440905 A7440905 A7
經濟部智慧財產局員工消費合作社印*'1^ 5-1發明領域： 本發明係有關於一種半導體製程用的機台設備與使 用方法，特别是關於一種負載閉鎖室與機械傳動手臂終 至，以及可以防止空氣與水氣進入的晶圓存取方法。 5-2發明背景： 在電子與半導體工業中，必須在每一半導體晶圓上進 行諸如氧化，沈積，微影、蝕刻等種種的製程步驟，以製 作各種積體電路的元件與連線佈局。爲因應半導體製程的 各種特走需求，製程所使用的各種機台設備系统都經過特 殊的設計。第一A圖中顯示出用以進行半導體製程的— 典型之基本機台設備的俯視圖。其中，各製程反應室1〇 環燒十央的緩衝室（buffer ciiainber)20设置，預定進行製 程的晶圓成批置放於晶舟盒中，由機台外圍的機械傳動系 統將晶舟盒送入設置於緩衝室20旁的一負載閉鎖室（i〇ad lock chamber)30之中暫時存放，以待製裎之進行。 當製程開始進行時，缓衝室20與負載閉鎖室30内的 氣壓調整至約略與製程反應所需相當的水平，並與外界保 持密閉隔離，然後由缓衝室20中的機械傳動系統將晶圓 由負載閉鎖室30内--取出，分别送入各製程反應室10 之中進行製程。當製程完成後’再由緩衝室20中的機械 本纸張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） , —1^--------訂---------線 t , (請先閱讀背面之注意事項再填寫本頁) 經濟部智慧財產局員工消費合作社印製 A7 B7 五、發明說明（） 傳動系統將晶圓由各製程反應室10内分别取出，一一送 回負載閉鎖至30之中。當負載閉鎖室3〇中的所有晶圓都 完成預定的製程後，再由機台外圍的機械傳動系統將晶舟 盒自負載閉鎖室30之中取出。此—運作機制爲半導體製 程機台系統的基本運作模式之一，大部分的系統均採用此 一模式或是其改良的方式運作。 在上述的過程中，晶圓與晶舟盒自負載閉鎖室之 中取出的步骑’是整個運作系統中與外界產生聯繫的接處 點，第一 B圖顯示出第一 A圖的機台設備中，一傳統的 負載閉鎖室30與機台外圍的機械傳動系統連接設計的剖 面圖。在此一設計中，過渡區裝置40及晶舟盒轉移用機 械手臂（Transfer Arm〉50依序連接於負載閉鎖室3〇旁， 與緩衝室（buffer chamber)20相對應的一側。其中，過渡 區裝置40爲一壓克力板，並固定在機械手臂5〇之上方， 用以防止高處不明物體掉入負載閉鎖室與機械手臂之間的 過渡區内，而造成晶片的毁損或污染。 在一階段的製程開始進行時，首先要將晶圓與晶舟盒 送入負載閉鎖室30之中，其流程參見第一 C囷。首先於 負載閉鎖室30中導入一惰性氣流（步驟101)，用以調整 閉鎖室内的氣壓。當閉鎖室内的氣壓達到與外界相同的常 壓（一大氣壓）時，關閉惰性氣流以維持壓力穩定，然後 打開負載閉鎖室與機械手臂之間的閘門（步驟102)，開始 本紙張尺度適闬中國國家標準（CNS)A4規格（210 x297公釐） -f— Ml i n n n HI n n ΙΛ I' n n I n-^aJ· n 1 n 1— n I- I>. < (請先閱讀背面之注意事項再填寫本頁) 經濟部智慧財產局員工消費合作社印裂 A7 B7 五、發明說明（） 以機械手臂50進行晶圓與晶舟盒存取裝卸的動作（步驟 103) ’最後將閘門關閉（步驟1〇3)，即完成整個晶園栽人 的流程。至於階段製程結東後的晶圓與晶舟盒自負載閉鎖 室30中卸載的程序，則大致與載入的程序相同，只有機 械手臂裝卸晶圓與晶舟盒的動作相反而已。 在上述整個晶圓與晶舟盒存取裝卸的過程中，當負載 閉鎖室對外的閘門打開以便於進行晶圓存取時，負載閉鎖 室成爲一開放的空間，由於—般在負載閉鎖室内用以調整 壓力的氣體都採用惰性氣體，因此閉鎖室内外的氣體種類 與濃度並不相同，外界的空氣與水分等將會擴散進入負載 閉鎖室之中。此時，若是製程完成後的晶圓上殘留有容易 與空氣成分或水氣結合的物質時，將容易對負載閉鎖室以 致於後續載入的晶圓產生污染’此一狀況在溝渠蝕刻—類 的製程機台上尤爲重要。 在半導體製程中，淺溝梁（shallow trench)在晶圓上 的形成可用以隔離積體電路中的各電晶體，或形成溝渠電 容’這種技術於是大量應用在積體電路的製程當中β在形 成淺溝渠的同時，囡爲蝕刻物質（如氣、溴化氫等組成之 此合物）對$夕晶片的蚀刻會有高分子聚合物（polymer)生成 在淺溝渠的表面，而此高分子篥合物在空氣中遇水氣會產 生具腐蝕性之物質及微粒，其與水氣作用的化學反應式可 以下式表示： 本纸張尺度適用中國國家標準（CNS)A4規格（21〇 X 297公釐〉 <.11 1111..^--------訂-------1線 I. f靖先閱讀背面之注意事項再填鸾本頁) 經濟部智慧財產局員工消費合作社印製 A7 B7 五、發明說明（）Printed by the Consumers ’Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs * '1 ^ 5-1 Field of Invention: The present invention relates to a machine equipment and a method for using the semiconductor process, and in particular to a load lock chamber and a mechanical transmission arm. And wafer access method that can prevent air and water from entering. 5-2 Background of the Invention: In the electronics and semiconductor industries, various process steps such as oxidation, deposition, lithography, and etching must be performed on each semiconductor wafer to produce various integrated circuit components and wiring layouts. In order to meet the various special requirements of the semiconductor process, the various machine equipment systems used in the process have been specially designed. The first A shows the top view of a typical basic machine for semiconductor manufacturing. Among them, each process reaction chamber 10 ring-burning Shiyang buffer chamber (buffer ciiainber) 20 is set, the wafers scheduled to be processed are placed in the wafer box in batches, and the wafer boat box is mechanically driven by a mechanical transmission system around the machine It is sent to a load lock chamber 30 located next to the buffer chamber 20 for temporary storage, and is to be processed. When the process begins, the air pressure in the buffer chamber 20 and the load lock chamber 30 is adjusted to a level approximately equal to that required for the process reaction, and is kept closed and isolated from the outside world, and then the crystal is transferred by the mechanical transmission system in the buffer chamber 20 The circles are taken out from the load lock chamber 30-and sent to the reaction chambers 10 for processing. When the process is completed, the paper size of the machine in the buffer chamber 20 is applicable to the Chinese National Standard (CNS) A4 specification (210 X 297 mm), --1 ^ -------- Order ---- ----- line t, (Please read the notes on the back before filling this page) Printed by the Consumers' Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs A7 B7 V. Description of the invention () The transmission system transfers the wafers from each process reaction chamber 10 Take out the inside separately, and send them back to the load lock to 30 one by one. After all the wafers in the load lock chamber 30 have completed the predetermined process, the wafer box is taken out of the load lock chamber 30 by the mechanical transmission system on the periphery of the machine. This—operation mechanism is one of the basic operation modes of the semiconductor process machine system. Most systems operate in this mode or in an improved way. In the above-mentioned process, the step-pedals taken