prior art date
Application number
TW094117475A
Other languages
English (en)
Other versions
TWI357842B (en
Inventor
Wei-Sheng Lei
Glenn Simenson
Jeff Howerton
Mark Unrath
Original Assignee
Electro Scient Ind Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Electro Scient Ind Inc filed Critical Electro Scient Ind Inc
Publication of TW200603930A publication Critical patent/TW200603930A/zh
Application granted granted Critical
Publication of TWI357842B publication Critical patent/TWI357842B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/10—Controlling the intensity, frequency, phase, polarisation or direction of the emitted radiation, e.g. switching, gating, modulating or demodulating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
    • H05K3/0032—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/34—Coated articles ; Surface treated articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/34—Coated articles ; Surface treated articles
    • B23K2101/35—Surface treated articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/16—Composite materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/30—Organic materials
    • B23K2103/42—Plastics other than composite materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic materials other than metals or composite materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/163—Monitoring a manufacturing process

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Electromagnetism (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laser Beam Processing (AREA)
TW094117475A 2004-05-28 2005-05-27 Method of providing consistent quality of target m TWI357842B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US57522804P 2004-05-28 2004-05-28
US11/131,432 US7985942B2 (en) 2004-05-28 2005-05-17 Method of providing consistent quality of target material removal by lasers having different output performance characteristics

Publications (2)

Publication Number Publication Date
TW200603930A true TW200603930A (en) 2006-02-01
TWI357842B TWI357842B (en) 2012-02-11

Family

ID=35425202

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094117475A TWI357842B (en) 2004-05-28 2005-05-27 Method of providing consistent quality of target m

Country Status (8)

Country Link
US (1) US7985942B2 (zh)
JP (2) JP2008515634A (zh)
KR (1) KR101147799B1 (zh)
CN (1) CN101427427B (zh)
DE (1) DE112005001225T5 (zh)
GB (1) GB2429422B (zh)
TW (1) TWI357842B (zh)
WO (1) WO2005119860A2 (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI426971B (zh) * 2007-06-01 2014-02-21 伊雷克托科學工業股份有限公司 雷射鑽出具有改良錐度之孔洞的方法和裝置

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8198566B2 (en) * 2006-05-24 2012-06-12 Electro Scientific Industries, Inc. Laser processing of workpieces containing low-k dielectric material
US7605343B2 (en) * 2006-05-24 2009-10-20 Electro Scientific Industries, Inc. Micromachining with short-pulsed, solid-state UV laser
US8116341B2 (en) * 2007-05-31 2012-02-14 Electro Scientific Industries, Inc. Multiple laser wavelength and pulse width process drilling
JP5192213B2 (ja) * 2007-11-02 2013-05-08 株式会社ディスコ レーザー加工装置
US8173931B2 (en) * 2008-06-13 2012-05-08 Electro Scientific Industries, Inc. Automatic recipe management for laser processing a work piece
US20100078418A1 (en) * 2008-09-26 2010-04-01 Electro Scientific Industries, Inc. Method of laser micro-machining stainless steel with high cosmetic quality
US8648277B2 (en) * 2011-03-31 2014-02-11 Electro Scientific Industries, Inc. Laser direct ablation with picosecond laser pulses at high pulse repetition frequencies
JP2016508069A (ja) 2012-11-29 2016-03-17 コーニング インコーポレイテッド 基板をレーザー穿孔するための犠牲カバー層およびその方法
US10410883B2 (en) 2016-06-01 2019-09-10 Corning Incorporated Articles and methods of forming vias in substrates
US10134657B2 (en) 2016-06-29 2018-11-20 Corning Incorporated Inorganic wafer having through-holes attached to semiconductor wafer
US10794679B2 (en) 2016-06-29 2020-10-06 Corning Incorporated Method and system for measuring geometric parameters of through holes
US11078112B2 (en) 2017-05-25 2021-08-03 Corning Incorporated Silica-containing substrates with vias having an axially variable sidewall taper and methods for forming the same
US10580725B2 (en) 2017-05-25 2020-03-03 Corning Incorporated Articles having vias with geometry attributes and methods for fabricating the same
US12180108B2 (en) 2017-12-19 2024-12-31 Corning Incorporated Methods for etching vias in glass-based articles employing positive charge organic molecules
US11554984B2 (en) 2018-02-22 2023-01-17 Corning Incorporated Alkali-free borosilicate glasses with low post-HF etch roughness
CN109648192A (zh) * 2018-12-10 2019-04-19 成都莱普科技有限公司 激光钻孔机能量控制方法
FR3089451B1 (fr) * 2018-12-11 2022-12-23 Saint Gobain Vitrage feuilleté comprenant un substrat transparent à couche chauffante ayant des lignes de flux dont l’ensemble est de largeur variable

