TW202013787A - Organic el element and method of producing same - Google Patents
Organic el element and method of producing same Download PDFInfo
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- 239000002274 desiccant Substances 0.000 claims abstract description 85
- 238000007789 sealing Methods 0.000 claims abstract description 63
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- 239000000565 sealant Substances 0.000 claims abstract description 20
- 238000005401 electroluminescence Methods 0.000 claims abstract description 18
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- 239000010410 layer Substances 0.000 claims description 147
- 239000002245 particle Substances 0.000 claims description 25
- 239000012044 organic layer Substances 0.000 claims description 8
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- 229910052784 alkaline earth metal Inorganic materials 0.000 claims description 6
- 150000001342 alkaline earth metals Chemical class 0.000 claims description 6
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- HFACYLZERDEVSX-UHFFFAOYSA-N benzidine Chemical compound C1=CC(N)=CC=C1C1=CC=C(N)C=C1 HFACYLZERDEVSX-UHFFFAOYSA-N 0.000 description 2
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/841—Self-supporting sealing arrangements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/846—Passivation; Containers; Encapsulations comprising getter material or desiccants
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
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- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Electroluminescent Light Sources (AREA)
- Drying Of Gases (AREA)
Abstract
Description
本發明係有關一種有機電致發光元件及其製造方法。The invention relates to an organic electroluminescence element and a manufacturing method thereof.
為了防止有機電致發光元件(有機EL元件)的發光部由於水分引起之發光壽命的下降,有時藉由密封基板來密封已設置在基板上之發光部,進而在密封基板上設置吸水材料(例如,日本特開2006-331766號公報)。In order to prevent the luminescence part of the organic electroluminescence element (organic EL element) from decreasing the luminescence life due to moisture, the light emitting part already provided on the substrate is sometimes sealed by a sealing substrate, and a water-absorbing material is provided on the sealing substrate ( For example, Japanese Patent Laid-Open No. 2006-331766).
[發明所欲解決的問題] 具有設置在密封基板上之乾燥劑層之有機電致發光元件之製造中,為了避免水分的混入,需要在惰性氣體等乾燥氣氛下在密封基板上形成乾燥劑層。但是,就步驟及設備的簡化的觀點而言,期望能夠在大氣氣氛下形成乾燥劑層,而無需乾燥氣氛。藉由使用吸水容量高的乾燥劑,期待即使在大氣氣氛下形成乾燥劑層,乾燥劑層亦能夠保持足夠的吸水能力。然而,明確可知:即使使用吸水容量高的乾燥劑,若在大氣氣氛下在密封基板上形成乾燥劑層,則有機電致發光元件的發光面積比率,從剛製造之後的初期,容易變成不足。[Problems to be solved by the invention] In the manufacture of an organic electroluminescent element having a desiccant layer provided on a sealing substrate, in order to avoid the incorporation of moisture, it is necessary to form a desiccant layer on the sealing substrate under a dry atmosphere such as an inert gas. However, from the viewpoint of simplification of steps and equipment, it is desirable to be able to form a desiccant layer in an atmospheric atmosphere without a drying atmosphere. By using a desiccant with a high water absorption capacity, it is expected that even if the desiccant layer is formed in an atmospheric atmosphere, the desiccant layer can maintain sufficient water absorption capacity. However, it is clear that even if a desiccant with a high water absorption capacity is used, if a desiccant layer is formed on the sealing substrate in an atmospheric atmosphere, the light emitting area ratio of the organic electroluminescence element tends to become insufficient from the early stage immediately after production.
[解決問題的技術手段] 因此,本發明的一方案的目的為提供一種即使在藉由包括在大氣氣氛下形成乾燥劑層的步驟之方法來製造時,亦能夠保持足夠的初始發光面積比率之有機電致發光元件。[Technical means to solve the problem] Therefore, an object of one aspect of the present invention is to provide an organic electroluminescence element capable of maintaining a sufficient initial light-emitting area ratio even when manufactured by a method including a step of forming a desiccant layer in an atmospheric atmosphere.
