KR101622643B1 - SUBSTRATE ASSEMBLY FOR FLEXIBLE DISPLAY DEVICE and METHOD OF MANUFACTURING FLEXIBLE DISPLAY DEVICE USING THE SAME - Google Patents

Abstract

The present invention relates to a substrate assembly for a flexible display device and a method of manufacturing the flexible display device using the flexible substrate and the transfer substrate, wherein the flexible substrate and the transfer substrate can be easily attached and detached to improve the production yield. A first coating layer formed by coating a first material having magnetism on one surface of the transfer substrate; A flexible substrate provided to have ductility; And a second coating layer formed by coating a ferromagnetic second material on the rear surface of the flexible substrate and being attached to the first coating layer by a magnetic force.

A flexible display, a substrate assembly, a flexible substrate, a magnetic force

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a substrate assembly for a flexible display, and a method of manufacturing the flexible display using the flexible substrate.

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate assembly for manufacturing a flexible display device, and a method of manufacturing a flexible display device using the same. More particularly, the flexible substrate and the transfer substrate are easily attached and detached, To a substrate assembly for a flexible display device capable of improving the yield and a method of manufacturing a flexible display device using the same.

In recent years, as the information age has come to a full-fledged information age, a display field for visually expressing electrical information signals has been rapidly developed. In response to this, various flat panel display devices having excellent performance of thinning, light weight, Flat Display Device) has been developed to replace CRT (Cathode Ray Tube). Specific examples of such flat panel display devices include a liquid crystal display device (LCD), a plasma display panel (PDP), a field emission display (FED) An electro luminescence display device (ELD), and the like.

Such a flat panel display device essentially includes a flat panel display panel that implements an image by having a pair of insulating substrates facing each other with a unique light-emitting or polarizing material layer sandwiched therebetween. At this time, it is general that the insulating substrate is made of a hard material which is stable and maintains a flat state against a semiconductor or metal patterning process for forming transistors, lines, etc. included in the display panel, such as glass . However, an insulating substrate made of glass (hereinafter referred to as a "glass substrate") tends to be broken by a force from the outside due to the physical characteristics of the glass. Therefore, the glass substrate is required to be formed thicker than a predetermined thickness that is not damaged by external force, and is easily broken due to its physical properties, so that it is practically impossible to deform the glass substrate freely. Therefore, And there is a problem that portability is lowered because shape deformation is not easy.

In order to solve such a problem, a flexible flat display device (hereinafter referred to as "flexible display device") capable of deforming light and easily deformable so as to improve portability is proposed, Technological development of devices is continuing. Such a soft display device uses a flexible insulating substrate (hereinafter referred to as a "flexible substrate") that easily bends according to a force externally applied, instead of a rigid glass substrate. That is, the soft display device has a flexible display panel in which a pair of flexible substrates has a structure in which a light emitting layer or a polarizing material layer is interposed therebetween. At this time, the flexible substrate is provided with a plastic film or a metal foil (metal thin film) in the form of a film.

However, since the existing manufacturing equipment for manufacturing the display panel is designed to fit on the glass substrate that maintains the flat state, it is difficult to apply the same directly to the flexible substrate which is not flattened and is not kept flat. That is, when the flexible display panel is manufactured using existing manufacturing facilities, there may arise a problem that the flexible substrate being conveyed can not be folded or transferred to a proper position and is pulled out due to the flexible nature of the flexible substrate, A pattern may be formed on the flexible substrate of the substrate.

Accordingly, as a method for manufacturing a flexible display panel using an existing manufacturing facility, a substrate assembly in which a flexible substrate is bonded to a rigid and flat transfer substrate, such as glass, is manufactured, There is a method of manufacturing a flexible display panel by performing a process of forming a laminate of a display panel on an assembly and then removing the transferred substrate from a substrate assembly in which a laminate of display panels is formed on a flexible substrate.

1 is a cross-sectional view of a conventional substrate assembly.

1, the substrate assembly 10 according to the related art includes a transfer substrate 11 which is flatly provided with a hard material such as glass or the like, an adhesive layer 12 formed on one surface of the transfer substrate 11, And a flexible substrate (13) disposed on the adhesive layer (12). Here, the adhesive layer 12 is provided with a double-sided adhesive such as OCA (Optical Clear Adhesive) or UV Resin having an adhesive strength while being solidified in response to ultraviolet rays (UV). The flexible substrate 13 is made of plastic or metal in film form.

