TWI882499B - Light source module - Google Patents

Light source module Download PDF

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TWI882499B
TWI882499B TW112141471A TW112141471A TWI882499B TW I882499 B TWI882499 B TW I882499B TW 112141471 A TW112141471 A TW 112141471A TW 112141471 A TW112141471 A TW 112141471A TW I882499 B TWI882499 B TW I882499B
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light
substrate
light source
source module
cup shell
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TW112141471A
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Chinese (zh)
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TW202517928A (en
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陳書偉
倪慶懷
吳崑榮
黃國維
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隆達電子股份有限公司
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Priority to TW112141471A priority Critical patent/TWI882499B/en
Priority to CN202410503921.3A priority patent/CN119914841A/en
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Publication of TWI882499B publication Critical patent/TWI882499B/en
Publication of TW202517928A publication Critical patent/TW202517928A/en

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Abstract

A light source module, including a substrate; a light-emitting element disposed on the substrate, and the light-emitting element has a light-emitting surface; a cup shell disposed on the substrate and having a top surface, the cup shell disposed around the light-emitting element to form an accommodating space, wherein a vertical distance from a light-emitting surface of the light-emitting element to the substrate is greater than or equal to a vertical distance from a top surface of the cup shell to the substrate.

Description

光源模組Light source module

本揭露係有關於一種發光元件,且特別係有關於一種光源模組。The present disclosure relates to a light emitting element, and more particularly to a light source module.

發光二極體(Light-Emitting Diode,LED)由於體積小、亮度高、耗能低等優點,近年來已逐漸取代傳統光源。發光二極體目前已廣泛的應用於背光模組中以作為發光元件。Light-emitting diodes (LEDs) have gradually replaced traditional light sources in recent years due to their small size, high brightness, and low energy consumption. LEDs are currently widely used in backlight modules as light-emitting components.

在現有的背光模組設計中,包括安裝於電路板上具有發光元件、反光杯殼及基板等元件的多個光源模組,而現有技術較高的杯殼設計往往限制了光源模組的出光角,進而限制了光源模組在出光平面上的光斑大小。除此之外,當光源模組之間的節距過大時,將導致光源模組間出現暗區而產生均勻度不佳的問題,造成不良的視覺感受。雖然可以藉由縮小光源模組間的節距改善上述問題,但縮小節距的同時必須增加光源模組的數量,導致成本上升。In the existing backlight module design, multiple light source modules with light-emitting elements, reflective cup shells and substrates are installed on the circuit board. The cup shell design with higher technology often limits the light output angle of the light source module, thereby limiting the spot size of the light source module on the light output plane. In addition, when the pitch between the light source modules is too large, dark areas will appear between the light source modules, resulting in poor uniformity and causing poor visual experience. Although the above problems can be improved by reducing the pitch between the light source modules, the number of light source modules must be increased when reducing the pitch, resulting in increased costs.

本揭露提供一種光源模組,包括基板;發光元件,設置於基板之上且發光元件具有發光面;杯殼,設置於基板之上且杯殼具有頂表面,杯殼環繞發光元件設置而形成容置空間,其中發光元件的發光面至基板的垂直距離大於或等於杯殼的頂表面至基板的垂直距離。The present disclosure provides a light source module, including a substrate; a light-emitting element, which is arranged on the substrate and has a light-emitting surface; a cup shell, which is arranged on the substrate and has a top surface, and the cup shell is arranged around the light-emitting element to form a containing space, wherein the vertical distance from the light-emitting surface of the light-emitting element to the substrate is greater than or equal to the vertical distance from the top surface of the cup shell to the substrate.

以下的揭示內容提供許多不同的實施例或範例,以展示本揭露實施例的不同部件。以下將揭示本說明書各部件及其排列方式之特定範例,用以簡化本揭露敘述。當然,這些特定範例並非用於限定本揭露。例如,若是本說明書以下的發明內容敘述了將形成第一部件於第二部件之上或上方,即表示其包括了所形成之第一及第二部件是直接接觸的實施例,亦包括了尚可將附加的部件形成於上述第一及第二部件之間,則第一及第二部件為未直接接觸的實施例。此外,本揭露說明中的各式範例可能使用重複的參照符號及/或用字。這些重複符號或用字的目的在於簡化與清晰,並非用以限定各式實施例及/或所述配置之間的關係。The following disclosure provides many different embodiments or examples to show the different components of the disclosed embodiments. The following will disclose specific examples of the various components of this specification and their arrangement to simplify the disclosure. Of course, these specific examples are not intended to limit the disclosure. For example, if the following invention in this specification describes forming a first component on or above a second component, it means that it includes an embodiment in which the first and second components formed are in direct contact, and also includes an embodiment in which an additional component can be formed between the first and second components, and the first and second components are not in direct contact. In addition, the various examples in the disclosure may use repeated reference symbols and/or words. The purpose of these repeated symbols or words is to simplify and clarify, and is not intended to limit the relationship between the various embodiments and/or the configurations.

此外,其中可能用到與空間相關用詞,例如「在… 之下」、「在… 的下方」、「下」、「在… 之上」、「在… 的上方」、「上」及類似的用詞,這些空間相關用詞係為了便於描述圖示中一個(些)元件或特徵部件與另一個(些)元件或特徵部件之間的關係,這些空間相關用詞包括使用中或操作中的裝置之不同方位,以及圖式中所描述的方位。當裝置被轉向不同方位時(例如,旋轉90度或其他方位),則其中所使用的空間相關形容詞也將依轉向後的方位來解釋。In addition, spatially related terms may be used, such as "under", "below", "down", "above", "above", "upper", and similar terms. These spatially related terms are used to facilitate the description of the relationship between one (or some) element or feature and another (or some) element or feature in the diagram. These spatially related terms include different orientations of the device in use or operation, as well as the orientations described in the drawings. When the device is turned to a different orientation (for example, rotated 90 degrees or other orientations), the spatially related adjectives used therein will also be interpreted according to the orientation after the rotation.

在此,「約」、「大約」、「大抵」之用語通常表示在一給定值或範圍的20%之內,較佳是10%之內,且更佳是5%之內,或3%之內,或2%之內,或1%之內,或0.5%之內。應注意的是,說明書中所提供的數量為大約的數量,亦即在沒有特定說明「約」、「大約」、「大抵」的情況下,仍可隱含「約」、「大約」、「大抵」之含義。Here, the terms "about", "approximately", and "generally" generally mean within 20% of a given value or range, preferably within 10%, and more preferably within 5%, or within 3%, or within 2%, or within 1%, or within 0.5%. It should be noted that the quantities provided in the specification are approximate quantities, that is, in the absence of specific description of "about", "approximately", and "generally", the meaning of "about", "approximately", and "generally" can still be implied.

