WO2011148960A1 - Dispositif d'imagerie radiologique et son procédé d'assemblage - Google Patents

Dispositif d'imagerie radiologique et son procédé d'assemblage Download PDF

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Publication number
WO2011148960A1
WO2011148960A1 PCT/JP2011/061930 JP2011061930W WO2011148960A1 WO 2011148960 A1 WO2011148960 A1 WO 2011148960A1 JP 2011061930 W JP2011061930 W JP 2011061930W WO 2011148960 A1 WO2011148960 A1 WO 2011148960A1
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WO
WIPO (PCT)
Prior art keywords
radiation
conversion panel
radiation conversion
base
radiographic imaging
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2011/061930
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English (en)
Japanese (ja)
Inventor
大田恭義
西納直行
中津川晴康
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Fujifilm Corp
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Fujifilm Corp
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Filing date
Publication date
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Publication of WO2011148960A1 publication Critical patent/WO2011148960A1/fr
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Ceased legal-status Critical Current

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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B42/00—Obtaining records using waves other than optical waves; Visualisation of such records by using optical means
    • G03B42/02—Obtaining records using waves other than optical waves; Visualisation of such records by using optical means using X-rays
    • G03B42/025—Positioning or masking the X-ray film cartridge in the radiographic apparatus
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B6/00—Apparatus or devices for radiation diagnosis; Apparatus or devices for radiation diagnosis combined with radiation therapy equipment
    • A61B6/42—Arrangements for detecting radiation specially adapted for radiation diagnosis
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B6/00—Apparatus or devices for radiation diagnosis; Apparatus or devices for radiation diagnosis combined with radiation therapy equipment
    • A61B6/42—Arrangements for detecting radiation specially adapted for radiation diagnosis
    • A61B6/4283—Arrangements for detecting radiation specially adapted for radiation diagnosis characterised by a detector unit being housed in a cassette
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B42/00—Obtaining records using waves other than optical waves; Visualisation of such records by using optical means
    • G03B42/02—Obtaining records using waves other than optical waves; Visualisation of such records by using optical means using X-rays
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B42/00—Obtaining records using waves other than optical waves; Visualisation of such records by using optical means
    • G03B42/02—Obtaining records using waves other than optical waves; Visualisation of such records by using optical means using X-rays
    • G03B42/04—Holders for X-ray films