本發明的一方案係有關一種有機電致發光元件,其具備:元件基板;發光部,其設置在元件基板上;密封基板,其具有與元件基板對置之主表面;複合層,其包含設置在前述主表面上之乾燥劑層及撥水層;及,密封劑,其介於元件基板與密封基板之間,藉此將元件基板和密封基板進行黏接。發光部具有對置配置之一對電極及在該等之間設置的有機層。形成由元件基板、密封基板及密封劑包圍之氣密空間。在該氣密空間內配置有發光部及複合層。An aspect of the present invention relates to an organic electroluminescence device including: an element substrate; a light-emitting portion provided on the element substrate; a sealing substrate having a main surface opposed to the element substrate; and a composite layer including the arrangement A desiccant layer and a water-repellent layer on the aforementioned main surface; and, a sealant interposed between the element substrate and the sealing substrate, thereby bonding the element substrate and the sealing substrate. The light-emitting part has a pair of electrodes arranged oppositely and an organic layer provided between these. An airtight space surrounded by the element substrate, the sealing substrate and the sealant is formed. The light emitting section and the composite layer are arranged in the airtight space.
本發明的另一方案係有關一種製造有機電致發光元件之方法。該方法具備:在密封基板的主表面上形成包含乾燥劑層及撥水層之複合層之步驟;在元件基板上形成發光部之步驟;及,以前述主表面與元件基板對置之方向,將密封基板黏接於前述元件基板上之步驟。密封基板藉由介於元件基板與密封基板之間之密封劑而被黏接於元件基板上。形成由元件基板、密封基板及密封劑包圍之氣密空間。在該氣密空間內配置發光部及複合層。Another aspect of the present invention relates to a method of manufacturing an organic electroluminescent element. The method includes: a step of forming a composite layer including a desiccant layer and a water repellent layer on the main surface of the sealing substrate; a step of forming a light-emitting portion on the element substrate; and, in a direction where the main surface and the element substrate face each other, The step of bonding the sealing substrate to the aforementioned element substrate. The sealing substrate is adhered to the element substrate by the sealant interposed between the element substrate and the sealing substrate. An airtight space surrounded by the element substrate, the sealing substrate and the sealant is formed. The light emitting section and the composite layer are arranged in the airtight space.
[發明的效果] 藉由在密封基板的主表面上設置乾燥劑層及撥水層,即使在大氣氣氛下形成乾燥劑層時,有機電致發光元件亦容易維持足夠的初始發光面積比率。撥水層抑制大氣氣氛中的水分吸附到密封基板上。又,認為撥水層還抑制已吸附到密封基板上之水分影響發光部。[Effect of invention] By providing a desiccant layer and a water-repellent layer on the main surface of the sealing substrate, even when the desiccant layer is formed in the atmosphere, the organic electroluminescent element can easily maintain a sufficient initial light-emitting area ratio. The water-repellent layer suppresses the adsorption of moisture in the atmospheric atmosphere onto the sealing substrate. In addition, it is considered that the water repellent layer also suppresses the moisture absorbed on the sealing substrate from affecting the light-emitting portion.
以下,對本發明的若干個實施形態進行詳細說明。但是,本發明並不限定於以下實施形態。Hereinafter, several embodiments of the present invention will be described in detail. However, the present invention is not limited to the following embodiments.