out of the wafer and wafer boat box from the load lock chamber are the contact points for contact with the outside world in the entire operating system. The first diagram B shows the machine of the first diagram A In the equipment, a cross-sectional view of a conventional load lock chamber 30 is designed to be connected to a mechanical transmission system on the periphery of the machine. In this design, the transition zone device 40 and the boat arm transfer robot (Transfer Arm> 50) are sequentially connected to the load lock chamber 30 next to the side corresponding to the buffer chamber 20. Among them, The transition zone device 40 is an acrylic plate and is fixed above the robotic arm 50 to prevent unknown objects from falling into the transitional region between the load lock chamber and the robotic arm, resulting in damage or contamination of the wafer. At the beginning of the one-stage manufacturing process, the wafer and wafer box are first sent into the load lock chamber 30, the process is described in the first step C. First, an inert gas flow is introduced into the load lock chamber 30 (step 101). ) To adjust the air pressure in the lock chamber. When the air pressure in the lock chamber reaches the same atmospheric pressure (one atmosphere) as the outside world, close the inert gas flow to maintain the pressure stability, and then open the gate between the load lock chamber and the robot arm (step 102), from the beginning of this paper the size of the national standard (CNS) A4 (210 x 297 mm) -f— Ml innn HI nn ΙΛ I 'nn I n- ^ aJ · n 1 n 1— n I- I > . < (Please read Note on the back, please fill in this page again.) Employees 'cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs printed A7 B7. V. Description of the invention () Use the robotic arm 50 to carry out the loading and unloading of wafers and wafer box (step 103)' Finally The shutter is closed (step 103), and the entire planting process is completed. As for the process of unloading the wafer and wafer boat from the load lock chamber 30 after the stage process is completed, it is roughly the same as the loaded program. Only the robotic arm loads and unloads the wafer and the wafer boat. In the process of loading and unloading the wafer and wafer boat, the load lock chamber opens to the outside for easy wafer access. The lockout chamber becomes an open space. Because the gas used to adjust the pressure in the load lockout chamber is generally an inert gas, the types and concentrations of gases inside and outside the lockup chamber are not the same. The outside air and moisture will diffuse into the load. Locking chamber. At this time, if there is a substance remaining on the wafer after the process, which is likely to be combined with air components or moisture, it will be easy to lock the chamber to the load. Contamination caused by subsequent loaded wafers is particularly important on trench-etching-type process equipment. In the semiconductor process, the formation of shallow trenches on the wafer can be used to isolate the product. Each transistor in the body circuit, or the formation of trench capacitors, is a technique that is widely used in the process of integrated circuits. While forming shallow trenches, β is a combination of etching materials (such as gas and hydrogen bromide). In the etching of wafers, high-molecular polymers (polymers) are formed on the surface of shallow trenches, and this polymer compound will generate corrosive substances and particles when it meets water and air in the air. The chemical reaction formula of gas action can be expressed as follows: The paper size is applicable to the Chinese National Standard (CNS) A4 specification (21 × X 297 mm) < .11 1111 .. ^ -------- order- ------ 1 line I. f Jing first read the notes on the back and then fill out this page) Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs A7 B7 V. Description of Invention ()
SiOBr + H20 -> HBr + Si02 上式説明高分子聚合物（SiOBr)(因其各原子之組成比例難 以測計’在此未將之組成比例標出）與水作用會產生溴化 氫（HBr)與二氧化矽（si〇2)微粒。這種腐蝕性的溴化氣在 製程機台中會腐蝕機台組件，腐蝕出來的微粒會造成整個 室内及晶片的污染，加以該二氧化矽微粒造成的污染，淺 溝渠蝕刻的製程良率將囡這些污染而大大降低。 因此’在渠溝姓刻這一類的製程設備中，晶圓與空氣 及水氣的隔離成爲重要的條件。然而，在上述典型的機太 台設備設計下，晶圓由負載閉鎖室卸載時，將會在負載閉 鎖室内接觸到外界的空氣，各淺溝渠表面殘餘的高分子聚 合物將因與空氣接觸而快速與其中的水氣發生化學反應’ 進而產生腐触性的溴化氫與二氧化矽污染微粒。其中漢化 氫會腐姓負載閉鎖室3〇、過渡區裝置、4〇以及機械手臂5〇, 這種機台組件的腐蝕將會產生其他的污染微粒，這些微粒 及原產生的一氧化石夕微粒會黏著在晶片的表面，導致製程 步驟之良率大幅下降。 、此外，以上所述之過渡區装置僅爲一壓克力板，只能 防止愿克力板上方的物質掉入過渡區裝，並未具有密 封的效能。在晶圓下載的過程中，當負載閉鎖室打開之後， 不獨負載閉鎖至内將充滿2氣與水氣而造成污染，當晶圓 移出至過渡區裝置時，囡晶圓與空氣中的水氣接觸而產生 本纸張尺度適用規格⑵0x297 ^ -------------d--------訂---------線< (請先閱讀背面之注意事項再填寫本頁) 440905 A7 B7 五、發明說明（ 漠化iL和一乳化發，過奸ρ举要基地从 度£裝置旁的機件裝置都將被腐 蝕，且晶片上因此黏附污染微粒而加重污染情形。 5-3發明目的與概述： 習知技術在淺溝渠蝕刻機台一類的設備裝置中，因負 載閉鎖室在晶圓存取過程中無法形成"環境，無法避免 溝渠蝕刻等製程後之殘留物接觸空氣而造成污$ :有鑑於 此，本發明揭露一種鬲圓暫存系统，與製裎用之機台設備 連結設置，以惰性氣體環境裝置與存取方珐的配合使用， 能夠有效防止空氣進入製程用之機台裝置中，避免污染的 產生。 