CN106933071B - Focusing leveling device and method - Google Patents
Focusing leveling device and method Download PDFInfo
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- CN106933071B CN106933071B CN201511025469.1A CN201511025469A CN106933071B CN 106933071 B CN106933071 B CN 106933071B CN 201511025469 A CN201511025469 A CN 201511025469A CN 106933071 B CN106933071 B CN 106933071B
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
- G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
- G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
- G03F9/7023—Aligning or positioning in direction perpendicular to substrate surface
- G03F9/7026—Focusing
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70216—Mask projection systems
- G03F7/70358—Scanning exposure, i.e. relative movement of patterned beam and workpiece during imaging
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
- G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
- G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
- G03F9/7023—Aligning or positioning in direction perpendicular to substrate surface
- G03F9/7034—Leveling
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Length Measuring Devices By Optical Means (AREA)
Abstract
本发明公开了一种调焦调平装置及方法，该装置包括：包括第一照明单元、投影光路、成像光路、探测器及控制端，所述第一照明单元提供测量光束，经所述投影光路后入射至被测工件表面，经所述被测工件表面反射后出射至所述成像光路，之后进入所述探测器成像，所述控制端根据成像信息得到所述被测工件表面的离焦量后，并控制工件台运动，将所述被测工件表面调节到误差允许范围内的最佳曝光面；所述第一照明单元与投影光路之间设有第一空间光调制器，所述第一空间光调制器上设有多个通光狭缝，所述测量光束经所述第一空间光调制器后形成多个测量光斑。本发明可以有效提高调焦调平装置的工艺适应性与测量精度，提高成品良率。
The invention discloses a focusing and leveling device and method. The device comprises: a first lighting unit, a projection light path, an imaging light path, a detector and a control end, the first lighting unit provides a measurement beam, and the projection After the optical path is incident on the surface of the workpiece to be tested, it is reflected by the surface of the workpiece to be tested and then exits the imaging optical path, and then enters the detector for imaging. The control end obtains the defocus of the surface of the workpiece to be tested according to the imaging information. After measuring and controlling the movement of the workpiece table, the surface of the workpiece to be tested is adjusted to the optimal exposure surface within the allowable error range; a first spatial light modulator is arranged between the first lighting unit and the projection light path, and the The first spatial light modulator is provided with a plurality of light-passing slits, and the measurement beam passes through the first spatial light modulator to form a plurality of measurement light spots. The invention can effectively improve the process adaptability and measurement accuracy of the focusing and leveling device, and improve the yield of finished products.
Description
Technical field
The present invention relates to projection lithography field, in particular to a kind of focusing leveling device and method.
Background technique
Projection mask aligner or projection lithography apparatus are that the pattern on mask is projected to workpiece surface by projection objective
Device.In projection lithography apparatus, it is necessary to have device for automatically focusing and leveling that work stage is guided accurately to move workpiece surface
To specified exposure position.Different technical solution that there are many automatic focusing leveling control functions of device for automatically focusing and leveling,
More common at present is non-contact type photoelectricity measuring technique.
Photodetection scheme based on imaging sensor is a kind of contactless optical Electric Measurement Technology scheme of comparative maturity,
According to label spot projection on tested object plane position and its reflected after on detector (photo-electrics such as CCD detector)
The position corresponding relationship of picture, calculates the defocusing amount of tested object plane.Since workpiece surface reflectivity is inconsistent and craftsmanship is poor
It is different, such as the groove in workpiece, the big deformation in part, hot spot imaging on CCD can generate distortion, or even be fallen into oblivion completely by noise
Not yet.
Many companies or mechanism are to solve above-mentioned technological problems to propose many solution and method, U.S. Publication
A kind of prescan scheme, specifically: first calculate the fit Plane of the facula measurement value of multiple measurement points in exposure area, then
The difference of each hot spot Yu the fit Plane is calculated, after carrying out certain choice, partially as each hot spot when formally exposing
The correcting value of measured value to improve measurement accuracy to a certain extent, but lacks even complete in certain exposure area parts
Processing method when portion's hot spot is invalid is difficult to be arranged and the defects of when hot spot gives up excessive is unable to measure there are preset value.
Fig. 1 is the structural schematic diagram typically based on image processing techniques focusing leveling device, when the upper table of measured workpiece 1
When face position is overlapped with the best focal plane position (in figure shown in 1 upper horizontal dotted line of measured workpiece) of projection objective 2, it is tested work
The reflection light path of part 1 is as shown in phantom in Figure 1, through projection slit 3 hot spot with incidence angle for θ Angles Projections to quilt
1 surface of workpiece is surveyed, is imaged on photodetector 4 after the imaged optical path of hot spot after 1 surface reflection of measured workpiece.When tested
When the upper surface location of workpiece 1 and the height tolerance of the best focal plane position of projection objective 2 are Δ z, through the light of projection slit 3
The spot position change amount Δ y of imaging in Z-direction on photodetector 4 are as follows:
Δ y=2 β Δ zsin θ (1-1)
In formula (1-1), β is the magnifying power of imaging optical path, and θ is the spot projection through projection slit 3 in measured workpiece 1
On incidence angle.
It is obtained based on image processing techniques focusing leveling device according to change in location inverse of the hot spot on photodetector 4
The defocusing amount on 1 surface of measured workpiece, generally use more facula measurement schemes with increase unit be tested area, improve measurement accuracy with
Efficiency.It is with some hot spot in more facula measurement schemes and by 3 sub- hot spots that the hot spot splits into asymmetric geometry below
Example describes the measurement process based on image processing techniques focusing leveling device.
Fig. 2 a is the slit distribution schematic diagram in projection slit 3, through projection slit spot projection to tested surface be
Measured workpiece surface, when the craftsmanship of tested surface is good and in zero-bit (i.e. the measurement zero-bit of sensor, and projection object
The optimum exposure face of mirror), dotted line (outgoing) as shown in figure 2b, then the light path imaging through end of probe is to photodetector
On, the signal of corresponding signal such as the dotted line expression in Fig. 2 c；When tested surface has the defocus of Δ z, such as institute in Fig. 2 b
The solid line (outgoing) shown, then signal represented by the corresponding solid line on photodetector, then three sub- hot spots are in photoelectricity
The location variation of the picture point of detector image-forming is respectively Δ y1, Δ y2, Δ y3, then the defocusing amount of the hot spot of corresponding tested surface
Respectively Δ z1, Δ z2, Δ z3.If tested surface only has defocus phenomenon, then obtaining defocusing amount Δ z according to formula (1-1) are as follows:
If tested surface has inclination, then can according to defocusing amount Δ z1, Δ z2, Δ z3 and the corresponding points of three sub- hot spots it
Between distance computation go out tilt quantity Rx, Ry of the tested surface at this, after obtaining defocusing amount Δ z, Rx, Ry, focusing and leveling sensor
Control terminal feeds back signal to work stage, is then adjusted to the optimum exposure face in allowable range of error by work stage, with
Guarantee the exposure quality of projection objective.
But when encountering technique groove intensive ditch slotted vane, as shown in Fig. 3 a~3d.When occur it is any 2 or
3 sub- spot projections of person to tested surface be Fig. 3 a or Fig. 3 any one situation of c when, then the signal detected is just
It can be the signal shape of Fig. 3 b or Fig. 3 d, obtain the spot center location information of photodetector and the practical center position of hot spot
There is deviation, the vertical position information of the tested surface measured is not the actual height of tested surface.When encountering such case,
Either taking discard portion facula information fit Plane method or simulating true object plane using least squares fitting curve is all
Invalid, it is invalid signals because the location information measured is not inconsistent with actual information inherently.Under such operating condition, using inclined
The method for moving projection facula position can also lose effect, because either along measurement direction positive offset or negative offset, hot spot
The case where encountering Fig. 3 a or Fig. 3 c is projected to after tested surface, can all be failed because there is partial information to fall into groove.
Summary of the invention
The present invention provides a kind of focusing leveling device and method, to solve to occur intensive work in measured workpiece local surfaces
Skill groove, the problem of causing the data measured that cannot reflect or cannot really reflect tested region height measurements.
