CN103107132A - Apparatus for manufacturing flat panel display - Google Patents
Apparatus for manufacturing flat panel display Download PDFInfo
- Publication number
- CN103107132A CN103107132A CN2012104482447A CN201210448244A CN103107132A CN 103107132 A CN103107132 A CN 103107132A CN 2012104482447 A CN2012104482447 A CN 2012104482447A CN 201210448244 A CN201210448244 A CN 201210448244A CN 103107132 A CN103107132 A CN 103107132A
- Authority
- CN
- China
- Prior art keywords
- area
- chamber
- substrates
- processing
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/54—Apparatus specially adapted for continuous coating
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/04—Apparatus for manufacture or treatment
- H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
- H10P72/0462—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the construction of the processing chambers, e.g. modular processing chambers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/04—Apparatus for manufacture or treatment
- H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
- H10P72/0464—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the construction of the transfer chamber
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
- H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
- H10P72/3302—Mechanical parts of transfer devices
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Physical Vapour Deposition (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
本发明公开了一种用于制造平板显示器的设备,该设备包括多个处理室、传递室、加载室和卸载室。所述多个处理室均形成有内部空间,在该内部空间中处理至少两个基板。所述传递室沿第一方向布置在多个处理室之间,并且所述传递室包括传递机器人,该传递机器人在沿垂直于第一方向的第二方向直线往复运动时将未处理的基板供给处理室或者从处理室运出已处理的基板。所述加载室连接到传递室的一侧并且容纳将要供给传递室的基板。所述卸载室连接到传递室的另一侧并且容纳从传递室运出的基板。所述传递机器人在沿第二方向直线往复运动时控制基板顺序地供给处理室或者从处理室运出。
The invention discloses an apparatus for manufacturing flat panel displays, which includes a plurality of processing chambers, transfer chambers, loading chambers and unloading chambers. Each of the plurality of processing chambers is formed with an inner space in which at least two substrates are processed. The transfer chamber is arranged between a plurality of processing chambers along a first direction, and includes a transfer robot that supplies unprocessed substrates while linearly reciprocating in a second direction perpendicular to the first direction. The processing chamber or the processed substrate is transported out of the processing chamber. The loading chamber is connected to one side of the transfer chamber and accommodates substrates to be supplied to the transfer chamber. The unloading chamber is connected to the other side of the transfer chamber and accommodates substrates carried out from the transfer chamber. The transfer robot controls the substrates to be sequentially supplied to or transported out of the processing chamber while linearly reciprocating in the second direction.
Description
技术领域technical field
本发明涉及一种用于制造平板显示器的设备,并且更特别地,涉及一种有机薄膜可以淀积在用于有机发光显示器的平板上的用于制造平板显示器的设备。The present invention relates to an apparatus for manufacturing a flat panel display, and more particularly, to an apparatus for manufacturing a flat panel display in which an organic thin film can be deposited on a flat panel for an organic light emitting display.
背景技术Background technique
在制造平板显示器(FPD)的工艺中,多次重复进行诸如用于在基板上淀积薄膜的淀积工艺的基板处理工艺;光刻工艺;蚀刻工艺;用于去除在所述工艺中产生的残余物的洗涤、干燥等清洁工艺;各种表面处理工艺;等等。每个工艺在处理室(process chamber,PM)中进行。In the process of manufacturing a flat panel display (FPD), a substrate treatment process such as a deposition process for depositing a thin film on a substrate; a photolithography process; an etching process; Cleaning processes such as washing and drying of residues; various surface treatment processes; etc. Each process is performed in a process chamber (PM).
这种处理室与传递室一起构成群集(cluster)。在一般群集中,多个处理室连接到一个传递室。就是说,该群集通常包括:处理室,在该处理室中进行基板处理工艺;和传递室,通过该传递室从处理室传递已处理的基板。Such processing chambers form a cluster together with the transfer chamber. In a typical cluster, multiple processing chambers are connected to a transfer chamber. That is, the cluster typically includes: a processing chamber in which a substrate processing process is performed; and a transfer chamber through which processed substrates are transferred from the processing chamber.
同时,存在一种用于有机发光显示(organic light emitting display,OLED)器的平板,该平板作为可以制造成具有前述结构的常规群集的其中一种平板。有机发光显示器是使用以下原理的自发光显示器:当电流在荧光或磷光有机薄膜中流动时,在电子和空穴在有机层中结合时发出光线。随着最近智能电话的广泛传播,用于以低功率操作的有机发光显示器的平板的使用已经增加。因此,提高用于有机发光显示器的平板的生产率的需求增加。Meanwhile, there is a flat panel for an organic light emitting display (OLED) as one of the flat panels that can be manufactured as a conventional cluster having the aforementioned structure. An organic light emitting display is a self-luminous display using the principle that when an electric current flows in a fluorescent or phosphorescent organic thin film, light is emitted when electrons and holes combine in the organic layer. With the recent wide spread of smartphones, the use of flat panels for organic light emitting displays operating at low power has increased. Therefore, there is an increased need to improve the productivity of flat panels for organic light emitting displays.
