CN206040705U - White light LED collection moulding piece of independent encapsulation - Google Patents

Abstract

The utility model discloses an independently encapsulated white light LED integrated module, which relates to the technical field of LED encapsulation. It includes at least one LED chip and a circuit board; the circuit board includes a substrate and a circuit layer on the substrate, and the positive and negative electrodes of the LED chip are connected to the corresponding pads of the circuit layer; the LED chip is covered with encapsulation glue; the structure is simple, and the LED chip is extended Longer working life, improved lumen value during use, low cost and simple process.

Description

An independently packaged white LED integrated module

technical field

The utility model relates to the technical field of LED packaging.

Background technique

With the continuous development of LED technology, white LED light source devices are widely used in LED backlight, lighting source and automotive lighting and other fields.

White light LEDs are usually formed by two methods. The first is to use "blue light chips" to cooperate with phosphors to form white light; the second is to mix multiple monochromatic lights. Both approaches have been successful in producing white light. Existing packaging products have low light extraction efficiency due to a lot of shading; the existing packaging process is complex and costly.

Utility model content

The technical problem to be solved by the utility model is to provide an independently packaged white LED integrated module for the above-mentioned deficiencies in the prior art. Simple.

In order to solve the above-mentioned technical problems, the technical solution adopted by the utility model is: comprise at least one LED chip and circuit board; Connected; the LED chip is covered with encapsulation glue.

Preferably, the encapsulation glue is hemispherical or arc-shaped.

Preferably, the encapsulation glue includes encapsulation colloid and phosphor powder, and the phosphor powder and the encapsulation colloid are evenly mixed.

Preferably, the encapsulating colloid is organic silica gel or epoxy resin glue.

As preferred, aluminum-based, copper-based, glass fiber, ceramic circuit boards.

The beneficial effects produced by adopting the above technical solution are: the utility model has a simple structure, and the hemispherical or arc-shaped packaging structure facilitates the light emission of the LED chip, improves the light output efficiency, and at the same time increases the light output angle and the average beam angle, so that the visual Good uniformity; SMD packaging process and soldering surface mount process are omitted, the cost is lower, the working life of the LED is prolonged, and the lumen value during use is improved. The process is simple, energy-saving and environmentally friendly.

Description of drawings

Fig. 1 is the structural representation of an embodiment of the utility model;

Fig. 2 is the structural representation of embodiment 1;

FIG. 3 is a schematic structural view of Embodiment 2.

In the figure: 1. LED chip; 2. Circuit board; 3. Packaging glue; 4. Solder pad; 2.1. Substrate; 2.2. Circuit layer.

detailed description

Below in conjunction with accompanying drawing and specific embodiment, the utility model is described in further detail.

As shown in Figure 1, it is an embodiment of a kind of independently packaged white LED integrated module of the present invention, including at least one LED chip 1 and a circuit board 2; the circuit board 2 includes a substrate 2.1 and a circuit layer on the substrate 2.1 2.2. The positive and negative poles of the LED chip 1 are connected to the corresponding pads of the circuit layer 2.2; the LED chip 1 is covered with encapsulation glue 3 .

The substrate plays the role of carrier and heat conduction, the positive and negative poles of the LED chip 1 are connected to the corresponding pads of the circuit layer 2.2, and the power supply circuit of the LED chip 1 is realized through the circuit layer 2.2; the packaging structure is simple, the material is less, and the process is simple. The SMD packaging process and soldering surface-mounting process are omitted, the cost is lower, energy saving and environmental protection; LED chip 1 can quickly transfer heat laterally through the copper clad circuit layer 2.2, and then transfer the heat to the substrate 2.1 or directly fix it on the substrate. The longitudinal heat conduction path through the base material 2.1 on the material 2.1 makes the thermal resistance of the module itself extremely small, and the temperature difference T _j -T _c between the junction temperature and the case is generally 0.5-5°C. Therefore, the working life of the LED chip is prolonged, and the lumen value during use is improved; the light output angle and the average beam angle are increased, which can illuminate the surface of the module substrate, and make the visual uniformity of the light-emitting surface of the lamp better.

