CN113493097B - Substrate loading and unloading device, substrate loading method and substrate unloading method - Google Patents

Substrate loading and unloading device, substrate loading method and substrate unloading method Download PDF

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Publication number
CN113493097B
CN113493097B CN202110903022.9A CN202110903022A CN113493097B CN 113493097 B CN113493097 B CN 113493097B CN 202110903022 A CN202110903022 A CN 202110903022A CN 113493097 B CN113493097 B CN 113493097B
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area
substrate
carrying device
processed
transfer processing
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CN113493097A (en
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吴凝香
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Dingqin Technology Shenzhen Co ltd
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Chaojie Semiconductor Equipment Shenzhen Co ltd
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G37/00—Combinations of mechanical conveyors of the same kind, or of different kinds, of interest apart from their application in particular machines or use in particular manufacturing processes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
    • B65G47/74—Feeding, transfer, or discharging devices of particular kinds or types
    • B65G47/88—Separating or stopping elements, e.g. fingers
    • B65G47/8876—Separating or stopping elements, e.g. fingers with at least two stops acting as gates
    • B65G47/8884—Stops acting asynchronously, e.g. one stop open, next one closed or the opposite
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
    • B65G47/74—Feeding, transfer, or discharging devices of particular kinds or types
    • B65G47/90—Devices for picking-up and depositing articles or materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
    • B65G47/74—Feeding, transfer, or discharging devices of particular kinds or types
    • B65G47/90—Devices for picking-up and depositing articles or materials
    • B65G47/91—Devices for picking-up and depositing articles or materials incorporating pneumatic, e.g. suction, grippers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2201/00—Indexing codes relating to handling devices, e.g. conveyors, characterised by the type of product or load being conveyed or handled
    • B65G2201/02—Articles
    • B65G2201/0214—Articles of special size, shape or weigh
    • B65G2201/022—Flat

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)

Abstract

The invention relates to the technical field of substrate conveying, in particular to a substrate loading and unloading device which comprises a conveying device, a first bearing device, a second bearing device, an upper plate area, a lower plate area, a first transfer processing area and a second transfer processing area. The invention also relates to a substrate feeding method, and the substrate feeding and discharging device adopting the substrate feeding and discharging method. The invention also relates to a substrate blanking method, and the substrate loading and unloading device is adopted. When the first bearing device moves out of the feeding area, the second bearing device can move to the feeding area, continuous feeding of the base material is achieved, and waiting time is saved.

Description

基材的上下料装置及上料方法、下料方法Substrate loading and unloading device, loading method, and unloading method

【技术领域】【Technical field】

本发明涉及基材运送技术领域，尤其涉及一种基材的上下料装置及上料方法、下料方法。The invention relates to the technical field of substrate transportation, in particular to a substrate loading and unloading device, a feeding method, and a feeding method.

【背景技术】【Background technique】

市面上的基材的运送方式，通常是通过运送机构从装载区直接运送至处理装置处，以及从处理装置处直接运送至卸载区，在从装载区运送至处理装置处时，后一运送机构需等前一运送机构从处理装置处移至原位置后才能够移至处理装置处，增加基材在运送过程中的等待时间；同理在从处理装置处运送至卸载区时，后一运送机构需等前一运送机构从卸载区移至原位置后才能够移至卸载区进行卸载处理，也增加了基材在运送过程中的等待时间。The transportation method of the substrate on the market is usually directly transported from the loading area to the processing device by the transport mechanism, and directly transported from the processing device to the unloading area. When transporting from the loading area to the processing device, the latter transport mechanism It is necessary to wait for the previous transport mechanism to move from the processing device to the original position before it can move to the processing device, which increases the waiting time of the substrate during the transport process; similarly, when transporting from the processing device to the unloading area, the latter transport The mechanism needs to wait for the previous transport mechanism to move from the unloading area to the original position before it can move to the unloading area for unloading processing, which also increases the waiting time of the substrate during the transport process.

因此，现有技术存在不足，需要改进。Therefore, there are deficiencies in the prior art and need to be improved.

【发明内容】【Content of invention】

为克服基材在上下料过程中等待时间过长的技术问题，本发明提供了一种基材的上下料装置及上料方法、下料方法。In order to overcome the technical problem of too long waiting time in the loading and unloading process of the substrate, the invention provides a loading and unloading device, a loading method and a blanking method for the substrate.

本发明解决技术问题的方案是提供一种基材的上下料装置，包括传送装置、第一承载装置、第二承载装置、上板区、下板区、第一中转处理区、第二中转处理区，所述处理装置包括上料区及下料区，所述待加工的基材被第一承载装置、第二承载装置依次从上板区经第一中转处理区运送至上料区进行加工处理，所述已加工的基材被第一承载装置、第二承载装置依次从下料区经第二中转处理区运送至下板区。The solution of the present invention to solve the technical problem is to provide a substrate loading and unloading device, including a conveying device, a first carrying device, a second carrying device, an upper plate area, a lower plate area, a first transfer processing area, and a second transfer processing area. area, the processing device includes a loading area and an unloading area, and the substrate to be processed is transported from the upper plate area to the loading area through the first transfer processing area by the first carrying device and the second carrying device in turn for processing , the processed base material is transported from the unloading area to the lower plate area through the second transfer processing area by the first carrying device and the second carrying device in sequence.