在制造用于有机发光显示器的平板时,在基板上淀积有机薄膜的淀积工艺是必要的。为进行淀积工艺,必须预先进行基板传递到处理室中的工艺、掩模与基板对齐的工艺等等。然而,常规制造设备不可能在传递基板和对齐掩模时进行该淀积工艺。换句话说,由于淀积工艺与传递基板的工艺和对齐掩模的工艺分别进行,存在整个工艺时间增加的问题。A deposition process for depositing an organic thin film on a substrate is necessary when manufacturing a flat panel for an organic light emitting display. In order to perform the deposition process, a process of transferring the substrate into the processing chamber, a process of aligning the mask with the substrate, and the like must be performed in advance. However, it is not possible for conventional manufacturing equipment to perform this deposition process while transferring the substrate and aligning the mask. In other words, since the deposition process is performed separately from the process of transferring the substrate and the process of aligning the mask, there is a problem that the overall process time increases.
发明内容Contents of the invention
因此,本发明用于解决前述问题,并且本发明的一方面提供一种用于制造平板显示器的设备,其中一个处理室容纳两个基板,因此在另一个基板进行淀积工艺时一个基板被传递且对齐,从而最小化在基板上淀积有机薄膜的总工艺时间。Therefore, the present invention serves to solve the aforementioned problems, and an aspect of the present invention provides an apparatus for manufacturing flat panel displays in which one process chamber accommodates two substrates so that one substrate is transferred while the other substrate undergoes a deposition process. and aligned, thereby minimizing the total process time for depositing the organic thin film on the substrate.
根据本发明的一方面,提供一种用于制造平板显示器的设备,该设备包括:多个形成有内部空间的处理室,在所述内部空间中处理至少两个基板;传递室,该传递室沿第一方向布置在所述多个处理室之间,并且所述传递室包括传递机器人,该传递机器人在沿垂直于所述第一方向的第二方向直线往复运动时将未处理的基板供给所述处理室或者从所述处理室运出已处理的基板;加载室,该加载室连接到所述传递室的一侧并且容纳将要供给所述传递室的基板;以及卸载室,该卸载室连接到所述传递室的另一侧并且容纳从所述传递室运出的基板,所述传递机器人在沿所述第二方向直线往复运动时控制所述基板顺序地供给所述处理室或者从所述处理室运出,并且在所述处理室中,一个基板受到处理气体的淀积,并且同时沿所述第二方向被传递且对齐另一个基板。According to an aspect of the present invention, there is provided an apparatus for manufacturing a flat panel display, the apparatus comprising: a plurality of processing chambers formed with internal spaces in which at least two substrates are processed; a transfer chamber, the transfer chamber arranged between the plurality of processing chambers in a first direction, and the transfer chamber includes a transfer robot that feeds unprocessed substrates while linearly reciprocating in a second direction perpendicular to the first direction the processing chamber or carrying out processed substrates from the processing chamber; a loading chamber connected to one side of the transfer chamber and accommodating substrates to be supplied to the transfer chamber; and an unloading chamber connected to the other side of the transfer chamber and accommodate substrates transported out of the transfer chamber, the transfer robot controls the substrates to be sequentially supplied to the processing chamber or transferred from The process chamber is transported out and in the process chamber one substrate is subjected to deposition of process gases while the other substrate is conveyed and aligned in the second direction.
处理室可以包括:本体构件,该本体构件具有内部空间,该内部空间包括第一区域和邻近所述第一区域的第二区域,并且所述本体构件在一侧打开以与所述传递室连通;支撑单元,该支撑单元分别安装在所述第一区域和所述第二区域中,以支撑和对齐传递到所述本体构件的基板;淀积源,该淀积源布置在所述本体构件的内部空间中并且将处理气体喷射到基板上;驱动单元,该驱动单元驱动所述淀积源沿所述第二方向直线往复运动;以及控制器,该控制器控制所述驱动单元,以驱动所述淀积源在所述第一区域和所述第二区域之间往复运动。The processing chamber may include: a body member having an inner space including a first region and a second region adjacent to the first region, and the body member is opened at one side to communicate with the transfer chamber a support unit installed in the first area and the second area, respectively, to support and align the substrate transferred to the body member; a deposition source arranged in the body member and injecting processing gas onto the substrate; a drive unit that drives the deposition source to reciprocate linearly along the second direction; and a controller that controls the drive unit to drive The deposition source reciprocates between the first area and the second area.
