TW202326735A - Memory device and operation method thereof - Google Patents
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Abstract
Description
本發明係有關於一種具有記憶體內運算(In-Memory-Computing (IMC))的記憶體裝置及其操作方法。The present invention relates to a memory device with In-Memory-Computing (IMC) and an operating method thereof.
人工智慧(AI)已在許多領域中成為高度有效解決方案。AI的關鍵操作在於對大量的輸入資料(如輸入特徵圖(input feature maps))與權重值進行乘積累加運算(multiply-and-accumulation (MAC))。Artificial intelligence (AI) has become a highly effective solution in many fields. The key operation of AI is to perform multiply-and-accumulation (MAC) on a large amount of input data (such as input feature maps) and weight values.
然而,以目前的AI架構而言,容易遇到輸出入瓶頸(IO bottleneck)與低效率的MAC運算流程(inefficient MAC operation flow)。However, with the current AI architecture, it is easy to encounter IO bottleneck and inefficient MAC operation flow.
為達到高準確度,可執行具有多位元輸入及多位元權重值的MAC操作。然而,輸出入瓶頸變得更加嚴重,且效率將更低。To achieve high accuracy, MAC operations can be performed with multi-bit inputs and multi-bit weight values. However, the I/O bottleneck becomes more severe and will be less efficient.
記憶體內運算(In-Memory-Computing (IMC))可用於加速MAC運算,因為IMC可減少在中央處理架構下所需要用的複雜算術邏輯單元 (Arithmetic logic unit,ALU),且提供記憶體內的MAC操作的高並行性(parallelism)。In-Memory-Computing (IMC) can be used to accelerate MAC operations, because IMC can reduce the complex arithmetic logic unit (ALU) required under the central processing architecture, and provide MAC in memory High parallelism of operations.
在進行IMC時,如果能加快乘法操作的背景設定時間的話,對於IMC性能將可有所助益。When performing IMC, if the background setting time of the multiplication operation can be accelerated, it will be beneficial to the performance of the IMC.
根據本案一實例,提出一種記憶體裝置之操作方法,該記憶體裝置包括複數個記憶體單元,該記憶體裝置之操作方法包括:於一第一階段內,選擇一整體信號線以將該整體信號線由一第一參考電壓拉高至一第二參考電壓,選擇一第一串選擇線以將該第一串選擇線由該第一參考電壓拉高至一第三參考電壓,不選一第二串選擇線以維持於該第一參考電壓,選擇一第一字元線以將該第一字元線由該第一參考電壓拉高至一第四參考電壓,以及不選一第二字元線以將該第二字元線由該第一參考電壓拉高至一第五參考電壓;於一第二階段內進行感應;於一第三階段內,將該整體信號線維持於該第二參考電壓,不選該第一串選擇線將該第一串選擇線由該第三參考電壓拉低至該第一參考電壓,選擇該第二串選擇線以將該第二串選擇線由該第一參考電壓拉高至該第三參考電壓,維持被選的該第一字元線於該第四參考電壓,以及,維持不選的該第二字元線於該第五參考電壓;以及於一第四階段內進行感應。According to an example of the present case, a method of operating a memory device is proposed, the memory device includes a plurality of memory units, the method of operating the memory device includes: in a first stage, selecting a whole signal line to connect the whole The signal line is pulled up from a first reference voltage to a second reference voltage, and a first string selection line is selected to pull up the first string selection line from the first reference voltage to a third reference voltage. The second string selects the line to maintain the first reference voltage, selects a first word line to pull the first word line from the first reference voltage to a fourth reference voltage, and does not select a second word line to pull up the second word line from the first reference voltage to a fifth reference voltage; sensing in a second phase; maintaining the overall signal line at the The second reference voltage, if the first string selection line is not selected, the first string selection line is pulled down from the third reference voltage to the first reference voltage, and the second string selection line is selected so that the second string selection line Pulling up from the first reference voltage to the third reference voltage, maintaining the selected first word line at the fourth reference voltage, and maintaining the unselected second word line at the fifth reference voltage ; and sensing in a fourth stage.
根據本案另一實例,提出一種記憶體裝置之操作方法,該記憶體裝置包括複數個記憶體單元,該記憶體裝置之操作方法包括:於一第一階段內,選擇一整體信號線以將該整體信號線由一第一參考電壓拉高至一第二參考電壓,選擇一第一串選擇線以將該第一串選擇線由該第一參考電壓拉高至一第三參考電壓,不選一第二串選擇線以維持於該第一參考電壓,選擇一第一字元線以將該第一字元線由該第一參考電壓拉高至一第四參考電壓,以及不選一第二字元線以將該第二字元線由該第一參考電壓拉高至一第五參考電壓;於一第二階段內進行感應;於一第三階段內,將該整體信號線維持於該第二參考電壓,維持被選的該第一串選擇線於該第三參考電壓,維持不選的該第二串選擇線於該第一參考電壓,不選該第一字元線以該第一字元線由該第四參考電壓拉高至該第五參考電壓,以及,選擇該第二字元線以將該第二字元線由該第五參考電壓拉低至該第四參考電壓;以及於一第四階段內進行感應。According to another example of the present case, a method for operating a memory device is proposed, the memory device includes a plurality of memory units, the method for operating the memory device includes: in a first stage, selecting an overall signal line to connect the The overall signal line is pulled up from a first reference voltage to a second reference voltage, and a first string selection line is selected to pull up the first string selection line from the first reference voltage to a third reference voltage, and not selected a second string select line to maintain at the first reference voltage, select a first word line to pull the first word line from the first reference voltage to a fourth reference voltage, and deselect a first word line Two word lines to pull up the second word line from the first reference voltage to a fifth reference voltage; sensing in a second phase; maintaining the overall signal line at a third phase The second reference voltage maintains the selected first string selection line at the third reference voltage, maintains the unselected second string selection line at the first reference voltage, does not select the first word line with the The first word line is pulled up from the fourth reference voltage to the fifth reference voltage, and the second word line is selected to be pulled down from the fifth reference voltage to the fourth reference voltage. voltage; and sensing in a fourth stage.
根據本案又一實例,提出一種記憶體裝置,包括:數個記憶體單元;複數個整體信號線;複數個位元線;複數個串選擇線;複數個字元線,耦接至該些記憶體單元,該些記憶體單元更耦接至該些位元線;複數個第一開關,耦接至該些串選擇線與該些位元線;以及複數個第二開關,耦接至該些整體信號線與該些位元線;其中,於一第一階段內,選擇該些整體信號線之一第一整體信號線以將該第一整體信號線由一第一參考電壓拉高至一第二參考電壓,選擇該些串選擇線之一第一串選擇線以將該第一串選擇線由該第一參考電壓拉高至一第三參考電壓,不選該些串選擇線之一第二串選擇線以維持於該第一參考電壓,選擇該些字元線之一第一字元線以將該第一字元線由該第一參考電壓拉高至一第四參考電壓,以及不選該些字元線之一第二字元線以將該第二字元線由該第一參考電壓拉高至一第五參考電壓;於一第二階段內進行感應;於一第三階段內,將該第一整體信號線維持於該第二參考電壓,不選該第一串選擇線將該第一串選擇線由該第三參考電壓拉低至該第一參考電壓,選擇該第二串選擇線以將該第二串選擇線由該第一參考電壓拉高至該第三參考電壓,維持被選的該第一字元線於該第四參考電壓,以及,維持不選的該第二字元線於該第五參考電壓;以及於一第四階段內進行感應。According to another example of this case, a memory device is proposed, including: several memory cells; a plurality of overall signal lines; a plurality of bit lines; a plurality of string selection lines; a plurality of word lines, coupled to the memories memory cells, the memory cells are further coupled to the bit lines; a plurality of first switches, coupled to the string selection lines and the bit lines; and a plurality of second switches, coupled to the bit lines These overall signal lines and these bit lines; wherein, in a first stage, select a first overall signal line of these overall signal lines to pull up the first overall signal line from a first reference voltage to A second reference voltage, select the first string selection line of the string selection lines to pull up the first string selection line from the first reference voltage to a third reference voltage, do not select one of the string selection lines a second string selection line to maintain the first reference voltage, select a first word line of the word lines to pull the first word line from the first reference voltage to a fourth reference voltage , and deselecting a second word line of the word lines to pull the second word line from the first reference voltage to a fifth reference voltage; sensing in a second phase; in a In the third stage, the first overall signal line is maintained at the second reference voltage, the first string selection line is not selected and the first string selection line is pulled down from the third reference voltage to the first reference voltage, selecting the second string selection line to pull the second string selection line from the first reference voltage to the third reference voltage, maintaining the selected first word line at the fourth reference voltage, and maintaining The unselected second word line is sensed at the fifth reference voltage; and in a fourth phase.
為了對本發明之上述及其他方面有更佳的瞭解,下文特舉實施例,並配合所附圖式詳細說明如下:In order to have a better understanding of the above-mentioned and other aspects of the present invention, the following specific examples are given in detail with the accompanying drawings as follows:
本說明書的技術用語係參照本技術領域之習慣用語,如本說明書對部分用語有加以說明或定義,該部分用語之解釋係以本說明書之說明或定義為準。本揭露之各個實施例分別具有一或多個技術特徵。在可能實施的前提下,本技術領域具有通常知識者可選擇性地實施任一實施例中部分或全部的技術特徵,或者選擇性地將這些實施例中部分或全部的技術特徵加以組合。The technical terms in this specification refer to the customary terms in this technical field. If some terms are explained or defined in this specification, the explanations or definitions of these terms shall prevail. Each embodiment of the disclosure has one or more technical features. On the premise of possible implementation, those skilled in the art may selectively implement some or all of the technical features in any embodiment, or selectively combine some or all of the technical features in these embodiments.
第1圖顯示根據本案一實施例之記憶體裝置100之電路示意圖。記憶體裝置100例如但不受限於,為三維(3D)記憶體裝置。如第1圖所示,記憶體裝置100包括複數個記憶體區塊(memory block)B0~BQ(Q為正整數)、頁緩衝器電路120、共同源極線(common source line)CSL、複數條整體源極線(global source lines,亦可稱為整體信號線)GSL0~GSLQ、複數條串選擇線(string select line)SSL0~SSLN(N為正整數)、複數條字元線WL0~WLM(M為正整數)、複數條位元線BL0~BLP(P為正整數)。FIG. 1 shows a schematic circuit diagram of a memory device 100 according to an embodiment of the present invention. The memory device 100 is, for example but not limited to, a three-dimensional (3D) memory device. As shown in FIG. 1, the memory device 100 includes a plurality of memory blocks (memory block) B0~BQ (Q is a positive integer), a page buffer circuit 120, a common source line (common source line) CSL, a plurality of A global source line (global source lines, also called a global signal line) GSL0~GSLQ, a plurality of string select lines (string select line) SSL0~SSLN (N is a positive integer), a plurality of word lines WL0~WLM (M is a positive integer), a plurality of bit lines BL0~BLP (P is a positive integer).
