TW200302507A - Stage device and exposure device - Google Patents

Abstract

A stator of a motor is separately and independently arranged from a base. Under the circumstance, a reaction force process is implemented without reducing the pushing force and the anti-vibratility of a motor and without damaging the motor. The device comprises a movable stage body A that is movably supported by a base 22 having a moving surface, and a first driving device for driving the stage body 1A that has a stator 65 and a movable element 64A which is located at the stage body 1A. The device further comprises a supporting unit 7 has the stator 65 installed thereon and is separately arranged from the base 22. The unlock device 45 frees the independence of the supporting unit 7 according to a relative displacement between the base 22 and the supporting unit 7 in a first direction that is substantially perpendicular to the moving surface.

Description

200302507 V. Description of the invention (1) Technical field to which the invention belongs The present invention relates to a machine device and an exposure device. Among them, the machine device moves the machine body holding the substrate in a plurality of directions, and the exposure device performs exposure processing using a mask (ma s k) held by the machine device and the substrate. In particular, it is a machine device and an exposure device which are suitable for the manufacturing process of a semiconductor integrated circuit, a liquid crystal display, and the like by using the lithography I insect engraving (1 i t h 0 g r a p h y) process. _

In the prior art V, the lithographic etching process, which is one of the processes for manufacturing semiconductor devices, uses various exposure devices to transfer the circuit pattern formed on a photomask or a grating (retic 1 e) (hereinafter referred to as a grating) to a coating. Photoresist (photosensitizer) on a wafer or glass (glass, etc.) substrate. For example, exposure devices for semiconductor devices, recent years, and the integration of integrated circuits has been increased. The minimum line width of the pattern * criterion (designru 1 e)) Use a projection optical system to make the pattern of the grating thinner] ~ Reduced projection exposure device printed on the wafer is the main. _ The person who knows this reduced projection exposure device is a static exposure type reduced projection exposure that makes the pattern of the grating sequentially printed on the wafer in the multiple irradiation area (exposure area) in step and repeat # (step and repeat) The device is called an exposure machine (stepper)), or an improvement of this exposure machine, is disclosed in Japanese Merritt Kaiping No. 8-1 6 6 0 4 3, etc. to make the grating and the wafer two-dimensional || Scanning exposure type exposure apparatus (a so-called scanning stepper) of a scanning exposure type that moves a raster pattern to each irradiation collar f & step and scan.

200302507 V. Description of the invention (2) Here, the stage projection exposure device is reduced in size. The stage device is based on the use of a base plate provided on the platform surface as a basis for the device, and the platform is cut off by the medium. Vibration-proof anti-vibration table mounts the main body column (c ο 1 um η) to support the grating machine, wafer machine and projection optical system (projection lens). In recent machine installations, the above-mentioned anti-vibration table adopts an actuator including an air mount capable of controlling internal pressure, a voice coil motor, and the like, and is mounted on a main column (main frame ) For example, an active anti-vibration table equipped with six force mouth speed meters and controlling the above-mentioned V voice coil motor according to its calculated 1J value to control the vibration of the body column is installed. However, after the exposure machine and other exposure areas on a wafer are exposed, the sequential exposure of other exposure areas is repeated by the wafer machine (in the case of an exposure machine), or the grating machine and the wafer machine ( In the case of a scanning exposure machine), the reaction caused by acceleration and deceleration becomes the main cause of the vibration of the main body column, so that the relative position error between the projection optical system and the wafer is inappropriate. In particular, the result of the above relative position error during alignment or exposure is a case where the pattern is transferred to a position different from the design value on the wafer or the position error contains vibration components. It is not suitable for reasons such as blur (increasing pattern line width). Therefore, in order to suppress the inappropriate situation, it is necessary to sufficiently attenuate the vibration of the main column. For example, in the case of an exposure machine. It is necessary to make the wafer machine at the desired position to determine the position and wait for the full adjustment before starting the positioning operation or the exposure operation. In the case of a scanning exposure machine, it is necessary to sufficiently ensure the synchronous setting of the grating machine and the wafer machine for exposure. Therefore, it is a cause of deterioration of productivity (productivity).

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10492pi f.ptd Page 7 200302507 V. Description of the invention (3) In addition, with the increase of gratings in recent years, although the above-mentioned Japanese patent or large-scale two-machine large-scale kaihei 8-33〇224 is used Equity 8 — 1 66 4 7 5 or the Japanese patent (frame) member caused the invention of the platform, due to the transmission of the frame ^ Tao from ~ τ, c < reaction force caused the frame member itself to vibrate, resulting in the platform Reverse the field Α Λ one person ^ .. Αβ々4 · Secretary / Shima forcefully transmitted to the main column (main body, m, main body) of the projection optical system through the vibration-proof platform to vibrate, there is a so-called return shake Yu. Therefore, you _ ^ make progress while ensuring a certain amount of output

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It becomes difficult to perform high-precision exposure. Therefore, 'Examples', for example, in Japanese Patent Laid-Open No. 8-6 3 2 3 1, it is disclosed that a chassis body and a driving frame provided with a floating support on the chassis, and the driving frame is driven by the reaction force of the forward movement of the random table body. A type of machine device that moves backwards. In accordance with this technology, 'a conservation law of momentum occurs between the machine body and the drive frame to maintain the relationship of the position of the center of gravity of the device on the base plate' can reduce the vibration effect on the frame members. An example of such a machine device is shown in FIGS. 1A and 3B. This machine device, the X / Y machine (machine body) 1 that holds the wafer W of the substrate (photosensitive substrate) is driven by a linear motor (1 inearm 〇t 〇r), etc., and is guided along the X guide rod (guide bar) 2 moves in the X direction (the left and right directions in Figures 13A and B) while the moving elements 5 and 5 provided on the X guide 2 move along the stator (stat 〇r) 3 and 3 constituting the linear motor Direction so that the wafer W moves in a two-dimensional direction along the XY plane. Each of the stators 3 and 3 constitutes an f balance mass (counter mas) 3, 6 which moves on the chassis (fixing plate) 4 via an airpad (6, 6) in the Y direction so as to be able to float and support freely. Y machine 1 is accelerated by

10492pi f. Ptd Page 8 200302507 V. Description of the invention (4) When the reaction force is accelerated, the equilibrium mass 3 and 6 are accelerated in the -Y direction to generate the law of constant momentum to maintain the center of gravity of the device on the chassis. position. As a result, the reaction force can be prevented from being transmitted to the outside of the device, and the force α of the X / Y machine 1 (that is, the wafer W) can be moved, and the vibration when the machine is moved can be suppressed to a minimum. However, in the above-mentioned machine device, although the center of gravity position of the device can be maintained, the movement of the stators 3 and 3 of the weight body distorts the chassis 4 and may adversely affect the sliding surface of the X / Υ machine 1. Therefore, in order to solve this problem, a machine device having a configuration as shown in Fig. 14 is conceived. The machine equipment shown in this figure, the stators 3 and 3, are separated from the chassis 4 by separate and independent side fixing plates (supporting parts) 7, 7 which are floated and supported by air cushions 6, 6. In this configuration, because the chassis 4 and the side fixing plate 7 are independent, and the stators 3 and 3 are balanced masses 3 and 6, when the movement, the strain energy or vibration with the movement is not transmitted to the chassis 4, While maintaining the accuracy of the sliding surface, the X / Y machine can be protected from vibration 1. However, in the machine structure with the above-mentioned structure, the chassis 4 is generally in a vibration-removing relationship, and most of them are placed on the platform via a vibration-proof platform. Generally, such an anti-vibration table has a driving stroke (stroke). The allowable stroke of the anti-vibration table must be smaller than the gap (g a p) between the stator 3 and the movable element 5 constituting the linear motor. If the drive stroke of the vibration isolator is increased, the gap between the stator 3 and the movable element 5 needs to be increased. In this case, the heat generated by the motor drive and the motor itself become large will be disadvantageous. Therefore, in the machine device shown in FIG. 15, it is thought that an actuator 9 such as a motor or an air spring or an air cylinder is provided with a side plate 7 on the platform.

10492pif.ptd Page 9 200302507 V. Description of Invention (5) Composition. With this configuration, the position of the side fixing plate 7 can be tracked with respect to the stroke of the vibration isolating table 8, and the gap between the stator 3 and the movable element 5 of the motor can be maintained. SUMMARY OF THE INVENTION However, the conventional machine apparatus and exposure apparatus described above have the following problems.

The actuator 9 of the V driving side plate 7 has a problem of generating heat because it is frequently driven in a servo state. In addition, when the actuator 9 is operating normally, it is not a problem. In the event that an unexpected situation occurs to prevent the actuator from operating or perform other than the predetermined operation, the stator 3 and the movable element of the motor may be used. 5 Contact may be damaged. Therefore, it is considered to increase the gap between the stator 3 and the movable element 5, or to shorten the stroke of the vibration isolation table 8, and the increase of the gap causes a problem that the driving force of the motor is lowered, and the stroke is shortened to generate vibration resistance. Low drop problem. The present invention has been made in consideration of the above-mentioned problems, so as to provide a lower and lower drop in driving force or anti-vibration performance of the motor and damage to the motor even when the stator of the motor is separately and independently arranged on the chassis. The purpose is to provide a machine device and an exposure device that perform reaction force processing. In order to achieve the above object, the present invention adopts the following configurations corresponding to the first to eleventh drawings showing the embodiments. The machine device of the present invention is a machine device (WST) including a machine body (1 A, 1 B) and a first driving device (61 A, 6 1 B). Among them, the machine body (1 A, 1 B) is movably supported on a chassis (2 2) having a moving surface (2 2 a), and a first driving device (6 1 A, 6 1 B) is driven. Machine body with stator (65) and movable element (64A, 64B) provided in machine body (IA, 1B)

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10492pif.ptd Page 10 200302507 V. Description of the invention (6) (1 A, 1 B). It is characterized in that the setter (6 5) is provided with a support part (7) and a release device (4 5). Among them, the support part (7) is provided independently from the chassis (2 2), and the release device (4 5) is based on the chassis (2 2) in the first direction (Z direction) which is substantially orthogonal to the moving surface (2 2 a). ) And the relative displacement of the support portion (7) to release the independent state of the support portion (7) of the chassis (2 2). Therefore, in the machine device of the present invention, the support portion (7) supporting the stator (65) is independently disposed in a relationship with the chassis (2), and reacts on the movement of the random table body (1 A, 1 B). When the force moves the stator (6 5), it can prevent the transmission of strain energy or vibration to the chassis (2 2). In addition, if an unexpected situation occurs, when the relative displacement of the chassis (2 2) and the support portion (7) becomes large, the relationship between the independent state of the chassis (2 2) and the support portion (7) becomes a dependent state. Prevent contact damage caused by the gap between the stator (6 5) and the movable element (6 4 A, 6 4 B) being smaller than the predetermined value. Therefore, it is not necessary to make the gap between the stator (6 5) and the movable element (6 4 A, 6 4 B) larger than necessary, so as to cause the first driving device (6 1 A, 6 1 B). The driving force is lowered, and the stroke of the second driving device (2 9) that drives the chassis (2 2) in the first direction is suppressed, so that the vibration-proof performance is not reduced, and the machine body (1 A, 1 B) can be implemented. Handling of reaction forces of movement. In addition, the exposure device of the present invention is an exposure in which the pattern of the mask (R) held by the mask table (RST) is exposed on the substrate (W, W1, W2) held by the substrate table (WST). Device 10 is characterized in that at least one of the mask machine (RST) and the substrate machine (WST) is a machine described in any one of the patent applications ranging from item 1 to item 11.台 装置。 Devices. Therefore, in the exposure apparatus of the present invention, the photomask (R)

10492pi f. Ptd Page 11 200302507 V. Description of the invention (7) When the reaction force of the substrate (W, W 1, W 2) moves the stator (6 5), the first driving device (6 1 A , 6 1 B) are not damaged to prevent the driving force of the first driving device (6 1 A, 6 1 B) from being lowered and the vibration-proof performance of the second driving device (2 9) from being lowered. Handling reaction force of the machine body (1 A, 1 B). In order to make the above principles and other objectives, features, and advantages of the present invention more comprehensible, a preferred embodiment is given below in conjunction with the accompanying drawings to make a detailed description as follows: Embodiments are described below with reference to FIGS. 1 to FIG. 7 illustrates a first embodiment of a machine apparatus and an exposure apparatus according to the present invention. In this exposure device, the grating and the wafer are moved synchronously in a one-dimensional direction (in the Y-axis direction above), and the circuit pattern of the semiconductor element formed on the grating is transferred to the wafer while using a step An example of a case of an exposure device of a scanning method or a scanning exposure method of a step and stitch method will be described. In addition, the exposure apparatus here is adapted to apply the machine apparatus of the present invention to a wafer machine. In addition, in these drawings, the same constituent elements as those in FIGS. 13 to 15 shown in the previous example are attached with the same reference numerals, and the description is omitted. Fig. 1 schematically shows the overall configuration of an exposure apparatus 10 according to an embodiment of the present invention. The exposure device 10 includes an illumination system (not shown), a grating machine RST, a projection optical system PL, a wafer machine (machine device) WST, a main body column 14, and an anti-vibration system. Among them, the illumination system illuminates the rectangular (or arc-shaped) illumination area on the grating R as a photomask with uniform illumination by the illumination light for exposure (hereinafter referred to as "illumination light"). Grating

10492pi f. Ptd Page 12 200302507 V. Description of the invention (8) The machine RS is a reticle machine that holds the grating R. The projection optical system pl projects the illumination light emitted from the grating R onto the wafer W. Wafer machine (machine equipment) W S T is a substrate machine that holds wafers W. The body column 1 4 is the body on which the projection optical system PL, the grating machine RST and the wafer machine WST are placed. The anti-vibration system suppresses or removes the vibration of the body column 14. The illumination light IL is, for example, a bright line (g line, i line) and K r F excimer laser light (wavelength 248 nm) from the ultra-high pressure mercury lamp. Far ultraviolet light (DUV light) or vacuum purple light (VUV light) such as ArF quasi-fraction V sub-laser light (wavelength 193nm) and F2 laser light (wavelength I57nm). The main body column 1 and 4 include a bottom plate B P and a vibration-proof component (u n 丨 t) 1 6 A ~ 1 6 C. Mirror & tube fixing plate 1 8. Supporting member 2 4 of projection optical system PL and supporting member 26 of grating table 2-5. Among them, the bottom plate B P is a rectangular plate shape serving as a reference for the device, and is placed on the platform (f 1 ο ο) plane F D horizontally. The anti-vibration members 1 6 A to 1 6 C (however, the anti-vibration members 1 6 C on the paper surface depth side in FIG. 1 are not shown) are arranged near the apex portions of the triangles on the bottom plate B P. ‘The lens barrel fixing plate 18 is supported horizontally via the vibration-proof parts 16 A ~ 16 C. The supporting members 24 of the projection light and learning system P L are attached to the lens barrel fixing plate 18 and are referred to as a first invar (hereinafter, referred to as "first invar 24"). The supporting member 2 6 of the grating table 25 5 is called the second invariant steel (hereinafter, referred to as the “second invariant steel 2 6”) standing on the lens barrel fixing plate 18. The vibration-proof member 1 6 A ~ 1 6 C is composed of the actuator unit 28 and the air mount 30 whose internal pressure can be adjusted in the upper part of the bottom plate BP in an inline arrangement. _ Vibration-proof parts 1 6 A ~ 1 6 C Each of the actuator sections 2 to 8 includes at least one voice coil

〇492pif.ptd Page 13 200302507 V. Description of the invention (9) Motor. In this case, at least three voice coil motors for driving in the vertical direction (Z direction in Fig. 1) are included in the entire actuator section of the vibration-proof members 1 6 A to 16 C, and for the X-direction driving. There are at least three voice coil motors and voice coil motors for Y direction driving (however, one voice coil motor for X direction driving and one voice coil motor for Y direction driving are included). The lens barrel fixing plate 18, although not shown in the first figure, is provided with a vibration sensor (such as a "semiconductor acceleration sensor") that detects the Z-axis vibration of the body column 14 containing the lens barrel fixing plate 18. Equal accelerometers) at least three, vibration sensors (such as accelerometers for semiconductor acceleration sensors, etc.) that detect vibrations in the ν and Υ directions in the X direction to a total of at least three (however, X-direction vibration detection sensors and One sensor for the vibration detection in the Υ direction is included. However, the output of at least four or six vibration sensors (hereinafter, referred to as the “vibration sensor group 3 2” for convenience) is supplied to a main control device described later 5 0 ( (Refer to FIG. 7), the main control device 50 determines the motion in the direction of six degrees of freedom of the main body column 14 to control the vibration-proof members 16A to 16C. That is, in this embodiment, the vibration-proof sensor group 3 2, the vibration-proof members 16 A to 16 C, and the main control device 50 constitute an active vibration-proof mechanism that vibrates the main column 14 and damps it. Vibration system. _ The side view of the second invariant steel 26 is roughly the overall shape of the platform-shaped bottom surface and the upper face with an octagonal polyhedron. The platform-shaped openings are formed on each side, and the bottom surface is a completely open frame. The upper surface of the second invariant steel 26 is a supporting plate for supporting the grating table 25, and the supporting plate forms a rectangular opening (not shown) as a passage for the illumination light IL. Place the grating table 2 5 on the f-plane. A predetermined opening is also formed in the grating table 25 to face the opening.