另外,在本揭露的一些實施例中,關於設置、連接之用語例如「設置」、「連接」及其類似用語,除非特別定義,否則可指兩個部件直接接觸,或者亦可指兩個部件並非直接接觸,其中有額外結部件位於此兩個結構之間。關於設置、連接之用語亦可包括兩個結構都可移動,或者兩個結構都固定的情況。In addition, in some embodiments of the present disclosure, terms such as "disposed", "connected" and similar terms, unless otherwise specifically defined, may refer to two components being in direct contact, or may refer to two components not being in direct contact, wherein an additional component is located between the two structures. Terms related to disposition and connection may also include situations where both structures are movable, or both structures are fixed.

參照第1圖,其是現有光源模組結構的中心線剖視圖。如第1圖所示,現有光源模組結構通常包括基板S、設置於基板S上的發光元件L,發光元件L包括發光面P,以及設置於基板S上用於反光的杯殼C。然而,由於現有光源模組結構發光面P低於杯殼C的配置,杯殼C阻擋了發光面P所發出的光線(特別是大角度的光線),因此限制了光源模組的出光角。此外,如第2圖所示,出光角的限制也進一步侷限了光源模組在出光平面PS上所能產生的光斑大小,當光源模組間的節距d1(兩光源模組中心處距離)增加時,更因為各自光斑大小的不足導致光斑間產生暗區D,這樣的光斑不均勻產成了視覺感受不良等問題。Refer to FIG. 1, which is a centerline cross-sectional view of the existing light source module structure. As shown in FIG. 1, the existing light source module structure generally includes a substrate S, a light-emitting element L disposed on the substrate S, the light-emitting element L includes a light-emitting surface P, and a cup shell C disposed on the substrate S for reflection. However, due to the configuration that the light-emitting surface P of the existing light source module structure is lower than the cup shell C, the cup shell C blocks the light emitted by the light-emitting surface P (especially the light at a large angle), thereby limiting the light output angle of the light source module. In addition, as shown in FIG. 2, the limitation of the light output angle further limits the size of the light spot that can be generated by the light source module on the light output plane PS. When the pitch d1 (the distance between the centers of the two light source modules) between the light source modules increases, the insufficient size of each light spot leads to a dark area D between the light spots. Such uneven light spots cause problems such as poor visual experience.

為了解決至少上述的技術問題,本揭露提供一種光源模組,光源模組具有發光元件的發光面高於杯殼的配置。由於本揭露的光源模組其發光面高於或等於杯殼,可以增加光源模組的出光角,在出光平面上形成更大的光斑,如此一來,增加了光源模組的光斑均勻度。本揭露的光源模組具有較大的出光角及優良的均勻度,可以減少光源模組中發光二極體的數量,進而降低製造成本。In order to solve at least the above-mentioned technical problems, the present disclosure provides a light source module, wherein the light source module has a configuration in which the light emitting surface of the light emitting element is higher than the cup shell. Since the light emitting surface of the light source module of the present disclosure is higher than or equal to the cup shell, the light emitting angle of the light source module can be increased, and a larger light spot can be formed on the light emitting plane, thereby increasing the light spot uniformity of the light source module. The light source module of the present disclosure has a larger light emitting angle and excellent uniformity, which can reduce the number of light emitting diodes in the light source module, thereby reducing the manufacturing cost.

請參照第3A圖。第3A圖是根據本揭露一些實施例,繪示出光源模組100的中心線剖視圖。如第3A圖所示,光源模組100可以包括基板101、發光元件102、杯殼103以及導線結構104。上述元件將詳細說明如下。Please refer to FIG. 3A. FIG. 3A is a centerline cross-sectional view of a light source module 100 according to some embodiments of the present disclosure. As shown in FIG. 3A, the light source module 100 may include a substrate 101, a light emitting element 102, a cup 103, and a wire structure 104. The above elements will be described in detail as follows.

在一些實施例中,基板101可以是任何適合的基板。舉例而言,基板101可以是透明基板或不透明基板。在一些實施例中,基板101是軟性基板。在一些實施例中,基板101是剛性基板。舉例而言,基板101的材料可以是樹脂、藍寶石、矽、玻璃、金屬、陶瓷、或其他適合的材料。在一些實施例中,基板101更包括位於基板101上的導電線路層(未繪示)。如此一來,基板101可以透過導電線路層與發光元件102電性連接。In some embodiments, the substrate 101 can be any suitable substrate. For example, the substrate 101 can be a transparent substrate or an opaque substrate. In some embodiments, the substrate 101 is a soft substrate. In some embodiments, the substrate 101 is a rigid substrate. For example, the material of the substrate 101 can be resin, sapphire, silicon, glass, metal, ceramic, or other suitable materials. In some embodiments, the substrate 101 further includes a conductive line layer (not shown) located on the substrate 101. In this way, the substrate 101 can be electrically connected to the light-emitting element 102 through the conductive line layer.

參照第3A圖,發光元件102設置於基板101上方。發光元件102包括發光面102t,其與基板101的頂表面101t之間具有垂直距離h1(以下將其稱為發光面高度h1)。在一些實施例中,發光元件102包括能夠發出特定波長的發光二極體晶片。舉例而言,發光元件102可以包括發出藍光的發光二極體晶片或發出紫外光的發光二極體晶片。Referring to FIG. 3A , the light emitting element 102 is disposed above the substrate 101. The light emitting element 102 includes a light emitting surface 102t, which has a vertical distance h1 (hereinafter referred to as the light emitting surface height h1) from the top surface 101t of the substrate 101. In some embodiments, the light emitting element 102 includes a light emitting diode chip capable of emitting a specific wavelength. For example, the light emitting element 102 may include a light emitting diode chip that emits blue light or a light emitting diode chip that emits ultraviolet light.