In order to solve the above technical problems, the present invention provides a kind of focusing leveling device, including the first lighting unit, projected light
Road, imaging optical path, detector and control terminal, first lighting unit provide measuring beam, incident after the projecting light path
To the measured workpiece surface, it is emitted to the imaging optical path after the measured workpiece surface reflection, enters the spy later
Device imaging is surveyed, after the control terminal obtains the defocusing amount on the measured workpiece surface according to image-forming information, and controls the workpiece
Platform movement, by the measured workpiece surface modulation to the optimum exposure face in allowable range of error；First lighting unit with
The first spatial light modulator is equipped between projecting light path, first spatial light modulator is equipped with multiple light passing slits, described
Measuring beam forms multiple measurement hot spots after first spatial light modulator, and first spatial light modulator can be according to institute
The groove structure feature and location information setting light passing slit on measured workpiece surface are stated, and then modulates the size of the measurement hot spot
And position, so that image-forming information of the measured workpiece surface on the detector is complete.
Preferably, first spatial light modulator is equipped with multiple groups measurement markers, every group of measurement markers are by multiple logical
Optical slits composition, first lighting unit include multiple groups light fixture, are measured described in one group of the correspondence of light fixture described in every group
Label.
Preferably, described device further includes reference path, the reference path includes second space optical modulator and
Two lighting units, the second space optical modulator are equipped with and the one-to-one reference marker of the measurement markers, every group of institute
Reference marker is stated to be made of multiple light passing slits, the measurement markers at the center and same position of reference marker described in every group
Center is consistent, and second lighting unit includes light fixture described in multiple groups, joins described in one group of the correspondence of light fixture described in every group
Label is examined, the light fixture provides illuminating bundle, is imaged on the detector through after the corresponding reference marker.
Preferably, described device further includes relaying amplification optical path, hot spot after the imaging optical path and institute is penetrated
Hot spot after stating reference marker, which is emitted on the detector after the relaying amplifies optical path, to be imaged.
Preferably, reference marker described in every group is equipped with multiple light passing slits for surrounding the corresponding measurement markers.
Preferably, the light passing slit is raster mode.
Preferably, the detector is CCD or linear array CCD.
Preferably, the projecting light path includes group after projecting preceding group, steering assembly and projecting.
Preferably, the imaging optical path includes group, end of probe diaphragm, the second reflection group before the first reflection subassembly, detection
Group after part and detection.
Preferably, the projecting light path includes group, projection end diaphragm and projection before multiple groups projection end reflection subassembly, projection
Group afterwards, measurement markers described in one group of correspondence of projection end reflection subassembly, will transmit through the measurement hot spot of the measurement markers described in every group
It is reflected into before the projection in group.
Preferably, the imaging optical path includes group and the reflection of multiple groups end of probe after group, end of probe diaphragm, detection before detecting
Component, the hot spot that measurement markers described in corresponding one group of end of probe reflection subassembly described in every group are emitted through the imaging optical path, and will
It is reflected on the detector.
The present invention also provides a kind of focusing and leveling methods, using the focusing leveling device, for inclining to workpiece
Gradient and defocus measurement, comprising:
Step 1, the illuminating bundle are incident on described tested through the light passing slit in first spatial light modulator
Workpiece surface is simultaneously reflected, and reflected light is imaged on the detector；
Step 2, the control terminal judge whether the image-forming information on the detector is complete, if completely thening follow the steps 4,
If imperfect then follow the steps 3；
Step 3, first spatial light modulator are believed according to the groove structure feature on the measured workpiece surface and position
Breath adjusts light passing slit, return step 1；
Step 4, the control terminal calculate the defocusing amount on the measured workpiece surface according to the image-forming information, and control institute
Work stage movement is stated, by the measured workpiece surface modulation to the optimum exposure face in allowable range of error.
Preferably, the step 2 is specifically, if the center of each facula information and reality in the image-forming information
Center is inconsistent, then the image-forming information on detector is imperfect, i.e., the described measured workpiece surface defocus, executes step 3.
Preferably, the step 3 is specifically, first spatial light modulator obtains the ditch on the measured workpiece surface
Slot structure feature and location information judge corresponding light passing slit distribution number whether is stored in first spatial light modulator
According to calling the light passing slit distributed data to adjust the light passing slit if having, later return step 1；The basis if not
The information of acquisition adjusts light passing slit and saves, later return step 1.
Preferably, the light passing slit uses raster mode.
Compared with prior art, the invention has the following advantages that
1, reducing the size on facula measurement direction can make focusing leveling device adapt to the intensive measured workpiece of groove, mention
The Technological adaptability of high focusing leveling device；
2, the mode for changing projection spot size and layout in the present invention using SLM, because it is directly to control in the PC of SLM
End does not have the realization process that mechanical component is realized that adjusts by what is be directly realized by after software modification, will not be to total band
Carry out the influence in structure, is conducive to the stability for improving sensing system structure；
3, the present invention can reduce the spot size in measurement direction, moreover it is possible to reduce because tested surface reflectivity unevenness is to hot spot
The influence of Energy distribution unevenness, improves the signal-to-noise ratio of signal, is conducive to improve measurement accuracy；
4, the present invention can reduce the size on facula measurement direction, while can increase the ruler on the non-measured direction of hot spot
It is very little, utilization ratio of optical energy can be improved, improve the signal-to-noise ratio of detector detectable signal, be conducive to improve measurement accuracy.
5, occurs intensive technique groove in measured workpiece local surfaces, the data for causing focusing leveling device to measure cannot
When reflecting or cannot really reflect tested region height measurements, directly kept away using the size that spatial light modulator changes hot spot
Open or be not covered with the region of technique influence so that hot spot not by technique influenced to extrapolating tested region elevation carrection
Value；Or change project to the illumination on measured workpiece surface or measure hot spot between spacing or facula position, searching can
Measure the alternative site of tested region height measurements in complete or part.The present invention can effectively improve the work of focusing leveling device
Skill adaptability and measurement accuracy improve finished product yield.
Detailed description of the invention
Fig. 1 is the existing structural schematic diagram based on image processing techniques focusing and leveling sensor device；
Fig. 2 a~Fig. 2 c is the existing realization principle schematic diagram based on image processing techniques focusing and leveling sensor；
Fig. 3 a~Fig. 3 d is the schematic diagram of pre-resolved technological problems；
Fig. 4 is the structural schematic diagram of focusing leveling device in the embodiment of the present invention 1；
Fig. 5 is the structural schematic diagram of 1 spatial light modulator of the embodiment of the present invention；
Fig. 6 a~6c is the structure of spatial light modulator after the size and layout for changing light passing slit in the embodiment of the present invention 1
Schematic diagram；
Fig. 7 is that optical path trend of the hot spot on measured workpiece is shown after the size of change light passing slit in the embodiment of the present invention 1
It is intended to；
Fig. 8 a~8c is the signal intensity feelings that detector detects after the size of change light passing slit in the embodiment of the present invention 1
Condition schematic diagram；
Fig. 9 is focusing and leveling method flow schematic diagram in the embodiment of the present invention 1；
Figure 10 is the signal that single light passing slit is transform as to the spatial light modulator of grating mode in the embodiment of the present invention 2
Figure；
Figure 11 is the portion the A enlarged drawing of Figure 10；
Figure 12 is the schematic diagram for increasing the spatial light modulator after light passing slot number in the embodiment of the present invention 2；
Figure 13 is the light path schematic diagram of focusing leveling device in the embodiment of the present invention 3；
Figure 14 a~14c is the schematic layout pattern of measurement markers and reference marker in the embodiment of the present invention 3.
Specific embodiment
In order to make the foregoing objectives, features and advantages of the present invention clearer and more comprehensible, with reference to the accompanying drawing to the present invention
Specific embodiment be described in detail.It should be noted that attached drawing of the present invention is all made of simplified form and uses non-essence
Quasi- ratio, only for the purpose of facilitating and clarifying the purpose of the embodiments of the invention.
Embodiment 1
The focusing leveling device (FLS) of the present embodiment is as shown in figure 4, it is specifically included: lighting unit, projecting light path, at
As optical path, detector 116 and control terminal, the lighting unit provides measuring beam, be incident to after the projecting light path by
103 surface of workpiece is surveyed, is emitted to the imaging optical path after 103 surface reflection of measured workpiece, enters the detection later
Device 116 is imaged, and after the control terminal obtains the defocusing amount on 103 surface of measured workpiece according to image-forming information, and controls workpiece
Platform 104 moves, by 103 surface modulation of measured workpiece to the optimum exposure face in allowable range of error；The lighting unit
Spatial light modulator 107 is equipped between projecting light path, the spatial light modulator 107 is equipped with multiple light passing slits 1071,
The measuring beam forms multiple measurement hot spots after the spatial light modulator 107, and the spatial light modulator 107 can basis
Light passing slit 1071 is arranged in the groove structure feature and location information on 103 surface of measured workpiece, and then modulates the measurement
The size of hot spot and position, so that image-forming information of 103 surface of the measured workpiece on the detector 116 is complete.