各該些記憶體區塊B0~BQ包括複數個開關SW1、複數個開關SW2與複數個記憶體串SS。各記憶體串SS包括複數個記憶體單元MC。該些記憶體單元MC位於該些字元線WL0~WLM與該些位元線BL0~BLP之交叉處。在同一記憶體區塊內,耦接至同一位元線的該些記憶體單元MC組成一記憶體串SS。Each of the memory blocks B0 ˜ BQ includes a plurality of switches SW1 , a plurality of switches SW2 and a plurality of memory strings SS. Each memory string SS includes a plurality of memory cells MC. The memory cells MC are located at intersections of the word lines WL0 ˜WLM and the bit lines BL0 ˜BLP. In the same memory block, the memory cells MC coupled to the same bit line form a memory string SS.
該些開關SW1位於該些串選擇線SSL0~SSLN與該些位元線BL0~BLP之交叉處。當選擇一相關記憶體串SS時,相關的開關SW1將被導通。The switches SW1 are located at intersections of the string selection lines SSL0 -SSLN and the bit lines BL0 -BLP. When an associated memory string SS is selected, the associated switch SW1 will be turned on.
該些開關SW2位於該些整體源極線GSL0~GSLQ與該些位元線BL0~BLP之交叉處。當選擇一相關記憶體區塊時,相關的開關SW2將被導通。The switches SW2 are located at intersections of the global source lines GSL0 -GSLQ and the bit lines BL0 -BLP. When a related memory block is selected, the related switch SW2 will be turned on.
流經該些記憶體串SS的複數個晶胞電流Id將透過共同源極線CSL而流至後端的相關電路(例如但不受限於,為累積電路),以進行相關操作(例如但不受限於,乘積累加運算(Multiply Accumulate,MAC)、資料讀取、資料寫入等)。The plurality of unit cell currents Id flowing through the memory strings SS will flow to related circuits (such as but not limited to, accumulator circuits) at the back end through the common source line CSL to perform related operations (such as but not limited to, accumulation circuits) Limited by multiplication and accumulation operation (Multiply Accumulate, MAC), data reading, data writing, etc.).
頁緩衝器電路120包括複數個頁緩衝器121_0~121_P。各頁緩衝器121_0~121_P耦接至各位元線BL0~BLP。The page buffer circuit 120 includes a plurality of page buffers 121_0˜121_P. Each page buffer 121_0˜121_P is coupled to each bit line BL0˜BLP.
第2圖顯示根據本案一實施例之記憶體操作方法之示意圖及波形圖。於第2圖中,為方便解釋,將耦接至同一字元線(如WL0)的該些記憶體單元MC畫出,以清楚顯示切換串選擇線時的操作。此外,在進行串選擇線切換時,雖然第2圖是以依序切換(SSL0→SSL1…),但當知本案並不受限於此,串選擇線的切換順序可以有其他順序,此亦在本案精神範圍內。FIG. 2 shows a schematic diagram and a waveform diagram of a memory operation method according to an embodiment of the present invention. In FIG. 2, for the convenience of explanation, the memory cells MC coupled to the same word line (such as WL0) are drawn to clearly show the operation when the string selection line is switched. In addition, when string selection lines are switched, although the second figure switches sequentially (SSL0→SSL1...), it should be understood that this case is not limited to this, and the switching sequence of string selection lines can have other sequences, which is also within the spirit of the case.
在底下,以記憶體區塊B0(整體源極線GSL0)、串選擇線SSL0、SSL1與字元線WL0、WL1為例做說明,但當知本案並不受限於此。為方便解釋,原本是存取其他記憶體區塊的資料,但在位址解碼後,例如,發現下一筆資料存於記憶體區塊B0內的串選擇線SSL0與字元線WL0之交叉處的記憶體單元MC內(亦即,串選擇線SSL0為受選串選擇線,而字元線WL0為受選字元線)。In the following, the memory block B0 (global source line GSL0 ), the string selection lines SSL0 , SSL1 , and the word lines WL0 , WL1 are taken as examples for illustration, but it should be understood that this case is not limited thereto. For the convenience of explanation, the data of other memory blocks are originally accessed, but after address decoding, for example, it is found that the next data is stored at the intersection of string selection line SSL0 and word line WL0 in memory block B0 (ie, string select line SSL0 is the selected string select line, and word line WL0 is the selected word line).
