TW202013787A - Organic el element and method of producing same - Google Patents

Organic el element and method of producing same Download PDF

Info

Publication number
TW202013787A
TW202013787A TW108126455A TW108126455A TW202013787A TW 202013787 A TW202013787 A TW 202013787A TW 108126455 A TW108126455 A TW 108126455A TW 108126455 A TW108126455 A TW 108126455A TW 202013787 A TW202013787 A TW 202013787A
Authority
TW
Taiwan
Prior art keywords
layer
main surface
substrate
desiccant
sealing substrate
Prior art date
Application number
TW108126455A
Other languages
Chinese (zh)
Inventor
米澤禎久
稗田茂
小川一道
Original Assignee
日商双葉電子工業股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商双葉電子工業股份有限公司 filed Critical 日商双葉電子工業股份有限公司
Publication of TW202013787A publication Critical patent/TW202013787A/en

Links

Images

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00Organic light-emitting devices
    • H10K50/80Constructional details
    • H10K50/84Passivation; Containers; Encapsulations
    • H10K50/841Self-supporting sealing arrangements
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00Organic light-emitting devices
    • H10K50/80Constructional details
    • H10K50/84Passivation; Containers; Encapsulations
    • H10K50/844Encapsulations
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00Organic light-emitting devices
    • H10K50/80Constructional details
    • H10K50/84Passivation; Containers; Encapsulations
    • H10K50/846Passivation; Containers; Encapsulations comprising getter material or desiccants
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00Manufacture or treatment specially adapted for the organic devices covered by this subclass

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroluminescent Light Sources (AREA)
  • Drying Of Gases (AREA)

Abstract

The present invention discloses an organic electroluminescence (EL) element which includes: an element substrate; a light-emitting portion; a sealing substrate having a main surface facing the element substrate; a composite layer including a desiccant layer and a water repellent layer provided on the main surface; and a sealant. An airtight space is formed and surrounded by the element substrate, the sealing substrate, and the sealant, and the light-emitting portion and the composite layer are arranged in the airtight space.

Description

有機電致發光元件及其製造方法Organic electroluminescence element and its manufacturing method

本發明係有關一種有機電致發光元件及其製造方法。The invention relates to an organic electroluminescence element and a manufacturing method thereof.

為了防止有機電致發光元件(有機EL元件)的發光部由於水分引起之發光壽命的下降,有時藉由密封基板來密封已設置在基板上之發光部,進而在密封基板上設置吸水材料(例如,日本特開2006-331766號公報)。In order to prevent the luminescence part of the organic electroluminescence element (organic EL element) from decreasing the luminescence life due to moisture, the light emitting part already provided on the substrate is sometimes sealed by a sealing substrate, and a water-absorbing material is provided on the sealing substrate ( For example, Japanese Patent Laid-Open No. 2006-331766).

[發明所欲解決的問題] 具有設置在密封基板上之乾燥劑層之有機電致發光元件之製造中,為了避免水分的混入,需要在惰性氣體等乾燥氣氛下在密封基板上形成乾燥劑層。但是,就步驟及設備的簡化的觀點而言,期望能夠在大氣氣氛下形成乾燥劑層,而無需乾燥氣氛。藉由使用吸水容量高的乾燥劑,期待即使在大氣氣氛下形成乾燥劑層,乾燥劑層亦能夠保持足夠的吸水能力。然而,明確可知:即使使用吸水容量高的乾燥劑,若在大氣氣氛下在密封基板上形成乾燥劑層,則有機電致發光元件的發光面積比率,從剛製造之後的初期,容易變成不足。[Problems to be solved by the invention] In the manufacture of an organic electroluminescent element having a desiccant layer provided on a sealing substrate, in order to avoid the incorporation of moisture, it is necessary to form a desiccant layer on the sealing substrate under a dry atmosphere such as an inert gas. However, from the viewpoint of simplification of steps and equipment, it is desirable to be able to form a desiccant layer in an atmospheric atmosphere without a drying atmosphere. By using a desiccant with a high water absorption capacity, it is expected that even if the desiccant layer is formed in an atmospheric atmosphere, the desiccant layer can maintain sufficient water absorption capacity. However, it is clear that even if a desiccant with a high water absorption capacity is used, if a desiccant layer is formed on the sealing substrate in an atmospheric atmosphere, the light emitting area ratio of the organic electroluminescence element tends to become insufficient from the early stage immediately after production.

