CN102386312A - LED packaging process - Google Patents

Abstract

The invention discloses an LED packaging process. The specific packaging process is as follows: 1) cleaning the surface of the support 3, taking out the silver paste or solder paste and thawing; 2) manually or automatically fixing the chip 1 on the bottom of the support 3 with the silver paste or solder paste ; 3) bake to fix the chip 1; 4) solder the positive and negative poles of the chip 1 with the support 3 with gold wire 2; Inject the adhesive 4 between the fluorescent lenses 5, place the light source in an oven to bake; or inject the adhesive 4 into the bracket 3 first, place it in an oven and bake, then join the remote fluorescent lens 5 with the bracket 3 and 6) sorting and packaging the packaged light source; the present invention can be used for SMD LED, high-power LED, and COB integrated package LED; LEDs using this packaging process can simplify the production process, improve production efficiency, and reduce fluorescence Powder light fades and improves the consistency and uniformity of light extraction performance.

Description

A kind of LED encapsulation process

Technical field: The present invention relates to an LED packaging process, which belongs to the field of solid-state lighting.

Background technology: the existing LED packaging generally adopts the following process: 1. Fix the LED chip in the middle of the bottom surface of the bracket with silver paste or solder paste; 2. Connect the positive and negative electrodes of the chip to the circuit of the bracket with gold wires; 3. Phosphor powder and silica gel or epoxy resin are mixed and stirred evenly, and air bubbles are pumped; 4. Use a glue dispenser or manually dispense glue on the bracket that has been bonded to the wire; 5. Test the glued bracket and add powder 6. Put the light source filled with powder in an oven to bake and cure; 7. Separation and color separation of the packaged patch light source; 8. Tape and pack the light source in the same color. This is the most common SMD LED or high-power packaging structure, and it is also a relatively mature packaging structure.

However, this packaging structure has some inherent disadvantages due to its technological problems. First of all, when dispensing glue, it is difficult to keep the concentration of the phosphor powder consistent from beginning to end. Since the phosphor powder exists in the binder in granular form, and its density is much higher than that of the binder, the phosphor powder will slowly precipitate in it. At the same time, the process of removing air bubbles also promotes the precipitation of phosphor powder, so the proportion of glue powder is inconsistent in the whole dispensing process, resulting in different batches or even LEDs produced by the same batch. The color coordinate error is used to classify, and some light sources that do not enter the required color classification are defective products; second, the luminous attenuation problem caused by the phosphor being heated, because the current LED packaging process is to directly combine the phosphor with the adhesive The mixture of bonding agent is glued onto the chip, and when the chip is working, it will emit a lot of heat, which will cause the temperature around the chip to rise rapidly. As a result, the luminous efficiency of the phosphor powder will continue to decline due to heat, and finally directly affect the LED light source. lifespan. Third, this structure is also relatively cumbersome, which is not conducive to mass production.

Invention content:

The purpose of the present invention is to propose a brand-new LED packaging process for some of the above-mentioned shortcomings of the existing LED packaging, so as to greatly improve the shortcomings of the existing LED packaging due to the process.

Concrete technical scheme of the present invention comprises the following steps:

1) Clean the surface of the bracket 3, and take out the silver paste or solder paste to thaw;

2) manually or automatically fix the chip 1 on the bottom of the bracket with silver paste or solder paste;

3) Bake the bracket 3 with the chip 1 fixed in an oven, so that the chip 1 is fixed at the bottom of the bracket 3;

4) Use the gold wire 2 to connect the positive and negative poles of the chip 1 with the support 3 circuit;

5) Cover and fix the remote fluorescent lens 5 on the bracket 3, then inject the adhesive 4 between the bracket 3 and the remote fluorescent lens 5, put the light source in an oven to bake; or inject the adhesive into the bracket 3 first Agent 4 is placed in an oven to bake, and then the remote fluorescent lens 5 is joined and fixed with the bracket 3;

6) Sorting and packaging the packaged light sources.

Preferably, the remote fluorescent lens 5 is molded by mixed injection molding of fluorescent powder and polycarbonate.

Preferably, the size of the chip 1 is 45mil×45mil.

Preferably, the specification of the bracket 3 is a high-power imitation lumen bracket.

