TWI882499B - Light source module - Google Patents
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Abstract
Description
本揭露係有關於一種發光元件,且特別係有關於一種光源模組。The present disclosure relates to a light emitting element, and more particularly to a light source module.
發光二極體(Light-Emitting Diode,LED)由於體積小、亮度高、耗能低等優點,近年來已逐漸取代傳統光源。發光二極體目前已廣泛的應用於背光模組中以作為發光元件。Light-emitting diodes (LEDs) have gradually replaced traditional light sources in recent years due to their small size, high brightness, and low energy consumption. LEDs are currently widely used in backlight modules as light-emitting components.
在現有的背光模組設計中,包括安裝於電路板上具有發光元件、反光杯殼及基板等元件的多個光源模組,而現有技術較高的杯殼設計往往限制了光源模組的出光角,進而限制了光源模組在出光平面上的光斑大小。除此之外,當光源模組之間的節距過大時,將導致光源模組間出現暗區而產生均勻度不佳的問題,造成不良的視覺感受。雖然可以藉由縮小光源模組間的節距改善上述問題,但縮小節距的同時必須增加光源模組的數量,導致成本上升。In the existing backlight module design, multiple light source modules with light-emitting elements, reflective cup shells and substrates are installed on the circuit board. The cup shell design with higher technology often limits the light output angle of the light source module, thereby limiting the spot size of the light source module on the light output plane. In addition, when the pitch between the light source modules is too large, dark areas will appear between the light source modules, resulting in poor uniformity and causing poor visual experience. Although the above problems can be improved by reducing the pitch between the light source modules, the number of light source modules must be increased when reducing the pitch, resulting in increased costs.
本揭露提供一種光源模組,包括基板;發光元件,設置於基板之上且發光元件具有發光面;杯殼,設置於基板之上且杯殼具有頂表面,杯殼環繞發光元件設置而形成容置空間,其中發光元件的發光面至基板的垂直距離大於或等於杯殼的頂表面至基板的垂直距離。The present disclosure provides a light source module, including a substrate; a light-emitting element, which is arranged on the substrate and has a light-emitting surface; a cup shell, which is arranged on the substrate and has a top surface, and the cup shell is arranged around the light-emitting element to form a containing space, wherein the vertical distance from the light-emitting surface of the light-emitting element to the substrate is greater than or equal to the vertical distance from the top surface of the cup shell to the substrate.
以下的揭示內容提供許多不同的實施例或範例,以展示本揭露實施例的不同部件。以下將揭示本說明書各部件及其排列方式之特定範例,用以簡化本揭露敘述。當然,這些特定範例並非用於限定本揭露。例如,若是本說明書以下的發明內容敘述了將形成第一部件於第二部件之上或上方,即表示其包括了所形成之第一及第二部件是直接接觸的實施例,亦包括了尚可將附加的部件形成於上述第一及第二部件之間,則第一及第二部件為未直接接觸的實施例。此外,本揭露說明中的各式範例可能使用重複的參照符號及/或用字。這些重複符號或用字的目的在於簡化與清晰,並非用以限定各式實施例及/或所述配置之間的關係。The following disclosure provides many different embodiments or examples to show the different components of the disclosed embodiments. The following will disclose specific examples of the various components of this specification and their arrangement to simplify the disclosure. Of course, these specific examples are not intended to limit the disclosure. For example, if the following invention in this specification describes forming a first component on or above a second component, it means that it includes an embodiment in which the first and second components formed are in direct contact, and also includes an embodiment in which an additional component can be formed between the first and second components, and the first and second components are not in direct contact. In addition, the various examples in the disclosure may use repeated reference symbols and/or words. The purpose of these repeated symbols or words is to simplify and clarify, and is not intended to limit the relationship between the various embodiments and/or the configurations.