所述控制器可以控制所述驱动单元,以重复在所述第一区域内沿所述第二方向从所述第一区域的初始位置移动所述淀积源时处理一个基板的工艺以及在所述第二区域内沿所述第二方向朝向所述第二区域移动所述淀积源并返回所述初始位置时处理另一个基板的工艺,以及在所述第一区域的基板和所述第二区域的基板都被处理之后,所述传递机器人可以从所述第一区域和所述第二区域运出已处理的基板,并且将新的基板供给所述第一区域和所述第二区域。The controller may control the driving unit to repeat a process of processing one substrate while moving the deposition source from an initial position of the first area in the second direction in the first area and A process of processing another substrate when the deposition source is moved toward the second region along the second direction in the second region and returns to the initial position, and the substrate in the first region and the first region After the substrates in both regions are processed, the transfer robot can transport processed substrates from the first region and the second region, and supply new substrates to the first region and the second region .
所述控制器可以控制所述驱动单元,以重复在所述淀积源沿所述第二方向顺序地移动到所述第一区域和所述第二区域时处理所述第一区域中的基板和所述第二区域中的基板的工艺以及在所述淀积源沿所述第二方向顺序地移动到所述第二区域和所述第一区域时处理所述第二区域中的基板和所述第一区域中的基板的工艺,以及在处理所述第一区域中的基板之后并且正在处理所述第二区域中的基板时,所述传递机器人可以从所述第一区域运出已处理的基板并且将新的基板供给所述第一区域,然后在处理所述第二区域中的基板之后并且正在处理所述第一区域中的基板时,所述传递机器人可以从所述第二区域运出已处理的基板并且将新的基板供给所述第二区域。The controller may control the driving unit to repeatedly process the substrate in the first area while the deposition source is sequentially moved to the first area and the second area in the second direction. and the process of the substrate in the second area and processing the substrate in the second area and the substrate in the second area when the deposition source sequentially moves to the second area and the first area along the second direction The processing of the substrates in the first area, and after processing the substrates in the first area and while processing the substrates in the second area, the transfer robot can transport out the processed substrates from the first area processed substrates and feed new substrates to the first area, then after processing substrates in the second area and while substrates in the first area are being processed, the transfer robot can transfer from the second A zone carries out processed substrates and new substrates are supplied to the second zone.
所述传递机器人可以通过所述传递室将基板从所述加载室供给所述多个处理室中的第一处理室,通过所述传递室将在所述第一处理室中完成处理的基板从所述第一处理室运出且供给所述多个处理室中的第二处理室,并且通过所述传递室将在所述第二处理室中完成处理的基板从所述第二处理室运出到所述卸载室。The transfer robot may supply the substrate from the loading chamber to the first processing chamber among the plurality of processing chambers through the transfer chamber, and transfer the substrate processed in the first processing chamber to the first processing chamber through the transfer chamber. The first processing chamber is transported out and supplied to a second processing chamber of the plurality of processing chambers, and the substrates processed in the second processing chamber are transported from the second processing chamber through the transfer chamber. out into the unloading chamber.
所述淀积源可以包括分别对应于将同时淀积的一种或者多种材料的一个或者多个蒸发源。The deposition sources may include one or more evaporation sources respectively corresponding to one or more materials to be simultaneously deposited.
所述淀积源可以布置为多个并且沿所述第二方向间隔开。The deposition sources may be arranged in plurality and spaced apart along the second direction.
所述多个处理室可以彼此间隔开并且沿所述第二方向布置在所述传递室的横向侧。The plurality of processing chambers may be spaced apart from each other and arranged at lateral sides of the transfer chamber along the second direction.
所述传递室可以包括两个传递机器人,并且所述传递机器人可以沿第一方向彼此间隔开并且布置成沿第二方向直线往复运动。The transfer chamber may include two transfer robots, and the transfer robots may be spaced apart from each other in the first direction and arranged to linearly reciprocate in the second direction.