參照第3A圖,杯殼103環繞發光元件102設置而形成一容置空間。在一些實施例中,杯殼103可為任何適合的反射材料。舉例而言,杯殼103的材料可包括熱固型材料,例如環氧樹脂模封材料(Epoxy Molding Compound, EMC)、矽氧樹脂模封材料(Silicone Molding Compound, SMC);熱塑型材料,例如聚鄰苯二甲醯胺(Polyphthalamide, PPA)、聚對苯二甲酸1,4-環己烷二甲醇酯(Poly(1,4-cyclohexylene dimethylene terephthalate), PCT)及其他合適的材料。在一些實施例中,杯殼103之材料的透光率可介於15%~50%之間,例如10%~45%。在一些實施例中,杯殼103為半透光材料。Referring to FIG. 3A , the cup shell 103 is disposed around the light-emitting element 102 to form a containing space. In some embodiments, the cup shell 103 may be any suitable reflective material. For example, the material of the cup shell 103 may include thermosetting materials, such as epoxy molding compound (EMC), silicone molding compound (SMC); thermoplastic materials, such as polyphthalamide (PPA), poly(1,4-cyclohexylene dimethylene terephthalate), PCT, and other suitable materials. In some embodiments, the light transmittance of the material of the cup shell 103 may be between 15% and 50%, for example, 10% to 45%. In some embodiments, the cup shell 103 is made of semi-transparent material.

繼續參照第3A圖,杯殼103的頂表面103t至基板101的頂表面101t之間具有垂直距離h2(亦即,杯殼高度h2)。在一些實施例中,發光面高度h1大於杯殼高度h2。同樣地,相較於第1圖的結構中杯殼高於發光面的配置(如第1圖所示),本揭露一些實施例中發光面高於杯殼的配置能減少杯殼對光線(特別是大角度光線)的吸收,使光線能以更大角度射出,增加了光源模組在出光平面上的光斑,改善了光源模組的出光均勻度。具體而言,在一些實施例中,發光面高度h1與杯殼高度h2的比例h1/h2介於1~1.66,例如1~1.33。舉例來說,在一些實施例中,發光面高度h1可以介於0.15mm~0.25mm之間,並且杯殼高度h2可以介於0.15mm~0.18mm之間。Continuing to refer to FIG. 3A , there is a vertical distance h2 (i.e., the height h2 of the shell) between the top surface 103t of the shell 103 and the top surface 101t of the substrate 101. In some embodiments, the height h1 of the light-emitting surface is greater than the height h2 of the shell. Similarly, compared with the configuration of the shell being higher than the light-emitting surface in the structure of FIG. 1 (as shown in FIG. 1 ), the configuration of the light-emitting surface being higher than the shell in some embodiments of the present disclosure can reduce the absorption of light (especially large-angle light) by the shell, allowing the light to be emitted at a larger angle, increasing the light spot of the light source module on the light-emitting plane, and improving the light-emitting uniformity of the light source module. Specifically, in some embodiments, the ratio of the luminous surface height h1 to the cup shell height h2 is between 1 and 1.66, such as 1 and 1.33. For example, in some embodiments, the luminous surface height h1 may be between 0.15 mm and 0.25 mm, and the cup shell height h2 may be between 0.15 mm and 0.18 mm.

繼續參照第3A圖,杯殼103在基板上具有厚度t1。在一些實施例中,杯殼103的厚度t1可以介於0.15mm~0.20mm之間,例如0.16mm~0.19mm。當杯殼103的厚度t1過大時,可能導致反射增加使光斑縮小;當杯殼103的厚度t1過小時,則可能導致杯殼缺損造成不正常漏光。Continuing with FIG. 3A , the cup shell 103 has a thickness t1 on the substrate. In some embodiments, the thickness t1 of the cup shell 103 may be between 0.15 mm and 0.20 mm, such as 0.16 mm and 0.19 mm. When the thickness t1 of the cup shell 103 is too large, it may cause increased reflection and shrink the light spot; when the thickness t1 of the cup shell 103 is too small, it may cause abnormal light leakage due to the damage of the cup shell.

參照第3A圖,導線結構104設置於基板101之上以將發光元件102連接到基板101上的導電線路層(未繪示)連接基板101與發光元件102。在一些實施例中,導線結構104包括一條或多條導線。在一些實施例中,導線的材料可包含鋁(Al)、銅(Cu)、鎢(W)、其各自之合金、其他適當之導電材料或前述之組合。在一些實施例中,導線結構104的至少一部分與基板上表面101t的垂直距離大於杯殼103的高度h2,也就是說,導線結構104具有較杯殼頂表面103t更遠離基板101的部分。具體而言,在一些實施例中,導線結構104所包括的金屬線具有一弧形結構,弧形結構在基板101上具有最高點P1,最高點P1至基板上表面101t的垂直距離h3大於杯殼103的高度h2。Referring to FIG. 3A , the wire structure 104 is disposed on the substrate 101 to connect the light-emitting element 102 to the conductive line layer (not shown) on the substrate 101 to connect the substrate 101 and the light-emitting element 102. In some embodiments, the wire structure 104 includes one or more wires. In some embodiments, the material of the wire may include aluminum (Al), copper (Cu), tungsten (W), their respective alloys, other appropriate conductive materials, or a combination thereof. In some embodiments, the vertical distance between at least a portion of the wire structure 104 and the upper surface 101t of the substrate is greater than the height h2 of the cup 103, that is, the wire structure 104 has a portion that is farther from the substrate 101 than the cup top surface 103t. Specifically, in some embodiments, the metal wire included in the conductive wire structure 104 has an arc structure. The arc structure has a highest point P1 on the substrate 101 . A vertical distance h3 from the highest point P1 to the substrate upper surface 101 t is greater than a height h2 of the cup 103 .