Further, the spatial light modulator 107 is equipped with multiple groups measurement markers, and every group of measurement markers are by multiple light passings
Slit 1071 forms, and the lighting unit includes multiple groups light fixture, measures mark described in one group of the correspondence of light fixture described in every group
Note.
Specifically, the light fixture is for providing illuminating bundle, including light source 105 and collimation camera lens 106.The light source
105 using visible light illuminator part, including white light LEDs, halogen lamp, xenon lamp etc..
The projecting light path includes: the preceding group 108 of projection, steering assembly 109 and organizes 110 after projecting, and is used for the illumination
Light beam projects 103 surface of measured workpiece of the work stage 104 of exposure system.
The imaging optical path includes group 112, projection end diaphragm 113, reflection before multiple groups projection end reflection subassembly 111, projection
115 are organized after component 114 and projection, measurement markers described in one group of correspondence of projection end reflection subassembly 111, will transmit through described described in every group
The measurement hot spot of measurement markers is organized on 112 before being reflected into the projection.
The collimated camera lens 106 of the light beam that the light source 105 issues forms more after the spatial light modulator 107 after collimating
A measurement hot spot, the measurement hot spot project to 103 surface of measured workpiece through the projecting light path with incidence angle θ, and reflected light is through institute
Imaging optical path collection is stated to be imaged on the detector 116.
Further, the spatial light modulator 107 uses iris diaphgram or moving machinery diaphragm.As shown in figure 5, institute
Stating iris diaphgram includes the display screen S1 on bracket H1 and bracket H1, certainly, the light passing slit is provided on display screen S1
1071.Further, the spatial light modulator 1071 is controlled by control terminal, i.e. the position of light passing slit 1071 and clear aperture
It can be modified by the drive software of control terminal.
Specifically, when the operational characteristic of measured workpiece 103 relatively good (the flat no groove in surface), in the present embodiment
Light passing slit 1071 on use space optical modulator 107 is identical as the effect of fixed slit in the prior art.But when measurement
It, can be by light passing slit 1071 in reduction spatial light modulator 107 in measurement side when the measured workpiece 103 of intensive trench process
Upward clear aperture, size is changed to size shown in Fig. 6 b as shown in FIG. 6 a, but the center spacing of light passing slit 1071 is not
Become；It if necessary, can also appropriate adjustment light passing slit 1071 according to the actual situation as fig. 6 c while changing size
Center spacing, to adapt to different process requirements.By the hot spot of light passing slit 1071 measured workpiece 103 projection form
As shown in fig. 7, the signal curve of the corresponding imaging on detector 116 is as shown in Fig. 8 b and 8c, the signal curve of 8a is Fig. 6 a
Shown in the corresponding signal curve of light passing slit 1071.
As shown in figure 9, the present invention also provides a kind of focusing and leveling methods, specifically includes the following steps:
Step 1, the illuminating bundle are incident on the tested work through the light passing slit in the spatial light modulator 107
Part surface is simultaneously reflected, and reflected light is imaged on the detector 116；
Step 2, the control terminal judge whether the image-forming information on the detector 116 is complete, if complete i.e. when described
When measuring the center location information and practical center position consistency of hot spot, 4 are thened follow the steps；If imperfect i.e. when the hot spot
Center location information and practical center position then follow the steps 3 there are when deviation；,
The groove structure feature and position of step 3, the spatial light modulator 107 according to 103 surface of measured workpiece
Information adjusts light passing slit 1071, return step 1；
Specifically, the step 3 includes: the groove that the spatial light modulator 107 obtains 103 surface of measured workpiece
Structure feature and location information judge that corresponding light passing slit 1071 whether is stored in the spatial light modulator 107 to be distributed
Data call 1071 distributed data of light passing slit to adjust the light passing slit 1071, later return step 1 if having；If
Light passing slit 1071 is not then adjusted according to the information of acquisition and is saved, later return step 1.