10492pif. Ptd Page 14 200302507 V. Description of the invention (10) The grating machine R s τ is arranged on the above-mentioned grating machine plate 25. The grating machine RST system enables linear encoders to be driven linearly with a large stroke on the grating machine fixed plate 25 in the direction of the y-axis while 'about the X-axis direction and the 0 Z direction (the rotation direction around the Z-axis) with minute driving. structure.

The grating machine R s τ is composed of a grating coarse machine table 11 and a grating micro machine table 12. Among them, the grating coarse motor table 11 is moved on a grating table 25 of the grating machine along a non-illustrated cymbal guide (g u i d e) provided in the y-axis direction. The grating micromotor body 1 2 is composed of a pair of X voice coil motors 3 6 A and 36B (not shown in FIG. 1 'refer to FIG. 7) and a pair of γ voice coil motors on the grating coarse motor table 1 1. 36C and 36D (not shown in FIG. 1 and refer to FIG. 7) are driven minutely in the X, γ, and 0Z directions. The grating R is fixed to the grating microcomputer 1 2 by, for example, vacuum suction. The grating coarse motor table 1 1 is supported by a non-illustrated air bearing in a non-contact manner to the Υ guide base, and Υ linear motors 3 4 A, 3 4 Β (not shown in FIG. 1 but not shown in FIG. 7). ) Driven in the Y-axis direction with a predetermined stroke, the strict example is a Y linear motor 3 4 A, 3 4 B, an X voice coil motor 3 6 A, 3 6 B, and a Y voice coil motor 36C, 36D. A drive system 37 (refer to FIG. 7) constituting the grating table RST. Each of the linear motors 34A and 34B is composed of a stator and a movable element. ： 士 is on the grating table 25, and it is added by a plurality of air bearings. = Shi Cheng extends in the direction of the Z axis. The movable element is provided corresponding to the stator, and two = first two coarse motor stages 1 1. Therefore, in this embodiment, when the grating machine is in the T drawing direction (γ-axis direction), the movable elements of the pair of linear motors 3 4 A and the stator are relatively moved in the reverse direction. That is, the grating

200302507 V. Description of the invention (11) The machine RST and the stator move in the opposite direction relative to each other. When the friction between the grating machine RST and the stator and the grating machine fixed plate 25 is zero, the law of constant momentum holds. The moving amount of the stator following the movement of the grating machine RST is determined by the whole of the grating machine RST. The weight ratio of the stator is determined. Therefore, the reaction force during the acceleration / deceleration of the grating machine R S T in the scanning direction is absorbed by the movement of the stator, which can effectively prevent the vibration of the grating machine plate 25 caused by the above reaction force. In addition, the grating machine RST and the stator are relatively moved in the opposite direction, so that the position of the center of gravity of the system including the grating machine RST and the grating machine plate 2 5 is maintained at a predetermined position, and the movement from the center of gravity position does not occur. Partial load. The details are described in, for example, Japanese Patent Laid-Open No. 8-6 3 2 31. A moving mirror 40 is installed on a part of the grating micromotor table 12, and the moving mirror 40 is a grating laser interferometer system 38 that reflects a length measuring laser beam from a position measuring device that measures its position or movement. The grating laser interferometer system 3 8 series is fixed on the lens barrel fixed plate 18. The fixed mirror 4 2 corresponding to the grating laser interferometer system 3 8 is provided on the side of the lens barrel of the projection optical system PL. However, the position measurement of the X, Y, and 0 Z directions of the grating machine R S T (specifically, the grating motor stage 1 2) by the grating laser interferometer system 38 is performed with reference to the projection optical system PL. The position data (or speed information) of the grating machine RST (ie, the grating R) measured by the grating laser interferometer system 38 described above is supplied to the machine control device 4 4 (not shown in FIG. 1, refer to FIG. 7) ) And the main control device 50 (see FIG. 7) via the media control device 44. The machine control device 4 4 basically makes the position information (or speed) output from the grating laser interferometer system 3 8

10492pif.ptd Page 16 200302507 V. Description of the invention (12) Data) The command values (target position, target speed) from the master control device 50 are consistent to control the above-mentioned Y linear motors 3 4 A, 3 4 B, and sound Coil motors 3 6 A to 3 6 D. 1 A circular opening is formed in the center of the above-mentioned lens barrel fixing plate 18, and a first invariant steel 24 formed by a cylindrical member with an upper edge (f 1 ange) at the upper end is inserted into the circular opening. The internal projection optical system PL of this first invariant steel 24 is inserted from above with the optical axis direction as the Z axis direction. The material of the first invariant steel 2 4 is a material with low thermal expansion, such as invariant steel (I nver: composed of iron containing 36% of nickel, 0.25% of manganese, and trace amounts of carbon and other elements Low expansion alloy). A projection FLG is formed on the outer peripheral portion of the lens barrel portion of the projection optical system PL, which is integrated with the lens barrel portion and is formed of a casting or the like. This flange FLG is a so-called movable support (K i n e m a t i c S u ρ ρ 〇 rt) which allows the projection optical system PL to support the first invariant steel 24 at three points via the intermediate point, the surface and the V groove. When the movable support structure is adopted in this way, the assembling of the projection optical system PL to the first invariant steel 24 is facilitated, and after assembly, it has vibration, temperature changes caused by the first invariant steel 24 and the projection optical system PL, Stress caused by posture changes, etc. The advantage of reducing the most effective. The above-mentioned projection light system PL, here, both the object plane (grating R) and the image plane (wafer W) have a telecentric circular projection horizon 'refraction using only quartz or fluorite as an optical glass material A refractive optical system with a projection magnification of / 5 (or 1/4) by the optical element (lens element). Therefore, when the grating R is irradiated with the illumination light I L, the junction image beam from the portion illuminated by the illumination light I L in the circuit pattern area on the grating R is incident on the projection optical system.

10492pif.ptd Page 17 200302507 V. Description of the invention (13) P L, the partial inverted image of the circuit pattern restricts the knot image in the shape of a slit (s 1 i t) to the center of the circular view on the image plane side of the projection optical system P L. As a result, the partially inverted image of the projected circuit pattern is used to reduce a photoresist layer on the surface of an irradiation field among the plurality of irradiation fields transferred on the wafer W arranged on the junction image plane of the projection optical system PL. The wafer table WST holds the wafer W in a two-dimensional XY direction. In more detail, the wafer machine table WST is shown in a simplified form in FIG. 1. In fact, as shown in FIG. 2, a wafer machine table w 2 having a moving surface 2 2 a is used. 2. Mobile machine (machine body) 1 A, 1 B (collectively referred to as mobile machine 1 for convenience), each of the mobile machines 1 A, 1 B is driven by a Y motor in the Y direction (first drive device) 6 1 A, 6 1 B, a double stage method in which the mobile machines 1 A and 1 B drive the X motors 62A and 62B in the X direction as the main body, for example, at the mobile machine 1 A During the scanning exposure of the circle (substrate) W1, the wafer (substrate) W2 can be exchanged and aligned in the mobile machine 1B. The wafer machine fixing plate 2 2 is supported above the bottom plate B P via a vibration-proof member (second driving device) 29 at a substantially horizontal level. The anti-vibration member 2 9 is the same as the above-mentioned anti-vibration member 1 6 A ~ 1 6 C, each of which includes an actuator portion and an adjustable internal pressure air table to form an active anti-vibration system, as shown in FIG. 3 , Placed at three vertices of the triangle (besides, the vibration-proof member in the depth direction of the paper surface in FIG. 1 is not shown). However, although not shown, at least three vibration sensors (such as accelerometers such as semiconductor accelerometers) for detecting the Z-axis vibration of the fixing plate 22 are installed on the wafer table 2 2 to detect X. Direction, Y direction vibration + moving vibration sensors (such as accelerometers such as semiconductor acceleration sensors) A total of at least three (however, X direction vibration detection sensors and Y direction vibration

