USD1094325S1 - Electro-magnetic device - Google Patents

Electro-magnetic device

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Publication number
USD1094325S1
USD1094325S1 US29/804,957 US202129804957F USD1094325S US D1094325 S1 USD1094325 S1 US D1094325S1 US 202129804957 F US202129804957 F US 202129804957F US D1094325 S USD1094325 S US D1094325S
Authority
US
United States
Prior art keywords
electro
magnetic device
view
magnetic
ornamental design
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/804,957
Inventor
Benjamin HANSON
Steven Hofer
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Vishay Dale Electronics LLC
Original Assignee
Vishay Dale Electronics LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Vishay Dale Electronics LLC filed Critical Vishay Dale Electronics LLC
Priority to US29/804,957 priority Critical patent/USD1094325S1/en
Assigned to VISHAY DALE ELECTRONICS, LLC reassignment VISHAY DALE ELECTRONICS, LLC ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: HANSON, Benjamin, Hofer, Steven
Assigned to JPMORGAN CHASE BANK, N.A. reassignment JPMORGAN CHASE BANK, N.A. SECURITY INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: VISHAY DALE ELECTRONICS, INC. (N/K/A VISHAY DALE ELECTRONICS, LLC), VISHAY GENERAL SEMICONDUCTOR INC. (N/K/A VISHAY GSI, INC.), VISHAY GENERAL SEMICONDUCTOR, LLC (N/K/A VISHAY GSI, INC.), VISHAY INTERTECHNOLOGY, INC., VISHAY-SILICONIX (N/K/A SILICONIX INCORPORATED)
Application granted granted Critical
Publication of USD1094325S1 publication Critical patent/USD1094325S1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Description

FIG. 1 is a top, front, right perspective view of an electro-magnetic device in accordance with our design;
FIG. 2 is a bottom, rear, left perspective view thereof;
FIG. 3 is a front elevational view thereof;
FIG. 4 is a rear elevational view thereof;
FIG. 5 is a right side elevational view thereof;
FIG. 6 is a left side elevational view thereof;
FIG. 7 is a top plan view thereof; and,
FIG. 8 is a bottom plan view thereof.

Claims (1)

    CLAIM
  1. The ornamental design for an electro-magnetic device as shown and described.
US29/804,957 2021-08-24 2021-08-24 Electro-magnetic device Active USD1094325S1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US29/804,957 USD1094325S1 (en) 2021-08-24 2021-08-24 Electro-magnetic device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US29/804,957 USD1094325S1 (en) 2021-08-24 2021-08-24 Electro-magnetic device

Publications (1)

Publication Number Publication Date
USD1094325S1 true USD1094325S1 (en) 2025-09-23

Family

ID=97102711

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US29/804,957 Active USD1094325S1 (en) 2021-08-24 2021-08-24 Electro-magnetic device

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US (1) USD1094325S1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD1125057S1 (en) * 2024-07-23 2026-05-05 Hong Dang Technology Co., Ltd. Elevated surface mount inductor

Citations (58)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2223345A1 (en) 1972-05-12 1973-11-22 Siemens Ag DEVICE FOR EQUIPMENT OF COMPONENT CARRIER
US4567543A (en) 1983-02-15 1986-01-28 Motorola, Inc. Double-sided flexible electronic circuit module
US4966282A (en) 1989-01-13 1990-10-30 Nitto Denko Corporation Electronic component carrier
JPH02143828U (en) 1989-05-08 1990-12-06
US5089314A (en) 1987-02-25 1992-02-18 Tdk Corporation Carrier tape for electronic circuit elements and method of manufacturing an electronic circuit element series
JPH0511424U (en) 1991-07-24 1993-02-12 株式会社トーキン Common mode chiyoke coil
US5203143A (en) 1992-03-28 1993-04-20 Tempo G Multiple and split pressure sensitive adhesive stratums for carrier tape packaging system
US5493259A (en) 1992-10-13 1996-02-20 The Whitaker Corporation High voltage, low pass filtering connector with multiple ground planes
US5655290A (en) 1992-08-05 1997-08-12 Fujitsu Limited Method for making a three-dimensional multichip module
US5731633A (en) 1992-09-16 1998-03-24 Gary W. Hamilton Thin multichip module
US5765692A (en) 1995-11-13 1998-06-16 Minnesota Mining And Manufacturing Company Carrier tape with adhesive and protective walls
US5846621A (en) 1995-09-15 1998-12-08 Minnesota Mining And Manufacturing Company Component carrier tape having static dissipative properties
US5990509A (en) 1997-01-22 1999-11-23 International Business Machines Corporation 2F-square memory cell for gigabit memory applications
US6058004A (en) 1997-09-08 2000-05-02 Delaware Capital Formation, Inc. Unitized discrete electronic component arrays
JP2000182838A (en) 1998-12-15 2000-06-30 Tokyo Coil Engineering Kk choke coil
US6412641B1 (en) 2000-06-19 2002-07-02 Advanced Micro Devices, Inc. Packaging for encapsulated dice employing EMR-sensitive adhesives
US20020118517A1 (en) 2001-02-27 2002-08-29 3Com Corporation Chip component assembly
CA2388319A1 (en) 2001-05-25 2002-11-25 Mould, Bernard High voltage power transmission line filter system and module
US6541874B2 (en) 1998-04-28 2003-04-01 Tessera, Inc. Encapsulation of microelectronic assemblies
US20030231477A1 (en) 2002-04-12 2003-12-18 Avx Corporation Discrete component array
US6822850B2 (en) 2002-09-27 2004-11-23 Rockwell Automation Technologies, Inc. Laminated bus bar for use with a power conversion configuration
JP2006253349A (en) 2005-03-10 2006-09-21 Shizuki Electric Co Inc Capacitor and manufacturing method thereof
JP4019541B2 (en) 1999-03-15 2007-12-12 ミツミ電機株式会社 Chip capacitor device
WO2008008538A2 (en) 2006-07-14 2008-01-17 Pulse Engineering, Inc. Self-leaded surface mount inductors and methods
US8028397B2 (en) 2005-11-03 2011-10-04 Vishay Sprague, Inc. Method of making a frame package array device
USD665740S1 (en) * 2011-11-18 2012-08-21 Sumida Corporation Coil component
USD674756S1 (en) * 2010-04-26 2013-01-22 Hakaryd Ab Magnetic cladding with electronics box
JP2014027090A (en) 2012-07-26 2014-02-06 Keihin Corp Reactor device
US20140160819A1 (en) 2011-07-20 2014-06-12 Sumitomo Electric Industries, Ltd. Reactor, converter, and power converter apparatus
JP2014130949A (en) 2012-12-28 2014-07-10 Auto Network Gijutsu Kenkyusho:Kk Reactor, converter and power conversion device
JP2014143332A (en) 2013-01-25 2014-08-07 Sumitomo Electric Ind Ltd Reactor, converter, and electric power conversion device
JP2015216145A (en) 2014-05-07 2015-12-03 株式会社オートネットワーク技術研究所 Reactor
JP2016111276A (en) 2014-12-09 2016-06-20 株式会社オートネットワーク技術研究所 Reactor
USD778837S1 (en) * 2015-06-24 2017-02-14 Sumida Corporation Magnetic component
USD779429S1 (en) * 2015-06-24 2017-02-21 Sumida Corporation Magnetic component
USD780120S1 (en) * 2015-06-24 2017-02-28 Sumida Corporation Magnetic component
USD796438S1 (en) * 2015-07-31 2017-09-05 Alps Electric Co., Ltd. Inductor
USD806651S1 (en) * 2014-12-25 2018-01-02 Sumida Corporation Magnetic component
US20190172630A1 (en) 2017-11-16 2019-06-06 Tdk Corporation Coil device
US20190189340A1 (en) 2016-09-30 2019-06-20 Moda-Innochips Co., Ltd. Power inductor
USD881127S1 (en) * 2017-09-14 2020-04-14 Alps Alpine Co., Ltd. Inductor
USD884630S1 (en) * 2017-09-14 2020-05-19 Alps Alpine Co., Ltd. Inductor
USD906965S1 (en) * 2018-03-16 2021-01-05 Tokin Corporation Inductor
USD921587S1 (en) * 2019-01-23 2021-06-08 Sumida Corporation Core
USD923574S1 (en) * 2019-01-30 2021-06-29 Sumida Corporation Coil component
USD935407S1 (en) * 2019-12-27 2021-11-09 Sumida Corporation Core
USD942946S1 (en) * 2014-12-02 2022-02-08 Tdk Corporation Coil component
US11424539B2 (en) 2016-12-21 2022-08-23 Intel Corporation Wireless communication technology, apparatuses, and methods
WO2023027690A1 (en) 2021-08-24 2023-03-02 Vishay Dale Electronics, Llc Dual inductor assembly
USD993181S1 (en) * 2021-08-23 2023-07-25 Tdk Corporation Coil component
USD995431S1 (en) * 2019-01-23 2023-08-15 Sumida Corporation Coil component
US20240105379A1 (en) * 2022-09-25 2024-03-28 Cyntec Co., Ltd. Magnetic component and method of manufacturing magnetic component
USD1029763S1 (en) * 2018-08-22 2024-06-04 Tdk Corporation Core of coil component
USD1034462S1 (en) * 2021-03-01 2024-07-09 Vishay Dale Electronics, Llc Inductor package
USD1040762S1 (en) * 2020-09-07 2024-09-03 Tdk Corporation Coil component
US12087492B2 (en) * 2018-02-05 2024-09-10 Murata Manufacturing Co., Ltd. Common-mode choke coil
USD1052527S1 (en) * 2013-12-13 2024-11-26 Pulse Electronics, Inc. Inductive apparatus
US12224105B2 (en) * 2020-03-03 2025-02-11 Tdk Corporation Coil component

Patent Citations (66)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2223345A1 (en) 1972-05-12 1973-11-22 Siemens Ag DEVICE FOR EQUIPMENT OF COMPONENT CARRIER
US4567543A (en) 1983-02-15 1986-01-28 Motorola, Inc. Double-sided flexible electronic circuit module
US5089314A (en) 1987-02-25 1992-02-18 Tdk Corporation Carrier tape for electronic circuit elements and method of manufacturing an electronic circuit element series
US4966282A (en) 1989-01-13 1990-10-30 Nitto Denko Corporation Electronic component carrier
JPH02143828U (en) 1989-05-08 1990-12-06
JPH0511424U (en) 1991-07-24 1993-02-12 株式会社トーキン Common mode chiyoke coil
US5203143A (en) 1992-03-28 1993-04-20 Tempo G Multiple and split pressure sensitive adhesive stratums for carrier tape packaging system
US5655290A (en) 1992-08-05 1997-08-12 Fujitsu Limited Method for making a three-dimensional multichip module
US5731633A (en) 1992-09-16 1998-03-24 Gary W. Hamilton Thin multichip module
US5493259A (en) 1992-10-13 1996-02-20 The Whitaker Corporation High voltage, low pass filtering connector with multiple ground planes
US5846621A (en) 1995-09-15 1998-12-08 Minnesota Mining And Manufacturing Company Component carrier tape having static dissipative properties
US5765692A (en) 1995-11-13 1998-06-16 Minnesota Mining And Manufacturing Company Carrier tape with adhesive and protective walls
US5990509A (en) 1997-01-22 1999-11-23 International Business Machines Corporation 2F-square memory cell for gigabit memory applications
US6058004A (en) 1997-09-08 2000-05-02 Delaware Capital Formation, Inc. Unitized discrete electronic component arrays
US6541874B2 (en) 1998-04-28 2003-04-01 Tessera, Inc. Encapsulation of microelectronic assemblies
JP2000182838A (en) 1998-12-15 2000-06-30 Tokyo Coil Engineering Kk choke coil
JP4019541B2 (en) 1999-03-15 2007-12-12 ミツミ電機株式会社 Chip capacitor device
US6412641B1 (en) 2000-06-19 2002-07-02 Advanced Micro Devices, Inc. Packaging for encapsulated dice employing EMR-sensitive adhesives
US20020118517A1 (en) 2001-02-27 2002-08-29 3Com Corporation Chip component assembly
US6549098B1 (en) 2001-05-25 2003-04-15 Bernard Mould Limited High voltage power transmission line filter system and module
CA2388319A1 (en) 2001-05-25 2002-11-25 Mould, Bernard High voltage power transmission line filter system and module
US20030231477A1 (en) 2002-04-12 2003-12-18 Avx Corporation Discrete component array
US6822850B2 (en) 2002-09-27 2004-11-23 Rockwell Automation Technologies, Inc. Laminated bus bar for use with a power conversion configuration
JP2006253349A (en) 2005-03-10 2006-09-21 Shizuki Electric Co Inc Capacitor and manufacturing method thereof
US8028397B2 (en) 2005-11-03 2011-10-04 Vishay Sprague, Inc. Method of making a frame package array device
US20100214050A1 (en) 2006-07-14 2010-08-26 Opina Jr Gil Self-leaded surface mount inductors and methods
WO2008008538A2 (en) 2006-07-14 2008-01-17 Pulse Engineering, Inc. Self-leaded surface mount inductors and methods
USD674756S1 (en) * 2010-04-26 2013-01-22 Hakaryd Ab Magnetic cladding with electronics box
US20140160819A1 (en) 2011-07-20 2014-06-12 Sumitomo Electric Industries, Ltd. Reactor, converter, and power converter apparatus
USD665740S1 (en) * 2011-11-18 2012-08-21 Sumida Corporation Coil component
JP2014027090A (en) 2012-07-26 2014-02-06 Keihin Corp Reactor device
JP2014130949A (en) 2012-12-28 2014-07-10 Auto Network Gijutsu Kenkyusho:Kk Reactor, converter and power conversion device