[解決問題的技術手段] 因此,本發明的一方案的目的為提供一種即使在藉由包括在大氣氣氛下形成乾燥劑層的步驟之方法來製造時,亦能夠保持足夠的初始發光面積比率之有機電致發光元件。[Technical means to solve the problem] Therefore, an object of one aspect of the present invention is to provide an organic electroluminescence element capable of maintaining a sufficient initial light-emitting area ratio even when manufactured by a method including a step of forming a desiccant layer in an atmospheric atmosphere.

本發明的一方案係有關一種有機電致發光元件,其具備:元件基板;發光部,其設置在元件基板上;密封基板,其具有與元件基板對置之主表面;複合層,其包含設置在前述主表面上之乾燥劑層及撥水層;及,密封劑,其介於元件基板與密封基板之間,藉此將元件基板和密封基板進行黏接。發光部具有對置配置之一對電極及在該等之間設置的有機層。形成由元件基板、密封基板及密封劑包圍之氣密空間。在該氣密空間內配置有發光部及複合層。An aspect of the present invention relates to an organic electroluminescence device including: an element substrate; a light-emitting portion provided on the element substrate; a sealing substrate having a main surface opposed to the element substrate; and a composite layer including the arrangement A desiccant layer and a water-repellent layer on the aforementioned main surface; and, a sealant interposed between the element substrate and the sealing substrate, thereby bonding the element substrate and the sealing substrate. The light-emitting part has a pair of electrodes arranged oppositely and an organic layer provided between these. An airtight space surrounded by the element substrate, the sealing substrate and the sealant is formed. The light emitting section and the composite layer are arranged in the airtight space.

本發明的另一方案係有關一種製造有機電致發光元件之方法。該方法具備:在密封基板的主表面上形成包含乾燥劑層及撥水層之複合層之步驟;在元件基板上形成發光部之步驟;及,以前述主表面與元件基板對置之方向,將密封基板黏接於前述元件基板上之步驟。密封基板藉由介於元件基板與密封基板之間之密封劑而被黏接於元件基板上。形成由元件基板、密封基板及密封劑包圍之氣密空間。在該氣密空間內配置發光部及複合層。Another aspect of the present invention relates to a method of manufacturing an organic electroluminescent element. The method includes: a step of forming a composite layer including a desiccant layer and a water repellent layer on the main surface of the sealing substrate; a step of forming a light-emitting portion on the element substrate; and, in a direction where the main surface and the element substrate face each other, The step of bonding the sealing substrate to the aforementioned element substrate. The sealing substrate is adhered to the element substrate by the sealant interposed between the element substrate and the sealing substrate. An airtight space surrounded by the element substrate, the sealing substrate and the sealant is formed. The light emitting section and the composite layer are arranged in the airtight space.

[發明的效果] 藉由在密封基板的主表面上設置乾燥劑層及撥水層,即使在大氣氣氛下形成乾燥劑層時,有機電致發光元件亦容易維持足夠的初始發光面積比率。撥水層抑制大氣氣氛中的水分吸附到密封基板上。又,認為撥水層還抑制已吸附到密封基板上之水分影響發光部。[Effect of invention] By providing a desiccant layer and a water-repellent layer on the main surface of the sealing substrate, even when the desiccant layer is formed in the atmosphere, the organic electroluminescent element can easily maintain a sufficient initial light-emitting area ratio. The water-repellent layer suppresses the adsorption of moisture in the atmospheric atmosphere onto the sealing substrate. In addition, it is considered that the water repellent layer also suppresses the moisture absorbed on the sealing substrate from affecting the light-emitting portion.

以下,對本發明的若干個實施形態進行詳細說明。但是,本發明並不限定於以下實施形態。Hereinafter, several embodiments of the present invention will be described in detail. However, the present invention is not limited to the following embodiments.

圖1係表示有機電致發光元件的一實施形態之剖面圖。圖1中所示之有機電致發光元件20,具備:元件基板1、設置在元件基板1上之發光部7、密封基板3、包含乾燥劑層10及撥水層11之複合層15、及密封劑5。FIG. 1 is a cross-sectional view showing an embodiment of an organic electroluminescence device. The organic electroluminescence element 20 shown in FIG. 1 includes an element substrate 1, a light-emitting portion 7 provided on the element substrate 1, a sealing substrate 3, a composite layer 15 including a desiccant layer 10 and a water-repellent layer 11, and Sealant 5.

密封基板3具有:頂板部3A,其具有與元件基板1對置之矩形或正方形的平坦的主表面3S;及,側壁部3B,其從頂板部3A的外周端部沿與主表面3S垂直之方向延伸。頂板部3A及側壁部3B,形成將主表面3S作為底表面而具有之凹部。複合層15形成於密封基板3的主表面3S上。The sealing substrate 3 has: a top plate portion 3A having a rectangular or square flat main surface 3S opposed to the element substrate 1; and a side wall portion 3B extending from the outer peripheral end of the top plate portion 3A perpendicular to the main surface 3S Direction extends. The top plate portion 3A and the side wall portion 3B form a concave portion having the main surface 3S as a bottom surface. The composite layer 15 is formed on the main surface 3S of the sealing substrate 3.

密封劑5,介於密封基板3的側壁部3B與元件基板1之間,並將密封基板3和元件基板1進行黏接。藉此,形成有由元件基板1、密封基板3及密封劑5包圍之氣密空間30。在該氣密空間30內配置發光部7及複合層15。密封基板3可以係不具有側壁部3B之平坦的板狀體,在該情形下,通常,密封劑5介於密封基板3的頂板部3A與元件基板1之間。在任何情形下,“與元件基板對置之主表面”係指在配置有發光部之氣密空間內與元件基板對置之表面。撥水層11設置成與主表面3S接觸。在撥水層11的與主表面3S相反的一側的面上設置有乾燥劑層10。The sealant 5 is interposed between the side wall portion 3B of the sealing substrate 3 and the element substrate 1, and bonds the sealing substrate 3 and the element substrate 1. Thereby, an airtight space 30 surrounded by the element substrate 1, the sealing substrate 3, and the sealant 5 is formed. The light emitting section 7 and the composite layer 15 are arranged in the airtight space 30. The sealing substrate 3 may be a flat plate-shaped body having no side wall portion 3B. In this case, generally, the sealant 5 is interposed between the top plate portion 3A of the sealing substrate 3 and the element substrate 1. In any case, the "main surface opposed to the element substrate" refers to the surface opposed to the element substrate in the airtight space where the light-emitting portion is arranged. The water repellent layer 11 is provided in contact with the main surface 3S. A desiccant layer 10 is provided on the surface of the water repellent layer 11 on the side opposite to the main surface 3S.

