JP2024018423A - semiconductor laser equipment - Google Patents

Abstract

To provide a semiconductor laser device capable of suitably suppressing occurrence of warpage in a semiconductor laser element and accurately aligning a plurality of luminous points.SOLUTION: A semiconductor laser device 1A comprises a semiconductor laser element 10 including a plurality of mesa parts 12, and a submount 20 including a plurality of recesses 22 in which the plurality of mesa parts 12 is arranged. An electrode 35 corresponding to each of the plurality of mesa parts 12 is electrically connected to a wiring part W via a solder member 33. A reference surface R1 of the semiconductor laser element 10 has surface contact with a reference surface R2 of the submount 20. A partition wall part 23 including the reference surface R2 is provided between recesses 22 adjacent to each other. When viewed from a Y axis direction, a distance d4 in an X-axis direction between a side surface 22b of the recess 22 and a side surface 12c of the mesa part 12 facing the side surface 22b becomes shorter as the side surface 22b heads to a base end part P from a top face 12b along a Z-axis direction.SELECTED DRAWING: Figure 9

Description

The present disclosure relates to a semiconductor laser device.

2. Description of the Related Art Conventionally, edge-emitting semiconductor laser devices have been known. For example, in Patent Document 1, the back surface of a semiconductor laser element having a plurality of light emitting points, which is opposite to the front surface (the surface on which the active layer forming the light emitting points is provided), is mounted on a mounting member using a junction-up method. A configuration is disclosed. Furthermore, conventionally, as a mounting method other than the junction-up method, a junction-down method is also known in which the surface of a semiconductor laser element is mounted on a mount member.

Japanese Patent Application Publication No. 2019-125614

However, in the conventional mounting method as described above, when the front or back surface of the semiconductor laser element is mounted on the mount member via the solder member, for example, by reflow soldering, the thickness of the solder member is not uniform; There was a problem in that the height positions of the plurality of light emitting points varied.

Furthermore, when the number of light emitting points is increased, the semiconductor laser element (substrate) becomes horizontally elongated in the direction in which the plurality of light emitting points are arranged, which may cause warpage of the semiconductor laser element.

Accordingly, one aspect of the present disclosure aims to provide a semiconductor laser device that can accurately align a plurality of light emitting points while suitably suppressing the occurrence of warpage of a semiconductor laser element.

The present disclosure includes the following semiconductor laser devices [1] to [19].

[1]
A substrate having a first surface and a second surface located opposite to each other in a first direction, and a light emitting end surface that intersects in a second direction perpendicular to the first direction, and a first surface formed on the second surface. a semiconductor laser element having a plurality of mesa portions formed to protrude in a first direction with respect to a reference plane and extend in a second direction;
a mount member having a third surface forming a second reference surface opposite to the first reference surface; and a plurality of recesses formed on the third surface in which a plurality of mesa portions are disposed;
Equipped with
The mesa portion has a top surface facing the bottom surface of the recess, and a pair of side surfaces located on opposite sides in a third direction orthogonal to the first direction and the second direction,
A first electrode electrically connected to the mesa portion is provided on the top surface of the mesa portion,
Wiring portions are provided in the plurality of recesses at positions corresponding to each of the plurality of mesa portions,
The first electrode corresponding to each of the plurality of mesa portions is electrically connected to the wiring portion via a solder member,
The first reference surface is in surface contact with the second reference surface,
A partition wall portion extending in the second direction, having a predetermined length in the third direction, and having a second reference surface is provided between the mutually adjacent recessed portions,
The recess has a first side surface facing the side surface of the mesa portion in the third direction,
When viewed from the second direction, the distance in the third direction between the first side surface and the side surface of the mesa section opposite to the first side surface is the distance between the side surface of the mesa section and the first reference plane from the top surface along the first direction. It becomes shorter towards the proximal end, which is the boundary between the
Semiconductor laser equipment.

In the semiconductor laser device described above, the first reference surface of the semiconductor laser element is in surface contact with the second reference surface of the mount member. Thereby, the positions of the plurality of light emitting points (for example, the center of the light emitting end surface in the first direction) with respect to the second reference plane of the mount member can be aligned with high precision. In addition, in the semiconductor laser device described above, since the contact area between the first reference surface and the second reference surface can be increased in the partition section provided between the adjacent recesses, the contact area between the first reference surface and the second reference surface can be increased. Stress can be reduced and the occurrence of warpage of the semiconductor laser element can be suppressed. Here, from the viewpoint of suppressing the occurrence of warpage of the semiconductor laser element, it is preferable to make the contact surface between the first reference surface and the second reference surface as large as possible. To this end, it is preferable to make the distance in the third direction between the boundary between the first side surface of the recess and the second reference surface and the base end of the mesa section facing the first side surface as short as possible. However, when the distance between the boundary and the base end is shortened in this way, the first side of the recess and the side of the mesa (the side opposite to the first side) tend to come into contact, resulting in damage to the mesa. The risk is higher. Therefore, the semiconductor laser device is configured such that the distance in the third direction between the first side surface of the recess and the side surface of the mesa portion becomes shorter from the top surface toward the base end along the first direction. . According to the above configuration, the distance between the boundary portion and the base end portion can be made as short as possible while reducing the risk of contact between the first side surface of the recess and the side surface of the mesa portion. As a result, the contact surface between the first reference surface and the second reference surface can be made as large as possible while suppressing damage to the semiconductor laser element. Therefore, according to the semiconductor laser device described above, it is possible to suitably suppress the occurrence of warpage of the semiconductor laser element and to precisely align the plurality of light emitting points.

[2]
Each of the plurality of mesa portions is individually arranged in the plurality of recesses,
[1] Semiconductor laser device.
According to the above configuration, it is possible to increase the contact area between the first reference surface and the second reference surface in the plurality of partitions provided between the respective recesses, thereby reducing the stress applied to the semiconductor laser element (mainly the substrate). This can be further reduced, and the occurrence of warpage in the semiconductor laser element can be effectively suppressed.

[3]
The semiconductor laser device has a plurality of channels each including one or more mesa portions and configured to be able to be driven independently of each other.
The semiconductor laser device of [1] or [2].
According to the above configuration, it is possible to obtain a multi-channel semiconductor laser device in which the positions of the light emitting points are aligned with high precision between each channel.

[4]
The wiring part includes a plurality of wirings arranged at positions corresponding to each of the plurality of mesa parts and electrically isolated from each other.
The semiconductor laser device according to any one of [1] to [3].
According to the above configuration, by separating any two adjacent mesa portions by the partition wall provided between the recesses, a plurality of mesa portions can be driven independently while preventing short circuit between each channel. It becomes possible to do so.

[5]
A single second electrode common to the plurality of mesa portions is provided on the first surface.
The semiconductor laser device according to any one of [1] to [4].
According to the above configuration, by making the electrode member (second electrode) arranged on the back surface (first surface) side of the substrate of the semiconductor laser element common among the plurality of mesa parts, the electrode member can be connected to the electrode member by wire bonding. Since the number of connected wires can be reduced, damage to the semiconductor laser element due to wire bonding can be suppressed.

[6]
The recess has a first side surface facing the side surface of the mesa portion in the third direction,
The first side surface is inclined with respect to the bottom surface such that the opening width of the recess in the third surface along the third direction is larger than the width of the bottom surface of the recess along the third direction.
The semiconductor laser device according to any one of [1] to [5].
According to the above configuration, by configuring the first side surface of the recess as an inclined surface that becomes wider from the bottom side toward the opening end side, a space for escaping melted solder material during reflow can be appropriately created within the recess. can be secured.

[7]
The angle of inclination of the side surface of the mesa portion with respect to the first reference plane is smaller than the angle of inclination of the first side surface with respect to the bottom surface.
[6] Semiconductor laser device.
According to the above configuration, it is possible to easily and reliably realize a configuration in which the distance in the third direction between the first side surface of the recess and the side surface of the mesa portion becomes shorter from the top surface of the recess toward the base end.

[8]
The angle between the second reference plane and the first side surface of the recess is an obtuse angle.
The semiconductor laser device according to any one of [1] to [7].
According to the above configuration, even if the side surface of the mesa portion comes into contact with the intersection of the second reference surface and the first side surface when mounting the semiconductor laser element on the mount member, the second reference surface and the first side surface may The impact on the side surface of the mesa portion can be reduced compared to the case where the angle formed by one side surface is 90 degrees or less. Therefore, according to the above configuration, the risk of damage to the semiconductor laser element during mounting can be reduced.

[9]
The boundary between the second reference plane and the first side surface of the recess is spaced apart from the base end in the third direction.
The semiconductor laser device according to any one of [1] to [8].
According to the above configuration, since the semiconductor laser element is mounted on the mount member so that the boundary part and the base end part do not come into contact with each other, the risk of the side surface of the mesa part coming into contact with the boundary part during mounting is reduced, and the semiconductor laser element Damage to the element can be suitably prevented.