V… d--------訂 (請先閱讀背面之注意事項再填寫本頁) 本發明的 以置放晶圓、 晶圓暫存裝置’至少包含一負載 一機械手臂裝置用以傳送晶圓晶 境裝置設置於其間。其中，負載 經濟部智慧財產局員工消費合作社印製 一惰性氣體環 含一製程出入口 第一排氣口。惰性氣體環境裝置包含一負載出 傳動出入口、 載出入口與負 控制其開關 閉鎖室用 舟、以及 閉鎖室包 一存取出入口、一第一通氣口以及一 線 第二通氣口、以及 載閉鎖室之存取出入口 。機械手臂裝置則包含 一外罩，此外罩與惰性氣體環境裝置 動手臂可經由傳動出入 並經由負載出入口與存 結，使機械傳 境裝置之中， 閉鎖室之中； 該外罩上並具有一第 第二排氣 相連接， 一機械傳 之傳動出 口進入惰 取出入σ 三通氣〇 入σ 、一 σ ，而負 並以一閘 動手臂與 入口相連 性氣體環 進入負載 以導入氣 本纸張尺度適用中國0家標準（CNS)A4規格（210x297公釐） Α7 B? 經濟部智慧財產局員工湞費合作社印*1^ 五、發明說明（） 體 以本發明所提俱之晶圓暫存 以下所提供的晶圓存取方法 直裝卸晶圓時，配合 避免空氣入侵。首先導入—可以形成隔離的空間， 以調整壓力，☆負載閉鎖室：^性氧祗至負載閉鎖室中 …矣 預定的壓力後停止第-惰 性氣流，其間弟一惰性惫泸任1 a 軋戽係由慢而快逐漸加速進入备載 閉鎖室，以減缓擾動。 n八”孰 在調整負載閉鎖室壓力的同時或稍冑，導入一第二 惰性氣流至惰性氣體環境裝置中；並導入一第三惰性氣* 至機械手臂二置的外罩中。此第二惰性氣流係由惰性氣： 環境裝置之第二辿氣口導入，並由惰性氣體環境裝置之第 二排氣口導出，在惰性氣體環境裝置中形成一氣流簾幕。 第三惰性氣流則由機械手臂裝置之第三通氣口進入，流向 惰性氣體環境装置中，然後由惰性氣體環境裝置之第二排 氣口導出。 在第二惰性氣流與第三惰性氣流持續流動之間，打 開負載閉鎖室與惰性氣體環境裝置之間的閘門，同時重行 導入第一惰性氣流至負載閉鎖室中。此時重行導入負載閉 鎖室的第一惰性氣流將通過負載閉鎖室與惰性氣體環境裝 置之間的閘門，進人惰性氣體環境装置之中，然後由惰性 氣體環境裝置之第二排氣口導出。 在第一、第二與第三情性氣流持續作用下’系統形 本纸張尺度適用中國國家標準（CNS)A4規格（210 X 297公爱） rtt n fi m l fl^— 1 n· n n ^1* J ，V n n Kf f^i n t $ 4 言 矣 i請先閱讀背面之注意事項再填寫本頁) A7 B7 五、發明說明（） 成一個隔離的空間，此時即可以機械 巧衣置進^干# 士 取的動作，然後關閉負載閉鎖室與惰性氣趙 ：圓存 的閑門，並關閉第一、第二與第三情性氣流，完成二’ 舟的存取流程。 π ® m 5-4圖式簡單説明： 經濟部智慧財產局員工消費合作社印製 本發明的較佳實施例將於往後之説明文字中輔以下列 圖形做更詳細的閣述： 第一 A圖爲傳統技藝中，用以進行半導體製程的一 典型之基本機台設備的俯視圖； 第一 B圖爲第一 A圏的機台設備中，一傳統的負載 閉鎖室與機台外圍的機械傳動系統連接設計的剖面囷； 第一 C圖爲傳統技藝中，於負載閉鎖室中存取晶圓 與晶舟盒的流程圖； 第二囷爲根據本發明所提出之半導體製程用之一晶 圓暫存系統之剖面示意圖； 第三圖爲根據本發明，於負載閉鎖室中存取晶圓與 晶舟盒的流程圖；以及 第四圖爲根據本發明，於負載閉鎖室中存取晶圓與 晶舟盒時，氣流控制的時脈圖。 本紙張又度適用中賴家標準（CNS)如規格C 297公爱） {請先閱讀背面之注意事項再填寫本頁) 装--------訂it--!,線. 44090 5 Α7 Β7 五、發明說明（ 5-5圖號對照説明 10 製程反應室 30 負載閉鏔室 50 機械手臂 210負載閉鎖室 214負載閉鎖室存取出入 216第一通氣口 20 緩衝室 40 過渡區裝置 200製程緩衝室 212負載閉鎖室製程出入口 218第一排氣口 220墮性氣體環境装置 222堕性氣體環境装置之負載出入口 224堕性氣體環境装置之傳動出入口 226第二通氣口 230機械手臂裝置 234機械手臂外罩 1抑氣體通道（？) 228 4二排氣口 232機械傳動手臂 236第三通氣口 • -----^<---I---訂---I--i J線.i (請先閱讀背面之注意事項再填寫本頁) 經濟部智慧財產局員工消費合作社印製 5-6發明詳細説明： 本發明提出一種半導體製成設備中的晶圓暫存系真 採用一惰性氣體環境装置結合於負載閉鎖室與機械傳聋 臂之間，配合三道惰性氣流的作用，構成隔離的晶圓^ 空間，使空氣與水氣無法進入，減少晶圓存取過程中ό 染。避免設備組件與後續載入的晶圓受到腐蝕損害。 衣紙張尺度適用中_家標準（CNS)A4規格咖x 297公®·)_ 440905 A7 B7 經濟部智慧財產局員工消費合作社印製 五、發明說明（） 第二圖類示出本發明所提出之半導體製程用之一晶 圓暫存系統之剖面示意圖，此—暫存系統可與製程用之 機台設備連結，設置於製程緩衝室2〇〇的周側，在製程 反應前後用以置放晶圓。在此—晶圓暫存系統中包含有 一負載閉鎖至（load lock chamber)210，用以置放晶圓與 晶舟盒。負載閉鎖室210中設置有一製程出入口 212、 一存取出入口 214、一第一通氣口 216以及一第一排氣 口 218»製程出入口 212連通至製程緩衝室200，設置 有製程閘門控制其開赭。存取出入σ 214則連通至一惰 性氣體環境裝置220，同樣設置有存取閘門控制其開關。 第一通氣口 216可用以導入氣體至該負載閉鎖室中；第 一排氣口 218則可以將氣體自負載閉鎖室中排出，二者 均與眞空抽吸系統連結，可以控制負載閉鎖室中的氣 壓。 緊鄰負載閉鎖室210旁連接一惰性氣體環境裝置 22(^此惰性氣體環境裝置220設置有一負載出入口 222、 一傳動出入口 224、一第二通氣口 226、以及一第二排氣 口 228。負載出入口 222與負載閉鎖室210之存取出入口 214相連接，以前述的閘鬥控制其間的連通與隔離。第二 通氣口 226連結一氣體傳送系統，可以將氣體由此導入惰 性氣體環境装置220之中。第二排氣口 228則可以連接一 排氣系統，以將惰性氣體環境裝置220中的氣體由此排 出0 (請先閱讀背面之江意事項再填寫本頁) 衰------II訂----- 線 本纸張尺度適用中國國家標準（CNS)A4規格（210x297公釐）SiOBr + H20-> HBr + Si02 The above formula shows that high molecular polymer (SiOBr) (because its composition ratio of each atom is difficult to measure; its composition ratio is not shown here) and water will generate hydrogen bromide ( HBr) and silicon dioxide (SiO2) particles. This corrosive bromine gas will corrode machine components in the process machine. The corroded particles will cause pollution of the entire room and the wafer. Adding the pollution caused by the silicon dioxide particles, the process yield of shallow trench etching will be 囡These pollutions are greatly reduced. Therefore, in process equipment such as Qugou, the isolation of wafers from air and water vapor has become an important condition. However, under the above-mentioned typical equipment design, when the wafer is unloaded from the load lock chamber, it will come into contact with the outside air in the load lock chamber, and the residual high-molecular polymers on the surface of each shallow trench will be exposed to the air. Quickly react chemically with the water and gas in it ', which in turn produces corrosive hydrogen bromide and silicon dioxide contaminated particles. Among them, Hanhua Hydrogen will rot the load lock chamber 30, the transition zone device, 40, and the robotic arm 50. The corrosion of this machine component will generate other contaminating particles, these particles and the original monoxide particles Will stick to the surface of the wafer, resulting in a significant decrease in the yield of the process steps. In addition, the above-mentioned transition zone device is only an acrylic board, which can only prevent the material above the acrylic board from falling into the transition zone and does not have the sealing effect. During the wafer downloading process, when the load lock chamber is opened, the load will not be locked until it is filled with 2 gas and water gas, which will cause pollution. When the wafer is moved to the transition zone device, the water vapor in the wafer and the air will be polluted. Applicable specifications resulting from contact with this paper size ⑵0x297 ^ ------------- d -------- order --------- line < (read first Note on the back, please fill out this page again) 440905 A7 B7 V. Description of the invention (Desert the iL and an emulsified hair, for example, if you want to use the base, the mechanical devices next to the device will be corroded, and the wafer will be adhered because of this Pollution of particles will aggravate the situation of pollution. 