Tam et al., 1989 - Google Patents

Picosecond laser sputtering of sapphire at 266 nm

Tam et al., 1989

View PDF
Document ID
15465407431805043386
Author
Tam A
Brand J
Cheng D
Zapka W
Publication year
Publication venue
Applied physics letters

External Links

Snippet

We observe that 266 nm laser pulses of 30 ps duration and fluence near 10 J/cm2 causes reproducible surface sputtering and etching of crystalline sapphire in air. The etching rate for the initial ten pulses is relatively slow, 0.04 μm/pulse, producing a smooth surface of the …
Continue reading at pubs.aip.org (PDF) (other versions)

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0626—Energy control of the laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/073—Shaping the laser spot
    • B23K26/0736—Shaping the laser spot into an oval shape, e.g. elliptic shape
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece

Similar Documents

Publication Publication Date Title
Tam et al. Picosecond laser sputtering of sapphire at 266 nm
Wang et al. Water-assisted femtosecond laser drilling of 4H-SiC to eliminate cracks and surface material shedding
US5057184A (en) Laser etching of materials in liquids
US4980536A (en) Removal of particles from solid-state surfaces by laser bombardment
US6864459B2 (en) High precision, rapid laser hole drilling
Bonse et al. Femtosecond laser ablation of silicon–modification thresholds and morphology
JP4035981B2 (en) Circuit formation method using ultrashort pulse laser
Zapka et al. “Laser cleaning” removes particles from surfaces
Rudolph et al. Femtosecond-and nanosecond-pulse laser ablation of bariumalumoborosilicate glass
US4092515A (en) Laser method of precision hole drilling
JP2011218384A (en) Laser processing method for transparent material
Genin et al. Laser-induced damage of fused silica at 355 and 1064 nm initiated at aluminum contamination particles on the surface
Garnov et al. Microsecond laser material processing at 1.06 mum
Nolte et al. Cutting of optical materials by using femtosecond laser pulses
Zhao et al. Micromachining with ultrashort laser pulses
Ashkenasi et al. Laser ablation and structuring of transparent materials with ultrashort laser pulses
Zapka et al. Laser cleaning: Laser‐induced removal of particles from surfaces
Zimmer et al. Enhancing the etch rate at backside etching of fused silica
Kawakami et al. Tungsten microcone arrays grown using nanosecond pulsed-Nd: YAG laser in a low-pressure He-gas atmosphere
Migulin et al. Oxygen-assisted laser cutting and drilling of CVD diamond
Gadag Studying the mechanism of micromachining by short pulsed laser
Battaglia et al. Synova has re-invented the laser: No heat damage, no beam divergence, no cutting gas, no deposition
Lowndes et al. Ablation, melting, and smoothing of polycrystalline alumina by pulsed excimer laser radiation
Warner et al. Industrial applications of high-power copper vapor lasers
Zhao et al. Development of wide bandgap semiconductor photonic device structures by excimer laser micromachining