圖2係表示密封基板及複合層的一實施形態之俯視圖。圖3係沿圖2的II-II線之剖面圖。圖2的俯視圖示出從與密封基板3的主表面3S垂直之方向觀察密封基板3及複合層15之形態。在圖2及圖3的實施形態的情形下,複合層15覆蓋整個主表面3S。但是,複合層15也可以覆蓋主表面3S的一部分。例如,從與密封基板3的主表面3S垂直之方向觀察時,相對於主表面3S的面積,複合層15的面積比率可以係50%以上、60%以上、70%以上或75%以上。認為:若複合層15的面積比率增加,則在大氣氣氛下附著於密封基板3的主表面3S上之水分不容易影響發光部7。又,就確保密封基板與元件基板之間的穩定的黏接之觀點而言,複合層15的面積比率可以小於90%。2 is a plan view showing an embodiment of a sealing substrate and a composite layer. FIG. 3 is a cross-sectional view taken along line II-II of FIG. 2. The plan view of FIG. 2 shows the state in which the sealing substrate 3 and the composite layer 15 are viewed from a direction perpendicular to the main surface 3S of the sealing substrate 3. In the case of the embodiment of FIGS. 2 and 3, the composite layer 15 covers the entire main surface 3S. However, the composite layer 15 may cover a part of the main surface 3S. For example, when viewed from a direction perpendicular to the main surface 3S of the sealing substrate 3, the area ratio of the composite layer 15 may be 50% or more, 60% or more, 70% or more, or 75% or more with respect to the area of the main surface 3S. It is considered that if the area ratio of the composite layer 15 is increased, the moisture attached to the main surface 3S of the sealing substrate 3 in the atmospheric atmosphere is less likely to affect the light-emitting portion 7. In addition, from the viewpoint of ensuring stable adhesion between the sealing substrate and the element substrate, the area ratio of the composite layer 15 may be less than 90%.

乾燥劑層10包含沿一定方向延伸之複數個線狀部。線狀部可以沿矩形或正方形主表面3S的任一邊延伸。如圖2及圖3所示,相鄰之線狀部可以分開,亦可以局部或整體接觸。通常,由於各線狀部具有相對於主表面3S平緩地傾斜之表面,因此即使相鄰之線狀部接觸,亦能夠區分各線狀部。關於各線狀部的寬度,例如,可以係0.5mm以上且50mm以下、或1mm以上且10mm以下。在此,“線狀部的寬度”為線狀部的與長邊方向垂直之方向上的寬度。線狀部的厚度可以係50μm以上且200μm以下。乾燥劑層10的線狀部並不一定需要直線延伸,可以包括曲線狀部分。線狀部能以直線或曲線狀延伸,而不交叉。例如,線狀部可以彎曲,亦能以螺旋狀延伸。The desiccant layer 10 includes a plurality of linear portions extending in a certain direction. The linear portion may extend along either side of the rectangular or square main surface 3S. As shown in FIGS. 2 and 3, adjacent linear portions may be separated, or may be partially or wholly contacted. In general, since each linear portion has a surface that is gently inclined with respect to the main surface 3S, even if adjacent linear portions contact, the linear portions can be distinguished. The width of each linear portion may be, for example, 0.5 mm or more and 50 mm or less, or 1 mm or more and 10 mm or less. Here, the "width of the linear portion" is the width of the linear portion in the direction perpendicular to the longitudinal direction. The thickness of the linear portion may be 50 μm or more and 200 μm or less. The linear portion of the desiccant layer 10 does not necessarily need to extend straight, and may include a curved portion. The linear portion can extend in a straight line or a curve without crossing. For example, the linear portion can be curved, and can also extend in a spiral shape.

關於具有線狀部之乾燥劑層10,由於表面積大,因此相較於單一膜能夠發揮大的吸水能力。又,尤其,在主表面3S的面積大的情形下,相較於單一膜能夠輕易地形成之方面上,具有線狀部之乾燥劑層10係有利的。Since the desiccant layer 10 having a linear portion has a large surface area, it can exhibit a large water absorption capacity compared to a single film. In addition, in particular, in the case where the area of the main surface 3S is large, the desiccant layer 10 having a linear portion is advantageous compared to the point where a single film can be easily formed.

撥水層11為覆蓋整個主表面3S之單一膜。撥水層11的厚度並無特別限定,但是可以小於乾燥劑層10的厚度。關於撥水層11的厚度,例如,可以係0.1μm以上且10μm以下。The water repellent layer 11 is a single film covering the entire main surface 3S. The thickness of the water-repellent layer 11 is not particularly limited, but may be smaller than the thickness of the desiccant layer 10. The thickness of the water-repellent layer 11 may be, for example, 0.1 μm or more and 10 μm or less.

