CN105047657A - AIO packaged structure and packaging method - Google Patents

Abstract

The invention discloses an AIO packaging structure and a packaging method. The AIO packaging structure includes: a first packaging structure, including a first substrate, a number of electronic components installed on the first substrate, and a plastic package located above the first substrate. The first plastic packaging body of several electronic components on the first substrate; the second packaging structure, the second packaging structure is located above the first packaging structure, the second packaging structure and the first substrate are seamlessly plastic-sealed through the first plastic packaging body, the second packaging structure The second packaging structure includes a second substrate and a number of electronic components mounted on the second substrate, and the second substrate is electrically connected to the first substrate. In the AIO of the present invention, one or more second substrates are arranged on the first substrate, and the adjacent substrates are plastic-sealed through the plastic sealing process, and all the substrates are electrically connected, since capacitors, resistors, and chips can be installed on each substrate. The area occupied by the substrate can be reduced through stacked installation of electronic components such as electronic components, which meets the requirements of miniaturized chip packaging.

Description

AIO packaging structure and packaging method

technical field

The invention relates to the technical field of IC packaging, in particular to an AIO packaging structure and packaging method.

Background technique

As the power consumption, area, portability and function requirements of the whole system are getting higher and higher, how to integrate multiple circuits with different functions puts forward new requirements for chip design, manufacturing and packaging.

System-in-Package (SIP, SystemInPackage) refers to the combination of multiple active and passive components with different functions, as well as other components such as micro-electromechanical systems (MEMS), optical (Optics) components, etc. A single standard packaged component with multiple functions forms a system or subsystem. Most system-in-package products integrate multiple chips, passive components, etc., and connect the pads of the chips to the pads on the substrate by wire bonding or flip-chip, and then realize the entire process by connecting the circuit wires on the substrate. The electrical connection of the system is finally molded into an integral sealed product by using the molding compound process.

With the development of miniaturization, the existing SIP packaging structure can no longer meet the requirements of miniaturized chip packaging. In the SIP packaging structure, each chip and component can only be packaged on one layer of SIP substrate, which can only reduce the number of chips and components. Or reduce the chip and component area to meet the miniaturization requirements of the chip. When the number of chips and components and the component area cannot be reduced, it is impossible to further realize the miniaturization of the chip.

Therefore, in view of the above technical problems, it is necessary to provide a new AIO packaging structure and packaging method.

Contents of the invention

The purpose of the present invention is to provide an AIO packaging structure and packaging method.

In order to achieve the above object, the technical solutions provided by the embodiments of the present invention are as follows:

A kind of AIO package structure, described AIO package structure comprises:

The first packaging structure includes a first substrate, a plurality of electronic components mounted on the first substrate, and a first plastic package located above the first substrate and plastic-sealed with a plurality of electronic components on the first substrate;

The second packaging structure, the second packaging structure is located above the first packaging structure, the second packaging structure and the first substrate are seamlessly plastic-sealed through the first plastic package, the second packaging structure includes a second substrate, and is installed on the second substrate The second substrate is electrically connected to the first substrate.

As a further improvement of the present invention, a second plastic package that plastic-seals several electronic components on the second substrate is formed above the second substrate.

As a further improvement of the present invention, the second packaging structure is a stacked structure, which is formed by stacking multiple second substrates and multiple second plastic packages. Electronic components are installed on each second substrate, adjacent to each other. The second substrate is seamlessly plastic-sealed by the second plastic packaging body.

As a further improvement of the present invention, each second substrate in the second package structure is electrically connected to the first substrate directly or indirectly.

As a further improvement of the present invention, the second substrate is electrically connected to the first substrate or different second substrates through metal conductive pillars.

As a further improvement of the present invention, a cover plate is provided on the top of the second packaging structure in the AIO packaging structure.

As a further improvement of the present invention, a heat dissipation layer is provided on the top of the second packaging structure in the AIO packaging structure.

As a further improvement of the present invention, all or part of the top and side surfaces of the AIO packaging structure are provided with a metal shielding layer.

As a further improvement of the present invention, the electronic components include capacitors, resistors, inductors, front-mount chips, and flip-chips.

Correspondingly, a kind of AIO encapsulation method, described method comprises:

providing a first substrate, and installing several electronic components on the first substrate;

providing a second substrate, performing seamless plastic sealing on the second substrate and the first substrate on which a plurality of electronic components are installed, and forming a first plastic package above the first substrate and between the second substrate;

electrically conducting the second substrate and the first substrate;

installing a plurality of electronic components on the second substrate;

Cut the above package structure to obtain several AIO package structures.

As a further improvement of the present invention, after "mounting several electronic components on the second substrate", it also includes:

The second substrate is plastic-sealed, and a second plastic-sealed body that is plastic-sealed on several electronic components on the second substrate is formed on the second substrate.

As a further improvement of the present invention, the "plastic sealing of the second substrate" also includes:

A heat dissipation layer is formed on the second plastic package.

As a further improvement of the present invention, after "mounting several electronic components on the second substrate", it also includes:

The cover plate and the second substrate on which several electronic components are installed are plastic-sealed, and a second plastic package is formed above the second substrate and between the cover plate.

As a further improvement of the present invention, after "mounting several electronic components on the second substrate", it also includes:

Another second substrate is provided, the second substrate is plastic-sealed on the original package structure, and a second plastic package is formed between the second substrates and plastic-sealed on several electronic components on the second substrate;

electrically conducting the uppermost second substrate and the first substrate;

installing a number of electronic components on the uppermost second substrate;

The above steps are repeated to form a stacked second packaging structure on the first substrate.

As a further improvement of the present invention, after "mounting several electronic components on the second substrate", it also includes:

providing another package structure including at least one second substrate, and plastic-sealing the package structure on the original package structure;

electrically conducting the two package structures;

The above steps are repeated to form several stacked packaging structures on the first substrate.

As a further improvement of the present invention, the "electrical conduction" is specifically:

Make a through hole between the second substrate and the first substrate, or between the second substrate and the second substrate, and pour metal conductive paste into the through hole, and form a metal conductive column after baking, and the second substrate and the first substrate pass through The metal conductive pillars are electrically connected directly or indirectly.

As a further improvement of the present invention, the AIO packaging method also includes:

A metal shielding layer is formed on all or part of the area between the first substrate and the second substrate in the AIO package structure.

The beneficial effects of the present invention are:

By setting one or more second substrates on the first substrate, the adjacent substrates are plastic-sealed through the plastic packaging process, and all the substrates are electrically connected, because electronic components such as capacitors, resistors, and chips can be installed on each substrate , the area occupied by the substrate can be reduced through stacked installation, which meets the requirements of miniaturized chip packaging;

The metal conductive pillar can electrically connect different substrates, and the signal is transmitted on different substrates through the metal conductive pillar. Compared with the traditional packaging structure, the present invention can shorten the transmission distance of the signal and improve the operating speed of the device;

The AIO packaging structure can be modularly combined with other same or different packaging structures to form a modular device. When there is a problem with a certain packaging structure of the device, it can be replaced, which avoids the problem of overall replacement of the traditional packaging structure and greatly reduces maintenance cost.

Description of drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings that need to be used in the description of the embodiments or the prior art. Obviously, the accompanying drawings in the following description are only These are some embodiments described in the present invention. Those skilled in the art can also obtain other drawings based on these drawings without creative work.

FIG. 1 is a schematic diagram of an AIO package structure in Embodiment 1 of the present invention.

2a-2l are the packaging flowcharts of the AIO packaging structure in Embodiment 1 of the present invention.

FIG. 3 is a schematic diagram of an AIO packaging structure in Embodiment 2 of the present invention.

4a-4c are packaging flowcharts of the AIO packaging structure in Embodiment 2 of the present invention.

5a-5d are the packaging flowcharts of the AIO packaging structure in Embodiment 4 of the present invention.

FIG. 6 is a schematic diagram of an AIO packaging structure in Embodiment 5 of the present invention.

7a and 7b are schematic diagrams of the AIO packaging structure in Embodiment 6 of the present invention.

FIG. 8 is a schematic diagram of an AIO packaging structure in Embodiment 7 of the present invention.

