WO2025163891A1 - Optical waveguide element, optical waveguide device, and optical transmission apparatus - Google Patents
Optical waveguide element, optical waveguide device, and optical transmission apparatusInfo
- Publication number
- WO2025163891A1 WO2025163891A1 PCT/JP2024/003502 JP2024003502W WO2025163891A1 WO 2025163891 A1 WO2025163891 A1 WO 2025163891A1 JP 2024003502 W JP2024003502 W JP 2024003502W WO 2025163891 A1 WO2025163891 A1 WO 2025163891A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- optical waveguide
- substrate
- optical
- waveguide element
- reinforcing block
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/03—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on ceramics or electro-optical crystals, e.g. exhibiting Pockels effect or Kerr effect
- G02F1/035—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on ceramics or electro-optical crystals, e.g. exhibiting Pockels effect or Kerr effect in an optical waveguide structure
Definitions
- the present invention relates to an optical waveguide element, an optical waveguide device, and an optical transmitter.
- optical modulators incorporating an optical modulation element as an optical waveguide element, which is composed of an optical waveguide formed on a substrate and a control electrode that controls the light wave propagating through the optical waveguide, are widely used.
- optical waveguide elements that perform optical modulation semiconductor optical modulation elements using semiconductor substrates such as InP substrates and LN optical modulation elements using LiNbO3 (hereinafter also referred to as LN) as a substrate have been put to practical use.
- Optical waveguide elements built into driver-integrated LN modulators which have been developed in recent years, or mounted directly on optical transceivers, are increasingly being required to be compact, in addition to offering higher performance such as lower power consumption, higher speeds, and wider bandwidths.
- CDM Coherent Driver Modulators
- the optical waveguides used in these optical waveguide elements are often ridge- or rib-shaped, which provide strong light confinement. This allows for low-loss folding in the waveguide direction, and the high-density arrangement of functional elements such as associated high-frequency electrodes, DC electrodes, and light-receiving elements for optical monitoring (e.g., photodiodes (PDs)) achieves both high functionality and compactness.
- PDs photodiodes
- the ridge-type and rib-type optical waveguides used in the above-mentioned optical waveguide elements have a mode field diameter (MFD) for propagating light of 3 ⁇ m or less.
- MFD mode field diameter
- optical components such as optical fibers that are bonded to the end face of the optical waveguide have an MFD of around 10 ⁇ m. Therefore, a spot size converter (SSC) is installed at the output end of the optical waveguide element to increase the MFD.
- SSC spot size converter
- a rectangular glass block (reinforcement block) is placed at the end of the optical waveguide element across the entire width of the substrate of the optical waveguide element, covering the optical waveguide containing the SSC.
- This reinforcing block is usually fixed to the substrate with an adhesive. Because this adhesive also functions as a cladding layer for the SSC, the reinforcing block plays an important role in constructing the optical waveguide element.
- Patent Document 1 discloses an optical waveguide element that includes a reinforcing block at the edge of the substrate and a light-receiving element for monitoring light on the surface of the substrate.
- the light-guiding direction of the optical waveguide that guides light to the light-receiving element is bent back, allowing the light-receiving element to be mounted on the part of the substrate surface where no reinforcing block is provided.
- Functional elements arranged on the substrate of an optical waveguide element may include, in addition to the light receiving element, an SSC, a buffer layer, a thick film electrode for high-frequency signals, an electrode pad (wiring electrode portion), and a thin film electrode for DC or low-frequency signals.
- the thickness of the adhesive layer between the reinforcing block and the substrate must be increased to the same thickness as these functional elements.
- Such a thick adhesive layer can cause problems such as cracks due to thermal expansion and contraction caused by ambient temperature fluctuations.
- the objective of this invention is to improve the degree of freedom in arranging functional elements on a substrate, thereby enabling the realization of highly functional optical waveguide elements without increasing the size of the substrate.
- One aspect of the present invention is an optical waveguide element comprising a substrate, an optical waveguide formed on one main surface of the substrate, and a reinforcing block arranged on the one main surface of the substrate so as to be aligned with an end face of the substrate, the end face being a light input/output surface that inputs light to the optical waveguide and outputs light from the optical waveguide, wherein the reinforcing block is either composed of a plurality of rectangular blocks, or composed of a single block having a shape obtained by removing at least a portion of a single rectangular block from the single rectangular block.
- the reinforcing block is a single block having a shape obtained by removing at least a portion of a single rectangular prism from the single rectangular prism, and the removed portion, which is the portion of the reinforcing block removed from the single rectangular prism, is formed at a position other than directly above the end of the optical waveguide where light enters and exits through the light entrance and exit surface of the substrate.
- the removed portion is at least one notch formed in at least one surface of the reinforcing block.
- the removed portion which is at least one notch portion, is formed on a surface of the reinforcing block that faces a surface of the substrate that is aligned with the light incident/exit surface.
- the removal portion which is at least one notch portion, is formed on a surface of the reinforcing block facing the main surface of the substrate.
- the removed portion is a through hole provided in the reinforcing block and opening in a direction perpendicular to the main surface of the substrate.
- the reinforcing block has a surface that faces the surface of the substrate along the light incident/exit surface and that forms a concave curved surface.
- the reinforcing block has a pentagonal shape in plan view when viewed from a normal direction to the main surface of the substrate. According to another aspect of the present invention, the reinforcing block has a trapezoidal shape in plan view when viewed from a normal direction to the main surface of the substrate.
- the optical waveguide includes an optical input waveguide that propagates input light input through the optical input/output surface of the substrate, and an optical output waveguide that propagates output light output through the optical input/output surface of the substrate toward the optical input/output surface, the optical input waveguide and the optical output waveguide including a spot size conversion section in which the cross-sectional size of the optical waveguide changes toward an end of the optical waveguide, and the removal section is formed at a position other than directly above the spot size conversion section.
- an adhesive layer is provided between the reinforcing block and one main surface of the substrate.
- the reinforcing block has a refractive index lower than that of the optical waveguide.
- an electrical circuit element, an optical element, or a mechanical element is arranged in the space between the plurality of rectangular blocks, or in the space of the removed portion, which is the portion removed from the single rectangular block, in a substrate on which a reinforcing block composed of a single block having a shape obtained by removing at least a portion of the single rectangular block is arranged.
- an optical component is fixed to a surface of the reinforcing block along the light incident/exit surface.
- optical waveguide device comprising: any one of the optical waveguide elements described above; a housing that houses the optical waveguide element; an input optical fiber that inputs light to the optical waveguide element; and an output optical fiber that guides output light emitted by the optical waveguide element to the outside of the housing.
- the optical waveguide element is an optical waveguide device that includes electrodes on the substrate that control light waves propagating through the optical waveguide, and a drive circuit inside the housing that drives the optical waveguide element.
- optical transmission apparatus comprising any one of the optical waveguide devices described above and an electronic circuit that generates an electrical signal for causing the optical waveguide element to operate.
- the present invention improves the degree of freedom in arranging functional elements on a substrate, making it possible to realize a highly functional optical waveguide element without increasing the substrate size.
- FIG. 1 is a plan view of an optical waveguide element according to a first embodiment of the present invention.
- FIG. 2 is a side view of the optical waveguide element shown in FIG.
- FIG. 3 is a cross-sectional view of the optical waveguide element shown in FIG. 1 taken along line III-III.
- FIG. 4 is a cross-sectional view of the optical waveguide element shown in FIG. 1 taken along line IV-IV.
- FIG. 5 is a plan view of an optical waveguide element according to a second embodiment of the present invention.
- FIG. 6 is a plan view of an optical waveguide element according to a third embodiment of the present invention.
- FIG. 7 is a plan view of an optical waveguide element according to a fourth embodiment of the present invention.
- FIG. 1 is a plan view of an optical waveguide element according to a first embodiment of the present invention.
- FIG. 2 is a side view of the optical waveguide element shown in FIG.
- FIG. 3 is a cross-sectional view of the optical waveguide element
- FIG. 8 is a plan view of an optical waveguide element according to a fifth embodiment of the present invention.
- FIG. 9 is a plan view of an optical waveguide element according to a sixth embodiment of the present invention.
- FIG. 10 is a plan view of an optical waveguide element according to a seventh embodiment of the present invention.
- FIG. 11 is a plan view of an optical waveguide element according to an eighth embodiment of the present invention.
- FIG. 12 is a cross-sectional view of the optical waveguide element shown in FIG. 11 taken along line XII-XII.
- FIG. 13 is a plan view of an optical waveguide element according to a ninth embodiment of the present invention.
- FIG. 14 is a cross-sectional view of the optical waveguide element shown in FIG. 13 taken along line XIV-XIV.
- FIG. 15 is a diagram showing the configuration of an optical waveguide device according to a tenth embodiment of the present invention.
- FIG. 16 is a diagram showing the configuration of an optical transmitting apparatus according to the
- First embodiment 1 is a plan view showing the configuration of an optical waveguide element 1a according to a first embodiment of the present invention.
- the optical waveguide element 1a includes a substrate 10 having an electro-optic effect, an optical waveguide 14 formed on one main surface 12 (the surface shown in FIG. 1) of the substrate 10, and electrodes 16 for controlling light waves propagating through the optical waveguide 14.
- Substrate 10 is, for example, an LN substrate.
- substrate 10 is not limited to an LN substrate and may be a substrate made of lithium tantalate (LT), PLZT (lead lanthanum zirconate titanate), or other materials, or may be a substrate made of various materials such as semiconductor materials or organic materials.
- LT lithium tantalate
- PLZT lead lanthanum zirconate titanate
- the electrodes 16 are arranged, for example, on the main surface of the substrate 10 at positions sandwiching the optical waveguide 14.
- the arrangement of the electrodes 16 shown in FIG. 1 is only one example, and the electrodes 16 can be arranged in any appropriate position in the design, depending on the material and/or crystal orientation used in the substrate 10.
- the electrodes 16 may be arranged on the optical waveguide 14. This is also true in other embodiments.
- the substrate 10 is rectangular in plan view, for example, and has two opposing left and right end faces 18a and 18b that extend in the vertical direction as shown, and two opposing upper and lower end faces 18c and 18d that extend in the horizontal direction as shown.
- the optical waveguide 14 is, for example, a convex optical waveguide (e.g., a rib-type optical waveguide or a ridge-type optical waveguide) formed on the main surface 12 of the substrate 10 and consisting of a convex portion extending in a strip shape.
- the convex waveguide is implemented by forming grooves on both sides of the optical waveguide 14 on the main surface 12.
- the optical waveguide 14 includes two Mach-Zehnder optical waveguides. This allows the optical waveguide element 1a to function as an optical modulator.
- Figure 2 is a side view of the optical waveguide element 1a shown in Figure 1, viewed from the direction of the end surface 18d of the substrate 10.
- the other main surface opposite to the one main surface 12 of the substrate 10 is bonded to a support plate 20 for reinforcement.
- the end surface 18b of the substrate 10 constitutes a light input/output surface 22 through which light is input to the optical waveguide 14 and through which light is output from the optical waveguide 14.
- the optical waveguide 14 includes an optical input waveguide 24a that propagates input light input through the optical input/output surface 22 of the substrate 10, and optical output waveguides 24b and 24c that propagate output light output through the optical input/output surface 22 of the substrate 10 toward the optical input/output surface 22.
- the optical input waveguide 24a and the optical output waveguides 24b, 24c each include spot size conversion sections 26a, 26b, 26c (shown as black triangular sections) where the cross-sectional size of the optical waveguide 14 changes toward the end of the optical waveguide 14.
- the optical input waveguide 24a and the optical output waveguides 24b, 24c will be collectively referred to as the optical input/output waveguides 24.
- the spot size conversion sections 26a, 26b, 26c will be collectively referred to as the spot size conversion section 26.
- the spot size conversion sections 26 are tapered so that the length in the thickness direction and the length in the principal surface direction of the substrate 10 in a cross section perpendicular to the extension direction of the optical input/output waveguides 24 decrease toward the respective ends of the optical input/output waveguides 24.
- the optical waveguide element 1a also includes a reinforcing block 28a arranged on the main surface 12 of the substrate 10 so as to align with the end face 18b, which is the light incident/emitting surface 22 of the substrate 10.
- the reinforcing block 28a being arranged "along the end face 18b” means that one face of the reinforcing block 28a is arranged flush or nearly flush with the end face 18b, or is arranged so as to be on the same plane as or nearly flush with the end face 18b.
- the reinforcing block 28a is arranged so that the face 36a on the right side of the reinforcing block 28a is flush with the end face 18b, which is the light incident/emitting surface 22 of the substrate 10.
- the optical waveguide element 1a has an adhesive layer 30 between the reinforcement block 28a and the main surface 12 of the substrate 10.
- the adhesive layer 30 also functions as a cladding layer for the spot size conversion section 26 located thereunder.
- the reinforcement block 28a and the adhesive layer 30 are made of a material with a refractive index lower than that of the optical waveguide 14.
- the adhesive layer 30 is made of a transparent resin.
- the reinforcement block 28a is preferably made of a material with good processability, such as alkali-free glass that is less susceptible to thermal deformation.
- optical components are fixed to the surface 36a (i.e., the surface along the light incident/exit surface 22) of the reinforcement block 28a, which is arranged flush with the light incident/exit surface 22 of the substrate 10.
- the optical component is, for example, a lens array 32.
- the optical component may include any optical component such as a lens, a wave plate, or a prism. This makes it possible to easily fabricate an assembly including the optical waveguide element 1a and the optical component by using the reinforcement block 28a as a structure for fixing the optical component.
- reinforcing block 28a is composed of a single block having a shape obtained by removing at least one portion (i.e., one or more portions) of a single rectangular parallelepiped from the rectangular parallelepiped.
- a shape obtained by removing at least one portion of a single rectangular parallelepiped from the rectangular parallelepiped describes the shape of reinforcing block 28a, and does not necessarily mean that reinforcing block 28a is actually made by removing a portion of a single rectangular parallelepiped.
- the removed portion 34a which is the portion of the reinforcing block 28a that has been removed from the single rectangular parallelepiped, does not include the position directly above the end of the optical waveguide 14 where light enters and exits via the light incident and exit surface 22 of the substrate 10.
- the removed portion 34a be formed in a position other than directly above the end of the optical waveguide 14.
- the end of the optical waveguide 14 where light enters and exits via the light incident and exit surface 22, in this embodiment, is the end of the optical input/output waveguide 24 on the light incident and exit surface 22 side.
- the reinforcing block 28a is located directly above the end of the optical waveguide 14 where light enters and exits, allowing the reinforcing block 28a and adhesive layer 30 to function as cladding at the end. This achieves good optical confinement at the end of the optical waveguide 14 where light enters and exits, resulting in an optical waveguide element 1a with high functionality and low optical loss.
- the removed portion 34a does not include the position directly above the spot size conversion portion 26 formed by the end of the optical input/output waveguide 24.
- the removed portion 34a is formed in a position other than directly above the spot size conversion portion 26.
- a reinforcing block 28a exists directly above the spot size conversion portion 26 via the adhesive layer 30, thereby achieving good light confinement in the spot size conversion portion 26.
- the removed portion 34a may be, for example, at least one notch formed on at least one surface of the reinforcing block 28a. More specifically, in this embodiment, the removed portion 34a is formed on the surface 36b of the reinforcing block 28a that faces the surface 36a that is aligned with the light incident/exit surface 22 (end surface 18b) of the substrate 10.
- the shape of this removed portion 34a can be easily formed, for example, using a laser-based cutting device or an NC milling machine.
- a space is created above the optical output waveguides 24b and 24c, excluding their respective ends, by the cutout portion, the removed portion 34a.
- Light-receiving elements 38a and 38b which serve as electrical circuit elements, are arranged in this space to monitor the light waves propagating through the respective waveguide portions. These light-receiving elements 38a and 38b can be fixed to the top of the optical output waveguides 24b and 24c via a thin adhesive layer so as to evanescently couple with the optical output waveguides 24b and 24c, respectively (see Figure 3).
- the reinforcing block 28a can be configured with cutouts for only the portions where electrical circuit elements, optical elements, or mechanical elements are to be placed, so the area of the adhesive surface with the substrate 10 is not significantly reduced. This ensures sufficient fixing strength between the reinforcing block 28a and the substrate 10.
- the reinforcing block 28a does not have a notch on the surface 36a that is aligned with the light input/output surface 22 of the substrate 10, so the reinforcing block 28a can function as a cladding regardless of where the end of the light input/output waveguide 24 is located on the light input/output surface 22. Therefore, in the optical waveguide element 1a, the degree of freedom in the placement of the end of the light input/output waveguide 24, which is part of the optical waveguide 14, is maintained, while the degree of freedom in the placement of functional elements on the substrate 10 can be increased.
- the external size of the reinforcement block 28a is such that the lengths of all three sides of the external shape of the reinforcement block 28a are 0.2 mm or more, more preferably 0.4 mm or more, and even more preferably 0.6 mm or more. Furthermore, from the viewpoint of adhesive strength, the adhesive area between the reinforcing block 28a and the substrate 10 is preferably 1.0 mm 2 or more.
- the ratio R of the area of the removed portion 34a to the total area can be at least 1% or more.
- the ratio R is preferably 10% or more, more preferably 30% or more, and even more preferably 50% or more from the perspective of more effectively utilizing the upper surface of the substrate.
- the ratio R is preferably 70% or less, and more preferably 60% or less. For the same reason, the ratio R is more preferably 50% or less. The same applies to other embodiments.
- planar shape of the removal portion 34a which is the cutout portion shown in Figure 1
- planar shape of the removal portion 34a as a cutout portion is not limited to a rectangle and can be any shape, such as a polygon, circle, or ellipse.
- the removed portion 34a of the reinforcing block 28a is a single notch provided on the surface 36b opposite the surface 36a along the light incident/exit surface 22 of the substrate 10.
- the reinforcing block may have multiple removed portions formed thereon.
- FIG. 5 is a plan view showing the configuration of an optical waveguide element 1b according to a second embodiment of the present invention. Note that in FIG. 5, the same components as those in FIG. 1 are designated by the same reference numerals, and the explanation for FIG. 1 above is applicable.
- the optical waveguide element 1b has a configuration similar to that of the optical waveguide element 1a according to the first embodiment shown in FIG. 1, but differs in that it has a reinforcing block 28b instead of the reinforcing block 28a.
- the reinforcing block 28b has the same configuration as the reinforcing block 28a, but differs in that a removed portion 34b is formed in addition to the removed portion 34a which is a cutout portion.
- the removed portion 34b is a cutout portion similar to the removed portion 34a.
- the removed portion 34b is formed, for example, at the corner of the reinforcement block 28b between the surface 36b and the surface 36c adjacent to the surface 36b.
- a plurality of electrode pads 40 serving as electrical circuit elements are arranged in the space on the main surface 12 of the substrate 10 secured by the removed portion 34b.
- the electrode pads 40 may be connected to the electrodes (not shown) of the light-receiving elements 38a, 38b via a wiring pattern (not shown) formed on the substrate 10, for example, and may serve as electrode pads for connecting these electrodes to an electrical circuit external to the substrate 10.