[10]
The wiring portion extends from the inside of the recess to the third surface outside the recess.
The semiconductor laser device according to any one of [1] to [9].
According to the above configuration, since the electrode on the mesa side of the semiconductor laser element can be drawn out to the surface (third surface) of the mount member via the first electrode and the wiring part, It is easier to implement the configuration.

[11]
The wiring portion extends along the second direction from the inside of the recess to the outside of the recess,
The recess has a second side surface that intersects in the second direction and along which the wiring portion runs;
The second side surface is inclined with respect to the bottom surface such that the opening width of the recess in the third surface along the second direction is larger than the width of the bottom surface of the recess along the second direction.
The semiconductor laser device of [10].
If the second side surface is not sloped as described above (for example, if the second side surface is perpendicular to the bottom surface of the recess), the wiring part will be bent in a step shape, making it easy to break the wire. Become. On the other hand, by configuring the second side surface as an inclined surface as described above and placing the wiring section along the inclined second side surface, it is possible to avoid bending the wiring section into a stepped shape and suppress the occurrence of wire breakage. can.

[12]
Each of the plurality of mesa portions has one or more active layers provided independently for each mesa portion,
The semiconductor laser device according to any one of [1] to [11].
According to the above configuration, since the active layer is spatially separated between the plurality of mesa parts, it is possible to reliably prevent optical crosstalk between the mesa parts. Further, when each mesa portion is provided with a plurality of active layers, each mesa portion can function as a stacked semiconductor laser element, and the laser output can be increased.

[13]
The mount member is made of silicon.
The semiconductor laser device according to any one of [1] to [12].
According to the above configuration, the recess can be formed with high precision, for example, by an etching process.

[14]
The mount member has a fourth surface connected to the third surface and intersecting the second direction,
The recess extends to the fourth surface and is open to the fourth surface.
The semiconductor laser device according to any one of [1] to [13].
According to the above configuration, the light emitting end face of each mesa portion arranged in the recess can be exposed to the outside from the portion of the recess that is open to the fourth surface. The efficiency of extracting emitted light can be improved.

[15]
The third surface is provided with an alignment mark for aligning the semiconductor laser element with respect to the mount member.
The semiconductor laser device according to any one of [1] to [14].
According to the above configuration, when mounting the semiconductor laser element on the mount member, it is possible to easily and accurately align the semiconductor laser element with respect to the mount member.

[16]
an optical element that is disposed at a position facing the semiconductor laser element and the mount member in a second direction and guides light emitted from the light emitting end face of each of the plurality of mesa parts toward the outside;
a support substrate that supports the mount member and the optical element;
further comprising;
The support substrate includes a first support surface that supports the mount member in surface contact with a sixth surface opposite to the third surface of the mount member, and a second support surface that supports the optical element in surface contact with the optical element. and has
The semiconductor laser device according to any one of [1] to [15].
According to the above configuration, the mount member on which the semiconductor laser element is mounted and the optical element are supported in surface contact with the first support surface and the second support surface of the support substrate. The height positions (that is, the height positions of each member with respect to the support surface (first support surface and second support surface) of the support substrate) can be easily and accurately matched.

[17]
The optical element has a light incident surface into which light emitted from each of the plurality of mesa portions is incident,
The mount member has a fourth surface facing the light incident surface,
The light incident surface is in surface contact with the fourth surface.
The semiconductor laser device of [16].
According to the above configuration, by bringing the fourth surface of the mount member facing each other in the second direction into surface contact with the light incident surface of the optical element, the distance between the light output end surface and the light incident surface in the second direction can be accurately adjusted. Can be adjusted well. That is, when mounting the semiconductor laser element on the mount member, by adjusting the distance from the light emitting end surface to the fourth surface in the second direction, the distance from the light emitting end surface to the light incident surface can be adjusted. .

[18]
The length of the recess in the second direction is longer than the length of the semiconductor laser element in the second direction.
The semiconductor laser device according to any one of [1] to [17].
According to the above configuration, it is possible to release the solder material melted during reflow into a space in the recess that does not overlap with the semiconductor laser element (mesa part) in the second direction. Furthermore, when the optical element is a lens, the position of the semiconductor laser element in the second direction relative to the mount member can be adjusted depending on the focal length of the lens.

[19]
Further comprising a mold resin formed to cover the optical element, the mounting member, and the semiconductor laser element on the support substrate.
The semiconductor laser device according to any one of [15] to [18].
According to the above configuration, the positional relationship of each member (optical element, mount member, and semiconductor laser element) arranged on the support substrate can be fixed by the molded resin, so that deviations in the positional relationship of each member can be prevented. This can be prevented from occurring. Moreover, each member can be appropriately protected by the mold resin.

According to one aspect of the present disclosure, it is possible to provide a semiconductor laser device that can accurately align a plurality of light emitting points while suitably suppressing the occurrence of warpage of a semiconductor laser element.

FIG. 1 is a perspective view showing a semiconductor laser device according to a first embodiment. FIG. 2 is a perspective view of the semiconductor laser element of the semiconductor laser device of FIG. 1 viewed from the side where the mesa portion is provided. FIG. 3 is a sectional view taken along line III-III in FIG. 2. FIG. 4 is a perspective view showing a submount in the semiconductor laser device of FIG. 1 before a semiconductor laser element is mounted thereon. FIG. 5 is an enlarged view of area A in FIG. FIG. 6A is a cross-sectional view taken along line VIa-VIa in FIG. FIG. 6B is a cross-sectional view taken along line VIb-VIb in FIG. FIG. 7 is a diagram showing a mounting process of a semiconductor laser element on a submount. FIG. 8 is a plan view showing a semiconductor laser element mounted on a submount. FIG. 9 is a side view of a portion including two mesa portions adjacent to each other. FIG. 10 is a side view showing a modified example of the recess. FIG. 11 is a partial side view showing another modification of the recess. FIG. 12 is a perspective view showing the semiconductor laser device of the second embodiment. FIG. 13 is a side view showing the semiconductor laser device of FIG. 12. FIG. 14 is a perspective view showing a semiconductor laser device according to the third embodiment. FIG. 15 is a side view showing the semiconductor laser device of FIG. 14.

Hereinafter, one embodiment of the present disclosure will be described in detail with reference to the drawings. In the following description, the same or equivalent elements will be denoted by the same reference numerals, and overlapping description will be omitted.

[First embodiment]
A semiconductor laser device 1A of the first embodiment will be described with reference to FIGS. 1 to 9. As shown in FIG. 1, the semiconductor laser device 1A includes a semiconductor laser element 10 and a submount 20 (mount member). The semiconductor laser device 10 is mounted on a submount 20 using a junction down method. That is, the semiconductor laser element 10 is mounted on the submount 20 such that the surface (lower surface 11b) on the side where the active layer 13 (see FIG. 3) is provided faces the submount 20.

In this embodiment, the side on which the semiconductor laser device 10 is mounted on the submount 20 is defined as the upper side, and the side from which the laser beam L directed to the outside is emitted from the semiconductor laser device 10 is defined as the front side. Further, based on the above definition, the up-down direction is expressed as the Z-axis direction (first direction), the front-rear direction is expressed as the Y-axis direction (second direction), and the left-right direction is expressed as the X-axis direction (third direction). The Z-axis direction coincides with the direction in which the semiconductor laser element 10 and the submount 20 face each other. The Y-axis direction is a direction perpendicular to the Z-axis direction, and coincides with the direction in which each of the plurality of mesa portions 12 of the semiconductor laser element 10 extends (that is, the laser emission direction). The X-axis direction is a direction perpendicular to both the Z-axis direction and the Y-axis direction, and coincides with the direction in which the plurality of mesa portions 12 are arranged.

The semiconductor laser device 10 is an edge-emitting type semiconductor laser device. The semiconductor laser device 10 includes a substrate 11 and a plurality of (eight in this embodiment) mesa portions 12. The semiconductor laser device 10 may be of a single channel type having only a single channel, or may be of a multichannel type having a plurality of channels. Here, a "channel" is a unit that emits light simultaneously. In other words, channels are independently drivable units. One channel is composed of one or more mesa portions 12. For example, when two or more mesa portions 12 are electrically connected, one channel is configured by the two or more mesa portions 12. In this embodiment, as an example, since each of the plurality of mesa parts 12 is electrically isolated from each other, the mesa part 12 and the channel have a "1:1" relationship. That is, in this embodiment, the semiconductor laser device 10 is configured as a multi-channel (8 channel) type semiconductor laser device, and the number of mesa portions 12 (eight) matches the number of channels.

The substrate 11 is, for example, a semiconductor substrate such as a compound semiconductor substrate. The substrate 11 is formed into a rectangular plate shape (cuboid shape). As shown in FIGS. 1 and 2, the substrate 11 has an upper surface 11a (first surface) and a lower surface 11b (second surface) located on opposite sides in the Z-axis direction, and on opposite sides in the Y-axis direction. It has a front surface 11c and a rear surface 11d, and side surfaces 11e and 11f (fifth surfaces) located on opposite sides in the X-axis direction.