9a and 9b are schematic diagrams of an AIO packaging structure in Embodiment 8 of the present invention.

10a and 10b are schematic diagrams of an AIO packaging structure in Embodiment 9 of the present invention.

Detailed ways

In order to enable those skilled in the art to better understand the technical solutions in the present invention, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described The embodiments are only some of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts shall fall within the protection scope of the present invention.

The terms used herein to denote relative spatial positions such as "upper", "above", "under", "under", etc. are for convenience of description to describe the relative position of one element or feature relative to another as shown in the drawings. Relationships of units or features. The terms of spatial relative position may be intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if the structure in the figures is turned over, elements described as "below" or "beneath" other elements or features would then be oriented "above" the other elements or features. Thus, the exemplary term "below" can encompass both an orientation of above and below. The device may be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.

And, it should be understood that although the terms first, second, etc. may be used herein to describe various elements or structures, these described objects should not be limited by these terms. These terms are only used to distinguish these described objects from one another. For example, a first substrate may be referred to as a second substrate, and similarly, a second substrate may also be referred to as a first substrate, which does not depart from the scope of protection of the present application.

The invention discloses an AIO (AllInOne) packaging structure, comprising:

The first packaging structure includes a first substrate, a plurality of electronic components mounted on the first substrate, and a first plastic package located above the first substrate and plastic-sealed with a plurality of electronic components on the first substrate;

The second packaging structure, the second packaging structure is located above the first packaging structure, the second packaging structure and the first substrate are seamlessly plastic-sealed through the first plastic package, the second packaging structure includes a second substrate, and several For electronic components, the second substrate is electrically connected to the first substrate.

Preferably, the second package structure is a stacked structure, which is formed by stacking multiple second substrates and multiple second plastic packages, each second substrate is respectively equipped with electronic components, and adjacent second substrates pass through the second The plastic body is seamlessly sealed.

The second packaging structure in the present invention includes a plurality of second substrates. Of course, the second packaging structure can also be described by using other terms, such as the second packaging structure including stacked second substrates, third substrates..., while the present The second plastic package in the invention can also be described in the form of the second plastic package, the third plastic package, . . . arranged in sequence.

The present invention also provides an AIO packaging method, comprising:

providing a first substrate, and installing several electronic components on the first substrate;

providing a second substrate, performing seamless plastic sealing on the second substrate and the first substrate on which a plurality of electronic components are installed, and forming a first plastic package above the first substrate and between the second substrate;

electrically conducting the second substrate and the first substrate;

installing a plurality of electronic components on the second substrate;

Cut the above package structure to obtain several AIO package structures.

The present invention will be further described below in conjunction with specific examples. Furthermore, repeated reference numerals or designations may be used in different embodiments. These repetitions are only for the purpose of simply and clearly describing the present invention, and do not represent any relationship between the different embodiments and/or structures discussed.

Embodiment one:

Referring to Figure 1, the AIO packaging structure in Embodiment 1 of the present invention includes:

The first packaging structure 10 includes a first substrate 101, a plurality of electronic components 103 mounted on the first substrate 101, and a first plastic package 102 packaged on the first substrate 101;

The second packaging structure 20, the second packaging structure 20 is a stacked packaging structure, including two second substrates, which are respectively the second substrate 211 and the second substrate 221, and several The electronic components 213 and 223 are respectively molded on the second substrate 211 and the second substrate 221 to form second plastic packages 212 and 222;

Metal conductive pillars, the first package structure 10 and the second package structure 20 are electrically connected through several metal conductive pillars, specifically, in this embodiment, the first metal substrate 211 and the first substrate 101 are electrically connected. The conductive posts 31 , the second metal conductive posts 32 electrically connected to the second substrate 221 and the second substrate 211 , and the third metal conductive posts 33 electrically connected to the second substrate 221 and the first substrate 101 .

Both the second substrates 211 and 221 in the present invention need to be electrically connected to the first substrate 101. It should be understood that the electrical connection in this embodiment is direct or indirect electrical connection. In other embodiments It is also possible to only set the first metal conductive column 31 and the second metal conductive column 32, or the first metal conductive column 31 and the third metal conductive column 33, or the second metal conductive column 32 and the third metal conductive column 33, without setting The two substrates of the metal conductive pillars can be electrically connected indirectly through other conductive pillars, and the purpose of electrical conduction can also be achieved.