5-3 Purpose and Summary of the Invention: Conventional technology In equipment such as shallow trench etching machines, the load lock chamber cannot form an "environment" during wafer access, and the trench cannot be avoided. Residues after processes such as etching contact the air and cause contamination. In view of this, the present invention discloses a circular storage system, which is connected with the equipment used in the production process, and uses an inert gas environment device and the accessor's enamel. When used together, it can effectively prevent air from entering the machine equipment used in the process. Free from pollution. V ... d -------- Order (please read the precautions on the back before filling out this page) The present invention for placing wafers and wafer temporary storage devices includes at least one load and one A robotic arm device is used to transfer wafers to the interstitial device. Among them, the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economics of the Loader printed an inert gas ring containing a process inlet and outlet first exhaust port. The inert gas environment device contains a load The drive inlet and outlet, the load inlet and outlet, and the boat for controlling the opening and closing of the lock room, and the lock room include an access door, a first vent and a second line vent, and the access door of the lock chamber. The robotic arm device contains An outer cover, the outer cover and the inert gas environment device can be moved in and out through a drive, and loaded and entered through a load inlet and outlet, so that the mechanical transit device is locked in the chamber; the outer cover is provided with a second exhaust connection A mechanical transmission transmission exit enters the inertia and takes out the σ three-way ventilation 〇 σ, a σ, and the negative and a brake to move the arm and the inlet connected to the air Into the load to import gas Paper size Applicable to China's 0 standard (CNS) A4 size (210x297 mm) Α7 B? Printed by the co-operative cooperative of employees of the Intellectual Property Bureau of the Ministry of Economic Affairs * 1 ^ 5. Description of the invention () The wafer storage method mentioned in the invention temporarily stores the wafer access method provided below to prevent the invasion of air when loading and unloading the wafer. First introduction-it can form an isolated space to adjust the pressure, ☆ load lock chamber: ^ oxygen祗 Into the load lock chamber ... 矣 After the predetermined pressure, the first-inert gas flow is stopped, during which time the brother is inert and exhausted. Any 1 a rolling system is gradually and slowly accelerated into the backup load lock chamber to slow down the disturbance.同时 While adjusting or slightly adjusting the pressure of the load lock chamber, introduce a second inert gas flow into the inert gas environment device; and introduce a third inert gas * into the outer cover of the robot arm. This second inert gas flow is introduced from the second radon port of the inert gas: environment device, and is led out from the second exhaust port of the inert gas environment device to form an air curtain in the inert gas environment device. The third inert gas flow enters through the third vent of the robotic arm device, flows into the inert gas environment device, and then exits through the second exhaust port of the inert gas environment device. Between the second inert gas flow and the third inert gas flow, the gate between the load lock chamber and the inert gas environment device is opened, and the first inert gas flow is re-introduced into the load lock chamber. At this time, the first inert gas flow re-introduced into the load lock chamber will pass through the gate between the load lock chamber and the inert gas environment device, enter the inert gas environment device, and then be led out by the second exhaust port of the inert gas environment device. Under the continuous action of the first, second, and third emotional airflow, the paper size of the system is applicable to the Chinese National Standard (CNS) A4 (210 X 297 public love) rtt n fi ml fl ^ — 1 n · nn ^ 1 * J ， V nn Kf f ^ int $ 4 Please read the notes on the back before filling in this page) A7 B7 V. Description of the invention () into an isolated space, at this time you can put it in mechanical