An electrode 32 (second electrode), which is a cathode electrode, is provided on the upper surface 11a of the substrate 11. As an example, the electrode 32 is configured as a single electrode common to the plurality of mesa parts 12. That is, the electrode 32 is provided on substantially the entire surface of the upper surface 11a so as to overlap with the plurality of mesa portions 12 in the Z-axis direction. The electrode 32 may be formed of a metal material such as AuGe, Ni, or Au. A wire for electrical connection to a power supply circuit (not shown) may be connected to the upper surface of the electrode 32 by wire bonding or the like.

The plurality of mesa portions 12 each have a light emitting end surface 12a that independently emits the laser beam L. As shown in FIG. 2, a plurality of (eight in this embodiment) mesa portions 12 are arranged at approximately equal intervals along the X-axis direction. The light emitting end surface 12a of each mesa portion 12 intersects with the Y-axis direction, and emits the laser beam L along the Y-axis direction. Note that the light emitting end face 12a is provided on both sides (front side and rear side) of each mesa portion 12 in the Y-axis direction, but in this embodiment, the front light emitting end face 12a directs the laser beam toward the outside. It functions as a light emitting end face that emits L. Therefore, a reflective film or the like may be provided on the rear light emitting end surface 12a in order to prevent the laser beam L from being emitted rearward. On the other hand, a low reflection film may be provided on the front light emitting end surface 12a in order to increase the efficiency of light extraction to the outside.

As shown in FIG. 2, each mesa portion 12 is formed to protrude in the Z-axis direction with respect to a reference surface R1 (first reference surface) formed on the lower surface 11b of the substrate 11. Further, each mesa portion 12 is formed to extend in the Y-axis direction. The reference surface R1 is a surface that is directly supported by the submount 20 by coming into surface contact with the reference surface R2 (second reference surface) of the submount 20. As an example, the insulating layer 19 is continuously formed with a predetermined thickness over the entire lower surface 11b (including the surface of the mesa portion 12). In this case, the surface 19a of the insulating layer 19 on the side opposite to the side facing the substrate 11 functions as the reference surface R1.

Each mesa portion 12 has a top surface 12b and a pair of side surfaces 12c. The top surface 12b is a surface facing the recess 21 (see FIG. 4) of the submount 20. In other words, the top surface 12b is a surface facing the opposite side of the mesa portion 12 from the side where the substrate 11 is located. As an example, the top surface 12b is formed by a portion of the surface 19a of the insulating layer 19 that covers a surface 18a of the contact layer 18, which will be described later. The pair of side surfaces 12c are surfaces located on opposite sides of each other in the X-axis direction. The side surface 12c is a surface connecting the top surface 12b and the reference surface R1. The pair of side surfaces 12c are inclined with respect to the top surface 12b and the reference surface R1 such that the distance between the pair of side surfaces 12c in the X-axis direction becomes wider from the top surface 12b toward the reference surface R1. That is, each mesa portion 12 is formed into a trapezoidal shape when viewed from the Y-axis direction.

An electrode 35 (first electrode) that is an anode electrode electrically connected to each mesa portion 12 is provided on the top surface 12b of each mesa portion 12. That is, the electrode 35 is provided for each mesa portion 12. The electrode 35 may be formed of a metal material such as Ti, Pt, or Au. As shown in FIG. 2, as an example, the electrode 35 covers most of the top surface 12b of the mesa portion 12 (excluding both side edges of the top surface 12b in the Y-axis direction), and extends in the Y-axis direction. It is arranged to extend.

As shown in FIG. 3, the mesa portion 12 has a laminated structure formed on the lower surface 11b of the substrate 11. As an example, the mesa portion 12 includes four first laminated structures L1, three second laminated structures L2, and a contact layer 18. More specifically, the first laminated structure L1 at the bottom (the side closest to the substrate 11) is laminated on the lower surface 11b of the substrate 11. Thereon, three first laminated structures L1 and three second laminated structures L2 are formed so that a repeating structure in which one second laminated structure L2 is sandwiched between two first laminated structures L1 is formed. are laminated. A contact layer 18 is laminated on the first laminated structure L1 at the top (the side farthest from the substrate 11).

The first stacked structure L1 includes an active layer 13, a first semiconductor layer 14, and a second semiconductor layer 15. The layers constituting the first stacked structure L1 are stacked in the order of the first semiconductor layer 14, the active layer 13, and the second semiconductor layer 15 from the bottom surface 11b side. The active layer 13 is, for example, a layer including a quantum well structure in which quantum well layers and barrier layers are alternately stacked in the Z-axis direction, and is a layer that generates laser light L. The active layer 13 has, for example, a structure in which a plurality of InGaAs layers and InAlAs layers are alternately stacked along the stacking direction (Z-axis direction). The first semiconductor layer 14 may be formed of, for example, an n-type AlGaAs layer. The second semiconductor layer 15 may be formed of, for example, a p-type AlGaAs layer.

The second stacked structure L2 is a so-called tunnel junction, and includes a first tunnel junction layer 16 and a second tunnel junction layer 17. The first tunnel junction layer 16 is located closer to the lower surface 11b than the second tunnel junction layer 17 is. The first tunnel junction layer 16 may be formed, for example, by a heavily doped GaAs layer with p-type dopants. The second tunnel junction layer 17 may be formed, for example, by a heavily doped GaAs layer with n-type dopants.

The contact layer 18 may be formed, for example, by a heavily doped GaAs layer with p-type dopants. The contact layer 18 is a layer that comes into contact with the electrode 35 described above. An opening 19b for exposing at least a portion of the surface 18a is provided in the insulating layer 19 covering the surface 18a of the contact layer 18 on the side opposite to the side facing the substrate 11. As shown in FIGS. 2 and 3, the opening 19b is provided at the center of the top surface 12b in the X-axis direction in a portion where the electrode 35 and the contact layer 18 overlap. When viewed from the Z-axis direction, the opening 19b is formed in a rectangular shape extending in the Y-axis direction. In this embodiment, the depressed portion of the electrode 35 in FIG. 2 corresponds to the portion where the opening 19b is formed. In the opening 19b, the electrode 35 enters into the contact layer 18 side, so that the surface of the electrode 35 is depressed. A region of the surface 18a of the contact layer 18 that overlaps with the opening 19b in the Z-axis direction (that is, a region exposed to the outside) functions as a contact region CA that contacts the electrode 35. In this embodiment, since the insulating layer 19 covers both edges of the surface 18a of the contact layer 18 in the X-axis direction, the length d1 of the contact area CA in the X-axis direction is equal to the length d1 of the top surface 12b in the X-axis direction. It is shorter than its length.

The submount 20 is, for example, a silicon substrate made of silicon. A circuit for driving the semiconductor laser element 10 may be built inside the submount 20. As shown in FIG. 4, the submount 20 is formed into a rectangular plate shape (cuboid shape). The submount 20 has an upper surface 20a (third surface) and a lower surface 20b (sixth surface) located opposite to each other in the Z-axis direction, and a front surface 20c (fourth surface) located opposite to each other in the Y-axis direction. It has a rear surface 20d and side surfaces 20e and 20f located on opposite sides in the X-axis direction. The upper surface 20a is a surface facing the reference surface R1 of the semiconductor laser element 10, and forms a reference surface R2 that is in surface contact with the reference surface R1. In this embodiment, the reference surface R1 of the semiconductor laser element 10 is formed by the surface 19a of the insulating layer 19 provided on the lower surface 11b of the substrate 11, whereas the reference surface R2 of the submount 20 is formed by the surface 19a of the insulating layer 19 provided on the lower surface 11b of the substrate 11. It is formed by the surface (upper surface 20a) of the mount 20 itself.

The submount 20 has a recess 21 formed in an upper surface 20a. The recessed portion 21 is a portion formed to be depressed toward the lower surface 20b than other portions of the upper surface 20a in order to arrange (accommodate) the plurality of mesa portions 12 provided in the semiconductor laser element 10. The recess 21 may be formed, for example, by wet etching. As an example, the recess 21 is configured by a plurality of (eight in this embodiment) recesses 22 that accommodate each of the plurality of mesa parts 12 individually. That is, in this embodiment, the upper surface 20a is provided with a plurality of recesses 22 arranged in the X-axis direction so as to correspond to each of the plurality of mesa parts 12. The length of each recess 22 in the Y-axis direction is longer than the length of the substrate 11 in the Y-axis direction. A partition 23 is provided between the recesses 22 adjacent to each other. The partition wall portion 23 extends in the Y-axis direction, has a predetermined length in the X-axis direction (that is, a width of a certain value or more), and has a reference surface R2. That is, the adjacent recesses 22 are arranged at a certain distance or more in the X-axis direction, and the portion corresponding to this distance (that is, the portion where the recess 22 is not formed) functions as the partition wall portion 23. do.