則於階段P21內,選擇整體源極線GSL0由第一參考電壓拉高至第二參考電壓;選擇串選擇線SSL0由第一參考電壓拉高至第三參考電壓;不選(unselect)其他串選擇線SSL1~SSLN以維持於第一參考電壓;選擇字元線WL0由第一參考電壓拉高至第四參考電壓;不選其他字元線WL1~WLM以由第一參考電壓拉高至第五參考電壓(高於第四參考電壓)。藉此,可以選擇區域150內的該些記憶體單元MC(如第1圖與第2圖所示)。Then in stage P21, select the overall source line GSL0 to be pulled up from the first reference voltage to the second reference voltage; select the string selection line SSL0 to be pulled up from the first reference voltage to the third reference voltage; do not select (unselect) other strings Select lines SSL1~SSLN to maintain at the first reference voltage; select word line WL0 to be pulled up from the first reference voltage to the fourth reference voltage; do not select other word lines WL1~WLM to be pulled up from the first reference voltage to the fourth reference voltage Five reference voltages (higher than the fourth reference voltage). Thereby, the memory cells MC in the area 150 can be selected (as shown in FIG. 1 and FIG. 2 ).
之後,於階段P22內進行感應。After that, sensing is performed in phase P22.
之後,在位址解碼後,例如,發現下一筆資料存於記憶體區塊B0內的串選擇線SSL1與字元線WL0之交叉處的記憶體單元MC內(亦即,串選擇線SSL1為受選串選擇線,而字元線WL0為受選字元線)。亦即,受選串選擇線改變(由串選擇線SSL0變為串選擇線SSL1),但受選字元線未改變(仍為字元線WL0)。Afterwards, after address decoding, for example, it is found that the next piece of data is stored in the memory cell MC at the intersection of the string selection line SSL1 and the word line WL0 in the memory block B0 (that is, the string selection line SSL1 is The selected string selection line, and the word line WL0 is the selected word line). That is, the selected string selection line changes (from string selection line SSL0 to string selection line SSL1 ), but the selected word line does not change (still word line WL0 ).
則於階段P23內,將受選整體源極線GSL0維持於第二參考電壓;不選該串選擇線SSL0由第三參考電壓拉低至第一參考電壓;其他的不選串選擇線SSL2~SSLN維持於第一參考電壓;選擇串選擇線SSL1由第一參考電壓拉高至第三參考電壓;將受選字元線WL0維持於第四參考電壓;將不選字元線WL1~WLM維持於第五參考電壓。藉此,可以選擇區域151內的該些記憶體單元MC(如第1圖與第2圖所示)。Then in the phase P23, the selected overall source line GSL0 is maintained at the second reference voltage; the unselected string selection line SSL0 is pulled down from the third reference voltage to the first reference voltage; the other unselected string selection lines SSL2~ SSLN is maintained at the first reference voltage; the selected string selection line SSL1 is pulled up from the first reference voltage to the third reference voltage; the selected word line WL0 is maintained at the fourth reference voltage; the unselected word lines WL1~WLM are maintained at the fifth reference voltage. Thereby, the memory cells MC in the area 151 (as shown in FIG. 1 and FIG. 2 ) can be selected.
之後,於階段P24內進行感應。Afterwards, sensing is performed in phase P24.
同理,在位址解碼後,為存取下一筆資料,要將受選串選擇線改變(例如,由串選擇線SSL1變為串選擇線SSL2),但受選字元線未改變。則於下一階段內,將受選整體源極線GSL0維持於第二參考電壓;不選串選擇線SSL1由第三參考電壓拉低至第一參考電壓;將其他的不選串選擇線SSL0與SSL3~SSLN維持於第一參考電壓;選擇串選擇線SSL2由第一參考電壓拉高至第三參考電壓;將受選字元線WL0維持於第四參考電壓;將其他的不選字元線WL1~WLM維持於第五參考電壓。Similarly, after the address is decoded, in order to access the next piece of data, the selected string selection line should be changed (for example, from the string selection line SSL1 to the string selection line SSL2), but the selected word line remains unchanged. Then in the next stage, the selected global source line GSL0 is maintained at the second reference voltage; the unselected string selection line SSL1 is pulled down from the third reference voltage to the first reference voltage; the other unselected string selection lines SSL0 and SSL3~SSLN are maintained at the first reference voltage; the selected string selection line SSL2 is pulled up from the first reference voltage to the third reference voltage; the selected word line WL0 is maintained at the fourth reference voltage; other unselected characters are The lines WL1˜WLM are maintained at the fifth reference voltage.
同理,在位址解碼後,為存取下一筆資料,如果要切換至不同的記憶體區塊,則需要再度執行類似於階段P21的操作。Similarly, after the address is decoded, in order to access the next piece of data, if switching to a different memory block, the operation similar to stage P21 needs to be performed again.
如第2圖所示,該記憶體裝置100更包括累積電路130,耦接至頁緩衝器電路120。As shown in FIG. 2 , the memory device 100 further includes an accumulation circuit 130 coupled to the page buffer circuit 120 .
由該些被選記憶體單元MC所讀出的資料係先輸入至頁緩衝器電路120內,再傳送給累積電路130(本案並不受限於此)進行MAC運算後,得到輸出資料。The data read from the selected memory cells MC are first input into the page buffer circuit 120, and then sent to the accumulation circuit 130 (the present application is not limited thereto) for MAC operation to obtain the output data.
