TW461589U - Lead frame of QFP package - Google Patents

Lead frame of QFP package

Info

Publication number
TW461589U
TW461589U TW89218915U TW89218915U TW461589U TW 461589 U TW461589 U TW 461589U TW 89218915 U TW89218915 U TW 89218915U TW 89218915 U TW89218915 U TW 89218915U TW 461589 U TW461589 U TW 461589U
Authority
TW
Taiwan
Prior art keywords
lead frame
qfp package
qfp
package
lead
Prior art date
Application number
TW89218915U
Other languages
Chinese (zh)
Inventor
C L Lin
R B Tsai
H P Liu
Original Assignee
Chipmos Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Chipmos Technologies Inc filed Critical Chipmos Technologies Inc
Priority to TW89218915U priority Critical patent/TW461589U/en
Publication of TW461589U publication Critical patent/TW461589U/en

Links

TW89218915U 2000-10-27 2000-10-27 Lead frame of QFP package TW461589U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW89218915U TW461589U (en) 2000-10-27 2000-10-27 Lead frame of QFP package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW89218915U TW461589U (en) 2000-10-27 2000-10-27 Lead frame of QFP package

Publications (1)

Publication Number Publication Date
TW461589U true TW461589U (en) 2001-10-21

Family

ID=21674466

Family Applications (1)

Application Number Title Priority Date Filing Date
TW89218915U TW461589U (en) 2000-10-27 2000-10-27 Lead frame of QFP package

Country Status (1)

Country Link
TW (1) TW461589U (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109841590A (en) * 2017-11-28 2019-06-04 恩智浦美国有限公司 Lead frame for the IC apparatus with J lead and gull wing lead
CN109904136A (en) * 2017-12-07 2019-06-18 恩智浦美国有限公司 Lead frame for the IC apparatus with J lead and gull wing lead
CN110707063A (en) * 2018-07-10 2020-01-17 恩智浦美国有限公司 Lead frame with bendable leads

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109841590A (en) * 2017-11-28 2019-06-04 恩智浦美国有限公司 Lead frame for the IC apparatus with J lead and gull wing lead
CN109904136A (en) * 2017-12-07 2019-06-18 恩智浦美国有限公司 Lead frame for the IC apparatus with J lead and gull wing lead
CN110707063A (en) * 2018-07-10 2020-01-17 恩智浦美国有限公司 Lead frame with bendable leads

Similar Documents

Publication Publication Date Title
SG94812A1 (en) Frame for semiconductor package
TW458377U (en) Sensor structure of quad flat package without external leads
EP1080824A4 (en) Leadless solder
SG91352A1 (en) Semiconductor package
SG104291A1 (en) Die package
SG105544A1 (en) Ultrathin leadframe bga circuit package
AU149513S (en) Package
TW461589U (en) Lead frame of QFP package
GB2368462B (en) Mounting structure of semiconductor package
TW483588U (en) Pin arrangement of package lead frame
TW443583U (en) Photoelectric IC lead frame
TW416573U (en) Semiconductor package having improved lead frame
TW461587U (en) Improved structure of the connection wire frame for semiconductor chip packaging
TW487225U (en) Lead frame for packaging multi-chip
TW504042U (en) Improved structure of chip package
TW467397U (en) Box-exchanging device of lead frame
TW471706U (en) QFN package structure and its leadframe
TW458385U (en) Lead frame having die pad
TW444926U (en) Lead frame structure of integrated circuit chip
GB0103884D0 (en) Package
TW462536U (en) Chip package structure
TW482334U (en) Quad flat package
TW529770U (en) Chip scale package
TW467400U (en) Irregular BGA package structure
GB9923998D0 (en) Novel package

Legal Events

Date Code Title Description
GD4K Issue of patent certificate for granted utility model filed before june 30, 2004