圖1係表示有機電致發光元件的一實施形態之剖面圖。圖1中所示之有機電致發光元件20,具備:元件基板1、設置在元件基板1上之發光部7、密封基板3、包含乾燥劑層10及撥水層11之複合層15、及密封劑5。FIG. 1 is a cross-sectional view showing an embodiment of an organic electroluminescence device. The
密封基板3具有:頂板部3A,其具有與元件基板1對置之矩形或正方形的平坦的主表面3S;及,側壁部3B,其從頂板部3A的外周端部沿與主表面3S垂直之方向延伸。頂板部3A及側壁部3B,形成將主表面3S作為底表面而具有之凹部。複合層15形成於密封基板3的主表面3S上。The
密封劑5,介於密封基板3的側壁部3B與元件基板1之間,並將密封基板3和元件基板1進行黏接。藉此,形成有由元件基板1、密封基板3及密封劑5包圍之氣密空間30。在該氣密空間30內配置發光部7及複合層15。密封基板3可以係不具有側壁部3B之平坦的板狀體,在該情形下,通常,密封劑5介於密封基板3的頂板部3A與元件基板1之間。在任何情形下,“與元件基板對置之主表面”係指在配置有發光部之氣密空間內與元件基板對置之表面。撥水層11設置成與主表面3S接觸。在撥水層11的與主表面3S相反的一側的面上設置有乾燥劑層10。The
圖2係表示密封基板及複合層的一實施形態之俯視圖。圖3係沿圖2的II-II線之剖面圖。圖2的俯視圖示出從與密封基板3的主表面3S垂直之方向觀察密封基板3及複合層15之形態。在圖2及圖3的實施形態的情形下,複合層15覆蓋整個主表面3S。但是,複合層15也可以覆蓋主表面3S的一部分。例如,從與密封基板3的主表面3S垂直之方向觀察時,相對於主表面3S的面積,複合層15的面積比率可以係50%以上、60%以上、70%以上或75%以上。認為:若複合層15的面積比率增加,則在大氣氣氛下附著於密封基板3的主表面3S上之水分不容易影響發光部7。又,就確保密封基板與元件基板之間的穩定的黏接之觀點而言,複合層15的面積比率可以小於90%。2 is a plan view showing an embodiment of a sealing substrate and a composite layer. FIG. 3 is a cross-sectional view taken along line II-II of FIG. 2. The plan view of FIG. 2 shows the state in which the
乾燥劑層10包含沿一定方向延伸之複數個線狀部。線狀部可以沿矩形或正方形主表面3S的任一邊延伸。如圖2及圖3所示,相鄰之線狀部可以分開,亦可以局部或整體接觸。通常,由於各線狀部具有相對於主表面3S平緩地傾斜之表面,因此即使相鄰之線狀部接觸,亦能夠區分各線狀部。關於各線狀部的寬度,例如,可以係0.5mm以上且50mm以下、或1mm以上且10mm以下。在此,“線狀部的寬度”為線狀部的與長邊方向垂直之方向上的寬度。線狀部的厚度可以係50μm以上且200μm以下。乾燥劑層10的線狀部並不一定需要直線延伸,可以包括曲線狀部分。線狀部能以直線或曲線狀延伸,而不交叉。例如,線狀部可以彎曲,亦能以螺旋狀延伸。The
關於具有線狀部之乾燥劑層10,由於表面積大,因此相較於單一膜能夠發揮大的吸水能力。又,尤其,在主表面3S的面積大的情形下,相較於單一膜能夠輕易地形成之方面上,具有線狀部之乾燥劑層10係有利的。Since the
撥水層11為覆蓋整個主表面3S之單一膜。撥水層11的厚度並無特別限定,但是可以小於乾燥劑層10的厚度。關於撥水層11的厚度,例如,可以係0.1μm以上且10μm以下。The
圖4亦係表示密封基板及複合層的一實施形態之剖面圖。在圖4的實施形態的情形下,乾燥劑層10包括與主表面接觸而設置之線狀部,撥水層11包括覆蓋主表面3S中的未被乾燥劑層10覆蓋的部分之部分。乾燥劑層10的一部分表面暴露而未被撥水層11覆蓋。FIG. 4 is also a cross-sectional view showing an embodiment of the sealing substrate and the composite layer. In the case of the embodiment of FIG. 4, the
圖5亦係表示密封基板及複合層的一實施形態之剖面圖。在圖4的實施形態的情形下,乾燥劑層10具有與圖3相同的構成。撥水層11,包括:覆蓋主表面3S中的未被乾燥劑層10覆蓋的部分之部分、及覆蓋乾燥劑層10之部分。換言之,撥水層11覆蓋主表面3S及乾燥劑層10。FIG. 5 is also a cross-sectional view showing an embodiment of the sealing substrate and the composite layer. In the case of the embodiment of FIG. 4, the
複合層的形態並不限定於以上例示者。例如,如圖6中所示之變形例那樣,乾燥劑層10可以係單一膜。圖6的實施形態中,乾燥劑層10覆蓋與密封基板3的主表面接觸而設置之撥水層11的表面的中央部。The form of the composite layer is not limited to those exemplified above. For example, as in the modification shown in FIG. 6, the
關於構成以上說明之實施形態之有機電致發光元件之各部的詳細內容,在以下進行說明。The details of each part constituting the organic electroluminescence element of the embodiment described above will be described below.
