1287079 九、發明說明： 【發明所屬之技術領域】 本發明係關於一種物體表面三維形貌量測系統及方法， 詳言之，係關於一種利用白光點光源之物體表面三維形貌 量測系統及方法。 【先前技術】 以非接觸式光學量測技術來檢視待測物件之三維形貌， 在生物工程與精密製造工程的應用有越來越普遍的趨勢。 而在現有非接觸式形貌檢測技術中，利用條紋投影的方 式、由投影在待測物之條紋的扭曲量，來求出物體的形 狀，已成為十分醒目的一種量測技術。 參考中華民國專利公告第580556號，其揭示一種物體表 面三維形貌量測系·統’該量測系統之架構係採用條紋投影 的方式it行物體之二維形狀量測。此架構使用的光源主 要為白光拓展光源（例如汞燈、鹵素燈）或雷射光源，然而 此兩種光源都有其難以抹滅之缺點。卩白光拓展光源作為 照明設備’會造成條紋成㈣圍之景深有限（limited epth of f〇CUS range)的情況，使得系統實際量測之縱深範 圍有限。而以雷射光源作為投影系統之照明設備，雖然可 以解決此項缺點，卻會因為 馮雷射光斑（speckle)的存在，造 成影像擷取時的雜訊，進一牛$ 退步衫響形貌量測的精確值。 因此，有必要提供一種創新1且、& W伟值 ^ - *1.1 ^ ^^ 創新且具進步性的物體表面三維 形貌里測祕及方法，以解決上述 【發明内容】 112033.doc 1287079 本發明之目的在於提供一種利用白光點光源之物體表面 三維形貌量測系統，用以量測一待測物體表面之三維形 貌，其包括·一白光點光源裝置、一光栅條紋投影裝置、 一顯微鏡裝置、一移動平台、一影像擷取裝置及一處理 器。該白光點光源裝置用以提供一白光點光源。該光柵條 紋投影裝置用以接收該白光點光源，以投影正弦函數週期 變化之條紋。該顯微鏡裝置用以一設定之倍率處理該條 紋。該移動平台具有一校正平面，用以置放該待測物體， 經處理之該條紋投影至該待測物體表面，該移動平台可控 制移動。該影像擷取裝置經由該顯微鏡裝置，擷取該待測 物體表面之各像素之相位值。該處理器用以依據該待測物 體表面之各像素之相位值，計算該待測物體表面之三維形 貌。 本發明之另一目的在於提供一種利用白光點光源之物體 表面三維形貌量測方法，用以量測一待測物體表面之三維 形貌，包括以下步驟：（a)利用一白光點光源，投影正弦函 數週期變化之條紋至一校正平面；（b)計算該校正平面之Z 軸校正函數、X軸校正函數及γ軸校正函數；（c)置放該待 測物體於該校正平面上；（d)擷取該待測物體表面之各像素 之相位值；及（e)依據擷取該待測物體表面之各像素之相位 值、該校正平面之Z軸校正函數、X軸校正函數及γ軸校正 函數’計算該待測物體表面之三维形貌。 由於本發明之物體表面三維形貌量測系統及方法係利用 白光點光源，故可增加實際量測之縱深範圍。再者，本發 I I2033.doc 1287079 牙J用决速傅立葉轉換(Fast触加簡稱砰丁)技術求 付物體表面纏繞相位，爾後，再代入校正過程所得每一個像素 之故正函數’最後由處理器還原物體表面三維形貌。其中使用 -技術優點為里測迅速準碟、具高解析度分析，縮短顯微物 : ^之形貌里測所需之時間。本發明之系統架設簡單化及方 法易於操作量測，適用於精密、自動化的檢測。 【實施方式】 φ 參考圖1，其顯示本發明利用白光點光源之物體表面三 維形貌量測系統之示意圖。本發明之物體表面三維形貌量 測系統1用以量測一待測物體表面之三維形貌，其包括： 一白光點光源裝置u、一光柵條紋投影裝置12、一顯微鏡 裝置13、一移動平台14、一影像擷取裝置15及一處理器 16孩白光點光源裝置11包括一超短脈衝雷射丨丨丨及一光 子晶體光纖112，用以提供一白光點光源。 該白光點光源照射至該光柵條紋投影裝置12，該光柵條 • 紋投影裝置12用以接收該白光點光源，以投影正弦函數週 期變化之條紋。該光柵條紋投影裝置12包括一具有週期性 條紋之光拇及一透鏡組。 ·' 該顯微鏡裝置13用以一設定之倍率處理該條紋，以將經 • 該顯微鏡裝置13處理之該條紋投影至該待測物體18之表 面。該設定倍率可由量測者設定。該移動平台14具有一校 正平面141，用以置放該待測物體18，該移動平台可由該 處理器控制沿一 z抽方向移動。本發明中之χ、丫及z軸方 向’清參考圖1所示。 112033.doc 1287079 該影像擷取裝置15經由該顯微鏡裝置13，擷取該待測物 體表面之各像素之相位值。該處理器16用以依據該待測物 體表面之各像素之相位值，計算該待測物體表面之三維形 貌。本發明之物體表面三維形貌量測系統i另包括一顯示 器17，用以顯示經該處理器計算之該待測物體表面之三維 形貌。 由於本發明之物體表面三維形貌量測系統係利用白光點 光源’具景深無限長之投影能力’以改善高倍率顯微量測 時’景深可量測範圍不足之問題，故可增加實際量測之縱 深範圍。 參考圖2至圖5,其顯示本發明利用白光點光源之物體表 面三維形貌量測方法之流程示意圖。首先配合參考圖以 圖2’如步驟S21所示’利用該白光點光源裝置，將一白光 點光源照射至該光柵條紋投影裝置12，以投影正弦函數週 期變化之條紋至該移動平台14之一校正平面i4i。該條纹 另經該顯微鏡裝置13以__設定之倍率處理該條紋。 如步驟S22所示，利用一 CCD影像掏取裝置㈣取該校 正平面之各像素之相位值。如步驟奶所示，利用該處理 控制該移動平台14之該校正平面⑷沿—z軸方 該校正平面之不同❻方向之各像素之相位 、、他軸方向移動之距離係以顯微鏡裝置Η 景深範圍内。如步驟S24所示，依據不同Z軸平面 之相位值，由處理㈣計算該校正平面之 象素 正函數，以完成Z軸之校正。 〃之Z軸杈 】】2033.doc 1287079 配合參考圖1及圖3，如步驟S31所示，置放一校正光柵 於該校正平面141，該校正光栅係平行於一 χ軸。該校正光 柵具有正弦函數強度變化之條紋。如步驟S32所示，利用 該CCD影像擷取裝置15擷取該校正平面之該χ轴之各像素 ^相位值。如步驟S33所示，利用該處理器丨6控制該移動 平台14之該校正平面141沿該ζ軸方向移動，並擷取該校正 平面之不同Ζ軸方向之該χ軸各像素之相位值。如步驟s34 所示，依據不同Z軸平面之該χ軸各像素之相位值，由處 理器16計算該校正平面之各像素軸校正函數，以完成 X軸之校正。 配合參考圖1及圖4，如步驟S41所示，置放該校正光拇 於該校正平面141，該校正光柵係平行於一 丫軸。如步驟 S42所示，利用該CCD影像擷取裝置15擷取該校正平面之 該Y軸之各像素之相録。如㈣S43所示，利用該處理器 16控制該移動平台14之該校正平面141沿該z軸方向移動， 並擷取該校正平面之不同z軸平面之該γ軸各像素之相位 值。如步驟S44所示，依據不同z軸方向之該γ軸各像素之 相位值，由處理器16計算該校正平面之各像素之γ轴校正 函數，以完成Υ軸之校正。 配合參考圖1及圖5，如步驟S51所示’利用該白光點光 源裝置11，將一白光點光源照射至該光柵條紋投影裝置 12，以投影正弦函數週期變化之條紋至該移動平台w之一 待測物體表面。如步驟S52所示，利用該ccd影像榻取裝 置15掘取該待測物體之各像素之相位值，係每一像素隨高 112033.doc -10· 1287079 度變化而扭曲之條紋相位值。如步驟S53所示，依據擷取 該待測物體表面之各像素之相位值，代入該校正平面之z 轴校正函數、X軸校正函數及γ軸校正函數，由該處理器 16冲异遠待測物體表面之三維形貌，並還原該待測物體表 面之三維形貌，顯示於該顯示器17。 本發明之量測方法是利用將條紋投影至物體表面，藉由 CCD影像操取裝置15擷取因物體表面高低起伏所造成的 光強度調變影像，利用快速傅立葉轉換（Fast F〇uHer1287079 IX. Description of the Invention: [Technical Field] The present invention relates to a three-dimensional topography measuring system and method for an object surface, and more particularly to a three-dimensional topography measuring system for an object surface using a white light point source and method. [Prior Art] The non-contact optical measurement technology is used to examine the three-dimensional shape of the object to be tested, and there is an increasing trend in the application of bioengineering and precision manufacturing engineering. In the existing non-contact topography detection technique, the shape of the object is determined by the method of fringe projection and the amount of distortion