clothes ^ 乾 # Shi take action, then close the load lock chamber and inert gas Zhao: round the idle door, and close the first, second and third sexual air flow to complete the access process of the second boat. π ® m 5-4 Schematic description: The preferred embodiment of the present invention printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs will be supplemented by the following figures in the following explanatory text to make a more detailed statement: First A The figure is a top view of a typical basic machine equipment used for semiconductor manufacturing in traditional technology. The first B diagram is a traditional load lock chamber and the mechanical transmission around the machine in the first A 圏 machine equipment. Section 囷 of the system connection design; Figure 1C is a flow chart of the conventional technology for accessing wafers and wafer boxes in a load lock chamber; and Figure 2 is a wafer used in the semiconductor process according to the present invention. A schematic cross-sectional view of a temporary storage system; the third diagram is a flowchart of accessing a wafer and a wafer boat in a load lock chamber according to the present invention; and the fourth diagram is a flowchart of accessing a wafer in a load lock chamber according to the present invention Clock diagram with airflow control when with the boat box. This paper is again applicable to the China Standard (CNS) such as specification C 297. (Please read the precautions on the back before filling out this page.) -------- Order it-- !, line. 44090 5 Α7 Β7 V. Description of the invention (5-5 drawing number comparison description 10 process reaction chamber 30 load lock chamber 50 robotic arm 210 load lock chamber 214 load lock chamber access access 216 first vent 20 buffer chamber 40 transition zone device 200 process buffer chamber 212 load lock chamber process entrance 218 first exhaust port 220 submerged gas environment device 222 submerged gas environment device load entrance 224 submerged gas environment device drive entrance 226 second vent 230 mechanical arm device 234 Manipulator cover 1 Suppressed gas passage (?) 228 4 Two exhaust ports 232 Mechanical transmission arm 236 Third vent port • ----- ^ < --- I --- Order --- I--i J Line.i (Please read the notes on the back before filling out this page) 5-6 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economics Detailed description of the invention: The present invention proposes a temporary storage of wafers in semiconductor manufacturing equipment. An inert gas environment device is integrated into the load lock chamber and the mechanical transmission Between the arms, with the effect of three inert gas flows, an isolated wafer space is formed, so that air and water cannot enter, which reduces the contamination during the wafer access process. Avoids corrosion of equipment components and subsequent loaded wafers. Damaged. Applicable to paper and paper scales_Home Standard (CNS) A4 size coffee x 297 males ·) _ 440905 A7 B7 Printed by the Consumers ’Cooperative of Intellectual Property Bureau of the Ministry of Economic Affairs A schematic cross-sectional view of the proposed wafer temporary storage system for semiconductor processes. This-the temporary storage system can be connected to the machine equipment used in the process, and is set on the periphery of the process buffer chamber 200. It is used before and after the process reaction. Place the wafer. Here—the wafer temporary storage system includes a load lock chamber 210 for placing wafers and wafer boxes. The load lock chamber 210 is provided with a process inlet and outlet 212, an access inlet and outlet 214, a first vent 216, and a first exhaust port 218. The process inlet and outlet 212 is connected to the process buffer chamber 200, and a process gate is provided to control its opening and closing. . The access σ 214 is connected to an inert gas environment device 220, and an access gate is also provided to control its opening and closing. The first vent 216 can be used to introduce gas into the load lock chamber; the first exhaust port 218 can discharge gas from the load lock chamber, both of which are connected to the air suction system and can control the air in the load lock chamber. Air pressure. An inert gas environment device 22 is connected next to the load lock chamber 210. The inert gas environment device 220 is provided with a load inlet and outlet 222, a transmission inlet and outlet 224, a second ventilation port 226, and a second exhaust port 228. The load inlet and outlet 222 is connected to the access inlet and outlet 214 of the load lock chamber 210, and the communication and isolation are controlled by the aforementioned hopper. The second vent 226 is connected to a gas transmission system, and the gas can be introduced into the inert gas environment device 220 therefrom. The second exhaust port 228 can be connected to an exhaust system to exhaust the gas from the inert gas environment device 220 (please read the Jiang Yi matter on the back before filling this page). Order II ----- The size of thread paper is applicable to China National Standard (CNS) A4 (210x297 mm)