乾燥劑層10,例如含有:包含鹼土金屬的氧化物之氧化物粒子、及黏合劑樹脂。乾燥劑層10,例如能夠藉由包括將含有該等之乾燥劑組成物塗佈於密封基板的主表面3S或預先形成之撥水層11上之方法來形成。The
乾燥劑層10中的氧化物粒子包含能夠對氧化物粒子賦予吸水性能之鹼土金屬的氧化物。將氧化物粒子的質量作為基準,氧化物粒子通常包含80質量%以上或90質量%以上的鹼土金屬的氧化物。氧化物粒子能夠包含1種或成分不同的2種以上的鹼土金屬的氧化物。The oxide particles in the
作為鹼土金屬的氧化物,例如可舉出氧化鎂(MgO)、氧化鈣(CaO)、氧化鍶(SrO)及氧化鋇(BaO)。鹼土金屬的氧化物可以係氧化鎂、氧化鈣或它們的組合。Examples of the oxides of alkaline earth metals include magnesium oxide (MgO), calcium oxide (CaO), strontium oxide (SrO), and barium oxide (BaO). The alkaline earth metal oxide may be magnesium oxide, calcium oxide, or a combination thereof.
將乾燥劑層的質量作為基準,乾燥劑層10中的氧化物粒子的含量可以係40~80質量%。若氧化物粒子的含量大,則吸水容量增加,因此即使在大氣氣氛下形成乾燥劑層10時,亦容易保持足夠的吸水能力。就相同的觀點而言,將乾燥劑層的質量作為基準,氧化物粒子的含量可以係50質量%以上、55質量%以上或60質量%以上。Using the mass of the desiccant layer as a reference, the content of oxide particles in the
氧化物粒子的平均粒徑並無特別限制,但是例如可以係0.01~30μm。若氧化物粒子的平均粒徑為該範圍,則傾向於可獲得更加高的吸水性能。就相同的觀點而言,氧化物粒子的平均粒徑可以係0.1μm以上、0.5μm以上或1μm以上,可以係20μm以下、10μm以下或5μm以下。在本說明書中,氧化物粒子的平均粒徑係指藉由動態光散射式粒度分佈計測量出之體積分佈的中央值。該平均粒徑為利用使氧化物粒子分散於既定的分散介質中而製備之分散液測量出之值。The average particle diameter of the oxide particles is not particularly limited, but it may be, for example, 0.01 to 30 μm. If the average particle diameter of the oxide particles falls within this range, it tends to obtain higher water absorption performance. From the same viewpoint, the average particle diameter of the oxide particles may be 0.1 μm or more, 0.5 μm or more, or 1 μm or more, and may be 20 μm or less, 10 μm or less, or 5 μm or less. In this specification, the average particle size of oxide particles refers to the central value of the volume distribution measured by a dynamic light scattering particle size distribution meter. The average particle diameter is a value measured using a dispersion liquid prepared by dispersing oxide particles in a predetermined dispersion medium.