Definitions

  • the present invention provides a radiation conversion panel for laminating a scintillator and a photoelectric conversion layer to convert radiation into a radiation image, a base on which the radiation conversion panel is placed and supported, and the radiation placed on the base
  • the present invention relates to a radiographic imaging apparatus having a lid that covers a conversion panel, a housing that houses the radiation conversion panel, the base, and the lid, and an assembling method thereof.
  • a radiation image capturing system that irradiates a subject with radiation and guides the radiation transmitted through the subject to a radiation conversion panel to capture a radiation image is widely used.
  • the radiation conversion panel a conventional radiation film in which the radiation image is exposed and recorded, or radiation energy as the radiation image is accumulated in a phosphor and irradiated with excitation light, thereby stimulating the radiation image.
  • a storage phosphor panel that can be extracted as light is known.
  • a direct conversion type radiation conversion panel using a solid-state detection element that directly converts radiation into an electrical signal, or the radiation to fluorescence in order to immediately read out and display the radiation image from the radiation conversion panel after imaging.
  • An indirect conversion type radiation conversion panel using a scintillator that converts once and a solid state detection element that converts the fluorescence into an electric signal has been developed. Then, the direct conversion type or indirect conversion type radiation conversion panel and a circuit board on which electronic components that perform predetermined processing on the radiation image output from the radiation conversion panel are housed in a housing.
  • a radiographic imaging device so-called electronic cassette is configured.
  • Japanese Patent Application Laid-Open No. 2007-101256 discloses an example in which a TFT (thin film transistor) manufactured by a room temperature process is applied as an output signal layer for outputting a radiographic image as an electrical signal.
  • the radiation conversion panel can be reduced in weight and thickness by forming an amorphous oxide semiconductor film on a resin substrate.
  • a detection element configured in a layer form may be referred to as a “photoelectric conversion layer”.
  • fluorescence Variations in the reflectance and refractive index of (scintillation light) occur locally, and the sensitivity characteristic distribution in the detection surface becomes non-uniform. Due to such non-uniform sensitivity, there is a problem that the quality of the radiation image is degraded. Therefore, various techniques for improving the adhesion between the scintillator and the photoelectric conversion layer are disclosed.
  • Japanese Patent Application Laid-Open No. 9-54162 discloses an apparatus configured to fix a scintillator and a photoelectric conversion layer with an adhesive after providing a spacer and separating them by a predetermined interval.
  • Japanese Patent Application Laid-Open No. 9-257944 discloses a device capable of forming a sealed space with solid detection means, sealing means and cover means, and exhausting the inside of the sealed space using exhaust means.
  • a resin material has a higher thermal expansion coefficient than glass and is likely to generate thermal expansion.
  • heat is stored in a state in which materials having different coefficients of thermal expansion are bonded together, there is a problem that peeling or cracking of the material occurs due to thermal stress generated at these interfaces, resulting in a decrease in adhesion.
  • An object of the present invention is to improve the adhesion of the scintillator and the photoelectric conversion layer with a simple configuration and to prevent the adhesion of the radiation conversion panel and the base due to thermal deformation.
  • the present invention provides a radiation conversion panel for laminating a scintillator and a photoelectric conversion layer to convert radiation into a radiation image, a base for placing and supporting the radiation conversion panel, and the radiation placed on the base
  • the present invention relates to a radiographic imaging apparatus having a lid that covers a conversion panel, a housing that houses the radiation conversion panel, the base, and the lid, and an assembling method thereof.
  • the said radiation conversion panel in order to achieve said objective, in the state which deform
  • the radiation conversion panel is deformed in a concave shape with respect to the placement direction and supported by the base, and the radiation conversion panel deformed in the concave shape is covered with the lid portion, thereby Tension can be generated in the extending direction of the radiation conversion panel without floating the radiation conversion panel from the base.
  • stress acts on the front surface side and the back surface side of the radiation conversion panel, and the adhesion of the scintillator and the photoelectric conversion layer contained in the radiation conversion panel can be enhanced with a simple configuration.
  • the influence of the bending stress generated inside the radiation conversion panel is small. That is, it is possible to prevent a decrease in the adhesion of the radiation conversion panel, the base, and the lid due to thermal deformation.
  • the lid portion is a part of the top plate or a lid member that makes surface contact with the top plate.
  • the radiation conversion panel By configuring a part of the top plate (inward of the top plate) in contact with the subject as the lid, the radiation conversion panel can be reliably covered, and the subject side of the top plate is on the subject side. Can be maintained flat, so that the subject does not feel uncomfortable. On the other hand, even when the lid member is brought into surface contact with the top plate, the top plate can be kept flat, so that the radiation conversion panel can be reliably covered without giving the subject a sense of incongruity. it can. If the lid member is fixed to the top plate or pulled, the radiation conversion panel can be covered with the lid member positioned at a predetermined position in the housing.
  • the base supports the radiation conversion panel by bending it, and the radiation conversion panel side of the lid portion is curved corresponding to the radiation conversion panel.
  • the profile of the detected dose of radiation becomes continuous (smooth), and the occurrence of sharp unevenness in the radiation image can be prevented.
  • the base supports the radiation conversion panel while being deformed in line symmetry with respect to a predetermined axis on a detection surface formed by the radiation conversion panel.
  • the predetermined axis is a center line of the detection surface.
  • the vertical component of the stress applied to the radiation conversion panel increases with the displacement of the radiation conversion panel in the mounting direction, thereby further improving the adhesion between the scintillator and the photoelectric conversion layer.
  • the base is made of a resin material. Therefore, the radiation image capturing apparatus can be reduced in weight and thickness.
  • the base is preferably made of an electromagnetic shielding material.
  • the electromagnetic wave shielding effect can be exhibited, and it is possible to avoid malfunction of internal electronic components including the radiation conversion panel and external electronic devices.
  • an image correction unit that corrects the radiation image according to the degree of deformation of the radiation conversion panel. Therefore, it is possible to correct the radiation dose reaching the detection surface of the radiation conversion panel, and the in-plane uniformity in the radiation image is improved.
  • the image correction unit corrects the radiation image by estimating a degree of deformation of the radiation conversion panel based on shapes of the base and the lid. Thereby, the radiation image can be accurately corrected from the shapes of the base and the lid without actually measuring the degree of deformation of the radiation conversion panel.
  • FIG. 5 is a sectional view taken along line VV of the electronic cassette shown in FIG. 2.
  • FIG. 3 is a cross-sectional view taken along line VI-VI of the electronic cassette shown in FIG. 2.
  • 7A and 7B are schematic explanatory views showing a state in which the radiation conversion panel of FIGS. 5 and 6 is placed on a base and covered with a lid member.
  • FIG. 8A and 8B are schematic explanatory views showing the shapes of the base and the lid member in the electronic cassette according to the first modification.
  • 9A and 9B are schematic explanatory views showing the shapes of the base and the lid member in the electronic cassette according to the second modification.
  • 10A and 10B are schematic explanatory views showing the shapes of the base and the lid member in the electronic cassette according to the third modification.
  • 11A and 11B are partially enlarged cross-sectional views of the electronic cassette according to the fourth modification, taken along line XI-XI in FIG. It is a block diagram of the radiographic imaging system to which the electronic cassette concerning 2nd Embodiment is applied. It is a perspective view of the electronic cassette shown in FIG.
  • FIG. 14 is a cross-sectional view of the electronic cassette shown in FIG.
  • FIG. 16A and 16B are schematic explanatory diagrams illustrating the shape of a base in an electronic cassette according to a fifth modification.
  • FIG. 14 is a partially enlarged cross-sectional view taken along line XVII-XVII in FIG. 13 of an electronic cassette according to a sixth modification.
  • FIG. 18A is a schematic explanatory diagram schematically illustrating the internal configuration of an electronic cassette according to a seventh modification
  • FIG. 18B is a schematic explanatory diagram schematically illustrating an example of the scintillator of FIG. 18A.
  • FIG. 19A is a schematic explanatory view schematically showing the irradiation of radiation to the radiation conversion panel of the electronic cassette according to the seventh modification
  • FIG. 19B is a schematic view of irradiation of radiation to the radiation conversion panel of the conventional electronic cassette. It is a schematic explanatory drawing shown in FIG.
  • a radiographic imaging system 10A includes a radiation source 18 that irradiates a patient, who is a subject 14 lying on an imaging platform 12 such as a bed, with radiation 16 having a dose according to imaging conditions; An electronic cassette 20A (radiation imaging apparatus) that detects radiation 16 transmitted through the subject 14 and converts it into a radiation image, a console 22 that controls the radiation source 18 and the electronic cassette 20A, and a display device 24 that displays the radiation image Is provided.
  • a radiation source 18 that irradiates a patient, who is a subject 14 lying on an imaging platform 12 such as a bed, with radiation 16 having a dose according to imaging conditions
  • An electronic cassette 20A radiation imaging apparatus
  • console 22 controls the radiation source 18 and the electronic cassette 20A
  • a display device 24 that displays the radiation image Is provided.
  • the radiation source 18, the electronic cassette 20A, and the display device 24 for example, UWB (Ultra Wide Band), IEEE 802.11.
  • UWB Ultra Wide Band
  • IEEE 802.11 Signals are transmitted and received by wireless LAN using a / g / n or wireless communication using millimeter waves or the like. Note that signals may be transmitted and received by wired communication using a cable.
  • RIS 26 Radiology Information System
  • HIS28 medical information system
  • the electronic cassette 20 ⁇ / b> A is a portable electronic cassette that includes a panel housing unit 30 disposed between the photographing table 12 and the subject 14.
  • the right side surface of the panel housing unit 30 is a protruding portion that bulges upward, and this protruding portion functions as the control unit 32.
  • the panel housing unit 30 has a substantially rectangular casing 40 made of a material that can transmit the radiation 16, and the upper surface of the casing 40 on which the subject 14 lies is irradiated with the radiation 16.
  • the imaging surface 42 irradiation surface.
  • a guide line 44 serving as an index of the shooting position of the subject 14 is formed at a substantially central portion of the shooting surface 42.
  • the guide line 44 indicating the outer frame becomes the imaging region 46 indicating the region where the radiation 16 can be irradiated.
  • the center position of the guide line 44 (intersection of two guide lines 44 intersecting in a cross shape) is the center position of the imaging region 46.
  • USB Universal Serial Bus
  • a terminal 52 and a card slot 54 for loading a memory card such as a PC card are arranged.
  • the radiation conversion panel 70 indirectly converts the radiation 16 that has passed through the subject 14 into fluorescence (scintillation light) such as a visible light region or an ultraviolet light region using a scintillator, and converts the converted fluorescence into an electrical signal using a photoelectric conversion element.
  • fluorescence sintillation light
  • a photoelectric conversion element solid-state detection element
  • the ultraviolet region is converted into an electrical signal so that fluorescence (ultraviolet light) emitted by the scintillator can be converted into an electric signal.
  • a solid-state detection element made of a material such as an amorphous oxide semiconductor (for example, IGZO (InGaZnOx)), an organic photoelectric conversion material (OPC) that converts fluorescence in the visible region (visible light) emitted by the scintillator into an electric signal, etc.
  • an amorphous oxide semiconductor for example, IGZO (InGaZnOx)
  • OPC organic photoelectric conversion material
  • a communication unit 58 or the like capable of wirelessly transmitting and receiving signals between a power source unit 56 such as a battery and the console 22 is disposed (see FIG. 4).
  • FIG. 3 is a diagram schematically showing the arrangement of the pixels 72 in the radiation conversion panel 70 and the electrical connection between the pixels 72 and the cassette control unit 80.
  • the radiation conversion panel 70 a large number of pixels 72 are arranged on a substrate (not shown), and a plurality of gate lines 76 for supplying a control signal from the drive circuit unit 74 to the pixels 72 and a plurality of pixels 72.
  • a plurality of signal lines 78 for reading out the output electric signals and outputting them to the drive circuit unit 74 are arranged.
  • the pixel 72 has a photoelectric conversion element.
  • the cassette control unit 80 of the control unit 34 controls the drive circuit unit 74 by supplying a control signal to the drive circuit unit 74.
  • FIG. 4 is a diagram showing a circuit configuration of the electronic cassette 20A.
  • the radiation conversion panel 70 has a structure in which a photoelectric conversion layer in which each pixel 72 having a photoelectric conversion element made of a substance such as IGZO or OPC that converts fluorescence into an electric signal is formed is arranged on an array of matrix-like TFTs 82.
  • a bias voltage is supplied from the bias circuit 84 that constitutes the drive circuit unit 74
  • charges generated by converting the fluorescence into an electric signal (analog signal) are accumulated, and the TFT 82 is installed for each column. The charges can be read out as an image signal by sequentially turning them on.
  • a gate line 76 extending in parallel with the column direction and a signal line 78 extending in parallel with the row direction are connected to the TFT 82 connected to each pixel 72.
  • Each gate line 76 is connected to a gate drive circuit 86, and each signal line 78 is connected to a multiplexer 92 constituting the drive circuit unit 74.
  • a control signal for controlling on / off of the TFTs 82 arranged in the column direction is supplied from the gate drive circuit 86 to the gate line 76.
  • the gate drive circuit 86 is supplied with an address signal from the cassette control unit 80, and the gate drive circuit 86 performs on / off control of the TFT 82 in accordance with the address signal.
  • a multiplexer 92 is connected to the amplifier 88 via a sample and hold circuit 90.
  • the multiplexer 92 includes an FET switch 94 that switches a signal line 78 that outputs a signal, and a multiplexer driving circuit 96 that turns on one FET switch 94 and outputs a selection signal.
  • the multiplexer drive circuit 96 is supplied with an address signal from the cassette control unit 80, and turns on one FET switch 94 in accordance with the address signal.
  • An A / D converter 98 is connected to the FET switch 94, and a radiation image converted into a digital signal by the A / D converter 98 is transferred to the cassette control unit 80 via a flexible substrate 138 (see FIG. 5) described later. Supplied.
  • the flexible substrate 138 electrically connects the cassette control unit 80 and the drive circuit unit 74.
  • the TFT 82 functioning as a switching element may be realized in combination with another imaging element such as a CMOS (Complementary Metal-Oxide Semiconductor) image sensor. Furthermore, it can be replaced with a CCD (Charge-Coupled Device) image sensor that transfers charges while shifting them with a shift pulse corresponding to a gate signal referred to as a TFT.
  • CMOS Complementary Metal-Oxide Semiconductor
  • CCD Charge-Coupled Device
  • the cassette control unit 80 is detected by the address signal generation unit 100 that generates an address signal to be supplied to the gate drive circuit 86 and the multiplexer drive circuit 96, the image memory 102 that stores the radiation image, and the radiation conversion panel 70.
  • An image correction unit 104 that corrects a radiation image and a correction data storage unit 106 that stores correction data corresponding to the degree of deformation of the radiation conversion panel 70 are provided.
  • the radiographic image stored in the image memory 102 is transmitted to the console 22 and the like by the communication unit 58.
  • the power supply unit 56 supplies power to the drive circuit unit 74 and also supplies power to the cassette control unit 80 and the communication unit 58.
  • each component in the housing 40 is illustrated with a partly exaggerated size and the like, and the configuration of the radiation conversion panel 70 is schematically illustrated. Are shown.
  • FIG. 5 is a sectional view taken along line VV (line parallel to the arrow X direction) of the electronic cassette 20A of FIG. 6 is a cross-sectional view taken along line VI-VI (line parallel to the arrow Y direction) of the electronic cassette 20A of FIG.
  • the radiation conversion panel 70 shown in FIG. 5 includes a substrate 122 mounted on a base 120, a radiation conversion layer 124 that is provided on the substrate 122 and converts the radiation 16 into an electrical signal of a radiation image, and a substrate 122.
  • the radiation converting layer 124 is provided with a protective film 126 for covering the side surface and the upper surface of the radiation converting layer 124 to protect the radiation converting layer 124 from moisture and the like.
  • the upper surface 152 of the base 120 has a concave (convex downward) curved shape with the lowest center position along the arrow X direction and the highest both ends. Yes.
  • the base 120 may be made of various materials such as glass, resin, Mg-containing metal, and carbon.
  • the substrate 122 is a substantially rectangular substrate having flexibility, and is made of a plastic resin in order to reduce the weight of the entire electronic cassette 20A.
  • the radiation conversion layer 124 has substantially the same area as the imaging region 46 in plan view, the signal output layer 128 formed on the substrate 122, the photoelectric conversion layer 130 stacked on the signal output layer 128, and the photoelectric conversion layer. And a scintillator 132 bonded to 130.
  • the scintillator 132 is made of columnar crystal CsI or the like substantially perpendicular to the substrate 122, and converts the radiation 16 into fluorescence (visible light in the case of the scintillator 132 made of CsI).
  • an adhesive may be used as a means for preventing dust from entering between the photoelectric conversion layer 130 and the scintillator 132 and further preventing displacement. This is because if the photoelectric conversion layer 130 on the substrate 122 side and the scintillator 132 are bonded together, the adhesion between them is improved. According to this embodiment, as will be described later, sufficient adhesion between the two can be ensured without using an adhesive.
  • the photoelectric conversion layer 130 converts fluorescence into an electric signal by the pixel 72 made of a substance such as an amorphous oxide semiconductor (for example, IGZO) or OPC (organic photoelectric conversion material).
  • the signal output layer 128 is constituted by an array of TFTs formed on the substrate 122 using an amorphous oxide semiconductor (for example, IGZO) by a room temperature process, and reads the electrical signal from the photoelectric conversion layer 130 and outputs it.
  • the radiation conversion panel 70 thus configured is normally flat and has a substantially uniform thickness in the plane.
  • the radiation conversion panel 70 housed in the housing 40 is placed in the placement direction of the radiation conversion panel 70 (arrow Z1 direction; hereinafter, simply referred to as the placement direction) according to the shape of the base 120. On the other hand, it is deformed into a concave shape (see FIG. 5).
  • a lid member 200 (lid portion) that covers the radiation conversion panel 70 deformed into a concave shape is inserted between the inner wall 134 (top plate) on the upper surface side of the housing 40 and the base 120.
  • the lid member 200 has a top surface that is flush with the top side inner wall 134 and a bottom surface 204 that is curved downward and convexly in accordance with the top surface 152 of the base 120.
  • the radiation conversion panel 70 can be maintained in a concavely curved state without floating the radiation conversion panel 70 from the upper surface 152 of the base 120. . Further, since the lid member 200 and the upper surface side inner wall 134 are flush with each other, the imaging surface 42 can be kept flat even when the lid member 200 is interposed between the upper surface side inner wall 134 and the radiation conversion panel 70. In addition, at the time of photographing, the radiation conversion panel 70 can be reliably covered without causing the subject 14 to feel uncomfortable.
  • the sense of incongruity felt by the subject 14 is, for example, a posture (uncomfortable) that places a load on the subject 14 when the subject 14 is positioned in the photographing region 46 at the time of photographing because the photographing surface 42 is not flat. This is a burden felt by the subject 14 due to the forced (natural posture).
  • the radiation conversion panel 70 is positioned at a predetermined position on the upper surface side inner wall 134 side in the housing 40. Can be covered.
  • the lid member 200 is preferably made of resin or the like to reduce the weight, and the inside of the lid member 200 is preferably a cavity 202.
  • the substrate 122 is made of flexible plastic resin (coefficient of thermal expansion is on the order of 10 ⁇ 5 / ° C.).
  • a metal coefficient of thermal expansion is on the order of 10 ⁇ 6 / ° C.
  • the substrate 122 is placed on the base 120 without attaching the base 120 and the substrate 122, and the placed radiation conversion panel 70 is covered from above. The structure which covers with the member 200 is taken.
  • the radiation conversion panel 70 (board
  • a fixing member 136 having an L-shaped cross section is provided on the side surface side of the base 120 in the arrow X2 direction so as to extend in the arrow Y direction.
  • the fixing member 136 fixes the base 120, the radiation conversion panel 70, and the lid member 200 at predetermined positions. Specifically, the radiation conversion panel 70 is positioned so that the radiation conversion layer 124 and the imaging region 46 overlap.
  • a flexible substrate 138 is fixed on the fixing member 136, and a plurality of electronic components 140 are mounted on the flexible substrate 138.
  • the flexible substrate 138 is connected to the cassette control unit 80.
  • the cassette control unit 80 transmits and receives signals between the drive circuit unit 74 and the radiation conversion layer 124 via the flexible substrate 138.
  • the power supply unit 56 also supplies power to the cassette control unit 80 and the communication unit 58 in the housing 40 and also supplies power to the drive circuit unit 74 and the radiation conversion layer 124 via the flexible substrate 138.