- the reinforcing block 28b has two cutout portions 34a and 34b formed therein, but any number of cutout portions, three or more, may be provided. These cutout portions do not necessarily have to have the same shape in plan view as shown in Figure 5, and cutout portions with different shapes in plan view may be mixed.
- the removed portion 34 a in the reinforcement block 28 a is a notch, but the removed portion does not necessarily have to be a notch.
- the removed portion may be, for example, a through hole provided in the reinforcement block that opens in the normal direction to the main surface 12 of the substrate 10.
- FIG. 6 is a plan view showing the configuration of an optical waveguide element 1c according to a third embodiment of the present invention. Note that in FIG. 6, the same components as those in FIG. 1 are designated by the same reference numerals, and the explanation for FIG. 1 above is applicable.
- the optical waveguide element 1c has a similar configuration to the optical waveguide element 1a according to the first embodiment shown in FIG. 1, but differs in that it has a reinforcing block 28c instead of the reinforcing block 28a.
- the reinforcing block 28c has the same configuration as the reinforcing block 28a, but differs in that a through-hole 34c is formed in place of the one removed portion 34a which is a notch portion.
- the removed portion 34c is a through-hole provided in the reinforcing block 28c that opens in the normal direction to the main surface 12 of the substrate 10.
- the removed portion 34c which is a through-hole, is provided above the portions of the optical output waveguides 24b and 24c other than their ends.
- light-receiving elements 38a and 38b are arranged as electrical circuit elements for monitoring the light waves propagating through the optical output waveguides 24b and 24c, respectively.
- the reinforcement block 28c has a removed portion 34c as a through-hole in the area where functional elements such as light-receiving elements 38a and 38b are located.
- a through-hole of the required size (e.g., the minimum size) for arranging a functional element can be provided at any desired position on the substrate 10 where the reinforcement block 28c is located, thereby securing space for arranging the functional element. Therefore, in the optical waveguide element 1c, the adhesive area between the reinforcement block 28c and the substrate 10 is not excessively narrowed, thereby improving the fixing strength between the reinforcement block 28c and the substrate 10 while increasing the degree of freedom in arranging functional elements on the substrate 10.
- the planar shape of the removed portion 34c as a through hole provided in the reinforcement block 28c shown in Figure 6 is rectangular, but it can be any shape, such as polygonal, circular, or elliptical.
- the reinforcement block 28c is provided with one removed portion 34c as a through hole, the number of removed portions as through holes is not limited to one and can be any number of two or more. These removed portions do not necessarily have to have the same shape in the planar view shown in Figure 6, and removed portions of different planar shapes may be mixed.
- the reinforcing block placed on the main surface 12 of the substrate 10 need only be composed of a single block having a shape obtained by removing at least one portion of a single rectangular parallelepiped, and the removed portion does not necessarily have to be a notch or a through hole.
- FIG. 7 is a plan view showing the configuration of an optical waveguide element 1d according to a fourth embodiment of the present invention. Note that in FIG. 7, the same components as those in FIG. 1 are designated by the same reference numerals, and the explanation for FIG. 1 above is applicable.
- Optical waveguide element 1d has a configuration similar to that of optical waveguide element 1a according to the first embodiment shown in Figure 1, but differs in that it has reinforcing block 28d instead of reinforcing block 28a.
- Reinforcement block 28d has a configuration similar to reinforcement block 28a, but does not have the cutout portion 34a, and the cutout portion 34d forms a concave curved surface 36b1 opposite to surface 36a along the light incident/exit surface 22 of the substrate 10. That is, the reinforcing block 28d has a shape in which one portion of one surface of a single rectangular parallelepiped is removed in a concave shape, and the one surface is formed into a curved surface.
- electrical circuit elements, optical elements, or mechanical elements can be placed, similar to removed portion 34a, etc.
- optical waveguide element 1d for example, light receiving elements 38a and 38b are placed in the space created by removed portion 34d.
- the surface 36b1 is configured as a curved surface, which has the following advantages. That is, generally, stress occurs in the portion of the substrate 10 to which the reinforcing block is adhered as the operating temperature changes due to the difference in the linear expansion coefficient between the reinforcing block and the substrate 10. This stress tends to concentrate and become unevenly distributed at positions on the main surface 12 of the substrate 10 where the corners of the reinforcing block are located (for example, the corners of the removed portion 34a, which is the notch portion in the configuration of FIG. 1 ).
- the reinforcement block 28d has a rectangular parallelepiped shape in which a portion has been removed in a concave shape by the removal portion 34d, and the remaining surface 36b1 is a curved surface without corners. This suppresses uneven distribution of stress at the adhesive portion between the reinforcement block 28d and the substrate 10 in the optical waveguide element 1d, preventing the stress from causing the reinforcement block 28d to peel off from the substrate 10 or adversely affecting the optical and operating characteristics of the optical waveguide element 1d.
- FIG. 8 is a plan view showing the configuration of an optical waveguide element 1e according to a fifth embodiment of the present invention.
- the same components as those in Fig. 1 are designated by the same reference numerals as those in Fig. 1, and the above description of Fig. 1 is incorporated herein.
- Optical waveguide element 1e has a configuration similar to that of optical waveguide element 1a according to the first embodiment shown in Figure 1, but differs in that it has reinforcing block 28e instead of reinforcing block 28a.
- Reinforcement block 28e has the same configuration as reinforcement block 28a, but does not have the cutout portion 34a, and is configured so that its planar shape when viewed from the normal direction of main surface 12 of substrate 10 is pentagonal. This shape can be formed by forming two triangular cutout portions 34e1 and 34e2 in a planar view in the portion facing surface 36a along the light incident/exit surface 22 of substrate 10.
- electrical circuit elements, optical elements, or mechanical elements can be placed in the space secured by removed portions 34e1 and 34e2.
- optical waveguide element 1e light-receiving elements 38a and 38b are placed in the space secured by removed portion 34e1.
- nothing is placed in the space secured by removed portion 34e2, but elements such as electrode pads 40 may also be placed there.
- the reinforcing block 28e can be easily fabricated by linear machining using a general-purpose dicing saw.
- FIG. 9 is a plan view showing the configuration of an optical waveguide element 1f according to a sixth embodiment of the present invention.
- the same components as those in Fig. 8 are designated by the same reference numerals as those in Fig. 8, and the description of Fig. 8 above is used.
- the optical waveguide element 1f has a similar configuration to the optical waveguide element 1e according to the fifth embodiment shown in Figure 8, but differs in that it has a reinforcing block 28f instead of reinforcing block 28e.
- This shape can be formed by forming a single removed portion 34f that is triangular in plan view in the portion facing the surface 36a along the light incident/exit surface 22 of the substrate 10.
- Electrical circuit elements, optical elements, or mechanical elements can be placed in the space secured by the removed portion 34f.
- light receiving elements 38a and 38b are placed in the space secured by the removed portion 34f.
- Reinforcement block 28f has fewer sides (or faces) than reinforcement block 28e, so it can be manufactured more easily than reinforcement block 28e by linear processing using a dicing saw.
- Fig. 10 is a plan view showing the configuration of an optical waveguide element 1g according to a seventh embodiment of the present invention.
- the same components as those in Fig. 1 are designated by the same reference numerals as those in Fig. 1, and the above description of Fig. 1 is used.
- Optical waveguide element 1g has a similar configuration to optical waveguide element 1a according to the first embodiment shown in FIG. 1, but instead of reinforcement block 28a, it has reinforcement block 28g composed of two sub-blocks 28g1 and 28g2.
- Sub-blocks 28g1 and 28g2 have a similar configuration to reinforcement block 28a, but do not have removed portion 34a, and each is configured as a block having a rectangular parallelepiped shape.
- reinforcement block 28g is composed of sub-blocks 28g1 and 28g2, which are two rectangular parallelepiped blocks.
- the sub-blocks 28g1 and 28g2 that make up the reinforcing block 28g are each arranged so that one surface is aligned with the light incident/exit surface 22 of the substrate 10 (e.g., flush or nearly flush).
- sub-block 28g1 is arranged directly above the end of optical input waveguide 24a that includes spot size conversion section 26a
- sub-block 28g2 is arranged directly above the end of optical output waveguides 24b and 24c that include spot size conversion sections 26b and 26c.
- sub-block 28g1 and the adhesive layer 30 below it function as cladding for spot size conversion section 26a of optical input waveguide 24a
- sub-block 28g2 and the adhesive layer 30 below it function as cladding for spot size conversion sections 26b and 26c of optical output waveguides 24b and 24c.
- the reinforcing block 28g includes two rectangular parallelepiped sub-blocks 28g1 and 28g2, but the number of rectangular parallelepiped sub-blocks included in the reinforcing block 28g can be any number greater than or equal to three.
- each sub-block can be arranged so that one face is aligned with the light incident/exit surface 22 of the substrate 10.
- the sum of the lengths of the sub-blocks along the light incident/exit surface 22 of the substrate 10 can be set to be shorter than the length Lb of the side of the substrate 10 along the light incident/exit surface 22.
- FIG. 11 is a plan view showing the configuration of an optical waveguide element 1h according to an eighth embodiment of the present invention.
- Fig. 12 is a cross-sectional view taken along the line XII-XII of the optical waveguide element 1h shown in Fig. 11.
- the same components as those in Figs. 1 and 4 are designated by the same reference numerals as those in Figs. 1 and 4, and the above-mentioned explanations for Figs. 1 and 4 are incorporated herein by reference.
- the optical waveguide element 1h has a configuration similar to that of the optical waveguide element 1a according to the first embodiment shown in FIG. 1, but differs in that it has a reinforcing block 28h instead of the reinforcing block 28a.
- the reinforcing block 28h has the same configuration as the reinforcing block 28a, but differs in that in addition to the one removed portion 34a which is a cutout portion, a removed portion 34h (FIG. 12) is formed.
- the removed portion 34h is a notch like the removed portion 34a, but is located on the surface 36d ( Figure 12) of the reinforcement block 28h that faces the main surface 12 of the substrate 10.
- the reinforcing block 28h is formed as a single block, so the strength of the reinforcing block 28h can be improved compared to the reinforcing block 28g of the seventh embodiment, which is composed of multiple sub-blocks.
- the reinforcing block 28h is formed as a single block, it is easier to align when placing it on the main surface 12 of the substrate 10 compared to the reinforcing block 28g according to the seventh embodiment, which is composed of multiple rectangular parallelepiped sub-blocks.
- the reinforcement block 28h is provided with one removed portion 34h that is a notch portion on the surface 36d that faces the main surface 12 of the substrate 10.
- the number of removed portions provided on the surface 36d that faces the main surface 12 of the substrate 10 may be two or more.
- FIG. 13 is a plan view showing the configuration of an optical waveguide element 1i according to a ninth embodiment of the present invention.
- FIG. 14 is a cross-sectional view of the optical waveguide element 1i shown in FIG. 13, taken along the line XIV-XIV. Note that in FIGS. 13 and 14, the same components as those in FIGS. 11 and 12 are designated by the same reference numerals, and the explanations for FIGS. 11 and 12 above are incorporated herein.
- the optical waveguide element 1i has a configuration similar to that of the optical waveguide element 1h according to the eighth embodiment shown in FIG. 11, but includes a reinforcing block 28i instead of the reinforcing block 28h.
- Reinforcement block 28i has a configuration similar to reinforcement block 28h, but differs in that instead of removal portion 34h, two removal portions 34i1 and 34i2 as cutout portions are provided on surface 36d opposite main surface 12 of substrate 10 (see Figure 14).
- optical waveguide element 1i similar to the optical waveguide element 1a, it is possible to arrange electrical circuit elements, optical elements, or mechanical elements in the space on the main surface 12 of the substrate 10 secured by the two cutout portions 34i1 and 34i2, thereby improving the degree of freedom in arranging these functional elements on the substrate 10.
- the two parallel waveguides 42a, 42b and 44a, 44b of the two Mach-Zehnder optical waveguides included in the optical waveguide 14 are formed in a zigzag bent shape.
- the bent portions of the parallel waveguides 42a, 42b and 44a, 44b, which serve as optical elements, are arranged together with electrodes 16, which serve as electrical elements, in the space on the main surface 12 of the substrate 10 secured by the removed portions 34i1, 34i2.
- optical waveguide element 1i longer parallel waveguides 42a, 42b and 44a, 44b can be formed over a wider area on the main surface 12 of the substrate 10, including the removed portions 34i1, 34i2.
- a longer interaction distance can be ensured between the light propagating through the parallel waveguides 42a, 42b and 44a, 44b and the high-frequency electrical signal propagating through the electrode 16, making it possible to reduce the operating voltage.
- This embodiment is an optical waveguide device incorporating any one of the optical waveguide elements 1a, 1b, 1c, 1d, 1e, 1f, 1g, 1h, and 1i according to the first to ninth embodiments described above.
- optical waveguide elements 1a, 1b, 1c, 1d, 1e, 1f, 1g, 1h, and 1i will be collectively referred to as optical waveguide element 1.
- reinforcement blocks 28a, 28b, 28c, 28d, 28e, 28f, 28g, 28h, and 28i provided in optical waveguide elements 1a, 1b, 1c, 1d, 1e, 1f, 1g, 1h, and 1i will be collectively referred to as reinforcement blocks 28.
- removed portions 34a, 34b, 34c, 34d, 34e, 34f, 34g, 34h, and 34i of reinforcement blocks 28a, 28b, 28c, 28d, 28e, 28f, 28g, 28h, and 28i will be collectively referred to as removed portions 34.
- Figure 15 is a diagram showing the configuration of an optical waveguide device 60 according to the tenth embodiment.
- the optical waveguide device 60 has an optical waveguide element 62 and a housing 64 that houses the optical waveguide element 62.
- a plate-shaped cover (not shown) is ultimately fixed to the opening of the housing 64, hermetically sealing the interior.
- the optical waveguide element 62 may be any of the optical waveguide elements 1a, 1b, 1c, 1d, 1e, 1f, 1g, 1h, and 1i described above. That is, the optical waveguide element 62 includes common components such as the optical input waveguide 24a and optical output waveguides 24b and 24c provided in the optical waveguide element 1 described above.
- a lens array 32 is fixed to the surface 36a of the reinforcement block 28 of the optical waveguide element 62 and the light input/output surface 22 of the substrate 10, which are arranged flush with each other.
- the optical waveguide device 60 comprises an input optical fiber 66 that inputs light into the optical waveguide element 62, and an output optical fiber 68 that guides the output light emitted by the optical waveguide element 62 out of the housing 64.
- the input optical fiber 66 and the output optical fiber 68 are fixed to the housing 64 via supports 70 and 72, which are fixing members, respectively.
- Light input from the input optical fiber 66 is collimated by a lens 74 arranged within the support 70, and then input to the optical input waveguide 24a of the optical waveguide element 62 via a corresponding lens in the lens array 32 fixed to the optical waveguide element 62.
- the light output from the two optical output waveguides 24b, 24c of the optical waveguide element 62 is collimated via corresponding lenses in the lens array 32 fixed to the optical waveguide element 62 and combined into a single beam by an optical unit 76 that includes a polarization combiner and other components.
- the combined beam is coupled to the output optical fiber 68 via a lens 78 arranged on the support 72.
- a plurality of pins 80 are arranged on the outer surface of the housing 64 for transmitting and receiving electrical signals, etc., required for the operation of the optical waveguide element 62, to and from an external device.
- the pins 80 may include power pins for receiving power from an external device in addition to transmitting and receiving electrical signals.
- the pins 80 are an example of an electrical interface for transmitting and receiving electrical signals, etc., required for the operation of the optical waveguide element 62, to and from an external device.
- the above electrical interface can be an electrical interface other than pins that has any shape and electrical characteristics, depending on the electrical characteristics required of the optical waveguide device 60 and mounting constraints on other devices.
- Such an electrical interface can be pins 80, a flexible printed circuit (FPC), or other device connected to the housing 64.
- FPC flexible printed circuit
- the housing 64 may include a relay board 82 inside that relays electrical signals transmitted and received via the pins 80 and/or power lines input via the pins 80 to the optical waveguide element 62 .
- the relay substrate 82 includes a drive circuit 84 that drives the optical waveguide element 62.
- the drive circuit 84 receives an electrical signal from the pin 80 as an input and outputs a high-frequency signal to the electrode 16 of the optical waveguide element 62.
- Each of the optical waveguide elements has an optical waveguide 14 that includes two Mach-Zehnder optical waveguides, and functions as an optical modulator.
- an optical waveguide device 60 that includes any of the optical waveguide elements 1 as an optical waveguide element 62 can function as an optical modulation device.
- the optical waveguide device 60 having the above-described configuration uses a high-performance optical waveguide element 1 as the optical waveguide element 62, which can be constructed without increasing the size of the substrate 10 or by using a smaller-sized substrate 10. Therefore, a high-performance or high-performance optical waveguide device can be realized without increasing the size of the housing 64 or by using a smaller housing 64.
- the relay board 82 is provided with a drive circuit 84, but the relay board 82 does not necessarily have to include a drive circuit 84.
- the relay board 82 may not include a drive circuit 84, and may include only a wiring pattern and passive circuit components such as capacitors that connect the pins 80 to electrodes such as the electrode 16 and light-receiving elements 38a and 38b provided on the optical waveguide element 62.
- This embodiment is an optical transmitting apparatus 90 equipped with an optical waveguide device 60 as the optical modulation device according to the tenth embodiment.
- FIG. 16 is a diagram showing the configuration of the optical transmitting apparatus 90 according to this embodiment.
- This optical transmitting apparatus 90 includes the optical waveguide device 60 as an optical modulation device, a light source 92 that inputs light to the optical waveguide device 60, and a modulation signal generating unit 94. Note that when the optical waveguide device 60 does not include a driving circuit 84, the optical transmitting apparatus 90 may include a modulator driving unit having the same function as the driving circuit 84.
- the modulation signal generation unit 94 is an electronic circuit that generates an electrical signal to cause the optical waveguide device 60 to perform a modulation operation. Based on externally provided transmission data, it generates a modulation signal, which is a high-frequency signal that causes the optical waveguide device 60 to perform an optical modulation operation in accordance with the modulation data, and outputs it to the optical waveguide device 60.
- the modulation signal is input to a drive circuit 84 mounted on the relay board 82 of the optical waveguide device 60.
- the drive circuit 84 amplifies the input modulation signal, and outputs a drive signal, which is a high-frequency signal for driving the optical waveguide element 62, to the electrode 16 of the optical waveguide element 62.
- the output light of the light source 92 is modulated by the optical waveguide device 60 and output from the optical transmitter 90.
- the optical transmitter 90 having the above configuration is composed of an optical waveguide device 60 that uses any of the optical waveguide elements 1 described above as the optical waveguide element 62, making it possible to realize a highly functional or high-performance optical transmitter.
- the optical waveguide element 1 functions as an optical modulator, but it may have any other function such as an optical switch, polarization rotation, or wavelength conversion.
- the optical waveguide 14 that constitutes the optical waveguide element 1 includes a Mach-Zehnder optical waveguide, but depending on the functionality required of the optical waveguide element 1, it may also include a waveguide pattern of a type other than a Mach-Zehnder optical waveguide.