黏合劑樹脂例如可以包含聚矽氧樹脂。乾燥劑層中的黏合劑樹脂可以包含由聚合性化合物形成之交聯聚合物。聚合性化合物例如可以係具有(甲基)丙烯醯氧基之改質聚矽氧。若該改質聚矽氧聚合,則乾燥劑組成物硬化,其結果,形成包含作為聚矽氧樹脂之交聯聚合物之乾燥劑層。The binder resin may include polysiloxane resin, for example. The binder resin in the desiccant layer may contain a cross-linked polymer formed of a polymerizable compound. The polymerizable compound may be, for example, modified polysiloxane having (meth)acryloyloxy group. When the modified polysiloxane is polymerized, the desiccant composition hardens, and as a result, a desiccant layer containing a cross-linked polymer as polysiloxane resin is formed.
具有(甲基)丙烯醯氧基之改質聚矽氧,例如由下述式(I)表示。式(I)中,R3 及R4 分別獨立地表示2價的有機基,R5 及R6 分別獨立地表示氫原子或甲基,x表示1以上的整數。R3 及R4 可以係伸烷基。 The modified polysiloxane with (meth)acryloyloxy group is represented by the following formula (I), for example. In formula (I), R 3 and R 4 each independently represent a divalent organic group, R 5 and R 6 each independently represent a hydrogen atom or a methyl group, and x represents an integer of 1 or more. R 3 and R 4 may be an alkylene group.
乾燥劑組成物還可以含有能夠與具有(甲基)丙烯醯氧基之改質聚矽氧共聚之其他聚合性化合物。其他聚合性化合物可以係具有1個或2個以上的(甲基)丙烯醯基之(甲基)丙烯酸化合物。就黏度的穩定性提高效果的觀點而言,相對於改質聚矽氧及其他聚合性化合物的總量,改質聚矽氧的含量可以係80~100質量%或90~100質量%。The desiccant composition may further contain other polymerizable compounds that can be copolymerized with modified polysiloxane having a (meth)acryloyloxy group. The other polymerizable compound may be a (meth)acrylic compound having one or more (meth)acryloyl groups. From the viewpoint of the effect of improving the stability of viscosity, the content of modified polysiloxane may be 80 to 100% by mass or 90 to 100% by mass relative to the total amount of modified polysiloxane and other polymerizable compounds.
相對於乾燥劑組成物的總質量,乾燥劑組成物中的具有(甲基)丙烯醯氧基之改質聚矽氧及其他聚合性化合物的總量,可以係20~90質量%。若聚合性化合物的含量在該範圍內,則具有容易確保更加優異的塗佈性及吸水性能之傾向。就相同的觀點而言,相對於乾燥劑組成物的總質量,具有(甲基)丙烯醯氧基之改質聚矽氧及其他聚合性化合物的總量,可以係20質量%以上或50質量%以上,亦可以係90質量%以下或70質量%以下。Relative to the total mass of the desiccant composition, the total amount of modified polysiloxane and other polymerizable compounds having (meth)acryloyloxy groups in the desiccant composition may be 20 to 90% by mass. When the content of the polymerizable compound is within this range, there is a tendency that it is easier to ensure more excellent coatability and water absorption performance. From the same point of view, the total amount of modified polysiloxane and other polymerizable compounds having (meth)acryloyloxy groups can be 20% by mass or more or 50% by mass relative to the total mass of the desiccant composition % Or more, it may be 90% by mass or less or 70% by mass or less.
為了光硬化,乾燥劑組成物還可以含有光自由基聚合起始劑。作為光自由基聚合起始劑,例如,可舉出1-羥基-環己基-苯基-酮、2-苄基-2-二甲基胺基-1-(4-嗎啉代苯基)-1-丁酮、2,2-二甲氧基-1,2-二苯乙烷-1-酮、2-甲基-1[4-(甲基硫基)苯基]-2-嗎啉代丙烷-1-酮及1-[4-(2-羥乙氧基)-苯基]-2-羥基-2-甲基-1-丙烷-1-酮。在乾燥劑組成物包含光自由基聚合起始劑之情形下,相對於乾燥劑組成物中的聚合性化合物的質量,其含量例如可以係0.01~10質量%。For photo hardening, the desiccant composition may further contain a photo radical polymerization initiator. Examples of the photo-radical polymerization initiator include 1-hydroxy-cyclohexyl-phenyl-one and 2-benzyl-2-dimethylamino-1-(4-morpholinophenyl) -1-Butanone, 2,2-dimethoxy-1,2-diphenylethane-1-one, 2-methyl-1[4-(methylthio)phenyl]-2-? Porphyrin-1-one and 1-[4-(2-hydroxyethoxy)-phenyl]-2-hydroxy-2-methyl-1-propane-1-one. When the desiccant composition contains an optical radical polymerization initiator, the content of the polymerizable compound in the desiccant composition may be, for example, 0.01 to 10% by mass.
