TWI523136B - Semiconductor process temperature measuring device - Google Patents

Description

Semiconductor process temperature measuring device

The present invention relates to the design of a semiconductor process temperature measuring device, and more particularly to a semiconductor process temperature measuring device with good reliability.

Semiconductors can be used as carriers for integrated circuits. The manufacturing process of semiconductors includes a variety of processing methods, including sensitizer coating, exposure, development, etching, and infiltration, etc., to fabricate components with multilayer wiring, and to make practically available products through inspection and packaging. The finished body circuit.

The manufacturing process of the semiconductor must be subjected to repeated heat treatment, including thermal oxidation process, annealing treatment, AI hot pressing method, hot rounding treatment, cooling hardening, etc., to gradually manufacture into finished products. In order to control the temperature of the heat treatment to achieve the desired manufacturing effect, and to avoid product damage caused by improper temperature, the temperature of the semiconductor process is usually measured by a temperature measuring device.

Conventional semiconductor temperature measuring devices typically use a thermocouple attached to the surface of a temperature object to be tested. However, the temperature test object often causes thermal expansion and contraction due to temperature changes during the heat treatment process, and further causes the thermocouple to fall off from the temperature test object, which not only makes the temperature monitoring reliability poor, and may even further lead to The temperature of the heat treatment is improperly controlled, which affects the manufacturing yield of the semiconductor.

In view of the above, how to avoid the temperature measurement component such as thermocouple from the original measurement position is an important research topic.

Accordingly, it is an object of the present invention to provide a semiconductor process temperature measuring device that effectively measures temperature at a fixed location to improve the problems of the prior art.

The technical means adopted by the present invention to solve the problems of the prior art is a semiconductor process temperature measuring device comprising a tested body and a temperature measuring member. A recess is formed on the body to be tested. One of the temperature measuring members is connected to the sensing end and is in thermal contact with the body to be tested, and the sensing end is covered by the adhesive member simultaneously with the concave portion. The body to be tested is a body for placing a semiconductor, and the body is thermally contacted with the semiconductor for placing the semiconductor, or the body to be tested is a semiconductor.

In an embodiment of the invention, the adhesive member protrudes from an upper surface adjacent to the convex portion of one of the recesses.

In an embodiment of the invention, the shape of the recess is selected from one or a plurality of groups consisting of a line, a circle, a concentric shape, a polygon, and a radial shape.

In an embodiment of the invention, the width of the recess is narrowed in width, narrowed in width, or equal in width in the depth direction.

In an embodiment of the invention, the distance between the plurality of sensing ends is the same.

In an embodiment of the invention, a single adhesive member is adhered to a plurality of recesses.

In an embodiment of the invention, the recess is formed on the surface of the body to be tested.

In an embodiment of the invention, the recess may be formed by a laser cutting method, an etching method, or a milling method.

Through the technical means adopted by the present invention, the adhesive end of the temperature measuring member is thermally contacted to the body to be tested by the adhesive member adhering to the concave portion of the body to be tested. Thereby, the thermal stress between the adhesive object and the tested body is stronger, and the adhesive object is more engaged with the concave portion, so that the sensing end is more effectively fixed to the tested body to enhance the reliability of temperature monitoring. Moreover, with the arrangement of the present invention, the sensing end can be fixed on the material that is difficult to be connected, and can have a wider and reliable temperature measurement range. In addition, it is further possible to make the adhesive article and the tested body have a longer service life. Thereby effectively controlling the ambient temperature of the semiconductor to enhance manufacturing Yield.

The specific embodiments of the present invention will be further described by the following examples and the accompanying drawings.

100, 100a, 100b, 100c, 100d‧‧‧ semiconductor process temperature measuring device

1, 1b, 1c, 1d‧‧‧ tested ontology

11‧‧‧ recess

12‧‧‧ convex

2‧‧‧Temperature measuring components

21‧‧‧ Sensing end

3‧‧‧Adhesive objects

4‧‧‧Store object

D1, D2‧‧‧ distance

L1, L1‧‧‧ center line

W‧‧‧Semiconductor

1 is a perspective view showing a semiconductor process temperature measuring device according to an embodiment of the present invention.

Fig. 2 is a perspective view showing a semiconductor process temperature measuring device according to another embodiment of the present invention.

Figure 3 is a cross-sectional view showing a semiconductor process temperature measuring device in accordance with another embodiment of the present invention.

Figure 4 is a bottom plan view showing a body to be tested in accordance with another embodiment of the present invention.

Figure 5 is a cross-sectional view showing a semiconductor process temperature measuring device in accordance with another embodiment of the present invention.

Figure 6 is a cross-sectional view showing a semiconductor process temperature measuring device in accordance with another embodiment of the present invention.

Figure 7 is a cross-sectional view showing a semiconductor process temperature measuring device according to still another embodiment of the present invention.

Figures 8A through 8F show side views of recesses in accordance with various embodiments of the present invention.

Figures 9A through 9H show top views of recesses in accordance with various embodiments of the present invention.

10A through 10D are diagrams showing the configuration of the sensing end in accordance with various embodiments of the present invention.

Referring to FIG. 1 , a semiconductor process temperature measuring device 100 according to an embodiment of the present invention includes a body 1 to be tested and a temperature measuring member 2 . In this embodiment, the body 1 to be tested is A semiconductor, a housing body 4 for placing the body 1 to be tested. The body 1 to be tested is formed with a recess 11 formed on the upper surface of the body 1 to be tested.

One of the sensing ends 21 of the temperature measuring member 2 is connected and thermally in contact with the body 1 to be tested, and the sensing end 21 is covered by an adhesive member 3 adhered to the recess 11. In the present embodiment, the temperature measuring member 2 is a thermal couple, and the adhesive member 3 is a ceramic paste. However, the present invention is not limited to the temperature measuring member 2, and may be other objects capable of measuring temperature, such as a thermistor, and the adhesive member 3 may also be solder, or the like, as long as the sensing end 2 can be covered. The sensing end 2 is fixed to the body 1 to be tested.

The sensing end 21 of the temperature measuring member 2 is in thermal contact with the body 1 to be tested by the fixing of the adhesive member 3, thereby measuring the temperature of the body 1 to be tested to further obtain the process temperature of the semiconductor. Moreover, the adhesive member 3 is adhered to the concave portion 11, so that the deformation of the thermal expansion and contraction caused by the tested body 1 or the adhesive member 3 during the heat treatment does not easily cause the adhesive member 3 to fall off. On the contrary, in the concave portion 11, the thermal stress between the adhesive member 3 and the body to be tested 1 is stronger, and the adhesive member 3 is more engaged with the concave portion 11, and is more effectively fixed to the body 1 to be tested, and The sensing end 21 of the temperature measuring member 2 is still in close thermal contact with the body 1 to be tested to maintain the measurement of the process temperature.

Please refer to FIG. 2 to FIG. 4 simultaneously, which shows a semiconductor process temperature measuring device 100a according to another embodiment of the present invention, a semiconductor process temperature measuring device 100a and a semiconductor process temperature measuring device according to the present embodiment. 100 is substantially the same, except that in the present embodiment, the body 1 to be tested is used for placing a semiconductor W, and the body to be tested 1 is in thermal contact with the semiconductor W, and the body 1 to be tested is formed with a recess 11. In this embodiment, the body 1 to be tested is a heating plate. The concave portion 11 is formed on the lower surface of the body 1 to be tested, and the upper surface of the body to be tested 1 is flat, so that the semiconductor W is in close and uniform thermal contact with the body 1 to be tested.

More preferably, in the present embodiment, since the single adhesive member 3 is adhered to the plurality of recesses 11, the effect of the engagement is stronger. Moreover, the height of the convex portion of the adhesive member 3 is higher than the upper surface of the convex portion 12 adjacent to the concave portion 11, so that the sensing end 21 of the temperature measuring member 2 can be completely covered, so that the fixing effect is better. of course, The invention is not limited thereto, and the single adhesive member 3 can be adhered to only one recess 11 and the sensing end 21 of the temperature measuring member 2 can also be fixed and thermally contacted with the tested body 1c of the semiconductor process temperature measuring device 100c. The recess 11 is as shown in Fig. 6.

Referring to FIG. 5, the semiconductor process temperature measuring device 100b according to another embodiment of the present invention is substantially the same as the semiconductor process temperature measuring device 100a. Therefore, the same components are denoted by the same reference numerals, and the difference lies in: In the embodiment, the body to be tested 1b is a heating furnace box, the semiconductor W is placed in the body to be tested 1b, and the concave portion 11 is formed on the inner wall surface of the body to be tested 1b, and the adhesive member 3 is adhered to the concave portion 11, And the sensing end 21 of the temperature measuring member 2 is fixedly in contact with the inner wall surface of the body to be tested 1b, thereby obtaining the process temperature of the semiconductor W.

Referring to FIG. 7, the semiconductor process temperature measuring device 100d according to still another embodiment of the present invention is substantially the same as the semiconductor process temperature measuring device 100. Therefore, the same components are denoted by the same reference numerals, and the difference lies in: In the embodiment, the body to be tested 1d is a semiconductor, and the sensing end 21 of the temperature measuring member 2 can be more stably contacted by forming the semiconductor with the concave portion 11 and adhering the adhesive member 3 to the plurality of concave portions 11. Semiconductors, while obtaining the temperature of the semiconductor.

Referring to FIGS. 8A to 8F, the width of the concave portion 11 may be equal in width (Fig. 8A), narrower in width (Fig. 8B), or narrower in width (Fig. 8C) in the depth direction. Alternatively, the surface of the concave portion 11 may be a curved surface (Fig. 8D, 8E), or other irregular shape (Fig. 8F) or the like. Referring to Figures 9A through 9H, the shape of the recess 11 is selected from one or more of a group consisting of a line, a circle, a concentric, a polygon, a radial, or other irregular shape. Thereby, the shape of the recess 11 can be selected according to different needs. Further, the recess 11 may be a recess formed by a laser cutting method, an etching method, or a milling method.

Please refer to FIGS. 10A to 10D, which are configuration diagrams showing the sensing ends of the embodiments of the present invention. The sensing end 21 of the temperature measuring member 2 of the present invention can be disposed at the center (Fig. 10A) and the edge (Fig. 10B) of the body 1 to be tested. Alternatively, the sensing end 21 can also be configured along the center line L1, L2 of the body 1 to be tested. Set (Fig. 10C), or configured in an array (Fig. 10D). And preferably, the distance between each of the sensing terminals 21 (for example, the distance D1 and the distance D2 are the same), whereby the process temperature of the semiconductor can be uniformly measured.

The above description is only for the preferred embodiment of the present invention, and those skilled in the art can make other improvements according to the above description, but these changes still belong to the inventive spirit of the present invention and the patents defined below. In the scope.

100‧‧‧Semiconductor process temperature measuring device

1‧‧‧Measured ontology

11‧‧‧ recess

2‧‧‧Temperature measuring components

21‧‧‧ Sensing end

3‧‧‧Adhesive objects

4‧‧‧Store object

Claims (7)

A semiconductor process temperature measuring device for measuring a process temperature of a semiconductor, the semiconductor process temperature measuring device comprising: a body to be tested, the body to be tested is formed with a concave portion; and a temperature measuring member, the temperature amount One of the sensing members is connected to the sensing end and is in thermal contact with the body to be tested, and the sensing end is covered by an adhesive object adhered to the recess, wherein the system under test is the semiconductor or the system is used for placing a substrate body of the semiconductor, and the substrate body is in thermal contact with the semiconductor by placing the semiconductor. The semiconductor process temperature measuring device of claim 1, wherein the adhesive member protrudes from an upper surface adjacent to the convex portion of the recess. The semiconductor process temperature measuring device according to claim 1, wherein the shape of the concave portion is selected from one or a plurality of groups consisting of a linear shape, a circular shape, a concentric shape, a polygonal shape, and a radial shape. The semiconductor process temperature measuring device according to claim 1, wherein the width of the concave portion is narrowed in width, narrowed in width, or equal in width in the depth direction. The semiconductor process temperature measuring device of claim 1, wherein a single one of the adhesive members is adhered to more than one of the recesses. The semiconductor process temperature measuring device of claim 1, wherein the recess is formed on a surface of the body to be tested. The semiconductor process temperature measuring device according to claim 1, wherein the recess is a recess formed by a laser cutting method, an etching method, or a milling method.