  • FIG. 7A and 7B are schematic explanatory views showing a state in which the radiation conversion panel 70 placed on the base 120 is covered with the lid member 200.
  • FIG. For convenience of explanation, other components are omitted. Further, the curvatures of the upper surface 152 of the base 120 and the bottom surface 204 of the lid member 200 are greatly expressed as compared with FIG. 5, but are exaggerated to help understanding of the present embodiment. It does not show the actual size.
  • the base 120 has a bow-shaped side surface 150 (arrow Y direction) that is concave downward, and extends in the arrow X direction.
  • the upper surface 152 of the base 120 forms a smooth curved surface.
  • the bottom surface 154 of the base 120 is in a positional relationship parallel to the imaging surface 42 of radiation 16 (see FIG. 5 and the like).
  • the radiation conversion panel 70 is supported by the base 120 with the back surface 156 in contact with the top surface 152. Further, the bottom surface 204 of the lid member 200 forms a smooth curved surface that protrudes downward corresponding to the top surface 152 of the base 120.
  • the radiation conversion panel 70 is deformed into a concave shape along the upper surface 152 of the base 120, and the one end 158 and the other end 160 of the radiation conversion panel 70 follow the curved surface shape of the upper surface 152.
  • the curved radiation conversion panel 70 is covered with the bottom surface 204 of the lid member 200 (see FIG. 7B).
  • the lid member 200, the radiation conversion panel 70, and the base 120 are in close contact with each other.
  • a tension T (see FIG. 7B) is generated at one end 158 and the other end 160 of the radiation conversion panel 70.
  • the influence of bending stress generated in the radiation conversion panel 70 is small. That is, it is possible to prevent the adhesion of the radiation conversion panel 70, the base 120, and the lid member 200 from being deteriorated due to thermal deformation.
  • the lid member 200 covers the radiation conversion panel 70 from above, so that the two-dimensional profile of the detected dose of the radiation 16 is continuous. (Smooth). Thereby, generation
  • the image correction unit 104 in the cassette control unit 80 appropriately corrects the radiation image based on the correction data acquired from the correction data storage unit 106.
  • a planar projection image as a reference (for example, when the base 120 and the lid member 200 are assumed to have a flat plate shape) Can be converted and corrected.
  • Various known algorithms can be used as a method for converting a planar projection image.
  • the shape of the radiation conversion panel 70 may be estimated based on the thickness information).
  • the correction data storage unit 106 stores correction data determined based on the shapes of the base 120 and the lid member 200.
  • the curvature may be used, the distance from the radiation source 18 (measured value, typical value, etc.), the positional relationship between the imaging surface 42, the base 120, and the lid member 200, etc.
  • Geometric information may be considered.
  • the shape of the radiation conversion panel 70 is preferably deformed in line symmetry with respect to a predetermined axis on the imaging surface 42 or the imaging region 46.
  • the predetermined axis is more preferably one of two guide lines 44 (arrow X direction, arrow Y direction).
  • the deformation amount (or correction amount) of the radiation conversion panel 70 is vertically or horizontally symmetrical with respect to the imaging region 46, and the calculation amount of the correction processing can be reduced.
  • the so-called back surface reading method in which the scintillator 132 is disposed in front of the irradiation direction (incident direction) of the radiation 16 and the photoelectric conversion layer 130 is disposed in the rear.
  • the radiation conversion panel 70 of PSS has been described.
  • the electronic cassette 20A according to the first embodiment is not limited to the PSS method, and the surface in which the photoelectric conversion layer 130 is disposed in the front with respect to the irradiation direction of the radiation 16 and the scintillator 132 is disposed in the rear.
  • the present invention can also be applied to a radiation conversion panel of a reading method (ISS method, ISS: Irradiation Side Sampling). Details of the ISS method and the PSS method will be described later.
  • the shapes of the bases 120a to 120c are different from those of the first embodiment (see FIGS. 1 to 7B).
  • the radiation conversion panel 70 placed on the bases 120a to 120c will be described in detail with reference to a state diagram in which the lid members 200 and 200a cover the radiation conversion panel.
  • the base 120a has an isosceles triangular side surface 162 (in the arrow Y direction), and extends in the arrow X direction.
  • the base 120a has a first inclined surface 164 and a second inclined surface 166 having the same area and the same inclination angle. Then, the first inclined surface 164 and the second inclined surface 166 intersect to form a valley line 170.
  • the bottom surface 204a of the lid member 200a has an isosceles triangle shape in a side view corresponding to the first inclined surface 164 and the second inclined surface 166 (see FIG. 8B).
  • the radiation conversion panel 70 is supported by the base 120a with its back surface 156 in contact with the first inclined surface 164 and the second inclined surface 166, and is covered by the lid member 200a from above.
  • a tension T (see FIG. 8B) is generated in the radiation conversion panel 70, and its one end 158 is curved along the first inclined surface 164 and the other end 160 is curved along the second inclined surface 166. Or it is bent.
  • the radiation conversion panel 70 is deformed according to its rigidity.
  • the radiation conversion panel 70 has the first embodiment (see FIGS. 7A and 7B) even if the surface shapes of the first inclined surface 164 and the second inclined surface 166 that contact the base 120 a and the lid member 200 a are different. ) Has the same effect.
  • the base 120b includes a plate-like flat portion 172 and two projecting portions 174 and 174 provided on both side edges (in the arrow Y direction) of the flat portion 172.
  • the two protrusions 174 and 174 have the same shape and are in a positional relationship parallel to each other.
  • the two protruding portions 174 and 174 are erected along the normal direction of the plane formed by the flat portion 172 and have arcuate side surfaces 176 and 176.
  • the upper surfaces 178 and 178 of the two protrusions 174 and 174 form a smooth curved surface.
  • the radiation conversion panel 70 is supported by the base 120b with the back surface 156 in contact with the two upper surfaces 178 and 178, and is covered by the lid member 200 from above. As a result, a tension T (see FIG. 9B) is generated in the radiation conversion panel 70, and its one end 158 and the other end 160 are curved along the curved surface shapes of the upper surfaces 178 and 178.
  • the base 120c includes a plate-like flat portion 180, a first projecting portion 182a provided at the central portion (in the direction of the arrow X) of the flat portion 180, and a side edge (in the same direction) on the near side of the flat portion. ) And a third protrusion 182c provided on the side edge (in the same direction) on the back side of the flat part.
  • the first to third protrusions 182a to 182c are all rectangular plate-like members provided extending in the direction of the arrow Y, and are in a positional relationship parallel to each other.
  • the first to third projecting portions 182a to 182c are respectively erected along the normal direction of the plane formed by the flat portion 180.
  • the second protrusion 182b and the third protrusion 182c have the same height, and the first protrusion 182a is provided lower than the second protrusion 182b and the third protrusion 182c.
  • the side surfaces of the first to third protrusions 182a to 182c have a rectangular shape that is long in the vertical direction.
  • the first to third upper surfaces 184a to 184c provided above the first to third projecting portions 182a to 182c form planes that are substantially parallel to the flat portion 180, respectively.
  • the radiation conversion panel 70 is supported by the base 120c with the back surface 156 in contact with the first to third upper surfaces 184a to 184c, and is covered with the lid member 200 from above. As a result, a tension T (see FIG. 10B) is generated in the radiation conversion panel 70, and the one end 158 and the other end 160 thereof are enveloped by the steps of the first to third protrusions 182a to 182c. Curved along.
  • the radiation conversion panel 70 is not curved along a predetermined surface shape, but the back surface 156 is supported by fulcrums with different heights arranged in a predetermined direction, and the cover member 200 is covered from above. Even if the radiation conversion panel 70 is curved by being covered, the same effects as those of the first embodiment (see FIGS. 7A and 7B) are obtained.
  • FIGS. 11A and 11B are partially enlarged cross-sectional views taken along line XI-XI of the electronic cassette 20A shown in FIG.
  • the fourth modification differs from the first embodiment in that the radiation conversion panel 70 is supported using not only the base 120 but also the housing 40.
  • a recess 188 is provided on one side wall 186 of the housing 40 in the direction of arrow Y1.
  • the recess 188 is freely engageable with one end 190 of the radiation conversion panel 70.
  • a recess (not shown) is provided on the other side wall of the housing 40 in the arrow Y2 direction at the same height as the recess 188 (in the arrow Z direction).
  • the radiation conversion panel 70 and the one side wall 186 are fixed using an adhesive or the like in a state where the recess 188 and the one end 190 are engaged. Similarly, the radiation conversion panel 70 and the other side wall are fixed. At this time, the radiation conversion panel 70 is held in a state of being separated from the upper surface side inner wall 134 and the lower surface side inner wall of the housing 40.
  • the base 120 is inserted between the radiation conversion panel 70 and the inner wall on the lower surface side of the housing 40. Thereby, the radiation conversion panel 70 is displaced along the upper surface 152 of the base 120.
  • the lid member 200 is inserted between the upper surface side inner wall 134 of the housing 40 and the radiation conversion panel 70.
  • the radiation conversion panel 70 is covered by the lid member 200 from above, and is deformed and supported by the upper surface 152 of the base 120 and the bottom surface 204 of the lid member 200 while being curved in a concave shape downward.
  • the radiation conversion panel 70 receives a drag force from the lid member 200 and is displaced according to the shapes of the base 120 and the lid member 200. Further, since the one end 190 is fixed to the housing 40, the radiation conversion panel 70 receives a tension T in its extending direction. That is, the radiation conversion panel 70 receives the Z component of tension T and the Z component of tension T. Accordingly, the radiation conversion panel 70 is pressed from both the signal output layer 128 side and the protective film 126 side, and the photoelectric conversion layer 130 and the scintillator 132 inside thereof are also pressed in the same manner. Thereby, both adhesiveness improves further.
  • the adhesion between the edge of the radiation conversion panel 70 and the base 120 is also improved. Thereby, the shape of the radiation conversion panel 70 is stabilized, and the correction accuracy of the radiation image is improved.
  • the radiation conversion panel 70 receives a larger pressure from the lid member 200 than when the side surface is not fixed. . Further, if the scintillator 132 and the substrate 122 having the heavier total weight are arranged on the lower side (in the direction of the arrow Z2), the central portion of the radiation conversion panel 70 is easily bent (deformed) downward along the base 120. Therefore, the above effect can be easily obtained.
  • the back-illuminated radiation conversion panel 70 arranged with the substrate 122 side facing the radiation 16 irradiation side incorporates the substrate 122 formed of a lightweight resin material.
  • the above-mentioned effect becomes remarkable.