依需要,乾燥劑層及用於形成其之乾燥劑組成物還可以含有其他成分。例如,為了調節黏度或提高氧化物粒子的分散性等目的,乾燥劑層及乾燥劑組成物可以含有不具有聚合性基之聚矽氧化合物。The desiccant layer and the desiccant composition used to form it may contain other components as needed. For example, the desiccant layer and the desiccant composition may contain a polysiloxane compound having no polymerizable group for the purpose of adjusting viscosity or improving the dispersibility of oxide particles.
乾燥劑組成物能夠在25℃下為糊狀。乾燥劑組成物在25℃條件下的黏度可以係5~500Pa•s。若乾燥劑組成物在25℃條件下的黏度在該範圍內,則藉由塗佈能夠更輕易地形成乾燥劑層。此處的黏度為藉由B型黏度計、流變計等旋轉黏度計測量出之值。The desiccant composition can be paste-like at 25°C. The viscosity of the desiccant composition at 25°C can be 5 to 500 Pa•s. If the viscosity of the desiccant composition at 25°C is within this range, the desiccant layer can be formed more easily by coating. The viscosity here is the value measured by a rotating viscometer such as a B-type viscometer and a rheometer.
撥水層11可以係包含各種撥水性材料之層。作為撥水性材料的例子,可舉出氟樹脂等有機氟化合物及聚二甲基矽氧烷等聚矽氧。有機氟化合物可以係具有全氟烷基之化合物。例如,可以使用AGC Inc.的CYTOP(商品名稱,氟樹脂)、AGC SEIMI CHEMICAL CO., LTD製造的SFCOAT(商品名稱)等市售的塗佈劑來形成撥水層11。The water-
構成有機電致發光元件20之元件基板1並無特別限定,但是典型地為具有絕緣性及透光性且具有矩形主表面之玻璃基板。藉由透明導電材料(例如,ITO(Indium Tin Oxide:氧化銦錫)),在元件基板1上形成有電極51。電極51例如藉由如下方法形成,該方法包含:藉由真空沉積法、濺射法等PVD(物理氣相沉積:Physical Vapor Deposition)法在元件基板1上形成ITO膜之步驟;及,藉由利用光刻法之蝕刻將ITO膜形成為既定的圖案形狀之步驟。電極51可以被引出至氣密空間30的外側,藉此電極51可以與驅動電路連接。The
發光部7,具有:對置配置之一對電極51、52;及,在電極51及電極52之間設置的有機層40。電極51可以係陽極,且電極52可以係陰極。有機層40具有電洞注入層41、電洞傳輸層42、發光層43及電子傳輸層44,且從電極51側依次積層有該等。The light-emitting
電洞注入層41例如由數10nm的膜厚的銅酞青(CuPc)形成。電洞傳輸層42例如由數10nm的膜厚的雙[N-(1-萘基)-N-苯基]聯苯胺(bis[N-(1-naphthyl)-N-phenyl]benzidine)(α-NPD)形成。發光層43例如由數10nm的膜厚的三(8-羥基喹啉)鋁(Alq3)形成。電子傳輸層44例如由數nm的膜厚的氟化鋰(LiF)形成。The