Step 4, the control terminal calculate the defocusing amount on 103 surface of measured workpiece according to the image-forming information, and control
It makes the work stage 104 to move, by 103 surface modulation of measured workpiece to the optimum exposure face in allowable range of error.
The step 4 specifically: if the measured workpiece 103, there are defocus, tilt phenomenon, work stage 104 adjusts quilt
After surveying workpiece 103, exposure system starts to expose；If defocus, tilt phenomenon, exposure system is not present in the measured workpiece 103
Directly start to expose.
Specifically, when tested surface (i.e. 103 surface of measured workpiece) is in ideal focal plane, if position at this time is
z0, projection hot spot finally on detector 116 as corresponding initial position y0, letter that the dotted line in signal such as Fig. 2 c indicates
Number curve, it is corresponding such as the position that the solid line on 103 surface of measured workpiece in Fig. 4 indicates when tested surface has the defocus of Δ z
Signal curve be Fig. 2 c in solid line indicate signal curve, then its image position of detector 116 corresponding position close
System and initial position corresponding relationship are Δ y (the imaging position deviation of three corresponding hot spots be Δ y1, Δ y2, Δ y3), then
The calculating formula of defocusing amount Δ z:
It is identical as the calculation of typical structure when measured workpiece 103 has inclination, it is similarly available at this
Rx, Ry tilt quantity.Defocus, obliquity information are fed back to work stage 104 after being measured, are right by work stage 104 by FLS
Measured workpiece 103 is calibrated, and then starts to expose.
The exposure process are as follows: the figure when measured workpiece 103 is in the optimal focal plane of exposure object lens 102, on mask 101
It is imaged onto 103 surface of measured workpiece in work stage 104 through exposing object lens 102 after the exposed optical illumination of shape, to corresponding position
Photoresist is exposed, and then completes photolithographic procedures after other a series of processes again, since photolithographic procedures are not the present invention
Key content, and be the prior art, no longer narration in detail herein.
It needs, due to when practical application, for the measured workpiece 103 of fixed batch, technique figure
It is fixed, that is to say, that the location information of groove is known on the workpiece of the batch, therefore before formal measurement, can be with
According to the location information of groove known to measured workpiece 103, corresponding dynamic regulation hot spot is compiled in the control software of control terminal
It is distributed graph data and then forms slit distributed image data corresponding with the measured workpiece 103, and store the number for arriving SLM 107
According to for use, when the position of specific groove is arrived in test, SLM 107 just calls corresponding slit distributed image data, in this way may be used in library
Rapidly effectively to evade the influence of measurand technique, the measurement accuracy and testing efficiency of focusing leveling device are improved.Cause
This, the present embodiment before carrying out focusing and leveling, first confirm that the size of the groove of measured workpiece 103, location information whether be
Determining, if determine, then control terminal is directed to the size of the groove of the batch measured workpiece 103, location information production pair
The FLS slit distributed image data answered, and the advance data stored into the database of SLM 107 as FLS is spare, FLS exists
When measuring the batch measured workpiece 103, occur shown in similar Fig. 3 b, 3d when detector 116 detects spot signal curve
Signal curve, then control terminal stores the corresponding slit distributed image data into 107 database of SLM before just calling, and right
Light passing slit 1071 on display screen S1 is adjusted/switches.
The focusing leveling device and method of the present embodiment are mainly in 103 surface of measured workpiece, the portion for intensive groove occur
Point or all measurement hot spot utilizes SLM 107 to change spot size when cannot measure complete tested region height measurements
Mode accurately and quickly realizes the measurement to there is intensive groove measured workpiece 103 to adapt to intensive groove.The present embodiment can be right
TSV etc. severe craft piece measures, and is of course equally applicable to the focusing and leveling system of big visual field multimetering.
Embodiment 2
The present embodiment and the distinctive points of embodiment 1 are, in the present embodiment, spatial light modulator 107 is grating mode, institute
Stating grating mode wherein can will be changed to grating mode by single light passing slit 1071 as shown in Figure 10,11, can also be such as Figure 12 institute
Show and several light passing slits are formed into grating.In this way, there are also portions in the case where spatial light modulator middle part light splitting grid hot spot failure
The grating of point other parts is unlikely to fail.In addition, in the case where not changing light channel structure, it can be according to practical, different works
Condition is different to the demand parameter of measurement accuracy, increases the number of measurement sub-light spot by spatial light modulator 107, as Figure 10,11,
Shown in 12, the number of spots in figure is only the difference of opposite 3 number of spots, and actual condition increases more as needed or subtracts
It is few.Detector only needs the sub-light spot of Selection Center location information Yu practical center position consistency, whether judges the measured workpiece
There are defocus, tilt phenomenon, feed back to work stage.