of the stripe projected on the object to be tested, which has become a striking measurement technique. Referring to the Republic of China Patent Publication No. 580556, which discloses an object surface three-dimensional topography measurement system, the architecture of the measurement system uses a stripe projection method to measure the two-dimensional shape of the object. The light source used in this architecture is mainly a white light source (such as mercury lamps, halogen lamps) or a laser source. However, both sources have their drawbacks that are difficult to erase. The expansion of the light source as a lighting device can cause the stripe to become a limited epth of f〇CUS range, making the actual range of the system's actual measurement limited. The laser light source as the illumination system of the projection system can solve this shortcoming, but it will cause the noise of the image capture due to the presence of the speckle, and the amount of the shape of the retreat. The exact value of the measurement. Therefore, it is necessary to provide an innovative and improved W-value ^ - *1.1 ^ ^^ innovative and progressive object surface three-dimensional shape measurement and method to solve the above [invention] 112033.doc 1287079 The object of the present invention is to provide a three-dimensional topography measuring system for an object surface using a white light point source for measuring a three-dimensional shape of a surface of an object to be tested, which comprises a white light point light source device, a grating stripe projection device, A microscope device, a mobile platform, an image capture device, and a processor. The white light point source device is configured to provide a white light point source. The grating stripe projection device is configured to receive the white light point source to project a fringe of a periodic variation of the sinusoidal function. The microscope device processes the strip at a set magnification. The mobile platform has a correction plane for placing the object to be tested, and the processed stripe is projected onto the surface of the object to be tested, and the mobile platform can control the movement. The image capturing device captures a phase value of each pixel on the surface of the object to be tested via the microscope device. The processor is configured to calculate a three-dimensional shape of the surface of the object to be tested according to a phase value of each pixel of the surface of the object to be tested. Another object of the present invention is to provide a three-dimensional topography measuring method for an object surface using a white light point source for measuring a three-dimensional shape of a surface of an object to be tested, comprising the following steps: (a) using a white light point source, Projecting a fringe of a periodic variation of the sine function to a correction plane; (b) calculating a Z-axis correction function, an X-axis correction function, and a γ-axis correction function of the correction plane; (c) placing the object to be tested on the correction plane; (d) capturing a phase value of each pixel of the surface of the object to be tested; and (e) determining a phase value of each pixel of the surface of the object to be tested, a Z-axis correction function of the correction plane, an X-axis correction function, and The γ-axis correction function 'calculates the three-dimensional topography of the surface of the object to be tested. Since the three-dimensional topography measuring system and method for the surface of the object of the present invention utilizes a white light point source, the depth range of the actual measurement can be increased. Furthermore, the present invention I I2033.doc 1287079 tooth J uses the speed-fast Fourier transform (Fast touch plus nickname) technology to pay for the surface winding phase of the object, and then replaces the positive function of each