亦即,於第2圖的操作方法中,於初始化階段(P21)後,讀取同一記憶體區塊內的資料下,當需要進行串選擇線之切換時,讓整體源極線的位準維持,讓受選字元線與不選字元線的位準維持,將下一受選串選擇線與目前受選串選擇線之位準進行切換(如階段P23)。如此做法可以縮短記憶體裝置操作之背景設定時間(階段P21~P24可視為是MAC操作中的乘法位元線設定時間與字元線設定時間)。That is, in the operation method of FIG. 2, after the initialization phase (P21), when reading the data in the same memory block, when it is necessary to switch the string selection line, the level of the overall source line Maintaining the level of the selected word line and the unselected word line, and switching the level of the next selected string selection line and the currently selected string selection line (such as stage P23). This method can shorten the background setup time of the memory device operation (stages P21-P24 can be regarded as the multiplication bit line setup time and word line setup time in the MAC operation).
此外,於本案第2圖實施例中,透過切換記憶體區塊與串選擇線,相比於習知技術,可以減少字元線設定時間,進而加速操作。In addition, in the embodiment of FIG. 2 of the present application, by switching the memory block and the string selection line, compared with the conventional technology, the word line setting time can be reduced, thereby speeding up the operation.
更甚者,於本案第2圖實施例中,如果記憶體裝置具有多個記憶平面(memory plane)且各記憶平面有各自的累積電路的話,則MAC操作的累積與輸出可利用管線化方式來進行。What's more, in the embodiment of Fig. 2 of this case, if the memory device has multiple memory planes (memory plane) and each memory plane has its own accumulation circuit, then the accumulation and output of the MAC operation can be implemented in a pipelined manner conduct.
第3圖顯示根據本案另一實施例之記憶體操作方法之示意圖及波形圖。於第3圖中,為方便解釋,將耦接至同一串選擇線(如SSL0)的該些記憶體單元MC畫出,以清楚顯示切換字元線時的操作。此外,在進行字元線切換時,雖然第3圖是以依序切換(WL0→WL1…),但當知本案並不受限於此,字元線的切換順序可以有其他順序,此亦在本案精神範圍內。FIG. 3 shows a schematic diagram and a waveform diagram of a memory operation method according to another embodiment of the present invention. In FIG. 3 , for the convenience of explanation, the memory cells MC coupled to the same string select line (eg SSL0 ) are drawn to clearly show the operation when the word line is switched. In addition, when word line switching is performed, although FIG. 3 switches in order (WL0→WL1...), it should be understood that this case is not limited to this, and the switching order of word lines can have other orders, which is also within the spirit of the case.
在底下,以記憶體區塊B0(整體源極線GSL0)、串選擇線SSL0、SSL1與字元線WL0、WL1為例做說明,但當知本案並不受限於此。為方便解釋,原本是存取其他記憶體區塊的資料,但在位址解碼後,例如,發現下一筆資料存於記憶體區塊B0內的串選擇線SSL0與字元線WL0之交叉處的記憶體單元MC內(亦即,串選擇線SSL0為受選串選擇線,而字元線WL0為受選字元線)。In the following, the memory block B0 (global source line GSL0 ), the string selection lines SSL0 , SSL1 , and the word lines WL0 , WL1 are taken as examples for illustration, but it should be understood that this case is not limited thereto. For the convenience of explanation, the data of other memory blocks are originally accessed, but after address decoding, for example, it is found that the next data is stored at the intersection of string selection line SSL0 and word line WL0 in memory block B0 (ie, string select line SSL0 is the selected string select line, and word line WL0 is the selected word line).
則於階段P31內,選擇該整體源極線GSL0由第一參考電壓拉高至第二參考電壓;選擇該串選擇線SSL0由第一參考電壓拉高至第三參考電壓;不選其他的串選擇線SSL1~SSLN以維持於第一參考電壓;選擇該字元線WL0由第一參考電壓拉高至第四參考電壓;不選其餘字元線WL1~WLM由第一參考電壓拉高至第五參考電壓(高於第四參考電壓)。藉此,可以選擇區域150內的該些記憶體單元MC(如第1圖與第3圖所示)。Then in the stage P31, the overall source line GSL0 is selected to be pulled up from the first reference voltage to the second reference voltage; the string selection line SSL0 is selected to be pulled up from the first reference voltage to the third reference voltage; other strings are not selected. Select the lines SSL1~SSLN to maintain at the first reference voltage; select the word line WL0 to be pulled up from the first reference voltage to the fourth reference voltage; do not select the other word lines WL1~WLM to be pulled up from the first reference voltage to the fourth reference voltage Five reference voltages (higher than the fourth reference voltage). Thereby, the memory cells MC in the area 150 (as shown in FIG. 1 and FIG. 3 ) can be selected.
之後,於階段P32內進行感應。Afterwards, sensing is performed in phase P32.
之後,在位址解碼後,例如,發現下一筆資料存於記憶體區塊B0內的串選擇線SSL0與字元線WL1之交叉處的記憶體單元MC內(亦即,串選擇線SSL0仍為受選串選擇線,而字元線WL1為受選字元線)。亦即,受選串選擇線不改變(仍為串選擇線SSL0),但受選字元線改變(由字元線WL0變為WL1)。Afterwards, after address decoding, for example, it is found that the next data is stored in the memory unit MC at the intersection of the string selection line SSL0 and the word line WL1 in the memory block B0 (that is, the string selection line SSL0 is still is the selected string selection line, and the word line WL1 is the selected word line). That is, the selected string selection line does not change (still string selection line SSL0), but the selected word line changes (from word line WL0 to WL1).
