TWI266602B - EMI shielding package and method of making the same - Google Patents

EMI shielding package and method of making the same

Info

Publication number
TWI266602B
TWI266602B TW94112031A TW94112031A TWI266602B TW I266602 B TWI266602 B TW I266602B TW 94112031 A TW94112031 A TW 94112031A TW 94112031 A TW94112031 A TW 94112031A TW I266602 B TWI266602 B TW I266602B
Authority
TW
Taiwan
Prior art keywords
making
same
shielded
emi shielding
shielding package
Prior art date
Application number
TW94112031A
Other languages
Chinese (zh)
Other versions
TW200637480A (en
Inventor
Xiao-Hua Kong
Original Assignee
Hon Hai Prec Ind Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hon Hai Prec Ind Co Ltd filed Critical Hon Hai Prec Ind Co Ltd
Priority to TW94112031A priority Critical patent/TWI266602B/en
Publication of TW200637480A publication Critical patent/TW200637480A/en
Application granted granted Critical
Publication of TWI266602B publication Critical patent/TWI266602B/en

Links

Landscapes

  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)

Abstract

An electromagnetic interference (EMI) shielding package includes a substrate mounting a plurality of electronic components, which the electronic component comprising components being shielded or not being shielded; a metal cap is configured on the substrate, which is covered on the electronic components being shielded; and a plastic encapsulating the electronic components being shielded, the metal cap, and gaps between the electronic components and the substrate.
TW94112031A 2005-04-15 2005-04-15 EMI shielding package and method of making the same TWI266602B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW94112031A TWI266602B (en) 2005-04-15 2005-04-15 EMI shielding package and method of making the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW94112031A TWI266602B (en) 2005-04-15 2005-04-15 EMI shielding package and method of making the same

Publications (2)

Publication Number Publication Date
TW200637480A TW200637480A (en) 2006-10-16
TWI266602B true TWI266602B (en) 2006-11-11

Family

ID=38191620

Family Applications (1)

Application Number Title Priority Date Filing Date
TW94112031A TWI266602B (en) 2005-04-15 2005-04-15 EMI shielding package and method of making the same

Country Status (1)

Country Link
TW (1) TWI266602B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI463735B (en) * 2010-08-03 2014-12-01 Shunsin Technology Zhong Shan Ltd Module having an antenna interface and manufacturing method thereof

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI619224B (en) * 2017-03-30 2018-03-21 Siliconware Precision Industries Co., Ltd. Electronic package and its manufacturing method

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI463735B (en) * 2010-08-03 2014-12-01 Shunsin Technology Zhong Shan Ltd Module having an antenna interface and manufacturing method thereof

Also Published As

Publication number Publication date
TW200637480A (en) 2006-10-16

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees