KR102036993B1 - Radio frequency identification tag having water resist property and heat resisting property - Google Patents

Abstract

The present invention provides an RFID tag having high heat resistance and water resistance. In addition, an aspect of the present invention provides an RFID tag that can minimize the discharge of foreign matter and efficiently release the heat inside the semiconductor chip at a high temperature.
According to an aspect of the present invention, an RFID tag includes a substrate, a semiconductor chip mounted on a substrate, a first antenna attached to one side of the substrate, and attached to one side of the substrate to cover the first antenna, wherein the semiconductor A shielding member having an opening formed so as to expose the chip, and a waterproof coating layer is provided to surround the substrate and the shielding member, the heat dissipation hole is connected to the opening.

Description

RFID tag with high heat resistance and water resistance {RADIO FREQUENCY IDENTIFICATION TAG HAVING WATER RESIST PROPERTY AND HEAT RESISTING PROPERTY}

The present invention relates to an RFID tag, and more particularly, to an RFID tag having high heat resistance and water resistance.

In general, a semiconductor device forms a predetermined film on a silicon wafer used as a semiconductor substrate, and fabricates a film in a pattern having electrical properties, and electrically inspects each die on which the pattern is formed. A probe test process, a cutting process of cutting each die, a wire-bonding process of welding gold or aluminum wires to a semiconductor device divided into each die by a cutting process, The semiconductor device, in which the bonding process is completed, is manufactured through a packaging process of sealing a ceramic or plastic.

The fab process may include a deposition process of forming a predetermined film on a semiconductor substrate, a photolithography process of forming a photoresist pattern to form the film in a pattern, an etching process of removing a specific portion of the film to form the film in a pattern, A chemical mechanical polishing process for planarizing the surface of the semiconductor substrate, an ion implantation process for injecting impurities into a specific portion of the semiconductor substrate, a cleaning drying process for removing foreign matter remaining on the surface of the semiconductor substrate, and the like.

At the time of semiconductor manufacturing in the FAB process for mass production of semiconductors, a certain number of wafers are collected and stacked in a magazine. The magazine may be attached with an RFID tag indicating the type and quantity of semiconductors.

After the magazine is used, contaminants are removed by washing and drying at a high temperature, and the removal of the contaminants is very important for preventing defects in the semiconductor process. In the case of the conventional RFID tag, there is a problem that the shielding material attached to the RFID tag is cured at a high temperature so that fine foreign substances are discharged from the shielding material. In addition, in the process of washing the magazine at a high temperature, a problem occurs in which the semiconductor chip installed inside the RFID tag is damaged by heat.

Republic of Korea Patent Publication No. 10-2006-0008094 (2006.01.26)

One aspect of the present invention provides an RFID tag having high heat resistance and water resistance. In addition, an aspect of the present invention provides an RFID tag that can minimize the discharge of foreign matter and efficiently release the heat inside the semiconductor chip at a high temperature.

RFID tag according to an aspect of the present invention, a substrate, a semiconductor chip mounted on a substrate, a first antenna attached to one side of the substrate, attached to one side of the substrate is installed to cover the first antenna, the semiconductor A shielding member having an opening formed to expose the chip, and a waterproof coating layer is provided to surround the substrate and the shielding member, the heat dissipation hole is connected to the opening.

Here, the waterproof coating layer may be bonded to the shield member and the substrate by thermal fusion.

In addition, the waterproof coating layer has a greater elasticity than the shielding member, it may be made of silicon.

In addition, a waterproof coating layer may be formed on surfaces of the semiconductor chip and the substrate exposed through the heat dissipation hole.

In addition, a plurality of heat dissipation grooves connected to the opening may be formed on a surface of the shield member facing the substrate, and the heat dissipation grooves may be formed extending from the opening toward the side end of the shield member.

In addition, a heat dissipation groove is formed on a surface of the shield member facing the substrate, and the heat dissipation groove is formed to be connected to a heat collecting portion extending to surround the opening and a longitudinal end of the heat collecting portion, so that the same side of the shielding member is formed. It can include up to two heat outlets.

In addition, the surface facing the substrate in the shield member is continued to surround the opening and the first heat dissipation groove formed in the direction toward the side end of the shield member in the opening, the longitudinal end of the first heat dissipation groove and Connected second heat dissipation grooves may be formed.

In addition, a heat dissipation plate covering the heat dissipation hole is attached to the semiconductor chip, and the heat dissipation plate is a support plate attached to the semiconductor chip through a thermally conductive adhesive layer, a mesh portion formed outside the support plate, and a plurality of holes and shielding are formed. It may include an edge inserted between the member and the waterproof coating layer.