pixel obtained by the calibration process. The processor restores the three-dimensional shape of the surface of the object. Among them - the technical advantage is the rapid measurement of the standard, high-resolution analysis, shortening the time required for the microscopic object: ^ shape. The system of the invention is simple in erection and easy to measure, and is suitable for precise and automated testing. [Embodiment] φ Referring to Fig. 1, there is shown a schematic diagram of a three-dimensional topography measuring system for an object surface using a white light point source according to the present invention. The object surface three-dimensional topography measuring system 1 of the present invention is configured to measure a three-dimensional topography of a surface of an object to be tested, and includes: a white light point light source device u, a grating stripe projection device 12, a microscope device 13, and a movement The platform 14, an image capturing device 15 and a processor 16 white light source device 11 comprise an ultrashort pulse laser and a photonic crystal fiber 112 for providing a white point source. The white light point source illuminates the grating stripe projection device 12, the raster stripe projection device 12 for receiving the white point source to project a stripe of varying sinusoidal duration. The grating stripe projection device 12 includes an optical thumb and a lens group having periodic stripes. The microscope unit 13 processes the fringes at a set magnification to project the fringes processed by the microscope unit 13 onto the surface of the object 18 to be tested. The set magnification can be set by the measurer. The mobile platform 14 has a calibration plane 141 for placing the object 18 to be tested, and the mobile platform can be controlled by the processor to move in a z-drawing direction. The χ, 丫 and z-axis directions in the present invention are shown in Fig. 1. 112033.doc 1287079 The image capturing device 15 captures the phase values of the pixels on the surface of the object to be tested via the microscope device 13. The processor 16 is configured to calculate a three-dimensional shape of the surface of the object to be tested according to a phase value of each pixel of the surface of the object to be tested. The object surface three-dimensional topography measuring system i of the present invention further includes a display 17 for displaying a three-dimensional topography of the surface of the object to be tested calculated by the processor. Since the three-dimensional topography measuring system of the object surface of the present invention utilizes the white light point light source 'projecting ability with infinite depth of field depth' to improve the problem that the depth of field measurement range is insufficient when high-magnification microscopic measurement is performed, the actual amount can be increased. Measure the depth range. Referring to Figures 2 to 5, there is shown a flow chart showing a method for measuring the three-dimensional shape of an object surface using a white light point source according to the present invention. First, with reference to the reference picture, as shown in FIG. 2', using the white light point light source device, a white light point light source is irradiated to the grating stripe projection device 12 to project a sinusoidal function periodically changing stripe to one of the moving platforms 14. Correction plane i4i. This stripe is additionally processed by the microscope unit 13 at a magnification set by __. As shown in step S22, a CCD image capturing device (4) is used to take the phase values of the pixels of the correction plane. As shown in the step milk, the correction plane (4) of the moving platform 14 is controlled by the processing, and the phase of each pixel in the different ❻ direction of the correction plane along the z-axis is moved by the microscope device. Within the scope. As shown in step S24, the positive function of the pixel of the correction plane is calculated by the processing (4) according to the phase values of the different Z-axis planes to complete the correction of the Z-axis. Z-axis 〃] 2033.doc 1287079 Referring to Figures 1 and 3, as shown in step S31, a correction grating is placed on the correction plane 141, which is parallel to a χ axis. The correction grating has stripes of varying intensity of the sinusoidal function. As shown in step S32, the CCD image capturing device 15 captures the phase values of the pixels of the axis of the correction plane. As shown in step S33, the processor 丨6 controls the correction plane 141 of the moving platform 14 to move along the x-axis direction, and captures the phase values of the pixels of the yaw axis in different y-axis directions of the correction plane. As shown in step s34, the pixel axis correction function of the correction plane is calculated by the processor 16 according to the phase values of the pixels of the x-axis plane to complete the X-axis correction. Referring to Figures 1 and 4, as shown in step S41, the correcting light is placed on the correction plane 141, which is parallel to a 丫 axis. As shown in step S42, the CCD image capturing device 15 captures the pixels of the pixels of the Y-axis of the correction plane. The correction plane 141 of the moving platform 14 is controlled to move along the z-axis direction by the processor 16 as shown in (d) S43, and the phase values of the pixels of the γ-axis of different z-axis planes of the correction plane are extracted. As shown in step S44, the gamma axis correction function of each pixel of the correction plane is calculated by the processor 16 according to the phase values of the pixels of the γ-axis in different z-axis directions to complete the correction of the x-axis. Referring to FIG. 1 and FIG. 5, as shown in step S51, by using the white light point source device 11, a white light point source is irradiated to the grating stripe projection device 12 to project a stripe with a periodic variation of the sine function to the mobile platform w. The surface of the object to be tested. As shown in step S52, the phase value of each pixel of the object to be tested is traversed by the ccd image reclining device 15, and the stripe phase value of each pixel is distorted with a height of 112033.doc -10·1287079 degrees. As shown in step S53, the z-axis correction function, the X-axis correction function, and the γ-axis correction function of the correction plane are substituted according to the phase values of the pixels of the surface of the object to be tested, and the processor 16 is different. The three-dimensional shape of the surface of the object is measured, and the three-dimensional shape of the surface of the object to be tested is restored and displayed on the display 17. The measuring method of the present invention utilizes a FT image projection device 15 to capture a light intensity modulated image caused by the undulation of the surface of the object, and utilizes a fast Fourier transform (Fast F〇uHer).
Transform簡稱FFT)技術求将物體表面纏繞相位，爾後， 再代入校正過程所得每一個像素之校正函數，最後.由處理 器還原物體表面三維形貌。其中使用卯丁技術優點為量測 迅速準確、具高解析度分析，進而有效達到快速工業自動 化的檢測之要求。 本發明$測方法分成校正過程與顯微物量之量测兩大部 分。校正過程採用本發明所提出之Calibrati〇n basedTransform referred to as FFT) technology to wrap the surface of the object, and then replace the correction function of each pixel obtained by the calibration process. Finally, the processor restores the three-dimensional shape of the surface of the object. Among them, the advantages of using Kenting technology are rapid and accurate measurement and high-resolution analysis, which effectively meets the requirements of rapid industrial automation. The present invention is divided into two parts, a calibration process and a measurement of the amount of microscopic matter. The calibration process uses the Calibrati〇n based proposed by the present invention.