參照第3A圖,透鏡結構105設置於基板101之上覆蓋發光元件102、杯殼103以及導線結構104。在一些實施例中,可以採用點膠製程,點膠在基板101之上覆蓋發光元件102,形成透鏡結構105。在一些實施例中,透鏡結構105的材料可包括含有矽、碳與氧所組成的有機化合物或其他合適的透明封裝材料,但本揭露不限於此。在一些實施例中,透鏡結構105的材料可以是矽膠(silicone),但本揭露不限於此。在一些實施例中,透鏡結構105的材料可以是矽樹酯,但本揭露不限於此。在一些實施例中,透鏡結構105可以添加三矽氧烷(Trisiloxance),三矽氧烷的濃度介於16%至23%。在一些實施例中,三矽氧烷的濃度可以是16%、17%、18%、19%、20%、21%、22%、23%。在一些實施例中,透鏡結構105可為凸透鏡,然本揭露不限於此。在一些實施例中,透鏡結構105可以是具有弧形曲面的形狀。在一些實施例中,透鏡結構105可以是具有半圓球或半橢圓球的形狀。在一些實施例中,由中心線剖視圖觀察時,透鏡結構105的底部周圍具有一凹槽。在一些實施例中,由頂部觀察時,透鏡結構105的底部周圍具有一環形的凹槽。在一些實施例中,杯殼103容置於透鏡結構105底部周圍的凹槽。在一些實施例中,由頂部觀察時,杯殼103為環形圍繞在基板101。在這樣的實施例中,由中心線剖視圖觀察時,杯殼103在剖視圖中具有梯形形狀,如第3A圖所示。Referring to FIG. 3A , the lens structure 105 is disposed on the substrate 101 to cover the light-emitting element 102, the cup shell 103, and the wire structure 104. In some embodiments, a dispensing process may be used to dispense glue on the substrate 101 to cover the light-emitting element 102 to form the lens structure 105. In some embodiments, the material of the lens structure 105 may include an organic compound composed of silicon, carbon, and oxygen or other suitable transparent packaging materials, but the present disclosure is not limited thereto. In some embodiments, the material of the lens structure 105 may be silicone, but the present disclosure is not limited thereto. In some embodiments, the material of the lens structure 105 may be silicone, but the present disclosure is not limited thereto. In some embodiments, trisiloxane may be added to the lens structure 105, and the concentration of trisiloxane is between 16% and 23%. In some embodiments, the concentration of trisiloxane may be 16%, 17%, 18%, 19%, 20%, 21%, 22%, 23%. In some embodiments, the lens structure 105 may be a convex lens, but the disclosure is not limited thereto. In some embodiments, the lens structure 105 may be in a shape having an arc-shaped surface. In some embodiments, the lens structure 105 may be in a shape having a semi-sphere or a semi-elliptical sphere. In some embodiments, when observed from the centerline cross-sectional view, the bottom of the lens structure 105 has a groove around it. In some embodiments, when viewed from the top, the bottom of the lens structure 105 has an annular groove around it. In some embodiments, the cup 103 is accommodated in the groove around the bottom of the lens structure 105. In some embodiments, when viewed from the top, the cup 103 is annularly surrounding the substrate 101. In such an embodiment, when viewed from the centerline cross-sectional view, the cup 103 has a trapezoidal shape in the cross-sectional view, as shown in FIG. 3A.

如第3A圖所示,在一些實施例中,透鏡結構105高於杯殼頂表面103t的部分具有一厚度t2。在一些實施例中,杯殼高度h2與厚度t2的比例(h2/t2)介於1:3~1:5之間。在一些實施例中,杯殼高度h2與厚度t2的比例(h2/t2)介於1:4~1:4.5之間。當杯殼103的高度h2與透鏡結構105的厚度t2的比例(h2/t2)過大時(例如,大於1:2)將會使得光源模組在出光平面上的光斑無法發散;當h2/t2過小時(例如,小於1:6),則會得光斑在出光平面上的圖案變形(例如,由圓形變為正方形)。具體而言,在一些實施例中,杯殼103的高度h2可以介於0.13mm~0.15mm並且透鏡結構105的厚度t2可以介於0.68mm~0.88mm。由第3A圖的光源模組100的中心線剖視圖,杯殼103的側表面與透鏡結構105的側表面為非連續,並且具有一傾斜夾角(未繪示)。As shown in FIG. 3A , in some embodiments, the portion of the lens structure 105 that is higher than the top surface 103t of the shell has a thickness t2. In some embodiments, the ratio of the shell height h2 to the thickness t2 (h2/t2) is between 1:3 and 1:5. In some embodiments, the ratio of the shell height h2 to the thickness t2 (h2/t2) is between 1:4 and 1:4.5. When the ratio of the shell height h2 to the thickness t2 of the lens structure 105 (h2/t2) is too large (e.g., greater than 1:2), the light spot of the light source module on the light emitting plane will not be able to diverge; when h2/t2 is too small (e.g., less than 1:6), the pattern of the light spot on the light emitting plane will be deformed (e.g., from a circle to a square). Specifically, in some embodiments, the height h2 of the cup shell 103 may be between 0.13 mm and 0.15 mm and the thickness t2 of the lens structure 105 may be between 0.68 mm and 0.88 mm. From the centerline cross-sectional view of the light source module 100 in FIG. 3A , the side surface of the cup shell 103 and the side surface of the lens structure 105 are discontinuous and have a tilt angle (not shown).

第3B圖是根據本揭露另一些實施例,繪示出光源模組200的中心線剖視圖。在第3B圖的實施例中,除了發光面102t的高度與杯殼頂表面103t的高度相同之外,其餘部分與第3A圖所出示的皆相同,在此為了簡潔而省略其描述。相較於習知結構中杯殼高於發光面的配置(例如,如第1圖所示),在本揭露如第3B圖所示的一些實施例中,藉由將發光面102t的高度設置為與杯殼頂表面103t的高度相同,也仍能減少杯殼對光線的吸收或反射並以此增加光源模組的出光角。在一些實施例中,杯殼103的折射率(n值)可介於1.53~1.56之間。在一些實施例中,杯殼103的折射率可以是1.53、1.54、1.55或1.56。在一些實施例中,透鏡結構105的折射率可介於1.45~1.56之間。在一些實施例中,透鏡結構105的折射率可以是1.45、1.46、1.47、1.48、1.49、1.50、1.51、1.52、1.53、1.54、1.55或1.56。FIG. 3B is a centerline cross-sectional view of the light source module 200 according to other embodiments of the present disclosure. In the embodiment of FIG. 3B, except that the height of the light-emitting surface 102t is the same as the height of the top surface 103t of the shell, the rest is the same as that shown in FIG. 3A, and its description is omitted here for the sake of brevity. Compared with the configuration in the known structure where the shell is higher than the light-emitting surface (for example, as shown in FIG. 1), in some embodiments of the present disclosure as shown in FIG. 3B, by setting the height of the light-emitting surface 102t to be the same as the height of the top surface 103t of the shell, the absorption or reflection of light by the shell can still be reduced and the light output angle of the light source module can be increased. In some embodiments, the refractive index (n value) of the shell 103 can be between 1.53 and 1.56. In some embodiments, the refractive index of the shell 103 may be 1.53, 1.54, 1.55, or 1.56. In some embodiments, the refractive index of the lens structure 105 may be between 1.45 and 1.56. In some embodiments, the refractive index of the lens structure 105 may be 1.45, 1.46, 1.47, 1.48, 1.49, 1.50, 1.51, 1.52, 1.53, 1.54, 1.55, or 1.56.