As shown in FIGS. 4, 5, and 6, the recess 22 is formed in a groove shape extending in the Y-axis direction. The recess 22 extends to the front surface 20c and is open to the front surface 20c. The recess 22 has a bottom surface 22a that intersects in the Z-axis direction, a pair of side surfaces 22b (first side surfaces) that intersect in the X-axis direction, and side surfaces 22c (second side surfaces) that intersect in the Y-axis direction. There is. Note that FIGS. 4, 5, and 6 show the state before the semiconductor laser element 10 is mounted on the submount 20.

The pair of side surfaces 22b are surfaces that face the side surfaces 12c of the mesa portion 12 in the X-axis direction when the semiconductor laser element 10 is mounted on the submount 20. The side surface 22b is inclined with respect to the bottom surface 22a such that the opening width of the recess 22 along the X-axis direction on the upper surface 20a is larger than the width of the bottom surface 22a of the recess 22 along the X-axis direction. That is, as shown in FIG. 6A, the inclination angle θ1 of the side surface 22b with respect to the bottom surface 22a is an acute angle. On the other hand, the angle θ2 formed between the upper surface 20a (reference surface R2) and the side surface 22b is an obtuse angle. As an example, the side surface 22b is formed into a planar shape by forming the recess 22 by wet etching. In this case, the inclination angle θ1 and the angle θ2 have a relationship of “θ1+θ2=180°”.

The side surface 22c is a surface formed at the rear of the recess 22. The side surface 22c is inclined with respect to the bottom surface 22a such that the opening width of the recess 22 in the upper surface 20a along the Y-axis direction is larger than the width of the bottom surface 22a of the recess 22 along the Y-axis direction. That is, as shown in FIG. 6(B), the inclination angle θ3 of the side surface 22c with respect to the bottom surface 22a is an acute angle. As an example, since the recess 22 is formed by wet etching, the inclination angle θ3 substantially matches the inclination angle θ1.

A wiring portion W is provided in the recess 21 at a position corresponding to each of the plurality of mesa portions 12 . As an example, the wiring portion W includes a plurality of wirings 31 arranged at positions corresponding to each of the plurality of mesa portions 12. The wiring 31 may be formed of a metal material such as Au. In this embodiment, since an independent recess 22 is formed for each mesa portion 12, an individual wiring 31 is provided for each recess 22, as shown in FIG. In each recess 22, the wiring 31 extends in the Y-axis direction along the bottom surface 22a. As shown in FIGS. 4 and 5, the wiring 31 extends from inside the recess 22 to above the upper surface 20a outside the recess 22. As shown in FIGS. As an example, each wiring 31 extends to an electrode pad 34 provided independently on the upper surface 20a. That is, the plurality of wirings 31 are electrically isolated from each other. This allows current to flow independently into each of the plurality of mesa portions 12 (that is, to drive each mesa portion 12 independently). As shown in FIGS. 5 and 6B, the wiring 31 is along the bottom surface 22a and the side surface 22c. That is, the side surface 22c plays the role of guiding the wiring 31 from the inside of the recess 22 to the outside of the recess 22. Note that a wire for electrical connection to a power supply circuit (not shown) may be connected to each electrode pad 34 by wire bonding or the like.

As shown in FIGS. 5 and 6A, a solder member 33 is provided on the wiring 31 in each recess 22 by vapor deposition or the like. The solder member 33 may be formed of a material suitable for reflow soldering, such as Sn, Ag, or Cu.

Referring to FIG. 7, the process of mounting the semiconductor laser element 10 onto the submount 20 will be described. First, as shown in S1 of FIG. 7, the solder member 33 is placed on the wiring 31 in each recess 22. Subsequently, as shown in S2 of FIG. 7, the positions of the respective mesa portions 12 of the semiconductor laser device 10 and the positions of the recesses 22 are aligned, and the semiconductor laser device is aligned so that the reference surface R1 faces the reference surface R2. 10 is placed on the submount 20. That is, the electrode 35 provided on the top surface 12b of each mesa portion 12 is brought into contact with the upper surface of the solder member 33 placed in each recess 22. Subsequently, the semiconductor laser element 10 and the submount 20 in the state shown in S2 of FIG. 7 are heated in a reflow oven, so that the solder member 33 is melted and the semiconductor laser element 10 is attracted to the submount 20. Specifically, the solder member 33 melts and the thickness of the solder member 33 in the Z-axis direction decreases, so that the semiconductor The laser element 10 moves toward the submount 20 side. As a result, as shown in S3 of FIG. 7, each of the plurality of mesa portions 12 is housed in the recess 22, and the reference surface R1 and the reference surface R2 are brought into surface contact. Further, the electrodes 35 corresponding to each of the plurality of mesa portions 12 are electrically connected to the corresponding wirings 31 via the solder members 33.

As shown in FIG. 8, an alignment mark M is provided on the upper surface 20a of the submount 20 for aligning the semiconductor laser element 10 with respect to the submount 20 in the mounting process shown in FIG. As an example, the alignment mark M has a cross shape in plan view. The alignment marks M are arranged on both sides of the semiconductor laser element 10 in the X-axis direction in the mounted state. As shown in FIG. 8, by aligning the inner end of each alignment mark M in the X-axis direction along the side surfaces 11e and 11f, it is possible to align the semiconductor laser element 10 with respect to the submount 20 in the X-axis direction. It is possible. Further, as an example, marks (recesses 32a) corresponding to the alignment marks M are provided at both end portions of the electrode 32 in the X-axis direction. The semiconductor laser element 10 is aligned with respect to the submount 20 in the Y-axis direction by aligning so that the portion M1 of the alignment mark M that extends inward in the X-axis direction overlaps the recess 32a in the Y-axis direction. is possible. Note that in this embodiment, due to such alignment, the semiconductor laser device 10 is arranged with respect to the submount 20 such that the front surface 11c of the semiconductor laser device 10 and the front surface 20c of the submount 20 are substantially flush with each other. Therefore, the position of the semiconductor laser element 10 relative to the submount 20 in the Y-axis direction can also be determined by aligning the front surface 11c and the front surface 20c. However, for example, when the semiconductor laser element 10 is arranged so that the front surface 11c of the substrate 11 is located in front or behind the front surface 20c of the submount 20, the above-mentioned portion M1 and the recess 32a may be used as a mark. Accordingly, the position of the semiconductor laser element 10 in the Y-axis direction can be appropriately determined.

With reference to FIG. 9, the positional relationship of each mesa portion 12 in the mounted state will be described. FIG. 9 is a side view of a portion including two mesa portions 12 adjacent to each other in the X-axis direction among a plurality of (eight in this embodiment) mesa portions 12, as viewed from the Y-axis direction (front). Here, of the two mesa portions 12, the left mesa portion 12 when viewed from the front is referred to as a first mesa portion 12A, and the right mesa portion 12 is referred to as a second mesa portion 12B.

The first wiring 31A, which is the wiring 31 placed in the recess 22 in which the first mesa portion 12A is accommodated, is electrically connected to the second wiring 31B, which is the wiring 31 placed in the recess 22 in which the second mesa portion 12B is accommodated. are separated (insulated). In other words, the plurality of wirings 31 include a first wiring 31A and a second wiring 31B that are arranged adjacent to each other in the X-axis direction and electrically isolated from each other. Further, since the solder member 33 electrically connected to the first wiring 31A is arranged so as not to come into contact with the solder member 33 electrically connected to the second wiring 31B, the solder member 33 electrically connected to the first wiring 31A is The first mesa portion 12A connected to the first mesa portion 12A is electrically isolated from the second mesa portion 12B, which is electrically connected to the second wiring 31B. Note that in this embodiment, as described above, the plurality of wirings 31 are electrically isolated from each other. Therefore, any two wirings 31 arranged adjacent to each other in the X-axis direction among the plurality of wirings 31 correspond to the first wiring 31A and the second wiring 31B.

Here, the boundary between the side surface 12c of the mesa section 12 and the reference surface R1 is referred to as a base end P, and the side surface 12c of the first mesa section 12A on the side where the second mesa section 12B is located with respect to the first mesa section 12A. The base end P, which is the boundary between and the reference plane R1, is referred to as a first base end P1, and the side surface 12c of the second mesa part 12B on the side where the first mesa part 12A is located with respect to the second mesa part 12B. The base end P that is the boundary with the reference surface R1 is referred to as a second base end P2. At this time, the distance d2 in the X-axis direction from the first base end P1 to the second base end P2 is longer than the length d1 of the contact area CA of the mesa portion 12 in the X-axis direction.

Further, when viewed from the Y-axis direction, the distance d4 in the X-axis direction between the side surface 22b of the recess 22 and the side surface 12c of the mesa portion 12 opposite to the side surface 22b is the distance d4 from the top surface 12b to the mesa section along the Z-axis direction. The length becomes shorter toward the base end P, which is the boundary between the side surface 12c of the portion 12 and the reference surface R1.

[Effect]
Hereinafter, the effects of the semiconductor laser device 1A described above will be explained.