本发明还提供一种基材的上料方法，其采用上述的基材的上下料装置，包括如下步骤：The present invention also provides a method for feeding a base material, which adopts the above-mentioned material loading and unloading device for the base material, comprising the following steps:

步骤S11：第一承载装置被传送装置带动至上板区并装载第一待加工基材；Step S11: the first carrying device is driven by the conveying device to the upper plate area and loaded with the first substrate to be processed;

步骤S12：第一承载装置被传送装置带动并将第一待加工基材从上板区运送至第一中转处理区，第二承载装置被传送装置带动至上板区并装载第二待加工基材；Step S12: The first carrying device is driven by the conveying device and transports the first substrate to be processed from the upper plate area to the first transfer processing area, and the second carrying device is driven by the conveying device to the upper plate area and loads the second substrate to be processed ;

步骤S13：第一承载装置被传送装置带动并将第一待加工基材从第一中转处理区运送并放至上料区，第二承载装置被传送装置带动并将第二待加工基材从上板区运送至第一中转处理区；Step S13: The first carrying device is driven by the conveying device and transports the first substrate to be processed from the first transfer processing area to the loading area, and the second carrying device is driven by the conveying device to transport the second substrate to be processed from the upper The board area is transported to the first transfer processing area;

步骤S14：第一承载装置被传送装置带动至上板区，第二承载装置被传送装置带动并将第二待加工基材从第一中转处理区运送至上料区，完成一次上料。Step S14: The first carrying device is driven to the plate loading area by the conveying device, and the second carrying device is driven by the conveying device to transport the second substrate to be processed from the first transfer processing area to the loading area, completing one loading.

优选地，在所述步骤S12中，所述基材的上下料装置包括第一止挡机构，当第一承载装置被传送装置带动并将第一待加工基材从上板区运送至第一中转处理区时，第一止挡机构工作，阻止在第一承载装置离开第一中转处理区之前，第二承载装置进入第一中转处理区。Preferably, in the step S12, the loading and unloading device for the substrate includes a first stopper mechanism, when the first carrying device is driven by the conveying device and transports the first substrate to be processed from the upper plate area to the first When transferring to the processing area, the first stop mechanism works to prevent the second carrying device from entering the first transferring processing area before the first carrying device leaves the first transferring processing area.

优选地，在所述步骤S13中，当第一承载装置被传送装置带动并将第一待加工基材从第一中转处理区运送至上料区时，第一止挡机构停止工作，解除对第二承载装置运送至第一中转处理区的阻止。Preferably, in the step S13, when the first carrying device is driven by the conveying device and transports the first substrate to be processed from the first transfer processing area to the loading area, the first stopper mechanism stops working, and releases the restriction on the second stopper mechanism. The prevention of the second carrier device from being transported to the first transfer area.

优选地，所述第一待加工基材通过被第一承载装置夹持或吸附的方式装载至第一承载装置处；所述第二待加工基材通过被第二承载装置夹持或吸附的方式装载至第二承载装置处。Preferably, the first substrate to be processed is loaded onto the first carrier by being clamped or adsorbed by the first carrier; the second substrate to be processed is loaded by being clamped or adsorbed by the second carrier mode loaded to the second carrier.

优选地，所述第一待加工基材与第二待加工基材为覆铜箔板或印制电路板。Preferably, the first substrate to be processed and the second substrate to be processed are copper clad boards or printed circuit boards.

本发明还提供一种基材的上料方法，其采用上述的基材的上下料装置，包括如下步骤：The present invention also provides a method for feeding a base material, which adopts the above-mentioned material loading and unloading device for the base material, comprising the following steps:

步骤S21：第一承载装置被传送装置带动至下料区并装载第一已加工基材；Step S21: the first carrying device is driven by the conveying device to the unloading area and loaded with the first processed substrate;

步骤S22：第一承载装置被传送装置带动并将第一已加工基材从下料区运送至第二中转处理区，第二承载装置被传送装置带动至下料区并装载第二已加工基材；Step S22: The first carrying device is driven by the conveying device and transports the first processed base material from the unloading area to the second transfer processing area, and the second carrying device is driven by the conveying device to the unloading area and loads the second processed base material material;

步骤S23：第一承载装置被传送装置带动并将第一已加工基材从第二中转处理区运送并放至下板区，第二承载装置被传送装置带动并将第二已加工基材从下料区运动至第二中转处理区；Step S23: The first carrying device is driven by the conveying device and transports the first processed substrate from the second transfer processing area to the lower plate area, and the second carrying device is driven by the conveying device and transports the second processed substrate from the The unloading area moves to the second transfer processing area;

步骤S24：第一承载装置被传送装置带动至下料区，第二承载装置被传送装置带动并将第二已加工基材从第二中转处理区运送至下板区，完成一次下料。Step S24: The first carrying device is driven to the unloading area by the conveying device, and the second carrying device is driven by the conveying device to transport the second processed base material from the second transfer processing area to the unloading area, completing a discharge.

优选地，在所述步骤S22中，所述基材的上下料装置包括第二止挡机构，当第一承载装置被传送装置带动并将第一已加工基材从下料区运送至第二中转处理区，第二止挡机构工作，阻止在第一承载装置离开第二中转处理区之前，第二承载装置进入第二中转处理区。Preferably, in the step S22, the loading and unloading device of the base material includes a second stopper mechanism, when the first carrying device is driven by the conveying device and transports the first processed base material from the unloading area to the second In the transfer processing area, the second stop mechanism works to prevent the second carrying device from entering the second transfer processing area before the first carrying device leaves the second transfer processing area.

优选地，在所述步骤S23中，所述基材的上下料装置包括第三止挡机构，当第一承载装置被传送装置带动并将第一已加工基材从第二中转处理区运送并放至下板区时，第二止挡机构停止工作，解除对第二承载装置运送至第二中转处理区的阻止，同时第三止挡机构工作，阻止在第一承载装置离开下板区之前，第二承载装置进入下板区。Preferably, in the step S23, the loading and unloading device for the base material includes a third stopper mechanism, when the first carrying device is driven by the conveying device and transports the first processed base material from the second transfer processing area and When it is placed in the lower plate area, the second stopper mechanism stops working, releasing the prevention of the second carrying device being transported to the second transfer processing area, and at the same time the third stopper mechanism works to prevent the first carrying device from leaving the lower platen area , the second carrying device enters the lower plate area.

优选地，在所述步骤S24中，当第一承载装置被传送装置带动至下料区时，第三止挡机构停止工作，解除对第二承载装置运送至下板区的阻止。Preferably, in the step S24, when the first carrying device is driven to the unloading area by the conveying device, the third stopper mechanism stops working, releasing the prevention of the second carrying device being transported to the lower plate area.

相对于现有技术，本发明的基材的上下料装置及上料方法、下料方法具有如下优点：Compared with the prior art, the loading and unloading device, the loading method and the blanking method of the substrate of the present invention have the following advantages:

在第一承载装置从上料区移出时，第二承载装置即可移至上料区，无需等待第一承载装置移至上板区即可实现基材的持续上料，节省了基材在上料过程中的等待时间，有利于增加基材的处理效率，扩大企业生产效益。When the first carrying device is moved out of the loading area, the second carrying device can be moved to the loading area, without waiting for the first carrying device to move to the upper plate area, the continuous loading of the substrate can be realized, saving the substrate in the loading area The waiting time in the process is conducive to increasing the processing efficiency of the substrate and expanding the production efficiency of the enterprise.

在第一承载装置从下板区移出时，第二承载装置即可移至下板区，无需等待第一承载装置移至下料区即可实现基材的持续下来，节省了基材在下料过程中的等待时间，减少了基材在处理过程中总体所需要的时间，有利于扩大企业生产效益。When the first carrying device is moved out of the lower plate area, the second carrying device can be moved to the lower plate area, without waiting for the first carrying device to move to the unloading area, the continuous down of the base material can be realized, saving the base material during unloading The waiting time in the process reduces the overall time required for the substrate in the processing process, which is conducive to expanding the production efficiency of the enterprise.

【附图说明】【Description of drawings】

图1是本发明基材的上下料装置与处理装置的具体系统框图示意图。Fig. 1 is a schematic block diagram of a specific system of a loading and unloading device and a processing device for a substrate of the present invention.

图2是本发明基材上料方法的具体流程示意图。Fig. 2 is a schematic flow chart of the substrate loading method of the present invention.

图3是本发明基材下料方法的具体流程示意图。Fig. 3 is a schematic flow chart of the method for blanking the substrate of the present invention.

图4是本发明的基材在上下料过程中的简图。Fig. 4 is a schematic diagram of the substrate of the present invention during loading and unloading.

附图标记说明：Explanation of reference signs:

11、第一承载装置；12、第二承载装置；13、传送装置；15、上板区；16、下板区；17、第一中转处理区；18、第二中转处理区；19、处理装置；20、上料区；21、下料区。11. First carrying device; 12. Second carrying device; 13. Transmission device; 15. Upper plate area; 16. Lower plate area; 17. First transfer processing area; 18. Second transfer processing area; 19. Processing device; 20, feeding area; 21, unloading area.

【具体实施方式】【Detailed ways】

为了使本发明的目的、技术方案及优点更加清楚明白，以下结合附图及实施实例，对本发明进行进一步详细说明。应当理解，此处所描述的具体实施例仅用于解释本发明，并不用于限定本发明。In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and implementation examples. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

本发明的说明书和权利要求书及上述附图说明中的术语“包括”和“具有”以及它们的任何变形，意图在于覆盖不排他的包含。本发明的说明书和权利要求书或上述附图中的术语“第一”、“第二”等是用于区别不同对象，而不是用于描述特定顺序。The terms "comprising" and "having" and any variations thereof in the description and claims of the present invention and the above descriptions of the drawings are intended to cover a non-exclusive inclusion. The terms "first", "second" and the like in the description and claims of the present invention or the above drawings are used to distinguish different objects, rather than to describe a specific order.