Embodiment 3
The distinctive points of the present embodiment and Examples 1 and 2 are that the present embodiment is suitable for the focusing tune of big visual field multimetering
Flat system, while detector can also be slackened influenced by temperature drift, improve the measurement accuracy of sensor.
As shown in figure 13, it includes that the first illumination identical with 1 structure of embodiment is single that the focusing leveling device of the present embodiment, which removes,
It further include reference path outside first E1, the first spatial light modulator 107, projecting light path E2 and detection optical path E3, the reference path
Including second space optical modulator 107 ' and the second lighting unit E1 ', the second space optical detector 107 ' is arranged described
Between second lighting unit E1 ' and detection optical path E3, the second space optical modulator 107 ' is equipped with and the measurement markers
107a one-to-one reference marker 107b, reference marker 107b described in every group are made of multiple light passing slits, are joined described in every group
The center for examining label 107b is consistent with the center of the measurement markers 107a of same position.It is identical as the first lighting unit E1,
The second lighting unit E1 ' includes light fixture described in multiple groups, reference marker described in one group of the correspondence of light fixture described in every group
107b, the light fixture provide illuminating bundle, are imaged on the detector through after the corresponding reference marker 107b.
The present embodiment increases reference marker 107b, Ke Yixiao between the second lighting unit E1 ' and detection optical path E3
Weak detector is influenced by environment temperature drift.Reference marker 107b adjustment is completed, and the positional relationship of opposite whole system is long-term
Stable, and reference marker 107b light beam does not have the influence of technique without tested craft piece, when detector does not receive
Environment temperature drift influence when, imaging position of the reference marker 107b on detector target surface be it is fixed, can be set to reference marker
The theoretical imaging position of 107b；When detector receive environment temperature drift influence when, reference marker 107b on detector target surface at
There is certain offset in image position relative to its theoretical imaging position, can demarcate detector because by environment temperature drift shadow using the offset
The influence amount to sensor accuracy class is rung, can thus weaken or eliminate due to detector is by environment temperature drift to sensor
Bring adverse effect, to improve the measurement accuracy of sensor.
Further, the measurement markers 107a and reference marker 107b is respectively by the first, second SLM107,107 ' controls
It realizes, wherein as shown in figures 14a, reference marker 107b is distributed as shown in fig. 14b, and measurement markers for measurement markers 107a distribution
107a and reference marker 107b be it is one-to-one, Figure 14 c be measurement markers 107a and reference marker 107b are placed on it is same
Schematic layout pattern under coordinate, as in Figure 14 a marked as label 01~05 in 01~05 measurement markers 107a and Figure 14 b be according to
Sequence from small to large is mutual corresponding, and positional relationship of each label in the spatial light modulator where respective is to design
It is determined when completion.Using when according to the process condition of every batch of craft piece, by control terminal will need to change size or
The label of position creates corresponding pictorial symbolization (including measurement markers 107a and corresponding reference marker 107b) data, and stores
In corresponding database, to be called at any time being subsequently encountered corresponding process condition.
So in order to realize while measure to two kinds of labels, the present embodiment also has additional relaying amplification optical path E4, institute
Relaying amplification optical path E4 is stated to be used for measurement markers 107a and reference marker 107b while detecting.It should be noted that figure
Two figures in 13 dotted line frame are the schematic diagrames at two orthogonal visual angles of relaying amplification optical path E4.