、-栲械手臂裝置230經由惰性氣體環境裝置22〇與負 載閉鎖至210連結，機械手臂裝置23〇包含一機械傳動手 臂232與一外罩234，外罩234與惰性氣體環境裝置22〇 之傳動出入口 224相連通，使機械傳動手臂232可經由傳 動出入口 224進入惰性氣體環境裝置22〇之中，並經由負 載出入σ 222與存取出入口 214進入負載閉鎖室21〇之 中，進行晶舟盒的存取。外罩234上至少具有一第三通氣 口 236 ’用以導引氣體進入機械手臂裝置23〇的外罩234 中°在一較佳實施例中’機械手臂裝置的外罩234與惰性 氣體環境装置220之間，設置有一氣體通道238，氣體可 以經由此一氣體通道238進入惰性氣體環境装置22〇中。 使用上述本發明所提供的晶圓暫存系統進行晶圓與晶 舟盒的存取動作時’可以採用第三圖中所示的控制流程圖 來進行。圖中以拾取的過程爲實施例，此時一已批完成階 段製程的晶圓置放於負載閉鎖室210中的晶舟盒240内， 而負載閉鎖室210仍處於接近製程條件的低壓狀態下□要 由負載閉鎖室210中取出晶圊與晶舟盒時，必須先調整氣 壓。首先’由第一通氣口 216持續導入一第一惰性氣流250 至負載閉鎖室210中（步驟301)，此時第一棑氣口 218爲 關閉狀態。爲了不至於擾動負載閉鎖室210中的固態微 粒，第一惰性氣流250係以由慢而快逐漸加速的方式進入 該負載閉鎖室中。當負載閉鎖室210中的氣壓升高至預定 的壓力（通常爲外界的常壓，亦即一大氣壓）時，將第一惰 ;紙張尺度_中關家標翠(CNS)A4規格⑵〇 X 297公餐） C靖先閱讀背面之it意事項再填寫本頁) 裒------ 訂----------線- 經濟部智慧財產局員工消費合作社印製 Α7 Β7 經濟部智慧財產局員工消費合作社印製 五、發明說明（ 性氣流250關閉，以控制閉鎖室在適當的壓力下 在導入第一惰性氣流250以調整負載閉鎖室氣壓的同 時或是稍後，可以由惰性氣體環境装置220的第二通氣口 226持續導入一第二惰性氣流26〇(步骤3〇2) 5在適當的 配置下’此一第二惰性氣流260將會經過惰性氣體環境裝 置220的負載出入口 222或是傳動出入口 224的内側’然 後由第二排氣口 228排出惰性氣體環境裝置220之外。 在導入第二惰性氣流260至惰性氣體環境装置220中 的同時或是稍後’可以由外罩234上的第三通氣口 236持 續導入一第三惰性氣流270(步騍302)。在適當的配置下， 此一第三惰性氣流270將會由機械手臂裝置23〇中進入惰 性氣體環境装置220中，然後由第二排氣口 228排出惰性 氣體環境装置220之外。 在第二惰性氣流260與第三惰性氣流270持續流通 間’打開負載閉鎮室210中，存取出入口 214上的存取閘 門（步報303)。此時第二惰性氣流260將會在存取出入口 214外形成一氣流簾幕’具有遮蔽負載閉鎖室21〇，阻擋 外界空氣進入的效果。第三惰性氣流270則在機械手臂裝 置内230流通，以達到相似的功能。而爲求更佳的空氣阻 絶效率，在打開負載閉鎖室存取閘門的同時，可以重行導 入第一惰性氣流250至負載閉鎖室21〇中（步驟3〇3)。此 本紙張尺度適用令國园家標準（〇^)八4規格（21〇><297公爱） ------------- ^--------^---------線、 (請先閱讀背面之注意事項再填寫本頁) A7 B7 五、發明說明（） 時第一惰性氣流250將經由存取出人 〜σ 214上的存取閘門 進入惰性氣體環境装置220之中，块 、、後由惰性氣體環境裝 置之第二排氣口 228導出。在第~惰w 4 q 渭性軋流250持續由負 載閉鎖室210流向惰性氣體環境裝置± 见^0的情況下，外界 的空氣與水氣成分將更難進入負載閉# ^ n丄 月至^◦中1而負載 閉鎖室21 〇中的污染也可以減至最低。 當負載閉鎖室21〇的存取問門打開之後1可進行晶 圓與晶舟的存取動作（步驟3〇4)。機械傳動手臂232可經 由傳動出入口 224進入惰性氣體環境裝置22〇之中，並經 由負載出入口 222與存取出入口 214進入負載閉鎖室21〇 之中，it行晶圓與晶舟盒的存取。晶圓與晶舟盒的存取完 成後，機械傳動手臂232回歸定位，即可關閉存取出入口 214上的存取閘η (步驟3〇5)，使負載閉鎖室21〇恢復密 閉狀態。此時即可將第―、第二與第三惰性氣流一齊關閉， 結東晶圓存取的流程。 第四囷中顯示出本發明於負載閉鎖室中存取晶圓與晶 舟I時，第一、第一與第三各惰性氣流的控制時脈圖。由 第四圖中可以看出，第一惰性氣流250分兩階段啓動，第 一階段在存取閘門開啓之前進行，於負載閉鎖室21 〇達到 預定壓力之後停止，此時存取閘門仍未開啓，負載閉鎖室 210保持定壓’此—階段的氣流作用係在調整閉鎖室内的 氣壓。第二階段則在存取閘門開啓的同時啓動，持續至存 13 (請先閱讀背面之注意事項再填寫本頁)--- The mechanical arm device 230 is connected to the load by 210 through the inert gas environment device 22. The mechanical arm device 23 includes a mechanical transmission arm 232 and an outer cover 234. The outer cover 234 and the transmission inlet 224 of the inert gas environment device 22 Connected so that the mechanical transmission arm 232 can enter the inert gas environment device 22 through the transmission inlet and outlet 224, and enter the load lock chamber 21 through the load inlet and outlet σ 222 and the access inlet and outlet 214 to access the wafer box. . The outer cover 234 has at least a third vent 236 ′ for guiding gas into the outer cover 234 of the robot arm device 23 °. In a preferred embodiment, between the outer cover 234 of the robot arm device and the inert gas environment device 220 A gas passage 238 is provided, and the gas can enter the inert gas environment device 22 through the gas passage 238. When the wafer temporary storage system provided by the present invention is used to perform the wafer and wafer box access operation ', the control flowchart shown in the third figure can be used to perform the operation. In the figure, the picking process is taken as an example. At this time, a batch of wafers that have been completed in a batch process is placed in the wafer box 240 in the load lock chamber 210, and the load lock chamber 210 is still in a low pressure state close to the process conditions. □ To remove the crystal cymbals and wafer box from the load lock chamber 210, the air pressure must be adjusted first. First, a first inert gas flow 250 is continuously introduced from the first vent 216 into the load lock chamber 210 (step 301). At this time, the first vent 218 is closed. In order not to disturb the solid particles in the load lock chamber 210, the first inert gas flow 250 enters the load lock chamber in a manner of gradually and slowly accelerating. When the air pressure in the load lock chamber 210 rises to a predetermined pressure (usually atmospheric pressure, that is, one atmosphere), the first inertia; paper size_zhongguanjiabiaocui (CNS) A4 size ⑵〇X 297 public Meal) C Jing first read the Italian notice on the back before filling in this page) 裒 ------ Order ---------- Line-Printed by the Intellectual Property Bureau of the Ministry of Economy Staff Consumer Cooperatives Α7 Β7 Ministry of Economy Printed by the Intellectual Property Bureau employee consumer cooperative V. Invention description (Sex air flow 250 is closed to control the lock chamber under the appropriate pressure while the first inert gas flow 250 is introduced to adjust the load lock chamber air pressure at the same time or later, it can be controlled by inertia The second vent 226 of the gas environment device 220 continuously introduces a second inert gas flow 26 (step 302). 