在有機層40的上表面上積層有電極52。電極52可以係藉由真空蒸鍍法等PVD法形成之金屬薄膜。作為金屬薄膜的材料,例如可舉出Al、Li、Mg、In等功函數小的金屬單質及Al-Li、Mg-Ag功函數小的合金。電極52例如以數10nm~數100nm或50nm~200nm的膜厚形成。電極52可以被引出至元件基板2的端部,藉此電極52可以與驅動電路連接。An
密封基板3可以係玻璃基板。大氣中的水分相對容易附著於玻璃基板的表面上。因此,在大氣氣氛下在作為密封基板3的玻璃基板上形成乾燥劑層10之情形下,如本實施形態那樣設置乾燥劑層10及撥水層11的利益大。The sealing
密封劑5能夠使用通常用於有機電致發光元件的密封之材料來形成。例如,能夠由紫外線硬化性樹脂形成密封劑5。The
有機電致發光元件20例如能夠藉由如下方法來製造,該方法包括:在密封基板3的主表面3S上形成包含乾燥劑層10及撥水層11之複合層15之步驟;在密封基板3的主表面3S上形成乾燥劑層10之步驟;在元件基板1上形成發光部7之步驟;及,以主表面3S與元件基板1對置之方向,將密封基板3黏接於元件基板1上之步驟。密封基板3藉由介於元件基板1與密封基板3之間之密封劑5黏接於元件基板1上。可形成由元件基板1、密封基板3及密封劑5包圍之氣密空間30。在氣密空間30內配置發光部7及複合層15。The
可以在大氣氣氛下在主表面3S上或撥水層11上形成乾燥劑層10。在本說明書中提及之“大氣氣氛”可以係藉由一般的空調設備控制溫度及濕度之環境。例如,大氣氣氛可以係15~30℃、相對濕度40~80%的氣氛。在該情形下,在大氣氣氛下將乾燥劑組成物塗佈於密封基板3的主表面3S上。然後,依需要,使乾燥劑組成物的塗膜在大氣氣氛下硬化。乾燥劑組成物例如能夠使用分注器來進行塗佈。The
可以在大氣氣氛下在主表面3S上或主表面3S及乾燥劑層10上形成撥水層11。在該情形下,在大氣氣氛下將包含撥水性材料之塗佈劑塗佈於密封基板3的主表面3S或主表面3S及乾燥劑層10上。然後,依需要,使塗佈劑的塗膜在大氣氣氛下進行乾燥或硬化。塗佈劑例如能夠使用分注器來進行塗佈。The
圖2及圖3的實施形態之複合層15能夠藉由如下步驟來形成,該步驟包括:形成與主表面3S接觸之撥水層11;及,在撥水層11的與主表面3S相反的一側的面上形成乾燥劑層10。可以在大氣氣氛下進行該等的一部分或全部。The
圖3或圖4的實施形態之複合層15能夠藉由如下步驟來形成,該步驟包括:形成包括與主表面3S接觸的線狀部之乾燥劑層10;及,形成覆蓋主表面3S中的未被乾燥劑層10覆蓋之部分和依情形覆蓋乾燥劑層10之撥水層11。可以在大氣氣氛下進行該等的一部分或全部。The
其他步驟能夠依據在有機電致發光元件之製造中通常採用之方法來進行。將密封基板黏接於元件基板上之步驟,通常在經除濕之乾燥氣氛下進行。The other steps can be performed according to a method generally used in the manufacture of organic electroluminescent elements. The step of adhering the sealing substrate to the element substrate is usually carried out under a dehumidified dry atmosphere.
依本發明的一方案,可提供一種即使在藉由包括在大氣氣氛下形成乾燥劑層的步驟之方法來製造時,亦能夠保持足夠的初始發光面積比率之有機電致發光元件。According to an aspect of the present invention, it is possible to provide an organic electroluminescent device capable of maintaining a sufficient initial light-emitting area ratio even when it is manufactured by a method including a step of forming a desiccant layer in an atmospheric atmosphere.