- the optical waveguide 14 may constitute a directional coupler or a multi-port optical branch.
- the substrate 10 constituting the optical waveguide element 1 is a substrate such as LN that has an electro-optic effect, but it may also be made of a material that does not have an electro-optic effect, depending on the functionality required of the optical waveguide element 1.
- Figures 8 and 9 respectively illustrate reinforcing blocks 28e and 28f having a pentagonal and trapezoidal shape in plan view, but the reinforcing block 28 may have any polygonal shape in plan view other than a pentagon or a trapezoid.
- the reinforcing block provided on the substrate 10 may be configured by combining two or more characteristic configurations of the reinforcing block 28 shown in the first to ninth embodiments.
- a reinforcing block configured from a single block may have a shape in which any two or more of the removed portions 34a, 34b, 34c, 34d, 34e, 34f, 34h, and 34i shown in the above-mentioned embodiments are formed.
- at least one of the sub-blocks may have a shape in which any one or more of the removed portions 34a, 34b, 34c, 34d, 34e, 34f, 34h, and 34i are formed.
- An optical waveguide element comprising: a substrate; an optical waveguide formed on one main surface of the substrate; and a reinforcing block arranged on the one main surface of the substrate so as to be aligned with the one end surface of the substrate, which is an end surface that is a light input/output surface that inputs light to the optical waveguide and outputs light from the optical waveguide, wherein the reinforcing block is composed of a plurality of rectangular parallelepiped blocks, or is composed of a single block having a shape obtained by removing at least a portion of a single rectangular parallelepiped from the single rectangular parallelepiped.
- the optical waveguide element of configuration 1 functional elements such as electrical circuit elements, optical elements, or mechanical elements can be arranged in the spaces on the substrate between the multiple rectangular parallelepipeds that make up the reinforcing block, or in the space secured by removing a portion from a single rectangular parallelepiped. Therefore, the optical waveguide element of configuration 1 improves the degree of freedom in arranging functional elements on the substrate, making it possible to realize a highly functional optical waveguide element without increasing the size of the substrate.
- the reinforcing block is a single block having a shape obtained by removing at least a portion of a single rectangular parallelepiped from the single rectangular parallelepiped, and the removed portion, which is the portion of the reinforcing block removed from the single rectangular parallelepiped, is formed at a position other than directly above the end of the optical waveguide where light enters and exits through the light entrance and exit surface of the substrate, an optical waveguide element described in Configuration 1.
- the reinforcing block and the adhesive layer that may be interposed between the reinforcing block and the substrate can function as a cladding at the end.
- the optical waveguide element of configuration 2 can achieve good light confinement at the end of the optical waveguide where light enters and exits, thereby realizing an optical waveguide element with high functionality and low optical loss.
- the optical waveguide element includes an optical input waveguide that propagates input light input through the optical incident/exit surface of the substrate, and an optical output waveguide that propagates output light output through the optical incident/exit surface of the substrate toward the optical incident/exit surface
- the optical input waveguide and the optical output waveguide each include a spot size conversion section in which the cross-sectional size of the optical waveguide changes toward an end of the optical waveguide, and the removal section is formed at a position other than directly above the spot size conversion section.
- the adhesive layer and the reinforcing block are present directly above the spot size conversion portion, and the reinforcing block and the adhesive layer can function as cladding in the spot size conversion portion.
- the optical waveguide element of configuration 10 achieves good light confinement in the spot size conversion portion, making it possible to realize an optical waveguide element with high functionality and low optical loss.
- (Configuration 11) The optical waveguide element according to any one of configurations 1 to 10, further comprising an adhesive layer between the reinforcing block and one main surface of the substrate.
- the reinforcing block and the adhesive layer between the reinforcing block and the substrate can function as a cladding for the optical waveguide formed on the main surface of the substrate below the reinforcing block, thereby achieving good light confinement in the optical waveguide.
- the spaces between the rectangular parallelepiped blocks formed on the substrate by the reinforcing blocks or the spaces in the removed portions of a single block are utilized as arrangement spaces for electrical circuit elements, optical elements, or mechanical elements. Therefore, the optical waveguide element of configuration 13 can realize a high-performance optical waveguide element without increasing the size of the substrate.
- (Configuration 14) The optical waveguide element according to any one of configurations 1 to 13, wherein an optical component is fixed to a surface of the reinforcing block along the light incident/exit surface.
- the reinforcing block can be used as a structure for fixing the optical component, and a subassembly including the optical waveguide element and the optical component can be easily produced.
- An optical waveguide device comprising: an optical waveguide element according to any one of configurations 1 to 14; a housing that houses the optical waveguide element; an input optical fiber that inputs light to the optical waveguide element; and an output optical fiber that guides output light emitted by the optical waveguide element to the outside of the housing.
- a high-performance optical waveguide element is used that can be realized without increasing the size of the substrate or by using a smaller size substrate, so that a high-performance or high-performance optical waveguide device can be realized without increasing the size of the housing or by using a smaller housing.
- An optical transmitter comprising: the optical waveguide device according to configuration 15 or 16; and an electronic circuit that generates an electrical signal for causing the optical waveguide element to operate.
- a highly functional or high performance optical transmitter can be realized by using a highly functional or high performance optical waveguide device without increasing the housing size or using a smaller housing.
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Abstract
Description
本発明は、光導波路素子、光導波路デバイス、および光送信装置に関する。 The present invention relates to an optical waveguide element, an optical waveguide device, and an optical transmitter.
高速/大容量光ファイバ通信システムにおいては、基板上に形成された光導波路と、光導波路を伝搬する光波を制御する制御電極と、で構成される光導波路素子としての光変調素子を組み込んだ光変調器が多く用いられている。光変調動作を行う光導波路素子としては、InP基板等の半導体基板を用いた半導体光変調素子、およびLiNbO3(以下、LNともいう)を基板に用いたLN光変調素子が実用化されている。 In high-speed/large-capacity optical fiber communication systems, optical modulators incorporating an optical modulation element as an optical waveguide element, which is composed of an optical waveguide formed on a substrate and a control electrode that controls the light wave propagating through the optical waveguide, are widely used. As optical waveguide elements that perform optical modulation, semiconductor optical modulation elements using semiconductor substrates such as InP substrates and LN optical modulation elements using LiNbO3 (hereinafter also referred to as LN) as a substrate have been put to practical use.
近年開発が進むドライバ集積型LN変調器(CDM、Coherent Driver Modulator)に内蔵される、あるいは光トランシーバーに直接実装させる光導波路素子は、低消費電力化、高速化、広帯域化等の高性能化に加え、小型化の要求が高まっている。これら要求に対応するため、上記光導波路素子に用いる光導波路は、光の閉じ込めが強いリッジ型や、リブ型の形状が採用される。これにより、光導波路における導波方向の低損失な折り返しを可能とし、付帯する高周波電極、DC電極、並びに光モニタ用の受光素子(例えば、PD(フォトダイオード))等の機能要素を高密度に配置することで、高機能化と小型化を両立している。 Optical waveguide elements built into driver-integrated LN modulators (CDM, Coherent Driver Modulators), which have been developed in recent years, or mounted directly on optical transceivers, are increasingly being required to be compact, in addition to offering higher performance such as lower power consumption, higher speeds, and wider bandwidths. To meet these demands, the optical waveguides used in these optical waveguide elements are often ridge- or rib-shaped, which provide strong light confinement. This allows for low-loss folding in the waveguide direction, and the high-density arrangement of functional elements such as associated high-frequency electrodes, DC electrodes, and light-receiving elements for optical monitoring (e.g., photodiodes (PDs)) achieves both high functionality and compactness.
上記光導波路素子に用いられるリッジ型やリブ型の光導波路は、光を伝搬するモードフィールド径(MFD、Mode Field Diameter)を3μm以下で形成するが、光導波路端面に接合する光ファイバ等の光学部品は、MFDが10μm程度となることから、光導波路素子の出射端部にスポットサイズ変換部(SSC、Spot Size Converter)を設置し、MFDを大径化させている。 The ridge-type and rib-type optical waveguides used in the above-mentioned optical waveguide elements have a mode field diameter (MFD) for propagating light of 3 μm or less. However, optical components such as optical fibers that are bonded to the end face of the optical waveguide have an MFD of around 10 μm. Therefore, a spot size converter (SSC) is installed at the output end of the optical waveguide element to increase the MFD.
また、光導波路素子の端面と、当該端面に接合する光ファイバ等の光学部品と、の接合強度確保と、上記端面を研磨する際の光導波路の欠けやスクラッチの発生を抑制するため、光導波路素子の端部には、SSCを含む光導波路を覆うように、光導波路素子の基板の幅全体に亘って直方体のガラスブロック(補強ブロック)が配置される。この補強ブロックは、通常、接着剤により上記基板に固定される。この接着剤は、SSCのクラッド層としての機能も有することから、補強ブロックは、光導波路素子を構成する上で重要な役割を担っている。 Furthermore, to ensure the bonding strength between the end face of the optical waveguide element and the optical component, such as an optical fiber, that is bonded to that end face, and to prevent chipping or scratches on the optical waveguide when the end face is polished, a rectangular glass block (reinforcement block) is placed at the end of the optical waveguide element across the entire width of the substrate of the optical waveguide element, covering the optical waveguide containing the SSC. This reinforcing block is usually fixed to the substrate with an adhesive. Because this adhesive also functions as a cladding layer for the SSC, the reinforcing block plays an important role in constructing the optical waveguide element.
特許文献1には、光導波路素子の基板端部に補強ブロックを備え、基板表面に光モニタ用の受光素子を備える光導波路素子が開示されている。この光導波路素子では、受光素子に光を導く光導波路の導波方向を折り返すことにより、基板表面のうち補強ブロックが設けられていない部分に上記受光素子が実装される。 Patent Document 1 discloses an optical waveguide element that includes a reinforcing block at the edge of the substrate and a light-receiving element for monitoring light on the surface of the substrate. In this optical waveguide element, the light-guiding direction of the optical waveguide that guides light to the light-receiving element is bent back, allowing the light-receiving element to be mounted on the part of the substrate surface where no reinforcing block is provided.
上記の構成は、基板サイズを拡大することなく高機能化を図ることができるため、デバイスサイズが規格化されている上述したCDMのような変調器に好適に用いられ得るが、更なる高機能化及び基板サイズの小型化の観点では、補強ブロックと基板との間にも受光素子等の機能部品を配することができれば有利である。 The above configuration allows for increased functionality without increasing the size of the substrate, making it suitable for use in modulators such as the CDM mentioned above, where device size is standardized. However, from the perspective of further increasing functionality and reducing the size of the substrate, it would be advantageous to be able to place functional components such as photodetectors between the reinforcing block and the substrate.
光導波路素子の基板上に配する機能要素としては、受光素子のほか、SSC、バッファ層、高周波信号用の厚膜電極、電極パッド(配線電極部)、及び直流信号又は低周波信号用の薄膜電極があり得る。 Functional elements arranged on the substrate of an optical waveguide element may include, in addition to the light receiving element, an SSC, a buffer layer, a thick film electrode for high-frequency signals, an electrode pad (wiring electrode portion), and a thin film electrode for DC or low-frequency signals.
しかしながら、受光素子、電極パッド、厚膜電極等の厚みの厚い機能要素を、補強ブロックと基板との間に配すると、補強ブロックと基板との間の接着層の厚みを、これらの機能要素と同等の厚みまで厚くする必要がある。このような厚い接着層は、周囲温度変動に伴う熱膨張収縮によりクラックが発生する等の問題を生じ得る。 However, when thick functional elements such as light-receiving elements, electrode pads, and thick-film electrodes are placed between the reinforcing block and the substrate, the thickness of the adhesive layer between the reinforcing block and the substrate must be increased to the same thickness as these functional elements. Such a thick adhesive layer can cause problems such as cracks due to thermal expansion and contraction caused by ambient temperature fluctuations.
本発明の課題は、基板上における機能要素の配置の自由度を向上して、基板サイズを拡大することなく、高機能な光導波路素子を実現し得るようにすることである。 The objective of this invention is to improve the degree of freedom in arranging functional elements on a substrate, thereby enabling the realization of highly functional optical waveguide elements without increasing the size of the substrate.
本発明の一の態様は、基板と、前記基板の一の主面に形成された光導波路と、前記基板の端面であって前記光導波路に光を入力し及び前記光導波路からの光を出力する光入出射面である一の端面に沿うように、前記基板の前記一の主面上に配された補強ブロックと、を備える光導波路素子であって、前記補強ブロックは、複数の直方体のブロックで構成されるか、又は、単一の直方体から当該単一の直方体の少なくとも一の部分を除去した形状を有する単一のブロックで構成される、光導波路素子である。
本発明の他の態様によると、前記補強ブロックは、単一の直方体から当該単一の直方体の少なくとも一の部分を除去した形状の単一のブロックであり、前記補強ブロックのうち前記単一の直方体から除去された前記部分である除去部は、前記基板の前記光入出射面を介して光が入出射する前記光導波路の末端の直上を除く位置に形成される。
本発明の他の態様によると、前記除去部は、前記補強ブロックの少なくとも一の面に形成された少なくとも一つの切欠き部である。
本発明の他の態様によると、少なくとも一つの切欠き部である前記除去部は、前記補強ブロックの、前記基板の前記光入出射面に沿った面に対向する面に形成されている。
本発明の他の態様によると、少なくとも一つの切欠き部である前記除去部は、前記補強ブロックの、前記基板の主面と向かい合う面に形成されている。
本発明の他の態様によると、前記除去部は、前記基板の主面と直交する方向に開口する前記補強ブロックに設けられた貫通穴である。
本発明の他の態様によると、前記補強ブロックは、前記基板の前記光入出射面に沿った面に対向する面が凹状の曲面を成す。
本発明の他の態様によると、前記補強ブロックは、前記基板の主面の法線方向から視た平面視形状が五角形を成す。
本発明の他の態様によると、前記補強ブロックは、前記基板の主面の法線方向から視た平面視形状が台形を成す。
本発明の他の態様によると、前記光導波路は、前記基板の前記光入出射面を介して入力された入力光を伝搬する光入力導波路、及び前記基板の前記光入出射面を介して出力する出力光を前記光入出射面に向かって伝搬する光出力導波路を含み、前記光入力導波路及び前記光出力導波路は、前記光導波路の末端に向かって前記光導波路の断面サイズが変化するスポットサイズ変換部を含み、前記除去部は、前記スポットサイズ変換部の直上を除く位置に形成される。
本発明の他の態様によると、前記補強ブロックと前記基板の一の主面との間に接着層を有する。
本発明の他の態様によると、前記補強ブロックは、前記光導波路の屈折率よりも低い屈折率を有する。
本発明の他の態様によると、複数の直方体のブロックで構成される前記補強ブロックが配された前記基板のうち、前記複数の直方体のブロックの間の空間、又は、単一の直方体から当該単一の直方体の少なくとも一の部分を除去した形状の単一のブロックで構成される前記補強ブロックが配された前記基板のうち、前記単一の直方体から除去された前記部分である除去部の空間に、電気回路要素、光学要素、又は機械要素が配置されている。
本発明の他の態様によると、前記補強ブロックの前記光入出射面に沿った面には、光学部品が固定される。
本発明の他の態様は、上記いずれかの光導波路素子と、前記光導波路素子を収容する筐体と、前記光導波路素子に光を入射する入力光ファイバと、前記光導波路素子が出射する出力光を前記筐体の外へ導く出力光ファイバと、を備える光導波路デバイスである。
本発明の他の態様によると、前記光導波路素子は、前記光導波路を伝搬する光波を制御する電極を前記基板上に備え、前記筐体の内部に、前記光導波路素子を駆動する駆動回路を備える光導波路デバイスである。
本発明の他の態様は、上記いずれかの光導波路デバイスと、前記光導波路素子に動作を行わせるための電気信号を生成する電子回路と、を備える光送信装置である。
One aspect of the present invention is an optical waveguide element comprising a substrate, an optical waveguide formed on one main surface of the substrate, and a reinforcing block arranged on the one main surface of the substrate so as to be aligned with an end face of the substrate, the end face being a light input/output surface that inputs light to the optical waveguide and outputs light from the optical waveguide, wherein the reinforcing block is either composed of a plurality of rectangular blocks, or composed of a single block having a shape obtained by removing at least a portion of a single rectangular block from the single rectangular block.
According to another aspect of the present invention, the reinforcing block is a single block having a shape obtained by removing at least a portion of a single rectangular prism from the single rectangular prism, and the removed portion, which is the portion of the reinforcing block removed from the single rectangular prism, is formed at a position other than directly above the end of the optical waveguide where light enters and exits through the light entrance and exit surface of the substrate.
According to another aspect of the present invention, the removed portion is at least one notch formed in at least one surface of the reinforcing block.
According to another aspect of the present invention, the removed portion, which is at least one notch portion, is formed on a surface of the reinforcing block that faces a surface of the substrate that is aligned with the light incident/exit surface.
According to another aspect of the present invention, the removal portion, which is at least one notch portion, is formed on a surface of the reinforcing block facing the main surface of the substrate.
According to another aspect of the present invention, the removed portion is a through hole provided in the reinforcing block and opening in a direction perpendicular to the main surface of the substrate.
According to another aspect of the present invention, the reinforcing block has a surface that faces the surface of the substrate along the light incident/exit surface and that forms a concave curved surface.
According to another aspect of the present invention, the reinforcing block has a pentagonal shape in plan view when viewed from a normal direction to the main surface of the substrate.
According to another aspect of the present invention, the reinforcing block has a trapezoidal shape in plan view when viewed from a normal direction to the main surface of the substrate.
According to another aspect of the present invention, the optical waveguide includes an optical input waveguide that propagates input light input through the optical input/output surface of the substrate, and an optical output waveguide that propagates output light output through the optical input/output surface of the substrate toward the optical input/output surface, the optical input waveguide and the optical output waveguide including a spot size conversion section in which the cross-sectional size of the optical waveguide changes toward an end of the optical waveguide, and the removal section is formed at a position other than directly above the spot size conversion section.
According to another aspect of the present invention, an adhesive layer is provided between the reinforcing block and one main surface of the substrate.
According to another aspect of the invention, the reinforcing block has a refractive index lower than that of the optical waveguide.
According to another aspect of the present invention, in a substrate on which a reinforcing block composed of a plurality of rectangular blocks is arranged, an electrical circuit element, an optical element, or a mechanical element is arranged in the space between the plurality of rectangular blocks, or in the space of the removed portion, which is the portion removed from the single rectangular block, in a substrate on which a reinforcing block composed of a single block having a shape obtained by removing at least a portion of the single rectangular block is arranged.
According to another aspect of the present invention, an optical component is fixed to a surface of the reinforcing block along the light incident/exit surface.
Another aspect of the present invention is an optical waveguide device comprising: any one of the optical waveguide elements described above; a housing that houses the optical waveguide element; an input optical fiber that inputs light to the optical waveguide element; and an output optical fiber that guides output light emitted by the optical waveguide element to the outside of the housing.