則於階段P33內,將受選整體源極線GSL0維持於第二參考電壓;將受選串選擇線SSL0維持於第三參考電壓;將不選串選擇線SSL1~SSLN維持於第一參考電壓;不選該字元線WL0由第四參考電壓拉高至第五參考電壓;將其他的不選字元線WL2~WLM維持於第四參考電壓;以及,選擇該字元線WL1由第五參考電壓拉低至第四參考電壓。藉此,可以選擇區域160內的該些記憶體單元MC(如第1圖與第3圖所示)。Then in phase P33, the selected global source line GSL0 is maintained at the second reference voltage; the selected string selection line SSL0 is maintained at the third reference voltage; the unselected string selection lines SSL1~SSLN are maintained at the first reference voltage ; The word line WL0 is not selected and pulled up to the fifth reference voltage by the fourth reference voltage; the other unselected word lines WL2~WLM are maintained at the fourth reference voltage; and, the word line WL1 is selected by the fifth reference voltage The reference voltage is pulled down to the fourth reference voltage. Thereby, the memory cells MC in the area 160 can be selected (as shown in FIG. 1 and FIG. 3 ).
之後,於階段P34內進行感應。Afterwards, sensing is performed in phase P34.
同理,在位址解碼後,為存取下一筆資料,要將受選字元線改變(例如,由字元線WL1變為字元線WL2),但受選串選擇線未改變。則於下一階段內,將受選整體源極線GSL0維持於第二參考電壓;將受選串選擇線SSL0維持於第三參考電壓;將不選串選擇線SSL1~SSLN維持於第一參考電壓;未擇該字元線WL1由第四參考電壓拉高至第五參考電壓;其他的不選字元線WL0與WL3~WLM係維持於第五參考電壓;以及,選擇該字元線WL2由第五參考電壓拉低至第四參考電壓。Similarly, after address decoding, in order to access the next data, the selected word line should be changed (for example, from word line WL1 to word line WL2), but the selected string selection line remains unchanged. Then in the next stage, the selected global source line GSL0 is maintained at the second reference voltage; the selected string selection line SSL0 is maintained at the third reference voltage; the unselected string selection lines SSL1~SSLN are maintained at the first reference voltage voltage; the unselected word line WL1 is pulled up from the fourth reference voltage to the fifth reference voltage; other unselected word lines WL0 and WL3~WLM are maintained at the fifth reference voltage; and, the word line WL2 is selected pulled down from the fifth reference voltage to the fourth reference voltage.
由該些被選記憶體單元MC所讀出的資料係先輸入至頁緩衝器電路120內,再傳送給累積電路130(本案並不受限於此)進行MAC運算後,得到輸出資料。The data read from the selected memory cells MC are first input into the page buffer circuit 120, and then sent to the accumulation circuit 130 (the present application is not limited thereto) for MAC operation to obtain the output data.
亦即,於第3圖的操作方法中,於初始化階段(P31)後,讀取同一記憶體區塊內的資料下,當需要進行字元線之切換時,讓整體源極線的位準維持,讓受選串選擇線與不選串選擇線的位準維持,將下一受選字元線與目前受選字元線之位準進行切換(如階段P33)。如此做法可以縮短記憶體裝置操作之背景設定時間(階段P31~P34可視為是MAC操作中的乘法位元線設定時間與字元線設定時間)。That is, in the operation method of FIG. 3, after the initialization phase (P31), when reading data in the same memory block, when it is necessary to switch word lines, the level of the overall source line Maintain, maintain the levels of the selected string selection line and the unselected string selection line, and switch the levels of the next selected word line and the currently selected word line (such as stage P33). This method can shorten the background setup time of the memory device operation (stages P31-P34 can be regarded as the multiplication bit line setup time and word line setup time in the MAC operation).
此外,於本案第3圖實施例中,透過切換記憶體區塊、串選擇線與字元線,相比於習知技術,可以減少字元線設定時間,進而加速操作。In addition, in the embodiment of FIG. 3 of this application, by switching the memory block, the string selection line and the word line, compared with the conventional technology, the word line setting time can be reduced, thereby speeding up the operation.
更甚者,於本案第3圖實施例中,如果記憶體裝置具有多個記憶平面且各記憶平面有各自的累積電路的話,則MAC操作的累積與輸出可利用管線化方式來進行。What's more, in the embodiment of FIG. 3 of the present application, if the memory device has multiple memory planes and each memory plane has its own accumulation circuit, the accumulation and output of the MAC operation can be performed in a pipelined manner.
此外,於本案其他可能實施例中,第2圖與第3圖之操作方法可以任意組合,其皆在本案精神範圍內。第4圖與第5圖顯示根據本案又一實施例之記憶體裝置之操作方法。In addition, in other possible embodiments of the present application, the operation methods in FIG. 2 and FIG. 3 can be combined arbitrarily, which are all within the spirit of the present application. FIG. 4 and FIG. 5 show the operation method of the memory device according to another embodiment of the present invention.