The first plastic package 102 and the second plastic package 212, 222 are respectively located between two adjacent substrates, and the electronic components on the lower substrate are plastic-sealed, and the substrates installed with electronic components can be packaged as a whole through several plastic packages , and the package structure is stable.

The electronic components in the present invention include capacitors, resistors, inductors, front-mount chips, flip-chips, etc., which can be installed on the substrate in the way of front-mount packaging or flip-chip packaging. As in this embodiment, the electronic components 103 and 213 are respectively mounted on the first substrate 101 and the second substrate 211 by means of front-mount packaging, and the electronic components 103 and 213 are also provided with the first substrate 101 and the second substrate respectively. The gold wires (not numbered) electrically connected to the substrate 211 ; and the electronic components 223 are mounted on the second substrate 221 by means of front-mount packaging, which does not need to be provided with gold wires. In other embodiments, other installation methods may also be used for installation.

The encapsulation method of the AIO encapsulation structure in this embodiment will be described in detail below with reference to the accompanying drawings.

Referring to Figures 2a and 2b, the first substrate 101 is first prepared, and the substrate is subjected to processes such as baking and dehumidification;

Various electronic components 103, such as various small and ultra-small capacitors, resistors, inductors, chips, etc., are dipped in flux in an automatic reflow furnace, and reflow soldered on the first substrate 101;

Finally, use an automatic cleaning machine to clean away the flux.

As shown in Figure 2c and 2d, wire bonding is performed on the electronic components that need to be wired. This step is aimed at the electronic components that are packaged in the front package. If the electronic components are flip-chip packaged, this step can be omitted.

Before wire bonding, the surface of the first substrate 101 is plasma cleaned, and then gold wires, such as alloy wires or copper wires, are used for wire bonding to electrically connect the electronic components 103 to the first substrate 101 through gold wires.

As shown in FIG. 2e, a second substrate 211 is provided, and the first substrate 101 and the second substrate 211 with all electronic components mounted on the first layer are molded together by a plastic sealing process to obtain the package shown in FIG. 2f.

Firstly, the first substrate 101 with the electronic components 103 installed is loaded into the automatic compression molding equipment, and the automatic compression molding equipment turns the first substrate 103 upside down and attaches it to the upper mold by adsorption;

Put the second substrate 211 into the automatic compression molding equipment, specifically: the automatic compression molding equipment puts a release film (not shown) on the lower mold, and fixes it with vacuum adsorption, then positions the second substrate 211, and places it on the on the film;

Sprinkle granular molding compound evenly on the second substrate 211. After the plastic sealing compound melts under the high temperature of the mold, the automatic compression mold sets another upper mold and lower mold to close the mold, and the plastic sealing is completed under pressurized conditions. The first plastic package 102 is formed on the first substrate 101 and the second substrate 211 .

After the mold is opened, the release film is removed, and the first substrate 101 with all electronic components has been combined with the second substrate 211 through the first plastic package 102 .

As shown in FIG. 2 g , several first metal conductive pillars 31 are formed between the second substrate 211 and the first substrate 101 , and the first substrate 101 and the second substrate 211 can be electrically connected through the first metal conductive pillars 31 .

Specifically, this process is similar to the substrate process: through holes are drilled, metal conductive paste (such as copper paste, etc.) is poured, and the first substrate 101 and the second substrate 211 are connected.

Various methods, such as mechanical drilling, laser drilling, etc., can be used to open the reserved holes of the first substrate 101 and the second substrate 211 . As in this embodiment, the copper paste is filled first, and then baked to conduct the first substrate 101 and the second substrate 211 .

It should be understood that in other embodiments, the electrical connection between the first substrate 101 and the second substrate 211 may also be achieved by methods such as electroplating metal layer conduction, metal sputtering and the like.

Referring to Figures 2h and 2i, several electronic components 213 are installed on the second substrate 211. The installation process is exactly the same as the process of installing electronic components 103 on the first substrate 101, and will not be repeated here.