附图说明Description of drawings
结合附图从下面对示例性实施例的描述,本发明的上述和/或其它方面将变得显而易见且更容易理解,其中:The above and/or other aspects of the present invention will become apparent and more readily understood from the following description of exemplary embodiments when taken in conjunction with the accompanying drawings, in which:
图1是示意性地示出根据示例性实施例的用于制造平板显示器的设备的平面图;FIG. 1 is a plan view schematically illustrating an apparatus for manufacturing a flat panel display according to an exemplary embodiment;
图2是示出用于制造图1的平板显示器的设备中的处理室的内部的侧视图;2 is a side view showing the inside of a processing chamber in the apparatus for manufacturing the flat panel display of FIG. 1;
图3示出用于制造图1的平板显示器的设备中的处理室的外部;Figure 3 shows the exterior of a processing chamber in the apparatus for manufacturing the flat panel display of Figure 1;
图4a-图4g示出在用于制造图1的平板显示器的设备中处理基板的同时传递基板的顺序进行的工艺;Figures 4a-4g illustrate a sequential process of transferring substrates while handling them in the apparatus for manufacturing the flat panel display of Figure 1;
图5示意性地示出用于制造图1的平板显示器的设备中的处理室的另一个例子;Fig. 5 schematically shows another example of a processing chamber in the apparatus for manufacturing the flat panel display of Fig. 1;
图6是示意性地示出根据本发明的另一个示例性实施例的用于制造平板显示器的设备的平面图;以及6 is a plan view schematically showing an apparatus for manufacturing a flat panel display according to another exemplary embodiment of the present invention; and
图7是示意性地示出根据本发明的示例性实施例的用于制造平板显示器的设备的平面图。FIG. 7 is a plan view schematically illustrating an apparatus for manufacturing a flat panel display according to an exemplary embodiment of the present invention.
具体实施方式Detailed ways
下面,将参考附图详细描述根据本发明的用于制造平板显示器的设备的示例性实施例。Hereinafter, exemplary embodiments of an apparatus for manufacturing a flat panel display according to the present invention will be described in detail with reference to the accompanying drawings.
图1是示意性地示出根据示例性实施例的用于制造平板显示器的设备的平面图,图2是示出用于制造图1的平板显示器的设备中的处理室的内部的侧视图,图3示出用于制造图1的平板显示器的设备中的处理室的外部,图4a-图4g示出在用于制造图1的平板显示器的设备中处理基板的同时传递基板的顺序进行的工艺,以及图5示意性地示出用于制造图1的平板显示器的设备中的处理室的另一个例子。1 is a plan view schematically showing an apparatus for manufacturing a flat panel display according to an exemplary embodiment, and FIG. 2 is a side view showing an inside of a processing chamber in the apparatus for manufacturing a flat panel display of FIG. 1 , FIG. 3 shows the exterior of a processing chamber in the apparatus for manufacturing the flat panel display of FIG. 1 , and FIGS. 4 a - 4 g illustrate the sequential process of transferring substrates while processing them in the apparatus for manufacturing the flat panel display of FIG. 1 , and FIG. 5 schematically shows another example of a processing chamber in the apparatus for manufacturing the flat panel display of FIG. 1 .
参考图1-图5,根据实施例的用于制造平板的设备100包括处理室110、传递室120、加载室130和卸载室140,对于用于有机发光显示器的平板在其中可以执行有机薄膜的淀积处理。Referring to FIGS. 1-5 , an
处理室110形成有用于处理至少两个基板10的内部空间,从而处理基板10。在处理室110中,用于制造有机发光显示器所需的有机薄膜淀积在基板10上。The
传递室120与多个处理室110连接且沿第一方向L1放置在多个处理室110之间。传递室120包括传递机器人123,该传递机器人沿垂直于第一方向L1的第二方向L2往复运动,同时将未处理的基板10供给处理室110或从处理室110运出已处理的基板10。传递室120可以保持为真空。下面将描述这个传递室120。The