According to the related art, since the adhesive layer 12 and the flexible substrate 13, which are bonded to each other face to face, are provided with materials having different coefficients of thermal expansion with respect to heat, the conventional substrate assembly 10 is formed by a heat treatment process, The adhesive layer 12 and the flexible substrate 13 may be expanded or contracted differently due to heat so that the overall shape of the substrate assembly 10 may be deformed as if it were bent. An outgassing phenomenon in which a fume is generated in the adhesive layer 12 by the heat treatment process causes the adhesion between the transfer substrate 11 and the adhesive layer 12 or between the adhesive layer 12 and the flexible substrate 13 The soft substrate 13 may be cried or the flexible substrate 13 or the transfer substrate 11 may be separated from the adhesive layer 12. [ In addition, due to misalignment, the flexible substrate 13 may not be flatly attached to the adhesive layer 12. As described above, the conventional substrate assembly 10 uses the adhesive layer 12 to adhere the transfer substrate 11 and the flexible substrate 12, so that the shape is deformed by the adhesive layer 12 during the heat treatment process And if the flexible substrate 12 is misaligned on the adhesive layer 12, correction can not be performed, and thus the manufacturing yield of the display panel is difficult to be improved.

In the conventional substrate assembly 10, the transfer substrate 11 and the adhesive layer (not shown) are stacked so that the adhesion between the transfer substrate 11 and the flexible substrate 12 is firmly maintained until the manufacturing process of the display panel is completed. 12 are adhered to each other and a pressure is applied when the adhesive layer 12 and the flexible substrate 13 are bonded together. By this two pressing process, a large amount of stress is applied to the transfer substrate 11. When the manufacturing process of the display panel is completed, the transfer substrate 11 must be removed from the substrate assembly 10 on which the stack of display panels is formed on the flexible substrate 13. At this time, the transfer substrate 11 is subjected to a large amount of stress by the process of separating from the flexible substrate 13. [ In this way, the transfer substrate 11, which is subjected to a large amount of stress due to the adhesion and separation processes, is liable to be damaged or broken. Thus, the number of reusable transfer substrates 11 is reduced, .

Accordingly, it is an object of the present invention to facilitate the process of bonding and separating the transfer substrate and the flexible substrate compared to the prior art, thereby improving the manufacturing yield of the flexible display panel and reducing the manufacturing cost of the flexible display panel And a method of manufacturing a flexible display device using the substrate assembly.

In order to solve such a problem, the present invention provides a transfer substrate which is flatly provided; A first coating layer formed by coating a first material having magnetism on one surface of the transfer substrate; A flexible substrate provided to have ductility; And a second coating layer formed by coating a ferromagnetic second material on the rear surface of the flexible substrate and being attached to the first coating layer by a magnetic force.

According to another aspect of the present invention, there is provided a method of manufacturing a semiconductor device, comprising: forming a first coating layer by coating a first material having magnetism on one surface of a transport substrate provided flat; Forming a second coating layer by coating a second material having a ferromagnetism on the back surface of the soft substrate provided to have ductility; Attaching the transfer substrate and the flexible substrate by magnetic force of the first coating layer to produce a substrate assembly; Forming a laminate of display panels on the upper surface of the flexible substrate of the substrate assembly; And removing the transfer substrate from the substrate assembly having the stack of the display panels formed thereon.

As described above, in the substrate assembly for a flexible display according to the present invention, the flexible substrate is attached to the transfer substrate in a flat manner by attaching the transfer substrate and the flexible substrate using a magnetic force instead of the adhesive force of the adhesive layer, The flexible substrate can be maintained in a flat state until the manufacturing process of the transfer substrate is completed, and the stress applied to the transfer substrate is reduced as compared with the prior art, so that the number of reuse times of the transfer substrate can be increased. Therefore, the manufacturing yield of the flexible display panel can be improved, and the manufacturing cost can be reduced.

Hereinafter, a substrate assembly according to an embodiment of the present invention and a method of manufacturing a flexible display using the same will be described with reference to the accompanying drawings.

A substrate assembly according to an embodiment of the present invention to be described below includes a flat panel display panel (hereinafter, referred to as " flexible ") panel for realizing an image by having a pair of flexible substrates, Display panel "). Examples of the flexible display device having such a flexible display panel include an active matrix liquid crystal display (AMLCD), an organic light emitting diode (OLED), an electrophoretic display, A field emission display (FED), a thin film transistor light emitting polymer, and a cholesteric liquid crystal display.