请参阅图1,本发明提供一种基材的上下料装置，用于提供基材给处理装置19进行处理及取回处理后的基材，包括控制部(图未示)及与控制部电性连接的传送装置13、第一承载装置11、第二承载装置12、上板区15、下板区16、第一中转处理区17、第二中转处理区18，处理装置19包括上料区20及下料区21，第一承载装置11、第二承载装置12分别与传送装置13连接并可被传送装置13带动运动，在控制部的控制下，待加工的基材被第一承载装置11、第二承载装置12依次从上板区15经第一中转处理区17运送至上料区20以供处理装置19对基板进行加工处理，已加工的基材被第一承载装置11、第二承载装置12在控制部的控制下依次从下料区21经第二中转处理区18运送至下板区16以便完成基板的卸载。Please refer to Fig. 1, the present invention provides a kind of material loading and unloading device of substrate, is used for providing substrate to processing device 19 to process and retrieve the processed substrate, including control unit (not shown) and control unit electrical connection Sexually connected conveying device 13, first carrier device 11, second carrier device 12, upper board area 15, lower board area 16, first transfer processing area 17, second transfer processing area 18, processing device 19 includes a feeding area 20 and the unloading area 21, the first carrying device 11 and the second carrying device 12 are respectively connected with the conveying device 13 and can be moved by the conveying device 13. Under the control of the control part, the base material to be processed is carried by the first carrying device 11. The second carrying device 12 is sequentially transported from the upper plate area 15 through the first transfer processing area 17 to the loading area 20 for the processing device 19 to process the substrate, and the processed substrate is carried by the first carrying device 11, the second Under the control of the control unit, the carrier device 12 is sequentially transported from the unloading area 21 to the lower plate area 16 through the second transfer processing area 18 so as to complete the unloading of the substrate.

进一步地，基材的上下料装置还包括与控制部电性连接的第一止挡机构及第二止挡机构、第三止挡机构(图未示)，第一止挡机构设置在上板区15中，第二止挡机构设置在下料区21中，第三止挡机构设置在第二中转处理区18，第一止挡机构与第二止挡机构用于在工作时对位于其内的承载装置进行阻挡以防止承载装置之间发生碰撞。Further, the loading and unloading device for the base material also includes a first stop mechanism, a second stop mechanism, and a third stop mechanism (not shown) electrically connected to the control unit, the first stop mechanism is arranged on the upper plate In zone 15, the second stopper mechanism is set in the blanking zone 21, the third stopper mechanism is set in the second transfer processing zone 18, and the first stopper mechanism and the second stopper mechanism are used to be positioned in it during work. Carriers are blocked to prevent collisions between carriers.

请参阅图2，进一步地，本发明还提供一种基材的上料方法，其采用上述的基材的上下料装置，包括如下步骤：Please refer to Fig. 2, further, the present invention also provides a substrate loading method, which adopts the above-mentioned substrate loading and unloading device, comprising the following steps:

步骤S11：第一承载装置被传送装置带动至上板区并装载第一待加工基材。Step S11: the first carrying device is driven by the conveying device to the upper plate area and loaded with the first substrate to be processed.

在该步骤中，第一承载装置可通过外界装置或工作人员协助实现对第一待加工基材的装载。In this step, the first carrying device can load the first substrate to be processed with the assistance of an external device or a worker.

步骤S12：第一承载装置被传送装置带动并将第一待加工基材从上板区运送至第一中转处理区，第二承载装置被传送装置带动至上板区并装载第二待加工基材。Step S12: The first carrying device is driven by the conveying device and transports the first substrate to be processed from the upper plate area to the first transfer processing area, and the second carrying device is driven by the conveying device to the upper plate area and loads the second substrate to be processed .

优选地，第一待加工基材与第二待加工基材为覆铜箔板或印制电路板，具体可根据实际进行设置。Preferably, the first substrate to be processed and the second substrate to be processed are copper clad boards or printed circuit boards, which can be set according to actual conditions.

优选地，第一待加工基材通过被第一承载装置夹持或吸附的方式装载至第一承载装置处；第二待加工基材通过被第二承载装置夹持或吸附的方式装载至第二承载装置处。包括但不限于此，第一承载装置与第二承载装置也可通过打螺丝等方式实现基材的装载，具体可根据实际进行设置。Preferably, the first substrate to be processed is loaded to the first carrier by being clamped or adsorbed by the first carrier; the second substrate to be processed is loaded to the second carrier by being clamped or adsorbed by the second carrier. Two bearing devices. Including but not limited to this, the first carrying device and the second carrying device can also realize the loading of the base material by means of screwing, etc., which can be set according to the actual situation.

在步骤S12中，当第一承载装置被传送装置带动并将第一待加工基材从上板区运送至第一中转处理区时，第一止挡机构工作，阻止在第一承载装置离开第一中转处理区之前，第二承载装置进入第一中转处理区。In step S12, when the first carrying device is driven by the conveying device and transports the first substrate to be processed from the upper plate area to the first transfer processing area, the first stopper mechanism works to prevent the first carrying device from Before a transfer processing area, the second carrying device enters the first transfer processing area.

第一止挡机构的设置可有效防止第二承载装置与第一承载装置因产生接触而导致结构被破坏的可能性，有利于提升第一承载装置、第二承载装置的使用寿命。The arrangement of the first stop mechanism can effectively prevent the possibility of structure damage caused by the contact between the second carrying device and the first carrying device, which is beneficial to improve the service life of the first carrying device and the second carrying device.

步骤S13：第一承载装置被传送装置带动并将第一待加工基材从第一中转处理区运送并放至上料区，第二承载装置被传送装置带动并将第二待加工基材从上板区运送至第一中转处理区。Step S13: The first carrying device is driven by the conveying device and transports the first substrate to be processed from the first transfer processing area to the loading area, and the second carrying device is driven by the conveying device to transport the second substrate to be processed from the upper The board area is transported to the first transfer processing area.

在步骤S13中，当第一承载装置被传送装置带动并将第一待加工基材从第一中转处理区运送至上料区时，第一止挡机构停止工作，解除对第二承载装置运送至第一中转处理区的阻止。In step S13, when the first carrying device is driven by the conveying device and transports the first substrate to be processed from the first transfer processing area to the loading area, the first stopper mechanism stops working, and releases the second carrying device from transporting to the loading area. Blocking of the first transit area.

步骤S14：第一承载装置被传送装置带动至上板区，第二承载装置被传送装置带动并将第二待加工基材从第一中转处理区运送至上料区，完成一次上料。Step S14: The first carrying device is driven to the plate loading area by the conveying device, and the second carrying device is driven by the conveying device to transport the second substrate to be processed from the first transfer processing area to the loading area, completing one loading.

请参阅图3，进一步地，本发明还提供一种基材的下料方法，其采用上述的基材的上下料装置，包括如下步骤：Please refer to Fig. 3, further, the present invention also provides a method for unloading a base material, which uses the above-mentioned unloading device for a base material, comprising the following steps:

步骤S21：第一承载装置被传送装置带动至下料区并装载第一已加工基材；Step S21: the first carrying device is driven by the conveying device to the unloading area and loaded with the first processed substrate;

步骤S22：第一承载装置被传送装置带动并将第一已加工基材从下料区运送至第二中转处理区，第二承载装置被传送装置带动至下料区并装载第二已加工基材。Step S22: The first carrying device is driven by the conveying device and transports the first processed base material from the unloading area to the second transfer processing area, and the second carrying device is driven by the conveying device to the unloading area and loads the second processed base material material.

优选地，第一已加工基材与第二已加工基材为覆铜箔板或印制电路板，具体可根据实际进行设置。Preferably, the first processed substrate and the second processed substrate are copper clad boards or printed circuit boards, which can be set according to actual conditions.

优选地，第一已加工基材通过被第一承载装置夹持或吸附的方式装载至第一承载装置处；第二已加工基材通过被第二承载装置夹持或吸附的方式装载至第二承载装置处。包括但不限于此，第一承载装置与第二承载装置也可通过打螺丝等方式实现基材的装载，具体可根据实际进行设置。Preferably, the first processed substrate is loaded to the first carrying device by being clamped or adsorbed by the first carrying device; the second processed substrate is loaded to the second processed substrate by being clamped or adsorbed by the second carrying device. Two bearing devices. Including but not limited to this, the first carrying device and the second carrying device can also realize the loading of the base material by means of screwing, etc., which can be set according to the actual situation.

在步骤S22中，当第一承载装置被传送装置带动并将第一已加工基材从下料区运送至第二中转处理区，第二止挡机构工作，阻止在第一承载装置离开第二中转处理区之前，第二承载装置进入第二中转处理区。In step S22, when the first carrying device is driven by the conveying device and transports the first processed base material from the unloading area to the second transfer processing area, the second stop mechanism works to prevent the first carrying device from leaving the second transfer area. Before the transfer processing area, the second carrying device enters the second transfer processing area.

第二止挡机构的设置可有效防止第一承载装置与第二承载装置因产生接触而导致结构被破坏的可能性，有利于提升第一承载装置、第二承载装置的使用寿命。The arrangement of the second stop mechanism can effectively prevent the possibility of structural damage caused by contact between the first bearing device and the second bearing device, and is beneficial to improve the service life of the first bearing device and the second bearing device.

步骤S23：第一承载装置被传送装置带动并将第一已加工基材从第二中转处理区运送并放至下板区，第二承载装置被传送装置带动并将第二已加工基材从下料区运动至第二中转处理区。Step S23: The first carrying device is driven by the conveying device and transports the first processed substrate from the second transfer processing area to the lower plate area, and the second carrying device is driven by the conveying device and transports the second processed substrate from the The unloading area moves to the second transfer processing area.

步骤S23还包括如下步骤：Step S23 also includes the following steps:

在步骤S23中，当第一承载装置被传送装置带动并将第一已加工基材从第二中转处理区运送并放至下板区时，第二止挡机构停止工作，解除对第二承载装置运送至第二中转处理区的阻止，同时第三止挡机构工作，阻止在第一承载装置离开下板区之前，第二承载装置进入下板区。In step S23, when the first carrying device is driven by the conveying device and transports the first processed base material from the second transfer processing area to the lower plate area, the second stopper mechanism stops working and releases the support for the second carrying device. The device is prevented from being transported to the second transfer processing area, and at the same time, the third stopper mechanism works to prevent the second carrying device from entering the lower plate area before the first carrying device leaves the lower plate area.

通过第三止挡结构的止挡作用，可有效防止第一承载装置与第二承载装置在下板区的接触，有利于防止第一承载装置与第二承载装置因发生接触而导致损坏的概率，有利于提升使用寿命。The stop function of the third stop structure can effectively prevent the contact between the first carrying device and the second carrying device in the lower plate area, which is beneficial to prevent the probability of damage caused by contact between the first carrying device and the second carrying device, It is beneficial to improve the service life.

步骤S24：第一承载装置被传送装置带动至下料区，第二承载装置被传送装置带动并将第二已加工基材从第二中转处理区运送至下板区，完成一次下料。Step S24: The first carrying device is driven to the unloading area by the conveying device, and the second carrying device is driven by the conveying device to transport the second processed base material from the second transfer processing area to the unloading area, completing a discharge.