According to one embodiment of the present invention, a waterproof coating layer surrounding the shielding member is formed to prevent foreign substances from radiating from the RFID tag.

In addition, an opening is formed in the shielding member, and a heat dissipation hole connected to the opening is formed in the waterproof coating layer, thereby efficiently dissipating heat inside the semiconductor chip.

1 is a perspective view from below of an RFID tag according to a first embodiment of the present invention.
2 is an exploded perspective view showing a part of the RFID tag according to the first embodiment of the present invention.
3 is a longitudinal cross-sectional view taken along line III-III of FIG. 1.
4 is a longitudinal sectional view showing an RFID tag according to a second embodiment of the present invention.
5 is a perspective view illustrating a shielding member of an RFID tag according to a second embodiment of the present invention.
6 is a perspective view illustrating a shielding member of an RFID tag according to a third embodiment of the present invention.
7 is a perspective view illustrating a shielding member of an RFID tag according to a fourth embodiment of the present invention.
8 is a perspective view from below of an RFID tag according to a fifth embodiment of the present invention.
9 is a longitudinal sectional view showing an RFID tag according to a fifth embodiment of the present invention.

As the invention allows for various changes and numerous embodiments, particular embodiments will be illustrated and described in detail in the detailed description. However, this is not intended to limit the present invention to specific embodiments, it should be understood to include all transformations, equivalents, and substitutes included in the spirit and scope of the present invention.

The terminology used herein is for the purpose of describing particular example embodiments only and is not intended to be limiting of the present invention. Singular expressions include plural expressions unless the context clearly indicates otherwise. In the present invention, the terms 'comprise' or 'have' are intended to indicate that there is a feature, number, step, operation, component, part, or combination thereof described in the specification, and one or more other features. It is to be understood that the present invention does not exclude the possibility of the presence or the addition of numbers, steps, operations, components, components, or a combination thereof.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings. At this time, it is noted that the same components in the accompanying drawings are represented by the same reference numerals as possible. In addition, detailed descriptions of well-known functions and configurations that may blur the gist of the present invention will be omitted. For the same reason, in the accompanying drawings, some components are exaggerated, omitted or schematically illustrated.

1 is a perspective view from below of an RFID tag according to a first embodiment of the present invention, FIG. 2 is an exploded perspective view showing a part of an RFID tag according to the first embodiment of the present invention, and FIG. It is a longitudinal cross-sectional view cut along the III-III line.

Referring to FIGS. 1 to 3, the RFID tag 100 according to the first embodiment may be formed of an RFID tag attached to a semiconductor storage magazine, a tray, or the like and used in a semiconductor manufacturing process. The RFID tag 100 includes a substrate 110, a semiconductor chip 160, a first antenna 131, a second antenna 132, a shielding member 140, and a waterproof coating layer 120.

The substrate 110 may be formed of a printed circuit board and may have an approximately rectangular plate shape. The semiconductor chip 160 may be mounted on the substrate 110 and may be a communication chip for transmitting and receiving RF signals. In addition, the semiconductor chip 160 may be disposed in the center of the substrate 110 and may be formed as a communication chip for high frequency band communication of 10 MHz to 15 MHz.

The first antenna 131 is attached to one side of the substrate 110 and may be formed of a copper pattern. The first antenna 131 may be attached to the bottom surface of the substrate 110 and may include an outer frame 1310a and a plurality of grids 131b formed inside the outer frame 131a. The lower surface is a surface attached to a storage means such as a magazine.

The second antenna 132 may be attached to the surface of the substrate 110 facing in a direction opposite to the surface to which the first antenna 131 is attached and may be formed of a copper pattern. The second antenna 132 may be attached to the top surface of the substrate 110. The second antenna 132 may extend in the circumferential direction of the substrate 110 but may have a wound pattern having a rectangular spiral shape.

The shielding member 140 is attached to the substrate 110 to cover the first antenna 131 and allows electromagnetic waves to be emitted to the front of the RFID tag 100. The shielding member 140 may be made of silicon, synthetic resin, ferrite sheet, or the like, and the present invention is not limited to the material of the shielding member 140. The shielding member 140 has an opening 141 through which the semiconductor chip 160 is exposed. The opening 141 may be formed in various shapes such as square, triangle, circle, and oval.

The waterproof coating layer 120 is installed to surround the substrate 110 and the shielding member 140, and is spaced apart from the upper surface 121 and the upper surface 121 to face the lower surface 125, the upper surface 121, and the lower surface 125. It includes a side 123 for connecting. The substrate 110 and the shielding member 140 are positioned between the upper surface 121 and the lower surface 125, and the waterproof coating layer 120 may be made of a silicon material having elasticity.