  • FIG. 11A has illustrated the case where the radiation conversion panel 70 is covered with the cover member 200 without the cavity 202 as an example.
  • the upper surface side inner wall 134 of the housing 40 is curved in a convex shape in the arrow Z2 direction, and a part on the imaging surface 42 side of the housing 40 is covered with the lid portion 206.
  • the same components as those in the electronic cassette 20A and the radiographic image capturing system 10A according to the first embodiment are denoted by the same reference numerals. Detailed description thereof will be omitted, and the same shall apply hereinafter.
  • the electronic cassette 20 ⁇ / b> B and the radiographic image capturing system 10 ⁇ / b> B according to the second embodiment are the first in that the protruding portion (control unit 32) of the panel housing unit 30 is not provided. Different from the embodiment.
  • an input terminal 50, a USB terminal 52, and a card slot 54 are arranged on the side surface of the housing 40 in the arrow Y2 direction.
  • the electrical configuration of the electronic cassette 20B is the same as that of the electronic cassette 20A (see FIGS. 3 and 4) of the first embodiment, and a description thereof will be omitted.
  • the housing 40 contains a radiation conversion panel 70, a base 220 that supports the radiation conversion panel 70, and a lid member 200 that covers the radiation conversion panel 70.
  • the height of the base 220 in the arrow Z direction is higher than that of the base 120 of the electronic cassette 20A (see FIG. 2), but the upper surface 228 of the main body 222 constituting the base 220 is directed downward. It is concavely curved.
  • the main body 222 is provided with a shielding plate 224 made of a material that shields the radiation 16.
  • the base 220 has a chamber 226 surrounded by the main body 222 and the shielding plate 224. Inside the chamber 226, a power supply unit 56, a communication unit 58, and a cassette control unit 80 are accommodated.
  • FIG. 15 is an exploded perspective view of the base 220 shown in FIG. For convenience of explanation, other components are omitted. Further, although the curvature of the upper surface 228 of the base 220 is greatly expressed as compared with FIG. 14, it is exaggerated to help the understanding of the present invention. Not shown.
  • the base 220 has a substantially rectangular parallelepiped main body 222, and the upper surface 228 of the main body is curved in a concave shape downward as described above. Further, the main body 222 has an opening 230 that opens largely to the front side surface in the arrow X direction. A chamber 226 in which various units such as the power supply unit 56 can be stored is formed inside the main body 222.
  • Four bolt holes 232 are provided at the four corners of the outer wall portion on the opening 230 side.
  • four through holes 236 are provided at the four corners of the rectangular plate-shaped lid portion 234.
  • the radiation conversion panel 70 is supported by the base 220 with the back surface 156 in contact with the top surface 228 and covered with the lid member 200 from above. Therefore, the radiation conversion panel 70 is generally curved along the curved surface shapes of the upper surface 228 and the bottom surface 204. Since it comprises in this way, the radiation conversion panel 70 can be supported concavely in the stacking direction similarly to 1st Embodiment.
  • the base 220 may be an electromagnetic wave shielding member.
  • an aluminum foil can be attached, conductive coating can be applied, or electroless nickel plating can be applied to the entire surface of the base 220.
  • EMC measures including noise reduction measures for the circuit board and the electronic components (for example, the power supply unit 56, the communication unit 58, and the cassette control unit 80 shown in FIG. 14) mounted on the circuit board can be performed. .
  • the radiation conversion panel 70 or the like or an external electronic device malfunctions due to noise generated from the circuit board and the electronic component, and the electronic component is prevented from malfunctioning due to noise entering the electronic cassette 20B from the outside. It becomes possible to do.
  • FIGS. 16A and 16B a fifth modification of the second embodiment will be described with reference to FIGS. 16A and 16B.
  • the radiation conversion panel 70 will be described in detail with reference to a state diagram in which the radiation conversion panel 70 is placed on the base 220a.
  • the base 220a includes a plate-like flat portion 250, two projecting portions 252 and 252 provided on both side edges (in the arrow X direction) of the flat portion 250, and a central position (in the arrow Y direction) of the flat portion. )
  • the main protrusion 254 is a rectangular plate-like member provided so as to extend in the arrow Y direction, and is in a positional relationship parallel to each other.
  • the main projecting portion 254 is erected along the normal direction of the plane formed by the flat portion 250, and the upper surface 260 is curved in a concave shape downward. Therefore, the upper surface 260 of the main protrusion 254 forms a smooth curved surface.
  • the main protrusion 254 is provided higher than the two protrusions 252 and 252. Furthermore, each side surface of the main projecting portion 254 is fixed in a positional relationship where the projecting portions 252 and 252 cross each other. Furthermore, the main protrusion 254 partitions the surface of the flat portion 250 into a first surface 256 and a second surface 258.
  • each part can be arranged on the flat part 250 of the base 220a.
  • the power supply unit 56 is disposed on the first surface 256, and the communication unit 58 and the cassette control unit 80 are disposed on the second surface 258.
  • FIG. 17 is a partially enlarged cross-sectional view taken along line XVII-XVII in FIG.
  • the second modification is different from the second embodiment in that the radiation conversion panel 70 is supported using not only the base 220 but also the housing 40.
  • a rectangular fixing member 302 is provided on one side wall 300 of the housing 40 in the direction of arrow Y1.
  • a rectangular protective member 304 is fixed to the side surface of the fixing member 302 in the arrow Y2 direction.
  • the protective member 304 can be made of a soft elastic body such as silicon rubber.
  • the protective film 126 and the substrate 122 side of the radiation conversion panel 70 curved along the upper surface of the base 220 are brought into contact with the protective member 304. Thereby, the one end 308 of the radiation conversion panel 70 is held in contact with the protective member 304 and the outer peripheral surface 306 of the base 220.
  • a fixing member and a protection member are provided on the other side wall in the arrow Y2 direction of the housing 40, and both end portions of the radiation conversion panel 70 are fixed to the side walls of the housing 40.
  • the radiation conversion panel 70 since the radiation conversion panel 70 is covered with the lid member 200 from above, it receives a drag from the lid member 200 and is displaced according to the shapes of the base 220 and the lid member 200. Further, since the one end 308 is fixed by the fixing member 302 and the protective member 304 provided in the housing 40, the radiation conversion panel 70 receives a tension T in its extending direction.
  • the radiation conversion panel 70 receives the Z component of the drag and the Z component of the tension T along the Z direction. Thereby, since the radiation conversion panel 70 is pressed from the signal output layer 128 side and the protective film 126 side, the photoelectric conversion layer 130 and the scintillator 132 inside thereof are also pressed in the same manner. Thereby, both adhesiveness improves further.
  • both ends of the radiation conversion panel 70 are fixed via the protective member 304 made of a soft elastic body or the like, it is possible to prevent scratches and damage from occurring at both ends of the radiation conversion panel 70.
  • the adhesion between the edge of the radiation conversion panel 70 and the base 220 and the lid member 200 is further enhanced. And since the deformation degree of the radiation conversion panel 70 is stabilized, the estimation accuracy of the shape is improved. Thereby, the correction accuracy of the radiation image by the image correction unit 104 (see FIG. 4) is improved.
  • the console 22 may acquire ID information of the electronic cassettes 20A and 20B, and may acquire correction data for each radiation conversion panel 70 associated with the ID information. Then, the radiographic image can be corrected using the image processing unit on the console 22 side.
  • the stacking order of the photoelectric conversion layer 130 and the scintillator 132 may be the reverse of the present embodiment. That is, the scintillator 132 and the photoelectric conversion layer 130 may be stacked in this order on the signal output layer 128.
  • the radiation conversion panel 70 may be configured as shown in FIGS. 18A to 19A (seventh modification).
  • a specific configuration of the radiation conversion panel 70 using the scintillator made of CsI described in the first and second embodiments will be described in detail with reference to FIGS. 18A to 19A.
  • the effect of curving the radiation conversion panel 70 including the scintillator made of CsI into a concave shape (convex shape downward) will be described with reference to FIGS. 19A and 19B.
  • the radiation conversion panel 70 converts the radiation 16 transmitted through the subject 14 into visible light (absorbs the radiation 16 and emits visible light), and the scintillator.
  • the radiation detection unit 502 converts the visible light converted in 500 into an electrical signal (charge) corresponding to the radiation image.
  • the scintillator 500 corresponds to the scintillator 132 described above, and the radiation detection unit 502 corresponds to the signal output layer 128 and the photoelectric conversion layer 130.
  • the protective film 126 is not shown.
  • an ISS system in which the radiation detection unit 502 and the scintillator 500 are arranged in this order with respect to the imaging surface 42 on which the radiation 16 is irradiated.
  • a PSS system in which the scintillator 500 and the radiation detection unit 502 are arranged in this order with respect to the imaging surface 42.
  • the scintillator 500 emits light more strongly on the imaging surface 42 side on which the radiation 16 is incident.
  • the scintillator 500 is arranged in a state of being close to the imaging surface 42 as compared with the PSS method, the resolution of the radiographic image obtained by imaging is high and the radiation detection unit 502 is visible. The amount of received light also increases. Therefore, the sensitivity of the radiation conversion panel 70 (electronic cassettes 20A and 20B) can be improved in the ISS method than in the PSS method.
  • the scintillator 500 can be made of, for example, a material such as CsI: Tl (cesium iodide added with thallium), CsI: Na (sodium activated cesium iodide), GOS (Gd 2 O 2 S: Tb), or the like. .
  • FIG. 18B illustrates, as an example, a case where a scintillator 500 including a columnar crystal region is formed by evaporating a material including CsI on a deposition substrate 504.
  • a columnar crystal region composed of columnar crystals 500a is formed on the imaging surface 42 side (radiation detection unit 502 side) on which the radiation 16 is incident, and on the opposite side of the imaging surface 42 side.
  • a non-columnar crystal region composed of the non-columnar crystal 500b is formed.
  • the vapor deposition substrate 504 is preferably made of a material having high heat resistance. For example, aluminum (Al) is preferable from the viewpoint of low cost.
  • the average diameter of the columnar crystals 500a is approximately uniform along the longitudinal direction of the columnar crystals 500a.
  • the scintillator 500 has a structure formed of a columnar crystal region (columnar crystal 500a) and a non-columnar crystal region (noncolumnar crystal 500b), and a columnar crystal 500a that can emit light with high efficiency.
  • the crystal region is disposed on the radiation detection unit 502 side. Therefore, visible light generated by the scintillator 500 travels through the columnar crystal 500 a and is emitted to the radiation detection unit 502. As a result, diffusion of visible light emitted to the radiation detection unit 502 side is suppressed, and blurring of the radiation image detected by the electronic cassettes 20A and 20B is suppressed.
  • the visible light reaching the deep part (non-columnar crystal region) of the scintillator 500 is also reflected by the non-columnar crystal 500b toward the radiation detection unit 502, so that the amount of visible light incident on the radiation detection unit 502 (in the scintillator 500) (Detection efficiency of emitted visible light) can also be improved.
  • the interval between t1 and t2 , 0.01 ⁇ (t2 / t1) ⁇ 0.25 is preferably satisfied.
  • a region (columnar crystal region) that has high luminous efficiency and prevents the diffusion of visible light, and visible light The ratio along the thickness direction of the scintillator 500 to the region that reflects the light (non-columnar crystal region) is a suitable range, the light emission efficiency of the scintillator 500, the detection efficiency of visible light emitted by the scintillator 500, and the radiation image Improve the resolution.
  • (t2 / t1) is 0.02 or more and 0.1 or less. More preferably, it is the range.
  • the scintillator 500 having a structure in which a columnar crystal region and a non-columnar crystal region are continuously formed has been described.
  • a light reflection made of Al or the like is used instead of the noncolumnar crystal region.
  • a layer may be provided so that only the columnar crystal region is formed, or another configuration may be used.
  • the radiation detection unit 502 detects visible light emitted from the light emission side (columnar crystal 500a) of the scintillator 500, and is a side view of FIG. 18A (FIGS. 18A and 18B show the X direction as shown in FIG. 6).
  • the insulating substrate 508, the TFT layer 510, and the photoelectric conversion unit 512 are sequentially stacked on the imaging surface 42 along the incident direction of the radiation 16.
  • a planarization layer 514 is formed on the bottom surface of the TFT layer 510 so as to cover the photoelectric conversion portion 512.
  • the radiation detection unit 502 includes a plurality of pixel units 520 each including a photoelectric conversion unit 512 including a photodiode (PD: Photo Diode), a storage capacitor 516, and a TFT 518 in a matrix on the insulating substrate 508 in a plan view.
  • the TFT active matrix substrate (hereinafter also referred to as a TFT substrate) is formed.
  • the TFT 518 corresponds to the TFT 82 (see FIG. 4) described in the first embodiment, and the photoelectric conversion unit 512 and the storage capacitor 516 correspond to the pixel 72.
  • the photoelectric conversion unit 512 is configured by arranging a photoelectric conversion film 512c between a lower electrode 512a on the scintillator 500 side and an upper electrode 512b on the TFT layer 510 side.
  • the photoelectric conversion film 512c absorbs visible light emitted from the scintillator 500 and generates a charge corresponding to the absorbed visible light.
  • the lower electrode 512a Since the lower electrode 512a needs to make visible light emitted from the scintillator 500 incident on the photoelectric conversion film 512c, the lower electrode 512a is preferably formed of a conductive material that is transparent at least with respect to the emission wavelength of the scintillator 500. Specifically, it is preferable to use a transparent conductive oxide (TCO) having a high visible light transmittance and a low resistance value.
  • TCO transparent conductive oxide
  • the lower electrode 512a a resistance value tends to increase when an optical transmittance of 90% or more is obtained, so that the TCO is preferable.
  • ITO Indium Tin Oxide
  • IZO Indium Tin Oxide
  • AZO Alluminum doped Zinc Oxide
  • FTO Fluorine doped Tin Oxide
  • SnO 2 TiO 2 , ZnO 2 and the like
  • ITO is most preferable from the viewpoints of stability, low resistance, and transparency.
  • the lower electrode 512a may have a single configuration common to all the pixel portions 520, or may be divided for each pixel portion 520.
  • the photoelectric conversion film 512c may be formed of a material that absorbs visible light and generates electric charge, and for example, amorphous silicon (a-Si), an organic photoelectric conversion material (OPC), or the like can be used.
  • a-Si amorphous silicon
  • OPC organic photoelectric conversion material
  • the photoelectric conversion film 512c is made of amorphous silicon, visible light emitted from the scintillator 500 can be absorbed over a wide wavelength range.
  • the formation of the photoelectric conversion film 512c made of amorphous silicon requires vapor deposition.
  • the insulating substrate 508 is made of a synthetic resin, the heat resistance of the insulating substrate 508 needs to be considered.
  • the photoelectric conversion film 512c is formed of a material containing an organic photoelectric conversion material, an absorption spectrum that exhibits high absorption mainly in the visible light region is obtained. Therefore, in the photoelectric conversion film 512c, visible light emitted from the scintillator 500 is obtained. Absorption of electromagnetic waves other than light is almost eliminated. As a result, noise generated by absorption of radiation 16 such as X-rays and ⁇ -rays in the photoelectric conversion film 512c can be suppressed.
  • the photoelectric conversion film 512c made of an organic photoelectric conversion material can be formed by depositing an organic photoelectric conversion material on an object to be formed using a droplet discharge head such as an inkjet head. Heat resistance to the body is not required. For this reason, in the seventh modification, the photoelectric conversion film 512c is formed of an organic photoelectric conversion material.
  • the photoelectric conversion film 512c is made of an organic photoelectric conversion material
  • the radiation 16 is hardly absorbed by the photoelectric conversion film 512c. Therefore, in the ISS system in which the radiation detection unit 502 is arranged so that the radiation 16 is transmitted, radiation detection is performed. Attenuation of the radiation 16 transmitted through the part 502 can be suppressed, and a decrease in sensitivity to the radiation 16 can be suppressed. Therefore, it is particularly suitable for the ISS system to configure the photoelectric conversion film 512c with an organic photoelectric conversion material.
  • the organic photoelectric conversion material constituting the photoelectric conversion film 512c is preferably as close as possible to the emission peak wavelength of the scintillator 500 in order to absorb the visible light emitted from the scintillator 500 most efficiently.
  • the absorption peak wavelength of the organic photoelectric conversion material matches the emission peak wavelength of the scintillator 500, but if the difference between the two is small, the visible light emitted from the scintillator 500 can be sufficiently absorbed. It is.
  • the difference between the absorption peak wavelength of the organic photoelectric conversion material and the emission peak wavelength of the scintillator 500 with respect to the radiation 16 is preferably within 10 nm, and more preferably within 5 nm.
  • organic photoelectric conversion materials examples include quinacridone organic compounds and phthalocyanine organic compounds.
  • quinacridone organic compounds since the absorption peak wavelength of quinacridone in the visible region is 560 nm, if quinacridone is used as the organic photoelectric conversion material and CsI: Tl is used as the material of the scintillator 500, the difference between the peak wavelengths can be within 5 nm. Thus, the amount of charge generated in the photoelectric conversion film 512c can be substantially maximized.
  • the electromagnetic wave absorption / photoelectric conversion site in the radiation conversion panel 70 is an organic layer including an upper electrode 512b and a lower electrode 512a, and a photoelectric conversion film 512c sandwiched between the upper electrode 512b and the lower electrode 512a. More specifically, this organic layer is a part that absorbs electromagnetic waves, a photoelectric conversion part, an electron transport part, a hole transport part, an electron blocking part, a hole blocking part, a crystallization preventing part, an electrode, and an interlayer contact. It can be formed by stacking or mixing improved parts.
  • the organic layer preferably contains an organic p-type compound or an organic n-type compound.
  • An organic p-type semiconductor (compound) is a donor organic semiconductor (compound) mainly represented by a hole-transporting organic compound, and is an organic compound having a property of easily donating electrons. More specifically, an organic compound having a smaller ionization potential when two organic materials are used in contact with each other. Therefore, any organic compound can be used as the donor organic compound as long as it is an electron-donating organic compound.
  • An organic n-type semiconductor (compound) is an acceptor organic semiconductor (compound) mainly represented by an electron-transporting organic compound, and is an organic compound having a property of easily accepting electrons. More specifically, an organic compound having a higher electron affinity when two organic compounds are used in contact with each other. Therefore, any organic compound can be used as the acceptor organic compound as long as it is an organic compound having an electron accepting property.
  • the photoelectric conversion unit 512 only needs to include at least the upper electrode 512b, the lower electrode 512a, and the photoelectric conversion film 512c.
  • at least one of an electron blocking film and a hole blocking film is required. It is preferable to provide these, and it is more preferable to provide both.
  • the electron blocking film can be provided between the upper electrode 512b and the photoelectric conversion film 512c.
  • a bias voltage is applied between the upper electrode 512b and the lower electrode 512a, the electron blocking film is applied from the upper electrode 512b to the photoelectric conversion film 512c.
  • An increase in dark current due to injection of electrons can be suppressed.
  • An electron donating organic material can be used for the electron blocking film.
  • the material actually used for the electron blocking film may be selected according to the material of the adjacent electrode, the material of the adjacent photoelectric conversion film 512c, etc., and the electron function is 1.3 eV or more from the work function (Wf) of the adjacent electrode material.
  • a material having a large affinity (Ea) and an Ip equivalent to or smaller than the ionization potential (Ip) of the material of the adjacent photoelectric conversion film 512c is preferable. Since the material applicable as the electron donating organic material is described in detail in Japanese Patent Application Laid-Open No. 2009-32854, description thereof is omitted.
  • the thickness of the electron blocking film is preferably 10 nm or more and 200 nm or less, more preferably 30 nm or more and 150 nm or less, particularly preferably, in order to surely exhibit the dark current suppressing effect and prevent a decrease in the photoelectric conversion efficiency of the photoelectric conversion unit 512. Is from 50 nm to 100 nm.
  • the hole blocking film can be provided between the photoelectric conversion film 512c and the lower electrode 512a, and when a bias voltage is applied between the upper electrode 512b and the lower electrode 512a, the lower electrode 512a to the photoelectric conversion film 512c. It is possible to suppress the increase of dark current due to injection of holes into the substrate.
  • An electron-accepting organic material can be used for the hole blocking film.
  • the material actually used for the hole blocking film may be selected according to the material of the adjacent electrode, the material of the adjacent photoelectric conversion film 512c, etc., and 1.3 eV or more from the work function (Wf) of the material of the adjacent electrode.
  • the thickness of the hole blocking film is preferably 10 nm or more and 200 nm or less, more preferably 30 nm or more and 150 nm or less, and particularly preferably, in order to reliably exhibit the dark current suppressing effect and prevent a decrease in the photoelectric conversion efficiency of the photoelectric conversion unit 512. Is from 50 nm to 100 nm.
  • the position of the electron blocking film and the holes are set.