在所述步骤S24中，当第一承载装置被传送装置带动至下料区时，第三止挡机构停止工作，解除对第二承载装置运送至下板区的阻止。In the step S24, when the first carrying device is driven to the unloading area by the conveying device, the third stop mechanism stops working, releasing the prevention of the second carrying device being transported to the lower plate area.

请参阅图4，本发明的基材的上下料装置通过基材的上料方法、下料方法工作时，在上料时：第一承载装置被传送装置带动至上板区并装载第一待加工基材，随后从上板区运送至第一中转处理区，第二承载装置被传送装置带动至上板区并装载第二待加工基材，第一承载装置被传送装置带动并将第一待加工基材从第一中转处理区运送并放至上料区，随后第二承载装置被传送装置带动并将第二待加工基材从上板区运送至第一中转处理区，第一承载装置被传送装置带动至上板区，第二承载装置被传送装置带动并将第二待加工基材从第一中转处理区运送至上料区，完成一次上料；处理装置对位于上料区的待加工基材进行处理，在处理过程中，第一承载装置与第二承载装置一直承载着第一待加工基材与第二待加工基材；在下料时：第一承载装置被传送装置带动至下料区并装载第一已加工基材，随后第一承载装置被传送装置带动并将第一已加工基材从下料区运送至第二中转处理区，第二承载装置被传送装置带动至下料区并装载第二已加工基材，接着第一承载装置被传送装置带动并将第一已加工基材从第二中转处理区运送并放至下板区，第二承载装置被传送装置带动并将第二已加工基材从下料区运动至第二中转处理区，最后第一承载装置被传送装置带动至下料区，第二承载装置被传送装置带动并将第二已加工基材从第二中转处理区运送至下板区，完成一次下料。其中，第一承载装置与第二承载装置在传送装置的带动下不断对处理装置进行上料及下料作业。Please refer to Fig. 4, when the loading and unloading device of the base material of the present invention works through the feeding method and the unloading method of the base material, when loading: the first carrying device is driven to the upper plate area by the conveying device and loads the first material to be processed The substrate is then transported from the upper plate area to the first transfer processing area, the second carrying device is driven by the conveying device to the upper plate area and loaded with the second substrate to be processed, the first carrying device is driven by the conveying device and the first to be processed The substrate is transported from the first transfer area to the loading area, and then the second carrying device is driven by the conveying device and transports the second substrate to be processed from the upper plate area to the first transfer area, and the first carrying device is transferred The device is driven to the upper plate area, the second carrying device is driven by the conveying device and transports the second substrate to be processed from the first transfer processing area to the loading area to complete a loading; the processing device is placed on the substrate to be processed in the loading area During the process, the first carrying device and the second carrying device always carry the first substrate to be processed and the second substrate to be processed; when unloading: the first carrying device is driven to the unloading area by the conveyor And load the first processed base material, then the first carrier device is driven by the conveyor and transports the first processed base material from the unloading area to the second transfer processing area, and the second carrier device is driven by the conveyor device to the unloading area And load the second processed base material, then the first carrying device is driven by the conveying device and transports the first processed substrate from the second transfer processing area to the lower plate area, the second carrying device is driven by the conveying device and The second processed base material moves from the unloading area to the second transfer processing area, and finally the first carrying device is driven to the unloading area by the conveying device, and the second carrying device is driven by the conveying device to move the second processed base material from the first The second transfer processing area is transported to the unloading area to complete one unloading. Wherein, the first carrying device and the second carrying device are driven by the conveying device to continuously perform loading and unloading operations on the processing device.

可以理解，第一承载装置与第二承载装置仅用于区分上下料的先后顺序，并不用于对位于传送装置上的承载装置的个数进行限制，其可以设置有多个，具体数目可根据实际进行设置。It can be understood that the first carrying device and the second carrying device are only used to distinguish the sequence of loading and unloading, and are not used to limit the number of carrying devices located on the conveying device. There may be more than one carrying device, and the specific number may be determined according to to actually set it up.

作为一种具体实施例，在第一承载装置从一工位被传送装置运至下一工位时，传送装置即带动位于第一承载装置后一工位处的第二承载装置朝第一承载装置原来所处的工位运动，使得在第一承载装置运动至下一工位时，第二承载装置运动至第一承载装置原来所处的工位，相较于第一承载装置完全运动至下一工位处时第一承载装置才被传送装置带动运动，有利于提高基材的运送效率及生产效率。具体地，当第一承载装置从一工位运动至与下一工位的三分之一处时，第二承载装置即开始运动，包括但不限于此，第一承载装置与第二承载装置可同步运动，或在第一承载装置运动至一工位与下一工位之间的某一位置时，第二承载装置开始运动，只要满足第一承载装置在运动至下一工位处时第二承载装置运动至第一承载装置原来所处的工位即可。As a specific embodiment, when the first carrying device is transported from one station to the next station by the conveying device, the conveying device drives the second carrying device located at a station behind the first carrying device toward the first carrying device. The station where the device was originally located moves so that when the first carrying device moves to the next station, the second carrying device moves to the station where the first carrying device was originally located, compared to the complete movement of the first carrying device to Only when the next station is at the first carrying device is driven by the conveying device to move, which is beneficial to improve the conveying efficiency and production efficiency of the base material. Specifically, when the first carrying device moves from one station to the third of the next station, the second carrying device starts to move, including but not limited to, the first carrying device and the second carrying device It can move synchronously, or when the first carrying device moves to a certain position between one station and the next station, the second carrying device starts to move, as long as the first carrying device moves to the next station. It is enough for the second carrying device to move to the original working position of the first carrying device.