Meanwhile, the waterproof coating layer 120 may be attached to the substrate 110, the shielding member 140, the first antenna 131, and the second antenna 132 by thermal fusion. A heat dissipation hole 126 connected to the opening 141 may be formed in the waterproof coating layer 120. Accordingly, the semiconductor chip 160 is exposed to the outside through the opening 141 and the heat dissipation hole 126. A sealing layer (not shown) made of an adhesive for waterproofing may be formed at a portion of the heat dissipation hole 126 that is in contact with the shielding member 140.

Meanwhile, the waterproof coating layer 150 is formed on the surfaces of the semiconductor chip 160 and the substrate 110 exposed through the heat dissipation hole 126, and the waterproof coating layer 150 may be formed of an epoxy resin. However, the waterproof coating layer 150 may be formed to a thickness of several tens of micrometers to several hundreds of micrometers so that heat inside the semiconductor chip 160 may be easily discharged.

Magazine used in the semiconductor process is subjected to a high temperature cleaning, ultrasonic cleaning, plasma cleaning and high temperature drying process, the shielding member 140 may be cured at a high temperature and fine foreign matter may be emitted from the shielding member 140. However, when the waterproof coating layer 120 is installed to surround the substrate 110 and the shielding member 140 as in the first embodiment, it is possible to prevent foreign substances from radiating from the shielding member 140.

In addition, when the opening 141 is formed in the shielding member 140 and the heat dissipation hole 126 connected to the opening 141 is formed in the waterproof coating layer 120, the heat inside the semiconductor chip 160 is externally generated during the high temperature cleaning process. Can be easily released. In addition, since the waterproof coating layer 150 formed of the epoxy resin is formed on the semiconductor chip 160 and the substrate 110, it is possible to prevent intrusion of moisture.

4 is a longitudinal sectional view showing an RFID tag according to a second embodiment of the present invention, and FIG. 5 is a perspective view showing a shielding member of the RFID tag according to the second embodiment of the present invention.

The RFID tag 200 according to the second embodiment includes a substrate 210, a semiconductor chip 260, a first antenna 231, a second antenna 232, a shielding member 240, and a waterproof coating layer 220. Include.

Since the RFID tag 200 according to the second exemplary embodiment has the same structure as the RFID tag according to the first exemplary embodiment except for the shielding member 240, redundant description of the same structure will be omitted.

In the shielding member 240 according to the second embodiment, a heat dissipation groove 245 is formed on a surface facing the substrate 210, and the heat dissipation groove 245 is connected to the opening 241 and at the opening 241. It is formed extending outward. The heat dissipation groove 245 is formed to extend in a direction perpendicular to the inner surface of the opening 241, whereby the heat dissipation groove 245 extends from the opening 241 toward the side end of the shielding member 240. Four heat dissipation grooves 245 may be formed in the shielding member 240, and the heat dissipation grooves 245 may be connected to each side of the opening 241 formed in a quadrangle.

When the heat dissipation groove 245 is formed in the shielding member 240 as in the second embodiment, the heat of the substrate 210 is discharged through the heat dissipation groove 245 to damage the semiconductor chip 260 during the high temperature cleaning process. You can prevent it.

6 is a perspective view illustrating a shielding member of an RFID tag according to a third embodiment of the present invention.

Since the RFID tag according to the third exemplary embodiment has the same structure as the RFID tag according to the first exemplary embodiment except for the shielding member 340, redundant description of the same structure will be omitted.

The heat dissipation groove 345 is formed on the surface facing the substrate in the shielding member 340 according to the third embodiment, the heat dissipation groove 345 is formed to continue to surround the opening 341, the heat dissipation groove 345 The longitudinal end of is formed connected to the same side of the shield member (340).

More specifically, the heat dissipation groove 345 is formed to extend in the circumferential direction of the opening 341 and is connected to the heat collecting portion 3451 and the heat collecting portion 3651 surrounding the opening 341, and in the heat collecting portion 3451. And heat dissipation portions 3452 and 3453 extending to the side ends of the shielding member 340.

The heat collecting part 3541 is formed to extend to surround the opening 341 having a rectangular shape, and is spaced apart from the opening 341. Two heat dissipating parts 3452 and 3453 are connected to both ends of the longitudinal direction of the heat collecting part 3651, and the heat dissipating parts 3452 and 3453 are connected to the same side of the shielding member 340.

As described above, according to the third exemplary embodiment, the air heated in the heat collecting part 3451 is discharged to the outside through the heat discharging parts 3452 and 3453 to efficiently discharge the heat of the substrate and the semiconductor element.