加载室130连接到传递室120的一侧且容纳将供给传递室120的未处理的基板10。加载室130的内部空间容纳多个基板10,将在处理室110中进行的处理工艺还未施加于该多个基板10,并且该多个基板10在加载室130中处于准备状态。The
卸载室140连接到传递室120的另一侧且容纳完成处理且从传递室120中运出的基板10。卸载室140的内部空间容纳多个基板10,该多个基板在卸载室140中处于准备状态,以便在前一个处理室110中处理后在后一个处理室110中处理。The
根据本发明的实施例,用于制造平板显示器的设备100的处理室110对至少两个基板10进行处理。而且,处理室110设置为沿第一方向L1供给和运出至少两个基板10,使得处理气体可以淀积在一个基板10上,同时可以沿垂直于第一方向L1的第二方向L2传递和对齐另一个基板10。为此目的,处理室110贯穿形成有至少两个开口115,每个开口115大到基板10可以穿过。According to an embodiment of the present invention, the
参考图2和3,处理室110包括本体构件111、支撑单元112、淀积源113、驱动单元114和控制器(未示出)。Referring to FIGS. 2 and 3 , the
本体构件111形成有内部空间。内部空间包括第一区域A和邻近第一区域A的第二区域B。这里,第一区域A和第二区域B可以分别对应于当本体构件11的内部空间精确地竖直分成两半时的空间。如上面描述的,本体构件111可以在一侧形成有至少两个开口115。开口115可以平行地布置在离本体构件111的底部的相同高度。通过开口115,基板10可以进入和离开传递室120。The
支撑单元112支撑和对齐传递到本体构件111中的基板10。这里,一个支撑单元112放置在第一区域A中,并且另一个支撑单元112放置在第二区域B中。两个支撑单元112可以沿第二方向L2布置成尽可能彼此靠近。这将通过减小支撑单元112占据的空间最小化处理室110的尺寸,并且通过最小化驱动单元114运行的行程而允许驱动单元114(将在后面描述)快速地传递,将淀积源113从第一区域A移动到第二区域B。The
如果在支撑单元112之间存在许多空间或者如果存在淀积源113停留一定时间段的空间,由于处理室110的尺寸增加到与该空间一样大的空间,则生产成本可能增加,并且由于基板的处理延迟与驱动单元114驱动淀积源113穿过该空间的时间一样长的时间,处理基板花费的时间可能增加。相反,根据本发明的示例性实施例,用于制造平板显示器的设备100的处理室110在支撑单元112之间没有浪费的空间,使得淀积源113可以在第一区域A和第二区域B之间快速移动,因此快速实现处理气体的淀积处理。If there are many spaces between the
淀积源113放置在本体构件111的内部空间中并且将处理气体喷射在基板10上。例如,淀积源113可以是线性淀积源113。在这个示例性实施例中,从淀积源113喷射出的处理气体是用于制造有机发光显示器的有机材料。The
参考图2,单个淀积源113放置在本体构件111的内部空间中,但不限于此。替代地,如图5中所示,多个淀积源113可以放置在处理室110’中并且沿第二方向L2间隔开。相应的淀积源113在相同时间喷射处理气体,因此增加喷射在处理室110’中的处理气体的量,从而缩短淀积处理花费的时间。Referring to FIG. 2, a
而且,每个淀积源113可以包括一个或多个蒸发源(evaporation sources)113a,该一个或多个蒸发源113a分别容纳一种或多种材料,以便在处理室110’中将一种或多种材料同时淀积在基板10上。从相应的蒸发源113a喷射的材料混合以构成处理气体。Moreover, each
驱动单元114驱动淀积源113沿第二方向L2直线往复运动。例如,驱动单元114可以包括线性电机和直线运动引导件。线性电机提供驱动力以使淀积源113直线往复运动,并且淀积源113接收驱动力并且沿直线运动引导件在第二方向L2上直线往复运动。这种构造对于本领域技术人员来说是熟知的,并且省略其详细描述。The driving
控制器控制驱动单元114,以驱动淀积源113在第一区域A和第二区域B之间往复运动。控制器控制驱动单元114,以在一个基板10在第一区域A中通过淀积源113处理之后,没有停留地将淀积源113移动到第二区域B,并且在另一个基板10在第二区域B中通过淀积源113处理之后,没有停留地将淀积源113返回到第一区域A。因此,控制器可以快速地处理两个基板10,而在淀积源113通过驱动单元114在第一区域A和第二区域B之间移动时没有延迟时间。The controller controls the driving
参考图1,传递室120包括传递机器人123,该传递机器人123沿第二方向直线往复运动并且传递基板10,并且传递机器人123包括传递单元121和机器人手臂122。Referring to FIG. 1 , the
传递单元121沿第二方向L2直线往复运动。传递单元121在加载室130和卸载室140之间直线往复运动。The
机器人手臂122在传递单元121上可旋转地连接到传递单元121,并且沿第一方向L1将基板10供给处理室110或沿第一方向L1从处理室110运出基板10。在基板10安置在机器人手臂122的顶部上的状态中,机器人手臂122滑动运动,以将基板10供给处理室110或从处理室110运出基板10。通过具有这种构造的传递室120,基板10可以在处理室110中同时处理、供给和运出。The robot arm 122 is rotatably connected to the
传递机器人123在沿第二方向L2直线往复运动时,允许基板10顺序地供给处理室110或从处理室110运出。传递机器人123通过处理室110的一个开口115传递已处理的基板10和未处理的基板10,沿第二方向L2直线往复运动以改变在传递室120中的位置,并且通过另一个开口115传递已处理的基板10和未处理的基板10。就是说,传递机器人123在传递室120内重复地直线往复运动并且与处理室110交换基板10。The
下面将描述通过控制器和传递机器人123处理基板10的方法。A method of processing the
根据示例性实施例,控制器控制驱动单元114,以重复在第一区域A内沿第二方向L2从第一区域A的初始位置移动淀积源113时处理一个基板10的工艺以及在第二区域B内沿第二方向L2朝向第二区域B移动淀积源113并返回初始位置时处理另一个基板10的工艺。这里,第一区域A的初始位置指的是第一区域A中的邻近处理室110的侧壁的位置,以作为在第一区域A内开始基板10的淀积的位置。According to an exemplary embodiment, the controller controls the driving