Preferably, the packaging glue 3 is hemispherical or arc-shaped, and can also be other specific shapes; the hemispherical packaging structure makes the light output window of the LED chip 1 larger, which is convenient for the light emission of the LED chip 1, and at the same time, because of its arched structure, the phosphor powder During the exiting process of the excited light, the exit surface is enlarged and the occlusion is reduced, which is convenient for one exit and is more conducive to improving the light extraction efficiency; the light exit angle exceeds 180°, and the average beam angle exceeds 130°, which can illuminate the surface of the module substrate and make the light-emitting surface of the lamp visually Uniformity is better.

Preferably, the encapsulating glue 3 includes encapsulating colloid and phosphor powder, the phosphor powder and the encapsulating colloid are evenly mixed, and modifying additives may also be added.

Preferably, the packaging colloid is a transparent colloid material such as organic silica gel, epoxy resin glue, etc., which has good light emission.

Preferably, the circuit board 2 is an aluminum-based, copper-based, glass fiber, or ceramic circuit board, which has good thermal conductivity, electrical insulation performance and machinability.

Example 1:

Formally installed LED blue light chip package white light source module:

As shown in Figure 2: First, place the cleaned aluminum-based circuit board 2 on the crystal-bonding table, and fix the LED chip 1 on the circuit board 2 through the crystal-bonding process; then, use bonding equipment to bond the LED chip 1 The positive and negative pads are connected to the corresponding pads 4 of the aluminum-based circuit board through wires; finally, the mixing of phosphor powder, organic silica gel and various modified additives is completed in proportion, and the mixed encapsulation glue 3 is covered on the LED chip 1 and the circuit board 2, pay attention to make the LED chip 1 in the center of the packaging glue 3, and pay attention to adjust the shape of the packaging glue 3. After testing that the color temperature is suitable, put the sealed substrate into a thermal cycle oven to complete heating and curing.

Example 2:

Flip-chip LED blue light chip packaging white light source module:

As shown in Figure 3: first, place the cleaned aluminum-based circuit board 2 on the crystal bonding table, and fix the LED chip 1 on the circuit board 2 with a specific solder paste through the crystal bonding process; then, use the eutectic process to process Solder the positive and negative electrodes of the LED chip 1 on the corresponding pads 4 of the aluminum-based circuit board 2; finally, complete the mixing of phosphor powder, organic silica gel and various modified additives in proportion, and cover the mixed packaging glue 3 on the On the LED chip 1 and the circuit board 2, pay attention to make the LED chip 1 in the center of the packaging glue 3, and pay attention to adjust the shape of the packaging glue 3. After testing that the color temperature is suitable, put the sealed substrate into a thermal cycle oven to complete heating and curing.

After adopting the above technical solution, the light extraction efficiency is high: the hemispherical or arc-shaped packaging structure makes the light output window of the LED chip larger, which is convenient for the light output of the LED chip, and at the same time, the arched structure increases the output surface during the emission process of the light excited by the phosphor powder. Large, less occlusion, easy to emit at one time, so the light output efficiency is improved;

Large light output angle: the light output angle exceeds 180°, and the average beam angle exceeds 130°, which can illuminate the surface of the module substrate and make the visual uniformity of the light-emitting surface of the lamp better;

High lumen maintenance rate: The LED chip can quickly transfer heat horizontally through the copper clad circuit layer, and then transfer the heat to the substrate or directly fix it on the substrate. Through the longitudinal heat conduction path of the substrate, the thermal resistance of the module itself is extremely small. Junction-case temperature difference TJ-TC is generally 0.5-5 ℃. Thereby prolonging the working life of the LED and improving the lumen value during use;

High cost performance: less material is used, the process is simple, the SMD packaging process and soldering surface mount process are omitted, the cost is lower, energy saving and environmental protection.

The above descriptions are only preferred embodiments of the present utility model, and are not intended to limit the present utility model. Any modifications, equivalent replacements and improvements made within the spirit and principles of the present utility model shall be included in this utility model. within the scope of protection of utility models.

Claims (3)

1. An independently packaged white LED integrated module, characterized in that it includes at least one LED chip (1) and a circuit board (2); the circuit board (2) includes a base material (2.1) and a base material (2.1) On the circuit layer (2.2), the positive and negative poles of the LED chip (1) are connected to the corresponding pads of the circuit layer (2.2); the LED chip (1) is covered with encapsulation glue (3). 2. An independently packaged white LED integrated module according to claim 1, characterized in that the packaging glue (3) is hemispherical or arc-shaped. 3. An independently packaged white LED integrated module according to claim 1, characterized in that the circuit board (2) is an aluminum-based, copper-based, glass fiber or ceramic circuit board.