7 is a perspective view illustrating a shielding member of an RFID tag according to a fourth embodiment of the present invention.

Since the RFID tag according to the fourth exemplary embodiment has the same structure as the RFID tag according to the first exemplary embodiment except for the shielding member 350, redundant description of the same structure will be omitted.

The first heat dissipation groove 354 and the second heat dissipation groove 355 are formed on the surface facing the substrate in the shielding member 350 according to the fourth embodiment. The first heat dissipation groove 354 is connected to the opening 351 and is formed to extend outward from the opening 351. The first heat dissipation groove 354 is formed to extend in a direction perpendicular to the inner surface of the opening 351, and extends toward the side end of the shielding member 350 in the opening 351. Four first heat dissipation grooves 354 may be formed in the shielding member 350, and the first heat dissipation grooves 354 may be connected to each side of the opening 351 having a quadrangular shape.

The second heat dissipation groove 355 is formed to extend to surround the opening 351, and is connected to the longitudinal end of the first heat dissipation groove 354.

The second heat dissipation groove 355 is formed to extend in the circumferential direction of the opening 351 and is connected to the heat collecting part 3551 and the heat collecting part 3551 surrounding the opening 351, and the shielding member at the heat collecting part 3551. And heat dissipation portions 3552 and 3553 extending to the side ends of the 350. The first heat dissipation groove 354 is located inside the heat collecting part 3551, and is connected to the heat collecting part 3551.

The heat collecting part 3551 is formed to surround the opening 351 having a rectangular shape and is spaced apart from the opening 351. Two heat dissipation parts 3652 and 3553 are connected to both ends of the longitudinal direction of the heat collecting part 3551, and the heat dissipation parts 3652 and 3553 are connected to the same side of the shield member.

As described above, according to the fourth embodiment, the air heated from the inside through the first heat dissipation groove 354 moves to the second heat dissipation groove 355 and is discharged to the outside through the heat dissipation parts 3552 and 3553. Thus, heat of the substrate and the semiconductor element can be efficiently discharged.

8 is a perspective view of an RFID tag according to a fifth embodiment of the present invention from below, and FIG. 9 is a longitudinal cross-sectional view of an RFID tag according to a fifth embodiment of the present invention.

Referring to FIGS. 8 and 9, the RFID tag 400 according to the fifth embodiment includes a substrate 410, a semiconductor chip 460, a first antenna 431, a second antenna 432, and shielding. The member 440, the waterproof coating layer 420, and the heat sink 470 are included.

Since the RFID tag 400 according to the fifth exemplary embodiment has the same structure as the semiconductor chip according to the first exemplary embodiment except that the heat sink 470 is installed, redundant description of the same structure will be omitted.

The RFID tag 400 according to the fifth embodiment further includes a heat sink 470 covering the heat dissipation hole 426 formed in the waterproof coating layer 420, and the heat sink 470 is attached to the semiconductor chip 460. The heat sink 470 may be attached to the semiconductor chip 460 through the thermally conductive adhesive 480, and the thermally conductive adhesive 480 may be made of thermally conductive silicon. The heat sink 470 may be formed in a film form or may be made of a thin thin plate having a thickness of less than 1 mm. The heat sink 470 may be made of a metal having excellent thermal conductivity such as copper or aluminum.

On the other hand, the heat sink 470 is formed on the outside of the support plate 471 and the support plate 471 attached to the semiconductor chip 460 and is located outside the mesh portion 472 and the mesh portion 472 in which a plurality of holes are formed. An edge portion 473 inserted between the shielding member 440 and the waterproof coating layer 420 may be included.

The support plate 471 is formed in a substantially rectangular plate shape and is made of a flat plate without a hole formed therein. The mesh part 472 is formed to surround the support plate 471 on the outside of the support plate 471 and has a plurality of holes in a mesh structure. On the other hand, the edge portion 473 is inserted between the shielding member 440 and the waterproof coating layer 420 is formed on the outside of the heat sink 470 may be attached to the shielding member 440 and the waterproof coating layer 420. .

According to the fifth embodiment, heat of the semiconductor chip 460 is transferred to the support plate 471 through the thermal conductive adhesive 480, and heat transferred to the support plate 471 is discharged from the mesh unit 472. Can be. Accordingly, heat of the semiconductor chip 460 may be efficiently released during the high temperature cleaning process.

As mentioned above, although an embodiment of the present invention has been described, those of ordinary skill in the art may add, change, delete or add components within the scope not departing from the spirit of the present invention described in the claims. The present invention may be modified and changed in various ways, etc., which will also be included within the scope of the present invention.