The beneficial effects of the present invention are:

1. In this technical solution, the fluorescent powder is evenly distributed in the remote fluorescent prefabricated board, away from the surface of the chip, that is, away from the heat source, and there will be no serious light decay and color shift caused by the long-term heating of the fluorescent powder in the existing packaging process The problem of maintaining color stability;

2. The blending of phosphor powder and polymer compound in this technical solution can make the phosphor powder evenly distributed in the polymer compound matrix, avoiding the problem of poor uniformity of the same batch of light sources caused by phosphor powder precipitation;

3. Adopting a kind of LED packaging process in this technical solution reduces the process of dispensing glue and replenishing powder in the existing packaging process, improves the consistency and yield of products, simplifies the packaging production process, and improves production efficiency , Improve the consistency and uniformity of the light extraction performance and reduce the cost of the product.

Description of drawings:

Fig. 1 packaging process flow chart 1 of the present invention;

Fig. 2 packaging process flow chart 2 of the present invention

Fig. 3 is a sectional view of an embodiment of the present invention;

Fig. 4 is the top view of an embodiment of the present invention;

Detailed ways:

Example 1:

1) First clean the surface of the high-power imitation lumen bracket and take out the silver paste and thaw it for use;

2) Fix the chip with a size of 45mil on the bottom of the high-power imitation lumen bracket through silver paste;

3) After fixing the chips, place them in an oven and bake at 150 degrees for 1 hour;

4) Connect the positive and negative electrodes of the chip to the support circuit with a gold wire;

5) Cover and fix the remote fluorescent lens which is mixed with yellow phosphor YAG and polycarbonate PC and injection-molded on the bracket, PC:YAG=5:1;

6) Inject silica gel into the gap between the bracket and the remote fluorescent lens through the injection hole;

7) Place the light source filled with silica gel in an oven at 120 degrees for 2 hours;

8) Finally, the packaged and molded light sources are sorted and packaged.

Example 2:

1) First clean the surface of the 5050 bracket and take out the silver paste and thaw it for use;

2) Fix a chip with a size of 45mil in a 5050 bracket through silver paste;

3) After fixing the chips, place them in an oven and bake at 150 degrees for 1 hour;

4) Connect the positive and negative electrodes of the chip to the support circuit with a gold wire;

5) First inject silica gel into the 5050 bracket;

6) Put the glue-filled light source in an oven at 120 degrees and bake for 2 hours;

7) Join and fix the remote fluorescent lens mixed with yellow phosphor YAG and polycarbonate PC and injection molded with the bracket, PC:YAG=5:1;

8) Finally, the packaged and molded light sources are sorted and packaged.

Claims (5)

1. A kind of LED encapsulation technology, it is characterized in that comprising the following steps: 1) Clean the surface of the bracket 3, and take out the silver paste or solder paste to thaw; 2) manually or automatically fix the chip 1 on the bottom of the bracket 3 with silver paste or solder paste; 3) Bake the bracket 3 of the fixed chip 1 in an oven, so that the chip 1 is fixed on the bottom of the bracket 3; 4) Use the gold wire 2 to connect the positive and negative poles of the chip 1 with the support 3 circuit; 5) Cover and fix the remote fluorescent lens 5 on the bracket 3, then inject the adhesive 4 between the bracket 3 and the remote fluorescent lens 5, put the light source in an oven to bake; or inject the adhesive into the bracket 3 first Agent 4 is placed in an oven to bake, and then the remote fluorescent lens 5 is joined and fixed with the bracket 3; 6) Sorting and packaging the packaged light sources. 2. A LED packaging process according to claim 1, characterized in that the remote fluorescent lens 5 is a mixture of fluorescent powder and polymer material, wherein the fluorescent powder is one of yellow, red, green fluorescent powder or Various; the polymer material is one of polycarbonate, polymethyl methacrylate, epoxy resin, and silica gel; the mass ratio of phosphor to polymer material is 1:2-10; 3. The LED packaging process according to claim 1, wherein the adhesive 4 is silica gel or epoxy resin. 4. A LED packaging process according to claim 1, characterized in that said support 3 is for 3014 or 3020 or 3528 or 5050 or 5630 or 6720 patch type LED support or high-power LED support or COB integrated packaging substrate. 5. A chip type LED packaging structure according to claim 1, characterized in that said chip 1 is a chip with a specification of 9x11mil or 12x12mil or 24x24mil or 38x38mil or 45x45mil or 50x50mil or 55x55mil.

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