In the present embodiment, (01~05 totally five groups, five groups are only signal, Ke Yigeng every group in the measurement markers 107a of Figure 14 a
It is more) label includes 3 slot markers (3 slits are only signals, can be more), every group in corresponding diagram 14b (01~05,
Group number is corresponding with measurement markers 107a) reference marker 107b includes 2 slot markers, and the label combination in Figure 14 a, 14b is one
After rising as shown in figure 14 c.Measurement markers 107a is corresponding to it after light fixture illumination in the first lighting unit E1, projection mark
Hot spot is first projected optical path E2 and projects in tested craft piece, is then detected optical path E3 and collects, last relayed amplification optical path
E4 is imaged on detector, and the detector is generally CCD or linear array CCD, i.e. LCCD, can also use other similar spy
Survey device；Corresponding reference marker 107b is directly relayed after being illuminated by light fixture corresponding in the second lighting unit E1 '
Amplification optical path E4 is imaged on detector, its certain measurement markers 107a identical with group number is imaged on the same LCCD, i.e.,
Measurement markers 107a and reference marker 107b shares a detector, subsequent that measurement is completed after back end signal is handled.
To sum up, the invention has the following advantages that
1, reducing the size on facula measurement direction can make focusing leveling device adapt to the intensive measured workpiece of groove
103, improve the Technological adaptability of focusing leveling device；
2, the mode for changing projection spot size and layout in the present invention using SLM 107, because it is directly in SLM 107
PC control terminal by what is be directly realized by after software modification, do not have the realization process that mechanical component is realized that adjusts, will not be to whole
A structure brings the influence in structure, is conducive to the stability for improving sensing system structure；
3, the present invention can reduce the spot size in measurement direction, moreover it is possible to reduce because tested surface reflectivity unevenness is to hot spot
The influence of Energy distribution unevenness, improves the signal-to-noise ratio of signal, is conducive to improve measurement accuracy；
4, the present invention can reduce the size on facula measurement direction, while can increase the ruler on the non-measured direction of hot spot
It is very little, utilization ratio of optical energy can be improved, improve the signal-to-noise ratio of 116 detectable signal of detector, be conducive to improve measurement accuracy.
5, occurs intensive technique groove in measured workpiece local surfaces, the data for causing focusing leveling device to measure cannot
When reflecting or cannot really reflect tested region height measurements, the size for changing hot spot using spatial light modulator 107 is straight
Connect the region for avoiding or not being covered with technique influence so that hot spot not by technique influenced to extrapolating tested region height
Measured value；Or change the spacing or facula position for projecting to the illumination on 103 surface of measured workpiece or measuring between hot spot,
Find the alternative site that can completely or partially measure tested region height measurements.The present invention can effectively improve focusing and leveling dress
The Technological adaptability and measurement accuracy set improve finished product yield.
Obviously, those skilled in the art can carry out various modification and variations without departing from spirit of the invention to invention
And range.If in this way, these modifications and changes of the present invention belong to the claims in the present invention and its equivalent technologies range it
Interior, then the invention is also intended to include including these modification and variations.
Claims (15)
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| CN109426093B (en) * | 2017-08-31 | 2020-12-11 | 上海微电子装备（集团）股份有限公司 | A focusing and leveling detection device |
| CN110501878B (en) * | 2018-05-18 | 2021-05-14 | 上海微电子装备（集团）股份有限公司 | Focusing and leveling device, photoetching equipment and focusing and leveling method |
| CN110057839A (en) * | 2019-04-18 | 2019-07-26 | 中国科学院微电子研究所 | Focusing control apparatus and method in a kind of Optical silicon wafer detection system |
| CN111443577B (en) * | 2020-04-08 | 2023-04-07 | 中国科学院微电子研究所 | Adjusting device and method for exposure equipment and exposure equipment |
| CN112649435B (en) * | 2020-12-01 | 2023-07-07 | 上海御微半导体技术有限公司 | A focal plane measurement device and defect detection equipment |
| CN112731773B (en) * | 2020-12-31 | 2024-04-16 | 中国科学院微电子研究所 | Electron beam exposure machine, focusing method and device |
| CN113764298B (en) * | 2021-05-31 | 2023-11-17 | 上海微电子装备（集团）股份有限公司 | Substrate defect detection device and substrate defect detection method |
| CN115542674B (en) * | 2021-06-30 | 2025-08-26 | 上海微电子装备（集团）股份有限公司 | Focusing and leveling device and photolithography machine |
| CN114326287B (en) * | 2021-11-30 | 2024-11-01 | 武汉宇微光学软件有限公司 | A Separate and Rigorous Mask Model and Photoresist Model Modeling and Calibration Method |
| CN114675514A (en) * | 2022-03-31 | 2022-06-28 | 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） | Leveling and focusing device |
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