5 In a proper configuration, 'this second inert gas flow 260 will pass through the load inlet and outlet of the inert gas environment device 220. 222 or the inside of the transmission inlet and outlet 224 'is then discharged out of the inert gas environment device 220 through the second exhaust port 228. While introducing the second inert gas flow 260 into the inert gas environment device 220 or later, it may be covered by the cover No. 234 The vent 236 continuously introduces a third inert gas flow 270 (step 302). Under proper configuration, this third inert gas flow 270 will enter the inert gas environment device 220 from the robot arm device 23 and then from the first The second exhaust port 228 is discharged out of the inert gas environment device 220. In the continuous circulation room of the second inert gas flow 260 and the third inert gas flow 270, the load-closed chamber 210 is opened, and the access gate on the access inlet and outlet 214 (step report) 303). At this time, the second inert gas flow 260 will form an air curtain outside the access door 214, which has the effect of shielding the load lock chamber 21 and blocking outside air from entering. The third inert gas flow 270 is inside the robot arm device. 230 circulation to achieve similar functions. For better air blocking efficiency, while opening the load lock chamber access gate, the first inert gas flow 250 can be re-introduced into the load lock chamber 21o (step 3o). 3). This paper size is applicable to the National Garden Standard (〇 ^) 8 4 specifications (21〇 > < 297 public love) ------------- ^ ----- --- ^ --------- line, (Please read the notes on the back before filling (Write this page) A7 B7 V. Description of the invention () When the first inert gas flow 250 will enter the inert gas environment device 220 through the access gate on the accessor ~ σ 214, the block, and then by the inert gas environment device The second exhaust port 228 is derived. In the case of the first to inert w 4 q continuous rolling flow 250 continuously flowing from the load lock chamber 210 to the inert gas environment device ± see ^ 0, the external air and water vapor components will be more difficult Entering the load lock # ^ n 丄 to ^ ◦ 1 and the pollution in the load lock chamber 21 〇 can also be minimized. When the access door of the load lock chamber 21 is opened, the wafer and wafer boat can be accessed (step 304). The mechanical transmission arm 232 can enter the inert gas environment device 22 through the transmission inlet and outlet 224, and enter the load lock chamber 21 through the load inlet and outlet 222 and the access inlet and outlet 214, and it can access the wafer and wafer boat box. After the wafer and wafer box access is completed, the mechanical transmission arm 232 returns to position, and the access gate η on the access door 214 can be closed (step 305), so that the load lock chamber 21 can be closed. At this time, the first, second, and third inert gas flows can be turned off together, and the process of wafer access is completed. The fourth diagram shows the control clock diagrams of the first, first and third inert gas flows when the present invention accesses the wafer and the boat I in the load lock chamber. It can be seen from the fourth figure that the first inert gas flow 250 is started in two stages. The first stage is performed before the access gate is opened and stopped after the load lock chamber 21 has reached a predetermined pressure. At this time, the access gate has not been opened. The load lock chamber 210 maintains a constant pressure. 'This stage of the air flow action is to adjust the air pressure in the lock chamber. The second stage is activated at the same time as the access gate is opened, and continues to save 13 (please read the precautions on the back before filling this page)
t'SJ -線. 經濟部智慧財產局員工消費合作社印製t'SJ-Line. Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs
^4〇9〇 5 五'發明說明（） 取閘門關閉時結東。此一階段的第一惰性氣流250由負載 閉鎖室210湧入惰性氣體環境装置220之中，可以有效地 阻止外界空氣逆向流入’維持負載閉鎖室21〇中的潔淨。 第二惰性氣流260則在存取閘門開啓之前啓動，持續 至存取閘門關閉時停止。在此期間，第二惰性氣流26〇由 惰性氣體環境裝置220的第二通氣口 226導入，流至第二 排氣σ 228然後排出。其間將會經過惰性氣體環境裝置22〇 的負載出入口 222或是傳動出入口 224的内側，形成一氣 流簾幕。此一氣流簾幕將可在負載出入口 222或是傳動出 入口 224的内側形成阻障，將外界空氣阻擋在傳動出入口 224或是負載出入口 222之外。此外，第二惰性氣流26〇 流貫整個惰性氣體環境装置220，也可以持續地將少數進 人惰性氣體環境裝置220中的空氣帶出第二排氣口 228之 外。 ： 弟二惰性氣流2 7 0同樣在存取閉門開啓之前啓動，而 持續至存取閘門關閉時停止。在此期間，第三惰性氣流270 由機械手臂裝置230之外罩234的第三通氣口 236導入， 流至惰性氣體環境装置220,然後由第二排氣口 228排出。 其間將會流貫機械手臂装置230，防止外界空氣經由機械 手臂装置230接觸到所傳送的晶圓，而造成污染β 縱合以上所述，採用本發明之晶圓暫存裝置與存取方 本紙張尺度適用中國國家標準（CNS)A4規格（210 x 297公釐） (請先閱讀背面之注意事項再填寫本頁) ^i------訂·--- I I ! I 1 經濟部智慧財產局員工消費合作社印則界 44C 9 A7 B7 五、發明說明（） 法，可以在惰性氣體環境装置結合於負載閉鎖室與機械傳 動手臂之間的配置下，以第一、第二與第三惰性氣流的作 用’構成隔離的晶圓存取空間，使負載閉鎖室、情性氣體 環境裝置以及機械手臂裝置皆處在充滿惰性氣體的環境 下，能有效防止空氣與水氣進入負載閉鎖室與機械手臂裝 置中’減少晶圓存取過程中與空氣的接觸機會，避免晶圊 上殘留的高份子物質等發生化學反應，而產生溴化等氫腐 蝕性污染’防止設備組件與後續載入的晶圓受到腐蝕損 害。並防止設備組件囡腐蝕而產生二氧化矽等二次微粒污 染，能有效防止污柰物的產生，製程良率便囡此大幅提高。 以上所述僅爲本發明之較佳實施例而已，並非用以限 定本發明之申請專利範圍；凡其它未脱離本發明所揭示之 精神下所完成之等效改變或修飾’例如更動各通氣孔與排 氣孔的位置等，均應包含在下述之申請專利範圍内，而應 受到本發明所申請專利權之限制。 (靖先閱讀背面之注意事項再填寫本頁) 农--------訂-------，線 經濟部智慧財產局員工消費合作社印*1^ 本紙張尺度適用中國园家標準（CNS)A4規格（210 X 297公釐）^ 4〇09〇 5 Description of the invention () Take the gate closed when the gate is closed. The first inert gas flow 250 at this stage flows from the load lock chamber 210 into the inert gas environment device 220, which can effectively prevent the reverse flow of outside air into the load lock chamber 21 and keep the load clean. The second inert gas flow 260 is activated before the access gate is opened, and continues until the access gate is closed. During this period, the second inert gas flow 26 is introduced from the second vent 226 of the inert gas environment device 220, flows to the second exhaust gas σ 228, and is then discharged. In the meantime, it will pass through the load inlet 222 or the transmission inlet 224 of the inert gas environment device 22 to form an air curtain. Such an air curtain can form a barrier inside the load inlet and outlet 222 or the drive inlet and outlet 224, and block outside air from the drive inlet and outlet 224 or the load inlet and outlet 222. In addition, the second inert gas flow 26 passes through the entire inert gas environment device 220, and a small amount of air entering the inert gas environment device 220 can be continuously taken out of the second exhaust port 228. : The second inert gas flow 2 70 is also activated before the access door is opened, and it continues until the access door is closed. During this period, the third inert gas flow 270 is introduced through the third vent 236 of the outer cover 234 of the robot arm device 230, flows to the inert gas environment device 220, and is then discharged through the second exhaust port 228. In the meantime, the robot arm device 230 will flow through to prevent the outside air from contacting the transferred wafers through the robot arm device 230, which will cause pollution. Β Summarize the above, using the wafer temporary storage device and accessor of the present invention Paper size applies to China National Standard (CNS) A4 (210 x 297 mm) (Please read the precautions on the back before filling out this page) ^ i ------ Order · --- II! I 1 Ministry of Economic Affairs Intellectual Property Bureau Staff Consumer Cooperatives Seal Circle 44C 9 A7 B7 V. Description of the invention () method can be used in the configuration of the inert gas environment device combined between the load lock chamber and the mechanical transmission arm, the first, second and first The role of the three inert gas flows' constitutes an isolated wafer access space, so that the load lock chamber, the emotional gas environment device and the robot arm device are all in an environment filled with inert gas, which can effectively prevent air and water from entering the load lock chamber. With the robot arm device, 'reducing the chance of contact with the air during the wafer access process, avoiding chemical reactions such as high molecular substances remaining on the wafer, and generating hydrogen corrosive pollution such as bromination' Loading device assembly subsequent corrosion damage of the wafer. It also prevents the secondary components of silicon dioxide and other particles from being contaminated by corrosion of equipment components, which can effectively prevent the generation of contamination, and the process yield is greatly improved. The above is only a preferred embodiment of the present invention, and is not intended to limit the scope of patent application of the present invention; any other equivalent changes or modifications made without departing from the spirit disclosed by the present invention, such as changing various The positions of the air holes and exhaust holes should be included in the scope of patent application described below, and should be restricted by the patent right of the present invention. (Jing first read the notes on the back before filling in this page) Agriculture -------- Order -------, printed by the Consumers ’Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs * 1 ^ This paper size is applicable to China Garden Standard (CNS) A4 (210 X 297 mm)