10492pif.ptd Page 18 200302507 V. Description of the invention (14) Each of the motion detection sensors includes one). However, the outputs of these at least six vibration sensors (hereinafter, referred to as "vibration sensor group 3 3" for convenience) are supplied to a main control device 5 0 (refer to FIG. 7) described later, and the main control device 5 0 In order to obtain the movement of the wafer machine table 2 2 in the six degrees of freedom direction, the vibration-proof member 2 9 is driven in the Z direction (first direction) which is approximately orthogonal to the moving surface 2 2 a and is transmitted to the base plate BP. The micro vibration of the wafer machine plate 2 2 is controlled by micr ◦ G level insulation. Furthermore, the relative positions of the two pairs of projection optical systems PL of the wafer machine table 22 are detected by the position sensor 7 7 (see FIG. 7) and output to the main control system 50. The moving tables 1 A and 1 B are floatingly supported by air bearings (not shown) on the wafer table 2 2. Each of the mobile stations 1 A and 1 B is equipped with a sample stage (h〇1 der) 6 3 A, 6 3 B, and the sample stages 6 3 A and 6 3 B are vacuum-adsorbed. The wafers (substrates) W 1 and W 2 holding the photosensitive substrates (for convenience, collectively referred to as wafers W). The sample tables 6 3 A and 6 3 B are used to move the moving table in the X direction, Y direction, and the direction of rotation around the Z axis. At the same time, it is configured to be leveling and focusing in the Z direction. Displacement, and tilt around the two axes (ie, around the X and Y axes). The X motor 62A drives the mobile machine 1A in the X direction of the step movement direction, and is embedded by an X stator (not shown in the figure) embedded in an X guide bar 2A extending in the X direction (hereinafter, the X guide bar The X stator is described.) It is located in the mobile machine 1 A and is composed of an X moving element (not shown) driven in the X direction by electromagnetic interaction with the X stator. Similarly, the X motor 6 2 B drives the mobile machine 1 B in the X direction, and the X stator (not shown) is embedded in the X guide rod 2 B (where appropriate, collectively referred to as the X guide rod 2) extending in the X direction. ) And, by the mobile step machine

10492pif.ptd Page 19 200302507 V. Description of the Invention (15) 1 B is composed of an X moving element (not shown) driven in the X direction by electromagnetic interaction with the X stator. The Y motor 6 1 A drives the mobile machine 1 A in the Y direction of the scanning direction. As shown in FIG. 4 for simplicity, Y through the X guide rod 2 A provided at both ends of the mobile machine 1 A is movable. The elements (movable elements) 64A and 64A are opened to the Y movable element 64A, and the Y movable elements 6 4 A and 6 4 A are driven to Y by the electromagnetic interaction with the Y movable elements 6 4 A and 6 4 A. The stator in the direction has a balanced mass with a concave section (conveniently referred to as a stator) 6 5 and 6 5 (However, as shown in Figure 2, although the shape of the balanced mass is different, it is convenient in Figures 1 and 3 It is shown in the same shape). Also, the balanced mass 6 on the -X side (the left side in the second figure) 6 5 has an inclined surface so that it can be connected to the X guide 2 A, 2 B, or Y. There are no stress alleviation (relaxation) in the power supply cables such as air piping, refrigerant pipes, power wiring, signal supply system wiring, etc. of the components 6 4 A and 6 4 B. Similarly, the Y motor 6 1 B drives the mobile machine 1 B in the Y direction of the scanning direction, and the Y movable elements (movable elements) 64B, 64B provided at both ends of the mobile machine 1B via the X guide rod 2B, and, Opening to the Y movable element 64B, the Y movable element 6 4 B, 6 4 B is driven by the electromagnetic interaction with the Y movable element 6 4 B, 6 4 B to balance the concave shape of the stator in the Y direction. Consisting of mass 6 5 and 65. That is, the Y moving elements 6 4 A and 6 4 B are provided on each of the plurality of moving tables 1 A and 1 B, and the balanced masses 6 5 and 6 5 are the lengths having the entire moving range of the moving tables 1 A and 1 B. The relationship is a structure that is commonly used for these Y moving elements 6 4 A, 6 4 B. Moreover, the Y motors 61A and 61B are linear motors in the form of a moving coil (moving c ο 1 1).

__ 10492pif.ptd Page 20 200302507 V. Description of the invention (16) Balance mass 6 5 and 6 5 are the side plates (supporting parts) 7, 7 provided on the X-direction sides of the wafer plate 2 2 In the above, the air cushions 6 having a guide mechanism (support mechanism) in the Y direction are provided with floating support that can move in the Y direction. The side plate 7 is provided independently of the wafer table 22 (on the vibration side), and is supported by a coil spring 31 of an elastic member provided on the bottom plate BP to support its own weight. The coil spring 3 丨 sets the spring constant so as to have sufficient rigidity to fully support the mass of the side balance plate 7 when the center of gravity of the mass 5 moves. Three points support the side plate 7. In addition, the side plate 7 and the wafer machine plate 2 2 are freely connected by the release device 4 5 to release the independent state. The release devices 4 and 5 are each provided at 1, the surface fixing plate 7 and the wafer machine table 22 in the ^ direction of the two ends (the first, 2 and 1 f are only shown in the figure-the release device on the Y side). As shown in FIG. 5, a stainless steel stopper (an anvil member) 46 provided on the crystal plate 22 of the machine table is provided with a gap in the X direction of the side plate 7 with a gap. The shaft member (second member) is composed of 4 7 and 4 7. p W is fixed to the wafer machine table 22 with a cross arm 4 6 series by bolts (b ο 1 t) and other connection means (not shown), and is formed at a position opposite to the shaft members 47, 47: X-direction fitting groove 48. As shown in FIG. 6, the fitting groove 48 is the width and position of the gap L 1 in the Z direction (and part of the X direction) between the shaft member 47 and the shaft member 47 during the normal operation of the wafer _ 1 WST. To be formed. This gap L1 is set when the gap between the Y movable elements 64a and 64B of the γ motors 6U and 61B and the stator 65 is 12 so that the following relationship can be established. LI < L2 (1

l〇492pif. P cut

Page 21, 200302507 V. Description of the invention (17) On the one hand, the wafer machine WST is used to supply the cables, pipes, etc. to the mobile machine 1 A, 1 B or the X guide 2 A, 2 B with various forces. It is maintained, and tube carriers are provided, which are moved in synchronization with the movement of the X guides 2 A, 2 B (that is, the Y direction of the mobile stations 1 A, 1 B). However, the tube support and the mobile stations 1A and 1B move synchronously to prevent the deformation relationship of the cables and tubes arranged between the tube support and the mobile stations 1A and 1B. The occurrence of external vibration due to friction, shock, or resistance to deformation due to the deformation of cables and pipes can be prevented. At the end on the X direction side of the above mobile machines 1 A and 1 B, the moving mirror 7 9 X is extended in the Y direction, and at the end on one side in the Y direction, the moving mirror 7 9 Y is extended at X direction. The wafer laser interferometer system constituting the position detection device & 80 (refer to Fig. 1) irradiates the moving mirrors 7 9 X, 7 9 Y from the length measuring laser beam of each laser interferometer. Furthermore, at least one of the laser interferometers corresponding to these length-measuring laser beams is a two-axis interferometer having two length-measuring axes. The respective fixed mirrors corresponding to the laser interferometers constituting the wafer laser interferometer system 80 are fixed to the lower end portion of the lens barrel of the projection optical system PL. The wafer laser _ interferometer system 80 is arranged on the lens barrel fixing plate 18. In addition, as mentioned above, the moving mirrors 79X and 79Y are equipped with a moving mirror on the wafer machine table WST. Corresponding to this, fixed mirrors for the X-direction position measurement and fixed mirrors for the Y-direction position measurement are also provided respectively. The laser interferometer is also provided with an X-direction position measurement user and a Y-direction position measurement user. In the first figure, the representative representation is a moving mirror + 79, a fixed mirror 8 1, and a wafer laser interferometer system 80. X, Y, 11 _1 111 III Bill 10492pi f. Ptd of wafer machine WST of wafer laser interferometer system 80 mentioned above Page 22 200302507 V. Description of the invention (18) 0 z (rotation around z) direction The position measurement is performed with reference to the projection optical system p L. However, the position information (or speed information) of the wafer machine WST measured by the wafer interferometer system 80 is sent to the machine control device 44 and to the main control device 50 via the medium machine control device 44. The machine control device 44 basically uses the position information (or speed information) output from the wafer laser interferometer system 80 and the command values (target position, target speed) given by the main control device 50. ) Unanimously to control the above-mentioned Y motors 6 1 A, 6 1 B and the X motors 62A, 62B. Fig. 7 is a block diagram showing a main configuration of a control system of the exposure apparatus 10 of this embodiment. This control system is structured by a main control device 50 of a control system composed of a microcomputer (or workstation). As shown in the figure, the measurement result of the position sensor 7 7 of the vibration induction is group 3 2, 3 3, which is output from the main control farm 50. The main control device 50 controls the driving of each of the vibration-proof members 16A to 16C and 29 based on the input measurement result. The machine control device is under the control of the main control device 50 and controls the gamma linear motors 3 4 a, 34B, and X voice coils based on the measurement results of the grating laser interferometer system 38 and the wafer laser interferometer system 80. Motors 36A, 36B, γ voice coil motors 36c, 36d "', γ motors 6U, 61B, X motors 62A, 62B, fine-tuning motors ^ ^ claw m0t〇i ^ 72, and voice coil motor 73 are driven. In the above exposure device, the operation of the wafer machine table ⑺T will be described first. For example, after the Υ motor 61 Α operates, the Υ moving element 64A moves the stators 65 and 65 relative to each other to move the moving table 丨 a and the sample. The stage 6 3 a (and said that it moves in the Y direction, and thus the reaction force of the movement makes the stator of balanced mass