2 is a cross-sectional view of a substrate assembly according to an embodiment of the present invention.

2, a substrate assembly 100 according to an embodiment of the present invention includes a transfer substrate 110, a first substrate 110 disposed on one side of the transfer substrate 110 and made of a first material having a magnetism, The first coating layer 120 is disposed on the back surface of the flexible substrate 130 and is made of a material having flexibility and opposite to the transfer substrate 110. The first coating layer 120 faces the first coating layer 120 and has ferromagnetic and a second coating layer 140 made of a second material of a ferromagnetism. The second coating layer 140 is made of a ferromagnetic second material that is magnetized by an external magnetic force or an electric force. Since the first and second coating layers 120 and 140 made of the first and second materials generate a magnetic force therebetween, the first and second coating layers 120 and 140 are mutually Respectively.

The flexible substrate 130 is made of plastic or metal in the form of a film that is stable to chemicals or heat and is made of a plastic metal.

The first coating layer 120 is in the form of a thin film disposed on one side of the transfer substrate 110. The first coating layer 120 is made of a first material, such as a magnet, which retains magnetism for a long time without an external electric field or a magnetic field. The first material may be a Neodium (Nd) -based metal or a Neodymium-based metal alloy coated on one surface of the transfer substrate 110 in the form of a thin film. have.

The second coating layer 140 is in the form of a thin film disposed on the back surface of the flexible substrate 130. The second coating layer 140 is made of a ferromagnetic second material that is magnetized by being affected by the magnetism of the first material or the magnetic energy applied from the outside. The second material may be an alloy including a transition metal or a transition metal that can be coated with a thin film on the back surface of the flexible substrate 130.

A magnetic force is generated between the first coating layer 120 and the second coating layer 140 due to the magnetism of the first coating layer 120 and the second coating layer 140. These magnetic forces are generated between the first coating layer 120 and the second coating layer 140 It acts as an attractive force. Therefore, the first coating layer 120 and the second coating layer 140 are adhered to each other by the magnetic force between the first coating layer 120 and the second coating layer 140. As the first coating layer 120 and the second coating layer 140 are bonded together, the flexible substrate 130 on which the transfer substrate 110 and the second coating layer 140, on which the first coating layer 120 is formed, do.

During the manufacturing process of the display panel, the first coating layer 120 is formed to have a Curie temperature higher than the process temperature of the heat treatment process included in the manufacturing process of the display panel, so that the first coating layer 120 does not lose magnetism Curie temperature < / RTI > Generally, since the process temperature of the heat treatment process is about 150 degrees Celsius, the first coating layer 120 may be made of a first material having a Curie temperature of 150 degrees Celsius or more. Also, the second coating layer 140 may be formed of a second material having a Curie temperature higher than the process temperature of the heat treatment process included in the manufacturing process of the display panel.

Further, the magnetism of the first material and the second material is weakened by heat and strengthened by an electric force or a magnetic force. According to the embodiment of the present invention, after the first coating layer 120 is heated to weaken the magnetic properties of the first material, the first coating layer 120 and the second coating layer 140 are sandwiched between the soft substrate The flexible substrate 130 is aligned on the transfer substrate 110 so that the flexible substrate 130 is easily aligned by the weak magnetic properties of the first coating layer 120. [ The transfer substrate 110 and the flexible substrate 130, which are aligned with the first coating layer 120 and the second coating layer 140 interposed therebetween, are positioned in an electric field in which electric force is present. At this time, the magnetic forces of the first coating layer 120 and the second coating layer 140 are strengthened by the electric force, so that the magnetic force between the first coating layer 120 and the second coating layer 140 becomes strong, And the flexible substrate 130 can be firmly attached to each other.

As described above, the substrate assembly 100 according to the embodiment of the present invention is different from the conventional substrate assembly having a structure in which the transfer substrate and the flexible substrate are bonded to each other with the adhesive layer interposed therebetween, The transfer substrate 110 and the flexible substrate 130 are formed by using the magnetic force between the first coating layer 120 and the second coating layer 140 generated by the magnetic properties of the first coating layer 120 and the second coating layer 140, Facing structure. This makes it possible to eliminate the adhesive layer which is deformed or generates fuming by the heat treatment process.

Next, a method of manufacturing a flexible display device using the substrate assembly 100 according to an embodiment of the present invention will be described.