JP2014143332A (en) 2013-01-25 2014-08-07 Sumitomo Electric Ind Ltd Reactor, converter, and electric power conversion device
USD1052527S1 (en) * 2013-12-13 2024-11-26 Pulse Electronics, Inc. Inductive apparatus
JP2015216145A (en) 2014-05-07 2015-12-03 株式会社オートネットワーク技術研究所 Reactor
USD1040763S1 (en) * 2014-12-02 2024-09-03 Tdk Corporation Coil component
USD942946S1 (en) * 2014-12-02 2022-02-08 Tdk Corporation Coil component
JP2016111276A (en) 2014-12-09 2016-06-20 株式会社オートネットワーク技術研究所 Reactor
USD830972S1 (en) * 2014-12-25 2018-10-16 Sumida Corporation Magnetic component
USD806651S1 (en) * 2014-12-25 2018-01-02 Sumida Corporation Magnetic component
USD779429S1 (en) * 2015-06-24 2017-02-21 Sumida Corporation Magnetic component
USD780120S1 (en) * 2015-06-24 2017-02-28 Sumida Corporation Magnetic component
USD778837S1 (en) * 2015-06-24 2017-02-14 Sumida Corporation Magnetic component
USD796438S1 (en) * 2015-07-31 2017-09-05 Alps Electric Co., Ltd. Inductor
US20190189340A1 (en) 2016-09-30 2019-06-20 Moda-Innochips Co., Ltd. Power inductor
US11424539B2 (en) 2016-12-21 2022-08-23 Intel Corporation Wireless communication technology, apparatuses, and methods
USD881127S1 (en) * 2017-09-14 2020-04-14 Alps Alpine Co., Ltd. Inductor
USD884630S1 (en) * 2017-09-14 2020-05-19 Alps Alpine Co., Ltd. Inductor
US20190172630A1 (en) 2017-11-16 2019-06-06 Tdk Corporation Coil device
US12087492B2 (en) * 2018-02-05 2024-09-10 Murata Manufacturing Co., Ltd. Common-mode choke coil
USD906965S1 (en) * 2018-03-16 2021-01-05 Tokin Corporation Inductor
USD1029763S1 (en) * 2018-08-22 2024-06-04 Tdk Corporation Core of coil component
USD995433S1 (en) * 2019-01-23 2023-08-15 Sumida Corporation Core
USD995431S1 (en) * 2019-01-23 2023-08-15 Sumida Corporation Coil component
USD995430S1 (en) * 2019-01-23 2023-08-15 Sumida Corporation Coil component
USD921587S1 (en) * 2019-01-23 2021-06-08 Sumida Corporation Core
USD923574S1 (en) * 2019-01-30 2021-06-29 Sumida Corporation Coil component
USD935407S1 (en) * 2019-12-27 2021-11-09 Sumida Corporation Core
US12224105B2 (en) * 2020-03-03 2025-02-11 Tdk Corporation Coil component
USD1040762S1 (en) * 2020-09-07 2024-09-03 Tdk Corporation Coil component
USD1034462S1 (en) * 2021-03-01 2024-07-09 Vishay Dale Electronics, Llc Inductor package
USD993181S1 (en) * 2021-08-23 2023-07-25 Tdk Corporation Coil component
US20240355525A1 (en) * 2021-08-24 2024-10-24 Vishay Dale Electronics, Llc Dual inductor assembly
CA3229949A1 (en) 2021-08-24 2023-03-02 Benjamin HANSON Dual inductor assembly
WO2023027690A1 (en) 2021-08-24 2023-03-02 Vishay Dale Electronics, Llc Dual inductor assembly
US20240105379A1 (en) * 2022-09-25 2024-03-28 Cyntec Co., Ltd. Magnetic component and method of manufacturing magnetic component

Non-Patent Citations (4)

* Cited by examiner, † Cited by third party
Title
"High Current Inductors", IHLD-2525GG-5A, Document No. 34556, Dec. 2020, 5 pages.
"Low Profile, High CurrentDual Inductors", IHLD-3232HB-5A, Document No. 34383, Oct. 2020, 4 pages.
"Low Profile, High CurrentDual Inductors", IHLD-4032KB-5A, Document No. 34381, Jan. 2020, 5 pages.
"SRF 1010DA Series—Dual Shielded Inductors for Class-D Amplifiers", Product Specification Sheet, Bourns, www.boruns.com, 3 pages.

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD1125057S1 (en) * 2024-07-23 2026-05-05 Hong Dang Technology Co., Ltd. Elevated surface mount inductor

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