於第4圖中,階段P41~P44相同或相似於第2圖的階段P21~P24,階段P45~P46相同或相似於第3圖的階段P33~P34,故其細節在此省略。In FIG. 4, stages P41-P44 are the same or similar to stages P21-P24 in FIG. 2, and stages P45-P46 are the same or similar to stages P33-P34 in FIG. 3, so details thereof are omitted here.
亦即,於第4圖中,先進行串選擇線的切換(受選串選擇線由串選擇線SSL0切換成串選擇線SSL1,如階段P43),之後進行字元線的切換(受選字元線由字元線WL0切換成字元線WL1,如階段P45)。That is, in the 4th figure, carry out the switching of string selection line earlier (selected string selection line is switched to string selection line SSL1 by string selection line SSL0, as stage P43), carry out the switching of character line afterwards (selected word line) The word line is switched from the word line WL0 to the word line WL1, as in stage P45).
於第5圖中,階段P51~P54相同或相似於第3圖的階段P31~P34,階段P55~P56相同或相似於第2圖的階段P23~P24,故其細節在此省略。In FIG. 5, stages P51-P54 are the same or similar to stages P31-P34 in FIG. 3, and stages P55-P56 are the same or similar to stages P23-P24 in FIG. 2, so details thereof are omitted here.
亦即,於第5圖中,先進行字元線的切換(受選字元線由字元線WL0切換成字元線WL1,如階段P53),之後進行串選擇線的切換(受選串選擇線由串選擇線SSL0切換成串選擇線SSL1,如階段P55)。That is to say, in Fig. 5, first carry out the switching of word line (selected word line is switched from word line WL0 to word line WL1, as stage P53), carry out the switching of string selection line afterwards (selected string The selection line is switched from the string selection line SSL0 to the string selection line SSL1, as in stage P55).
第6圖顯示根據本案又一實施例之記憶體裝置之操作方法。記憶體裝置之操作方法包括:(610)於一第一階段內,選擇一整體信號線以將該整體信號線由一第一參考電壓拉高至一第二參考電壓,選擇一第一串選擇線以將該第一串選擇線由該第一參考電壓拉高至一第三參考電壓,不選一第二串選擇線以維持於該第一參考電壓,選擇一第一字元線以將該第一字元線由該第一參考電壓拉高至一第四參考電壓,以及不選一第二字元線以將該第二字元線由該第一參考電壓拉高至一第五參考電壓;(620)於一第二階段內進行感應;(630)於一第三階段內,將該整體信號線維持於該第二參考電壓,不選該第一串選擇線將該第一串選擇線由該第三參考電壓拉低至該第一參考電壓,選擇該第二串選擇線以將該第二串選擇線由該第一參考電壓拉高至該第三參考電壓,維持被選的該第一字元線於該第四參考電壓,以及,維持不選的該第二字元線於該第五參考電壓;以及(640)於一第四階段內進行感應。FIG. 6 shows the operation method of the memory device according to another embodiment of the present application. The operation method of the memory device includes: (610) in a first stage, selecting an overall signal line to pull up the entire signal line from a first reference voltage to a second reference voltage, selecting a first string selection line to pull up the first string selection line from the first reference voltage to a third reference voltage, deselect a second string selection line to maintain at the first reference voltage, select a first word line to pull The first word line is pulled up to a fourth reference voltage by the first reference voltage, and a second word line is not selected to be pulled up to a fifth word line by the first reference voltage Reference voltage; (620) sensing in a second stage; (630) maintaining the overall signal line at the second reference voltage in a third stage, not selecting the first string selection line and the first The string selection line is pulled down from the third reference voltage to the first reference voltage, and the second string selection line is selected to pull the second string selection line up from the first reference voltage to the third reference voltage to maintain being selected. Selecting the first wordline at the fourth reference voltage, and maintaining the unselected second wordline at the fifth reference voltage; and (640) sensing in a fourth phase.
第7圖顯示根據本案又一實施例之記憶體裝置之操作方法。該記憶體裝置之操作方法包括:(710)於一第一階段內,選擇一整體信號線以將該整體信號線由一第一參考電壓拉高至一第二參考電壓,選擇一第一串選擇線以將該第一串選擇線由該第一參考電壓拉高至一第三參考電壓,不選一第二串選擇線以維持於該第一參考電壓,選擇一第一字元線以將該第一字元線由該第一參考電壓拉高至一第四參考電壓,以及不選一第二字元線以將該第二字元線由該第一參考電壓拉高至一第五參考電壓;(720)於一第二階段內進行感應;(730)於一第三階段內,將該整體信號線維持於該第二參考電壓,維持被選的該第一串選擇線於該第三參考電壓,維持不選的該第二串選擇線於該第一參考電壓,不選該第一字元線以該第一字元線由該第四參考電壓拉高至該第五參考電壓,以及,選擇該第二字元線以將該第二字元線由該第五參考電壓拉低至該第四參考電壓;以及(740)於一第四階段內進行感應。FIG. 7 shows an operation method of a memory device according to another embodiment of the present invention. The operation method of the memory device includes: (710) in a first stage, selecting an overall signal line to pull up the entire signal line from a first reference voltage to a second reference voltage, selecting a first string select line to pull up the first string selection line from the first reference voltage to a third reference voltage, unselect a second string selection line to maintain at the first reference voltage, select a first word line to Pulling up the first word line from the first reference voltage to a fourth reference voltage, and unselecting a second word line to pull up the second word line from the first reference voltage to a fourth reference voltage Five reference voltages; (720) sensing in a second stage; (730) in a third stage, maintaining the overall signal line at the second reference voltage, maintaining the selected first string of selection lines at The third reference voltage maintains the unselected second string selection line at the first reference voltage, the first word line is not selected and the first word line is pulled up from the fourth reference voltage to the fifth reference voltage, and selecting the second word line to pull down the second word line from the fifth reference voltage to the fourth reference voltage; and (740) sensing in a fourth phase.