  • the position of the blocking film may be reversed.
  • a gate electrode, a gate insulating film, and an active layer are stacked, and a source electrode and a drain electrode are formed on the active layer at a predetermined interval.
  • the active layer can be formed of any of amorphous silicon, amorphous oxide, organic semiconductor material, carbon nanotube, etc., but the material that can form the active layer is not limited to these. Absent.
  • an amorphous oxide capable of forming an active layer for example, an oxide containing at least one of In, Ga, and Zn (for example, an In—O system) is preferable, and at least one of In, Ga, and Zn is used.
  • An oxide containing two eg, In—Zn—O, In—Ga—O, and Ga—Zn—O
  • an oxide containing In, Ga, and Zn is particularly preferable.
  • the In—Ga—Zn—O-based amorphous oxide an amorphous oxide whose composition in a crystalline state is represented by InGaO 3 (ZnO) m (m is a natural number less than 6) is preferable, and in particular, InGaZnO. 4 is more preferable.
  • the amorphous oxide capable of forming the active layer is not limited to these.
  • examples of the organic semiconductor material capable of forming the active layer include, but are not limited to, phthalocyanine compounds, pentacene, vanadyl phthalocyanine, and the like.
  • the configuration of the phthalocyanine compound is described in detail in Japanese Patent Application Laid-Open No. 2009-212389, and thus the description thereof is omitted.
  • the active layer of the TFT 518 is formed of any one of an amorphous oxide, an organic semiconductor material, a carbon nanotube, and the like, the radiation 16 such as X-rays is not absorbed, or even if it is absorbed, the amount is extremely small. The generation of noise in the radiation detection unit 502 can be effectively suppressed.
  • the switching speed of the TFT 518 can be increased, and the degree of light absorption in the visible light region in the TFT 518 can be reduced.
  • the performance of the TFT 518 is remarkably deteriorated only by mixing a very small amount of metallic impurities into the active layer. Therefore, it must be used for forming the active layer.
  • membrane formed with the organic-semiconductor material have sufficient flexibility, the photoelectric conversion film 512c formed with the organic photoelectric conversion material, and an active layer are used. If the configuration is combined with a TFT 518 formed of an organic semiconductor material, it is not always necessary to increase the rigidity of the radiation detection unit 502 in which the weight of the body of the subject 14 is added as a load.
  • the insulating substrate 508 may be any substrate that has optical transparency and little radiation absorption.
  • both the amorphous oxide constituting the active layer of the TFT 518 and the organic photoelectric conversion material constituting the photoelectric conversion film 512c of the photoelectric conversion portion 512 can be formed at a low temperature. Therefore, the insulating substrate 508 is not limited to a highly heat-resistant substrate such as a semiconductor substrate, a quartz substrate, or a glass substrate, and a flexible substrate made of synthetic resin, aramid, or bio-nanofiber can also be used.
  • flexible materials such as polyesters such as polyethylene terephthalate, polybutylene phthalate and polyethylene naphthalate, polystyrene, polycarbonate, polyethersulfone, polyarylate, polyimide, polycycloolefin, norbornene resin, poly (chlorotrifluoroethylene), etc.
  • a conductive substrate can be used.
  • the insulating substrate 508 includes an insulating layer for ensuring insulation, a gas barrier layer for preventing permeation of moisture and oxygen, an undercoat layer for improving flatness or adhesion to electrodes, and the like. May be provided.
  • the transparent electrode material can be cured at a high temperature to reduce resistance, and it can also be used for automatic mounting of a driver IC including a solder reflow process.
  • aramid has a thermal expansion coefficient close to that of ITO or a glass substrate, warping after production is small and it is difficult to break.
  • aramid can make a substrate thinner than a glass substrate or the like.
  • the insulating substrate 508 may be formed by stacking an ultrathin glass substrate and aramid.
  • the bionanofiber is a composite of cellulose microfibril bundle (bacterial cellulose) produced by bacteria (acetobacterium, Xylinum) and transparent resin.
  • the cellulose microfibril bundle has a width of 50 nm and a size of 1/10 of the visible light wavelength, and has high strength, high elasticity, and low thermal expansion.
  • a transparent resin such as acrylic resin or epoxy resin in bacterial cellulose
  • a bio-nanofiber having a light transmittance of about 90% at a wavelength of 500 nm can be obtained while containing 60% to 70% of the fiber.
  • Bionanofiber has a low coefficient of thermal expansion (3-7 ppm) comparable to that of silicon crystals, and is as strong as steel (460 MPa), highly elastic (30 GPa), and flexible. Compared to glass substrates, etc. Thus, the insulating substrate 508 can be thinned.
  • the thickness of the radiation detector 502 (TFT substrate) as a whole is, for example, about 0.7 mm.
  • the electronic cassettes 20A and 20B are thinned. Therefore, a thin substrate made of a light-transmitting synthetic resin is used as the insulating substrate 508.
  • the thickness of the radiation detection unit 502 as a whole can be reduced to, for example, about 0.1 mm, and the radiation detection unit 502 can be flexible. Further, by providing the radiation detection unit 502 with flexibility, the impact resistance of the electronic cassettes 20A and 20B is improved, and even when an impact is applied to the electronic cassettes 20A and 20B, it is difficult to be damaged.
  • plastic resin, aramid, bionanofiber, etc. all absorb less radiation 16, and when the insulating substrate 508 is formed of these materials, the amount of radiation 16 absorbed by the insulating substrate 508 also decreases. Even if the radiation 16 is transmitted through the radiation detection unit 502 by the ISS method, a decrease in sensitivity to the radiation 16 can be suppressed.
  • a synthetic resin substrate as the insulating substrate 508 of the electronic cassettes 20A and 20B.
  • a substrate made of another material such as a glass substrate is used.
  • the insulating substrate 508 may be used.
  • a flattening layer 514 for flattening the radiation detection unit 502 is formed on the radiation detection unit 502 (TFT substrate) on the side opposite to the arrival direction of the radiation 16 (on the scintillator 500 side).
  • the radiation conversion panel 70 may be configured as follows.
  • the photoelectric conversion part 512 including PD may be formed of an organic photoelectric conversion material, and the TFT layer 510 may be formed using a CMOS sensor. In this case, since only the PD is made of an organic material, the TFT layer 510 including the CMOS sensor may not have flexibility. Note that the photoelectric conversion unit 512 made of an organic photoelectric conversion material and the CMOS sensor are described in Japanese Patent Application Laid-Open No. 2009-212377, and thus detailed description thereof is omitted.
  • the photoelectric conversion unit 512 including the PD may be formed of an organic photoelectric conversion material, and the flexible TFT layer 510 may be realized by a CMOS circuit including a TFT made of an organic material.
  • pentacene may be adopted as the material of the p-type organic semiconductor used in the CMOS circuit
  • copper fluoride phthalocyanine (F 16 CuPc) may be adopted as the material of the n-type organic semiconductor.
  • F 16 CuPc copper fluoride phthalocyanine
  • a flexible TFT layer 510 that can have a smaller bending radius can be realized.
  • the gate insulating film can be significantly thinned, and the driving voltage can be lowered.
  • the gate insulating film, the semiconductor, and each electrode can be manufactured at room temperature or 100 ° C. or lower.
  • a CMOS circuit can be directly formed over the flexible insulating substrate 508.
  • a TFT made of an organic material can be miniaturized by a manufacturing process in accordance with a scaling law.
  • the insulating substrate 508 can be realized by applying a polyimide precursor on a thin polyimide substrate by spin coating and heating, so that the polyimide precursor is changed to polyimide, so that a flat substrate without unevenness can be realized. it can.
  • insulating PD and TFT made of crystalline Si from resin substrate It may be arranged on the substrate 508.
  • PDs and TFTs as micro device blocks of micron order are fabricated in advance on another substrate and then separated from the substrate, and the PDs and TFTs are dispersed on an insulating substrate 508 as a target substrate in a liquid. And place statistically.
  • the insulating substrate 508 is processed in advance to be adapted to the device block, and the device block can be selectively disposed on the insulating substrate 508.
  • the optimum device block (PD and TFT) made of the optimum material can be integrated on the optimum substrate (insulating substrate 508), and the PD and the insulating substrate 508 (resin substrate) which are not crystals can be integrated. It becomes possible to integrate TFTs.
  • the radiation 16 is output from the radiation source 18 so as to spread from the radiation source 18 (see FIGS. 1 and 12) toward the electronic cassettes 20A and 20B. Therefore, as schematically shown in a side view of FIG. 19A (FIG. 19A is a side view seen in the Y direction as in FIGS. 5 and 14), the radiation conversion panel 70 has a certain extent.
  • the radiation 16 having
  • the radiation conversion panel 70 including the CsI scintillator 500 is entirely arranged so that the longitudinal direction of the columnar crystal 500a and the incident direction of the radiation 16 are substantially parallel in consideration of the spread of the radiation 16. It is curved in a concave shape (convex shape downward). Accordingly, the columnar crystal 500a of the scintillator 500 is curved so as to be directed to the radiation source 18 (the focal point thereof). In FIG. 19A, the non-columnar crystal 500b and the like are not shown for ease of explanation.
  • FIG. 19B the same components as those in FIG. 19A are denoted by the same reference numerals for convenience of explanation.
  • FIG. 19B schematically shows a conventional example, and the radiation conversion panel 70 including the CsI scintillator 500 has a flat plate shape. Therefore, the longitudinal direction of the columnar crystal 500a and the incident direction of the radiation 16 are different from each other. As a result, in FIG. 19B, crosstalk in which the radiation 16 enters the scintillator 500 so as to straddle each columnar crystal 500a occurs, which also causes a reduction in the image quality of the radiation image.
  • the radiation conversion panel 70 including the CsI scintillator 500 is curved in a concave shape so that the longitudinal direction of the columnar crystal 500a and the incident direction of the radiation 16 are changed. Since they are substantially parallel, it is possible to prevent the radiation 16 incident on the scintillator 500 via the radiation detection unit 502 from straddling between the columnar crystals 500a. It becomes possible to acquire a radiographic image of image quality.
  • reference numeral 530 indicates a light emission location of visible light 532 converted from radiation 16 in scintillator 500 (columnar crystal 500a thereof).
  • a non-columnar crystal region including a non-columnar crystal 500b (see FIG. 18B) on the vapor deposition substrate 504 side in the scintillator 500, the adhesion between the vapor deposition substrate 504 and the scintillator 500 can be improved.
  • FIG. 19A even if the scintillator 500 is curved in a generally concave shape so that the longitudinal direction of the columnar crystal 500a and the incident direction of the radiation 16 are substantially parallel, The peeling of the columnar crystals 500a) can be suppressed.
  • tip of the imaging surface 42 side (radiation detection part 502 side) of the columnar crystal 500a and the interface with the radiation detection part 502 are a free state which does not interpose an adhesive agent. This is because if the scintillator 500 is curved in a concave shape as a whole in a state where the tip of the columnar crystal 500a and the radiation detection unit 502 are bonded, the columnar crystal 500a may be cracked.

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  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Medical Informatics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Pathology (AREA)
  • Surgery (AREA)
  • Nuclear Medicine, Radiotherapy & Molecular Imaging (AREA)
  • Optics & Photonics (AREA)
  • Biophysics (AREA)
  • Radiology & Medical Imaging (AREA)
  • Biomedical Technology (AREA)
  • Heart & Thoracic Surgery (AREA)
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  • General Health & Medical Sciences (AREA)
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  • Measurement Of Radiation (AREA)
  • Radiography Using Non-Light Waves (AREA)
  • Apparatus For Radiation Diagnosis (AREA)

Abstract

L'invention concerne un dispositif d'imagerie radiologique (20A, 20B) et son un procédé d'assemblage. Le dispositif d'imagerie radiologique comprend un panneau de transformation de rayonnement (70) monté sur une base et supporté par cette dernière (120, 120a, 120b, 120c, 220, 220a), de telle sorte que ledit panneau de transformation de rayonnement (70) est déformé selon une forme concave par rapport au sens de montage du panneau de transformation de rayonnement (70) sur la base (120, 120a, 120b, 120c, 220, 220a) et que le panneau de transformation de rayonnement (70) monté sur la base (120, 120a, 120b, 120c, 220, 220a) est recouvert par une unité de recouvrement (200, 200a).
PCT/JP2011/061930 2010-05-25 2011-05-25 Dispositif d'imagerie radiologique et son procédé d'assemblage Ceased WO2011148960A1 (fr)

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JP2010-119549 2010-05-25

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JP2016057204A (ja) * 2014-09-10 2016-04-21 キヤノン株式会社 放射線撮像装置および放射線撮像システム
CN108604591A (zh) * 2016-02-22 2018-09-28 索尼公司 摄像装置、摄像显示系统和显示装置
EP3722837A4 (fr) * 2018-03-20 2021-08-11 Canon Kabushiki Kaisha Dispositif d'imagerie par rayonnement
US11183533B2 (en) * 2017-11-13 2021-11-23 Tovis Co., Ltd. Method for manufacturing curved-surface detector, and curved-surface detector manufactured using the manufacturing method
EP3859401A4 (fr) * 2018-09-27 2021-11-24 FUJIFILM Corporation Détecteur de rayonnement, appareil d'imagerie par rayonnement et procédé de fabrication
JP2026059714A (ja) * 2024-09-26 2026-04-07 ディアールテック コーポレーション 支持部を含む放射線ディテクタ

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JP2014081358A (ja) * 2012-09-27 2014-05-08 Fujifilm Corp 放射線画像検出装置
JP2023063720A (ja) * 2021-10-25 2023-05-10 キヤノン株式会社 放射線撮影装置

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JPH0511301U (ja) * 1991-07-26 1993-02-12 日本板硝子株式会社 Ｘ線イメージセンサ
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JP2002341042A (ja) * 2001-05-21 2002-11-27 Canon Inc 光電変換装置
JP2004064087A (ja) * 2002-07-25 2004-02-26 General Electric Co <Ge> 可撓性イメージャ及びデジタル画像形成方法
WO2009125632A1 (fr) * 2008-04-10 2009-10-15 コニカミノルタエムジー株式会社 Détecteur portable de rayonnement à l’état solide

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JPS55133039A (en) * 1979-04-02 1980-10-16 Toray Ind Inc X-ray film cassette
JPH03107944A (ja) * 1989-09-22 1991-05-08 Canon Inc フィルム密着装置
JPH0511301U (ja) * 1991-07-26 1993-02-12 日本板硝子株式会社 Ｘ線イメージセンサ
WO2001063321A1 (fr) * 2000-02-25 2001-08-30 Hamamatsu Photonics K.K. Dispositif d'imagerie a rayons x et son procede de fabrication
JP2002006050A (ja) * 2000-06-26 2002-01-09 Canon Inc 二次元撮像装置の実装構造
JP2002341042A (ja) * 2001-05-21 2002-11-27 Canon Inc 光電変換装置
JP2004064087A (ja) * 2002-07-25 2004-02-26 General Electric Co <Ge> 可撓性イメージャ及びデジタル画像形成方法
WO2009125632A1 (fr) * 2008-04-10 2009-10-15 コニカミノルタエムジー株式会社 Détecteur portable de rayonnement à l’état solide

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016057204A (ja) * 2014-09-10 2016-04-21 キヤノン株式会社 放射線撮像装置および放射線撮像システム
CN108604591A (zh) * 2016-02-22 2018-09-28 索尼公司 摄像装置、摄像显示系统和显示装置
US11183533B2 (en) * 2017-11-13 2021-11-23 Tovis Co., Ltd. Method for manufacturing curved-surface detector, and curved-surface detector manufactured using the manufacturing method
EP3722837A4 (fr) * 2018-03-20 2021-08-11 Canon Kabushiki Kaisha Dispositif d'imagerie par rayonnement
US11320546B2 (en) 2018-03-20 2022-05-03 Canon Kabushiki Kaisha Radiation imaging apparatus
EP3859401A4 (fr) * 2018-09-27 2021-11-24 FUJIFILM Corporation Détecteur de rayonnement, appareil d'imagerie par rayonnement et procédé de fabrication
US11802980B2 (en) 2018-09-27 2023-10-31 Fujifilm Corporation Radiation detector, radiographic imaging apparatus, and manufacturing method
JP2026059714A (ja) * 2024-09-26 2026-04-07 ディアールテック コーポレーション 支持部を含む放射線ディテクタ

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