此外,其中可能用到與空間相關用詞,例如「在… 之下」、「在… 的下方」、「下」、「在… 之上」、「在… 的上方」、「上」及類似的用詞,這些空間相關用詞係為了便於描述圖示中一個(些)元件或特徵部件與另一個(些)元件或特徵部件之間的關係,這些空間相關用詞包括使用中或操作中的裝置之不同方位,以及圖式中所描述的方位。當裝置被轉向不同方位時(例如,旋轉90度或其他方位),則其中所使用的空間相關形容詞也將依轉向後的方位來解釋。In addition, spatially related terms may be used, such as "under", "below", "down", "above", "above", "upper", and similar terms. These spatially related terms are used to facilitate the description of the relationship between one (or some) element or feature and another (or some) element or feature in the diagram. These spatially related terms include different orientations of the device in use or operation, as well as the orientations described in the drawings. When the device is turned to a different orientation (for example, rotated 90 degrees or other orientations), the spatially related adjectives used therein will also be interpreted according to the orientation after the rotation.
在此,「約」、「大約」、「大抵」之用語通常表示在一給定值或範圍的20%之內,較佳是10%之內,且更佳是5%之內,或3%之內,或2%之內,或1%之內,或0.5%之內。應注意的是,說明書中所提供的數量為大約的數量,亦即在沒有特定說明「約」、「大約」、「大抵」的情況下,仍可隱含「約」、「大約」、「大抵」之含義。Here, the terms "about", "approximately", and "generally" generally mean within 20% of a given value or range, preferably within 10%, and more preferably within 5%, or within 3%, or within 2%, or within 1%, or within 0.5%. It should be noted that the quantities provided in the specification are approximate quantities, that is, in the absence of specific description of "about", "approximately", and "generally", the meaning of "about", "approximately", and "generally" can still be implied.
另外,在本揭露的一些實施例中,關於設置、連接之用語例如「設置」、「連接」及其類似用語,除非特別定義,否則可指兩個部件直接接觸,或者亦可指兩個部件並非直接接觸,其中有額外結部件位於此兩個結構之間。關於設置、連接之用語亦可包括兩個結構都可移動,或者兩個結構都固定的情況。In addition, in some embodiments of the present disclosure, terms such as "disposed", "connected" and similar terms, unless otherwise specifically defined, may refer to two components being in direct contact, or may refer to two components not being in direct contact, wherein an additional component is located between the two structures. Terms related to disposition and connection may also include situations where both structures are movable, or both structures are fixed.
參照第1圖,其是現有光源模組結構的中心線剖視圖。如第1圖所示,現有光源模組結構通常包括基板S、設置於基板S上的發光元件L,發光元件L包括發光面P,以及設置於基板S上用於反光的杯殼C。然而,由於現有光源模組結構發光面P低於杯殼C的配置,杯殼C阻擋了發光面P所發出的光線(特別是大角度的光線),因此限制了光源模組的出光角。此外,如第2圖所示,出光角的限制也進一步侷限了光源模組在出光平面PS上所能產生的光斑大小,當光源模組間的節距d1(兩光源模組中心處距離)增加時,更因為各自光斑大小的不足導致光斑間產生暗區D,這樣的光斑不均勻產成了視覺感受不良等問題。Refer to FIG. 1, which is a centerline cross-sectional view of the existing light source module structure. As shown in FIG. 1, the existing light source module structure generally includes a substrate S, a light-emitting element L disposed on the substrate S, the light-emitting element L includes a light-emitting surface P, and a cup shell C disposed on the substrate S for reflection. However, due to the configuration that the light-emitting surface P of the existing light source module structure is lower than the cup shell C, the cup shell C blocks the light emitted by the light-emitting surface P (especially the light at a large angle), thereby limiting the light output angle of the light source module. In addition, as shown in FIG. 2, the limitation of the light output angle further limits the size of the light spot that can be generated by the light source module on the light output plane PS. When the pitch d1 (the distance between the centers of the two light source modules) between the light source modules increases, the insufficient size of each light spot leads to a dark area D between the light spots. Such uneven light spots cause problems such as poor visual experience.
為了解決至少上述的技術問題,本揭露提供一種光源模組,光源模組具有發光元件的發光面高於杯殼的配置。由於本揭露的光源模組其發光面高於或等於杯殼,可以增加光源模組的出光角,在出光平面上形成更大的光斑,如此一來,增加了光源模組的光斑均勻度。本揭露的光源模組具有較大的出光角及優良的均勻度,可以減少光源模組中發光二極體的數量,進而降低製造成本。In order to solve at least the above-mentioned technical problems, the present disclosure provides a light source module, wherein the light source module has a configuration in which the light emitting surface of the light emitting element is higher than the cup shell. Since the light emitting surface of the light source module of the present disclosure is higher than or equal to the cup shell, the light emitting angle of the light source module can be increased, and a larger light spot can be formed on the light emitting plane, thereby increasing the light spot uniformity of the light source module. The light source module of the present disclosure has a larger light emitting angle and excellent uniformity, which can reduce the number of light emitting diodes in the light source module, thereby reducing the manufacturing cost.
請參照第3A圖。第3A圖是根據本揭露一些實施例,繪示出光源模組100的中心線剖視圖。如第3A圖所示,光源模組100可以包括基板101、發光元件102、杯殼103以及導線結構104。上述元件將詳細說明如下。Please refer to FIG. 3A. FIG. 3A is a centerline cross-sectional view of a
在一些實施例中,基板101可以是任何適合的基板。舉例而言,基板101可以是透明基板或不透明基板。在一些實施例中,基板101是軟性基板。在一些實施例中,基板101是剛性基板。舉例而言,基板101的材料可以是樹脂、藍寶石、矽、玻璃、金屬、陶瓷、或其他適合的材料。在一些實施例中,基板101更包括位於基板101上的導電線路層(未繪示)。如此一來,基板101可以透過導電線路層與發光元件102電性連接。In some embodiments, the
參照第3A圖,發光元件102設置於基板101上方。發光元件102包括發光面102t,其與基板101的頂表面101t之間具有垂直距離h1(以下將其稱為發光面高度h1)。在一些實施例中,發光元件102包括能夠發出特定波長的發光二極體晶片。舉例而言,發光元件102可以包括發出藍光的發光二極體晶片或發出紫外光的發光二極體晶片。Referring to FIG. 3A , the
參照第3A圖,杯殼103環繞發光元件102設置而形成一容置空間。在一些實施例中,杯殼103可為任何適合的反射材料。舉例而言,杯殼103的材料可包括熱固型材料,例如環氧樹脂模封材料(Epoxy Molding Compound, EMC)、矽氧樹脂模封材料(Silicone Molding Compound, SMC);熱塑型材料,例如聚鄰苯二甲醯胺(Polyphthalamide, PPA)、聚對苯二甲酸1,4-環己烷二甲醇酯(Poly(1,4-cyclohexylene dimethylene terephthalate), PCT)及其他合適的材料。在一些實施例中,杯殼103之材料的透光率可介於15%~50%之間,例如10%~45%。在一些實施例中,杯殼103為半透光材料。Referring to FIG. 3A , the
繼續參照第3A圖,杯殼103的頂表面103t至基板101的頂表面101t之間具有垂直距離h2(亦即,杯殼高度h2)。在一些實施例中,發光面高度h1大於杯殼高度h2。同樣地,相較於第1圖的結構中杯殼高於發光面的配置(如第1圖所示),本揭露一些實施例中發光面高於杯殼的配置能減少杯殼對光線(特別是大角度光線)的吸收,使光線能以更大角度射出,增加了光源模組在出光平面上的光斑,改善了光源模組的出光均勻度。具體而言,在一些實施例中,發光面高度h1與杯殼高度h2的比例h1/h2介於1~1.66,例如1~1.33。舉例來說,在一些實施例中,發光面高度h1可以介於0.15mm~0.25mm之間,並且杯殼高度h2可以介於0.15mm~0.18mm之間。Continuing to refer to FIG. 3A , there is a vertical distance h2 (i.e., the height h2 of the shell) between the
繼續參照第3A圖,杯殼103在基板上具有厚度t1。在一些實施例中,杯殼103的厚度t1可以介於0.15mm~0.20mm之間,例如0.16mm~0.19mm。當杯殼103的厚度t1過大時,可能導致反射增加使光斑縮小;當杯殼103的厚度t1過小時,則可能導致杯殼缺損造成不正常漏光。Continuing with FIG. 3A , the
參照第3A圖,導線結構104設置於基板101之上以將發光元件102連接到基板101上的導電線路層(未繪示)連接基板101與發光元件102。在一些實施例中,導線結構104包括一條或多條導線。在一些實施例中,導線的材料可包含鋁(Al)、銅(Cu)、鎢(W)、其各自之合金、其他適當之導電材料或前述之組合。在一些實施例中,導線結構104的至少一部分與基板上表面101t的垂直距離大於杯殼103的高度h2,也就是說,導線結構104具有較杯殼頂表面103t更遠離基板101的部分。具體而言,在一些實施例中,導線結構104所包括的金屬線具有一弧形結構,弧形結構在基板101上具有最高點P1,最高點P1至基板上表面101t的垂直距離h3大於杯殼103的高度h2。Referring to FIG. 3A , the
參照第3A圖,透鏡結構105設置於基板101之上覆蓋發光元件102、杯殼103以及導線結構104。在一些實施例中,可以採用點膠製程,點膠在基板101之上覆蓋發光元件102,形成透鏡結構105。在一些實施例中,透鏡結構105的材料可包括含有矽、碳與氧所組成的有機化合物或其他合適的透明封裝材料,但本揭露不限於此。在一些實施例中,透鏡結構105的材料可以是矽膠(silicone),但本揭露不限於此。在一些實施例中,透鏡結構105的材料可以是矽樹酯,但本揭露不限於此。在一些實施例中,透鏡結構105可以添加三矽氧烷(Trisiloxance),三矽氧烷的濃度介於16%至23%。在一些實施例中,三矽氧烷的濃度可以是16%、17%、18%、19%、20%、21%、22%、23%。在一些實施例中,透鏡結構105可為凸透鏡,然本揭露不限於此。在一些實施例中,透鏡結構105可以是具有弧形曲面的形狀。在一些實施例中,透鏡結構105可以是具有半圓球或半橢圓球的形狀。在一些實施例中,由中心線剖視圖觀察時,透鏡結構105的底部周圍具有一凹槽。在一些實施例中,由頂部觀察時,透鏡結構105的底部周圍具有一環形的凹槽。在一些實施例中,杯殼103容置於透鏡結構105底部周圍的凹槽。在一些實施例中,由頂部觀察時,杯殼103為環形圍繞在基板101。在這樣的實施例中,由中心線剖視圖觀察時,杯殼103在剖視圖中具有梯形形狀,如第3A圖所示。Referring to FIG. 3A , the
如第3A圖所示,在一些實施例中,透鏡結構105高於杯殼頂表面103t的部分具有一厚度t2。在一些實施例中,杯殼高度h2與厚度t2的比例(h2/t2)介於1:3~1:5之間。在一些實施例中,杯殼高度h2與厚度t2的比例(h2/t2)介於1:4~1:4.5之間。當杯殼103的高度h2與透鏡結構105的厚度t2的比例(h2/t2)過大時(例如,大於1:2)將會使得光源模組在出光平面上的光斑無法發散;當h2/t2過小時(例如,小於1:6),則會得光斑在出光平面上的圖案變形(例如,由圓形變為正方形)。具體而言,在一些實施例中,杯殼103的高度h2可以介於0.13mm~0.15mm並且透鏡結構105的厚度t2可以介於0.68mm~0.88mm。由第3A圖的光源模組100的中心線剖視圖,杯殼103的側表面與透鏡結構105的側表面為非連續,並且具有一傾斜夾角(未繪示)。As shown in FIG. 3A , in some embodiments, the portion of the
第3B圖是根據本揭露另一些實施例,繪示出光源模組200的中心線剖視圖。在第3B圖的實施例中,除了發光面102t的高度與杯殼頂表面103t的高度相同之外,其餘部分與第3A圖所出示的皆相同,在此為了簡潔而省略其描述。相較於習知結構中杯殼高於發光面的配置(例如,如第1圖所示),在本揭露如第3B圖所示的一些實施例中,藉由將發光面102t的高度設置為與杯殼頂表面103t的高度相同,也仍能減少杯殼對光線的吸收或反射並以此增加光源模組的出光角。在一些實施例中,杯殼103的折射率(n值)可介於1.53~1.56之間。在一些實施例中,杯殼103的折射率可以是1.53、1.54、1.55或1.56。在一些實施例中,透鏡結構105的折射率可介於1.45~1.56之間。在一些實施例中,透鏡結構105的折射率可以是1.45、1.46、1.47、1.48、1.49、1.50、1.51、1.52、1.53、1.54、1.55或1.56。FIG. 3B is a centerline cross-sectional view of the
藉由杯殼103的折射率與透鏡結構105的折射率的調整,可以進一步調整光源模組的出光角。在一些實施例中,杯殼103為半透光材料,可以採用透鏡結構105的折射率小於杯殼103的折射率的設計,可以進一步增加光源模組的出光角,例如採用透鏡結構105的折射率為1.50與杯殼103的折射率為1.53。例如採用透鏡結構105的折射率為1.53與杯殼103的折射率為1.56。By adjusting the refractive index of the
第4圖是本揭露一些實施例的光源模組在出光平面的投影的示意圖。如第4圖所示,由於本揭露一些實施例中發光面高於杯殼或齊平於杯殼的配置,減少了杯殼對光線的吸收或反射而增加了光源模組的出光角,在出光平面PS上能夠產生比現有(採用發光面低於杯殼配置)的光源模組更大的光斑。如此一來,本揭露的光源模組較大的光斑能夠改善現有結構因光斑大小不足而在出光平面上無法重疊所導致的暗區(如第4圖中a所示)。除此之外,本揭露的光源模組在出光平面上不產生暗區的前提下,能夠以比現有的光源模組更大的節距配置(例如,d 2>d 1),因此可以減少光源模組的使用量,降低了生產成本。 FIG. 4 is a schematic diagram of the projection of the light source module of some embodiments of the present disclosure on the light-emitting plane. As shown in FIG. 4, due to the configuration of the light-emitting surface being higher than or flush with the cup shell in some embodiments of the present disclosure, the absorption or reflection of light by the cup shell is reduced, thereby increasing the light-emitting angle of the light source module, and a larger light spot can be generated on the light-emitting plane PS than the existing light source module (adopting the configuration of the light-emitting surface being lower than the cup shell). In this way, the larger light spot of the light source module of the present disclosure can improve the dark area caused by the inability to overlap on the light-emitting plane due to insufficient light spot size in the existing structure (as shown in a in FIG. 4). In addition, the light source module disclosed herein can be configured with a larger pitch (eg, d 2 > d 1 ) than existing light source modules without generating dark areas on the light emitting plane, thereby reducing the usage of light source modules and lowering production costs.
現在,將以下方表1、表2的光學模擬結果說明降低杯殼高度對光斑大小的影響。表1係實驗例1、實驗例2的給定條件。表2係實驗例1、實驗例2在出光平面上不同光斑亮度的面積的模擬結果。此處所指「杯高」為以基板上表面為準的杯殼高度(即,如第3A圖所示的杯殼103的高度h2)、「膠高」為透鏡結構超過杯殼的高度(即,如第3A圖所示的透鏡結構105的厚度t2)。此處將光斑在出光平面上最亮處(中心點)的亮度定為100%亮度,其餘處的亮度皆以中心最亮處的亮度為比較基準。Now, the effect of reducing the cup shell height on the spot size is explained by the optical simulation results in Tables 1 and 2 below. Table 1 shows the given conditions of Experimental Examples 1 and 2. Table 2 shows the simulation results of the areas of different spot brightness on the light-emitting plane in Experimental Examples 1 and 2. The "cup height" referred to here is the cup shell height based on the upper surface of the substrate (i.e., the height h2 of the
如表2的結果所示,相較於使用較高杯殼(0.4mm)配置的光源模組,採用較低杯殼(0.2mm)配置的光源模組在不同亮度之下的面積都能有所增加。As shown in Table 2, compared with the light source module with a higher cup size (0.4 mm), the light source module with a lower cup size (0.2 mm) can increase the area at different brightness levels.
表1
表2
現在,將以下方表3、表4說明以CCD(Charge Coupled Device)圖像感測器實際觀察不同杯殼高度的光源模組在出光平面上的光斑亮度分佈結果。表3係實驗例3~實驗例7的給定條件。表4係實驗例3~實驗例7在出光平面上不同光斑亮度的面積的觀測結果。此處所指「杯高」、「膠高」定義皆與前述模擬所用相同,在此不予贅述。此處將光斑在出光平面上最亮處(中心點)的亮度定為100%亮度,其餘處的亮度皆以最亮處的亮度為比較基準。Now, the following Tables 3 and 4 illustrate the actual observation results of the spot brightness distribution on the light-emitting plane of the light source module with different cup shell heights using a CCD (Charge Coupled Device) image sensor. Table 3 is the given conditions of Experimental Examples 3 to 7. Table 4 is the observation result of the area of different spot brightness on the light-emitting plane in Experimental Examples 3 to 7. The definitions of "cup height" and "glue height" referred to here are the same as those used in the above simulation and will not be elaborated here. Here, the brightness of the brightest spot (center point) on the light-emitting plane is set as 100% brightness, and the brightness of the rest is compared with the brightness of the brightest point.
如表4的結果所示。相較於發光面低於杯殼的組別,發光面高於杯殼的組別在相同光源強度的條件下所有亮度的面積均能有所提升。除此之外,在相同光源強度的條件下,發光面高於杯殼的組別單位面積亮度也顯著地小於發光面低於杯殼的組別,表示發光面高於杯殼的配置能更有效地將光分散至更大的面積,因此在相同的光源強度之下具有更低的單位面積亮度。As shown in the results in Table 4, compared with the group with the luminous surface lower than the shell, the group with the luminous surface higher than the shell can improve all the brightness areas under the same light intensity. In addition, under the same light intensity, the unit area brightness of the group with the luminous surface higher than the shell is also significantly lower than that of the group with the luminous surface lower than the shell, indicating that the configuration with the luminous surface higher than the shell can more effectively disperse light to a larger area, and therefore has a lower unit area brightness under the same light intensity.
表3
表4
第5圖是根據本揭露一實施例的光源模組應用於背光模組的的示意圖。如第5圖所示,在一些實施例中,背光模組可以包括光源模組(例如光源模組100)、承載基板201、擴散板202、以及光色轉換結構203。第5圖僅為舉例說明,本揭露的光源模組亦可以應用於所屬技術領域中具有通常知識者所熟知的各種背光模組中。FIG. 5 is a schematic diagram of a light source module according to an embodiment of the present disclosure being applied to a backlight module. As shown in FIG. 5, in some embodiments, the backlight module may include a light source module (e.g., light source module 100), a
如第5圖所示,可以藉由將多個光源模組100排列在承載基板201上形成發光板來提供背光。在一些實施例中,承載基板201可以為印刷電路板(PCB板)或者製作有線路的玻璃、陶瓷、高分子(如聚醯亞胺、聚甲基丙烯酸甲酯)等基板,但本揭露不限於此。在一些實施例中,光源模組100為單色光源。光源模組100可以依照設計需求而採用藍色或其他顏色(例如,紅色、綠色)的光源模組,並且光源模組的數量也可依照實際產品需求進行調整。As shown in FIG. 5 , a plurality of
如第5圖所示,可以在發光板的上方進一步設置光擴散結構202。光擴散結構202可藉由將發光板所發出的光線進行折射、反射來改善光線分布的均勻性。在一些實施例中,光擴散結構202可以根據設計需求為單層或多層結構。舉例而言,光擴散結構202可以包括粒子性擴散板及/或帶有微結構的擴散膜(未繪示),但本揭露不限於此。As shown in FIG. 5 , a
如第5圖所示,可以在發光板的上方進一步設置光色轉換結構203。光色轉換結構203包括不同顏色的光轉換材料以將光源模組100所發出的光線轉換為不同顏色。舉例而言,在光源模組100為藍光光源的一些實施例中,光色轉換結構203可以包括紅色光轉換材料與綠色光轉換材料,其中紅色光轉換材料與綠色光轉換材料可以分別吸收光源模組100所發出的部分藍光並分別將其轉換為紅光與綠光,所轉換的紅光、綠光與部分藍光混合成白光。在一些實施例,光色轉換結構203可以是量子點膜。在一些實施例,光色轉換結構203可以是黃色量子點膜。在一些實施例,光色轉換結構203可以是紅色與綠色量子點膜。在一些實施例,光色轉換結構203可以包括紅色量子點與綠色量子點。As shown in FIG. 5 , a light
在一些實施例中,黃色光轉換材料可包括黃色量子點或黃色螢光粉。舉例而言,黃色光轉換材料可包括釔鋁石榴石(YAG)螢光粉。在一些實施例中,上述紅色光轉換材料可為紅色量子點,或紅色螢光粉,例如(Sr,Ca)AlSiN
3:Eu
2+、Ca
2Si
5N
8:Eu
2+、Sr(LiAl
3N
4):Eu
2+、錳摻雜紅色氟化物螢光粉(例如,K
2GeF
6:Mn
4+、K
2SiF
6:Mn
4+、K
2TiF
6:Mn
4+)等,但本揭露不限於此。在一些實施例中,上述綠色光轉換材料可為綠色量子點或綠色螢光粉,例如鎦鋁石榴石(LuAG)螢光粉、釔鋁石榴石(YAG)螢光粉、賽隆(β-SiAlON)螢光粉、矽酸鹽(Silicate)螢光粉,但本揭露不限於此。在一些實施例,光色轉換結構203可以是黃色螢光粉。舉例而言,黃色螢光粉可為釔鋁石榴石(YAG)螢光粉。在一些實施例,光色轉換結構203可以包括綠色螢光粉與紅色螢光粉。舉例而言,光色轉換結構203可包括綠色賽隆螢光粉及紅色K
2SiF
6:Mn
4+。在一些實施例中,光色轉換結構203可包括綠色螢光粉及兩種紅色螢光粉的組合,舉例而言,光色轉換結構203可包括綠色賽隆螢光粉、紅色K
2SiF
6:Mn
4+與紅色(Sr,Ca)AlSiN
3:Eu
2+。
In some embodiments, the yellow light conversion material may include yellow quantum dots or yellow fluorescent powder. For example, the yellow light conversion material may include yttrium aluminum garnet (YAG) fluorescent powder. In some embodiments, the red light conversion material may be red quantum dots or red fluorescent powder, such as (Sr,Ca)AlSiN 3 :Eu 2+ , Ca 2 Si 5 N 8 :Eu 2+ , Sr(LiAl 3 N 4 ):Eu 2+ , manganese-doped red fluoride fluorescent powder (e.g., K 2 GeF 6 :Mn 4+ , K 2 SiF 6 :Mn 4+ , K 2 TiF 6 :Mn 4+ ), etc., but the present disclosure is not limited thereto. In some embodiments, the green light conversion material may be green quantum dots or green fluorescent powder, such as LuAG fluorescent powder, YAG fluorescent powder, β-SiAlON fluorescent powder, silicate fluorescent powder, but the present disclosure is not limited thereto. In some embodiments, the light
綜上所述,本揭露提供一種光源模組,可應用於顯示器的背光、多種發光裝置等。相較於現有結構發光面低於杯殼的配置,本揭露提供的光源模組採用發光面高於杯殼的設置,減少了封裝材料層或杯殼對光源所發出光線的反射或吸收而有效增加光源模組的出光角,如此一來,擴大了光源模組在出光平面上產生的光斑,並且在光源模組間節距較大時減少出光平面上連續光斑亮度的不均勻。除此之外,本揭露提供的光源模組也可以減少發光二極體的使用量,進而降低製造成本。In summary, the present disclosure provides a light source module that can be applied to the backlight of a display, a variety of light-emitting devices, etc. Compared with the configuration of the existing structure in which the light-emitting surface is lower than the cup shell, the light source module provided by the present disclosure adopts a configuration in which the light-emitting surface is higher than the cup shell, which reduces the reflection or absorption of the light emitted by the light source by the packaging material layer or the cup shell and effectively increases the light output angle of the light source module. In this way, the light spot generated by the light source module on the light output plane is enlarged, and when the pitch between the light source modules is larger, the uneven brightness of the continuous light spots on the light output plane is reduced. In addition, the light source module provided by the present disclosure can also reduce the use of light-emitting diodes, thereby reducing the manufacturing cost.
雖然本揭露已以具體之較佳實施例揭露如上,然其並非用以限定本揭露,任何熟習此項技術者,在不脫離本揭露之精神和範圍內,仍可作些許的更動與潤飾,因此本揭露之保護範圍當視後附之申請專利範圍所界定者為準。Although the present disclosure has been disclosed as above with specific preferred embodiments, it is not intended to limit the present disclosure. Anyone skilled in the art may make slight changes and modifications without departing from the spirit and scope of the present disclosure. Therefore, the protection scope of the present disclosure shall be subject to the scope defined by the attached patent application.
100:光源模組
101:基板
101t:基板上表面
102:發光元件
102t:發光面
103:杯殼
103t:杯殼上表面
104:導線結構
105:透鏡結構
200:光源模組
201:承載基板
202:擴散板
203:光色轉換結構
h1:距離
h2:距離
h3:距離
t1:厚度
t2:厚度
P1:最高點
S:基板
L:發光元件
P:發光面
C:杯殼
d1:節距
d2:節距
PS:出光平面
D:區域
a:區域
100: light source module
101:
以下將配合所附圖式詳述本發明實施例。應注意的是,依據在業界的標準做法,各種特徵並未按照比例繪製且僅用以說明例示。事實上,可任意地放大或縮小元件的尺寸,以清楚地表現出本發明實施例的特徵。
第1圖是現有光源模組結構的中心線剖視圖。
第2圖是現有光源模組結構在出光平面上的投影的示意圖。
第3A圖是根據本揭露一些實施例之光源模組100的中心線剖視圖。
第3B圖是根據本揭露另一些實施例之光源模組200的中心線剖視圖。
第4圖是根據本揭露一些實施例之光源模組在出光平面上的投影的示意圖。
第5圖是根據本揭露的一實施例例示了光源模組應用於背光模組的一些實施例的示意圖。
The following will be described in detail with the accompanying drawings. It should be noted that, according to standard practices in the industry, various features are not drawn to scale and are only used for illustration. In fact, the size of the components can be arbitrarily enlarged or reduced to clearly show the features of the embodiments of the present invention.
Figure 1 is a centerline cross-sectional view of the existing light source module structure.
Figure 2 is a schematic diagram of the projection of the existing light source module structure on the light output plane.
Figure 3A is a centerline cross-sectional view of the
100:光源模組
101:基板
101t:基板上表面
102:發光元件
102t:發光面
103:杯殼
103t:杯殼上表面
104: 導線結構
105: 透鏡結構
h1:距離
h2:距離
h3:距離
t1:厚度
t2:厚度
P1:最高點
100: Light source module
101:
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW201024612A (en) * | 2008-12-30 | 2010-07-01 | Denki Kagaku Kogyo Kk | The fabrication method of substrate for packaging light emitting device and light emitting device package |
| CN102097425A (en) * | 2009-12-09 | 2011-06-15 | 三星Led株式会社 | Light emitting diode, method for fabricating phosphor layer, and lighting apparatus |
| CN103363357A (en) * | 2013-07-17 | 2013-10-23 | 晶科电子(广州)有限公司 | LED light source with well heat dissipation effect |
| US20140084323A1 (en) * | 1996-07-29 | 2014-03-27 | Nichia Corporation | Light emitting device and display comprising a plurality of light emitting components on mount |
| US20230146908A1 (en) * | 2014-12-03 | 2023-05-11 | Samsung Electronics Co., Ltd. | White light emitting device and display device using the same |
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Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20140084323A1 (en) * | 1996-07-29 | 2014-03-27 | Nichia Corporation | Light emitting device and display comprising a plurality of light emitting components on mount |
| TW201024612A (en) * | 2008-12-30 | 2010-07-01 | Denki Kagaku Kogyo Kk | The fabrication method of substrate for packaging light emitting device and light emitting device package |
| CN102097425A (en) * | 2009-12-09 | 2011-06-15 | 三星Led株式会社 | Light emitting diode, method for fabricating phosphor layer, and lighting apparatus |
| CN103363357A (en) * | 2013-07-17 | 2013-10-23 | 晶科电子(广州)有限公司 | LED light source with well heat dissipation effect |
| US20230146908A1 (en) * | 2014-12-03 | 2023-05-11 | Samsung Electronics Co., Ltd. | White light emitting device and display device using the same |
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