As shown in FIG. 2j, another second substrate 221 is provided, and the second substrate 211 and the second substrate 221 with all electronic components mounted thereon are molded together by a plastic sealing process to obtain the package shown in FIG. 2k. A second plastic package 212 is formed between the second substrate 211 and the second substrate 221 . The molding process is completely the same as that of the first substrate 101 and the second substrate 211 , and will not be repeated here.

As shown in FIG. 2l, after the second substrate 221 is packaged, the second metal conductive column 32 is formed on the second substrate 221 and the second substrate 211, and the third metal conductive column 32 is formed on the second substrate 221 and the first substrate 101 at the same time. Conductive column 33. This process is exactly the same as the above-mentioned process of drilling holes and filling copper paste on the second substrate 211 and the first substrate 101 , and will not be repeated here.

Further, a number of electronic components 223 are installed on the second substrate 221, and can also be plastic-sealed through the above-mentioned plastic packaging process. After all the plastic packaging is completed, the above-mentioned package can be cut to obtain several AIO packages as shown in FIG. 1 structure.

In this embodiment, the first substrate 101 and the second substrates 211 and 221 respectively undergo a one-step molding process to form the first plastic package 102 and the second plastic package 212 on the first substrate 101 and the second substrate 211 and 221 respectively. , 222, and the first substrate 101, the first plastic package 102, the second substrate 211, the second plastic package 212, the second substrate 221, and the second plastic package 222 are seamlessly connected, and the plastic sealing process is simple and convenient , effectively improving the stability and reliability of the AIO packaging structure.

Embodiment two:

Referring to Figure 3, the AIO packaging structure in Embodiment 2 of the present invention includes:

The first packaging structure 10 includes a first substrate 101, a plurality of electronic components 103 mounted on the first substrate 101, and a first plastic package 102 packaged on the first substrate 101;

The second packaging structure 20, the second packaging structure 20 is a stacked packaging structure, including three second substrates, respectively the second substrate 211, the second substrate 221 and the second substrate 231, the second substrate 211, the second substrate 221 A number of electronic components 213, 223 and 233 are respectively mounted on the second substrate 231, and second plastic packages 212, 222 and 232 are respectively formed on the second substrate 211, the second substrate 221 and the second substrate 231;

Metal conductive pillars, the first package structure 10 and the second package structure 20 are electrically connected through several metal conductive pillars, specifically, in this embodiment, the first metal substrate 211 and the first substrate 101 are electrically connected. The conductive column 31, the second metal conductive column 32 electrically connected to the second substrate 221 and the second substrate 211, the third metal conductive column 33 electrically connected to the second substrate 221 and the first substrate 101, electrically connected The second substrate 231 and the fourth metal conductive column 34 of the first substrate 101, the fifth metal conductive column 35 electrically connected to the second substrate 231 and the second substrate 211, and the second substrate 231 and the second conductive column electrically connected The sixth metal conductive pillar 36 of the substrate 221 .

Similarly, in this embodiment, six metal conductive columns may not be provided, but three metal conductive columns may be provided as required, such as only the first, third and fourth metal conductive columns, or the first, second and third The six metal conductive pillars can achieve the purpose of electrically connecting all the substrates, that is, all the second substrates are electrically connected directly or indirectly to the first substrate.

Wherein, in this embodiment, the uppermost second substrate 231 is provided with a heat dissipation layer 40 , and the second overtime 231 and the heat dissipation layer 40 are plastic-sealed by a second plastic package 232 . The heat dissipation layer 40 may be a metal heat dissipation layer, and when it is a metal heat dissipation layer, the upper part of the AIO packaging structure may also function as a signal shield.

The packaging method of the packaging structure in this embodiment can be similar to the packaging method in Embodiment 1. After the second substrate 221 is packaged, continue to use the same plastic packaging process to plastic-seal the second substrate 231 on the second substrate 221, and then Drill holes and fill copper paste on the second substrate 231 to form the fourth metal conductive column 34, the fifth metal conductive column 35 and the sixth metal conductive column 36; then install the electronic components 233 on the second substrate 231, and then The entire package body is plastic-sealed on the heat dissipation layer 40 through the same plastic-seal process, as shown in FIGS. 4 a to 4 c , and finally cut to form the AIO package structure shown in FIG. 3 .