1:元件基板
3:密封基板
3A:密封基板的頂板部
3B:密封基板的側壁部
3S:密封基板的主表面
5:密封劑
7:發光部
10:乾燥劑層
11:撥水層
15:複合層
20:有機電致發光元件
30:氣密空間
40:有機層
51、52:電極
1: component substrate
3: sealed
圖1係表示有機電致發光元件的一實施形態之剖面圖。 圖2係表示密封基板及複合層的一實施形態之俯視圖。 圖3係沿圖2的II-II線之剖面圖。 圖4係表示密封基板及複合層的一實施形態之剖面圖。 圖5係表示密封基板及複合層的一實施形態之剖面圖。 圖6係表示密封基板及複合層的一實施形態之俯視圖。FIG. 1 is a cross-sectional view showing an embodiment of an organic electroluminescence device. 2 is a plan view showing an embodiment of a sealing substrate and a composite layer. FIG. 3 is a cross-sectional view taken along line II-II of FIG. 2. 4 is a cross-sectional view showing an embodiment of a sealing substrate and a composite layer. 5 is a cross-sectional view showing an embodiment of a sealing substrate and a composite layer. 6 is a plan view showing an embodiment of a sealing substrate and a composite layer.
國內寄存資訊 (請依寄存機構、日期、號碼順序註記) 無Domestic storage information (please note in order of storage institution, date, number) no
國外寄存資訊 (請依寄存國家、機構、日期、號碼順序註記) 無Overseas hosting information (please note in order of hosting country, institution, date, number) no
1:元件基板 1: component substrate
3:密封基板 3: sealed substrate
3A:密封基板的頂板部 3A: Seal the top part of the substrate
3B:密封基板的側壁部 3B: Seal the side wall of the substrate
3S:密封基板的主表面 3S: Seal the main surface of the substrate
5:密封劑 5: Sealant
7:發光部 7: Light emitting part
10:乾燥劑層 10: Desiccant layer
11:撥水層 11: Water-repellent layer
15:複合層 15: Composite layer
20:有機電致發光元件 20: Organic electroluminescence element
30:氣密空間 30: Airtight space
40:有機層 40: Organic layer
51、52:電極 51, 52: electrode
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| JP7391000B2 (en) * | 2020-10-09 | 2023-12-04 | 双葉電子工業株式会社 | Desiccant composition, sealing structure, organic EL device, and method for manufacturing an organic EL device |
| CN112490389A (en) * | 2020-12-09 | 2021-03-12 | 中国乐凯集团有限公司 | Organic light emitting diode packaging structure, packaging method and lighting device |
| CN112820839B (en) * | 2021-01-07 | 2022-08-23 | 深圳市华星光电半导体显示技术有限公司 | Display panel and preparation method thereof |
| CN114709320A (en) * | 2022-03-30 | 2022-07-05 | Tcl华星光电技术有限公司 | Tiled display device |
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| DE19959957A1 (en) * | 1999-12-13 | 2001-06-21 | Sued Chemie Ag | Platelet-shaped compacts |
| JP4090253B2 (en) * | 2002-03-08 | 2008-05-28 | 三洋電機株式会社 | Display device |
| JP2003317936A (en) * | 2002-04-24 | 2003-11-07 | Sanyo Electric Co Ltd | Electroluminescence display device |
| JP4118099B2 (en) * | 2002-07-22 | 2008-07-16 | 三洋電機株式会社 | Electroluminescence display device |
| JP4050972B2 (en) * | 2002-10-16 | 2008-02-20 | 株式会社 日立ディスプレイズ | Display device |
| JP2004186048A (en) * | 2002-12-04 | 2004-07-02 | Sanyo Electric Co Ltd | Display and desiccant |
| JP2013127932A (en) * | 2011-12-19 | 2013-06-27 | Tokai Rubber Ind Ltd | Organic semiconductor element sealing body |
| JP6612130B2 (en) * | 2013-12-27 | 2019-11-27 | Jxtgエネルギー株式会社 | Light emitting element |
| JP6649243B2 (en) * | 2016-12-27 | 2020-02-19 | 双葉電子工業株式会社 | Desiccant composition, sealing structure, and organic EL device |
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| JP2020021559A (en) | 2020-02-06 |
| CN110783477A (en) | 2020-02-11 |
| JP6855418B2 (en) | 2021-04-07 |
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