(First effect)
In the semiconductor laser device 1A, the reference surface R1 of the semiconductor laser element 10 (in this embodiment, the surface 19a of the insulating layer 19) is in surface contact with the reference surface R2 of the submount 20. Thereby, the positions of a plurality of light emitting points (for example, the center of the light emitting end surface 12a in the Z-axis direction) can be precisely aligned with respect to the reference surface R2 of the submount 20. Further, the semiconductor laser device 1A includes a first mesa portion 12A and a second mesa portion 12B that are electrically isolated from each other (that is, configured to be able to be driven independently of each other) and are arranged adjacent to each other. . Here, the amount of solder member 33 required (for example, the width of solder member 33 in the X-axis direction) may change depending on the width of the contact area CA (length d1 in the X-axis direction), but the semiconductor laser device 1A Then, the distance between the first mesa part 12A and the second mesa part 12B (that is, the distance d2 from the first base end P1 to the second base end P2 in the X-axis direction) is smaller than the length d1 of the contact area CA. It has also been lengthened. Thereby, a sufficient distance between the first mesa portion 12A and the second mesa portion 12B can be secured for the amount of solder member 33 required depending on the length d1 of the contact area CA. As a result, when the semiconductor laser device 10 is mounted on the submount 20 by reflow soldering, the solder member 33 corresponding to the first mesa portion 12A and the solder member 33 corresponding to the second mesa portion 12B melt and come into contact with each other. This can be suitably prevented. Therefore, according to the semiconductor laser device 1A, it is possible to precisely align a plurality of light emitting points while preventing short circuits between channels configured to be driven independently of each other.

Furthermore, the semiconductor laser device 1A has the following configuration in relation to the above-mentioned first effect. That is, as shown in FIG. 9, the recess 21 includes a first recess 22A, which is the recess 22 in which the first mesa part 12A is accommodated (arranged), and a recess 22, which is the recess 22 in which the second mesa part 12B is accommodated. 2 recesses 22B. Further, the reference for the partition wall 23 formed between the first recess 22A and the second recess 22B (that is, the portion extending in the Y-axis direction so as to separate the first recess 22A and the second recess 22B) The length d3 of the surface R2 in the X-axis direction is longer than the length d1 of the contact area CA in the X-axis direction. As shown in FIG. 9, in this embodiment, a boundary B between the reference surface R2 and the side surface 22b of the recess 22 is spaced apart from the base end P in the X-axis direction. Therefore, the relationship "d2>d3>d1" holds true. The length d3 is defined as the boundary B between the reference surface R2 and the first recess 22A (the boundary B on the second recess 22B side) and the boundary B between the reference surface R2 and the second recess 22B (the boundary B on the first recess 22A side). This is the length in the X-axis direction from the boundary part B). According to the above configuration, the first mesa portion 12A and the second mesa portion 12B are accommodated in mutually different recesses 22 (the first recess 22A and the second recess 22B), and the space between the first recess 22A and the second recess 22B is By ensuring a sufficient width (length d3) of the partition wall portion 23, the solder member 33 corresponding to the first mesa portion 12A (or second mesa portion 12B) that is melted during reflow can cross the partition wall portion 23 and become the first mesa portion 23. Contact (short circuit) with the solder member 33 corresponding to the second mesa portion 12B (or the first mesa portion 12A) can be suitably prevented.

Further, the recess 21 is constituted by a plurality of recesses 22 in which each of the plurality of mesa parts 12 is individually accommodated, and a partition wall portion 23 is provided between the recesses 22 adjacent to each other. According to the above configuration, compared to a configuration including a single recess 22 in which two or more mesa portions 12 are accommodated, short circuits between adjacent mesa portions 12 can be better prevented, and a plurality of channels can be independently driven. reliability can be improved. Furthermore, since the contact area between the reference surface R1 and the reference surface R2 can be increased in the partition wall section 23 provided between each recess 22, the stress applied to the semiconductor laser element 10 (mainly the substrate 11) can be reduced, and the The occurrence of warpage of the laser element 10 can be suppressed. In particular, when the length of the substrate 11 in the X-axis direction increases due to the plurality of mesa portions 12 being arranged in the X-axis direction as in this embodiment, the substrate 11 tends to warp in the X-axis direction. Become. The above configuration is particularly effective in such cases.

In this embodiment, the first mesa portion 12A and the second mesa portion 12B are accommodated in separate recesses 22, so that the solder member 33 corresponding to the first mesa portion 12A and the second mesa portion 12B correspond to each other. However, in order to obtain the first effect described above, it is preferable that the first mesa portion 12A and the second mesa portion 12B are housed in separate recesses 22. It is not necessary to do so. For example, as shown in FIG. 10, the recess 21 may be configured by a single recess 22C that accommodates a plurality of (here, eight) mesa parts 12. In this case, a plurality of wirings 31 corresponding to each of the plurality of mesa portions 12 are provided on the bottom surface 22a of the single recess 22C. That is, the wiring portion W provided at a position corresponding to each of the plurality of mesa portions 12 is arranged at a position corresponding to each of the plurality of mesa portions 12, and connects a plurality of wirings 31 that are electrically isolated from each other. include. Alternatively, as shown in FIG. 11, the recess 21 has a plurality of recesses 22 (however, the number is smaller than the total number of mesa parts 12) and accommodates two or more (here, three) mesa parts 12. It may have at least one recess 22D. According to the configuration in which “d2>d1” is satisfied, if the first mesa portion 12A and the second mesa portion 12B are accommodated in the same recess (that is, the first mesa portion 12A and the second mesa portion 12B), the occurrence of short circuit between the solder member 33 corresponding to the first mesa portion 12A and the solder member 33 corresponding to the second mesa portion 12B is effectively prevented. can do.

Further, as in the example shown in FIG. 11, the distance between adjacent mesa portions 12 (distance corresponding to the above-mentioned distance d2) may not be uniform among all mesa portions 12. In the example of FIG. 11, the distance d21 between the rightmost mesa portion 12 accommodated in the recess 22D and the leftmost mesa portion 12 accommodated in the recess 22 adjacent to the right side of the recess 22D is The distance d22 between the three mesa portions 12 accommodated in the three mesa portions 12 is longer than the distance d22. For example, the distance between mesa portions 12 that need to be electrically isolated may be longer than the distance between mesa portions 12 that do not need to be electrically isolated. Further, in the example of FIG. 11, when the same channel is configured by three mesa parts 12 accommodated in the recess 22D, one wiring common to the three mesa parts 12 (the three mesa parts 12 (wiring formed wide in the X-axis direction so as to overlap with the wiring) may be provided in the recess 22D. In this case, the three mesa portions 12 are electrically connected to each other via the one wiring.

Further, in this embodiment, the wiring portion W includes a plurality of wirings 31 arranged at positions corresponding to each of the plurality of mesa portions 12 and electrically isolated from each other, and among the plurality of wirings 31, the X-axis Any two wirings 31 arranged adjacent to each other in the direction correspond to the above-described first wiring 31A and second wiring 31B. According to the above configuration, between any two mesa portions 12 adjacent to each other, the interval between the mesa portions 12 (i.e., the distance d2) is longer than the width (length d1) of the contact area CA; It becomes possible to independently drive a plurality of mesa portions 12 (channels) while preventing short circuits between the channels.

Note that some of the plurality of wirings 31 may be electrically connected to each other. For example, as described above, the common wiring 31 may be formed in two or more mesa portions 12 belonging to the same channel. In this case, there is no problem even if the solder members 33 corresponding to some of the wirings 31 come into contact with each other. Therefore, when the mesa portions 12 corresponding to the several wirings 31 are adjacent to each other in the X-axis direction, the interval (distance d2) between the mesa portions 12 is smaller than the width (length d1) of the contact area CA. may also be shortened. That is, in order to obtain the above first effect, the above-mentioned relationship "d2>d1" is satisfied by It suffices if it is established between the first mesa portion 12A and the second mesa portion 12B.

(Second effect)
In the semiconductor laser device 1A, the reference surface R1 of the semiconductor laser element 10 is in surface contact with the reference surface R2 of the submount 20. Thereby, the positions of a plurality of light emitting points (for example, the center of the light emitting end surface 12a in the Z-axis direction) can be precisely aligned with respect to the reference surface R2 of the submount 20. In addition, in the semiconductor laser device 1A, since the contact area between the reference surface R1 and the reference surface R2 can be increased in the partition part 23 provided between the adjacent recesses 22, the semiconductor laser element 10 (mainly the substrate 11) The stress applied to the semiconductor laser element 10 can be reduced, and the occurrence of warpage of the semiconductor laser element 10 can be suppressed. More specifically, in the semiconductor laser device 1A, in the regions on both sides of the semiconductor laser element in the X-axis direction (the region to the left of the leftmost recess 22 and the region to the right of the rightmost recess 22). In addition to the contact between the reference plane R1 and the reference plane R2, the reference plane R1 and the reference plane R2 are also in contact at the partition wall 23, so that the stress applied to the semiconductor laser element 10 (mainly the substrate 11) is reduced. can be effectively reduced. Here, from the viewpoint of suppressing the occurrence of warpage of the semiconductor laser element 10, it is preferable to make the contact surface between the reference surface R1 and the reference surface R2 as large as possible. For this purpose, it is preferable to shorten the distance in the X-axis direction between the side surface 22b of the recess 22 and the boundary B of the reference surface R2 and the base end P of the mesa section 12 facing the side surface 22b. However, when the distance between the boundary part B and the base end P is shortened in this way, the side surface 22b of the recess 22 and the side surface 12c of the mesa part 12 tend to come into contact with each other, increasing the risk of damaging the mesa part 12. . Therefore, in the semiconductor laser device 1A, the distance d4 in the X-axis direction between the side surface 22b of the recess 22 and the side surface 12c of the mesa portion 12 (see FIG. 9) is from the top surface 12b to the base end P along the Z-axis direction. It is structured so that it gets shorter as you go. According to the above configuration, the distance between the boundary portion B and the base end portion P can be made as short as possible while reducing the risk of contact between the side surface 22b of the recess 22 and the side surface 12c of the mesa portion 12. As a result, the contact surface between the reference surface R1 and the reference surface R2 can be made as large as possible while suppressing damage to the semiconductor laser element 10. Therefore, according to the semiconductor laser device 1A, it is possible to suitably suppress the occurrence of warping of the semiconductor laser element 10 and to accurately align the plurality of light emitting points.