藉由杯殼103的折射率與透鏡結構105的折射率的調整,可以進一步調整光源模組的出光角。在一些實施例中,杯殼103為半透光材料,可以採用透鏡結構105的折射率小於杯殼103的折射率的設計,可以進一步增加光源模組的出光角,例如採用透鏡結構105的折射率為1.50與杯殼103的折射率為1.53。例如採用透鏡結構105的折射率為1.53與杯殼103的折射率為1.56。By adjusting the refractive index of the shell 103 and the refractive index of the lens structure 105, the light output angle of the light source module can be further adjusted. In some embodiments, the shell 103 is a semi-transparent material, and the refractive index of the lens structure 105 can be designed to be less than the refractive index of the shell 103, which can further increase the light output angle of the light source module, for example, the refractive index of the lens structure 105 is 1.50 and the refractive index of the shell 103 is 1.53. For example, the refractive index of the lens structure 105 is 1.53 and the refractive index of the shell 103 is 1.56.

第4圖是本揭露一些實施例的光源模組在出光平面的投影的示意圖。如第4圖所示,由於本揭露一些實施例中發光面高於杯殼或齊平於杯殼的配置,減少了杯殼對光線的吸收或反射而增加了光源模組的出光角,在出光平面PS上能夠產生比現有(採用發光面低於杯殼配置)的光源模組更大的光斑。如此一來,本揭露的光源模組較大的光斑能夠改善現有結構因光斑大小不足而在出光平面上無法重疊所導致的暗區(如第4圖中a所示)。除此之外,本揭露的光源模組在出光平面上不產生暗區的前提下,能夠以比現有的光源模組更大的節距配置(例如,d 2>d 1),因此可以減少光源模組的使用量,降低了生產成本。 FIG. 4 is a schematic diagram of the projection of the light source module of some embodiments of the present disclosure on the light-emitting plane. As shown in FIG. 4, due to the configuration of the light-emitting surface being higher than or flush with the cup shell in some embodiments of the present disclosure, the absorption or reflection of light by the cup shell is reduced, thereby increasing the light-emitting angle of the light source module, and a larger light spot can be generated on the light-emitting plane PS than the existing light source module (adopting the configuration of the light-emitting surface being lower than the cup shell). In this way, the larger light spot of the light source module of the present disclosure can improve the dark area caused by the inability to overlap on the light-emitting plane due to insufficient light spot size in the existing structure (as shown in a in FIG. 4). In addition, the light source module disclosed herein can be configured with a larger pitch (eg, d 2 > d 1 ) than existing light source modules without generating dark areas on the light emitting plane, thereby reducing the usage of light source modules and lowering production costs.

現在,將以下方表1、表2的光學模擬結果說明降低杯殼高度對光斑大小的影響。表1係實驗例1、實驗例2的給定條件。表2係實驗例1、實驗例2在出光平面上不同光斑亮度的面積的模擬結果。此處所指「杯高」為以基板上表面為準的杯殼高度(即,如第3A圖所示的杯殼103的高度h2)、「膠高」為透鏡結構超過杯殼的高度(即,如第3A圖所示的透鏡結構105的厚度t2)。此處將光斑在出光平面上最亮處(中心點)的亮度定為100%亮度,其餘處的亮度皆以中心最亮處的亮度為比較基準。Now, the effect of reducing the cup shell height on the spot size is explained by the optical simulation results in Tables 1 and 2 below. Table 1 shows the given conditions of Experimental Examples 1 and 2. Table 2 shows the simulation results of the areas of different spot brightness on the light-emitting plane in Experimental Examples 1 and 2. The "cup height" referred to here is the cup shell height based on the upper surface of the substrate (i.e., the height h2 of the cup shell 103 as shown in FIG. 3A), and the "glue height" is the height of the lens structure exceeding the cup shell (i.e., the thickness t2 of the lens structure 105 as shown in FIG. 3A). Here, the brightness of the brightest point (center point) of the light spot on the light-emitting plane is set as 100% brightness, and the brightness of the rest is based on the brightness of the brightest point in the center as a comparison standard.

如表2的結果所示,相較於使用較高杯殼(0.4mm)配置的光源模組,採用較低杯殼(0.2mm)配置的光源模組在不同亮度之下的面積都能有所增加。As shown in Table 2, compared with the light source module with a higher cup size (0.4 mm), the light source module with a lower cup size (0.2 mm) can increase the area at different brightness levels.

表1 實驗例1 實驗例2 杯高(mm) 0.4 0.2 膠高(mm) 0.7 0.9 Table 1 Experimental Example 1 Experimental Example 2 Cup height (mm) 0.4 0.2 Rubber height(mm) 0.7 0.9

表2 亮度             面積(mm 2) 實驗例1 實驗例2 90% 4.60 5.00 50% 12.3 12.7 10% 28.5 30.0 Table 2 Brightness Area(mm 2 ) Experimental Example 1 Experimental Example 2 90% 4.60 5.00 50% 12.3 12.7 10% 28.5 30.0

現在,將以下方表3、表4說明以CCD(Charge Coupled Device)圖像感測器實際觀察不同杯殼高度的光源模組在出光平面上的光斑亮度分佈結果。表3係實驗例3~實驗例7的給定條件。表4係實驗例3~實驗例7在出光平面上不同光斑亮度的面積的觀測結果。此處所指「杯高」、「膠高」定義皆與前述模擬所用相同,在此不予贅述。此處將光斑在出光平面上最亮處(中心點)的亮度定為100%亮度,其餘處的亮度皆以最亮處的亮度為比較基準。Now, the following Tables 3 and 4 illustrate the actual observation results of the spot brightness distribution on the light-emitting plane of the light source module with different cup shell heights using a CCD (Charge Coupled Device) image sensor. Table 3 is the given conditions of Experimental Examples 3 to 7. Table 4 is the observation result of the area of different spot brightness on the light-emitting plane in Experimental Examples 3 to 7. The definitions of "cup height" and "glue height" referred to here are the same as those used in the above simulation and will not be elaborated here. Here, the brightness of the brightest spot (center point) on the light-emitting plane is set as 100% brightness, and the brightness of the rest is compared with the brightness of the brightest point.

如表4的結果所示。相較於發光面低於杯殼的組別,發光面高於杯殼的組別在相同光源強度的條件下所有亮度的面積均能有所提升。除此之外,在相同光源強度的條件下,發光面高於杯殼的組別單位面積亮度也顯著地小於發光面低於杯殼的組別,表示發光面高於杯殼的配置能更有效地將光分散至更大的面積,因此在相同的光源強度之下具有更低的單位面積亮度。As shown in the results in Table 4, compared with the group with the luminous surface lower than the shell, the group with the luminous surface higher than the shell can improve all the brightness areas under the same light intensity. In addition, under the same light intensity, the unit area brightness of the group with the luminous surface higher than the shell is also significantly lower than that of the group with the luminous surface lower than the shell, indicating that the configuration with the luminous surface higher than the shell can more effectively disperse light to a larger area, and therefore has a lower unit area brightness under the same light intensity.

表3 實驗例3 實驗例4 實驗例5 實驗例6 實驗例7 杯高(mm) 0.45 0.45 0.15 0.15 0.15 膠高(mm) 0.68 0.67 0.76 0.82 0.87 發光面高度(mm) 0.16 0.16 0.16 0.16 0.16 Table 3 Experimental Example 3 Experimental Example 4 Experimental Example 5 Experimental Example 6 Experimental Example 7 Cup height (mm) 0.45 0.45 0.15 0.15 0.15 Rubber height(mm) 0.68 0.67 0.76 0.82 0.87 Light emitting surface height (mm) 0.16 0.16 0.16 0.16 0.16

表4 亮度             面積(mm 2) 實驗例3 實驗例4 實驗例5 實驗例6 實驗例7 90% 11.93 14.14 14.49 15.83 16.83 60% 24.37 26.04 27.19 29.43 30.03 50% 28.52 30.03 31.17 33.51 34.11 40% 32.79 34.61 35.85 38.09 38.89 10% 60.83 62.40 65.73 67.97 68.72 單位面積亮度(cd/m 2) 424.45 416.60 340.73 318.50 317.84 Table 4 Brightness Area(mm 2 ) Experimental Example 3 Experimental Example 4 Experimental Example 5 Experimental Example 6 Experimental Example 7 90% 11.93 14.14 14.49 15.83 16.83 60% 24.37 26.04 27.19 29.43 30.03 50% 28.52 30.03 31.17 33.51 34.11 40% 32.79 34.61 35.85 38.09 38.89 10% 60.83 62.40 65.73 67.97 68.72 Brightness per unit area (cd/m 2 ) 424.45 416.60 340.73 318.50 317.84

第5圖是根據本揭露一實施例的光源模組應用於背光模組的的示意圖。如第5圖所示,在一些實施例中,背光模組可以包括光源模組(例如光源模組100)、承載基板201、擴散板202、以及光色轉換結構203。第5圖僅為舉例說明,本揭露的光源模組亦可以應用於所屬技術領域中具有通常知識者所熟知的各種背光模組中。FIG. 5 is a schematic diagram of a light source module according to an embodiment of the present disclosure being applied to a backlight module. As shown in FIG. 5, in some embodiments, the backlight module may include a light source module (e.g., light source module 100), a carrier substrate 201, a diffusion plate 202, and a light color conversion structure 203. FIG. 5 is only an example, and the light source module of the present disclosure may also be applied to various backlight modules that are well known to a person of ordinary skill in the art.

如第5圖所示,可以藉由將多個光源模組100排列在承載基板201上形成發光板來提供背光。在一些實施例中,承載基板201可以為印刷電路板(PCB板)或者製作有線路的玻璃、陶瓷、高分子(如聚醯亞胺、聚甲基丙烯酸甲酯)等基板,但本揭露不限於此。在一些實施例中,光源模組100為單色光源。光源模組100可以依照設計需求而採用藍色或其他顏色(例如,紅色、綠色)的光源模組,並且光源模組的數量也可依照實際產品需求進行調整。As shown in FIG. 5 , a plurality of light source modules 100 may be arranged on a carrier substrate 201 to form a light-emitting board to provide backlight. In some embodiments, the carrier substrate 201 may be a printed circuit board (PCB) or a substrate made of glass, ceramic, polymer (such as polyimide, polymethyl methacrylate) or the like with wiring, but the present disclosure is not limited thereto. In some embodiments, the light source module 100 is a monochromatic light source. The light source module 100 may adopt a blue or other color (for example, red, green) light source module according to design requirements, and the number of light source modules may also be adjusted according to actual product requirements.

如第5圖所示,可以在發光板的上方進一步設置光擴散結構202。光擴散結構202可藉由將發光板所發出的光線進行折射、反射來改善光線分布的均勻性。在一些實施例中,光擴散結構202可以根據設計需求為單層或多層結構。舉例而言,光擴散結構202可以包括粒子性擴散板及/或帶有微結構的擴散膜(未繪示),但本揭露不限於此。As shown in FIG. 5 , a light diffusion structure 202 may be further disposed above the light emitting plate. The light diffusion structure 202 may improve the uniformity of light distribution by refracting and reflecting the light emitted by the light emitting plate. In some embodiments, the light diffusion structure 202 may be a single-layer or multi-layer structure according to design requirements. For example, the light diffusion structure 202 may include a particle diffusion plate and/or a diffusion film with a microstructure (not shown), but the present disclosure is not limited thereto.

如第5圖所示,可以在發光板的上方進一步設置光色轉換結構203。光色轉換結構203包括不同顏色的光轉換材料以將光源模組100所發出的光線轉換為不同顏色。舉例而言,在光源模組100為藍光光源的一些實施例中,光色轉換結構203可以包括紅色光轉換材料與綠色光轉換材料,其中紅色光轉換材料與綠色光轉換材料可以分別吸收光源模組100所發出的部分藍光並分別將其轉換為紅光與綠光,所轉換的紅光、綠光與部分藍光混合成白光。在一些實施例,光色轉換結構203可以是量子點膜。在一些實施例,光色轉換結構203可以是黃色量子點膜。在一些實施例,光色轉換結構203可以是紅色與綠色量子點膜。在一些實施例,光色轉換結構203可以包括紅色量子點與綠色量子點。As shown in FIG. 5 , a light color conversion structure 203 may be further provided above the light emitting plate. The light color conversion structure 203 includes light conversion materials of different colors to convert the light emitted by the light source module 100 into different colors. For example, in some embodiments where the light source module 100 is a blue light source, the light color conversion structure 203 may include a red light conversion material and a green light conversion material, wherein the red light conversion material and the green light conversion material may absorb part of the blue light emitted by the light source module 100 and convert it into red light and green light respectively, and the converted red light, green light and part of the blue light are mixed into white light. In some embodiments, the light color conversion structure 203 may be a quantum dot film. In some embodiments, the light color conversion structure 203 may be a yellow quantum dot film. In some embodiments, the light color conversion structure 203 may be a red and green quantum dot film. In some embodiments, the light color conversion structure 203 may include red quantum dots and green quantum dots.

