dos Santos Filho et al., 2021 - Google Patents

Pool boiling performance of HFE-7100 on hierarchically structured surfaces

dos Santos Filho et al., 2021

View HTML
Document ID
512798648554724526
Author
dos Santos Filho E
Kiyomura I
de Andrade B
Cardoso E
Publication year
Publication venue
Case Studies in Thermal Engineering

External Links

Snippet

The evolution of the processes for modifying/manufacturing surfaces has facilitated the advancement in pool boiling research with surfaces capable of increasing the heat transfer coefficient (HTC) and the critical heat flux (CHF) through micro/nanostructures heating …
Continue reading at www.sciencedirect.com (HTML) (other versions)

Classifications

    • H—ELECTRICITY
    • H01—BASIC ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—BASIC ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—BASIC ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H01—BASIC ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H—ELECTRICITY
    • H01—BASIC ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L2021/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
    • H01L2021/60007—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation involving a soldering or an alloying process
    • H01L2021/60022—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation involving a soldering or an alloying process using bump connectors, e.g. for flip chip mounting
    • H01L2021/60097—Applying energy, e.g. for the soldering or alloying process
    • H01L2021/60172—Applying energy, e.g. for the soldering or alloying process using static pressure
    • H—ELECTRICITY
    • H01—BASIC ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks

Similar Documents

Publication Publication Date Title
dos Santos Filho et al. Pool boiling performance of HFE-7100 on hierarchically structured surfaces
Zhang et al. 3D heterogeneous wetting microchannel surfaces for boiling heat transfer enhancement
Tang et al. Enhanced heat transfer coefficient of flow boiling in microchannels through expansion areas
Khan et al. Design, fabrication and nucleate pool-boiling heat transfer performance of hybrid micro-nano scale 2-D modulated porous surfaces
Dedov A review of modern methods for enhancing nucleate boiling heat transfer
Siddiqui et al. Hybrid nanofluid spray cooling performance and its residue surface effects: Toward thermal management of high heat flux devices
Demir et al. Effect of silicon nanorod length on horizontal nanostructured plates in pool boiling heat transfer with water
Kumar et al. Role of inter-nanowire distance in metal nanowires on pool boiling heat transfer characteristics
Alam et al. A comparative study of flow boiling HFE-7100 in silicon nanowire and plainwall microchannels
Sun et al. Hierarchically 3D-textured copper surfaces with enhanced wicking properties for high-power cooling
Shi et al. Pool boiling heat transfer enhancement with copper nanowire arrays
Lee et al. Enhanced thermal uniformity and stability in pool boiling heat transfer using ultrasonic actuation
Zhou et al. Markedly enhanced pool boiling heat transfer performance on maicropaorous copper surfaces fabricated utilizing a facile wire cutting process
Liu et al. Enhancement of pool boiling heat transfer using 3D-printed groove structure
Lin et al. Boiling heat transfer on the micro-nano structured surface fabricated by mechanical sandblasting/alkali-assisted oxidation
Lee et al. Enhanced boiling heat transfer on micro-structured surfaces via ultrasonic actuation
Hsu et al. Enhanced immersion cooling using two-tier micro-and nano-structures
Li et al. Pool boiling heat transfer of multi-scale composite copper powders fabricated by sintering-alloying-dealloying treatment
Liu et al. The suppression effect of easy-to-activate nucleation sites on the critical heat flux in pool boiling
Jo et al. Modifying capillary pressure and boiling regime of micro-porous wicks textured with graphene oxide
Lin et al. Comparative study of pool boiling heat transfer on different subtractive surfaces
Lu et al. Enhanced capillary-driven thin film boiling through superhydrophilic mesh wick structure
El-Genk Nucleate boiling enhancements on porous graphite and microporous and macro–finned copper surfaces
Li et al. Highly efficient boiling heat transfer of copper surface with sub-10 µm channels fabricated by elliptical vibration chiseling
Hsu et al. Enhancing boiling heat transfer by ultrafast laser texturing of groove structures on thin-film graphene surfaces