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2002A (en) * 1841-03-12 Tor and planter for plowing
US5656186A (en) * 1994-04-08 1997-08-12 The Regents Of The University Of Michigan Method for controlling configuration of laser induced breakdown and ablation
GB2290411A (en) 1994-06-15 1995-12-20 Zeiss Stiftung Laser and adapter for mounting it on a surgical microscope
JPH1099980A (ja) 1996-09-30 1998-04-21 Toshiba Corp 積層部材の加工方法
DE19734732A1 (de) 1996-12-10 1998-06-18 Wavelight Laser Technologie Gm Vorrichtung für die Behandlung von Körpersubstanzen
US6333485B1 (en) * 1998-12-11 2001-12-25 International Business Machines Corporation Method for minimizing sample damage during the ablation of material using a focused ultrashort pulsed beam
JP5079942B2 (ja) 1999-04-07 2012-11-21 サン−ゴバン グラス フランス ソシエテ アノニム 担体材料上の薄層の剥離のための装置及び方法
US6229114B1 (en) * 1999-09-30 2001-05-08 Xerox Corporation Precision laser cutting of adhesive members
TW503143B (en) * 2000-10-06 2002-09-21 Hitachi Via Mechanics Ltd Method and apparatus for drilling printed wiring boards
JP2002335063A (ja) * 2001-05-09 2002-11-22 Hitachi Via Mechanics Ltd プリント基板の穴あけ加工方法および装置
CA2436736A1 (en) 2001-01-31 2002-08-08 Electro Scientific Industries, Inc. Ultraviolet laser ablative patterning of microstructures in semiconductors
US6639177B2 (en) * 2001-03-29 2003-10-28 Gsi Lumonics Corporation Method and system for processing one or more microstructures of a multi-material device
US6864457B1 (en) 2002-02-25 2005-03-08 The Board Of Regents Of The University Of Nebraska Laser machining of materials
DE10209617C1 (de) 2002-03-05 2003-08-07 Siemens Ag Laserbeschriftungsverfahren
US6809291B1 (en) 2002-08-30 2004-10-26 Southeastern Universities Research Assn., Inc. Process for laser machining and surface treatment
JP2004114094A (ja) 2002-09-26 2004-04-15 Kyocera Corp プリプレグシートのレーザによる穿孔方法
US6979798B2 (en) 2003-03-07 2005-12-27 Gsi Lumonics Corporation Laser system and method for material processing with ultra fast lasers
JP2006224174A (ja) 2005-02-21 2006-08-31 Sumitomo Heavy Ind Ltd レーザ加工装置及びパルスエネルギのしきい値設定方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI426971B (zh) * 2007-06-01 2014-02-21 伊雷克托科學工業股份有限公司 雷射鑽出具有改良錐度之孔洞的方法和裝置

Also Published As

Publication number Publication date
TWI357842B (en) 2012-02-11
WO2005119860A2 (en) 2005-12-15
JP2008515634A (ja) 2008-05-15
GB2429422A (en) 2007-02-28
JP5635139B2 (ja) 2014-12-03
KR20070019741A (ko) 2007-02-15
CN101427427A (zh) 2009-05-06
US20050265408A1 (en) 2005-12-01
US7985942B2 (en) 2011-07-26
GB2429422B (en) 2008-06-11
JP2013099792A (ja) 2013-05-23
KR101147799B1 (ko) 2012-05-18
CN101427427B (zh) 2012-03-21
WO2005119860A3 (en) 2009-04-09
DE112005001225T5 (de) 2007-06-28
GB0623282D0 (en) 2007-01-03

Similar Documents

Publication Publication Date Title
TW200603930A (en) Method of providing consistent quality of target material removal by lasers having different output performance characteristics
ATE476482T1 (de) Tinten mit verbesserter leistung
SI1790427T1 (sl) Postopek rezanja kosa iz jekla C-Mn s pomočjo vlakna, ki vsebuje iterbij
DE602006009765D1 (de) Schneideeinsatz mit veränderlichem anschnittwinkel an der spitzenschnittkante
EP1696522A3 (en) Passively Q-switched laser with adjustable pulse repetition rate
CA2618526A1 (en) Fiber pulse laser apparatus and method of control the same
TW200618919A (en) Laser processing method
TW200627116A (en) Method of forming a multi-phase power supply controller
SG119217A1 (en) Workpiece dividing method utilizing laser beam
TWI318590B (en) Device and method to create a low divergence, high power laser beam for material processing applications
WO2006020946A3 (en) Dual pulse-width medical laser with presets
WO2011001257A3 (en) Welding device, electrode head and method
DE602004018223D1 (de) Verfahrem zum Elektronenstrahlschweissen mit Wärmenachbehandlung
WO2009060569A1 (ja) ローラ加工方法、およびローラ加工装置
WO2007044789A3 (en) Apparatus and method for generating short optical pulses
DE102004032093B4 (de) Durch einen selektiven Lasersintervorgang (SLS) hergestelltes Bauteil
WO2011156033A3 (en) Laser source that generates a rapidly changing output beam
WO2009090643A3 (en) Laser surgical method
TW200714398A (en) Laser machining apparatus and method of adjusting the same
TW200726563A (en) Laser processing device, program preparation device, and laser processing method
LT2089943T (lt) Lazerinė sistema su pikosekundine impulsine emisija
DE602005017760D1 (de) Gesteuerter laser mit moduliertem sättigbaren absorber
ZA200908350B (en) Electric fence energiser system
TW200739995A (en) Laser irradiation apparatus
NL1032243A1 (nl) Hoog-rendement bundelverdeling met onafhankelijke golffrontcorrectie.

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees