TWI895086B - Display stacking and splicing structure - Google Patents

Abstract

A display stacking and splicing structure includes plural display panels, plural dummy substrates, at least one optical clear resin (OCR) layer, and a support plate. Each of the display panels has a display area and a border area surrounding the display area. The left side of the border area of each of the display panels overlaps the right sides of the border area of one of the display panels in a vertical direction, thereby forming plural step difference spaces. The dummy substrates are respectively located in the step difference spaces. The OCR layer is located between one of the display panels and one of the dummy substrates. The support plate is located below the display panels.

Description

Display stacking and splicing structure

This disclosure relates to a display device, and more particularly to a display stacking and splicing structure.

Reflective displays (such as electronic paper) are now widely used as display screens in various consumer electronics markets. The display medium layer of a reflective display is primarily composed of microcapsules containing white and black particles. Applying a voltage to the display medium drives the white and black particles to move, causing each pixel to display black, white, or grayscale, respectively. Because reflective displays utilize incident light to illuminate the display medium layer, they do not require a backlight, saving power.

Many large-scale commercial display applications, such as exhibition displays, require the use of multiple spliced displays. For example, when electronic paper displays are used in spliced displays, they are typically tiled directly (that is, horizontally adjacent to each other), placing each display adjacent to the next. This creates a double-width border around the spliced display area, creating a large seam that impacts visual quality and compromises product competitiveness.

According to some embodiments of the present disclosure, a display stacking and splicing structure includes a plurality of display panels, a plurality of filler substrates, at least one optical adhesive layer, and a carrier plate. Each display panel has a display area and a frame region surrounding the display area. The left side of the frame region of each display panel overlaps vertically with the right side of the frame region of one of the display panels, forming a plurality of step spaces. The filler substrates are positioned in each of the step spaces. The optical adhesive layer is positioned between one of the display panels and one of the filler substrates. The carrier plate is positioned below the display panels.

In some embodiments, the display stacking and splicing structure further includes an adhesive layer. The adhesive layer is located between at least one of the filler substrates and the carrier plate, and between at least one of the display panels and the carrier plate.

In some embodiments, the display stacking and splicing structure further includes a transparent cover plate and another optical adhesive layer. The transparent cover plate is located above the display panel and the filler substrate. The other optical adhesive layer is located between at least one of the filler substrates and the transparent cover plate, and between at least one of the display panels and the transparent cover plate.

In some embodiments, the carrier plate and the light-transmitting cover plate are both glass sheets.

In some embodiments, one of the filling substrates and at least one of the display panels overlap in a vertical direction.

In some embodiments, at least one of the filler substrates extends from above the display area of one display panel to above the display area of another display panel.

In some embodiments, at least one of the filling substrates extends from below the display area of one of the display panels to below another of the filling substrates.

In some embodiments, each of the display panels has a flexible circuit board, the carrier board has a plurality of grooves, and the flexible circuit boards pass through the grooves of the carrier board respectively.

In some embodiments, the supporting plate is a metal part or a bakelite part.

In some embodiments, the supporting plate has a plurality of protrusions, and each protrusion extends into one of the step spaces.

In some embodiments, the protrusions of the carrier plate define a staircase structure.

In some embodiments, the optical adhesive layer extends from under one of the display panels to under another of the display panels.

In some embodiments, the optical adhesive layer extends from above one of the display panels to above another of the display panels.

In some embodiments, the optical adhesive layer extends from under one of the filling substrates to under another of the filling substrates.

In some embodiments, the optical adhesive layer extends from above one of the filling substrates to above another of the filling substrates.

In some implementations, the display panel is an electronic paper display panel.

In some embodiments, the refractive index of the filler substrate is the same as the refractive index of the optical adhesive layer.

In the disclosed embodiments, the display stacking and splicing structure vertically overlaps the different sides (e.g., left and right) of the two bezel areas of the upper and lower display panels, creating a stepped space. A filler substrate and optical adhesive layer fill this stepped space to provide support and flattening. This reduces the width of the splicing seam from twice the width of the bezel area in a traditional flat-panel configuration to the width of a single bezel area, thereby improving visual quality and enhancing product competitiveness.

100, 100a, 100b, 100c, 100d, 100e: Display stacking and splicing structure

110: Display Panel

111:Lower base plate

112: Display area

113: Electronic ink layer

114: Border area

115: Sealant

117: Front Panel

119: Flexible circuit board

120: Filling the substrate

130: Optical adhesive layer

140,140a: Carrier plate

141:convex part

142: Groove

150: Adhesive layer

160: Translucent cover

170: Optical adhesive layer

D: Display area

G: Seam

S: step difference space

The aspects of the present disclosure are best understood from the following embodiments when read in conjunction with the accompanying drawings. Note that, in accordance with standard practice in the industry, various features are not drawn to scale. In fact, the dimensions of the various features may be arbitrarily increased or reduced for clarity of discussion.

Figure 1 shows a cross-sectional view of a display stacking and splicing structure according to one embodiment of the present disclosure.

Figure 2 shows a cross-sectional view of a display stacking and splicing structure according to another embodiment of the present disclosure.

Figure 3 shows a top view of the carrier plate in Figure 2.

Figure 4 shows a cross-sectional view of a display stacking and splicing structure according to another embodiment of the present disclosure.

Figure 5 shows a top view of the carrier plate in Figure 4.

Figure 6 shows a cross-sectional view of a display stacking and splicing structure according to another embodiment of the present disclosure.

Figure 7 shows a top view of the carrier plate in Figure 6.

Figure 8 shows a cross-sectional view of a display stacking and splicing structure according to an embodiment of the present disclosure.

Figure 9 shows a top view of the carrier plate in Figure 8.

Figure 10 shows a cross-sectional view of a display stacking and splicing structure according to another embodiment of the present disclosure.

Figure 11 shows a top view of the carrier plate in Figure 10.

The following disclosed embodiments provide numerous different embodiments, or examples, for implementing various features of the subject matter. Specific examples of components and arrangements are described below to simplify the present disclosure. However, these examples are merely examples and are not intended to be limiting. Furthermore, the present disclosure may repeat component symbols and/or letters throughout the various examples. This repetition is for the sake of simplicity and clarity and does not in itself dictate a relationship between the various embodiments and/or configurations discussed.

Spatially relative terms such as "below," "beneath," "lower," "above," "upper," and the like may be used herein for descriptive purposes to describe the relationship of one element or feature to another element or feature as illustrated in the figures. Spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. The device may be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.

FIG1 shows a cross-sectional view of a display stacking and splicing structure 100 according to an embodiment of the present disclosure. As shown in the figure, the display stacking and splicing structure 100 includes a plurality of display panels 110, a plurality of filler substrates 120, at least one optical adhesive layer 130, and a carrier plate 140. Each display panel 110 has a display area 112 and a frame area 114 surrounding the display area 112. The left side of the frame area 114 of a display panel 110 and the right side of the frame area 114 of another display panel 110 overlap in the vertical direction to form a plurality of step spaces S. For example, two step spaces S are formed above the lower left display panel 110 and below the upper right display panel 110 in FIG1. The filler substrates 120 are respectively located in the step spaces S. With this configuration, the filler substrate 120 and the display panel 110 can overlap vertically. Furthermore, an optical adhesive layer 130 is located between the display panel 110 and the filler substrate 120 to bond the two. A carrier plate 140 is located beneath the display panel 110 and the filler substrate 120.

In some embodiments, the display stacking and splicing structure 100 may further include an adhesive layer 150, a transparent cover plate 160, and another optical adhesive layer 170. The adhesive layer 150 is located between the filler substrate 120 and the carrier plate 140, and between the display panel 110 and the carrier plate 140. The transparent cover plate 160 is located above the display panel 110 and the filler substrate 120. The optical adhesive layer 170 is located between the filler substrate 120 and the transparent cover plate 160, and between the display panel 110 and the transparent cover plate 160. Furthermore, the orthographic projection of the vertically overlapping border region 114 on the transparent cover plate 160 may define a splicing seam G of the display stacking and splicing structure 100.

In this embodiment, the display panel 110 is a two-layer stack. The display panel 110, the filler substrate 120, and the optical adhesive layer 130 are all two, but this is not limiting. The display panel 110 can be an electronic paper display panel. The transparent cover plate 160 and the carrier plate 140 can be glass sheets. The filler substrate 120 can be a glass sheet or a polymethyl methacrylate (PMMA) film. The optical adhesive layer 130 and the optical adhesive layer 170 can be acrylic optical adhesive. The refractive index of the filler substrate 120 and the optical adhesive layer 130 can be the same (e.g., 1.48), which facilitates light transmission and reduces interface reflection.

Specifically, the display stacking and splicing structure 100 vertically overlaps the two sides (e.g., left and right) of the two bezel regions 114 of the upper and lower display panels 110, creating a stepped space S. The filler substrate 120 and optical adhesive layer 130 fill this stepped space S to provide support and flattening. Consequently, the width of the splicing seam G is reduced from twice the width of the bezel region in a traditional flat-panel configuration to the width of a single bezel region 114, thereby enhancing visual quality and improving product competitiveness.

It should be understood that the component connections, materials, and functions already described will not be repeated here, but will be explained first. The following description will explain other types of display stacking and splicing structures.

Figure 2 shows a cross-sectional view of a display stacking and tiling structure 100a according to another embodiment of the present disclosure. Display stacking and tiling structure 100a includes a display panel 110, a filler substrate 120, an optical adhesive layer 130, a carrier plate 140, an adhesive layer 150, a transparent cover plate 160, and an optical adhesive layer 170. Display panels 110 are a two-layer stack. Each display panel 110 may include a lower substrate 111, an electronic ink layer 113, a sealant 115, a front panel 117, and a flexible circuit board 119. The vertically overlapping display area 112, projected onto the transparent cover plate 160, defines the display area D of the display stacking and tiling structure 100. This embodiment differs from the embodiment shown in FIG. 1 in that there are three display panels 110 and three filler substrates 120, and one optical adhesive layer 130. The optical adhesive layer 130 extends from below one of the display panels 110 (e.g., the upper left display panel 110) to below another of the display panels 110 (e.g., the upper right display panel 110). Furthermore, the optical adhesive layer 130 extends from above one of the filler substrates 120 (e.g., the lower left filler substrate 120) to above another of the filler substrates 120 (e.g., the lower right filler substrate 120).

FIG3 illustrates a top view of the carrier plate 140 of FIG2 . Referring to both FIG2 and FIG3 , the carrier plate 140 of the display stacking and splicing structure 100a has a plurality of trenches 142 . The flexible circuit board 119 extends from the lower substrate 111 of the display panel 110 to the carrier plate 140 . The flexible circuit board 119 passes through each of the trenches 142 of the carrier plate 140 , allowing the flexible circuit board 119 to electrically connect to other electronic devices from the outside of the carrier plate 140 . In this embodiment, the number of trenches 142 and the number of flexible circuit boards 119 are both three. The number of trenches 142 in the carrier plate 140 is the same as that in the display panel 110 , but this is not intended to limit the present disclosure. In another embodiment of the present invention, the number of trenches 142 on the carrier plate 140 is less than the number of display panels 110, meaning that multiple flexible circuit boards 119 can share one trench 142.

FIG4 illustrates a cross-sectional view of a display stacking and splicing structure 100b according to another embodiment of the present disclosure. Display stacking and splicing structure 100b includes a display panel 110, a filler substrate 120, an optical adhesive layer 130, a carrier plate 140, an adhesive layer 150, a transparent cover plate 160, and an optical adhesive layer 170. The difference between this embodiment and the embodiment of FIG. 2 is that the number of display panels 110 is five and they are stacked in three layers, the number of filling substrates 120 is six, the number of optical adhesive layers 130 is two, and one of the filling substrates 120 (e.g., the upper filling substrate 120) extends from above the display area 112 of one of the display panels 110 (e.g., the display panel 110 on the left side of the middle layer) to above the display area 112 of another of the display panels 110 (e.g., the display panel 110 on the right side of the middle layer). At least one of the filling substrates 120 (e.g., the filling substrate 120 on the left side of the lower layer) extends from below the display area 112 of one of the display panels 110 (e.g., the display panel 110 on the left side of the middle layer) to below another one of the filling substrates 120 (e.g., the filling substrate 120 on the left side of the middle layer). Furthermore, a lower optical adhesive layer 130 extends from below one of the filling substrates 120 (e.g., the filling substrate 120 on the left side of the middle layer) to below another one of the filling substrates 120 (e.g., the filling substrate 120 on the right side of the middle layer).

Figure 5 shows a top view of the carrier plate 140 in Figure 4. Referring to both Figures 4 and 5, the flexible circuit board 119 of the display stacking and splicing structure 100b extends from the lower substrate 111 of the display panel 110 to the carrier plate 140, and the flexible circuit board 119 passes through the trenches 142 of the carrier plate 140. In this embodiment, the number of trenches 142 and the number of flexible circuit boards 119 are both five.

FIG6 shows a cross-sectional view of a display stacking and splicing structure 100c according to another embodiment of the present disclosure. Display stacking and splicing structure 100c includes a display panel 110, a filler substrate 120, an optical adhesive layer 130, a carrier plate 140a, a transparent cover plate 160, and an optical adhesive layer 170. This embodiment differs from the embodiment shown in FIG4 in that there are two filler substrates 120, the carrier plate 140a has a plurality of protrusions 141, and the upper optical adhesive layer 130 extends from above one of the display panels 110 (e.g., the display panel 110 on the left side of the middle layer) to above another of the display panels 110 (e.g., the display panel 110 on the right side of the middle layer). The protrusion 141 of the supporting plate 140a extends into the step space S, so that the protrusion 141 of the supporting plate 140a can define a staircase structure. In this embodiment, the supporting plate 140a can be a metal member or a bakelite member.

Figure 7 shows a top view of the carrier plate 140a in Figure 6. Referring to both Figures 6 and 7, the flexible circuit board 119 of the display stacking and splicing structure 100c extends from the lower substrate 111 of the display panel 110 to the carrier plate 140a, and the flexible circuit board 119 passes through the trenches 142 of the carrier plate 140a. In this embodiment, the number of trenches 142 and the number of flexible circuit boards 119 are both five.

FIG8 shows a cross-sectional view of a display stacking and splicing structure 100d according to an embodiment of the present disclosure. FIG9 shows a top view of the carrier plate 140 of FIG8. Referring to both FIG8 and FIG9, the display stacking and splicing structure 100d includes a display panel 110, a filler substrate 120, an optical adhesive layer 130, a carrier plate 140, an adhesive layer 150, a transparent cover plate 160, and an optical adhesive layer 170. This embodiment differs from the embodiment of FIG2 in that the number of display panels 110 and filler substrates 120 is five, and the number of grooves 142 of the flexible circuit board 119 and the carrier plate 140 is five. Furthermore, the optical adhesive layer 170 extends from above the upper left filling substrate 120 to above the upper right filling substrate 120. The optical adhesive layer 130 extends from above the lower left display panel 110 to above the lower right display panel 110. The adhesive layer 150 extends from below the lower left display panel 110 to below the lower right display panel 110.