rojected Fringe Profilometry 簡稱 Calibration-based PFP 方法其執行步驟詳見圖2之Calibration-based PFP方法 之Phase-depth校正，接續將執行圖3之以丨加如⑽讣以以 PFP 方法之 depth-h〇rizontal校正與圖 4 之 dep.vertic^ 正。當元成杈正步驟後，記錄每一像素之獨立校正函數， 待測物件的表面三維型貌量測 只需將所擷取到表面每一Rojected Fringe Profilometry, referred to as the Calibration-based PFP method, is shown in Figure 2. The Phase-depth correction of the Calibration-based PFP method is performed, and the implementation will be performed as shown in Figure 3 by adding (10) to the depth-h〇rizontal of the PFP method. Correct the dep.vertic^ positive with Figure 4. After the step of Yuan Chengzheng, the independent correction function of each pixel is recorded, and the surface three-dimensional appearance measurement of the object to be tested only needs to be captured to the surface.
際上所相對應的高度， V W衣甸像素之相位值，轉換成實 進而繪出待測物件的表面三維型 112033.doc 1287079 貌。 本發明利用白光點光源之物體表面三維形貌量測系統及 方法之優點為·· M具備大景深的量測工作範圍；2•非接觸 式光學1測，故不破壞物件表面，適合高精密性元件量 測；3·量測工作時間短，適合工業界線上量測；及#•工作 %楗要求低，不受溫度、溼度、壓力、粉塵所影響。 惟上述實施例僅為說明本發明之原理及其功效，而非用 以限制本發明。因此，習於此技術之人士可在不達背本發 月之精神對上述實施例進行修改及變化。本發明之權利範 圍應如後述之申請專利範圍所列。 【圖式簡單說明】 圖1係顯示本發明利用白光點光源之物體表 量測系統之示意圖;及 -料貌 圖2係顯示本發明物體表面三維形貌量測方法之2軸校正 之流程示意圖； 圖3係顯示本發明物體表面三維形貌量測方法之乂軸校正 之流鞋示意圖； 圖4係顯示本發明物體表面三維形貌量測方法之γ軸校正 之流程示意圖；及 圖5係顯示本發明物體表面三維形貌量測方法之流程示 意圖。 【主要元件符號說明】 I 本發明之物體表面三維形貌量測系統 II 白光點光源裝置 112033.doc 1287079 12 光柵條紋投影裝置 13 顯微鏡裝置 14 移動平台 15 影像擷取裝置 16 處理器 17 顯示器 18 待測物體 111 超短脈衝雷射At the corresponding height, the phase value of the V W Yidian pixel is converted into a solid and then the surface of the object to be tested is three-dimensional. The advantages of the three-dimensional shape measuring system and method for the surface of the object using the white light point source are that the M has a large depth of field measurement working range; 2• the non-contact optical 1 measurement, so the surface of the object is not destroyed, and the high precision is suitable. Sexual component measurement; 3·Measurement working time is short, suitable for industrial line measurement; and #•Work%楗 requires low temperature, humidity, pressure and dust. However, the above-described embodiments are merely illustrative of the principles of the invention and its effects, and are not intended to limit the invention. Therefore, those skilled in the art can make modifications and changes to the above embodiments without departing from the spirit of the present invention. The scope of the invention should be as set forth in the appended claims. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic view showing an object surface measuring system using a white light point light source according to the present invention; and FIG. 2 is a flow chart showing a 2-axis calibration method for measuring a three-dimensional topography of an object surface of the present invention. FIG. 3 is a schematic diagram showing a crucible-corrected flow shoe of the surface three-dimensional shape measurement method of the object of the present invention; FIG. 4 is a flow chart showing the γ-axis correction of the three-dimensional topography measurement method of the surface of the object of the present invention; A schematic flow chart showing a method for measuring the three-dimensional shape of the surface of the object of the present invention. [Main component symbol description] I The object surface three-dimensional shape measurement system of the present invention II White light point light source device 112033.doc 1287079 12 Grating fringe projection device 13 Microscope device 14 Mobile platform 15 Image capturing device 16 Processor 17 Display 18 Waiting Measuring object 111 ultrashort pulse laser
112 光子晶體光纖 141 校正平面112 Photonic Crystal Fiber 141 Correction Plane
112033.doc -13 -112033.doc -13 -