相对于现有技术，本发明的基材的上下料装置及上料方法、下料方法具有如下优点：Compared with the prior art, the loading and unloading device, the loading method and the blanking method of the substrate of the present invention have the following advantages:

在第一承载装置从上料区移出时，第二承载装置即可移至上料区，无需等待第一承载装置移至上板区即可实现基材的持续上料，节省了基材在上料过程中的等待时间，有利于增加基材的处理效率，扩大企业生产效益。When the first carrying device is moved out of the loading area, the second carrying device can be moved to the loading area, without waiting for the first carrying device to move to the upper plate area, the continuous loading of the substrate can be realized, saving the substrate in the loading area The waiting time in the process is conducive to increasing the processing efficiency of the substrate and expanding the production efficiency of the enterprise.

在第一承载装置从下板区移出时，第二承载装置即可移至下板区，无需等待第一承载装置移至下料区即可实现基材的持续下来，节省了基材在下料过程中的等待时间，减少了基材在处理过程中总体所需要的时间，有利于扩大企业生产效益。When the first carrying device is moved out of the lower plate area, the second carrying device can be moved to the lower plate area, without waiting for the first carrying device to move to the unloading area, the continuous down of the base material can be realized, saving the base material during unloading The waiting time in the process reduces the overall time required for the substrate in the processing process, which is conducive to expanding the production efficiency of the enterprise.

以上所述仅为本发明的较佳实施例，并非因此限制本发明的专利范围，凡是在本发明的构思之内所作的任何修改，等同替换和改进等均应包含在本发明的专利保护范围内。The above descriptions are only preferred embodiments of the present invention, and are not intended to limit the patent scope of the present invention. Any modifications made within the concept of the present invention, equivalent replacements and improvements, etc. should be included in the scope of patent protection of the present invention. Inside.

Claims (10)