FIG. 3 is a flowchart illustrating a method of manufacturing a flexible display device using the substrate assembly shown in FIG. 2, and FIGS. 4a to 4e are cross-sectional views schematically illustrating a method of manufacturing the flexible display device shown in FIG.

3, a method of manufacturing a flexible display device according to an embodiment of the present invention includes forming a first coating layer 120 on one side of a transfer substrate 110 (S100) The transfer substrate 110 and the flexible substrate 130 are bonded to each other with the first coating layer 120 and the second coating layer 140 facing each other to form a second coating layer 140 on the back surface of the substrate 110, A step S130 of forming a laminate in which a semiconductor layer or a metal layer or the like is patterned on the upper surface of the flexible substrate 130 of the substrate assembly 100 and a step S130 of forming a flexible substrate 130, And removing the transfer substrate 110 from the substrate assembly 100 having the stacked structure formed thereon (S140).

In the step S100 of forming the first coating layer 120 on one side of the transfer substrate 110, the transfer substrate 110 is made of a material such as glass that is stable and hard to chemically or heat. As shown in FIG. 4A, the first coating layer 120 is formed on one surface of the transfer substrate 110 by coating a first material having magnetism. In this case, the first material is a material such as a magnet capable of retaining magnetism for a long period of time without applying an external electric field or an external magnetic field, and may be a neodymium (Nd) And may be an alloy including a neodymium (Nd) -based metal. In addition, the first coating layer 120 may be formed of a material having a Curie temperature higher than the process temperature in the step of forming the laminate (S130) so as not to lose the magnetic property until the step of forming the laminate (S130) 1 substance.

Then, the first coating layer 120 formed on the transfer substrate 110 is heated to weaken the magnetic properties of the first coating layer 120 (S101). When the magnetism of the first coating layer 120 is weakened in this manner, when the soft substrate 130 is aligned on the transfer substrate 110 in the step of creating the substrate assembly 100 (S120) Can be easily adjusted so as to be in a flat state.

In step S110 of forming the second coating layer 140 on the rear surface of the flexible substrate 130, the flexible substrate 130 is formed of plastic or metal in film form. 4B, the second coating layer 140 is formed by coating a second ferromagnetic material on the back surface of the thus-prepared soft substrate 130. As shown in FIG. At this time, the second material can determine whether or not the magnetic material is retained depending on whether an external electric field or an external magnetic field is applied, and can detect the magnetic property of the ferromagnetic material, which is maintained for a predetermined time after the external electric field or the external magnetic field is removed, . The second material may be an alloy including a transition metal or a transition metal that can be coated on the flexible substrate 130 in the form of a thin film. The second coating layer 140 may be formed in the same manner as the first coating layer 120 so that the magnetic properties are not lost until the step S130 of forming the laminate is completed, Lt; RTI ID = 0.0 > Curie < / RTI > temperature.

In step S120 of creating the substrate assembly 100, the flexible substrate 130 is aligned to spread flat on the transfer substrate 110 with the first coating layer 120 and the second coating layer 140 therebetween S121). At this time, since the magnetic properties of the first coating layer 120 are weakened by the first heating step S101 and the magnetic force between the first coating layer 120 and the second coating layer 140 is weakened, The process of aligning the substrate 110 on the transfer substrate 110 in a flat state can be easily performed.

Next, the transfer substrate 110 and the flexible substrate 130, which are aligned to face each other with the first coating layer 120 and the second coating layer 140 interposed therebetween, are positioned in an electric field in which electric force is present, Substrate 110 and flexible substrate 130 are bonded (S122) to produce substrate assembly 100 (S120). At this time, the electric field is formed to have the same direction as the magnetism of the first coating layer 120, so that the first coating layer 120 and the second coating layer 140 have magnetism in the same direction. That is, the magnetic forces of the first coating layer 120 and the second coating layer 140 located in the electric field are strengthened by the electric force, and the magnetic force between the first coating layer 120 and the second coating layer 140 is strengthened So that the first coating layer 120 and the second coating layer 140 are bonded together. By bonding the first coating layer 120 and the second coating layer 140 together, the transfer substrate 110 and the flexible substrate 130 are bonded together. Therefore, the structure in which the transfer substrate 110, the first coating layer 120, the second coating layer 140, and the flexible substrate 130 are bonded together by the magnetic force between the first coating layer 120 and the second coating layer 140 0.0 > 100 < / RTI >

In the step of forming the laminate (S130), the laminate means an element constituting a display panel such as a thin film transistor, a line, an electrode, a black matrix, or a color filter. At this time, a laminate is formed on the flexible substrate 130 by a process of depositing a metal layer or a semiconductor layer using the substrate assembly 100, a heat treatment process, a process of patterning a deposited metal layer or a semiconductor layer, a vacuum process, or the like .