Furthermore, the semiconductor laser device 1A has the following configuration in relation to the above-mentioned second effect. That is, the plurality of recesses 22 accommodate each of the plurality of mesa parts 12 individually. According to the above configuration, since it is possible to increase the contact area between the reference surface R1 and the reference surface R2 in the plurality of partitions 23 provided between the respective recesses 22, the contact area between the reference surface R1 and the reference surface R2 can be increased. Stress can be further reduced, and the occurrence of warpage of the semiconductor laser element 10 can be effectively suppressed.

Further, the wiring portion W includes a plurality of wirings 31 that are arranged at positions corresponding to each of the plurality of mesa portions 12 and electrically isolated from each other. According to the above configuration, by separating any two adjacent mesa parts 12 by the partition wall part 23 provided between the recesses 22, short circuits between the channels can be prevented, and a plurality of mesa parts 12 ( channels) can be driven independently.

Further, as shown in FIG. 9, the inclination angle θ4 of the side surface 12c of the mesa portion 12 with respect to the reference plane R1 is smaller than the inclination angle θ1 of the side surface 22b with respect to the bottom surface 22a of the recess 22 (see (A) in FIG. 6). . That is, in the present embodiment, both the side surface 12c of the mesa portion 12 and the side surface 22b of the recessed portion 22 are provided in a planar shape, and the inclination angle θ4 of the side surface 12c and the inclination angle θ1 of the side surface 22b satisfy “θ4<θ1”. By having the following relationship, a configuration is realized in which the distance d4 becomes shorter from the top surface 12b toward the base end P. According to the above configuration, it is possible to easily and reliably realize a configuration in which the distance d4 between the side surface 22b of the recess 22 and the side surface 12c of the mesa portion 12 becomes shorter from the top surface 12b toward the base end P.

Further, as shown in FIG. 6A, the angle θ2 between the reference surface R2 and the side surface 22b of the recess 22 is an obtuse angle. According to the above configuration, when the semiconductor laser device 10 is mounted on the submount 20, the side surface 12c of the mesa portion 12 comes into contact with the portion where the reference surface R2 and the side surface 22b intersect (i.e., the boundary portion B). Even so, the impact on the side surface 12c of the mesa portion 12 can be reduced compared to the case where the angle between the reference surface R2 and the side surface 22c is configured to be 90 degrees or less (that is, when the sharpness of the boundary portion B is large). . Therefore, according to the above configuration, the risk of damage to the semiconductor laser element 10 during mounting can be reduced.

Moreover, the boundary part B between the reference surface R2 and the side surface 22b of the recessed part 22 is spaced apart from the base end part P in the X-axis direction. According to the above configuration, since the semiconductor laser element 10 is mounted on the submount 20 so that the boundary part B and the base end part P do not come into contact with each other, the side surface 12c of the mesa part 12 comes into contact with the boundary part B during mounting. Risk can be reduced and damage to the semiconductor laser element 10 can be suitably prevented.

Note that in order to obtain the above-mentioned second effect, it is not essential that a plurality of recesses 22 for individually accommodating the mesa portions 12 be provided. In order to obtain the above second effect, it is sufficient that at least two recesses 22 and at least one partition wall 23 disposed therebetween are provided.

(Other effects)
A single electrode 32 common to the plurality of mesa portions 12 is provided on the upper surface 11 a of the substrate 11 of the semiconductor laser device 10 . According to the above configuration, by sharing the cathode electrode (electrode 32) disposed on the back surface (upper surface 11a) side of the substrate 11 between the plurality of mesa parts 12, the wires connected to the electrode 32 by wire bonding are Since the number of wires can be reduced, damage to the semiconductor laser element 10 due to wire bonding can be suppressed. More specifically, if the electrodes 32 were separated for each channel, at least as many wires as the number of channels would be required, but according to the present embodiment, if at least one wire is connected to the electrodes 32, good.

As shown in FIG. 6A, the opening width of the side surface 22b of the recess 22 along the X-axis direction of the recess 22 on the top surface 20a of the submount 20 is the same as that of the bottom surface 22a of the recess 22 along the X-axis direction. It is inclined with respect to the bottom surface 22a so as to be larger than the width. That is, the inclination angle θ1 of the side surface 22b with respect to the bottom surface 22a is an acute angle. According to the above configuration, by configuring the side surface 22b of the recess 22 as an inclined surface that becomes wider from the bottom surface 22a side toward the opening end side, a space is created in the recess 22 for the solder member 33 melted during reflow to escape. can be appropriately secured.

As shown in FIGS. 4 and 5, the wiring 31 extends from inside the recess 22 to above the upper surface 20a outside the recess 22. As shown in FIGS. According to the above configuration, since the electrode (anode electrode) on the mesa portion 12 side of the semiconductor laser element 10 can be drawn out to the surface (upper surface 20a) of the submount 20 via the electrode 35 and the wiring 31, the semiconductor laser element 10 This makes it easy to implement a configuration for passing current through. More specifically, the electrode pad 34 electrically connected to the electrode 35, which is the anode electrode, can be exposed on the same side as the electrode 32, which is the cathode electrode (the side facing the upper surface 20a of the submount 20). . Thereby, the workability of wire bonding to the electrode 32 and the electrode pad 34 can be improved.

As shown in FIG. 5, the wiring 31 (wiring portion W) extends from the inside of the recess 22 to the outside of the recess 22 along the Y-axis direction. Further, as shown in FIG. 6B, the recess 22 has a side surface 22c that intersects with the Y-axis direction and along which the wiring 31 runs. Further, the side surface 22c is inclined with respect to the bottom surface 22a such that the opening width of the recess 22 in the upper surface 20a along the Y-axis direction is larger than the width of the bottom surface 22a of the recess 22 along the Y-axis direction. . That is, the inclination angle θ3 of the side surface 22c with respect to the bottom surface 22a is an acute angle. If the side surface 22c is not inclined as described above (for example, if the side surface 22c is a surface perpendicular to the bottom surface 22a of the recess 22), the boundary between the bottom surface 22a and the side surface 22c and the boundary between the side surface 22c and the top surface 20a. Since the wiring 31 is bent in a step-like manner at the boundary, disconnection is likely to occur. On the other hand, by configuring the side surface 22c as a sloped surface as described above and arranging the wiring 31 along the sloped side surface 22c, the wiring 31 can be prevented from bending in a step-like manner, and the occurrence of wire breakage can be suppressed.

As shown in FIG. 3, each of the plurality of mesa parts 12 has one or more active layers 13 provided independently for each mesa part 12. According to the above configuration, since the active layer 13 is spatially separated between the plurality of mesa parts 12, it is possible to reliably prevent the occurrence of optical crosstalk between the mesa parts 12. Furthermore, when a plurality of (four in this embodiment) active layers 13 are provided in each mesa portion 12 as in this embodiment, each mesa portion 12 can function as a stacked semiconductor laser element. It is possible to increase the laser output.

Submount 20 is made of silicon. According to the above configuration, the recess 21 can be formed with high precision, for example, by an etching process.

The submount 20 has a front surface 20c that is connected to the upper surface 20a and intersects with the Y-axis direction, and the recess 22 extends to the front surface 20c and is open to the front surface 20c. According to the above configuration, the light emitting end surface 12a of each mesa section 12 accommodated in the recess 22 can be exposed to the outside from the portion of the recess 22 that opens to the front surface 20c. The extraction efficiency of the laser beam L emitted along the direction can be improved.

An alignment mark M for aligning the semiconductor laser element 10 with respect to the submount 20 is provided on the upper surface 20a of the submount 20. According to the above configuration, when mounting the semiconductor laser device 10 on the submount 20, it is possible to easily and accurately align the semiconductor laser device 10 with respect to the submount 20.