Embodiment three:

The AIO packaging structure in this embodiment is exactly the same as the AIO packaging structure in Embodiment 2, but the difference lies in its packaging method. For the sake of easy understanding, only the packaging steps of the substrate are described in this embodiment, and the packaging steps on the substrate The steps of installing electronic components, drilling holes, and filling copper paste are not specifically described.

In the first embodiment, the second substrate 211 , the second substrate 221 , the second substrate 231 and the heat dissipation layer 40 are sequentially packaged on the first substrate 101 , while in this embodiment the second substrate 211 , the second substrate 211 , and the The second substrate 221 forms a first package, and the heat dissipation layer 40 is packaged on the second substrate 231 to form a second package, and then the first package and the second package are plastic-sealed to obtain the package structure shown in FIG. 4 a .

It should be understood that other packaging steps can also be used in this embodiment, such as packaging the second substrate 211 on the first substrate 101 to form a first package, while packaging the second substrate 231 on the second substrate 221 and heat dissipation. layer 40 to form a second package, and then plastic-encapsulate the first package and the second package to obtain the package structure shown in FIG. 4a; or package the second substrate 211 on the first substrate 101 to form the first package, while The second substrate 231 is packaged on the second substrate 221 to form a second package, and then the first package and the second package are plastic-sealed, and then the entire package and the heat dissipation layer are plastic-sealed.

Embodiment four:

The AIO packaging structure in this embodiment is similar to the packaging structure in Embodiment 2, except that, as shown in Figure 5d, a metal shielding layer 50 surrounding the AIO packaging structure is provided around each AIO packaging structure, and in The upper part of the AIO packaging structure is provided with a heat dissipation layer 40 , and the heat dissipation layer 40 is a metal heat dissipation layer, so that the five sides of the AIO packaging structure are completely covered and shielded by metal.

Preferably, when designing the first substrate at the bottom, a grounding circuit that communicates with the AIO packaging structure can be directly designed, and the bottom of the entire first substrate can be grounded and shielded. In this way, the six sides of the AIO packaging structure except the electrical signal interface have been It can be completely covered by metal, so that it can shield external signals and avoid external signal interference.

As shown in Figures 5a-5d, after all the substrates and heat dissipation layers are plastic-sealed, the entire AIO package is half-cut to the first substrate, but the first substrate is not cut off, and several receiving grooves 51 are formed on the AIO package. Then copper paste is poured into the receiving tank 51 and cured. After the curing is completed, cutting is performed along the middle of the receiving tank 51 , and the metal shielding layer 50 is distributed around the obtained AIO packaging structure.

Embodiment five:

As shown in FIG. 6, in another embodiment of the present invention, the AIO packaging structure is basically the same as that in Embodiment 1, the difference is that in this embodiment, the inner part of the AIO packaging structure is provided with a metal shielding layer 50, The metal shielding layer 50 can shield electrical signals inside the AIO packaging structure.

The preparation process of the metal shielding layer 50 in this embodiment is basically the same as that in Embodiment 5, the difference is that in this embodiment, after the second substrate 221 is plastic-sealed, the package body is half-cut to the first substrate 101 to form several Then, pour copper paste into the storage tank and solidify it. After curing, continue to package on the package, and finally cut along the storage tank. Only part of the side of the AIO package structure obtained by cutting in this way is equipped with a metal shielding layer. .

It should be understood that, in this embodiment, shielding the electrical signal between the second substrate 221 and the first substrate 101 is used as an example for illustration. The receiving groove between the second substrate 221 and the second substrate 211 is filled with copper paste and cured, and finally the AIO packaging structure obtained by cutting can shield the electrical signal between the second substrate 221 and the second substrate 211, so that it can be used according to actual needs. Selectively design the area of the metal shield.

Embodiment six:

In a specific embodiment of the present invention, as shown in FIG. 7 a , the AIO package structure is an optical-electric hybrid AIO package structure, and several flip-chip optical communication chips 223 are arranged on the second substrate 221 .

Further, as shown in FIG. 7b, a transparent molding compound 222 may also be provided on the optical communication chip 223, and the transparent molding compound 222 can protect the optical communication chip 223 without affecting the light extraction efficiency of the optical communication chip.

Embodiment seven:

In a specific embodiment of the present invention, as shown in FIG. 8, the AIO packaging structure is an optical-electric hybrid AIO packaging structure, the top of the AIO packaging structure is provided with a heat dissipation layer 40, and the first substrate 101 is an integrated optical-electrical structure. The first substrate 101 is provided with a number of optical communication chips 103, the optical communication chips 103 are installed in the way of front mounting and gold wire, the optical-electrical integrated substrate has a number of optical communication chips 103 for communication the optical channel. Such a setting will not affect the heat dissipation of the chip with high heat generation on the top, and at the same time, it can greatly increase the data input and output rate through optical communication.

Embodiment eight:

In another specific embodiment of the present invention, as shown in Figures 9a and 9b, based on the biometric AIO packaging structure, a fingerprint identification chip 223 is provided on the second substrate 221, and the fingerprint identification chip 223 can be the The flip-chip mounting on the second substrate 221 may also be the front-mounting on the second substrate 221 as shown in FIG. 9 b and the electrical connection with the second substrate 221 is performed with gold wires. A cover plate 40 is formed on the second substrate 221 , the cover plate may be glass, sapphire or other high-k value cover plate, and a second plastic package 222 is formed between the cover plate 40 and the second substrate 221 .

Embodiment nine:

In another specific embodiment of the present invention, as shown in Figures 10a and 10b, based on the AIO packaging structure of the image sensor, the image sensor chip 223 is arranged on the second substrate 221, and a second plastic package is formed on the second substrate 221. body 222, the image sensor chip 223 is exposed outside the second plastic package body 222, and can be packaged with Film-Mold (film mold), and a micro lens can be installed on the top of the image sensor to transform into a camera, and it can also be used in other embodiments At the same time, the packaging of iris recognition chips, face recognition chips, or other image-related recognition chips is completed.

Wherein, in FIG. 10a, the image sensor chip 223 is electrically connected to the second substrate 221 by using gold wires, while in FIG. (not shown), the electrical connection between the top surface of the image sensor chip 223 and the second substrate 221 can be realized through the TSV conductive pillars.

It should be understood that the TSV conductive connection manner in this embodiment can also be applied to other embodiments, and will not be described in other embodiments by way of example.

It can be seen from the above technical solutions that the AIO packaging structure and packaging method of the present invention have the following advantages:

By setting one or more second substrates on the first substrate, the adjacent substrates are plastic-sealed through the plastic packaging process, and all the substrates are electrically connected, because electronic components such as capacitors, resistors, and chips can be installed on each substrate , the area occupied by the substrate can be reduced through stacked installation, which meets the requirements of miniaturized chip packaging;

The metal conductive pillar can electrically connect different substrates, and the signal is transmitted on different substrates through the metal conductive pillar. Compared with the traditional packaging structure, the present invention can shorten the transmission distance of the signal and improve the operating speed of the device;

The AIO packaging structure can be modularly combined with other same or different packaging structures to form a modular device. When there is a problem with a certain packaging structure of the device, it can be replaced, which avoids the problem of overall replacement of the traditional packaging structure and greatly reduces maintenance cost.

It will be apparent to those skilled in the art that the invention is not limited to the details of the above-described exemplary embodiments, but that the invention can be embodied in other specific forms without departing from the spirit or essential characteristics of the invention. Accordingly, the embodiments should be regarded in all points of view as exemplary and not restrictive, the scope of the invention being defined by the appended claims rather than the foregoing description, and it is therefore intended that the scope of the invention be defined by the appended claims rather than by the foregoing description. All changes within the meaning and range of equivalents of the elements are embraced in the present invention. Any reference sign in a claim should not be construed as limiting the claim concerned.

In addition, it should be understood that although this specification is described according to implementation modes, not each implementation mode only includes an independent technical solution, and this description in the specification is only for clarity, and those skilled in the art should take the specification as a whole , the technical solutions in the various embodiments can also be properly combined to form other implementations that can be understood by those skilled in the art.