〇492pif. ptd page 23 200302507 V. Description of the invention (19) 6 5 and 6 5 The relative movement on the side plate 7 is opposite to the moving direction of the mobile machine 1 A. As a result, the reaction force during the acceleration and deceleration in the Y direction of the mobile machine 1 A is absorbed by the movement of the balance masses 6 5 and 65, and the amount of motion given to the bottom plate BP is theoretically zero. At the wafer machine WST The position of the center of gravity is substantially fixed in the Y direction. In addition, when the Y motor 6 1 B is moved and the transfer table 1 B is moved in the Y direction, the same operation is performed. When the mobile stations 1 A and 1 B move, according to the instructions from the main control unit 50, the machine control unit 44 will follow the measured values of the laser interferometer system 80 and so The balance force (cunterf ore), which is eliminated by the influence of the change in the center of gravity, feeds forward the vibration-proof member 29, so that this force is generated to drive the air table and the actuator unit. In addition, the reason that the friction between the mobile tables 1 A and 1 B and the wafer table 2 2 is non-zero, or even when there is a slight vibration in the direction of 6 degrees of freedom of the wafer table 2 2, The above-mentioned residual vibration is removed based on the measurement value of the vibration sensor group 33 or the position sensor 77, and the air table and the actuator unit are controlled by feedback. Therefore, although the masses 6 5 and 6 5 are biased against the side plate 7, the side plate 7 and the wafer machine do not undergo a large posture change because they are supported by the highly rigid coil spring 3 1. The relative displacement of the table fixing plate 2 2 is also slightly smaller than the above-mentioned L 1. At this time, although the displacement of the side fixing plate 7 caused by the balance masses 6 5 and 65 is strained, the relative displacement between the fixing plates 7 and 22 is small, and the cross arm 4 6 for the brake and the shaft member 4 7 are non-contact. The relationship can maintain the independent state of the fixed plates 7, 2 2. The strain energy or vibration system is not transmitted to the wafer machine fixed plate 22, and the surface accuracy of the sliding surfaces of the mobile units 1 A, 1 B can be maintained.

10492pif.ptd Page 24 200302507 V. Description of the invention (20) '-On the one hand, in the event that the vibration-proof member 29 disappears, the relative displacement between the 22 will become larger, specifically, the z-direction The relative displacement is large enough to exceed the braking by the combination of the cross arm 46 and the shaft member 47. The movable element 64A in the γ motor 61A, 6; "; ^ ^ ί f46r ^ # ^ 47-^ ^ ^ ^ ^ ^ ^ The independent state of the platen plate 22 and the side plate 7, even the platen 22 moves in the + Z direction or the -Z direction with a large displacement, and moves from 0 to D on the day. Therefore, the γ movable element plate 7 will also maintain the amount of L2-L1 (>G; from ⑴ \) 64Br and the second sub-v65, β4B, and the stator 65 according to the quantity system. This port avoids the movable element 64A,

In addition, when the wafer set plate 22 is not only in the Z direction, the rotation around the shaft), it is intersected by a shaft member ϋ = When it is located around the shaft of the shaft member, the shaft 22 can be maintained, The gap between the arms 46, the γ movable element 64, the Mβ and the stator, and the actuator are horizontal. In this embodiment, the shaft member 47 is provided in the \ direction and is arranged to touch the machine plate 2 2 to 0. The γ direction has a large relative displacement: Although the wafer cross arm 46 is in contact with the vehicle member 47 to release the cutting; :: "The use of the relationship of movement can avoid the γ movable element: use its j 'description in the exposure device 1 〇 exposure action.

e / light amount 1 is set to various exposure conditions in advance for the exposure area on the wafer w to suit the exposure amount. In addition, using a grating microscope (not shown) and off-axis alignment (Mims allg㈣ent sensor), etc.

10492pif.ptd Page 25 200302507 V. Explanation of the invention (21) (base 1 ine) measurement and other preparations, and then the fine alignment of the wafer W using the alignment sensor (fine alignment (Enhanced Global Alignment, EGA (Enhanced Global A ignment, etc.), etc.) to obtain the alignment coordinates of the multiple irradiation areas on the wafer W. In this way, at the end of the preparation for exposure of the wafer W, the machine control device 44 is monitoring the measured value of the wafer laser interferometer system 80 according to the alignment and positioning results according to the instruction from the main control device 50. The Y motors 6 1 A and 6 1 B and the X motors 6 2 A and 6 2 B are controlled to move the mobile station 1 to the scanning start position of the first irradiation exposure of the wafer W. However, the machine control device 44 starts scanning in the Y direction of the raster machine RST and the wafer machine WST via the raster drive unit 37 and the wafer drive unit 39 according to the instructions from the main control unit 50. When the two machines RST and WST reach each target scanning speed, the pattern area of the grating R is illuminated by the illumination light IL to start scanning exposure. The machine control device 44 maintains the moving speed in the Y-axis direction of the raster table RST and the moving speed in the Y-axis direction of the wafer table WST during the scanning exposure, in accordance with the projection magnification of the projection optical system PL ( 1/5 times or 1/4 times) speed ratio to synchronously control the grating machine RST and the wafer machine WST (mobile machine 1). However, different areas of the pattern area of the grating R are sequentially illuminated with the illumination light IL, and by completing the comprehensive illumination of the pattern area, the scanning exposure of the first irradiation on the wafer W is ended. Thereby, the pattern of the grating R is reduced and transferred to the first irradiation through the projection optical system PL.

10492pif.ptd Page 26 200302507 V. Explanation of the invention (22) So, when the scanning exposure of the first irradiation is finished, the machine control device 4 4 follows the instructions of the main control device 50 and the wafer driving portion 39 makes The moving table 1 moves in the X and Y axis directions in steps, and moves to the scanning start position of the second irradiation exposure. When this step is performed, the position change of the X, Y, 0 Z direction of the mobile machine 1 is measured in real time (rea 1 time) on the machine control device 44 according to the measured value of the wafer laser interferometer system 80. Bit. Based on this measurement result, the machine control device 4 4 controls the wafer driving unit 39 to control the position of the mobile machine 1 with the X Y position being changed to a predetermined state. However, in accordance with the instruction of the main control device 50, the machine control device 44 performs the same scanning exposure on the second irradiation as described above. In this way, the stepwise operation of the irradiation scanning exposure on the wafer W and the subsequent irradiation exposure is repeated, so that the pattern of the grating R is sequentially transferred to all of the exposure of the exposure object on the wafer W. That is, as described above, the exposure is performed in the step scanning method. Continuing, the parallel processing by two mobile stations 1 A and 1 B will be described. In this embodiment, for example, when the wafer W 1 on the mobile station 1 A (that is, the sample station 63 A) is exposed through the projection optical system PL, an exchange crystal is performed on the wafer station 1 B. Round, followed by wafer exchange, alignment and positioning, and auto-focus gravity leveling (auto-level ling is on the mobile machine 1 B side, between the wafer exchange and alignment and positioning, on mobile machine 1 A On the other hand, when two gratings are used, double exposure can be performed continuously while stepping the scanning conditions while changing the exposure conditions. The exposure sequences and wafers can be performed in parallel on the two mobile machines 1 A and 1 B. When exchanging and aligning the positioning sequence, one of the wafer machines that has ended first is in the standby state, and the movement is controlled by the movement when the two sides' operations are completed.

1 0492pif. Ptd page 27 200302507 V. Description of the invention (23) Machines 1 A, 1 B. However, the wafer W 1 on the mobile station 1 A at the end of the exposure sequence is exchanged for the wafer at the rotation position (r 〇tating ρ 〇 siti ο η), and the mobile station 1 Β at the end of the positioning sequence (ie, the sample The wafer W 2 on the stage 6 3 B) performs an exposure sequence under the projection optical system PL. In this way, between performing wafer exchange and alignment and positioning operations on one mobile machine side, and performing an exposure operation on the other mobile machine side, by switching the mutual actions at the end of the two parties' operations, the output can be greatly increased . As described above, in this embodiment, the relationship between the independent state of the wafer plate 22 and the platen 7 can be avoided according to the relative displacement of the wafer machine plate 2 2 and the side plate 7, which can be avoided. Breakage of contact between Y movable element 6 4 A, 6 4 B and stator 65. Therefore, it is not necessary to make the gap between the Y movable elements 64A, 64B and the stator 65 larger or to shorten the driving stroke of the vibration-proof member 29, which can prevent a decrease in the driving force of the motor or a low vibration-proof performance. drop. Furthermore, in this embodiment, since the self-weight of the side plate 7 is supported by the ring spring 3 1, it is possible to prevent the heat generated by the drive from accompanying the automatic field of the side plate 7 with the actuator. Further, in this embodiment, the coil spring 31 is arranged at the three points of the apex of the triangle, so that the side plate 7 can be stably supported in a plane. 8 to 11 are diagrams showing a second embodiment of a machine apparatus and an exposure apparatus according to the present invention. In these drawings, the same components as those of the first embodiment shown in Figs. 1 to 7 are assigned the same reference numerals, and descriptions thereof will be omitted. The difference between the second embodiment and the first embodiment is an actuator that drives the side plate 7 in the Z direction. As shown in FIG. 8, in this embodiment, an actuator such as a voice coil motor is used.

10492pif. Ptd page 28 200302507 V. Description of the invention (24) (third driving device) 49 is provided between the side fixing plate 7 and the bottom plate BP. As shown in FIG. 9, the actuator 4 9 is paired with the coil spring 3 1 adjacent to the coil spring 3 1 in the X direction, and is arranged at the same point as the apex of the coil in the same manner as the coil spring 3 1. There are three places in which the main control device (control device) 50 controls the side plate 7 in the Z direction (refer to FIG. 10). In addition, when the actuator 4 9 stops driving, the side plate 7 is connected and connected in a freely movable manner. In addition, the coil spring 3 1 does not need to consider the rigidity of the center of gravity that moves with the movement of the balance ‘mass 65, but is set to a relatively low spring constant of the dead weight of the fixed plate 7. Furthermore, in this embodiment, a position sensor 7 8 (not shown in FIG. 8, refer to FIG. 10) for detecting the position in the Z direction of the side plate 7 is configured so that the detection result is output to the main control device. 50's structure. The main control device 50 drives the actuator 49 according to the detection results of the position sensors 7 7 and 7 8. The other structures are the same as those of the first embodiment. With the above structure, during the normal operation of the exposure device 10, the dead weight of the side plate 7 is supported by the ring spring 31, and the balance mass 6 5 of the moving machine 1 A, 1 B 'is supported. The movement is to correct the center of gravity with the mass of the balance 6 5_ The center of gravity of the moving side plate 7 is moved so that the side plate 7 can be chased at the position of the wafer table 2 2 and driven by the main control device 50动 器 4 9. Therefore, it is not necessary to constantly drive the actuator 49, and it is possible to suppress the heat accompanying the driving. On the other hand, when the anti-vibration member 29 is in the function stop state or the disturbance state f, the actuator 4 is driven in accordance with the detection results (difference) of the position sensors 7 7, 7 8 as in the normal operation. 9, make the side plate 7 to position

10492pif.ptd Page 29 200302507 V. Description of the invention (25) Followed by the wafer machine table 22, which can avoid the contact between the Y movable elements 64A and 64B and the stator 65. In contrast, when the actuator 49 is in a functional stop state or a disordered state, the main control device 50 shuts off the power of the actuator 49 (0 FF) to stop its driving, and only uses a coil spring 3 1Support side fixed plate 7. In this case, the side fixing plate 7 is restricted by the release device 4 5 (ie, the cross arm 4 6 for the brake and the shaft member 4 7) so as not to leave the predetermined distance (L 2-L 1) or more, and the Y element 6 can be avoided. 4 A, 64 are in contact with the stator 65. In addition, the above-mentioned operation is the same even when both of the vibration-proof member 29 and the actuator 49 are in a functional stop state or a disturbed state. In the first embodiment described above, the spring constant of the coil spring 3 1 is set to a relatively large value by moving the center of gravity of the balanced mass 65, and the release device 4 5 resists the energy attached to the coil spring 3 1 so that When the side plate 7 follows the wafer machine table 2 2 in position, one of the wafer machine table 2 2 may be twisted and strained due to the large energy attached. In this embodiment, it is possible to The same effect and effect as those of the first embodiment can be obtained, and the relationship of the spring constant of the low coil spring 3 1 can be suppressed by the movement of the center of mass of the balanced mass 6 5 by the actuator 4 9. The strain of the wafer machine table 2 2 is greatly reduced. Moreover, in the second embodiment described above, the coil spring 3 1 and the actuator 4 9 are arranged adjacent to each other in pairs, which is actually the control of the actuator 4 The drive system of 9 is preferably arranged on the coaxial. The configuration for realizing such an arrangement is shown in FIG. 11, and an AC servo motor 52 for Z-direction driving constituting a third driving device is provided in a bellows (be 1 1 0ws) 51 with an elastic member. And the structure of a ball screw (bal 1 screw) mechanism 5 3. In this case, when the drive is stopped,

10492pif.ptd Page 30 200302507 V. Description of the invention (26) The side plate 7 can move freely in the Z direction so that the lead screw (1 e a d) of the screw portion is set to be large. Moreover, a gear (g e a r) structure may be used instead of the ball screw mechanism. Also, in the second embodiment described above, although the difference between the measurement results of the position sensors 7 7 and 7 8 is used to drive the actuator 49, the Y movable element 6 4 A, 6 4 B and the stator can be designed. The sensor with a gap of 6 to 5 drives the structure of the actuator 4 9 according to the measurement results of this sensor. Furthermore, in the above-mentioned embodiment, although the brake cross arm 46 is provided on the wafer machine table 2 2 and the shaft member 4 7 is provided on the side plate 7, it can also be set on the side. The disc 7 is provided with a cross arm 4 6 for a brake, and a shaft member 47 is provided on the wafer table 2 2. In this case, it is preferable that the shaft members 47 are provided at two places (plurality) in the X direction. The number of vibration-proof members 29 or coil springs 31 is not limited to three places, and it may be a structure with four or more places if it is not arranged on a straight line. Furthermore, the elastic member supporting the weight of the side fixing plate 7 is not only a coil spring, but also an air spring or an air cylinder (air c y 1 i n d e r). Furthermore, a voice coil motor or a linear motor can be used for the actuator 4-9 series. Moreover, in the above-mentioned embodiment, the mobile machine is provided with two units, and an example of using a so-called dual stage (doub 1 estage) type is not limited to this. The mobile machine may also be provided with one or more than three units. . Furthermore, in the above-mentioned embodiment, the structure in which the machine device is applied to the wafer machine W S T of the exposure device 10 is not limited to this, and it can also be applied to the grating machine R S T. In this case, although the side plate for the grating table and the side plate for the wafer table are provided separately, they may be integrally supported by the same column or the like. Moreover, the above-mentioned embodiment is the present invention