According to another aspect of the present invention, the optical waveguide element is an optical waveguide device that includes electrodes on the substrate that control light waves propagating through the optical waveguide, and a drive circuit inside the housing that drives the optical waveguide element.
Another aspect of the present invention is an optical transmission apparatus comprising any one of the optical waveguide devices described above and an electronic circuit that generates an electrical signal for causing the optical waveguide element to operate.
本発明によれば、基板上における機能要素の配置の自由度を向上して、基板サイズを拡大することなく、高機能な光導波路素子を実現することができる。 The present invention improves the degree of freedom in arranging functional elements on a substrate, making it possible to realize a highly functional optical waveguide element without increasing the substrate size.
以下、図面を参照して本発明の実施形態について説明する。
[1.第1実施形態]
図1は、本発明の第1の実施形態に係る光導波路素子1aの構成を示す平面図である。光導波路素子1aは、電気光学効果を有する基板10と、基板10の一の主面12(図1に示す面)に形成された光導波路14と、光導波路14を伝搬する光波を制御する電極16と、を備える。
Hereinafter, an embodiment of the present invention will be described with reference to the drawings.
1. First embodiment
1 is a plan view showing the configuration of an optical waveguide element 1a according to a first embodiment of the present invention. The optical waveguide element 1a includes a substrate 10 having an electro-optic effect, an optical waveguide 14 formed on one main surface 12 (the surface shown in FIG. 1) of the substrate 10, and electrodes 16 for controlling light waves propagating through the optical waveguide 14.
基板10は、例えば、LN基板である。ただし、基板10は、LN基板に限らず、タンタル酸リチウム(LT)、PLZT(ジルコン酸チタン酸鉛ランタン)などの基板であってもよく、また、半導体材料や有機材料などの種々の材料で構成される基板であってもよい。 Substrate 10 is, for example, an LN substrate. However, substrate 10 is not limited to an LN substrate and may be a substrate made of lithium tantalate (LT), PLZT (lead lanthanum zirconate titanate), or other materials, or may be a substrate made of various materials such as semiconductor materials or organic materials.
図1に示すように、電極16は、例えば、基板10の主面内において光導波路14を挟む位置に配される。ただし、図1に示す電極16の配置は一例であって、電極16は、基板10に用いられる材料及び又は結晶方位等に依存して、設計上適切な任意の位置に配され得る。例えば、電極16は、光導波路14上に配される場合もあり得る。他の実施形態においても同様である。 As shown in FIG. 1, the electrodes 16 are arranged, for example, on the main surface of the substrate 10 at positions sandwiching the optical waveguide 14. However, the arrangement of the electrodes 16 shown in FIG. 1 is only one example, and the electrodes 16 can be arranged in any appropriate position in the design, depending on the material and/or crystal orientation used in the substrate 10. For example, the electrodes 16 may be arranged on the optical waveguide 14. This is also true in other embodiments.
基板10は、例えば平面視が矩形であり、図示上下方向に延在して対向する図示左右の2つの端面18a、18b、および図示左右方向に延在して対向する図示上下の端面18c、18dを有する。 The substrate 10 is rectangular in plan view, for example, and has two opposing left and right end faces 18a and 18b that extend in the vertical direction as shown, and two opposing upper and lower end faces 18c and 18d that extend in the horizontal direction as shown.
光導波路14は、例えば、基板10の主面12に形成された、帯状に延在する凸部で構成された凸状光導波路(例えば、リブ型光導波路又はリッジ型光導波路)である。凸状導波路は、本実施形態では、例えば、主面12のうち光導波路14の両側部に溝を形成することにより掲載される。一例として、光導波路14は、2つのマッハツェンダ型光導波路を含む。これにより、光導波路素子1aは、光変調器として機能し得る。 The optical waveguide 14 is, for example, a convex optical waveguide (e.g., a rib-type optical waveguide or a ridge-type optical waveguide) formed on the main surface 12 of the substrate 10 and consisting of a convex portion extending in a strip shape. In this embodiment, the convex waveguide is implemented by forming grooves on both sides of the optical waveguide 14 on the main surface 12. As an example, the optical waveguide 14 includes two Mach-Zehnder optical waveguides. This allows the optical waveguide element 1a to function as an optical modulator.
図2は、図1に示す光導波路素子1aを、基板10の端面18dの方向から視た側面図である。基板10の一の主面12に対向する他の主面は、補強のための支持板20に接合されている。 Figure 2 is a side view of the optical waveguide element 1a shown in Figure 1, viewed from the direction of the end surface 18d of the substrate 10. The other main surface opposite to the one main surface 12 of the substrate 10 is bonded to a support plate 20 for reinforcement.
図1を参照し、基板10の端面18bは、光導波路14に光を入力し及び光導波路14からの光を出力する光入出射面22を構成する。
光導波路14は、基板10の光入出射面22を介して入力された入力光を伝搬する光入力導波路24a、及び基板10の光入出射面22を介して出力する出力光を光入出射面22に向かって伝搬する光出力導波路24b、24cを含む。
Referring to FIG. 1, the end surface 18b of the substrate 10 constitutes a light input/output surface 22 through which light is input to the optical waveguide 14 and through which light is output from the optical waveguide 14.
The optical waveguide 14 includes an optical input waveguide 24a that propagates input light input through the optical input/output surface 22 of the substrate 10, and optical output waveguides 24b and 24c that propagate output light output through the optical input/output surface 22 of the substrate 10 toward the optical input/output surface 22.
光入力導波路24a及び光出力導波路24b、24cは、それぞれ、光導波路14の末端に向かって光導波路14の断面サイズが変化するスポットサイズ変換部26a、26b、26c(図示黒塗り三角形の部分)を含む。以下、光入力導波路24a及び光出力導波路24b、24cを総称して光入出力導波路24ともいうものとする。また、スポットサイズ変換部26a、26b、26cを総称してスポットサイズ変換部26ともいうものとする。 The optical input waveguide 24a and the optical output waveguides 24b, 24c each include spot size conversion sections 26a, 26b, 26c (shown as black triangular sections) where the cross-sectional size of the optical waveguide 14 changes toward the end of the optical waveguide 14. Hereinafter, the optical input waveguide 24a and the optical output waveguides 24b, 24c will be collectively referred to as the optical input/output waveguides 24. Furthermore, the spot size conversion sections 26a, 26b, 26c will be collectively referred to as the spot size conversion section 26.
具体的には、スポットサイズ変換部26は、それぞれ、光入出力導波路24の延在方向に直交する断面における、基板10の厚み方向の長さ及び主面方向の長さが、光入出力導波路24のそれぞれの末端に向かって減少するように、テーパ状に形成されている。 Specifically, the spot size conversion sections 26 are tapered so that the length in the thickness direction and the length in the principal surface direction of the substrate 10 in a cross section perpendicular to the extension direction of the optical input/output waveguides 24 decrease toward the respective ends of the optical input/output waveguides 24.
光導波路素子1aは、また、基板10の光入出射面22である端面18bに沿うように基板10の主面12上に配された補強ブロック28aを備える。ここで、補強ブロック28aが「端面18bに沿うように」配されているとは、補強ブロック28aの一の面が、端面18bと面一若しくは略面一となるように、又は端面18bと同一の面となるように若しくは略同一の面となるように配されていることをいう。図1に示す光導波路素子1aでは、補強ブロック28aは、補強ブロック28aの図示右側の面36aが基板10の光入出射面22である端面18bと面一となるように配されている。 The optical waveguide element 1a also includes a reinforcing block 28a arranged on the main surface 12 of the substrate 10 so as to align with the end face 18b, which is the light incident/emitting surface 22 of the substrate 10. Here, "the reinforcing block 28a being arranged "along the end face 18b" means that one face of the reinforcing block 28a is arranged flush or nearly flush with the end face 18b, or is arranged so as to be on the same plane as or nearly flush with the end face 18b. In the optical waveguide element 1a shown in Figure 1, the reinforcing block 28a is arranged so that the face 36a on the right side of the reinforcing block 28a is flush with the end face 18b, which is the light incident/emitting surface 22 of the substrate 10.
図3及び図4は、それぞれ、図1に示す光導波路素子1aのIII-III断面矢視図及びIV-IV断面矢視図である。
光導波路素子1aは、補強ブロック28aと基板10の主面12との間に接着層30を有する。接着層30は、その下部にあるスポットサイズ変換部26のクラッド層としても機能する。スポットサイズ変換部26における光の閉じ込めを確保するため、補強ブロック28a及び接着層30は、光導波路14の屈折率よりも低い屈折率を有する材料で構成される。例えば、接着層30は透明樹脂で構成される。補強ブロック28aは、熱変形の少ない無アルカリガラスなどの、加工性の良い材質が好ましい。
3 and 4 are cross-sectional views taken along the lines III-III and IV-IV, respectively, of the optical waveguide element 1a shown in FIG.
The optical waveguide element 1a has an adhesive layer 30 between the reinforcement block 28a and the main surface 12 of the substrate 10. The adhesive layer 30 also functions as a cladding layer for the spot size conversion section 26 located thereunder. To ensure light confinement in the spot size conversion section 26, the reinforcement block 28a and the adhesive layer 30 are made of a material with a refractive index lower than that of the optical waveguide 14. For example, the adhesive layer 30 is made of a transparent resin. The reinforcement block 28a is preferably made of a material with good processability, such as alkali-free glass that is less susceptible to thermal deformation.
図1及び図2を参照し、面一となるように配された補強ブロック28aの面36a(すなわち、光入出射面22に沿った面)及び基板10の光入出射面22には、光学部品が固定される。光学部品は、本実施形態では、例えば、レンズアレイ32である。上記光学部品には、レンズのほか、波長板やプリズム等の任意の光学部品が含まれてもよい。これにより、補強ブロック28aを、光学部品を固定するための構造物として利用して、光導波路素子1aと光学部品とを含むアセンブリを容易に作製することができる。 Referring to Figures 1 and 2, optical components are fixed to the surface 36a (i.e., the surface along the light incident/exit surface 22) of the reinforcement block 28a, which is arranged flush with the light incident/exit surface 22 of the substrate 10. In this embodiment, the optical component is, for example, a lens array 32. The optical component may include any optical component such as a lens, a wave plate, or a prism. This makes it possible to easily fabricate an assembly including the optical waveguide element 1a and the optical component by using the reinforcement block 28a as a structure for fixing the optical component.
本実施形態では、特に、補強ブロック28aは、単一の直方体から当該直方体の少なくとも一の部分(すなわち、一つ又は複数の部分)を除去した形状を有する単一のブロックで構成されている。なお、「単一の直方体から当該直方体の少なくとも一の部分を除去した形状」とは、補強ブロック28aの形状を表現したものであり、必ずしも補強ブロック28aが実際に単一の直方体からその一部分を除去することで作製されることを意味したものではない。 In this embodiment, in particular, reinforcing block 28a is composed of a single block having a shape obtained by removing at least one portion (i.e., one or more portions) of a single rectangular parallelepiped from the rectangular parallelepiped. Note that "a shape obtained by removing at least one portion of a single rectangular parallelepiped from the rectangular parallelepiped" describes the shape of reinforcing block 28a, and does not necessarily mean that reinforcing block 28a is actually made by removing a portion of a single rectangular parallelepiped.
ここで、補強ブロック28aのうち、上記単一の直方体から除去された部分である除去部34aは、基板10の光入出射面22を介して光が入出射する光導波路14の末端の直上の位置を含まないことが望ましい。すなわち、除去部34aは、光導波路14の上記末端の直上を除く位置に形成されることが望ましい。ここで、光入出射面22を介して光が入出射する光導波路14の末端とは、本実施形態では、光入出力導波路24の光入出射面22の側の末端である。 Here, it is desirable that the removed portion 34a, which is the portion of the reinforcing block 28a that has been removed from the single rectangular parallelepiped, does not include the position directly above the end of the optical waveguide 14 where light enters and exits via the light incident and exit surface 22 of the substrate 10. In other words, it is desirable that the removed portion 34a be formed in a position other than directly above the end of the optical waveguide 14. Here, the end of the optical waveguide 14 where light enters and exits via the light incident and exit surface 22, in this embodiment, is the end of the optical input/output waveguide 24 on the light incident and exit surface 22 side.
これにより、光導波路素子1aでは、光が入出射する光導波路14の末端の直上には補強ブロック28aが存在することとなるので、補強ブロック28a及び接着層30を、上記末端におけるクラッドとして機能させることができる。このため、光が入出射する光導波路14の末端部における良好な光閉じ込めを実現して、高機能且つ光損失の少ない光導波路素子1aを実現することができる。 As a result, in the optical waveguide element 1a, the reinforcing block 28a is located directly above the end of the optical waveguide 14 where light enters and exits, allowing the reinforcing block 28a and adhesive layer 30 to function as cladding at the end. This achieves good optical confinement at the end of the optical waveguide 14 where light enters and exits, resulting in an optical waveguide element 1a with high functionality and low optical loss.
詳細には、本実施形態では、除去部34aは、光入出力導波路24の端部が形成するスポットサイズ変換部26の直上の位置を含まない。すなわち、除去部34aは、スポットサイズ変換部26の直上を除く位置に形成されている。これにより、スポットサイズ変換部26の直上には、接着層30を介して補強ブロック28aが存在することとなるので、スポットサイズ変換部26における良好な光閉じ込めが実現され得る。 In more detail, in this embodiment, the removed portion 34a does not include the position directly above the spot size conversion portion 26 formed by the end of the optical input/output waveguide 24. In other words, the removed portion 34a is formed in a position other than directly above the spot size conversion portion 26. As a result, a reinforcing block 28a exists directly above the spot size conversion portion 26 via the adhesive layer 30, thereby achieving good light confinement in the spot size conversion portion 26.
除去部34aは、本実施形態では、例えば、補強ブロック28aの少なくとも一の面に形成された少なくとも一つの切欠き部であり得る。より具体的には、本実施形態では、除去部34aは、補強ブロック28aの、基板10の光入出射面22(端面18b)に沿った面36aに対向する面36bに形成されている。このような除去部34aの形状は、例えば、レーザーを利用したカット装置やNCフライス盤等で容易に形成することができる。 In this embodiment, the removed portion 34a may be, for example, at least one notch formed on at least one surface of the reinforcing block 28a. More specifically, in this embodiment, the removed portion 34a is formed on the surface 36b of the reinforcing block 28a that faces the surface 36a that is aligned with the light incident/exit surface 22 (end surface 18b) of the substrate 10. The shape of this removed portion 34a can be easily formed, for example, using a laser-based cutting device or an NC milling machine.
これにより、切欠き部である除去部34aにより確保される基板10の主面12上の空間に、電気回路要素、光学要素、又は機械要素を配置することが可能となり、基板10上におけるこれら機能要素の配置の自由度が向上する。その結果、基板10のサイズを従来に比べて拡大することなく、又は従来よりサイズの小さい基板10を用いて、高機能な光導波路素子1aを実現することが可能となる。また、上記の結果として、機能要素の配置のために光導波路14のパターンや電極16のパターンに制約を加える必要がないので、光導波路素子1aのより良好な光学特性や動作特性(本実施形態では、光変調動作の動作特性)を実現し得る。 This makes it possible to arrange electrical circuit elements, optical elements, or mechanical elements in the space on the main surface 12 of the substrate 10 secured by the cutout portion, or removed portion 34a, thereby improving the degree of freedom in arranging these functional elements on the substrate 10. As a result, it is possible to realize a highly functional optical waveguide element 1a without increasing the size of the substrate 10 compared to conventional methods, or using a substrate 10 that is smaller than conventional methods. Furthermore, as a result of the above, there is no need to impose restrictions on the pattern of the optical waveguide 14 or the pattern of the electrodes 16 in order to arrange the functional elements, making it possible to realize better optical characteristics and operating characteristics (in this embodiment, the operating characteristics of optical modulation operation) of the optical waveguide element 1a.
例えば、本実施形態では、切欠き部である除去部34aにより、光出力導波路24b、24cのそれぞれの末端を除く部分の上部に空間が確保されている。そして、この空間部分に、それぞれの導波路部分を伝搬する光波をモニタするための、電気回路要素としての受光素子38a、38bが配されている。これらの受光素子38a、38bは、それぞれ、光出力導波路24b、24cとエバネッセント結合するように、光出力導波路24b、24cの上部に薄い接着層を介して固定され得る(図3参照)。 For example, in this embodiment, a space is created above the optical output waveguides 24b and 24c, excluding their respective ends, by the cutout portion, the removed portion 34a. Light-receiving elements 38a and 38b, which serve as electrical circuit elements, are arranged in this space to monitor the light waves propagating through the respective waveguide portions. These light-receiving elements 38a and 38b can be fixed to the top of the optical output waveguides 24b and 24c via a thin adhesive layer so as to evanescently couple with the optical output waveguides 24b and 24c, respectively (see Figure 3).
光導波路素子1aでは、補強ブロック28aは、電気回路要素、光学要素、又は機械要素を配置する部分のみを切り欠いた形状で構成され得るので、基板10との接着面の面積を大きく減少させない。このため、補強ブロック28aと基板10との固定強度を十分に確保することができる。 In the optical waveguide element 1a, the reinforcing block 28a can be configured with cutouts for only the portions where electrical circuit elements, optical elements, or mechanical elements are to be placed, so the area of the adhesive surface with the substrate 10 is not significantly reduced. This ensures sufficient fixing strength between the reinforcing block 28a and the substrate 10.
また、光導波路素子1aでは、補強ブロック28aは、基板10の光入出射面22に沿った面36aには切欠き部が設けられないので、光入出力導波路24の末端を光入出射面22のどの位置に設けても、補強ブロック28aがクラッドとして機能し得る。このため光導波路素子1aでは、光導波路14の一部である光入出力導波路24の末端部の配置の自由度を確保しつつ、基板10上における機能要素の配置の自由度を高めることができる。 Furthermore, in the optical waveguide element 1a, the reinforcing block 28a does not have a notch on the surface 36a that is aligned with the light input/output surface 22 of the substrate 10, so the reinforcing block 28a can function as a cladding regardless of where the end of the light input/output waveguide 24 is located on the light input/output surface 22. Therefore, in the optical waveguide element 1a, the degree of freedom in the placement of the end of the light input/output waveguide 24, which is part of the optical waveguide 14, is maintained, while the degree of freedom in the placement of functional elements on the substrate 10 can be increased.
なお、補強ブロック28aの外形サイズは、機械強度の観点から、補強ブロック28aの外形の3辺の長さが全て0.2mm以上であることが好ましく、0.4mm以上であることがより好ましく、0.6mm以上であることが更に好ましい。
また、補強ブロック28aと基板10との接着面積は、接着強度の観点から、1.0mm2以上であることが好ましい。
From the standpoint of mechanical strength, it is preferable that the external size of the reinforcement block 28a is such that the lengths of all three sides of the external shape of the reinforcement block 28a are 0.2 mm or more, more preferably 0.4 mm or more, and even more preferably 0.6 mm or more.
Furthermore, from the viewpoint of adhesive strength, the adhesive area between the reinforcing block 28a and the substrate 10 is preferably 1.0 mm 2 or more.