在一些實施例中,黃色光轉換材料可包括黃色量子點或黃色螢光粉。舉例而言,黃色光轉換材料可包括釔鋁石榴石(YAG)螢光粉。在一些實施例中,上述紅色光轉換材料可為紅色量子點,或紅色螢光粉,例如(Sr,Ca)AlSiN 3:Eu 2+、Ca 2Si 5N 8:Eu 2+、Sr(LiAl 3N 4):Eu 2+、錳摻雜紅色氟化物螢光粉(例如,K 2GeF 6:Mn 4+、K 2SiF 6:Mn 4+、K 2TiF 6:Mn 4+)等,但本揭露不限於此。在一些實施例中,上述綠色光轉換材料可為綠色量子點或綠色螢光粉,例如鎦鋁石榴石(LuAG)螢光粉、釔鋁石榴石(YAG)螢光粉、賽隆(β-SiAlON)螢光粉、矽酸鹽(Silicate)螢光粉,但本揭露不限於此。在一些實施例,光色轉換結構203可以是黃色螢光粉。舉例而言,黃色螢光粉可為釔鋁石榴石(YAG)螢光粉。在一些實施例,光色轉換結構203可以包括綠色螢光粉與紅色螢光粉。舉例而言,光色轉換結構203可包括綠色賽隆螢光粉及紅色K 2SiF 6:Mn 4+。在一些實施例中,光色轉換結構203可包括綠色螢光粉及兩種紅色螢光粉的組合,舉例而言,光色轉換結構203可包括綠色賽隆螢光粉、紅色K 2SiF 6:Mn 4+與紅色(Sr,Ca)AlSiN 3:Eu 2+In some embodiments, the yellow light conversion material may include yellow quantum dots or yellow fluorescent powder. For example, the yellow light conversion material may include yttrium aluminum garnet (YAG) fluorescent powder. In some embodiments, the red light conversion material may be red quantum dots or red fluorescent powder, such as (Sr,Ca)AlSiN 3 :Eu 2+ , Ca 2 Si 5 N 8 :Eu 2+ , Sr(LiAl 3 N 4 ):Eu 2+ , manganese-doped red fluoride fluorescent powder (e.g., K 2 GeF 6 :Mn 4+ , K 2 SiF 6 :Mn 4+ , K 2 TiF 6 :Mn 4+ ), etc., but the present disclosure is not limited thereto. In some embodiments, the green light conversion material may be green quantum dots or green fluorescent powder, such as LuAG fluorescent powder, YAG fluorescent powder, β-SiAlON fluorescent powder, silicate fluorescent powder, but the present disclosure is not limited thereto. In some embodiments, the light color conversion structure 203 may be yellow fluorescent powder. For example, the yellow fluorescent powder may be YAG fluorescent powder. In some embodiments, the light color conversion structure 203 may include green fluorescent powder and red fluorescent powder. For example, the light color conversion structure 203 may include green SiAlON fluorescent powder and red K 2 SiF 6 :Mn 4+ . In some embodiments, the light color conversion structure 203 may include a green phosphor and a combination of two red phosphors. For example, the light color conversion structure 203 may include green SiAlON phosphor, red K 2 SiF 6 :Mn 4+ and red (Sr,Ca)AlSiN 3 :Eu 2+ .

綜上所述,本揭露提供一種光源模組,可應用於顯示器的背光、多種發光裝置等。相較於現有結構發光面低於杯殼的配置,本揭露提供的光源模組採用發光面高於杯殼的設置,減少了封裝材料層或杯殼對光源所發出光線的反射或吸收而有效增加光源模組的出光角,如此一來,擴大了光源模組在出光平面上產生的光斑,並且在光源模組間節距較大時減少出光平面上連續光斑亮度的不均勻。除此之外,本揭露提供的光源模組也可以減少發光二極體的使用量,進而降低製造成本。In summary, the present disclosure provides a light source module that can be applied to the backlight of a display, a variety of light-emitting devices, etc. Compared with the configuration of the existing structure in which the light-emitting surface is lower than the cup shell, the light source module provided by the present disclosure adopts a configuration in which the light-emitting surface is higher than the cup shell, which reduces the reflection or absorption of the light emitted by the light source by the packaging material layer or the cup shell and effectively increases the light output angle of the light source module. In this way, the light spot generated by the light source module on the light output plane is enlarged, and when the pitch between the light source modules is larger, the uneven brightness of the continuous light spots on the light output plane is reduced. In addition, the light source module provided by the present disclosure can also reduce the use of light-emitting diodes, thereby reducing the manufacturing cost.

雖然本揭露已以具體之較佳實施例揭露如上,然其並非用以限定本揭露,任何熟習此項技術者,在不脫離本揭露之精神和範圍內,仍可作些許的更動與潤飾,因此本揭露之保護範圍當視後附之申請專利範圍所界定者為準。Although the present disclosure has been disclosed as above with specific preferred embodiments, it is not intended to limit the present disclosure. Anyone skilled in the art may make slight changes and modifications without departing from the spirit and scope of the present disclosure. Therefore, the protection scope of the present disclosure shall be subject to the scope defined by the attached patent application.

100:光源模組 101:基板 101t:基板上表面 102:發光元件 102t:發光面 103:杯殼 103t:杯殼上表面 104:導線結構 105:透鏡結構 200:光源模組 201:承載基板 202:擴散板 203:光色轉換結構 h1:距離 h2:距離 h3:距離 t1:厚度 t2:厚度 P1:最高點 S:基板 L:發光元件 P:發光面 C:杯殼 d1:節距 d2:節距 PS:出光平面 D:區域 a:區域 100: light source module 101: substrate 101t: upper surface of substrate 102: light emitting element 102t: light emitting surface 103: cup shell 103t: upper surface of cup shell 104: wire structure 105: lens structure 200: light source module 201: carrier substrate 202: diffusion plate 203: light color conversion structure h1: distance h2: distance h3: distance t1: thickness t2: thickness P1: highest point S: substrate L: light emitting element P: light emitting surface C: cup shell d1: pitch d2: pitch PS: light emitting plane D: area a: area

以下將配合所附圖式詳述本發明實施例。應注意的是,依據在業界的標準做法,各種特徵並未按照比例繪製且僅用以說明例示。事實上,可任意地放大或縮小元件的尺寸,以清楚地表現出本發明實施例的特徵。 第1圖是現有光源模組結構的中心線剖視圖。 第2圖是現有光源模組結構在出光平面上的投影的示意圖。 第3A圖是根據本揭露一些實施例之光源模組100的中心線剖視圖。 第3B圖是根據本揭露另一些實施例之光源模組200的中心線剖視圖。 第4圖是根據本揭露一些實施例之光源模組在出光平面上的投影的示意圖。 第5圖是根據本揭露的一實施例例示了光源模組應用於背光模組的一些實施例的示意圖。 The following will be described in detail with the accompanying drawings. It should be noted that, according to standard practices in the industry, various features are not drawn to scale and are only used for illustration. In fact, the size of the components can be arbitrarily enlarged or reduced to clearly show the features of the embodiments of the present invention. Figure 1 is a centerline cross-sectional view of the existing light source module structure. Figure 2 is a schematic diagram of the projection of the existing light source module structure on the light output plane. Figure 3A is a centerline cross-sectional view of the light source module 100 according to some embodiments of the present disclosure. Figure 3B is a centerline cross-sectional view of the light source module 200 according to other embodiments of the present disclosure. Figure 4 is a schematic diagram of the projection of the light source module on the light output plane according to some embodiments of the present disclosure. Figure 5 is a schematic diagram illustrating some embodiments of the light source module being applied to the backlight module according to an embodiment of the present disclosure.

100:光源模組 101:基板 101t:基板上表面 102:發光元件 102t:發光面 103:杯殼 103t:杯殼上表面 104: 導線結構 105: 透鏡結構 h1:距離 h2:距離 h3:距離 t1:厚度 t2:厚度 P1:最高點 100: Light source module 101: Substrate 101t: Substrate upper surface 102: Light-emitting element 102t: Light-emitting surface 103: Shell 103t: Shell upper surface 104: Wire structure 105: Lens structure h1: Distance h2: Distance h3: Distance t1: Thickness t2: Thickness P1: Highest point

Claims (10)

一種光源模組,包括: 一基板; 一發光元件,設置於該基板之上且該發光元件具有一發光面; 一杯殼,設置於該基板之上且杯殼具有一頂表面,該杯殼環繞該發光元件設置而形成一容置空間,其中該發光元件的該發光面至該基板的垂直距離大於或等於該杯殼的該頂表面至該基板的垂直距離;以及 一透鏡結構,設置於該基板之上並覆蓋該發光元件以及該杯殼,其中該透鏡結構的折射率小於該杯殼的折射率,並且在一剖視圖中,該杯殼具有一梯形形狀,並且其中該杯殼的側表面與該透鏡結構的側表面為非連續,並且具有一傾斜夾角。 A light source module comprises: a substrate; a light-emitting element disposed on the substrate and having a light-emitting surface; a cup shell disposed on the substrate and having a top surface, the cup shell being disposed around the light-emitting element to form a containing space, wherein the vertical distance from the light-emitting surface of the light-emitting element to the substrate is greater than or equal to the vertical distance from the top surface of the cup shell to the substrate; and A lens structure is disposed on the substrate and covers the light-emitting element and the cup shell, wherein the refractive index of the lens structure is less than the refractive index of the cup shell, and in a cross-sectional view, the cup shell has a trapezoidal shape, and wherein the side surface of the cup shell is discontinuous with the side surface of the lens structure and has a tilt angle. 如請求項1之光源模組,更包括一導線結構,設置於該基板之上,該導線結構連接該基板與該發光元件,其中該導線結構的至少一部份較該杯殼的該頂表面更遠離該基板。The light source module of claim 1 further includes a wire structure disposed on the substrate, the wire structure connecting the substrate and the light-emitting element, wherein at least a portion of the wire structure is farther away from the substrate than the top surface of the cup shell. 如請求項2之光源模組,其中該導線結構包括至少一金屬導線,該金屬導線具有一弧形結構,其中該弧形結構在該基板之上的一最高點至該基板的垂直距離大於該杯殼的該頂表面至該基板的垂直距離。A light source module as claimed in claim 2, wherein the wire structure includes at least one metal wire, the metal wire has an arc structure, wherein the vertical distance from a highest point of the arc structure on the substrate to the substrate is greater than the vertical distance from the top surface of the cup shell to the substrate. 如請求項1之光源模組,其中該杯殼的折射率介於1.53~1.56之間並且該透鏡結構的折射率介於1.45~1.56之間。A light source module as claimed in claim 1, wherein the refractive index of the cup shell is between 1.53 and 1.56 and the refractive index of the lens structure is between 1.45 and 1.56. 如請求項1之光源模組,其中該透鏡結構包括一凸透鏡,該凸透鏡在該基板之上的厚度與該杯殼在該基板之上的高度的比例介於1:3~1:5之間。A light source module as claimed in claim 1, wherein the lens structure comprises a convex lens, and the ratio of the thickness of the convex lens on the substrate to the height of the cup shell on the substrate is between 1:3 and 1:5. 如請求項5之光源模組,其中該凸透鏡在該基板之上的厚度與該杯殼在該基板之上的高度的比例介於1:4~1:4.5之間。A light source module as claimed in claim 5, wherein the ratio of the thickness of the convex lens on the substrate to the height of the cup shell on the substrate is between 1:4 and 1:4.5. 如請求項1之光源模組,其中該透鏡結構的厚度介於0.68mm~0.88mm之間。As in claim 1, the light source module, wherein the thickness of the lens structure is between 0.68 mm and 0.88 mm. 如請求項1之光源模組,其中該杯殼的高度介於0.13mm~0.15mm之間。As in claim 1, the light source module, wherein the height of the cup shell is between 0.13 mm and 0.15 mm. 如請求項1之光源模組,其中該杯殼之材料的透光率介於15%~50%之間。As in claim 1, the light source module, wherein the light transmittance of the material of the cup shell is between 15% and 50%. 如請求項1之光源模組,其中該杯殼的厚度介於0.15mm~0.20mm之間。As in claim 1, the light source module, wherein the thickness of the cup shell is between 0.15 mm and 0.20 mm.
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