这时,在第一区域A的基板和第二区域B的基板都被处理之后,传递机器人123从第一区域A和第二区域B运出已处理的基板10,并且将新的基板供给第一区域A和第二区域B。在完成所有基板10的处理之后,顺序进行已处理的基板10的运出和新的基板10的供给。At this time, after both the substrates in the first area A and the substrates in the second area B are processed, the
根据另一个示例性实施例,控制器控制驱动单元114,以重复在淀积源113沿第二方向L2顺序地移动到第一区域A和第二区域B时处理第一区域A中的基板和第二区域B中的基板的工艺以及在淀积源113沿第二方向L2顺序地移动到第二区域B和第一区域A时处理第二区域B中的基板和第一区域A中的基板的工艺。According to another exemplary embodiment, the controller controls the driving
这时,传递机器人123在处理第一区域A中的基板之后,从第一区域A运出已处理的基板10并且将新的基板10供给第一区域A,同时处理第二区域B中的基板,然后在处理第二区域B中的基板之后,从第二区域B运出已处理的基板10并且将新的基板10供给第二区域B,同时处理第一区域A中的基板。At this time, after processing the substrates in the first area A, the
以如下方式同时进行基板的处理和传递,即一个基板10完成处理并且在处理另一个基板10时供给新的基板10,使得每单位时间处理的基板的数量可以多于设置在用于制造平板显示器的传统设备中的处理室处理的基板的数量,从而提高生产率。The processing and transfer of the substrates are simultaneously performed in such a manner that one
通过这种构造,将参考图1-图5描述根据本发明的实施例的用于制造平板显示器的设备100的操作。如果处理室110的第一区域A中的基板10b如图4a中所示通过淀积源113完成处理,则放置在加载室130中的未处理的基板10a如图4b中所示通过传递机器人123传递到处理室110。在第一区域A中完成处理的基板10b通过传递机器人123向外运出,并且将被处理的基板10a被安置在第一区域A的支撑单元112中。支撑单元112与掩模对齐,使得从淀积源113喷射出的处理气体可以均匀地淀积在基板10上。同时,淀积源113通过驱动单元114快速移动到第二区域B并且当在第二区域B内直线往复运动时喷射将要淀积在基板10上的处理气体。此外,如图4c和图4d中所示,传递机器人123将基板10传递到卸载室140以便将其运出。With this configuration, the operation of the
如图4e到图4g中所示,传递机器人123移动到加载室130并且当基板10b在第二区域B中处理时将基板10a传递到第二区域B,运出在第二区域B中完成处理的基板10b,以及将需要处理的基板10a供给第二区域B。就是说,淀积源113在第一区域A和第二区域B之间往复运动时连续地处理基板10a,并且放置在加载室130中的基板10a通过传递机器人123交替地供给处理室110的第一区域A和第二区域B。这些操作不断地重复。As shown in FIGS. 4e to 4g, the
在这个示例性实施例中,在处理室110中处理的基板10被传递到卸载室140,但不限于此。替代地,在一个处理室110中处理的基板10被传递到另一个处理室110并且在另一个处理室110中处理,然后被传递到卸载室140。In this exemplary embodiment, the
就是说,基板10通过传递室120从加载室130供给多个处理室110中的第一处理室110(例如,放置在传递室的右侧的处理室),并且在第一处理室110中完成处理的基板10从第一处理室110运出并且通过传递室120供给多个处理室110中的第二处理室110(例如,放置在传递室的左侧的处理室)。然后,在第二处理室110中完成处理的基板10通过传递室120从第二处理室110运出到卸载室140。That is, the
如上所述,在根据本发明的实施例的用于制造平板显示器的设备100中,一旦对基板10完成处理,淀积源113就没有延迟地从第一区域A移动到第二区域B,并且连续地处理第二区域B中的另一个基板10,从而缩短处理时间并且提高生产率。As described above, in the
而且,如上所述,在根据本发明的实施例的用于制造平板显示器的设备100中,两个支撑单元112布置成在它们之间留下较小的空间,使得处理室110即使容纳两个基板10也可以最小化,因此减小处理室110的制造成本。Moreover, as described above, in the
同时,参考图6,根据另一个示例性实施例的用于制造平板显示器的设备200包括多个处理室110,该多个处理室110布置在传递室120的横向侧并且沿第二方向L2彼此间隔开。通过这种构造,单位时间内可以处理更多基板,因此生产率可以比用于制造平板显示器的图1的设备100的生产率进一步提高。Meanwhile, referring to FIG. 6 , an
在存在多个处理室110a的情况下,传递室120可以包括如图7中所示的两个传递机器人123,并且传递机器人123沿第一方向L1彼此间隔开并布置成沿第二方向L2直线往复运动。In the case where there are a plurality of processing chambers 110a, the
一个传递机器人123将基板10供给连接到传递室120的一侧的处理室110a或从处理室110a运出基板10,另一个传递机器人123将基板10供给连接到传递室120的另一侧的处理室110b或从处理室110b运出基板10。通过这种构造,不仅可以提高从处理室110运出已处理的基板10的速度,而且可以提高将基板10供给处理室110的速度。One
在根据本发明的实施例的用于制造平板显示器的设备中,同时进行基板的处理和传递,并且每单位时间可以处理更多基板,从而提高生产率。In the apparatus for manufacturing a flat panel display according to an embodiment of the present invention, processing and transfer of substrates are performed simultaneously, and more substrates can be processed per unit time, thereby improving productivity.