1.一种基材的上下料装置，用于提供基材给处理装置进行处理以及取回处理后的基材，其特征在于：所述基材的上下料装置包括传送装置、第一承载装置、第二承载装置、上板区、下板区、第一中转处理区、第二中转处理区，所述处理装置包括上料区及下料区，所述待加工的基材被第一承载装置、第二承载装置依次从上板区经第一中转处理区运送至上料区进行加工处理，所述已加工的基材被第一承载装置、第二承载装置依次从下料区经第二中转处理区运送至下板区。1. A substrate loading and unloading device, used to provide substrates to a processing device for processing and retrieve processed substrates, characterized in that: the substrate loading and unloading device includes a conveying device, a first carrying device , a second carrying device, an upper board area, a lower board area, a first transfer processing area, and a second transfer processing area, the processing device includes a feeding area and a feeding area, and the base material to be processed is carried by the first The device and the second carrying device are sequentially transported from the upper plate area to the loading area through the first transfer processing area for processing, and the processed substrate is sequentially transported from the unloading area to the second The transfer processing area is transported to the lower plate area. 2.一种基材的上料方法，其采用如权利要求1所述的基材的上下料装置，其特征在于：所述基材的上料方法包括如下步骤：2. a feeding method for a base material, which adopts the loading and unloading device for a base material as claimed in claim 1, characterized in that: the feeding method for said base material comprises the steps: 步骤S11：第一承载装置被传送装置带动至上板区并装载第一待加工基材；Step S11: the first carrying device is driven by the conveying device to the upper plate area and loaded with the first substrate to be processed; 步骤S12：第一承载装置被传送装置带动并将第一待加工基材从上板区运送至第一中转处理区，第二承载装置被传送装置带动至上板区并装载第二待加工基材；Step S12: The first carrying device is driven by the conveying device and transports the first substrate to be processed from the upper plate area to the first transfer processing area, and the second carrying device is driven by the conveying device to the upper plate area and loads the second substrate to be processed ; 步骤S13：第一承载装置被传送装置带动并将第一待加工基材从第一中转处理区运送并放至上料区，第二承载装置被传送装置带动并将第二待加工基材从上板区运送至第一中转处理区；Step S13: The first carrying device is driven by the conveying device and transports the first substrate to be processed from the first transfer processing area to the loading area, and the second carrying device is driven by the conveying device to transport the second substrate to be processed from the upper The board area is transported to the first transfer processing area; 步骤S14：第一承载装置被传送装置带动至上板区，第二承载装置被传送装置带动并将第二待加工基材从第一中转处理区运送至上料区，完成一次上料。Step S14: The first carrying device is driven to the plate loading area by the conveying device, and the second carrying device is driven by the conveying device to transport the second substrate to be processed from the first transfer processing area to the loading area, completing one loading. 3.如权利要求2所述的基材的上料方法，其特征在于：在所述步骤S12中，所述基材的上下料装置包括第一止挡机构，当第一承载装置被传送装置带动并将第一待加工基材从上板区运送至第一中转处理区时，第一止挡机构工作，阻止在第一承载装置离开第一中转处理区之前，第二承载装置进入第一中转处理区。3. The substrate loading method according to claim 2, characterized in that: in the step S12, the loading and unloading device for the substrate comprises a first stopper mechanism, when the first carrying device is transported When driving and transporting the first substrate to be processed from the upper plate area to the first transfer processing area, the first stop mechanism works to prevent the second carrying device from entering the first transfer processing area before the first carrying device leaves the first transfer processing area. Transit processing area. 4.如权利要求3所述的基材的上料方法，其特征在于：在所述步骤S13中，当第一承载装置被传送装置带动并将第一待加工基材从第一中转处理区运送至上料区时，第一止挡机构停止工作，解除对第二承载装置运送至第一中转处理区的阻止。4. The method for feeding substrates according to claim 3, characterized in that: in the step S13, when the first carrying device is driven by the conveying device and the first substrate to be processed is transported from the first transfer processing area When transporting to the material loading area, the first stopper mechanism stops working, and the prevention of the second carrying device from being transported to the first transfer processing area is released. 5.如权利要求2所述的基材的上料方法，其特征在于：所述第一待加工基材通过被第一承载装置夹持或吸附的方式装载至第一承载装置处；所述第二待加工基材通过被第二承载装置夹持或吸附的方式装载至第二承载装置处。5. The method for loading substrates according to claim 2, characterized in that: the first substrate to be processed is loaded onto the first carrier by being clamped or adsorbed by the first carrier; The second substrate to be processed is loaded onto the second carrying device by being clamped or adsorbed by the second carrying device. 6.如权利要求2所述的基材的上料方法，其特征在于：所述第一待加工基材与第二待加工基材为覆铜箔板或印制电路板。6 . The method for feeding substrates according to claim 2 , wherein the first substrate to be processed and the second substrate to be processed are copper clad boards or printed circuit boards. 7.一种基材的下料方法，其采用如权利要求1所述的基材的上下料装置，其特征在于：所述基材的下料方法包括如下步骤：7. A blanking method for a base material, which adopts the loading and unloading device for a base material as claimed in claim 1, characterized in that: the blanking method for the base material comprises the steps: 步骤S21：第一承载装置被传送装置带动至下料区并装载第一已加工基材；Step S21: the first carrying device is driven by the conveying device to the unloading area and loaded with the first processed substrate; 步骤S22：第一承载装置被传送装置带动并将第一已加工基材从下料区运送至第二中转处理区，第二承载装置被传送装置带动至下料区并装载第二已加工基材；Step S22: The first carrying device is driven by the conveying device and transports the first processed base material from the unloading area to the second transfer processing area, and the second carrying device is driven by the conveying device to the unloading area and loads the second processed base material material; 步骤S23：第一承载装置被传送装置带动并将第一已加工基材从第二中转处理区运送并放至下板区，第二承载装置被传送装置带动并将第二已加工基材从下料区运动至第二中转处理区；Step S23: The first carrying device is driven by the conveying device and transports the first processed substrate from the second transfer processing area to the lower plate area, and the second carrying device is driven by the conveying device and transports the second processed substrate from the The unloading area moves to the second transfer processing area; 步骤S24：第一承载装置被传送装置带动至下料区，第二承载装置被传送装置带动并将第二已加工基材从第二中转处理区运送至下板区，完成一次下料。Step S24: The first carrying device is driven to the unloading area by the conveying device, and the second carrying device is driven by the conveying device to transport the second processed base material from the second transfer processing area to the unloading area, completing a discharge. 8.如权利要求7所述的基材的下料方法，其特征在于：在所述步骤S22中，所述基材的上下料装置包括第二止挡机构，当第一承载装置被传送装置带动并将第一已加工基材从下料区运送至第二中转处理区，第二止挡机构工作，阻止在第一承载装置离开第二中转处理区之前，第二承载装置进入第二中转处理区。8. The substrate blanking method according to claim 7, characterized in that: in the step S22, the substrate loading and unloading device includes a second stop mechanism, when the first carrying device is transported Drive and transport the first processed base material from the unloading area to the second transfer processing area, and the second stop mechanism works to prevent the second carrying device from entering the second transfer processing area before the first carrying device leaves the second transfer processing area processing area. 9.如权利要求8所述的基材的下料方法，其特征在于：在所述步骤S23中，所述基材的上下料装置包括第三止挡机构，当第一承载装置被传送装置带动并将第一已加工基材从第二中转处理区运送并放至下板区时，第二止挡机构停止工作，解除对第二承载装置运送至第二中转处理区的阻止，同时第三止挡机构工作，阻止在第一承载装置离开下板区之前，第二承载装置进入下板区。9. The substrate blanking method according to claim 8, characterized in that: in the step S23, the substrate loading and unloading device includes a third stopper mechanism, when the first carrying device is transported When driving and transporting the first processed base material from the second transfer processing area to the lower plate area, the second stopper mechanism stops working and removes the prevention of the second carrying device from being transported to the second transfer processing area, and at the same time the second The three stop mechanisms work to prevent the second carrying device from entering the lower plate area before the first carrying device leaves the lower plate area. 10.如权利要求9所述的基材的下料方法，其特征在于：在所述步骤S24中，当第一承载装置被传送装置带动至下料区时，第三止挡机构停止工作，解除对第二承载装置运送至下板区的阻止。10. The substrate blanking method according to claim 9, characterized in that: in the step S24, when the first carrying device is driven to the blanking area by the conveying device, the third stop mechanism stops working, Unblock the transport of the second carrier to the lower deck area.
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