Figure 10 illustrates a cross-sectional view of a display stacking and splicing structure 100e according to another embodiment of the present disclosure. Display stacking and splicing structure 100e includes a display panel 110, a filler substrate 120, an optical adhesive layer 130, a carrier plate 140a, a transparent cover plate 160, and an optical adhesive layer 170. This embodiment differs from the embodiment of Figure 8 in that there are three filler substrates 120, and the carrier plate 140a has a plurality of protrusions 141. The protrusions 141 of the carrier plate 140a extend into the step space S, defining a stepped structure. In this embodiment, the carrier plate 140a can be made of metal or Bakelite.

Figure 11 shows a top view of the carrier plate 140a in Figure 10. Referring to both Figures 10 and 11, the flexible circuit board 119 of the display stacking and splicing structure 100e extends from the lower substrate 111 of the display panel 110 to the carrier plate 140a, and the flexible circuit board 119 passes through the trenches 142 of the carrier plate 140a. In this embodiment, the number of trenches 142 and the number of flexible circuit boards 119 are both five.

The foregoing description outlines the features of several embodiments so that those skilled in the art may better understand the aspects of the present disclosure. Those skilled in the art should appreciate that they may readily use this disclosure as a basis for designing or modifying other processes and structures to achieve the same purposes and/or achieve the same advantages as the embodiments described herein. Those skilled in the art should also recognize that such equivalent constructions do not depart from the spirit and scope of the present disclosure, and that various changes, substitutions, and alterations may be made herein without departing from the spirit and scope of the present disclosure.

100: Display stacking and splicing structure

110: Display Panel

112: Display area

114: Border area

120: Filling the substrate

130: Optical adhesive layer

140: Carrier Plate

150: Adhesive layer

160: Translucent cover

170: Optical adhesive layer

G: Seam

S: step difference space

Claims (11)

A display stacking and splicing structure includes: a plurality of display panels, each having a display area and a frame area surrounding the display area, wherein the left side of the frame area of each display panel and the right side of the frame area of one of the display panels overlap in a vertical direction, forming a plurality of step spaces; a plurality of filler substrates, each located in the step spaces, with at least one of the filler substrates extending from above the display area of one of the display panels to above the display area of another of the display panels; at least one optical adhesive layer, wherein the optical adhesive layer is located between one of the display panels and one of the filler substrates; and a carrier plate, located below the display panels. The display stacking and splicing structure of claim 1 further comprises: An adhesive layer positioned between at least one of the filler substrates and the carrier plate, and between at least one of the display panels and the carrier plate. The display stacking and splicing structure of claim 1 further comprises: a transparent cover plate positioned above the display panels and the filler substrates; and another optical adhesive layer positioned between at least one of the filler substrates and the transparent cover plate, and between at least one of the display panels and the transparent cover plate. The display stacking and splicing structure as described in claim 1, wherein one of the filling substrates and at least one of the display panels overlap in the vertical direction. The display stacking and splicing structure as described in claim 1, wherein at least one of the filling substrates extends from under the display area of one of the display panels to under another one of the filling substrates. The display stacking and splicing structure as described in claim 1, wherein each of the display panels has a flexible circuit board, the carrier board has a plurality of grooves, and the flexible circuit boards respectively pass through the grooves of the carrier board. A display stacking and splicing structure as described in claim 6, wherein the supporting plate has a plurality of protrusions, and each of the protrusions extends into one of the step spaces. The display stacking and splicing structure as described in claim 1, wherein the optical adhesive layer extends from under one of the display panels to under another of the display panels. The display stacking and splicing structure as described in claim 1, wherein the optical adhesive layer extends from above one of the display panels to above another one of the display panels. The display stacking and splicing structure as described in claim 1, wherein the optical adhesive layer extends from above one of the filling substrates to above another one of the filling substrates. The display stacking and splicing structure as described in claim 1, wherein the refractive index of the filling substrates is the same as the refractive index of the optical adhesive layer.