Claims (17)

1. a kind of AIO package structure, it is characterized in that, described AIO package structure comprises: The first packaging structure includes a first substrate, a plurality of electronic components mounted on the first substrate, and a first plastic package located above the first substrate and plastic-sealed with a plurality of electronic components on the first substrate; The second packaging structure, the second packaging structure is located above the first packaging structure, the second packaging structure and the first substrate are seamlessly plastic-sealed through the first plastic package, the second packaging structure includes a second substrate, and is installed on the second substrate The second substrate is electrically connected to the first substrate. 2 . The AIO packaging structure according to claim 1 , wherein a second plastic package that plastic-seals a plurality of electronic components on the second substrate is formed above the second substrate. 3 . 3. The AIO packaging structure according to claim 1, wherein the second packaging structure is a stacked structure formed by stacking a plurality of second substrates and a plurality of second plastic packages, each second substrate Electronic components are mounted on the substrates respectively, and the adjacent second substrates are seamlessly plastic-sealed by the second plastic packaging body. 4 . The AIO packaging structure according to claim 3 , wherein each second substrate in the second packaging structure is electrically connected to the first substrate directly or indirectly. 5 . The AIO package structure according to claim 4 , wherein the second substrate is electrically connected to the first substrate or a different second substrate through metal conductive pillars. 6 . The AIO package structure according to claim 1 , wherein a cover plate is provided on the top of the second package structure in the AIO package structure. 7 . The AIO package structure according to claim 1 , wherein a heat dissipation layer is arranged on the top of the second package structure in the AIO package structure. 8. The AIO packaging structure according to claim 1, wherein a metal shielding layer is provided on all or part of the top and side surfaces of the AIO packaging structure. 9. The AIO packaging structure according to claim 1, wherein the electronic components include capacitors, resistors, inductors, front-mount chips, and flip-chips. 10. An AIO packaging method, characterized in that the method comprises: providing a first substrate, and installing several electronic components on the first substrate; providing a second substrate, performing seamless plastic sealing on the second substrate and the first substrate on which a plurality of electronic components are installed, and forming a first plastic package above the first substrate and between the second substrate; electrically conducting the second substrate and the first substrate; installing a plurality of electronic components on the second substrate; Cut the above package structure to obtain several AIO package structures. 11. The AIO packaging method according to claim 10, characterized in that, after the "installing several electronic components on the second substrate", it also includes: The second substrate is plastic-sealed, and a second plastic-sealed body that is plastic-sealed on several electronic components on the second substrate is formed on the second substrate. 12. The AIO packaging method according to claim 11, further comprising: A heat dissipation layer is formed on the second plastic package. 13. The AIO packaging method according to claim 10, characterized in that, after the "installing several electronic components on the second substrate", it also includes: The cover plate and the second substrate on which several electronic components are installed are plastic-sealed, and a second plastic package is formed above the second substrate and between the cover plate. 14. The AIO packaging method according to claim 11, characterized in that, after the "installing several electronic components on the second substrate", it also includes: Another second substrate is provided, the second substrate is plastic-sealed on the original package structure, and a second plastic package is formed between the second substrates and plastic-sealed on several electronic components on the second substrate; electrically conducting the uppermost second substrate and the first substrate; installing a number of electronic components on the uppermost second substrate; The above steps are repeated to form a stacked second packaging structure on the first substrate. 15. The AIO packaging method according to claim 11, characterized in that, after the "installing several electronic components on the second substrate", it also includes: providing another package structure including at least one second substrate, and plastic-sealing the package structure on the original package structure; electrically conducting the two package structures; The above steps are repeated to form several stacked packaging structures on the first substrate. 16. The AIO packaging method according to claims 10, 14, and 15, wherein the "electrical conduction" is specifically: Make a through hole between the second substrate and the first substrate, or between the second substrate and the second substrate, and pour metal conductive paste into the through hole, and form a metal conductive column after baking, and the second substrate and the first substrate pass through The metal conductive pillars are electrically connected directly or indirectly. 17. The AIO packaging method according to claim 10, wherein the AIO packaging method further comprises: A metal shielding layer is formed on all or part of the area between the first substrate and the second substrate in the AIO package structure.