TW200739995A - Laser irradiation apparatus - Google Patents

Laser irradiation apparatus

Info

Publication number
TW200739995A
TW200739995A TW095148349A TW95148349A TW200739995A TW 200739995 A TW200739995 A TW 200739995A TW 095148349 A TW095148349 A TW 095148349A TW 95148349 A TW95148349 A TW 95148349A TW 200739995 A TW200739995 A TW 200739995A
Authority
TW
Taiwan
Prior art keywords
laser
heads
irradiation apparatus
moves
laser irradiation
Prior art date
Application number
TW095148349A
Other languages
Chinese (zh)
Other versions
TWI327784B (en
Inventor
Byoung-Hyun Jung
You-Min Cha
Won-Woong Jung
Youn-Goo Roh
Original Assignee
Samsung Sdi Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Samsung Sdi Co Ltd filed Critical Samsung Sdi Co Ltd
Publication of TW200739995A publication Critical patent/TW200739995A/en
Application granted granted Critical
Publication of TWI327784B publication Critical patent/TWI327784B/en

Links

Classifications

    • EFIXED CONSTRUCTIONS
    • E06DOORS, WINDOWS, SHUTTERS, OR ROLLER BLINDS IN GENERAL; LADDERS
    • E06BFIXED OR MOVABLE CLOSURES FOR OPENINGS IN BUILDINGS, VEHICLES, FENCES OR LIKE ENCLOSURES IN GENERAL, e.g. DOORS, WINDOWS, BLINDS, GATES
    • E06B1/00Border constructions of openings in walls, floors, or ceilings; Frames to be rigidly mounted in such openings
    • E06B1/04Frames for doors, windows, or the like to be fixed in openings
    • E06B1/34Coverings, e.g. protecting against weather, for decorative purposes
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08Devices involving relative movement between laser beam and workpiece
    • B23K26/0869Devices involving movement of the laser head in at least one axial direction
    • B23K26/0876Devices involving movement of the laser head in at least one axial direction in at least two axial directions
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/067Dividing the beam into multiple beams, e.g. multi-focusing
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/067Dividing the beam into multiple beams, e.g. multi-focusing
    • B23K26/0676Dividing the beam into multiple beams, e.g. multi-focusing into dependently operating sub-beams, e.g. an array of spots with fixed spatial relationship or for performing simultaneously identical operations

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Civil Engineering (AREA)
  • Structural Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Electroluminescent Light Sources (AREA)
  • Radiation-Therapy Devices (AREA)
  • Recrystallisation Techniques (AREA)
  • Lasers (AREA)

Abstract

A laser irradiation apparatus includes a plurality of laser heads from which a laser 15 irradiated, can adjust arranged intervals of the laser heads, and moves freely to irradiate the laser along a shape of a subject. A laser oscillator oscillates a laser. A plurality of laser heads linearly irradiate the laser oscillated by the laser oscillator. A first driving means adjusts arranged intervals of the laser heads, and moves the laser heads in an X direction. A second driving means moves the laser heads in a Y direction different from the X direction.
TW095148349A 2006-03-08 2006-12-22 Laser irradiation apparatus TWI327784B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020060021890A KR100754146B1 (en) 2006-03-08 2006-03-08 Laser irradiator

Publications (2)

Publication Number Publication Date
TW200739995A true TW200739995A (en) 2007-10-16
TWI327784B TWI327784B (en) 2010-07-21

Family

ID=38110683

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095148349A TWI327784B (en) 2006-03-08 2006-12-22 Laser irradiation apparatus

Country Status (6)

Country Link
US (1) US7875828B2 (en)
EP (1) EP1832378B1 (en)
JP (1) JP4437127B2 (en)
KR (1) KR100754146B1 (en)
CN (1) CN101033111B (en)
TW (1) TWI327784B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI611469B (en) * 2012-12-27 2018-01-11 Samsung Display Co., Ltd. Multifunctional device for testing and etching a substrate and substrate processing device therewith

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JP2011060700A (en) * 2009-09-14 2011-03-24 Canon Inc Manufacturing method of image display device, and jointing method of base material
JP2011060699A (en) * 2009-09-14 2011-03-24 Canon Inc Manufacturing method of image display device and jointing method of base material
CN104395033B (en) 2012-07-04 2017-06-23 法国圣戈班玻璃厂 Apparatus and method for laser processing of large area substrates using at least two bridges
CN105023880A (en) * 2014-04-15 2015-11-04 上海微电子装备有限公司 Sealing device of glass packaging body
AT519177B1 (en) * 2016-10-06 2019-04-15 Trotec Laser Gmbh Method for engraving, marking and / or inscribing a workpiece with
KR102166646B1 (en) * 2018-12-27 2020-10-16 주식회사 에스에프에이 Laser processing equipment and apparatus for etching device having the same
US12421742B2 (en) * 2021-06-30 2025-09-23 Jz Technologies, Llc Method and apparatus for applying an architectural layout to a surface
KR102535886B1 (en) * 2021-09-10 2023-05-26 공주대학교 산학협력단 laser annealing system using lamps

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI611469B (en) * 2012-12-27 2018-01-11 Samsung Display Co., Ltd. Multifunctional device for testing and etching a substrate and substrate processing device therewith
US10137533B2 (en) 2012-12-27 2018-11-27 Samsung Display Co., Ltd. Multi-functional apparatus for testing and etching substrate and substrate processing apparatus including the same

Also Published As

Publication number Publication date
US20070211323A1 (en) 2007-09-13
JP4437127B2 (en) 2010-03-24
CN101033111A (en) 2007-09-12
EP1832378A3 (en) 2007-10-31
JP2007237292A (en) 2007-09-20
TWI327784B (en) 2010-07-21
CN101033111B (en) 2010-12-15
US7875828B2 (en) 2011-01-25
EP1832378A2 (en) 2007-09-12
EP1832378B1 (en) 2012-12-12
KR100754146B1 (en) 2007-08-31

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