The substrate assembly 100 is heated to remove the magnetic properties of the first coating layer 120 and the second coating layer 140 in step S140 of removing the transfer substrate 110 from the substrate assembly 100 having the laminate formed thereon (S141). At this time, as the magnetic force between the first coating layer 120 and the second coating layer 140 is weakened, the attracting force between the first coating layer 120 and the second coating layer 140 is weakened. By separating the first coating layer 120 and the second coating layer 140 from each other (S142) by using the magnetic force between the weakened first coating layer 120 and the second coating layer 140, The transfer substrate 110 is removed.

According to an embodiment of the present invention, a heating step S101 for weakening the magnetic properties of each of the first coating layers 120 before the flexible substrate 130 is aligned on the transfer substrate 110, Except for the heating step S141 for weakening the magnetic properties of the first coating layer 120 and the second coating layer 140 before separating the second coating layer 140 and the second coating layer 140, It is not subjected to stress. Accordingly, the transfer substrate 110 removed from the substrate assembly 100 does not have a high degree of damage, and can be reused a plurality of times. Therefore, the transfer substrate 110 which is determined to be reusable among the transfer substrates 110 removed from the substrate assembly 100 is reused (S150). That is, since the transfer substrate 110 to be reused has the same structure as that shown in FIG. 4A and the magnetic properties of the first coating layer 120 are weakened to be removed from the substrate assembly 100, the substrate assembly 100 (S120). ≪ / RTI >

The first coating layer 120 and the second coating layer 140 are coated on the transfer substrate 110 and the flexible substrate 130, respectively. However, the alignment of the flexible substrate 130 is facilitated, the adhesion between the transfer substrate 110 and the flexible substrate 130 is firmly maintained, and the removal of the transfer substrate 110 from the substrate assembly 100 is facilitated. The first coating layer 120 and the second coating layer 140 may be patterned.

FIG. 5A is a plan view showing a pattern of a first coating layer formed on a transfer substrate according to another embodiment of the present invention, FIG. 5B is a plan view showing a pattern of a second coating layer formed on a flexible substrate according to another embodiment of the present invention, to be.

According to another embodiment of the present invention, as shown in FIG. 5A, the first coating layer 120 is formed to have a pattern in which the first material is arranged in the first direction. That is, in step S100 of forming the first coating layer 120 on one side of the transfer substrate 110, a first material is coated on one side of the transfer substrate 110, The material is patterned to form a first coating layer 120.

The second coating layer 140 is formed to have a pattern in which the second material is arranged in a second direction perpendicular to the first direction, as shown in FIG. 5B. That is, in the step S110 of forming the second coating layer 140 on the back surface of the flexible substrate 130, the second material is coated on the back surface of the flexible substrate 130, The material is patterned to form a second coating layer 140.

5A and 5B illustrate patterns of the first coating layer 120 and the second coating layer 140 according to another embodiment of the present invention, and the alignment of the flexible substrate 130 is facilitated Any of the patterns that can firmly hold the transfer substrate 110 and the flexible substrate 130 in contact with each other and facilitate the removal of the transfer substrate 110 from the substrate assembly 100 may be used. Can be applied to the example.

As described above, the substrate assembly 100 according to the embodiment of the present invention uses the magnetic force between the first coating layer 120 and the second coating layer 140 in place of the adhesive force of the adhesive layer, Since the adhesion of the transfer substrate 110 and the flexible substrate 130 is facilitated and the stress applied to the transfer substrate 110 is reduced by increasing the number of times the transfer substrate 110 is reused, The manufacturing cost can be reduced.

The flexible substrate 130 is aligned on the transfer substrate 110 so as to be flatly spread while the magnetic force between the first coating layer 120 and the second coating layer 140 is weakened and the first coating layer The shape of the substrate assembly 100 can be prevented from being deformed by strengthening the magnetic force between the transfer substrate 110 and the flexible substrate 130 by strengthening the magnetic force between the first substrate layer 120 and the second coating layer 140, Since the flexible substrate 130 of the display panel 100 can maintain a flat state, the reliability of the process of forming the laminate of the display panel becomes high, and the manufacturing yield can be improved.