また、補強ブロック28aの主平面の法線方向から視た平面視における、補強ブロック28aの面積と除去部34aの範囲の面積とを加算した総面積(すなわち、上記平面視における、補強ブロック28aの範囲と除去部34aの範囲とで構成される矩形範囲の面積)に対する、除去部34aの範囲の面積の比率Rは、少なくとも1%以上であり得る。上記比率Rは、好ましくは10%以上、より好ましくは30%以上、基板上面をより有効に活用する観点から50%以上であると更に好ましい。一方、補強ブロック28aと基板10との接着強度を確保する観点からは、特に、3つのスポットサイズ変換部26を覆う位置に補強ブロック28aが接着される場合は、これらのスポットサイズ変換部26の上に接着層を形成する必要があるため、上記比率Rは、70%以下が好ましく、60%以下がより好ましい。また、同様の理由から、上記比率Rは、より好適には50%以下が更に好ましい。他の実施形態においても同様である。 Furthermore, in a plan view viewed from the normal direction of the main plane of the reinforcement block 28a, the ratio R of the area of the removed portion 34a to the total area (i.e., the area of the rectangular area formed by the area of the reinforcement block 28a and the area of the removed portion 34a in the plan view) can be at least 1% or more. The ratio R is preferably 10% or more, more preferably 30% or more, and even more preferably 50% or more from the perspective of more effectively utilizing the upper surface of the substrate. On the other hand, from the perspective of ensuring the adhesive strength between the reinforcement block 28a and the substrate 10, particularly when the reinforcement block 28a is attached in a position covering three spot size conversion portions 26, it is necessary to form an adhesive layer on these spot size conversion portions 26. Therefore, the ratio R is preferably 70% or less, and more preferably 60% or less. For the same reason, the ratio R is more preferably 50% or less. The same applies to other embodiments.
なお、図1に示す切欠き部である除去部34aの平面視形状は矩形であるものとしたが、切欠き部としての除去部34aの平面視形状は、矩形に限らず、多角形、円形、楕円形等の任意の形状であり得る。 Note that while the planar shape of the removal portion 34a, which is the cutout portion shown in Figure 1, is rectangular, the planar shape of the removal portion 34a as a cutout portion is not limited to a rectangle and can be any shape, such as a polygon, circle, or ellipse.
[2.第2実施形態]
上述した第1の実施形態では、補強ブロック28aの除去部34aは、基板10の光入出射面22に沿った面36aに対向する面36bに設けられた一つの切欠き部であるものとした。ただし、これは一例であって、補強ブロックには、複数の除去部が形成されてもよい。
[2. Second embodiment]
In the first embodiment described above, the removed portion 34a of the reinforcing block 28a is a single notch provided on the surface 36b opposite the surface 36a along the light incident/exit surface 22 of the substrate 10. However, this is just one example, and the reinforcing block may have multiple removed portions formed thereon.
図5は、本発明の第2の実施形態に係る光導波路素子1bの構成を示す平面図である。なお、図5において、図1と同じ構成要素については、図1における符号と同じ符号を用いて示すものとし、上述した図1についての説明を援用する。 FIG. 5 is a plan view showing the configuration of an optical waveguide element 1b according to a second embodiment of the present invention. Note that in FIG. 5, the same components as those in FIG. 1 are designated by the same reference numerals, and the explanation for FIG. 1 above is applicable.
光導波路素子1bは、図1に示す第1の実施形態に係る光導波路素子1aと同様の構成を有するが、補強ブロック28aに代えて補強ブロック28bを有する点が異なる。
補強ブロック28bは、補強ブロック28aと同様の構成を有するが、切欠き部である除去部34aに加えて、除去部34bが形成されている点が異なる。
The optical waveguide element 1b has a configuration similar to that of the optical waveguide element 1a according to the first embodiment shown in FIG. 1, but differs in that it has a reinforcing block 28b instead of the reinforcing block 28a.
The reinforcing block 28b has the same configuration as the reinforcing block 28a, but differs in that a removed portion 34b is formed in addition to the removed portion 34a which is a cutout portion.
除去部34bは、除去部34aと同様の切欠き部である。除去部34bは、例えば、補強ブロック28bの、面36bと面36bに隣接する面36cと、の角部に形成されている。 The removed portion 34b is a cutout portion similar to the removed portion 34a. The removed portion 34b is formed, for example, at the corner of the reinforcement block 28b between the surface 36b and the surface 36c adjacent to the surface 36b.
また、光導波路素子1bでは、除去部34bにより確保される基板10の主面12上のスペースに、電気回路要素としての複数の電極パッド40が配されている。電極パッド40は、例えば、基板10上に形成された不図示の配線パターンを介して受光素子38a、38bの電極(不図示)と接続されて、これらの電極を、基板10の外部の電気回路に接続するための電極パッドであり得る。 Furthermore, in the optical waveguide element 1b, a plurality of electrode pads 40 serving as electrical circuit elements are arranged in the space on the main surface 12 of the substrate 10 secured by the removed portion 34b. The electrode pads 40 may be connected to the electrodes (not shown) of the light-receiving elements 38a, 38b via a wiring pattern (not shown) formed on the substrate 10, for example, and may serve as electrode pads for connecting these electrodes to an electrical circuit external to the substrate 10.
なお、本実施形態では、補強ブロック28bには、切欠き部としての2つの除去部34a及び34bが形成されるものとしたが、3つ以上の任意の数の除去部が設けられてもよい。それらの除去部は、図5に示す平面視形状において、必ずしも同一である必要はなく、異なる平面視形状の除去部が混在してもよい。 In this embodiment, the reinforcing block 28b has two cutout portions 34a and 34b formed therein, but any number of cutout portions, three or more, may be provided. These cutout portions do not necessarily have to have the same shape in plan view as shown in Figure 5, and cutout portions with different shapes in plan view may be mixed.
[3.第3実施形態]
上述した第1実施形態では、補強ブロック28aにおける除去部34aは切欠き部であるものとしたが、除去部は、必ずしも切欠き部である必要はない。除去部は、例えば、基板10の主面12の法線方向に開口する、補強ブロックに設けた貫通穴であってもよい。
3. Third embodiment
In the first embodiment described above, the removed portion 34 a in the reinforcement block 28 a is a notch, but the removed portion does not necessarily have to be a notch. The removed portion may be, for example, a through hole provided in the reinforcement block that opens in the normal direction to the main surface 12 of the substrate 10.
図6は、本発明の第3の実施形態に係る光導波路素子1cの構成を示す平面図である。なお、図6において、図1と同じ構成要素については、図1における符号と同じ符号を用いて示すものとし、上述した図1についての説明を援用する。 FIG. 6 is a plan view showing the configuration of an optical waveguide element 1c according to a third embodiment of the present invention. Note that in FIG. 6, the same components as those in FIG. 1 are designated by the same reference numerals, and the explanation for FIG. 1 above is applicable.
光導波路素子1cは、図1に示す第1の実施形態に係る光導波路素子1aと同様の構成を有するが、補強ブロック28aに代えて補強ブロック28cを有する点が異なる。
補強ブロック28cは、補強ブロック28aと同様の構成を有するが、切欠き部である一つの除去部34aに代えて、貫通穴である除去部34cが形成されている点が異なる。
The optical waveguide element 1c has a similar configuration to the optical waveguide element 1a according to the first embodiment shown in FIG. 1, but differs in that it has a reinforcing block 28c instead of the reinforcing block 28a.
The reinforcing block 28c has the same configuration as the reinforcing block 28a, but differs in that a through-hole 34c is formed in place of the one removed portion 34a which is a notch portion.
除去部34cは、基板10の主面12の法線方向に開口する補強ブロック28cに設けられた貫通穴である。本実施形態では、貫通穴である除去部34cは、光出力導波路24b、24cの末端以外の部分の上部に設けられている。除去部34cにより確保された基板10の主面12上の空間には、光出力導波路24b及び24cのそれぞれを伝搬する光波をモニタするための、電気回路要素としての受光素子38a及び38bが配されている。 The removed portion 34c is a through-hole provided in the reinforcing block 28c that opens in the normal direction to the main surface 12 of the substrate 10. In this embodiment, the removed portion 34c, which is a through-hole, is provided above the portions of the optical output waveguides 24b and 24c other than their ends. In the space above the main surface 12 of the substrate 10 secured by the removed portion 34c, light-receiving elements 38a and 38b are arranged as electrical circuit elements for monitoring the light waves propagating through the optical output waveguides 24b and 24c, respectively.
光導波路素子1cでは、補強ブロック28cは、受光素子38a、38bのような機能素子を配する部分に貫通としての除去部34cが設けられる。すなわち、光導波路素子1cでは、補強ブロック28cが配される基板10上の範囲であって機能要素を配置したい任意の位置に、当該機能要素の配置に必要なだけの(例えば、最小限の)広さの貫通穴を設けて、当該機能要素を配置するための空間を確保することができる。従って、光導波路素子1cでは、補強ブロック28cと基板10との間の接着面積を過度に狭めることがないので、補強ブロック28cと基板10との固定強度をより良好に保ちつつ、基板10上における機能要素の配置の自由度を高めることができる。 In the optical waveguide element 1c, the reinforcement block 28c has a removed portion 34c as a through-hole in the area where functional elements such as light-receiving elements 38a and 38b are located. In other words, in the optical waveguide element 1c, a through-hole of the required size (e.g., the minimum size) for arranging a functional element can be provided at any desired position on the substrate 10 where the reinforcement block 28c is located, thereby securing space for arranging the functional element. Therefore, in the optical waveguide element 1c, the adhesive area between the reinforcement block 28c and the substrate 10 is not excessively narrowed, thereby improving the fixing strength between the reinforcement block 28c and the substrate 10 while increasing the degree of freedom in arranging functional elements on the substrate 10.
なお、本実施形態では、図6に示す補強ブロック28cに設けられる貫通穴としての除去部34cの平面視形状は矩形であるものとしたが、多角形、円形、楕円形等の任意形状であり得る。また、補強ブロック28cには、貫通穴としての除去部34cが一つ設けられるものとしたが、貫通穴としての除去部の数は、一つに限らず、二つの以上の任意の数であり得る。それらの除去部は、図6に示す平面視形状において、必ずしも同一である必要はなく、異なる平面視形状の除去部が混在してもよい。 In this embodiment, the planar shape of the removed portion 34c as a through hole provided in the reinforcement block 28c shown in Figure 6 is rectangular, but it can be any shape, such as polygonal, circular, or elliptical. Furthermore, while the reinforcement block 28c is provided with one removed portion 34c as a through hole, the number of removed portions as through holes is not limited to one and can be any number of two or more. These removed portions do not necessarily have to have the same shape in the planar view shown in Figure 6, and removed portions of different planar shapes may be mixed.
[4.第4実施形態]
基板10の主面12上に配する補強ブロックは、単一の直方体から当該直方体の少なくとも一の部分を除去した形状を有する単一のブロックで構成されていればよく、除去される部分は、必ずしも切欠きや貫通穴である必要はない。
4. Fourth embodiment
The reinforcing block placed on the main surface 12 of the substrate 10 need only be composed of a single block having a shape obtained by removing at least one portion of a single rectangular parallelepiped, and the removed portion does not necessarily have to be a notch or a through hole.
図7は、本発明の第4の実施形態に係る光導波路素子1dの構成を示す平面図である。なお、図7において、図1と同じ構成要素については、図1における符号と同じ符号を用いて示すものとし、上述した図1についての説明を援用する。 FIG. 7 is a plan view showing the configuration of an optical waveguide element 1d according to a fourth embodiment of the present invention. Note that in FIG. 7, the same components as those in FIG. 1 are designated by the same reference numerals, and the explanation for FIG. 1 above is applicable.
光導波路素子1dは、図1に示す第1の実施形態に係る光導波路素子1aと同様の構成を有するが、補強ブロック28aに代えて補強ブロック28dを有する点が異なる。 Optical waveguide element 1d has a configuration similar to that of optical waveguide element 1a according to the first embodiment shown in Figure 1, but differs in that it has reinforcing block 28d instead of reinforcing block 28a.
補強ブロック28dは、補強ブロック28aと同様の構成を有するが、切欠き部である除去部34aを有さず、除去部34dにより、基板10の光入出射面22に沿った面36aに対向する面36b1が、凹状の曲面で形成されている。
すなわち、補強ブロック28dは、単一の直方体の一の面から当該直方体の一の部分を凹状に除去して、当該一の面を曲面に形成した形状を有する。
Reinforcement block 28d has a configuration similar to reinforcement block 28a, but does not have the cutout portion 34a, and the cutout portion 34d forms a concave curved surface 36b1 opposite to surface 36a along the light incident/exit surface 22 of the substrate 10.
That is, the reinforcing block 28d has a shape in which one portion of one surface of a single rectangular parallelepiped is removed in a concave shape, and the one surface is formed into a curved surface.
上記凹状に除去された部分である除去部34dにより確保された空間内には、除去部34a等と同様に、電気回路要素、光学要素、又は機械要素を配置することができる。光導波路素子1dでは、除去部34dにより確保された空間内には、例えば、受光素子38a、38bが配されている。 In the space created by the recessed removed portion 34d, electrical circuit elements, optical elements, or mechanical elements can be placed, similar to removed portion 34a, etc. In the optical waveguide element 1d, for example, light receiving elements 38a and 38b are placed in the space created by removed portion 34d.
また、光導波路素子1dでは、面36b1が曲面で構成されるので、次のような利点を有する。
すなわち、一般に、補強ブロックが接着されている基板10の部分には、補強ブロックと基板10との線膨張係数差に起因して、動作温度の変動に伴って応力が発生する。この応力は、基板10の主面12のうち、補強ブロックの角部(例えば、図1の構成において切欠き部である除去部34aの角部)が配される位置に集中して、偏在し易い。
Furthermore, in the optical waveguide element 1d, the surface 36b1 is configured as a curved surface, which has the following advantages.
That is, generally, stress occurs in the portion of the substrate 10 to which the reinforcing block is adhered as the operating temperature changes due to the difference in the linear expansion coefficient between the reinforcing block and the substrate 10. This stress tends to concentrate and become unevenly distributed at positions on the main surface 12 of the substrate 10 where the corners of the reinforcing block are located (for example, the corners of the removed portion 34a, which is the notch portion in the configuration of FIG. 1 ).
これに対し、光導波路素子1dでは、補強ブロック28dは、直方体の一部が除去部34dにより凹状に除去された形状を有し、残された面36b1が、角部のない曲面となっている。このため、光導波路素子1dでは、補強ブロック28dと基板10との接着部分における応力の偏在を抑制して、当該応力が、基板10から補強ブロック28dを剥離させる要因となったり、光導波路素子1dとしての光学特性や動作特性に悪影響を与えるのを防止することができる。 In contrast, in the optical waveguide element 1d, the reinforcement block 28d has a rectangular parallelepiped shape in which a portion has been removed in a concave shape by the removal portion 34d, and the remaining surface 36b1 is a curved surface without corners. This suppresses uneven distribution of stress at the adhesive portion between the reinforcement block 28d and the substrate 10 in the optical waveguide element 1d, preventing the stress from causing the reinforcement block 28d to peel off from the substrate 10 or adversely affecting the optical and operating characteristics of the optical waveguide element 1d.
[5.第5実施形態]
図8は、本発明の第5の実施形態に係る光導波路素子1eの構成を示す平面図である。なお、図8において、図1と同じ構成要素については、図1における符号と同じ符号を用いて示すものとし、上述した図1についての説明を援用する。
5. Fifth embodiment
Fig. 8 is a plan view showing the configuration of an optical waveguide element 1e according to a fifth embodiment of the present invention. In Fig. 8, the same components as those in Fig. 1 are designated by the same reference numerals as those in Fig. 1, and the above description of Fig. 1 is incorporated herein.
光導波路素子1eは、図1に示す第1の実施形態に係る光導波路素子1aと同様の構成を有するが、補強ブロック28aに代えて補強ブロック28eを有する点が異なる。 Optical waveguide element 1e has a configuration similar to that of optical waveguide element 1a according to the first embodiment shown in Figure 1, but differs in that it has reinforcing block 28e instead of reinforcing block 28a.
補強ブロック28eは、補強ブロック28aと同様の構成を有するが、切欠き部である除去部34aがなく、基板10の主面12の法線方向から視た平面視形状が五角形を成すように構成されている。このような形状は、基板10の光入出射面22に沿った面36aに対向する部分に、平面視が三角形の2つの除去部34e1、34e2を形成することにより形成され得る。 Reinforcement block 28e has the same configuration as reinforcement block 28a, but does not have the cutout portion 34a, and is configured so that its planar shape when viewed from the normal direction of main surface 12 of substrate 10 is pentagonal. This shape can be formed by forming two triangular cutout portions 34e1 and 34e2 in a planar view in the portion facing surface 36a along the light incident/exit surface 22 of substrate 10.
除去部34e1、34e2により確保された空間内には、除去部34a等と同様に、電気回路要素、光学要素、又は機械要素を配置することができる。光導波路素子1eでは、除去部34e1により確保された空間内に受光素子38a、38bが配されている。図8では、除去部34e2により確保された空間内には何も配されていないが、電極パッド40等の要素が配されてもよい。 As with removed portion 34a, etc., electrical circuit elements, optical elements, or mechanical elements can be placed in the space secured by removed portions 34e1 and 34e2. In optical waveguide element 1e, light-receiving elements 38a and 38b are placed in the space secured by removed portion 34e1. In Figure 8, nothing is placed in the space secured by removed portion 34e2, but elements such as electrode pads 40 may also be placed there.
補強ブロック28eは、汎用使用されるダイシングソーによる直線加工により、容易に作製することができる。 The reinforcing block 28e can be easily fabricated by linear machining using a general-purpose dicing saw.
[6.第6実施形態]
図9は、本発明の第6の実施形態に係る光導波路素子1fの構成を示す平面図である。なお、図9において、図8と同じ構成要素については、図8における符号と同じ符号を用いて示すものとし、上述した図8についての説明を援用する。
6. Sixth Embodiment
Fig. 9 is a plan view showing the configuration of an optical waveguide element 1f according to a sixth embodiment of the present invention. In Fig. 9, the same components as those in Fig. 8 are designated by the same reference numerals as those in Fig. 8, and the description of Fig. 8 above is used.
光導波路素子1fは、図8に示す第5の実施形態に係る光導波路素子1eと同様の構成を有するが、補強ブロック28eに代えて補強ブロック28fを有する点が異なる。このような形状は、基板10の光入出射面22に沿った面36aに対向する部分に、平面視が三角形の一つの除去部34fを形成することにより形成され得る。 The optical waveguide element 1f has a similar configuration to the optical waveguide element 1e according to the fifth embodiment shown in Figure 8, but differs in that it has a reinforcing block 28f instead of reinforcing block 28e. This shape can be formed by forming a single removed portion 34f that is triangular in plan view in the portion facing the surface 36a along the light incident/exit surface 22 of the substrate 10.