The thickness of the substrate 11 in the Z-axis direction (the length from the top surface 11a to the bottom surface 11b) is smaller than the thickness of the submount 20 in the Z-axis direction (the length from the top surface 20a to the bottom surface 20b). According to the above configuration, by using the submount 20 that is thicker than the semiconductor laser element 10, it is possible to suitably suppress the occurrence of distortion of the submount 20 with respect to the semiconductor laser element 10 (that is, distortion of the reference plane R2). As a result, the positions of the plurality of light emitting points with respect to the reference surface R2 of the submount 20 can be aligned with even higher precision.

The substrate 11 has side surfaces 11e and 11f that intersect in the X-axis direction. Further, the distance d5 in the X-axis direction from the end (boundary part B) of the recess 22 provided at the position closest to the side surfaces 11e and 11f in the X-axis direction to the side surfaces 11e and 11f (see FIG. 7) is the reference plane. It is longer than the distance d6 in the Z-axis direction from R1 to the top surface 12b of the mesa portion 12 (see FIG. 9). According to the above configuration, it is possible to secure a certain area or more of the area of the portion where the reference surface R1 and the reference surface R2 are in contact with each other on the outside of the region where the recess 22 is provided in the X-axis direction of the substrate 11. The support stability of the semiconductor laser element 10 with respect to the submount 20 can be improved.

As an example, the distance d6 (i.e., the height of the mesa portion 12) is shorter than 1/2 of the depth of the recess 22 (i.e., the length in the Z-axis direction from the reference surface R2 to the bottom surface 22a). It may be set as follows. In this case, since a space not occupied by the mesa portion 12 can be appropriately secured in the recess 22, a space for storing the solder member 33 melted during reflow, for example, can be appropriately secured. Further, by making the recess 22 deep relative to the height of the mesa 12, the risk of contact between the mesa 12 and the recess 22 can be reduced; however, making the recess 22 too deep relative to the height of the mesa 12 As a result, the amount (height) of the solder member 33 required to ensure reliable contact between the wiring 31 and the electrode 35 increases. From the above viewpoint, the distance d6 may be set to be longer than ⅓ of the depth of the recess 22.

[Second embodiment]
A semiconductor laser device 1B according to the second embodiment will be described with reference to FIGS. 12 and 13. The semiconductor laser device 1B is different from the semiconductor laser device 1A in that it further includes a support substrate 40 and a lens member 50 (optical element) in addition to the semiconductor laser device 1A of the first embodiment. In addition, in FIG. 13, only the elements necessary to explain the positional relationship among the semiconductor laser element 10, the submount 20, the support substrate 40, and the lens member 50 are shown, and unnecessary elements (the wiring 31 , electrode pads 34, etc.) are omitted as appropriate.

The support substrate 40 is a member that supports the submount 20 and the lens member 50. As an example, the support substrate 40 is formed into a rectangular plate shape whose length in the X-axis direction matches that of the submount 20 and whose length in the Y-axis direction is longer than the submount 20. As an example, a pair of side surfaces of the support substrate 40 that intersect in the X-axis direction are substantially flush with the side surfaces 20f and 20e of the submount 20, and a rear-facing surface of the support substrate 40 is approximately flush with the rear surface 20d of the submount 20. The submount 20 is arranged on the support substrate 40 so as to be flush with each other.

The lens member 50 is arranged at a position facing the semiconductor laser element 10 and the submount 20 in the Y-axis direction. The lens member 50 guides the laser light L emitted from the light emitting end face 12a (see FIG. 1) of each of the plurality of mesa parts 12 toward the outside. In this embodiment, as shown in FIG. 13, the lens member 50 has the role of condensing or collimating the laser light L emitted from the light emitting end surface 12a of each mesa portion 12 with a certain spread angle. Fulfill. The lens member 50 includes a main body 51 having a lens function, a lower flange 52 provided on the lower side of the main body 51 (the side where the support substrate 40 is located), and an upper flange 53 provided on the upper side of the main body 51. It has . The lower flange 52 and the upper flange 53 have similar rectangular plate shapes. The lens member 50 has a lower surface 50a formed by the rectangular lower surface of the lower flange 52, a light incident surface 50b formed by the rear surfaces of the main body 51, the lower flange 52, and the upper flange 53, and a light incident surface 50b formed on the main body 51. and a light exit surface 50c on the opposite side to the light entrance surface 50b. Both the lower surface 50a and the light entrance surface 50b are flat surfaces. The light exit surface 50c is a lens surface having a curved surface convex outward (forward) when viewed from the X-axis direction. The light incident surface 50b is a surface onto which the laser beam L emitted from the light emitting end surface 12a of each of the plurality of mesa portions 12 is incident. The light incident surface 50b is in surface contact with the front surface 20c of the submount 20.

The support substrate 40 has a support surface 40a that supports the submount 20 and the lens member 50. The support surface 40a includes a first support surface 40a1 that supports the submount 20 in surface contact with the lower surface 20b of the submount 20, and a second support surface 40a1 that supports the lens member 50 in surface contact with the lower surface 50a of the lens member 50. 40a2. In addition, in this embodiment, the first support surface 40a1 and the second support surface 40a2 are flush and continuous, but the height position (position in the Z-axis direction) of the first support surface 40a1 and the second support surface The height positions of the surfaces 40a2 may be different from each other. That is, the support substrate 40 may have a connection surface parallel to the XZ plane that connects the first support surface 40a1 and the second support surface 40a2.

According to the semiconductor laser device 1B, the submount 20 on which the semiconductor laser element 10 is mounted and the lens member 50 are supported in surface contact with the first support surface 40a1 and the second support surface 40a2 of the support substrate 40. , the height positions of the semiconductor laser element 10 and the lens member 50 (that is, the height positions of each member with respect to the support surface 40a (first support surface 40a1 and second support surface 40a2) of the support substrate 40) can be easily and Can be matched with high precision. Here, as shown in FIG. 13, the thickness of the submount 20 in the Z-axis direction is expressed as T, and the height of the central axis of the lens member 50 from the lower surface 50a is expressed as H. In this case, between the distance d6 in the Z-axis direction from the reference plane R1 to the top surface 12b of the mesa portion 12 (see FIG. 9) and the thickness T and height H described above, "H=T-d6/2". By adjusting the thickness T so that the following relationship holds true, the height positions of the plurality of light emitting points (centers in the Z-axis direction of the light emitting end surface 12a) can be easily aligned with the center position of the lens member 50. . Note that the height position adjustment described above may be performed by adjusting the height position of the second support surface 40a2 of the support substrate 40 with respect to the first support surface 40a1. In any case, by simply placing the submount 20 and the lens member 50 on the support surface 40a of the support substrate 40, the height positions of the semiconductor laser element 10 and the lens member 50 can be easily and appropriately adjusted. Become.

In addition, in the semiconductor laser device 1B, by bringing the front surface 20c of the submount 20 and the light incident surface 50b of the lens member 50, which face each other in the Y-axis direction, into surface contact, the light output end surface 12a and the light incident surface in the Y-axis direction are brought into surface contact. The distance to 50b can be adjusted with high precision. That is, when mounting the semiconductor laser element 10 on the submount 20, the distance from the light emitting end surface 12a to the light incident surface 50b is adjusted by adjusting the distance from the light emitting end surface 12a to the front surface 20c in the Y-axis direction. can do. For example, the light emitting end surface 12a of each mesa portion 12 is configured to be flush with the front surface 11c of the substrate 11, and the semiconductor laser element is configured such that the front surface 11c of the substrate 11 and the front surface 20c of the submount 20 are flush with each other. 10 is mounted on the submount 20, the light emitting end surface 12a is flush with the front surface 20c of the submount 20. In this case, by bringing the front surface 20c of the submount 20 into surface contact with the light entrance surface 50b, the light output end surface 12a of each mesa portion 12 can be brought into surface contact with the light entrance surface 50b.

Further, as described when describing the semiconductor laser device 1A, in this embodiment, the length of the recess 21 in the Y-axis direction is longer than the length of the semiconductor laser element 10 in the Y-axis direction. According to the above configuration, it is possible to release the solder member 33 melted during reflow into a space in the recess 21 that does not overlap with the semiconductor laser element 10 (mesa portion 12) in the Y-axis direction. Furthermore, it is possible to adjust the position of the semiconductor laser element 10 with respect to the submount 20 in the Y-axis direction according to the focal length of the lens member 50. That is, according to the above configuration, the semiconductor laser device 10 is mounted on the submount such that the front surface 11c of the semiconductor laser device 10 is located behind the front surface 20c of the submount 20 within a range where the mesa portion 12 does not interfere with the submount 20. It becomes possible to arrange it with respect to the mount 20. Thereby, it becomes possible to appropriately adjust the distance between the front light emitting end surface 12a of each mesa portion 12 and the light incident surface 50b.

