TWM307769U - Improved backlight module structure - Google Patents

Description

M307769 ~ VII, designated representative map (1), the designated representative figure of this case is: the third picture. .1)), the symbol of the representative figure of this representative figure is simple:

Backlight module.....B

Light module...C light source point............C 1

Thermal Conductive Plate ....D Depressions... D 1 Solder Paste ........D 2

Heat pipe.......E VIII. New description: [New technical field] The technology of this creation provides a backlight module structure improvement, especially a backlight module for average heat conduction. The heat pipe is disposed in the recessed portion of the heat guide plate, and the heat pipe is corresponding to the light source point, so that the light source point effectively conducts heat energy to the heat conductive plate through the heat pipe, so that the backlight module can reach Heat conduction, temperature uniformity and the function of avoiding chromatic aberration of the light source module.

4 M307769, [Prior Art] • Private Office As shown in Fig. 2 and Fig. 2, the conventional backlight module A is only used by the guide film for the heat sink. A 1 includes one or more hairs 1 and the thermal energy of the illuminant A 1 is generated by the optical element A 2 "the thermal energy A 3 of the phosphor A 1 is caused by the light-emitting element a 2 The position θ is set, and the temperature is higher as the position closer to the light-emitting element A 2 is higher, and the guide piece has only a sense of not having a uniform temperature function, resulting in a light-emitting element A2 having a higher thermal energy A3 λ 〇 J ί * The temperature difference of A 1 is too large, and the thermal energy A 3 cannot be effectively excluded, resulting in a problem that the light-emitting element A 2 is liable to cause chromatic aberration due to high heat. Therefore, how to eliminate the above problems is the technical difficulty that the creators of the case want to solve. [New Content] Z-qiao's creation is described in detail with the drawings, drawings and examples. The author proposes two monthly light source module structural improvements, as shown in the third, fourth and fifth figures. The backlight source is composed of a light source module c, a heat conducting plate ϋ and a heat pipe ;; /, the light source module c includes one or more light source points ,i, and the light source 5 M3 07769 . f implementation] Innovative, light source module structure improvement, such as the fifth picture, .m jin r its thermal conduction _ embedded with - or more than one 』, week i: ή f 1 ί fD1 corresponds to the light source In the module c, one or one of the hairpins - the original source ^;: point C 1 is the light source module c generates heat energy c 2 ",, ί 中进, group c is closer to the light ^^ point c 1 The thermal energy c 2 is higher. ί5, Tim f has solder paste D 2, ·, ί heat guide batch i concave S-order ί ii S paste D2 has ί ^ guide tightly joined to the depression D1, and can be via f 5) For processing - processing, the heat pipe e and the guide hsisi ̄ 月 ^ ^ value im can be used for the light source mode, red is completely attached to the guide 'd, such as ϊ 图 第 第 3rd ΐ 当 当 当 当 当 当The problem that caused the color difference.

1, and shown, the heat pipe is installed in the recess D. “ ϊ “ 效 效 效 收 收 收 收 收 以 以 以 以 以 以 以 令 令 令 令 令 令 令 令 令 令 令 令 令 令 令 令 令 令 令 令 令 令 令 令 令 令 令 令 令 令 令The light module C is caused by high heat, and the heat-dissipation effect is 'and can be avoided'. 6 M307769 analysis makes the creation more obvious and progressive, _ production-comparison is divided into "uselessness". Only the effect of heat dissipation. Shi, Ling Yi, can not reach the function of uniform temperature. Second, the position of the * component is high (3) excellent if the light component is easy to produce color difference due to high heat ': :, ί ί ί ΐ , , , The temperature is too high and the color difference is caused. V. Enhance the competitiveness of the industry. The work piece ϊ ' ' ' Γ Γ Γ 实 实 实 实 、 、 、 、 、 、 、 、 、 、 、 、 、 、 实用 实用 实用 实用 巧

7 M307769 [Simple description of the diagram] The first picture is a stereo view of the application. - The second diagram is a schematic diagram of the thermal energy used in the past. The third picture is a perspective view of the creation. The fourth picture is a three-dimensional exploded view of the creation. The fifth picture is a schematic diagram of the thermal energy of this creation. . The sixth figure is one of the embodiments of the present creation. The seventh figure is the second embodiment of the present invention. The eighth figure is the third embodiment of the present invention. The ninth figure is the fourth embodiment of the present invention. The tenth figure is the fifth of the embodiment of the present creation. The eleventh figure is the sixth figure of the embodiment of the present creation. [Main component symbol description]

Backlight module.....A illuminator.......A 1 illuminating element...A 2 Thermal energy........A 3,C 2

Backlight module.....B

Light source module...C Light source point.......C 1 D,G D 1 D2 E F 导热Heat-conducting plate · Depressions · Solder paste · · Heat pipe · Plane · · Heat sink 8

Claims (1)

____________________ M307769 • Nine, the patented range of backlight module structure improvement, the backlight module mainly includes: module, including one or more light source points; recessed! The board is used to conduct heat source The board is cut, and it is embedded with a point corresponding to the point of the light source, and the light source of the crane is connected to the light source portion, and the heat can be effectively transmitted by the solder paste. ..., etc. g home in the interface concave heat guide! Packing guide! On the iii flat J cat numerical control) for a processing, 俾 έ heat conduction ; another;: back J source module 妓 妓 good. Wei's position 俾 俾 贪 贪 贪 贪 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 背光 背光 背光 背光 背光 背光 背光 背光 背光 背光 背光 背光 背光 背光 背光 背光