除去部34fにより確保された空間内には、電気回路要素、光学要素、又は機械要素を配置することができる。光導波路素子1fでは、除去部34fにより確保された空間内に受光素子38a、38bが配されている。 Electrical circuit elements, optical elements, or mechanical elements can be placed in the space secured by the removed portion 34f. In the optical waveguide element 1f, light receiving elements 38a and 38b are placed in the space secured by the removed portion 34f.
補強ブロック28fは、補強ブロック28eよりも辺(又は面)の数が少ないので、ダイシングソーによる直線加工により、補強ブロック28eよりも更に容易に作製するこができる。 Reinforcement block 28f has fewer sides (or faces) than reinforcement block 28e, so it can be manufactured more easily than reinforcement block 28e by linear processing using a dicing saw.
[7.第7実施形態]
図10は、本発明の第7の実施形態に係る光導波路素子1gの構成を示す平面図である。なお、図10において、図1と同じ構成要素については、図1における符号と同じ符号を用いて示すものとし、上述した図1についての説明を援用する。
[7. Seventh embodiment]
Fig. 10 is a plan view showing the configuration of an optical waveguide element 1g according to a seventh embodiment of the present invention. In Fig. 10, the same components as those in Fig. 1 are designated by the same reference numerals as those in Fig. 1, and the above description of Fig. 1 is used.
光導波路素子1gは、図1に示す第1の実施形態に係る光導波路素子1aと同様の構成を有するが、補強ブロック28aに代えて、2つのサブブロック28g1及び28g2で構成される補強ブロック28gを備える。サブブロック28g1及び28g2は、補強ブロック28aと同様の構成を有するが、除去部34aを有さず、それぞれが、直方体の形状を有するブロックとして構成されている。すなわち、補強ブロック28gは、2つの直方体のブロックであるサブブロック28g1及び28g2により構成されている。 Optical waveguide element 1g has a similar configuration to optical waveguide element 1a according to the first embodiment shown in FIG. 1, but instead of reinforcement block 28a, it has reinforcement block 28g composed of two sub-blocks 28g1 and 28g2. Sub-blocks 28g1 and 28g2 have a similar configuration to reinforcement block 28a, but do not have removed portion 34a, and each is configured as a block having a rectangular parallelepiped shape. In other words, reinforcement block 28g is composed of sub-blocks 28g1 and 28g2, which are two rectangular parallelepiped blocks.
補強ブロック28gを構成するサブブロック28g1及び28g2は、それぞれ、一の面が、基板10の光入出射面22に沿うように(例えば、面一又は略面一となるように)配されている。 The sub-blocks 28g1 and 28g2 that make up the reinforcing block 28g are each arranged so that one surface is aligned with the light incident/exit surface 22 of the substrate 10 (e.g., flush or nearly flush).
また、サブブロック28g1は、光入力導波路24aのスポットサイズ変換部26aを含む端部の直上に配され、サブブロック28g2は、光出力導波路24b、24cのスポットサイズ変換部26b、26cを含む端部の直上に配されている。これにより、サブブロック28g1及びその下部の接着層30は、光入力導波路24aのスポットサイズ変換部26aのクラッドとして機能し、サブブロック28g2及びその下部の接着層30は、光出力導波路24b、24cのスポットサイズ変換部26b、26cのクラッドとして機能する。 Furthermore, sub-block 28g1 is arranged directly above the end of optical input waveguide 24a that includes spot size conversion section 26a, and sub-block 28g2 is arranged directly above the end of optical output waveguides 24b and 24c that include spot size conversion sections 26b and 26c. As a result, sub-block 28g1 and the adhesive layer 30 below it function as cladding for spot size conversion section 26a of optical input waveguide 24a, and sub-block 28g2 and the adhesive layer 30 below it function as cladding for spot size conversion sections 26b and 26c of optical output waveguides 24b and 24c.
ここで、図10に示す基板10の主面12の平面視における光入出射面22に沿った辺の長さLbに対し、補強ブロック28gを構成するサブブロック28g1、28g2のそれぞれの上記辺に沿った長さLg1、Lg2の和は小さいものとする。すなわち、以下の式(1)を満たすものとする。
Lg1+Lg2<Lb (1)
Here, the sum of lengths Lg1 and Lg2 of the sub-blocks 28g1 and 28g2 constituting the reinforcement block 28g along the respective sides is assumed to be smaller than the length Lb of the side along the light incident/exit surface 22 in the plan view of the main surface 12 of the substrate 10 shown in Figure 10. In other words, the following formula (1) is satisfied.
Lg1+Lg2<Lb (1)
これにより、基板10の主面12上には、光入出射面22に沿って、2つの直方体のブロックであるサブブロック28g1と28g2の間に空間が確保され得る。
この空間には、図1における除去部34aにより確保される空間と同様に、基板10の主面12上に、電気回路要素、光学要素、又は機械要素などの機能要素を配置することができる(図10では、空間に配された機能要素は不図示)。
This allows a space to be secured on the main surface 12 of the substrate 10 along the light incident/exit surface 22 between the sub-blocks 28 g 1 and 28 g 2 , which are two rectangular parallelepiped blocks.
In this space, functional elements such as electrical circuit elements, optical elements, or mechanical elements can be placed on the main surface 12 of the substrate 10, similar to the space secured by the removed portion 34a in Figure 1 (the functional elements placed in the space are not shown in Figure 10).
なお、本実施形態では、補強ブロック28gは、直方体形状の2つのサブブロック28g1及び28g2を含むものとしたが、補強ブロック28gが含む直方体形状のサブブロックの数は、3以上の任意の数であるものとすることができる。この場合にも、各サブブロックは、それぞれ、一の面が、基板10の光入出射面22に沿うように配されるものとすることができる。また、基板10の光入出射面22に沿った各サブブロックの長さの総和は、光入出射面22に沿った基板10の辺の長さLbより短く設定され得る。 In this embodiment, the reinforcing block 28g includes two rectangular parallelepiped sub-blocks 28g1 and 28g2, but the number of rectangular parallelepiped sub-blocks included in the reinforcing block 28g can be any number greater than or equal to three. In this case, each sub-block can be arranged so that one face is aligned with the light incident/exit surface 22 of the substrate 10. Furthermore, the sum of the lengths of the sub-blocks along the light incident/exit surface 22 of the substrate 10 can be set to be shorter than the length Lb of the side of the substrate 10 along the light incident/exit surface 22.
[8.第8実施形態]
図11は、本発明の第8の実施形態に係る光導波路素子1hの構成を示す平面図である。また、図12は、図11に示す光導波路素子1hのXII-XII断面矢視図である。なお、図11及び図12において、図1及び図4と同じ構成要素については、図1及び図4における符号と同じ符号を用いて示すものとし、上述した図1及び図4についての説明を援用する。
[8. Eighth embodiment]
Fig. 11 is a plan view showing the configuration of an optical waveguide element 1h according to an eighth embodiment of the present invention. Fig. 12 is a cross-sectional view taken along the line XII-XII of the optical waveguide element 1h shown in Fig. 11. In Figs. 11 and 12, the same components as those in Figs. 1 and 4 are designated by the same reference numerals as those in Figs. 1 and 4, and the above-mentioned explanations for Figs. 1 and 4 are incorporated herein by reference.
光導波路素子1hは、図1に示す第1の実施形態に係る光導波路素子1aと同様の構成を有するが、補強ブロック28aに代えて補強ブロック28hを有する点が異なる。
補強ブロック28hは、補強ブロック28aと同様の構成を有するが、切欠き部である一つの除去部34aに加えて、除去部34h(図12)が形成されている点が異なる。
The optical waveguide element 1h has a configuration similar to that of the optical waveguide element 1a according to the first embodiment shown in FIG. 1, but differs in that it has a reinforcing block 28h instead of the reinforcing block 28a.
The reinforcing block 28h has the same configuration as the reinforcing block 28a, but differs in that in addition to the one removed portion 34a which is a cutout portion, a removed portion 34h (FIG. 12) is formed.
除去部34hは、除去部34aと同様に切欠き部であるが、その位置が、補強ブロック28hのうちの、基板10の主面12と向かい合う面36d(図12)に形成されている。 The removed portion 34h is a notch like the removed portion 34a, but is located on the surface 36d (Figure 12) of the reinforcement block 28h that faces the main surface 12 of the substrate 10.
これにより、光導波路素子1hでは、補強ブロック28hと基板10との間に、機能要素を配置するための空間を確保することができるので、基板10上における機能要素の配置の自由度をより高めることができる。また、光導波路素子1hでは、単一のブロックとして補強ブロック28hが形成されるので、複数のサブブロックで構成される第7実施形態の補強ブロック28gに比べて、補強ブロック28hの強度を向上することができる。 As a result, in the optical waveguide element 1h, space can be secured between the reinforcing block 28h and the substrate 10 for arranging functional elements, thereby increasing the degree of freedom in arranging functional elements on the substrate 10. Furthermore, in the optical waveguide element 1h, the reinforcing block 28h is formed as a single block, so the strength of the reinforcing block 28h can be improved compared to the reinforcing block 28g of the seventh embodiment, which is composed of multiple sub-blocks.
また、補強ブロック28hは、単一のブロックとして形成されているので、直方体形状の複数のサブブロックで構成される第7実施形態に係る補強ブロック28gに比べて、基板10の主面12へ配置する際の位置合わせが容易である。 Furthermore, since the reinforcing block 28h is formed as a single block, it is easier to align when placing it on the main surface 12 of the substrate 10 compared to the reinforcing block 28g according to the seventh embodiment, which is composed of multiple rectangular parallelepiped sub-blocks.
[9.第9実施形態]
上述した第8の実施形態では、補強ブロック28hには、基板10の主面12と向かい合う面36dに、切欠き部である一つの除去部34hが設けられるものとした。ただし、これは一例であって、基板10の主面12と向かい合う面36dに設けられる除去部の数は、2以上の数であってもよい。
[9. Ninth embodiment]
In the above-described eighth embodiment, the reinforcement block 28h is provided with one removed portion 34h that is a notch portion on the surface 36d that faces the main surface 12 of the substrate 10. However, this is just one example, and the number of removed portions provided on the surface 36d that faces the main surface 12 of the substrate 10 may be two or more.
図13は、本発明の第9の実施形態に係る光導波路素子1iの構成を示す平面図である。また、図14は、図13に示す光導波路素子1iのXIV-XIV断面矢視図である。なお、図13及び図14において、図11及び図12と同じ構成要素については、図11及び図12における符号と同じ符号を用いて示すものとし、上述した図11及び図12についての説明を援用する。 FIG. 13 is a plan view showing the configuration of an optical waveguide element 1i according to a ninth embodiment of the present invention. Furthermore, FIG. 14 is a cross-sectional view of the optical waveguide element 1i shown in FIG. 13, taken along the line XIV-XIV. Note that in FIGS. 13 and 14, the same components as those in FIGS. 11 and 12 are designated by the same reference numerals, and the explanations for FIGS. 11 and 12 above are incorporated herein.
光導波路素子1iは、図11に示す第8の実施形態に係る光導波路素子1hと同様の構成を有するが、補強ブロック28hに代えて補強ブロック28iを有する。
補強ブロック28iは、補強ブロック28hと同様の構成を有するが、除去部34hに代えて、基板10の主面12と向かい合う面36dに、切欠き部としての2つの除去部34i1及び34i2が設けられている点が異なる(図14参照)。
The optical waveguide element 1i has a configuration similar to that of the optical waveguide element 1h according to the eighth embodiment shown in FIG. 11, but includes a reinforcing block 28i instead of the reinforcing block 28h.
Reinforcement block 28i has a configuration similar to reinforcement block 28h, but differs in that instead of removal portion 34h, two removal portions 34i1 and 34i2 as cutout portions are provided on surface 36d opposite main surface 12 of substrate 10 (see Figure 14).
光導波路素子1iでは、光導波路素子1aと同様に、切欠き部である2つの除去部34i1、34i2により確保される基板10の主面12上の空間に、電気回路要素、光学要素、又は機械要素を配置することが可能となり、基板10上におけるこれら機能要素の配置の自由度が向上する。 In the optical waveguide element 1i, similar to the optical waveguide element 1a, it is possible to arrange electrical circuit elements, optical elements, or mechanical elements in the space on the main surface 12 of the substrate 10 secured by the two cutout portions 34i1 and 34i2, thereby improving the degree of freedom in arranging these functional elements on the substrate 10.
一例として、図13及び図14に示す光導波路素子1iでは、光導波路14が含む2つのマッハツェンダ型光導波路がそれぞれ有する2つの並行導波路42a、42b及び44a、44bがジグザグ上に折れ曲がって形成されている。そして、除去部34i1、34i2により確保される基板10の主面12上の空間に、光学要素としての、並行導波路42a、42b及び44a、44bの、それぞれの折れ曲がり部が、電気要素としての電極16と共に配されている。 As an example, in the optical waveguide element 1i shown in Figures 13 and 14, the two parallel waveguides 42a, 42b and 44a, 44b of the two Mach-Zehnder optical waveguides included in the optical waveguide 14 are formed in a zigzag bent shape. The bent portions of the parallel waveguides 42a, 42b and 44a, 44b, which serve as optical elements, are arranged together with electrodes 16, which serve as electrical elements, in the space on the main surface 12 of the substrate 10 secured by the removed portions 34i1, 34i2.
これにより、光導波路素子1iでは、基板10の主面12上の、除去部34i1、34i2の部分を含むより広い範囲に、より長い並行導波路42a、42b及び44a、44bを形成することができる。その結果、光導波路素子1iでは、並行導波路42a、42b及び44a、44bを伝搬する光と、電極16を伝搬する高周波電気信号と、の作用距離をより長く確保して、動作電圧を低減することが可能となる。 As a result, in the optical waveguide element 1i, longer parallel waveguides 42a, 42b and 44a, 44b can be formed over a wider area on the main surface 12 of the substrate 10, including the removed portions 34i1, 34i2. As a result, in the optical waveguide element 1i, a longer interaction distance can be ensured between the light propagating through the parallel waveguides 42a, 42b and 44a, 44b and the high-frequency electrical signal propagating through the electrode 16, making it possible to reduce the operating voltage.
[10.第10実施形態]
次に、本発明の第10の実施形態について説明する。本実施形態は、上述した第1ないし第9の実施形態に係る光導波路素子1a、1b、1c、1d、1e、1f、1g、1h、1iのいずれかを搭載した光導波路デバイスである。
[10. Tenth embodiment]
Next, a tenth embodiment of the present invention will be described. This embodiment is an optical waveguide device incorporating any one of the optical waveguide elements 1a, 1b, 1c, 1d, 1e, 1f, 1g, 1h, and 1i according to the first to ninth embodiments described above.
以下、光導波路素子1a、1b、1c、1d、1e、1f、1g、1h、1iを総称して光導波路素子1ともいうものとする。また、光導波路素子1a、1b、1c、1d、1e、1f、1g、1h、1iが備える補強ブロック28a、28b、28c、28d、28e、28f、28g、28h、28iを総称して補強ブロック28ともいうものとする、また、補強ブロック28a、28b、28c、28d、28e、28f、28g、28h、28iの除去部34a、34b、34c、34d、34e、34f、34g、34h、34iを総称して除去部34ともいうものとする。 Hereinafter, optical waveguide elements 1a, 1b, 1c, 1d, 1e, 1f, 1g, 1h, and 1i will be collectively referred to as optical waveguide element 1. Furthermore, reinforcement blocks 28a, 28b, 28c, 28d, 28e, 28f, 28g, 28h, and 28i provided in optical waveguide elements 1a, 1b, 1c, 1d, 1e, 1f, 1g, 1h, and 1i will be collectively referred to as reinforcement blocks 28. Furthermore, removed portions 34a, 34b, 34c, 34d, 34e, 34f, 34g, 34h, and 34i of reinforcement blocks 28a, 28b, 28c, 28d, 28e, 28f, 28g, 28h, and 28i will be collectively referred to as removed portions 34.
図15は、第10の実施形態に係る光導波路デバイス60の構成を示す図である。光導波路デバイス60は、光導波路素子62と、光導波路素子62を収容する筐体64と、を有する。筐体64は、最終的にはその開口部に、板体であるカバー(不図示)が固定されて、その内部が気密封止される。 Figure 15 is a diagram showing the configuration of an optical waveguide device 60 according to the tenth embodiment. The optical waveguide device 60 has an optical waveguide element 62 and a housing 64 that houses the optical waveguide element 62. A plate-shaped cover (not shown) is ultimately fixed to the opening of the housing 64, hermetically sealing the interior.
光導波路素子62は、上述した光導波路素子1a、1b、1c、1d、1e、1f、1g、1h、1iのいずれかであり得る。すなわち、光導波路素子62は、上述した光導波路素子1が備える光入力導波路24a、光出力導波路24b、24c等の共通の構成要素を含んでいる。また、面一に配された光導波路素子62の補強ブロック28の面36a及び基板10の光入出射面22には、レンズアレイ32が固定されている。 The optical waveguide element 62 may be any of the optical waveguide elements 1a, 1b, 1c, 1d, 1e, 1f, 1g, 1h, and 1i described above. That is, the optical waveguide element 62 includes common components such as the optical input waveguide 24a and optical output waveguides 24b and 24c provided in the optical waveguide element 1 described above. In addition, a lens array 32 is fixed to the surface 36a of the reinforcement block 28 of the optical waveguide element 62 and the light input/output surface 22 of the substrate 10, which are arranged flush with each other.
光導波路デバイス60は、光導波路素子62に光を入射する入力光ファイバ66と、光導波路素子62が出射する出力光を筐体64の外へ導く出力光ファイバ68と、を備える。入力光ファイバ66及び出力光ファイバ68は、固定部材であるサポート70及び72を介して筐体64にそれぞれ固定されている。 The optical waveguide device 60 comprises an input optical fiber 66 that inputs light into the optical waveguide element 62, and an output optical fiber 68 that guides the output light emitted by the optical waveguide element 62 out of the housing 64. The input optical fiber 66 and the output optical fiber 68 are fixed to the housing 64 via supports 70 and 72, which are fixing members, respectively.
入力光ファイバ66から入力された光は、サポート70内に配されたレンズ74によりコリメートされた後、光導波路素子62に固定されたレンズアレイ32の対応するレンズを介して光導波路素子62の光入力導波路24aに入力される。 Light input from the input optical fiber 66 is collimated by a lens 74 arranged within the support 70, and then input to the optical input waveguide 24a of the optical waveguide element 62 via a corresponding lens in the lens array 32 fixed to the optical waveguide element 62.
光導波路素子62の2つの光出力導波路24b、24cから出力される光は、光導波路素子62に固定されたレンズアレイ32の対応するレンズを介してコリメートされ、偏波合成器等を含む光学ユニット76により一つのビームに結合される。結合されたビームは、サポート72に配されたレンズ78を介して出力光ファイバ68に結合される。 The light output from the two optical output waveguides 24b, 24c of the optical waveguide element 62 is collimated via corresponding lenses in the lens array 32 fixed to the optical waveguide element 62 and combined into a single beam by an optical unit 76 that includes a polarization combiner and other components. The combined beam is coupled to the output optical fiber 68 via a lens 78 arranged on the support 72.