The present invention described above is not limited to the above-described embodiment and the accompanying drawings, and various substitutions, modifications, and changes may be made without departing from the technical spirit of the present invention.

1 is a cross-sectional view of a conventional substrate assembly.

2 is a cross-sectional view of a substrate assembly according to an embodiment of the present invention.

3 is a flowchart illustrating a method of manufacturing a flexible display device using the substrate assembly shown in FIG.

4A to 4E are cross-sectional views schematically showing a manufacturing method of the soft display device shown in FIG.

5A is a plan view showing a pattern of a first coating layer formed on a transfer substrate according to an embodiment of the present invention.

5B is a plan view showing a pattern of a second coating layer formed on a flexible substrate according to an embodiment of the present invention.

≪ Description of Identification Numbers for Main Parts of the Drawings >

100: substrate assembly 110: transfer substrate

120: first coating layer 130: flexible substrate

140: Second coating layer 200: Laminate of display panel

Claims (13)

A transporting substrate provided flat; A first coating layer disposed on one surface of the transfer substrate and made of a first magnetic material; A flexible substrate facing the transfer substrate and having flexibility; And And a second coating layer disposed on a back surface of the flexible substrate and made of a ferromagnetic second material facing the first coating layer and magnetized by external magnetic energy, Wherein the first and second coating layers are mutually adhered to each other by a magnetic force generated by the first and second materials. The method according to claim 1, The first coating layer may be formed by coating a first material corresponding to a neodymium-based metal or a neodymium-based alloy on a surface of the transfer substrate in a thin film form, Wherein the second coating layer is formed by coating a second material corresponding to an alloy including a transition metal or a transition metal on the rear surface of the flexible substrate in a thin film form. 3. The method of claim 2, Wherein the first coating layer has a pattern arranged in a first direction, Wherein the second coating layer has a pattern arranged in a second direction perpendicular to the first direction. 3. The method of claim 2, Wherein the transfer substrate is made of glass, Wherein the flexible substrate is made of plastic or metal in the form of a film. Forming a first coating layer by coating a magnetic first material on one surface of a transport substrate provided flat; Forming a second coating layer facing the first coating layer by coating a second ferromagnetic material that is magnetized by external magnetic energy on the back surface of the flexible substrate to be softened; Cementing the first and second coating layers with magnetic force by the first and second materials to produce a substrate assembly; Forming a stack of display panels on an upper surface of the flexible substrate of the substrate assembly; And And removing the transfer substrate from the substrate assembly on which the stack of the display panel is formed. 6. The method of claim 5, The step of creating a substrate assembly Aligning the flexible substrate to spread flat on the transfer substrate with the first coating layer and the second coating layer interposed therebetween by the magnetism of the first coating layer; And The aligned soft substrate and the transferred substrate are placed in an electric field in the same direction as the magnetism of the first coating layer so that magnetic force between the first coating layer and the second coating layer strengthened by the electric force in the electric field, And bonding the transfer substrate and the flexible substrate to each other. The method according to claim 6, Before aligning the flexible substrate on the transfer substrate, Further comprising the step of heating the first coating layer formed on the transfer substrate so that the magnetic properties of the first coating layer are weakened. The method according to claim 6, The step of removing the transfer substrate from the substrate assembly Heating the substrate assembly such that the magnetic properties of each of the first and second coating layers are weakened; And And separating the first coating layer and the second coating layer using the magnetic properties of the weakened first coating layer and the second coating layer, respectively. 9. The method of claim 8, Further comprising the step of aligning the flexible substrate on which the second coating layer is formed on the transfer substrate on which the first coating layer is formed, by removing the substrate from the substrate assembly. The method according to claim 6, Wherein the forming of the first coating layer includes patterning the first material so that the first material is arranged in the first direction. 11. The method of claim 10, Wherein the forming of the second coating layer includes patterning the second material so that the second material is arranged in a second direction perpendicular to the first direction. The method according to claim 6, Wherein the first material is a neodymium-based metal or a neodymium-based alloy having a Curie temperature of 150 ° C or more, Wherein the second material is an alloy including a transition metal or a transition metal. The method according to claim 6, Wherein the electric field is formed in the same direction as the magnetism of the first material.

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