而且,在根据本发明的实施例的用于制造平板显示器的设备中,处理室内的用于处理基板的两个区域彼此邻近,使得处理室的尺寸可以最小化,从而减小设备的总尺寸,并且传递淀积源的距离和时间可以减小,从而缩短总处理时间。Also, in the apparatus for manufacturing a flat panel display according to an embodiment of the present invention, two regions in the processing chamber for processing substrates are adjacent to each other, so that the size of the processing chamber can be minimized, thereby reducing the overall size of the apparatus, And the distance and time to transfer the deposition source can be reduced, thereby shortening the total processing time.
此外,在根据本发明的实施例的用于制造平板显示器的设备中,即使多个处理室成排布置,也能够设置在处理室之间直线往复运动的传递机器人,使得处理室的数量和布置的各种组合可以根据工厂的内部情况构造。Furthermore, in the apparatus for manufacturing a flat panel display according to an embodiment of the present invention, even if a plurality of processing chambers are arranged in a row, a transfer robot that linearly reciprocates between the processing chambers can be provided so that the number and arrangement of the processing chambers Various combinations can be constructed according to the internal conditions of the factory.
虽然已经示出且描述了本发明的数个示例性实施例,本领域技术人员可以理解的是,在不偏离本发明的原理和精神的情况下,可以对这些实施例作出改变,本发明的范围在所附权利要求和它们的等同物中限定。Although several exemplary embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that changes may be made to these embodiments without departing from the principle and spirit of the present invention. The scope is defined in the appended claims and their equivalents.
Claims (9)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2011-0117311 | 2011-11-11 | ||
| KR1020110117311A KR101293024B1 (en) | 2011-11-11 | 2011-11-11 | Apparatus for Manufacturing Flat panel display |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103107132A true CN103107132A (en) | 2013-05-15 |
Family
ID=48314884
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012104482447A Pending CN103107132A (en) | 2011-11-11 | 2012-11-09 | Apparatus for manufacturing flat panel display |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP2013104131A (en) |
| KR (1) | KR101293024B1 (en) |
| CN (1) | CN103107132A (en) |
| TW (1) | TW201318942A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103789732A (en) * | 2014-02-13 | 2014-05-14 | 上海和辉光电有限公司 | Evaporator and evaporation method |
| CN111041424A (en) * | 2018-10-15 | 2020-04-21 | 佳能特机株式会社 | Film forming apparatus and method, and system and method for manufacturing organic EL panel |
| CN112623700A (en) * | 2020-12-04 | 2021-04-09 | 深圳市韩安特科技有限公司 | Display screen maintenance equipment |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102150452B1 (en) * | 2014-03-31 | 2020-09-01 | 주식회사 선익시스템 | Cluster type deposition apparatus |
| JP2016117915A (en) * | 2014-12-18 | 2016-06-30 | キヤノントッキ株式会社 | Device and method of vapor deposition |
| TWI643799B (en) * | 2017-12-01 | 2018-12-11 | 瑩耀科技股份有限公司 | Semiconductors transfer system |
| CN113493097B (en) * | 2021-08-06 | 2023-05-02 | 超捷半导体设备(深圳)有限公司 | Substrate loading and unloading device, substrate loading method and substrate unloading method |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1357910A (en) * | 2000-12-11 | 2002-07-10 | 矽品精密工业股份有限公司 | Substrate type semiconductor device packaging method capable of preventing glue overflow |
| KR100493644B1 (en) * | 1996-09-11 | 2005-09-15 | 가부시끼가이샤 히다치 세이사꾸쇼 | Operating method of vacuum processing system |
| CN101667630A (en) * | 2008-09-04 | 2010-03-10 | 株式会社日立高新技术 | Organic EL device manufacturing apparatus and manufacturing method thereof, and film forming apparatus and film forming method |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4538650B2 (en) * | 2004-06-18 | 2010-09-08 | 京セラ株式会社 | Vapor deposition equipment |
| CN101167173B (en) * | 2005-06-10 | 2011-06-22 | 应用材料股份有限公司 | Linear vacuum deposition system |
| WO2009109464A1 (en) * | 2008-03-05 | 2009-09-11 | Applied Materials Inc. | Coating apparatus with rotation module |
| TWI424784B (en) * | 2008-09-04 | 2014-01-21 | 日立全球先端科技股份有限公司 | Organic electroluminescent device manufacturing apparatus, manufacturing method thereof, film forming apparatus and film forming method |
| KR100980706B1 (en) * | 2008-09-19 | 2010-09-08 | 세메스 주식회사 | Substrate transfer apparatus, substrate processing apparatus having same and substrate transfer method thereof |