100, 200, 400: RFID Tag
110, 210, 410: substrate
120, 220, 420: waterproof coating layer
121: top
123: side
125: if
126, 226, 426: heat dissipation hole
131, 231, and 431: first antenna
132, 232, and 432: second antenna
140, 240, 340, 350, 450: shield member
141, 241, 341, 351: opening
150: waterproof coating layer
160.260, 460: semiconductor chips
245, 345: heat dissipation groove
3451: heat collector
3452, 3453: heat exhaust
354: first heat dissipation groove
355: second heat dissipation groove
470: heat sink
471: support plate
472: mesh part
473: border

Claims (8)

Board;
A semiconductor chip mounted on the substrate;
A first antenna attached to one side of the substrate;
A shielding member attached to one side of the substrate to cover the first antenna, the shielding member having an opening to expose the semiconductor chip;
A waterproof coating layer provided to surround the substrate and the shielding member and having a heat dissipation hole exposing the semiconductor chip;
Including;
The heat dissipation hole is connected to the opening,
A portion of the heat dissipation hole in contact with the shielding member is formed with a sealing layer for waterproofing,
And said semiconductor chip is inserted into an opening formed in said shielding member. The method of claim 1,
The waterproof coating layer is a RFID tag having a high heat resistance and waterproof performance, characterized in that bonded to the shield member and the substrate by thermal fusion. The method of claim 1,
The waterproof coating layer has a greater elasticity than the shield member, RFID tag having a high heat resistance and waterproof performance, characterized in that made of silicon. Board;
A semiconductor chip mounted on the substrate;
A first antenna attached to one side of the substrate;
A shielding member attached to one side of the substrate to cover the first antenna, the shielding member having an opening to expose the semiconductor chip;
A waterproof coating layer provided to surround the substrate and the shielding member and having a heat dissipation hole exposing the semiconductor chip;
Including;
The heat dissipation hole is connected to the opening,
RFID tag having high heat resistance and waterproof performance, characterized in that a waterproof coating layer is formed on the surface of the semiconductor chip and the substrate exposed through the heat dissipation hole. Board;
A semiconductor chip mounted on the substrate;
A first antenna attached to one side of the substrate;
A shielding member attached to one side of the substrate to cover the first antenna, the shielding member having an opening to expose the semiconductor chip;
A waterproof coating layer provided to surround the substrate and the shielding member and having a heat dissipation hole exposing the semiconductor chip;
Including;
The heat dissipation hole is connected to the opening,
The shielding member is formed with a plurality of heat dissipation grooves extending from the opening toward the side end of the shielding member,
The heat dissipation groove is a RFID tag having a high heat resistance and waterproof performance, characterized in that formed on the surface facing the substrate in the shielding member. Board;
A semiconductor chip mounted on the substrate;
A first antenna attached to one side of the substrate;
A shielding member attached to one side of the substrate to cover the first antenna, the shielding member having an opening to expose the semiconductor chip;
A waterproof coating layer provided to surround the substrate and the shielding member and having a heat dissipation hole exposing the semiconductor chip;
Including;
The heat dissipation hole is connected to the opening,
The shielding member is provided with a heat dissipation groove formed to be connected to the heat collecting portion extending to surround the opening and the longitudinal end of the heat collecting portion and two heat dissipating portions extending to the same side of the shielding member,
The heat dissipation groove is a RFID tag having a high heat resistance and waterproof performance, characterized in that formed on the surface facing the substrate in the shielding member. Board;
A semiconductor chip mounted on the substrate;
A first antenna attached to one side of the substrate;
A shielding member attached to one side of the substrate to cover the first antenna, the shielding member having an opening to expose the semiconductor chip;
A waterproof coating layer provided to surround the substrate and the shielding member and having a heat dissipation hole exposing the semiconductor chip;
Including;
The heat dissipation hole is connected to the opening,
The shield member has a first heat dissipation groove formed to extend from the opening toward the side end of the shield member and to surround the opening, and a second heat dissipation groove connected to the longitudinal end of the first heat dissipation groove is formed.
And the first heat dissipation groove and the second heat dissipation groove are formed on the surface of the shielding member facing the substrate. The method of claim 1,
The heat dissipation plate is attached to the semiconductor chip to cover the heat dissipation hole, and the heat dissipation plate includes a support plate attached to the semiconductor chip via a thermally conductive adhesive layer, a mesh portion formed outside the support plate, and a plurality of holes and the shielding member. RFID tag having high heat resistance and waterproof performance, characterized in that it comprises an edge portion inserted between the waterproof coating layer.

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