[Third embodiment]
A semiconductor laser device 1C according to the third embodiment will be described with reference to FIGS. 14 and 15. The semiconductor laser device 1C differs from the semiconductor laser device 1B in that it further includes a mold resin 60 in addition to the semiconductor laser device 1B of the second embodiment. 15, similar to FIG. 13, only the elements necessary to explain the positional relationship among the semiconductor laser element 10, submount 20, support substrate 40, lens member 50, and mold resin 60 are illustrated, and the above-mentioned elements are illustrated. For the sake of explanation, illustrations of unnecessary elements (wiring 31, electrode pads 34, etc.) are omitted as appropriate.

The mold resin 60 is formed on the support substrate 40 so as to cover the lens member 50, the submount 20, and the semiconductor laser element 10. The semiconductor laser device 1C has a rectangular parallelepiped outer shape as a whole by including the mold resin 60 as described above. The mold resin 60 may be formed by, for example, a resin molding technique such as transfer molding or compression molding. Examples of the material for the mold resin 60 include epoxy resin and silicone resin.

According to the semiconductor laser device 1C, the positional relationship of each member (lens member 50, submount 20, and semiconductor laser element 10) arranged on the support substrate 40 can be fixed by the molding resin 60. It is possible to prevent a shift in the positional relationship of the members from occurring. Moreover, each member can be appropriately protected by the mold resin 60.

[Modified example]
Although the embodiment and some modifications of the present disclosure have been described above, the present disclosure is not limited to the configurations shown in the embodiment and each modification. The materials and shapes of each structure are not limited to the specific materials and shapes described above, and various materials and shapes other than those described above can be employed. Further, some of the configurations included in the above embodiment and each modification may be omitted or changed as appropriate, or may be combined arbitrarily.

For example, the recess 22 may be formed by a method other than wet etching. In this case, the inclination angle θ1 and the inclination angle θ3 may be different. Further, the inclination angle θ1 of the side surface 22b of the recess 22 may not be constant over the entire region of the side surface 22b in the Z-axis direction. For example, the side surface 22b may be formed such that the angle of inclination with respect to the bottom surface 22a changes stepwise from the top surface 20a side toward the bottom surface 22a side. Further, the side surface 22b does not have to be planar, and may be curved, for example. What has been said above regarding the side surface 22b also applies to the side surface 22c.

Further, in the second embodiment and the third embodiment, the lens member 50 has been described as an example of an optical element, but the optical element may be a member other than a lens, such as an optical filter or a volume holographic diffraction grating (VBG). It may be. That is, the optical element only needs to have a lower surface (a surface corresponding to the lower surface 50a) that can be supported in surface contact with the second support surface 40a2 of the support substrate 40, and is incorporated into the semiconductor laser device. The type of optical element is not particularly limited.

Further, in the above embodiment, each mesa portion 12 is completely housed within the recess 22, but a portion of the mesa portion 12 may be placed outside the recess 22. That is, at least a portion of the mesa portion 12 may be disposed in the recess 22 . For example, the front light emitting end surface 12a of the mesa portion 12 may protrude further forward than the front surface 20c of the submount 20. Further, for example, when the reference surface R1 of the semiconductor laser element 10 is formed lower than in the above embodiment (for example, the reference surface R1 is formed by the surface of another member provided on the surface 19a of the insulating layer 19, etc. In this case, a portion of the mesa portion 12 (a portion on the proximal end P side in the Z-axis direction) may be disposed outside the recess portion 22.

1A, 1B, 1C...Semiconductor laser device, 10...Semiconductor laser element, 10...Semiconductor laser element, 11...Substrate, 11a...Top surface (first surface), 11b...Bottom surface (second surface), 11e, 11f...Side surface ( 5th surface), 12...Mesa portion, 12a...Light emitting end surface, 12b...Top surface, 12c...Side surface, 13...Active layer, 20...Submount, 20a...Top surface (third surface), 20b... Bottom surface (sixth surface) front surface), 20c...front surface (fourth surface), 21, 22, 22C, 22D...recess, 22a...bottom surface, 22b...side surface (first side surface), 22c...side surface (second side surface), 23...partition wall portion, 31 ...Wiring, 32... Electrode (second electrode), 33... Solder member, 35... Electrode (first electrode), 40... Support substrate, 40a1... First support surface, 40a2... Second support surface, 50... Lens member ( optical element), 50b...light incidence surface, 60...mold resin, B...boundary part, M...alignment mark, P...base end part, R1...reference surface (first reference surface), R2...reference surface (second reference surface) surface), W...Wiring section.

Claims (19)

a substrate having a first surface and a second surface located opposite to each other in a first direction; and a light emitting end surface that intersects in a second direction perpendicular to the first direction, and formed on the second surface. a semiconductor laser element having a plurality of mesa portions formed to protrude in the first direction with respect to a first reference plane and extend in the second direction;
a mount member having a third surface forming a second reference surface opposite to the first reference surface; and a plurality of recesses formed on the third surface in which the plurality of mesa portions are disposed;
Equipped with
The mesa portion has a top surface facing the bottom surface of the recess, and a pair of side surfaces located on opposite sides in a third direction orthogonal to the first direction and the second direction,
A first electrode electrically connected to the mesa portion is provided on the top surface of the mesa portion,
A wiring portion is provided in the plurality of recesses at a position corresponding to each of the plurality of mesa portions,
The first electrode corresponding to each of the plurality of mesa portions is electrically connected to the wiring portion via a solder member,
The first reference surface is in surface contact with the second reference surface,
A partition wall portion extending in the second direction, having a predetermined length in the third direction, and having the second reference surface is provided between the mutually adjacent recessed portions,
The recess has a first side surface facing the side surface of the mesa portion in the third direction,
When viewed from the second direction, the distance in the third direction between the first side surface and the side surface of the mesa portion that opposes the first side surface is from the top surface to the distance along the first direction. becoming shorter toward the base end, which is the boundary between the side surface of the mesa portion and the first reference surface;
Semiconductor laser equipment. Each of the plurality of mesa portions is individually arranged in the plurality of recesses,
The semiconductor laser device according to claim 1. Each of the semiconductor laser elements includes one or more of the mesa portions, and has a plurality of channels that are configured to be driven independently of each other.
The semiconductor laser device according to claim 1. The wiring portion includes a plurality of wirings arranged at positions corresponding to each of the plurality of mesa portions and electrically isolated from each other.
The semiconductor laser device according to claim 1. A single second electrode common to the plurality of mesa portions is provided on the first surface.
The semiconductor laser device according to claim 1. The recess has a first side surface facing the side surface of the mesa portion in the third direction,
The first side surface is arranged with respect to the bottom surface such that the opening width of the recess in the third surface along the third direction is larger than the width of the bottom surface of the recess along the third direction. sloping,
The semiconductor laser device according to claim 1. The angle of inclination of the side surface of the mesa portion with respect to the first reference plane is smaller than the angle of inclination of the first side surface with respect to the bottom surface.
The semiconductor laser device according to claim 6. The angle between the second reference plane and the first side surface of the recess is an obtuse angle.
The semiconductor laser device according to claim 1. a boundary between the second reference plane and the first side surface of the recess is spaced apart from the base end in the third direction;
The semiconductor laser device according to claim 1. The wiring portion extends from the inside of the recess to the third surface outside the recess.
The semiconductor laser device according to claim 1. The wiring portion extends along the second direction from the inside of the recess to the outside of the recess,
The recess has a second side surface that intersects with the second direction and along which the wiring section runs;
The second side surface is arranged with respect to the bottom surface such that the opening width of the recess in the third surface along the second direction is larger than the width of the bottom surface of the recess along the second direction. sloping,
The semiconductor laser device according to claim 10. Each of the plurality of mesa portions has one or more active layers provided independently for each mesa portion,
The semiconductor laser device according to claim 1. The mount member is made of silicon.
The semiconductor laser device according to claim 1. The mount member has a fourth surface connected to the third surface and intersecting the second direction,
The recess extends to the fourth surface and is open to the fourth surface.
The semiconductor laser device according to claim 1. The third surface is provided with an alignment mark for aligning the semiconductor laser element with respect to the mount member.
The semiconductor laser device according to claim 1. an optical element that is disposed at a position facing the semiconductor laser element and the mount member in the second direction and guides light emitted from the light emitting end face of each of the plurality of mesa portions toward the outside;
a support substrate that supports the mount member and the optical element;
further comprising;
The support substrate includes a first support surface that supports the mount member in surface contact with a sixth surface of the mount member opposite to the third surface, and a first support surface that supports the mount member in surface contact with the optical element. a second supporting surface that supports;
The semiconductor laser device according to claim 1. The optical element has a light entrance surface into which the light emitted from the light exit end face of each of the plurality of mesa portions is incident;
The mount member has a fourth surface facing the light incident surface,
The light incidence surface is in surface contact with the fourth surface.
The semiconductor laser device according to claim 16. The length of the recess in the second direction is longer than the length of the semiconductor laser element in the second direction.
The semiconductor laser device according to claim 1 or 16. Further comprising a molded resin formed on the support substrate to cover the optical element, the mount member, and the semiconductor laser element.
The semiconductor laser device according to claim 16 or 17.

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