TWI792288B - memory testing device - Google Patents
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Abstract
一種記憶體檢測裝置,係包括一測試基板、數個待測記憶體模組(device under test, DUT)、一中央處理器(central processing unit, CPU)、一基本輸入/輸出系統(Basic Input/Output System, BIOS)韌體、一序列存在檢測(serial presence detect, SPD)晶片、以及一Hyper伺服器所構成。藉此,通過外部連結的Hyper伺服器來更改SPD晶片內部儲存的參數,可提供進行多種測試動作,例如電壓偏移的設定、資料保存的持久性等,BIOS韌體在開機後會去讀取SPD晶片內部之參數,從而對數個BIOS設定的至少之一進行部分校正或全部校正,以達到可快速的控制大批量的測試基板,省下需逐台進行設定的時間,從而提高更佳的測試便利性,並增加測試的效率。A memory testing device includes a test substrate, several memory modules to be tested (device under test, DUT), a central processing unit (central processing unit, CPU), a basic input/output system (Basic Input/Output) Output System, BIOS) firmware, a serial presence detect (SPD) chip, and a Hyper server. In this way, the parameters stored in the SPD chip can be changed through the externally connected Hyper server, and various test actions can be provided, such as the setting of voltage offset, the persistence of data storage, etc., and the BIOS firmware will read it after booting The internal parameters of the SPD chip can be partially corrected or fully corrected at least one of several BIOS settings, so as to quickly control a large number of test substrates, save the time for setting one by one, and improve better testing. Convenience and increase test efficiency.
Description
本發明係有關於一種記憶體檢測裝置,尤指涉及一種通過外部連 結的Hyper伺服器來更改序列存在檢測(serial presence detect, SPD)晶片內部儲存的參數,可提供進行多種測試動作,基本輸入/輸出系統(Basic Input/Output System, BIOS)韌體在開機後會去讀取SPD晶片內部之參數,從而對數個BIOS設定的至少之一進行部分校正或全部校正,特別係指可快速的控制大批量的測試基板,省下需逐台進行設定的時間,從而提高更佳的測試便利性,並增加測試的效率者。 The invention relates to a memory detection device, in particular to a device through an external connection The hyper server of the junction can be used to change the parameters stored in the serial presence detect (SPD) chip, which can provide a variety of test actions. The basic input/output system (Basic Input/Output System, BIOS) firmware will be activated after booting To read the parameters inside the SPD chip, so as to partially correct or fully correct at least one of several BIOS settings, especially to quickly control a large number of test substrates, saving the time to set one by one, thereby improving Better test convenience and increase test efficiency.
一電腦可包含一主機系統及附接至該主機系統之一或數個記憶 體子系統。該主機系統可具有與一或數個記憶體子系統通信以儲存及/或擷取資料及指令之一中央處理單元(Center Processing Unit, CPU)。該記憶體子系統可為一記憶體模組,如一雙列直插記憶體模組(Dual In-line Memory Module, DIMM),該DIMM係指一系列由動態隨機存取記憶體(Dynamic Random Access Memory, DRAM)組成的模組。該DIMM通常是數顆至數十顆DRAM晶片焊接安裝於一塊已製作好電路的印刷電路板的形式,用於個人電腦、工作站、伺服器。 A computer may consist of a host system and one or more memory devices attached to the host system body subsystem. The host system may have a central processing unit (CPU) that communicates with one or more memory subsystems to store and/or retrieve data and instructions. The memory subsystem can be a memory module, such as a dual in-line memory module (Dual In-line Memory Module, DIMM), which refers to a series of dynamic random access memory (Dynamic Random Access Memory, DRAM) modules. The DIMM is usually in the form of several to dozens of DRAM chips soldered and installed on a printed circuit board with a circuit, and is used in personal computers, workstations, and servers.
目前主機系統的BIOS係由電路板上的快閃記憶體(Flash memory) 執行,其記錄電腦基本的輸出入設定,該電路板上還包括有一SPD,用於控制DRAM。在BIOS程式的設定檔中,包含有許多參數對應各硬體的參數設定與該硬體是否啟動等資訊。傳統的前案,在製造電腦時,這些BIOS程式的設定檔大多是預先燒錄在記憶體中,然後憑藉操作人員在開機時,進入BIOS的選單,根據當下連接主機系統的硬體配置而手動地設定各項參數,最後再存成設定檔,並在重新開機後重新載入新的BIOS設定檔。 At present, the BIOS of the host system is controlled by the flash memory (Flash memory) on the circuit board. Execution, which records the basic input and output settings of the computer. The circuit board also includes an SPD for controlling the DRAM. In the configuration file of the BIOS program, there are many parameters corresponding to the parameter settings of each hardware and information such as whether the hardware is started or not. In the traditional case, when computers are manufactured, these BIOS program configuration files are mostly pre-burned in the memory, and then rely on the operator to enter the BIOS menu when starting the computer, and manually configure the settings according to the hardware configuration of the current connected host system. Set various parameters in a timely manner, and finally save it as a configuration file, and reload the new BIOS configuration file after rebooting.
然而,上述手動設定BIOS設定檔對於電腦的研發工程師、製造 及測試人員來說都是一件既麻煩又沒有效率的工作,因為還要逐一核對主機系統所配置的各項硬體,因此不利於設計、製造與測試的效率。此外,一般電腦的使用者對於BIOS選單的各項參數設定也容易發生困難,如果設定不當,有可能會導致主機系統出現異常狀況而無法順利開機。再者,由於現有技術是將開機時BIOS程式所需載入的設定檔儲存在主機系統,也容易發生設定檔檔案毀損或是遭不當竄改的問題,影響到後續主機系統的開機作業。故,一般習用者係無法符合使用者於實際使用時之所需。 However, the above-mentioned manual setting of the BIOS setting file is very difficult for the research and development engineers and manufacturers of the computer. It is a cumbersome and inefficient job for both computer and testers, because it is necessary to check each hardware configured in the host system one by one, which is not conducive to the efficiency of design, manufacturing and testing. In addition, general computer users are also prone to difficulties in setting various parameters in the BIOS menu. If the settings are improper, it may cause abnormal conditions in the host system and fail to boot smoothly. Furthermore, since the prior art stores the configuration files loaded by the BIOS program in the host system during startup, the configuration files are prone to be damaged or improperly tampered with, which will affect the subsequent startup operations of the host system. Therefore, general users cannot meet the needs of users in actual use.
本發明之主要目的係在於,克服習知技藝所遭遇之上述問題並提 供一種通過外部連結的Hyper伺服器來更改SPD晶片內部儲存的參數,可提供進行多種測試動作,BIOS韌體在開機後會去讀取SPD晶片內部之參數,從而對數個BIOS設定的至少之一進行部分校正或全部校正,以達到可快速的控制大批量的測試基板,省下需逐台進行設定的時間,從而提高更佳的測試便利性,並增加測試的效率之記憶體檢測裝置。 The main purpose of the present invention is to overcome the above-mentioned problems encountered in the prior art and provide Provide a hyper server connected externally to change the parameters stored inside the SPD chip, and provide a variety of test actions. After booting, the BIOS firmware will read the parameters inside the SPD chip, so as to set at least one of several BIOS settings. Partial calibration or full calibration can be performed to quickly control a large number of test substrates, saving the time required to set up one by one, thereby improving the convenience of testing and increasing the efficiency of testing.
為達以上之目的,本發明係一種記憶體檢測裝置,係包括:一測 試基板;數個待測記憶體模組(device under test, DUT),設置於該測試基板上;一中央處理器,設置於該測試基板上,並電連接至該數個待測記憶體模組;一BIOS韌體,設置於該測試基板上,並電連接至該中央處理器,係配置成提供該測試基板對安裝於其上之數個待測記憶體模組進行篩檢;一SPD晶片,設置於該測試基板上,並電連接至該BIOS韌體與該數個待測記憶體模組,其內部儲存有數個參數,包含記憶體模組的主要設定值、擴充設定值、及BIOS命令集,可供該BIOS韌體自該SPD晶片處讀取該等參數;以及一Hyper伺服器,係由外部連結至該測試基板之SPD晶片,用以將欲更改數個BIOS設定的至少之一的該BIOS命令集及設定值寫入該SPD晶片,令結構化之該BIOS韌體啟動後自該SPD晶片處讀取該BIOS命令集時,基於該BIOS命令集直接更改該數個BIOS設定的至少之一,並在下一次開機時生效。 For reaching above purpose, the present invention is a kind of memory detection device, and system comprises: a test a test substrate; several memory modules to be tested (device under test, DUT), arranged on the test substrate; a central processing unit, arranged on the test substrate, and electrically connected to the several memory modules to be tested Set; a BIOS firmware, arranged on the test substrate, and electrically connected to the central processing unit, configured to provide the test substrate to screen several memory modules to be tested installed thereon; an SPD The chip is arranged on the test substrate and is electrically connected to the BIOS firmware and the several memory modules to be tested. There are several parameters stored inside it, including the main set value, extended set value, and The BIOS command set can be used for the BIOS firmware to read these parameters from the SPD chip; and a Hyper server is externally connected to the SPD chip of the test substrate for at least One of the BIOS command sets and setting values are written into the SPD chip, so that when the structured BIOS firmware starts and reads the BIOS command set from the SPD chip, the several BIOSes are directly changed based on the BIOS command set At least one of the settings will take effect at the next boot.
於本發明上述實施例中,各該待測記憶體模組為DIMM,該DIMM 係用以設置至少一記憶體晶片。 In the above-mentioned embodiments of the present invention, each memory module to be tested is a DIMM, and the DIMM It is used to set at least one memory chip.
於本發明上述實施例中,該記憶體晶片為DRAM。In the above embodiments of the present invention, the memory chip is a DRAM.
請參閱『第1圖』所示,係本發明之方塊示意圖。如圖所示:本
發明係一種記憶體檢測裝置100,係包括一測試基板1、數個待測記憶體模組(device under test, DUT)2、一中央處理器(central processing unit, CPU)3、一基本輸入/輸出系統(Basic Input/Output System, BIOS)韌體4、一序列存在檢測(serial presence detect, SPD)晶片5、以及一Hyper伺服器6所構成。
Please refer to "Fig. 1", which is a schematic block diagram of the present invention. As shown in the picture: this
The invention is a
上述所提之待測記憶體模組(device under test, DUT)2係設置於
該測試基板1上;其中,各該待測記憶體模組2可為雙列直插記憶體模組(Dual
In-line Memory Module, DIMM),該DIMM係用以設置至少一記憶體晶片,而該
記憶體晶片可為動態隨機存取記憶體(Dynamic Random Access Memory, DRAM)。
The aforementioned memory module under test (device under test, DUT) 2 is set in
on the
該中央處理器3係設置於該測試基板1上,並電連接至該數個待
測記憶體模組2。
The
該BIOS韌體4係設置於該測試基板1上,並電連接至該中央處
理器3。該BIOS韌體4係配置成提供該測試基板1對安裝於其上之數個待測記憶體模組2進行篩檢。
The
該SPD晶片5係設置於該測試基板1上,並電連接至該BIOS韌體
4與該數個待測記憶體模組2。該SPD晶片5內部儲存有數個參數,包含記憶體模組的主要設定值、擴充設定值、及BIOS命令集,可供該BIOS韌體4自該SPD晶片5處讀取該等參數。
The SPD
該Hyper伺服器6係由外部連結至該測試基板1之SPD晶片5,
用以將欲更改數個BIOS設定的至少之一的該BIOS命令集及設定值寫入該SPD晶片5,令結構化之BIOS韌體4啟動後自該SPD晶片5處讀取該BIOS命令集時,基於該BIOS命令集直接更改該數個BIOS設定的至少之一,並在下一次開機時生效。如是,藉由上述揭露之結構構成一全新之記憶體檢測裝置100。
The Hyper
本發明之主要目的就是讓BIOS韌體4結構化,形成可以由外部
的Hyper伺服器6來控制的BIOS韌體4,而這個結構化也可以直接更改快閃記憶體(Flash memory)。於本實施例中,要讓BIOS韌體4可以結構化所採用的方法,係通過外部連結的Hyper伺服器6更改SPD晶片5。
The main purpose of the present invention is to make the
當運用時,本發明係在SPD晶片5中未使用之空間,將其連結到
外部的Hyper伺服器6上,之後當BIOS韌體4啟動並讀取該SPD晶片5時,該SPD晶片5會連結至該Hyper伺服器6,由該Hyper伺服器6把要更改的資料以BIOS命令集及設定值方式寫入該SPD晶片5中,提供該BIOS韌體4基於該BIOS命令集直接更改數個BIOS設定的至少之一。換言之,本發明係將BIOS的一些設定移至SPD晶片5這邊,經定義後,所要更改的BIOS設定就會透過SPD晶片5來直接影響到BIOS韌體4內部數個BIOS設定的至少之一。藉此,通過外部連結的Hyper伺服器來更改SPD晶片內部儲存的參數,可提供進行多種測試動作,例如電壓偏移的設定、資料保存的持久性等,BIOS韌體在開機後會去讀取SPD晶片內部之參數,從而對數個BIOS設定的至少之一進行部分校正或全部校正,以達到可快速的控制大批量的測試基板,省下需逐台進行設定的時間,從而提高更佳的測試便利性,並增加測試的效率。
When used, the present invention connects the unused space in the SPD
綜上所述,本發明係一種記憶體檢測裝置,可有效改善習用之種 種缺點,通過外部連結的Hyper伺服器來更改SPD晶片內部儲存的參數,可提供進行多種測試動作,BIOS韌體在開機後會去讀取SPD晶片內部之參數,從而對數個BIOS設定的至少之一進行部分校正或全部校正,以達到可快速的控制大批量的測試基板,省下需逐台進行設定的時間,從而提高更佳的測試便利性,並增加測試的效率,進而使本發明之產生能更進步、更實用、更符合使用者之所須,確已符合發明專利申請之要件,爰依法提出專利申請。 In summary, the present invention is a memory detection device, which can effectively improve the commonly used This shortcoming is to change the parameters stored inside the SPD chip through the externally connected Hyper server, which can provide a variety of test actions. The BIOS firmware will read the parameters inside the SPD chip after booting, so that at least one of several BIOS settings Partial correction or full correction is performed to quickly control a large number of test substrates, saving the time needed to set up one by one, thereby improving the convenience of testing and increasing the efficiency of testing, and thus making the present invention If the product is more advanced, more practical, and more in line with the needs of users, and has indeed met the requirements for invention patent application, the patent application shall be filed in accordance with the law.
惟以上所述者,僅為本發明之較佳實施例而已,當不能以此限定 本發明實施之範圍;故,凡依本發明申請專利範圍及發明說明書內容所作之簡單的等效變化與修飾,皆應仍屬本發明專利涵蓋之範圍內。 However, what is described above is only a preferred embodiment of the present invention, and should not be limited thereto. The scope of implementation of the present invention; therefore, all simple equivalent changes and modifications made according to the patent scope of the present invention and the content of the description of the invention should still fall within the scope covered by the patent of the present invention.
100:記憶體檢測裝置 1:測試基板 2:待測記憶體模組 3:中央處理器 4:BIOS韌體 5:SPD晶片 6:Hyper伺服器 100:Memory detection device 1: Test substrate 2: The memory module to be tested 3: CPU 4:BIOS firmware 5: SPD chip 6:Hyper server
第1圖,係本發明之方塊示意圖。Figure 1 is a schematic block diagram of the present invention.
100:記憶體檢測裝置 100:Memory detection device
1:測試基板 1: Test substrate
2:待測記憶體模組 2: The memory module to be tested
3:中央處理器 3: CPU
4:BIOS韌體 4:BIOS firmware
5:SPD晶片 5: SPD chip
6:Hyper伺服器 6:Hyper server
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Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI384236B (en) * | 2008-06-27 | 2013-02-01 | Teco Image Sys Co Ltd | Machine to be tested, machine detection system and detection method capable of reloading detection program |
| TW201623987A (en) * | 2014-12-24 | 2016-07-01 | 力晶科技股份有限公司 | Dynamic memory testing apparatus and testing method thereof |
| TWI643204B (en) * | 2018-03-30 | 2018-12-01 | 森富科技股份有限公司 | Memory Layout Fabricated for Preventing Reference Layer from Breaking |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI384236B (en) * | 2008-06-27 | 2013-02-01 | Teco Image Sys Co Ltd | Machine to be tested, machine detection system and detection method capable of reloading detection program |
| TW201623987A (en) * | 2014-12-24 | 2016-07-01 | 力晶科技股份有限公司 | Dynamic memory testing apparatus and testing method thereof |
| TWI559009B (en) * | 2014-12-24 | 2016-11-21 | 力晶科技股份有限公司 | Dynamic memory testing apparatus and testing method thereof |
| TWI643204B (en) * | 2018-03-30 | 2018-12-01 | 森富科技股份有限公司 | Memory Layout Fabricated for Preventing Reference Layer from Breaking |
Non-Patent Citations (1)
| Title |
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| 網路文獻 JEDEC Serial Presence Detect (SPD) for DDR4 SDRAM Modules, Release 6 SPD4.1.2.L-6 Published: Nov 2020 JEDEC 20201101 https://www.jedec.org/taxonomy/term/2327 * |
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