10492pi f.ptd Page 31 200302507 V. Description of the invention (27) The structure of the machine is applicable to the structure of the wafer machine of the exposure device. Besides the exposure device, it can also be used to transfer the masking device and the mask pattern. Precision measuring equipment such as position coordinate measuring device. Moreover, the substrate of this embodiment is not only the semiconductor wafers W, W 1, and W 2 for semiconductor elements, but also a glass substrate for a liquid crystal display element or a ceramic wafer for a thin-film magnetic head, or used for exposure The mask of the device or the base plate of the grating (synthetic quartz, Shixi wafer), etc. The exposure device 10 is a step-scan type scanning exposure device (scanning exposure machine; USP 5, 4 7 3, 4 1 0) that makes the grating R and the wafer W move synchronously to scan and expose the pattern of the grating R. In addition, the invention can also be applied to a projection exposure device (exposure machine) in a step-and-repeat mode in which the grating R and the wafer W are exposed to a pattern of the grating R in a stationary state, and the wafer W is moved step by step. In addition, the present invention can also be applied to an exposure device of a step-stitching method in which at least two patterns are partially transferred on the wafer W by overlapping printing. The type of the exposure device 10 is not limited to an exposure device for manufacturing a semiconductor device that exposes a semiconductor device pattern to a wafer W, and may be extended to an exposure device for manufacturing a liquid crystal display device or a display device, or a thin-film magnetic head, or a photographing device. (CCD) or an exposure device used for making gratings or photomasks. In addition, the light source for exposure not shown is not only the g-line (4 3 6 nm), h-line (4 0 4 nm), i-line (3 6 5 nm), or K r F standard which are generated from the ultra-high pressure mercury lamp. Molecular lasers (248 nm), ArF excimer lasers (193nm), F2 lasers (157nm), Ar2 lasers (126nm), or charged particle lines such as electron beams or ion beams can also be used. For example, in the case of electronic wires, thermoelectric power can be used.

10492pif.ptd Page 32 200302507 V. Description of the invention (28) Radial hexaboride (L a B6), button (T a) and so on. Also, a higher harmonic wave such as a Y A G laser or a semiconductor laser may be used. For example, a single-wavelength laser in the infrared or visible region oscillating from a DFB semiconductor laser or fiber 1 aser, for example, doped with Er (er, erbium) (or 铒 ( E r) and a mirror (Yb 'Ytterbium) fiber amplifier (fiber ampl if ier) amplification, and can also use the non-linear optical crystal wavelength conversion into the higher harmonics of ultraviolet light as the exposure light. Moreover, when the oscillation wavelength of a single-wavelength laser is in the range of 1.544 to 1.553 " m, eight times higher harmonics in the range of 1 93 to 1 94 nm can be obtained, that is, the same as the ArF excimer laser Datian f The same = long ultraviolet light, with an oscillation wavelength of 1 · 5 7 ~ 1. 5 8 // m Shou can get ten times higher harmonics in the range of 1 5 7 ~ 1 5 8 nm, that is, The F 2 laser is approximately the same wavelength of ultraviolet light. You can also use a laser plasma (laSer plasm) light source, or a soft X-ray field with an alpha wavelength of 5 to 50 nm, such as the wavelength • nm, or U.5nm2 far ultraviolet (EUV: Extreme Ultra 1.0, 6 Light & is the exposure light. Reflective light is used for the EUV exposure system. Γ μstop: the technology optical system is a reduction system consisting of only a plurality of bodies (for example, about 3 to 6 pieces). The technical magnification of the optical system PL is not only a reduction system, an equal magnification system, and an ultraviolet expansion 222 Z. In addition, the projection optical system ^ uses an excimer laser's far ice # # Or fluorite and other materials that can make the far purple Rongji ^ '' using h laser or X-ray is a reflective system 5 ', the optical system (the grating R is also reflective), and electronics

Bii

10492pi f.ptd Page 33 200302507 V. Description of the invention (29) In the case of a line, the optical system uses an electronic optical system composed of an electronic lens and a deflector. Moreover, the light path through which the electronic wires pass through does not need to be said to be empty. Where a linear motor (refer to USP5, 623, 853 or USP5, 528, 118) is used for the wafer machine WST or the grating machine RST, the air bearing air bearing type and the Lorentz force ( Lorentz force: or any of the magnetic levitation type of reactance force. In addition, each machine WST, RST can also be used to move along the guide (gUide), or can be used without a guide In addition, the γ motor 61A, 61B or the X motor 62 A, 62B may be provided with or without a guide seat. Any machine WST, R s T__ 德德 Touch /? In addition, the moving mechanism system can also use the 4 effect iron components (permanent power r +. Λ bar) arranged in two dimensions with the armature unit (coil) arranged in two dimensions. Surface motor. In this case, the magnetic drive of each machine WST, RST is connected to the machine WST, RS D, magnetic decoration: either side of the component and the armature component is connected to the moving surface side of WST, RST The other parts of the armature part are set on the machine as described above. This patent ^ 1 will be included in the scope of this patent application. The exposure device 10 in the embodiment of the present invention is a sub system to ensure various sub-systems of the constituent elements mentioned above, and is manufactured in combination. The mechanical accuracy, electrical accuracy, and optical precision are 2 for various optical systems. These various precisions are adjusted before and after the system to achieve mechanical precision adjustment, optical precision adjustments, and various machinery adjustments. Various subsystems are used to correct electrical systems for mechanical accuracy. The process of the exposure device includes various sub-A wiring connections and the distribution of air pressure pipes.

200302507 V. Description of the invention (30) Pipeline and so on. Before the assembly process of the exposure devices is assembled by the various subsystems, it is not necessary to say that the assembly process of each subsystem is required. At the end of the assembly process of the exposure devices of various subsystems, a total adjustment is performed to ensure the accuracy of the entire exposure device. Moreover, it is advisable to manufacture the exposure device in a clean room that manages temperature and cleanliness. Micro-devices such as semiconductor devices (micr 0-device) are shown in Fig. 12, after the stage of designing the functions and performance of the micro-devices 2 01, 'According to this design stage, a photomask (grating) stage is manufactured. 002, the stage from silicon material to manufacturing wafer 203, the pattern of the grating is exposed to the wafer's exposure processing stage by the exposure device of the above embodiment, 04, the component assembly stage (including the dicing process), It is manufactured by combining (b nding) process, packaging 4 (packaging process) 205, inspection stage 206, and the like. As described above, the machine device of the first patent application scope is configured to release the independent state of the support portion of the chassis according to the relative displacement of the chassis and the support portion in the first direction substantially orthogonal to the moving surface. structure. Therefore, in this machine device, the damage caused by the contact between the movable element and the stator can be avoided, and at the same time, the effect of reaction force treatment can be implemented while preventing the reduction of the driving force of the motor or the reduction of the anti-vibration performance. The machine device of item 2 is configured such that the release device has a first member provided on the chassis and a second member provided on the support portion. Thereby, the first device and the second member can play the f effect of releasing the independent state of the support portion of the chassis. Regarding the third device of the scope of patent application, the support unit is constituted as a support unit from

10492pif.ptd Page 35 200302507 V. Description of the invention (31) The first member and the second member are non-contact when the chassis is independent, and the structure is contact when the independent state is released. By this means, the contact and non-contact of the first member and the second member can be used to release the independent state of the support portion of the chassis. The body device concerning item 4 of the patent application is a structure in which either of the first member and the second member is provided in a plural number in a direction orthogonal to the first direction. With this, in this machine device, even when the chassis is relatively displaced in a direction other than the first direction, it can play the effect of reliably canceling the independent state of the support portion of the chassis and following the movement. The machine device concerning the scope of patent application No. 5 has a structure in which the weight of the support portion is supported by an elastic member. This makes it possible to prevent the heat generated in the supporting portion from being supported by the machine device. Regarding the item 6 of the scope of patent application, the machine device is configured as an elastic member that supports the support portion at least at three points that become the apex of a triangle. Thereby, the effect that the support portion can be stably supported in a plane can be exhibited in this machine system. The machine device relating to item 7 of the patent application has a structure having a second driving device for driving the chassis in the first direction. Thereby, in this machine device, the effect of releasing the independent state of the support portion of the f chassis driven in the first direction can be exhibited. Regarding the item 8 of the scope of patent application, the machine device is configured to have