由上述可知,在本案上述實施例中,可以提供較快操作速度(例如但不受限於,較快的MAC操作速度,較快的資料讀取/寫入速度等),因為在進行感應前可以減少背景設定時間(例如可減少MAC操作中的乘法位元線設定時間與字元線設定時間)。As can be seen from the above, in the above-mentioned embodiment of this case, a faster operation speed (such as but not limited to, a faster MAC operation speed, a faster data read/write speed, etc.) can be provided, because before sensing The background setup time can be reduced (eg, the bitline setup time and the wordline setup time in the multiplication MAC operation can be reduced).
本案上述實施例可應用於三維NAND型快閃記憶體,或者敏感於保持與熱變化的記憶體裝置,例如但不受限於,三維NOR型快閃記憶體,相變(PCM)型快閃記憶體,磁式隨機存取記憶體(magnetic RAM)或電阻式RAM等。The above-mentioned embodiments of this case can be applied to three-dimensional NAND type flash memory, or memory devices sensitive to retention and thermal changes, such as but not limited to, three-dimensional NOR type flash memory, phase change (PCM) type flash memory memory, magnetic random access memory (magnetic RAM) or resistive RAM, etc.
本案上述實施例可應用於需要執行多個MAC操作的不同人工智慧(AI)模型,例如但不受限於,全連接層(fully connection layer)、卷積層(convolution layer)、多層感知器 (Multilayer perceptron)、支援向量機器(support vector machine)等。The above embodiments of this case can be applied to different artificial intelligence (AI) models that need to perform multiple MAC operations, such as but not limited to, fully connected layer (fully connection layer), convolution layer (convolution layer), multilayer perceptron (Multilayer) perceptron), support vector machine (support vector machine), etc.
本案上述實施例可應用於加速MAC操作、讀取操作、寫入操作等。The foregoing embodiments of the present application can be applied to accelerate MAC operations, read operations, write operations, and the like.
本案上述實施例可應用於計算用途(computing usage),亦可應用於資料搜尋、分析用途、聚類分析(Clustering analysis)等。The above-mentioned embodiments of this case can be applied to computing usage, and can also be applied to data search, analysis, clustering analysis, and the like.
綜上所述,雖然本發明已以實施例揭露如上,然其並非用以限定本發明。本發明所屬技術領域中具有通常知識者,在不脫離本發明之精神和範圍內,當可作各種之更動與潤飾。因此,本發明之保護範圍當視後附之申請專利範圍所界定者為準。To sum up, although the present invention has been disclosed by the above embodiments, it is not intended to limit the present invention. Those skilled in the art of the present invention can make various changes and modifications without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the present invention should be defined by the scope of the appended patent application.
100:記憶體裝置 B0~BQ:記憶體區塊 120:頁緩衝器電路 CSL:共同源極線 GSL0~GSLQ:整體源極線 SSL0~SSLN:串選擇線 WL0~WLM:字元線 BL0~BLP:位元線 SW1、SW2:開關 SS:記憶體串 121_0~121_P:頁緩衝器 Id:電流 150、151、160:區域 130:累積電路 P21~P24、P31~P34、P41~P46、P51~P56:階段 610-640、710-740:步驟 100: Memory device B0~BQ: Memory block 120: page buffer circuit CSL: common source line GSL0~GSLQ: Global source line SSL0~SSLN: String selection line WL0~WLM: word line BL0~BLP: bit line SW1, SW2: switch SS: memory string 121_0~121_P: page buffer Id: current 150, 151, 160: area 130: accumulation circuit P21~P24, P31~P34, P41~P46, P51~P56: stages 610-640, 710-740: Steps
第1圖顯示根據本案一實施例之記憶體裝置之電路示意圖。 第2圖顯示根據本案一實施例之記憶體操作方法之示意圖及波形圖。 第3圖顯示根據本案另一實施例之記憶體操作方法之示意圖及波形圖。 第4圖與第5圖顯示根據本案又一實施例之記憶體裝置之操作方法。 第6圖顯示根據本案又一實施例之記憶體裝置之操作方法。 第7圖顯示根據本案又一實施例之記憶體裝置之操作方法。 FIG. 1 shows a schematic circuit diagram of a memory device according to an embodiment of the present invention. FIG. 2 shows a schematic diagram and a waveform diagram of a memory operation method according to an embodiment of the present invention. FIG. 3 shows a schematic diagram and a waveform diagram of a memory operation method according to another embodiment of the present invention. FIG. 4 and FIG. 5 show the operation method of the memory device according to another embodiment of the present invention. FIG. 6 shows the operation method of the memory device according to another embodiment of the present application. FIG. 7 shows an operation method of a memory device according to another embodiment of the present invention.
610-640:步驟 610-640: Steps
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