筐体64の外側面には、光導波路素子62の動作に必要な電気信号等を外部装置との間で送受信するための、複数のピン80が配されている。ピン80は、電気信号の送受信だけでなく、外部装置から電源供給を受けるための電源ピンを含んでもよい。なお、ピン80は、光導波路素子62の動作に必要な電気信号等を外部装置との間で送受信するための電気的インタフェースの一例であって、上記電気的インタフェースは、光導波路デバイス60に求められる電気特性及び他装置への実装上の制約等に応じて、ピン以外の任意の形状及び電気特性を有する電気的インタフェースを選択して用いることができる。そのような電気的インタフェースは、ピン80のほか、筐体64に接続されたフレキシブル基板(FPC)その他であり得る。 A plurality of pins 80 are arranged on the outer surface of the housing 64 for transmitting and receiving electrical signals, etc., required for the operation of the optical waveguide element 62, to and from an external device. The pins 80 may include power pins for receiving power from an external device in addition to transmitting and receiving electrical signals. Note that the pins 80 are an example of an electrical interface for transmitting and receiving electrical signals, etc., required for the operation of the optical waveguide element 62, to and from an external device. The above electrical interface can be an electrical interface other than pins that has any shape and electrical characteristics, depending on the electrical characteristics required of the optical waveguide device 60 and mounting constraints on other devices. Such an electrical interface can be pins 80, a flexible printed circuit (FPC), or other device connected to the housing 64.
筐体64の内部には、ピン80を介して送受信される電気信号及び又はピン80を介して入力される電源ラインを光導波路素子62に中継する中継基板82を備えてもよい。
中継基板82は、光導波路素子62を駆動する駆動回路84を備える。駆動回路84は、ピン80から入力される電気信号を入力として、光導波路素子62の電極16に高周波信号を出力する。
The housing 64 may include a relay board 82 inside that relays electrical signals transmitted and received via the pins 80 and/or power lines input via the pins 80 to the optical waveguide element 62 .
The relay substrate 82 includes a drive circuit 84 that drives the optical waveguide element 62. The drive circuit 84 receives an electrical signal from the pin 80 as an input and outputs a high-frequency signal to the electrode 16 of the optical waveguide element 62.
光導波路素子1のそれぞれは、光導波路素子1aと同様に光導波路14が2つのマッハツェンダ型光導波路を含み、光変調器として機能する。すなわち、光導波路素子1のいずれかを光導波路素子62として備える光導波路デバイス60は、光変調デバイスとして機能し得る。 Each of the optical waveguide elements 1, like the optical waveguide element 1a, has an optical waveguide 14 that includes two Mach-Zehnder optical waveguides, and functions as an optical modulator. In other words, an optical waveguide device 60 that includes any of the optical waveguide elements 1 as an optical waveguide element 62 can function as an optical modulation device.
上述した構成を有する光導波路デバイス60は、光導波路素子62として、基板10サイズを拡大することなく又はよりサイズの小さな基板10を用いて構成され得る高機能な光導波路素子1を用いるので、筐体64のサイズを拡大することなく又はより小さな筐体64を用いて、高機能な又は高性能の光導波路デバイスを実現することができる。 The optical waveguide device 60 having the above-described configuration uses a high-performance optical waveguide element 1 as the optical waveguide element 62, which can be constructed without increasing the size of the substrate 10 or by using a smaller-sized substrate 10. Therefore, a high-performance or high-performance optical waveguide device can be realized without increasing the size of the housing 64 or by using a smaller housing 64.
なお、本実施形態では、中継基板82は駆動回路84を備えるものとしたが、中継基板82は、必ずしも駆動回路84を備えなくてもよい。例えば、中継基板82は、駆動回路84を含まず、光導波路素子62に設けられた電極16や受光素子38a、38b等の電極と、ピン80と、を中継する配線パターン及びコンデンサ等の受動回路部品のみを含むものとすることができる。 In this embodiment, the relay board 82 is provided with a drive circuit 84, but the relay board 82 does not necessarily have to include a drive circuit 84. For example, the relay board 82 may not include a drive circuit 84, and may include only a wiring pattern and passive circuit components such as capacitors that connect the pins 80 to electrodes such as the electrode 16 and light-receiving elements 38a and 38b provided on the optical waveguide element 62.
ただし、本実施形態のように、光導波路素子62を収容する筐体64内に駆動回路84を備えることで、より高機能な光導波路デバイスを実現することができる。
[11.第11実施形態]
次に、本発明の第11の実施形態について説明する。本実施形態は、第10の実施形態に係る光変調デバイスとしての光導波路デバイス60を搭載した光送信装置90である。図16は、本実施形態に係る光送信装置90の構成を示す図である。この光送信装置90は、光変調デバイスである光導波路デバイス60と、光導波路デバイス60に光を入射する光源92と、変調信号生成部94と、を備える。なお、光導波路デバイス60に駆動回路84を備えないときは、光送信装置90は、駆動回路84と同機能を有する変調器駆動部を備えるものとすることができる。
However, as in this embodiment, by providing a drive circuit 84 inside the housing 64 that houses the optical waveguide element 62, a more sophisticated optical waveguide device can be realized.
[11. Eleventh embodiment]
Next, an eleventh embodiment of the present invention will be described. This embodiment is an optical transmitting apparatus 90 equipped with an optical waveguide device 60 as the optical modulation device according to the tenth embodiment. FIG. 16 is a diagram showing the configuration of the optical transmitting apparatus 90 according to this embodiment. This optical transmitting apparatus 90 includes the optical waveguide device 60 as an optical modulation device, a light source 92 that inputs light to the optical waveguide device 60, and a modulation signal generating unit 94. Note that when the optical waveguide device 60 does not include a driving circuit 84, the optical transmitting apparatus 90 may include a modulator driving unit having the same function as the driving circuit 84.
変調信号生成部94は、光導波路デバイス60に変調動作を行わせるための電気信号を生成する電子回路であり、外部から与えられる送信データに基づき、光導波路デバイス60に当該変調データに従った光変調動作を行わせるための高周波信号である変調信号を生成して、光導波路デバイス60へ出力する。上記変調信号は、光導波路デバイス60の中継基板82に搭載された駆動回路84に入力される。駆動回路84は、入力された変調信号の増幅等を行い、光導波路素子62を駆動するための高周波信号である駆動信号を、光導波路素子62の電極16に出力する。これにより、光源92の出力光が光導波路デバイス60により変調されて、光送信装置90から出力される。 The modulation signal generation unit 94 is an electronic circuit that generates an electrical signal to cause the optical waveguide device 60 to perform a modulation operation. Based on externally provided transmission data, it generates a modulation signal, which is a high-frequency signal that causes the optical waveguide device 60 to perform an optical modulation operation in accordance with the modulation data, and outputs it to the optical waveguide device 60. The modulation signal is input to a drive circuit 84 mounted on the relay board 82 of the optical waveguide device 60. The drive circuit 84 amplifies the input modulation signal, and outputs a drive signal, which is a high-frequency signal for driving the optical waveguide element 62, to the electrode 16 of the optical waveguide element 62. As a result, the output light of the light source 92 is modulated by the optical waveguide device 60 and output from the optical transmitter 90.
上記の構成を有する光送信装置90は、光導波路素子62として上述したいずれかの光導波路素子1を用いた光導波路デバイス60により構成されるので、高機能又は高性能の光送信装置を実現し得る。 The optical transmitter 90 having the above configuration is composed of an optical waveguide device 60 that uses any of the optical waveguide elements 1 described above as the optical waveguide element 62, making it possible to realize a highly functional or high-performance optical transmitter.
[12.他の実施形態]
光導波路素子1は、上述した実施形態では、光変調器として機能するものとしたが、光スイッチや、偏波回転、あるいは波長変換等の、任意の機能を有するものとすることができる。
12. Other Embodiments
In the above-described embodiment, the optical waveguide element 1 functions as an optical modulator, but it may have any other function such as an optical switch, polarization rotation, or wavelength conversion.
光導波路素子1を構成する光導波路14は、上述した実施形態ではマッハツェンダ型光導波路を含むものとしたが、光導波路素子1に求められる機能に応じて、マッハツェンダ型光導波路以外のタイプの導波路パターンを含んでもよい。例えば、光導波路14は、方向性結合器や、多ポートの光分岐を構成するものであってもよい。 In the above-described embodiment, the optical waveguide 14 that constitutes the optical waveguide element 1 includes a Mach-Zehnder optical waveguide, but depending on the functionality required of the optical waveguide element 1, it may also include a waveguide pattern of a type other than a Mach-Zehnder optical waveguide. For example, the optical waveguide 14 may constitute a directional coupler or a multi-port optical branch.
光導波路素子1を構成する基板10は、上述した実施形態では、電気光学効果を有するLN等の基板であるものとしたが、光導波路素子1に求められる機能に応じて、電気光学効果を有さない材料で構成されてもよい。 In the above-described embodiment, the substrate 10 constituting the optical waveguide element 1 is a substrate such as LN that has an electro-optic effect, but it may also be made of a material that does not have an electro-optic effect, depending on the functionality required of the optical waveguide element 1.
上述した第5の実施形態及び第6の実施形態では、それぞれ、図8及び図9において、平面視形状が五角形及び台形の補強ブロック28e及び28fを例示したが、補強ブロック28の平面視形状は、五角形及び台形以外の任意の多角形であり得る。 In the fifth and sixth embodiments described above, Figures 8 and 9 respectively illustrate reinforcing blocks 28e and 28f having a pentagonal and trapezoidal shape in plan view, but the reinforcing block 28 may have any polygonal shape in plan view other than a pentagon or a trapezoid.
基板10に設ける補強ブロックは、第1ないし第9実施形態に示す補強ブロック28の2つ以上の特徴構成が組み合わされて構成されてもよい。例えば、単一のブロックで構成される補強ブロックは、上述した実施形態において示した除去部34a、34b、34c、34d、34e、34f、34h、34iのうちの、任意の2つ以上の除去部が形成された形状であり得る。また、複数の直方体のサブブロックで構成される補強ブロックでは、サブブロックの少なくとも一つが、除去部34a、34b、34c、34d、34e、34f、34h、34iの、いずれか一つ以上の除去部が形成された形状であってもよい。 The reinforcing block provided on the substrate 10 may be configured by combining two or more characteristic configurations of the reinforcing block 28 shown in the first to ninth embodiments. For example, a reinforcing block configured from a single block may have a shape in which any two or more of the removed portions 34a, 34b, 34c, 34d, 34e, 34f, 34h, and 34i shown in the above-mentioned embodiments are formed. Also, in a reinforcing block configured from multiple rectangular parallelepiped sub-blocks, at least one of the sub-blocks may have a shape in which any one or more of the removed portions 34a, 34b, 34c, 34d, 34e, 34f, 34h, and 34i are formed.
なお、本発明は上記の実施形態の構成に限られるものではなく、その要旨を逸脱しない範囲において種々の態様において実施することが可能である。 The present invention is not limited to the configuration of the above embodiment, and can be implemented in various forms without departing from the spirit of the invention.
[13.上記実施形態によりサポートされる構成]
上述した実施形態は、以下の構成をサポートする。
13. Configurations supported by the above embodiments
The above-described embodiment supports the following configurations.
(構成1)基板と、前記基板の一の主面に形成された光導波路と、前記基板の端面であって前記光導波路に光を入力し及び前記光導波路からの光を出力する光入出射面である一の端面に沿うように、前記基板の前記一の主面上に配された補強ブロックと、を備える光導波路素子であって、前記補強ブロックは、複数の直方体のブロックで構成されるか、又は、単一の直方体から当該単一の直方体の少なくとも一の部分を除去した形状を有する単一のブロックで構成される、光導波路素子。
構成1の光導波路素子では、基板上における、補強ブロックを構成する複数の直方体の間の空間、又は、単一の直方体から除去された部分により確保され空間に、電気回路要素、光学要素、又は機械要素などの機能要素を配することができる。このため、構成1の光導波路素子によれば、基板上における機能要素の配置の自由度を向上して、基板サイズを拡大することなく、高機能な光導波路素子を実現することができる。
(Configuration 1) An optical waveguide element comprising: a substrate; an optical waveguide formed on one main surface of the substrate; and a reinforcing block arranged on the one main surface of the substrate so as to be aligned with the one end surface of the substrate, which is an end surface that is a light input/output surface that inputs light to the optical waveguide and outputs light from the optical waveguide, wherein the reinforcing block is composed of a plurality of rectangular parallelepiped blocks, or is composed of a single block having a shape obtained by removing at least a portion of a single rectangular parallelepiped from the single rectangular parallelepiped.
In the optical waveguide element of configuration 1, functional elements such as electrical circuit elements, optical elements, or mechanical elements can be arranged in the spaces on the substrate between the multiple rectangular parallelepipeds that make up the reinforcing block, or in the space secured by removing a portion from a single rectangular parallelepiped. Therefore, the optical waveguide element of configuration 1 improves the degree of freedom in arranging functional elements on the substrate, making it possible to realize a highly functional optical waveguide element without increasing the size of the substrate.
(構成2)前記補強ブロックは、単一の直方体から当該単一の直方体の少なくとも一の部分を除去した形状の単一のブロックであり、前記補強ブロックのうち前記単一の直方体から除去された前記部分である除去部は、前記基板の前記光入出射面を介して光が入出射する前記光導波路の末端の直上を除く位置に形成される、構成1に記載の光導波路素子。
構成2の光導波路素子では、光が入出射する光導波路の末端の直上には補強ブロックが存在するので、補強ブロック及び補強ブロックと基板との間に介在し得る接着層を、上記末端におけるクラッドとして機能させることができる。これにより、構成2の光導波路素子によれば、光が入出射する光導波路の末端部における良好な光閉じ込めを実現して、高機能且つ光損失の少ない光導波路素子を実現することができる。
(Configuration 2) The reinforcing block is a single block having a shape obtained by removing at least a portion of a single rectangular parallelepiped from the single rectangular parallelepiped, and the removed portion, which is the portion of the reinforcing block removed from the single rectangular parallelepiped, is formed at a position other than directly above the end of the optical waveguide where light enters and exits through the light entrance and exit surface of the substrate, an optical waveguide element described in Configuration 1.
In the optical waveguide element of configuration 2, since a reinforcing block is present directly above the end of the optical waveguide where light enters and exits, the reinforcing block and the adhesive layer that may be interposed between the reinforcing block and the substrate can function as a cladding at the end. As a result, the optical waveguide element of configuration 2 can achieve good light confinement at the end of the optical waveguide where light enters and exits, thereby realizing an optical waveguide element with high functionality and low optical loss.
(構成3)前記除去部は、前記補強ブロックの少なくとも一の面に形成された少なくとも一つの切欠き部である、構成2に記載の光導波路素子。
構成3の光導波路素子によれば、補強ブロックにおいて、機能要素を配置する空間を確保するための除去部を、容易に形成することができる。
(Configuration 3) The optical waveguide element according to Configuration 2, wherein the removed portion is at least one notch formed in at least one surface of the reinforcing block.
According to the optical waveguide element of Configuration 3, the removed portion for securing the space for arranging the functional element can be easily formed in the reinforcing block.
(構成4)少なくとも一つの切欠き部である前記除去部は、前記補強ブロックの、前記基板の前記光入出射面に沿った面に対向する面に形成されている、構成3に記載の光導波路素子。
構成4の光導波路素子によれば、補強ブロックにおいて、例えば、光入出射面を構成する基板の一の端面に沿った面には切欠き部を設けることなく、光導波路の末端部の配置の自由度を確保しつつ、基板上における機能要素の配置の自由度を高めることができる。
(Configuration 4) An optical waveguide element according to Configuration 3, wherein the removed portion, which is at least one cutout portion, is formed on a surface of the reinforcing block opposite to a surface of the substrate along the light incident/exit surface.
According to the optical waveguide element of configuration 4, in the reinforcing block, for example, no notch is provided on the surface along one end face of the substrate that constitutes the light incident/exit surface, and thus the degree of freedom in the placement of the terminal end of the optical waveguide can be ensured while increasing the degree of freedom in the placement of functional elements on the substrate.
(構成5)少なくとも一つの切欠き部である前記除去部は、前記補強ブロックの、前記基板の主面と向かい合う面に形成されている、構成3に記載の光導波路素子。
構成5の光導波路素子によれば、補強ブロックと基板との間に、機能要素を配置するための空間を確保することができるので、基板上における機能要素の配置の自由度をより高めることができる。また、構成5の光導波路素子によれば、単一のブロックとして補強ブロックが形成されるので、複数のサブブロックで構成される補強ブロックに比べて、補強ブロックの強度を向上することができる。
(Configuration 5) The optical waveguide element according to Configuration 3, wherein the removed portion, which is at least one cutout portion, is formed on a surface of the reinforcing block facing the main surface of the substrate.
According to the optical waveguide element of configuration 5, a space for arranging functional elements can be secured between the reinforcing block and the substrate, thereby increasing the degree of freedom in arranging functional elements on the substrate. Furthermore, according to the optical waveguide element of configuration 5, the reinforcing block is formed as a single block, which can improve the strength of the reinforcing block compared to a reinforcing block composed of multiple sub-blocks.
(構成6)前記除去部は、前記基板の主面と直交する方向に開口する前記補強ブロックに設けられた貫通穴である、構成2に記載の光導波路素子。
構成6の光導波路素子では、補強ブロックが配される基板上の範囲であって機能要素を配置したい任意の位置に、必要なだけの広さの貫通穴を設けて、機能要素を配置するための空間を確保することができる。従って、構成6の光導波路素子によれば、例えば、補強ブロックと基板との間の接着面積を過度に狭めることがないので、補強ブロックと基板との固定強度を良好に保ちつつ、基板上における機能要素の配置の自由度を高めることができる。
(Configuration 6) The optical waveguide element according to configuration 2, wherein the removed portion is a through hole provided in the reinforcing block and opening in a direction perpendicular to the main surface of the substrate.
In the optical waveguide element of configuration 6, a through hole of a necessary size can be provided at any desired position on the substrate where the reinforcing block is disposed, thereby ensuring space for arranging the functional element. Therefore, with the optical waveguide element of configuration 6, for example, the adhesive area between the reinforcing block and the substrate is not excessively narrowed, and therefore the degree of freedom in arranging the functional element on the substrate can be increased while maintaining a good fixing strength between the reinforcing block and the substrate.
(構成7)前記補強ブロックは、前記基板の前記光入出射面に沿った面に対向する面が凹状の曲面を成す、構成2に記載の光導波路素子。
構成7の光導波路素子によれば、補強ブロックのうち、基板の光入出射面に沿った面に対向する面が、角部を有さない凹状の曲面で構成されるので、補強ブロックが固定される基板上の部分における応力の偏在を抑制して、光導波路素子としてより安定な光学特性及び又は動作特性を実現することができる。
(Configuration 7) The optical waveguide element according to configuration 2, wherein the reinforcing block has a concave curved surface that faces the surface of the substrate that is aligned with the light incident/exit surface.