10492pif.ptd Page 36 200302507 V. Description of the invention (32) The bearing unit is driven in the first direction. Here, the effect of reducing the deformation force of the chassis by the width of the machine device. It is possible to move the support, so that when the independent state of the machine device is released, the structure of the control device that controls the third driving device to compensate for the movement can be obtained in the scope of the patent application. Thereby, the machine device is moved to play the elastic member. The first driving device is constructed when the driving is stopped. With this, when this machine device is stopped, it is possible to make sure that the support device is related to at least one of the first patent application scope and the substrate machine to any one of item 11 in the scope of the patent application. The effect of reducing the driving force or the vibration-proof performance of the contact between the movable element and the stator. Structure of three driving devices. It can be obtained that when the independent state is released, the machine device with a large item is constituted as a structure having a supporting mechanism to make a contract. This is the effect of greatly reducing the deformation force of the chassis even when the stator moves. The machine device of item 〇 is configured to have the effect of shifting the center of gravity of the supporting portion when moving with the stator, and is capable of correcting the effect of reducing the rigidity of the center of gravity when moving with the stator. The machine device of item 1 is constituted as a third mobile link which is connected with the support part freely, and the effect of following the chassis even in the drive support part of the third drive device. The exposure device of the two items is configured as a mask device and the device using the device of the patent application ranging from the first item. When the photomask or substrate is moved, damage can be recovered. At the same time, the reaction force is treated while preventing the motor from falling.

10492pi f.ptd Page 37 200302507 Brief Description of Drawings Fig. 1 is a schematic view showing the overall structure of an exposure apparatus according to a first embodiment of the present invention. Fig. 2 is a perspective view showing the appearance of a wafer machine according to the present invention. Fig. 3 is a plan view showing the arrangement of vibration-proof members and coil springs. Fig. 4 is a schematic configuration diagram showing a wafer machine according to the first embodiment of the present invention. FIG. 5 is an enlarged view of a release device constituting a wafer table. Fig. 6 is a side sectional view of the release device. Fig. 7 is a control block diagram of the first embodiment. Fig. 8 is a schematic configuration diagram showing a wafer machine according to a second embodiment of the present invention. Fig. 9 is a plan view showing the arrangement of vibration-proof members, coil springs, and actuators. Fig. 10 is a control block diagram of the second embodiment. Fig. 11 is a diagram showing another embodiment of the elastic member and the third driving device. Fig. 12 is a flowchart showing an example of a manufacturing process of a semiconductor device. Figures 1 A and 1 B show an example of a conventional machine. A is a plan view and B is a front view. FIG. 14 is a front view showing another example of a conventional machine device. Fig. 15 is a front view showing another example of a conventional machine device. Schematic symbols do not explain: R grating (reticle)

10492pi f.ptd Page 38 200302507 Schematic description of RST grating machine (photomask machine) W, W 1, W 2 wafers (substrate, photosensitive substrate) WST wafer machine (machine device, substrate machine) ) 1 A, 1 B mobile machine (machine body) 7 side plate (supporting part) 1 0 exposure device 2 2 wafer machine plate (base plate) 2 2 a moving surface 2 9 anti-vibration part (second Driving device) 3 1-turn spring (elastic member) 4 5 Release device 4 6 Brace for brake (first member) 4 7-axis member (second member) 4 9 Actuator (third driving device) 5 0 Main control Device (control device) 5 1 bellows (elastic member) 6 1 A, 6 1 BY motor (first drive device) 64A, 64BY movable element (movable element) 6 5 balanced mass (stator)

10492pi f. Ptd p. 39

Claims (1)

200302507 VI. Scope of patent application 1. A machine device system includes: a machine body that is movably supported on a chassis having a moving surface; and a first driving device that drives a stator and a device. A machine device of the machine body of the machine body, which is a movable element of the machine body, is characterized by comprising: a support portion, at the same time, the stator is provided separately from the chassis; k and a release device, It is in a first direction substantially orthogonal to the moving surface according to the relative displacement between the chassis and the support portion to release an independent state of the support portion of the chassis. ¥ 2. The machine device according to item 1 of the scope of patent application, characterized in that the release device comprises: a first member attached to the chassis; and a second member attached to the support portion . 3. The machine device according to item 2 of the scope of patent application, wherein the first member and the second member become non-contact when the support portion is independent from the chassis, and when the independent state is released, the system is non-contact. Become in touch. 4. The machine device according to item 2 or item 3 of the scope of patent application, characterized in that either one of the first member and the second member is provided in plural in a direction orthogonal to the first direction. direction. 5. The machine device according to any one of claims 1 to 3, including: an elastic member supporting the weight of the support portion. 10492pi f. Ptd Page 40 200302507 6. Application for patent scope 6. The machine device as described in item 5 of the patent application scope, characterized in that the elastic member supports the support portion at least at three points that become the apex of a triangle. . 7. The machine device according to any one of claims 1 to 3 of the patent application scope, comprising: a second driving device for driving the chassis in the first direction. 8. The machine device according to any one of claims 1 to 3 in the scope of patent application, characterized in that it comprises: a third driving device for driving the supporting portion in the first direction. 9. The machine device according to item 8 of the scope of patent application, characterized in that it comprises: a support mechanism for the stator to support the stator in a movable manner to the support part. 10. The machine device according to item 9 of the scope of the patent application, wherein the stator is moved by the reaction force of the movement of the machine body; and includes: a control device for correcting the movement of the stator The center of gravity of the supporting portion moves to control the third driving device. 11. The machine device according to item 8 of the scope of patent application, characterized in that the third driving device is connected to the support part freely when the driving is stopped. 1 2. An exposure device is an exposure device for exposing a mask pattern held on a mask table to a substrate held on a substrate table 10492pif. Ptd Page 41 200302507 々 The scope of the patent application lies in that at least one of the mask machine and the substrate machine is used in any one of the items 1 to 12 of the scope of patent application. Device. 1 3. An exposure device is an exposure device that exposes a pattern to a first substrate held by a first substrate machine, and is characterized by comprising: a first driving device that is driven to have a connection to the first substrate. A movable element of a machine and a stator of the first substrate machine; a first fixed plate having a moving surface of the first substrate machine moving; a second fixed plate provided with the stator, and The first fixed plate is set to be independent; a second driving device drives the first fixed plate in a first direction substantially orthogonal to the moving surface; and a third driving device drives the second fixed plate. In the first direction. 14. The exposure device according to item 13 of the scope of patent application, which comprises: a support mechanism that enables the stator to support the stator in a movable manner with respect to the second fixed plate. 15. The exposure device according to item 14 of the scope of patent application, characterized in that it comprises: a control device for correcting the displacement of the center of gravity of the first fixed plate with the movement of the first substrate machine to control The second driving device is also for correction 10492pif.ptd Page 42 200302507 6. Scope of patent application The movement of the first substrate machine changes the center of gravity of the second fixed plate with the movement of the stator to control the third driving device. 16. The exposure device according to item 13 of the scope of patent application, comprising: a projection optical system for projecting the pattern on the first substrate; and a third fixed plate for connection with the first The fixed plate is independent of the second fixed plate to support the projection optical system. 17. The exposure device according to item 16 of the scope of patent application, characterized in that it comprises: a fourth driving device for driving the third fixed disk in the first direction. 18. The exposure device according to item 13 of the scope of patent application, characterized in that it comprises: a second substrate machine, which is moved on the moving surface of the first fixed plate. 19. An exposure method is an exposure method for exposing a pattern on a substrate held by a substrate machine, comprising: a movable element and a stator connected to the substrate machine to drive the substrate machine A stage of driving; a stage of driving a first fixed disk having a moving surface of the substrate machine in a first direction substantially orthogonal to the moving surface; and setting the stator at the same time as the first positioning The disk is set to a stage where an independent second fixed disk is driven in the first direction. 2 0. An exposure method is an exposure method for exposing a pattern on a substrate held by a substrate machine, which includes: 10492pi f. Ptd Page 43 200302507 6. The scope of patent application is at the stage of setting the substrate machine on the first fixed plate with one of the moving surfaces; on the second fixed plate which is set separately from the first fixed plate A stage of a certain number of stages; a stage of driving the substrate machine by the stator and a movable element connected to the substrate machine; and a stage of releasing the independent state of the first fixing plate and the second fixing plate. 10492pi f. Ptd p. 44