| JP5260212B2 (en) * | 2008-09-25 | 2013-08-14 | 株式会社日立ハイテクノロジーズ | Deposition equipment |
| JP5694679B2 (en) * | 2009-05-04 | 2015-04-01 | 三星ディスプレイ株式會社Samsung Display Co.,Ltd. | Organic matter vapor deposition apparatus and vapor deposition method |
-
2011
- 2011-11-11 KR KR1020110117311A patent/KR101293024B1/en not_active Expired - Fee Related
-
2012
- 2012-10-26 JP JP2012237278A patent/JP2013104131A/en active Pending
- 2012-11-07 TW TW101141229A patent/TW201318942A/en unknown
- 2012-11-09 CN CN2012104482447A patent/CN103107132A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100493644B1 (en) * | 1996-09-11 | 2005-09-15 | 가부시끼가이샤 히다치 세이사꾸쇼 | Operating method of vacuum processing system |
| CN1357910A (en) * | 2000-12-11 | 2002-07-10 | 矽品精密工业股份有限公司 | Substrate type semiconductor device packaging method capable of preventing glue overflow |
| CN101667630A (en) * | 2008-09-04 | 2010-03-10 | 株式会社日立高新技术 | Organic EL device manufacturing apparatus and manufacturing method thereof, and film forming apparatus and film forming method |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103789732A (en) * | 2014-02-13 | 2014-05-14 | 上海和辉光电有限公司 | Evaporator and evaporation method |
| CN111041424A (en) * | 2018-10-15 | 2020-04-21 | 佳能特机株式会社 | Film forming apparatus and method, and system and method for manufacturing organic EL panel |
| CN112623700A (en) * | 2020-12-04 | 2021-04-09 | 深圳市韩安特科技有限公司 | Display screen maintenance equipment |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2013104131A (en) | 2013-05-30 |
| TW201318942A (en) | 2013-05-16 |
| KR20130052084A (en) | 2013-05-22 |
| KR101293024B1 (en) | 2013-08-05 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101880865B (en) | Apparatus for depositing organic material and depositing method and depositing system thereof | |
| CN103107132A (en) | Apparatus for manufacturing flat panel display | |
| KR101036123B1 (en) | Thin film deposition apparatus | |
| JP5173699B2 (en) | Organic EL device manufacturing equipment | |
| US11404299B2 (en) | Substrate transfer mechanism, substrate processing apparatus, and substrate processing method | |
| CN104120386B (en) | The method of precipitation equipment and manufacture organic light emitting diode display | |
| TWI452166B (en) | Apparatus for depositing organic material and depositing method thereof | |
| CN102246286A (en) | Vacuum processing apparatus and vacuum transfer apparatus | |
| JP2011068980A (en) | Apparatus for depositing organic material and depositing method thereof | |
| CN108122809A (en) | Base plate processing system | |
| WO2012039383A1 (en) | Vacuum processing apparatus and method for forming organic thin film | |
| KR101252987B1 (en) | multiple evaporation system sharing an evaporator | |
| KR102134438B1 (en) | Apparatus for treating substrate, System for treating substrate with the apparatus, and Method for treating substrate | |
| JP2014133923A (en) | Retaining device, film deposition device, and conveying method | |
| KR20160081342A (en) | A ald apparatus for large substrate | |
| CN108538749B (en) | Deposition apparatus, method of manufacturing display device, and display device manufactured by the method | |
| KR20150130670A (en) | Deposition apparatus for flat panel display device | |
| CN106784394B (en) | System and method for the device and method of glassivation and mask and for loading substrate | |
| KR101225212B1 (en) | Oled manufacturing apparatus and method of the same | |
| JP5442969B2 (en) | Substrate processing unit, substrate processing apparatus, and nozzle position control method | |
| KR101972210B1 (en) | Deposition apparatus based on 4-divided domain chamber, deposition system based on multi-divided domain chamber, and deposition method thereof | |
| KR101175988B1 (en) | Substrate treatment apparatus and method of the same | |
| KR20180046667A (en) | An manufacturing system for organic light emitting device and manufacturing method | |
| JP2013110114A (en) | Apparatus for manufacturing organic el device and angle correction mechanism | |
| KR102427211B1 (en) | System to deposition substrate and method to transfer substrate thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20130515 |