According to the optical waveguide element of configuration 7, the surface of the reinforcing block that faces the surface along the light input/output surface of the substrate is composed of a concave curved surface without corners, thereby suppressing uneven distribution of stress in the portion of the substrate where the reinforcing block is fixed, thereby achieving more stable optical and/or operating characteristics as an optical waveguide element.
(構成8)前記補強ブロックは、前記基板の主面の法線方向から視た平面視形状が五角形を成す、構成2に記載の光導波路素子。
構成8の光導波路素子によれば、機能要素を配置する空間を確保し得る補強ブロックを、汎用使用されるダイシングソーによる直線加工により、容易に作製することができる。
(Configuration 8) The optical waveguide element according to configuration 2, wherein the reinforcing block has a pentagonal shape in plan view when viewed from the normal direction of the main surface of the substrate.
According to the optical waveguide element of configuration 8, the reinforcing block capable of securing a space for arranging the functional element can be easily fabricated by linear processing using a general-purpose dicing saw.
(構成9)前記補強ブロックは、前記基板の主面の法線方向から視た平面視形状が台形を成す、構成2に記載の光導波路素子。
構成9の光導波路素子によれば、機能要素を配置する空間を確保し得る補強ブロックを、汎用使用されるダイシングソーによる直線加工により、容易に作製することができる。
(Configuration 9) The optical waveguide element according to configuration 2, wherein the reinforcing block has a trapezoidal shape in a plan view when viewed from the normal direction of the main surface of the substrate.
According to the optical waveguide element of Configuration 9, the reinforcing block capable of securing a space for arranging the functional element can be easily fabricated by linear processing using a general-purpose dicing saw.
(構成10)前記光導波路は、前記基板の前記光入出射面を介して入力された入力光を伝搬する光入力導波路、及び前記基板の前記光入出射面を介して出力する出力光を前記光入出射面に向かって伝搬する光出力導波路を含み、前記光入力導波路及び前記光出力導波路は、前記光導波路の末端に向かって前記光導波路の断面サイズが変化するスポットサイズ変換部を含み、前記除去部は、前記スポットサイズ変換部の直上を除く位置に形成される、構成2に記載の光導波路素子。
構成10の光導波路素子では、スポットサイズ変換部の直上には、接着層及び補強ブロックが存在するので、補強ブロック及び接着層をスポットサイズ変換部におけるクラッドとして機能させることができる。これにより、構成10の光導波路素子によれば、スポットサイズ変換部における良好な光閉じ込めを実現して、高機能且つ光損失の少ない光導波路素子を実現することができる。
(Configuration 10) The optical waveguide element according to Configuration 2, wherein the optical waveguide includes an optical input waveguide that propagates input light input through the optical incident/exit surface of the substrate, and an optical output waveguide that propagates output light output through the optical incident/exit surface of the substrate toward the optical incident/exit surface, the optical input waveguide and the optical output waveguide each include a spot size conversion section in which the cross-sectional size of the optical waveguide changes toward an end of the optical waveguide, and the removal section is formed at a position other than directly above the spot size conversion section.
In the optical waveguide element of configuration 10, the adhesive layer and the reinforcing block are present directly above the spot size conversion portion, and the reinforcing block and the adhesive layer can function as cladding in the spot size conversion portion. As a result, the optical waveguide element of configuration 10 achieves good light confinement in the spot size conversion portion, making it possible to realize an optical waveguide element with high functionality and low optical loss.
(構成11)前記補強ブロックと前記基板の一の主面との間に接着層を有する、構成1ないし10のいずれかに記載の光導波路素子。
構成11の光導波路素子によれば、補強ブロック及び補強ブロックと基板との間の接着層を、補強ブロックの下部であって基板の主面上に形成された光導波路のクラッドとして機能させることができる。これにより、構成11の光導波路素子によれば、光導波路における良好な光閉じ込めを実現することができる。
(Configuration 11) The optical waveguide element according to any one of configurations 1 to 10, further comprising an adhesive layer between the reinforcing block and one main surface of the substrate.
In the optical waveguide element of Configuration 11, the reinforcing block and the adhesive layer between the reinforcing block and the substrate can function as a cladding for the optical waveguide formed on the main surface of the substrate below the reinforcing block, thereby achieving good light confinement in the optical waveguide.
(構成12)前記補強ブロックは、前記光導波路の屈折率よりも低い屈折率を有する、構成1ないし11のいずれかに記載の光導波路素子。
構成12の光導波路素子によれば、補強ブロックを、光導波路素子のクラッドとして有効に機能させることができる。
(Configuration 12) The optical waveguide element according to any one of configurations 1 to 11, wherein the reinforcing block has a refractive index lower than the refractive index of the optical waveguide.
According to the optical waveguide element of Configuration 12, the reinforcing block can be made to function effectively as a cladding for the optical waveguide element.
(構成13)複数の直方体のブロックで構成される前記補強ブロックが配された前記基板のうち、前記複数の直方体のブロックの間の空間、又は、単一の直方体から当該単一の直方体の少なくとも一の部分を除去した形状の単一のブロックで構成される前記補強ブロックが配された前記基板のうち、前記単一の直方体から除去された前記部分である除去部の空間に、電気回路要素、光学要素、又は機械要素が配置されている、構成1ないし12のいずれかに記載の光導波路素子。
構成13の光導波路素子では、補強ブロックが基板上に構成する、複数の直方体ブロック間の空間、又は単一ブロックの除去部の空間が、電気回路要素、光学要素、又は機械要素の配置空間として利用される。このため、構成13の光導波路素子によれば、基板サイズを拡大することなく、高機能な光導波路素子を実現することができる。
(Configuration 13) An optical waveguide element described in any one of configurations 1 to 12, wherein an electrical circuit element, an optical element, or a mechanical element is arranged in the space between the plurality of rectangular blocks on the substrate on which the reinforcing block is arranged, or in the space of the removed portion, which is the portion removed from the single rectangular block on the substrate on which the reinforcing block is arranged and which is composed of a single block having a shape obtained by removing at least a portion of the single rectangular block.
In the optical waveguide element of configuration 13, the spaces between the rectangular parallelepiped blocks formed on the substrate by the reinforcing blocks or the spaces in the removed portions of a single block are utilized as arrangement spaces for electrical circuit elements, optical elements, or mechanical elements. Therefore, the optical waveguide element of configuration 13 can realize a high-performance optical waveguide element without increasing the size of the substrate.
(構成14)前記補強ブロックの前記光入出射面に沿った面には、光学部品が固定される、構成1ないし13のいずれかに記載の光導波路素子。
構成14の光導波路素子によれば、補強ブロックを、光学部品を固定するための構造物として利用して、光導波路素子と光学部品とを含むサブアセンブリを容易に作製することができる。
(Configuration 14) The optical waveguide element according to any one of configurations 1 to 13, wherein an optical component is fixed to a surface of the reinforcing block along the light incident/exit surface.
According to the optical waveguide element of configuration 14, the reinforcing block can be used as a structure for fixing the optical component, and a subassembly including the optical waveguide element and the optical component can be easily produced.
(構成15)構成1ないし14のいずれかに記載の光導波路素子と、前記光導波路素子を収容する筐体と、前記光導波路素子に光を入射する入力光ファイバと、前記光導波路素子が出射する出力光を前記筐体の外へ導く出力光ファイバと、を備える光導波路デバイス。
構成15の光導波路デバイスによれば、基板サイズを拡大することなく又はよりサイズの小さな基板をもちいて実現される高機能な光導波路素子を用いるので、筐体のサイズを拡大することなく又はより小さな筐体を用いて、高機能な又は高性能の光導波路デバイスを実現することができる。
(Configuration 15) An optical waveguide device comprising: an optical waveguide element according to any one of configurations 1 to 14; a housing that houses the optical waveguide element; an input optical fiber that inputs light to the optical waveguide element; and an output optical fiber that guides output light emitted by the optical waveguide element to the outside of the housing.
According to the optical waveguide device of configuration 15, a high-performance optical waveguide element is used that can be realized without increasing the size of the substrate or by using a smaller size substrate, so that a high-performance or high-performance optical waveguide device can be realized without increasing the size of the housing or by using a smaller housing.
(構成16)前記光導波路素子は、前記光導波路を伝搬する光波を制御する電極を前記基板上に備え、前記筐体の内部に、前記光導波路素子を駆動する駆動回路を備える、構成15に記載の光導波路デバイス。
構成16の光導波路デバイスによれば、光導波路素子を収容する筐体内に駆動回路を備えて、より高機能な光導波路デバイスを実現することができる。
(Configuration 16) The optical waveguide device described in Configuration 15, wherein the optical waveguide element has electrodes on the substrate that control light waves propagating through the optical waveguide, and the housing has a drive circuit inside that drives the optical waveguide element.
According to the optical waveguide device of Configuration 16, a driving circuit is provided in the housing that houses the optical waveguide element, and an optical waveguide device with higher functionality can be realized.
(構成17)構成15又は16に記載の光導波路デバイスと、前記光導波路素子に動作を行わせるための電気信号を生成する電子回路と、を備える光送信装置。
構成17の光送信装置によれば、筐体サイズを拡大することなく又はより小さな筐体を用いた高機能な又は高性能の光導波路デバイスにより、高機能又は高性能の光送信装置を実現し得る。
(Configuration 17) An optical transmitter comprising: the optical waveguide device according to configuration 15 or 16; and an electronic circuit that generates an electrical signal for causing the optical waveguide element to operate.
According to the optical transmitter of configuration 17, a highly functional or high performance optical transmitter can be realized by using a highly functional or high performance optical waveguide device without increasing the housing size or using a smaller housing.
1、1a、1b、1c、1d、1e、1f、1g、1h、1i、62…光導波路素子、10…基板、12…主面、14…光導波路、16…電極、18a、18b、18c、18d…端面、20…支持板、22…光入出射面、24…光入出力導波路、24a…光入力導波路、24b、24c…光出力導波路、26、26a、26b、26c…スポットサイズ変換部、28、28a、28b、28c、28d、28e、28f、28g、28h、28i…補強ブロック、28g1、28g2…サブブロック、30…接着層、32…レンズアレイ、34、34a、34b、34c、34d、34e、34f、34g、34h、34i、34i1、34i2…除去部、36a、36b、36c、36d…面、38a、38b…受光素子、40…電極パッド、42a、42b、44a、44b…並行導波路、60…光導波路デバイス、64…筐体、66…入力光ファイバ、68…出力光ファイバ、70、72…サポート、74、78…レンズ、76…光学ユニット、80…ピン、82…中継基板、84…駆動回路、90…光送信装置、92…光源、94…変調信号生成部。 1, 1a, 1b, 1c, 1d, 1e, 1f, 1g, 1h, 1i, 62...optical waveguide element, 10...substrate, 12...main surface, 14...optical waveguide, 16...electrode, 18a, 18b, 18c, 18d...end surface, 20...support plate, 22...light incident/exit surface, 24...optical input/output waveguide, 24a...optical input waveguide, 24b, 24c...optical output waveguide, 26, 26a, 26b, 26c...spot size conversion section, 28, 28a, 28b, 28c, 28d, 28e, 28f, 28g, 28h, 28i...reinforcement block, 28g1, 28g2...sub-block, 30...adhesive layer, 32...lens array, 34, 34a, 34b, 34c, 34d, 34e, 34f, 34g, 34h, 34i, 34i1, 34i2...removal section, 36a, 36b, 36c, 36d...surface, 38a, 38b...light receiving element, 40...electrode pad, 42a, 42b, 44a, 44b...parallel waveguide, 60...optical waveguide device, 64...housing, 66...input optical fiber, 68...output optical fiber, 70, 72...support, 74, 78...lens, 76...optical unit, 80...pin, 82...relay board, 84...drive circuit, 90...optical transmitter, 92...light source, 94...modulation signal generator.
Claims (17)
前記基板の一の主面に形成された光導波路と、
前記基板の端面であって前記光導波路に光を入力し及び前記光導波路からの光を出力する光入出射面である一の端面に沿うように、前記基板の前記一の主面上に配された補強ブロックと、
を備える光導波路素子であって、
前記補強ブロックは、複数の直方体のブロックで構成されるか、又は、単一の直方体から当該単一の直方体の少なくとも一の部分を除去した形状を有する単一のブロックで構成される、
光導波路素子。 A substrate;
an optical waveguide formed on one main surface of the substrate;
a reinforcing block disposed on the one main surface of the substrate so as to be aligned with one end surface of the substrate, the end surface being a light input/output surface through which light is input to the optical waveguide and through which light is output from the optical waveguide;
An optical waveguide element comprising:
The reinforcing block is composed of a plurality of rectangular parallelepiped blocks, or is composed of a single block having a shape obtained by removing at least a portion of a single rectangular parallelepiped from the single rectangular parallelepiped.
Optical waveguide element.
前記補強ブロックのうち前記単一の直方体から除去された前記部分である除去部は、前記基板の前記光入出射面を介して光が入出射する前記光導波路の末端の直上を除く位置に形成される、
請求項1に記載の光導波路素子。 the reinforcing block is a single block having a shape obtained by removing at least a portion of a single rectangular parallelepiped from the single rectangular parallelepiped,
a removed portion, which is the portion of the reinforcing block removed from the single rectangular parallelepiped, is formed at a position other than directly above an end of the optical waveguide where light enters and exits through the light incident and exit surface of the substrate.
The optical waveguide element according to claim 1 .
請求項2に記載の光導波路素子。 The removed portion is at least one notch formed on at least one surface of the reinforcing block.
The optical waveguide element according to claim 2 .
請求項3に記載の光導波路素子。 the removal portion being at least one notch portion is formed on a surface of the reinforcing block facing a surface along the light incident/exit surface of the substrate;
The optical waveguide element according to claim 3 .
請求項3に記載の光導波路素子。 the removal portion being at least one notch portion is formed on a surface of the reinforcing block facing a main surface of the substrate;
The optical waveguide element according to claim 3 .
請求項2に記載の光導波路素子。 the removed portion is a through hole provided in the reinforcing block and opening in a direction perpendicular to the main surface of the substrate.
The optical waveguide element according to claim 2 .
請求項2に記載の光導波路素子。 the reinforcing block has a concave curved surface facing a surface of the substrate aligned with the light incident/exit surface;
The optical waveguide element according to claim 2 .
請求項2に記載の光導波路素子。 the reinforcing block has a pentagonal shape in a plan view when viewed from a normal direction of the main surface of the substrate;
The optical waveguide element according to claim 2 .
請求項2に記載の光導波路素子。 The reinforcing block has a trapezoidal shape in a plan view when viewed from a normal direction of the main surface of the substrate.
The optical waveguide element according to claim 2 .
前記光入力導波路及び前記光出力導波路は、前記光導波路の末端に向かって前記光導波路の断面サイズが変化するスポットサイズ変換部を含み、
前記除去部は、前記スポットサイズ変換部の直上を除く位置に形成される、
請求項2に記載の光導波路素子。 the optical waveguide includes an optical input waveguide that propagates input light input through the light incident/exit surface of the substrate, and an optical output waveguide that propagates output light output through the light incident/exit surface of the substrate toward the light incident/exit surface,
the optical input waveguide and the optical output waveguide each include a spot size conversion section in which a cross-sectional size of the optical waveguide changes toward an end of the optical waveguide;
the removal portion is formed at a position other than directly above the spot size conversion portion.
The optical waveguide element according to claim 2 .
請求項1ないし10のいずれか一項に記載の光導波路素子。 an adhesive layer between the reinforcing block and one main surface of the substrate;
The optical waveguide element according to claim 1 .
請求項1ないし11のいずれか一項に記載の光導波路素子。 the reinforcing block has a refractive index lower than that of the optical waveguide;
The optical waveguide element according to claim 1 .
請求項1ないし12のいずれか一項に記載の光導波路素子。 In the substrate on which the reinforcing blocks made up of a plurality of rectangular parallelepiped blocks are arranged, an electric circuit element, an optical element, or a mechanical element is arranged in a space between the plurality of rectangular parallelepiped blocks, or in a space in a removed portion which is the portion removed from the single rectangular parallelepiped in the substrate on which the reinforcing blocks made up of a single block having a shape obtained by removing at least a portion of the single rectangular parallelepiped are arranged.
The optical waveguide element according to claim 1 .
請求項1ないし13のいずれか一項に記載の光導波路素子。 an optical component is fixed to a surface of the reinforcing block along the light incident/exit surface;
The optical waveguide element according to claim 1 .
前記光導波路素子を収容する筐体と、
前記光導波路素子に光を入射する入力光ファイバと、
前記光導波路素子が出射する出力光を前記筐体の外へ導く出力光ファイバと、
を備える光導波路デバイス。 The optical waveguide element according to any one of claims 1 to 14;
a housing that houses the optical waveguide element;
an input optical fiber for inputting light into the optical waveguide element;
an output optical fiber that guides output light emitted by the optical waveguide element to the outside of the housing;
An optical waveguide device comprising:
前記筐体の内部に、前記光導波路素子を駆動する駆動回路を備える、
請求項15に記載の光導波路デバイス。 the optical waveguide element includes an electrode on the substrate that controls a light wave propagating through the optical waveguide;
a drive circuit for driving the optical waveguide element is provided inside the housing;
16. The optical waveguide device according to claim 15.
前記光導波路素子に動作を行わせるための電気信号を生成する電子回路と、
を備える光送信装置。 The optical waveguide device according to claim 15 or 16;
an electronic circuit for generating an electrical signal for causing the optical waveguide element to operate;
An optical transmitting device comprising:
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11258455A (en) * | 1998-03-11 | 1999-09-24 | Nippon Telegr & Teleph Corp <Ntt> | Optical waveguide component and optical waveguide module using the same |
| WO2002075387A2 (en) * | 2001-03-16 | 2002-09-26 | Bookham Technology Plc | A tapered optical waveguide |
| JP2009031780A (en) * | 2007-06-26 | 2009-02-12 | Panasonic Electric Works Co Ltd | Optical module |
| JP2021162643A (en) * | 2020-03-31 | 2021-10-11 | 住友大阪セメント株式会社 | Optical waveguide element and optical modulation device including the same, and optical transmission device |
| WO2022210853A1 (en) * | 2021-03-30 | 2022-10-06 | 住友大阪セメント株式会社 | Optical waveguide element, and optical modulation device and optical transmission device which use same |
-
2024
- 2024-02-02 WO PCT/JP2024/003502 patent/WO2025163891A1/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11258455A (en) * | 1998-03-11 | 1999-09-24 | Nippon Telegr & Teleph Corp <Ntt> | Optical waveguide component and optical waveguide module using the same |
| WO2002075387A2 (en) * | 2001-03-16 | 2002-09-26 | Bookham Technology Plc | A tapered optical waveguide |
| JP2009031780A (en) * | 2007-06-26 | 2009-02-12 | Panasonic Electric Works Co Ltd | Optical module |
| JP2021162643A (en) * | 2020-03-31 | 2021-10-11 | 住友大阪セメント株式会社 | Optical waveguide element and optical modulation device including the same, and optical transmission device |
| WO2022210853A1 (en) * | 2021-03-30 | 2022-10-06 | 住友大阪セメント株式会社 | Optical waveguide element, and optical modulation device and optical transmission device which use same |
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