圖4亦係表示密封基板及複合層的一實施形態之剖面圖。在圖4的實施形態的情形下,乾燥劑層10包括與主表面接觸而設置之線狀部,撥水層11包括覆蓋主表面3S中的未被乾燥劑層10覆蓋的部分之部分。乾燥劑層10的一部分表面暴露而未被撥水層11覆蓋。FIG. 4 is also a cross-sectional view showing an embodiment of the sealing substrate and the composite layer. In the case of the embodiment of FIG. 4, the desiccant layer 10 includes a linear portion provided in contact with the main surface, and the water repellent layer 11 includes a portion covering the portion of the main surface 3S that is not covered by the desiccant layer 10. Part of the surface of the desiccant layer 10 is exposed without being covered by the water repellent layer 11.

圖5亦係表示密封基板及複合層的一實施形態之剖面圖。在圖4的實施形態的情形下,乾燥劑層10具有與圖3相同的構成。撥水層11,包括:覆蓋主表面3S中的未被乾燥劑層10覆蓋的部分之部分、及覆蓋乾燥劑層10之部分。換言之,撥水層11覆蓋主表面3S及乾燥劑層10。FIG. 5 is also a cross-sectional view showing an embodiment of the sealing substrate and the composite layer. In the case of the embodiment of FIG. 4, the desiccant layer 10 has the same structure as FIG. 3. The water-repellent layer 11 includes a portion covering the portion of the main surface 3S that is not covered by the desiccant layer 10 and a portion covering the desiccant layer 10. In other words, the water repellent layer 11 covers the main surface 3S and the desiccant layer 10.

複合層的形態並不限定於以上例示者。例如,如圖6中所示之變形例那樣,乾燥劑層10可以係單一膜。圖6的實施形態中,乾燥劑層10覆蓋與密封基板3的主表面接觸而設置之撥水層11的表面的中央部。The form of the composite layer is not limited to those exemplified above. For example, as in the modification shown in FIG. 6, the desiccant layer 10 may be a single film. In the embodiment of FIG. 6, the desiccant layer 10 covers the central portion of the surface of the water repellent layer 11 provided in contact with the main surface of the sealing substrate 3.

關於構成以上說明之實施形態之有機電致發光元件之各部的詳細內容,在以下進行說明。The details of each part constituting the organic electroluminescence element of the embodiment described above will be described below.

乾燥劑層10,例如含有:包含鹼土金屬的氧化物之氧化物粒子、及黏合劑樹脂。乾燥劑層10,例如能夠藉由包括將含有該等之乾燥劑組成物塗佈於密封基板的主表面3S或預先形成之撥水層11上之方法來形成。The desiccant layer 10 contains, for example, oxide particles containing an oxide of alkaline earth metal, and a binder resin. The desiccant layer 10 can be formed by, for example, a method including applying a desiccant composition containing the same to the main surface 3S of the sealing substrate or the water-repellent layer 11 formed in advance.

乾燥劑層10中的氧化物粒子包含能夠對氧化物粒子賦予吸水性能之鹼土金屬的氧化物。將氧化物粒子的質量作為基準,氧化物粒子通常包含80質量%以上或90質量%以上的鹼土金屬的氧化物。氧化物粒子能夠包含1種或成分不同的2種以上的鹼土金屬的氧化物。The oxide particles in the desiccant layer 10 include oxides of alkaline earth metals that can impart water absorption properties to the oxide particles. Taking the mass of the oxide particles as a reference, the oxide particles usually contain 80% by mass or more or 90% by mass or more of oxides of alkaline earth metals. The oxide particles can contain one type or two or more types of alkaline earth metal oxides having different compositions.

作為鹼土金屬的氧化物,例如可舉出氧化鎂(MgO)、氧化鈣(CaO)、氧化鍶(SrO)及氧化鋇(BaO)。鹼土金屬的氧化物可以係氧化鎂、氧化鈣或它們的組合。Examples of the oxides of alkaline earth metals include magnesium oxide (MgO), calcium oxide (CaO), strontium oxide (SrO), and barium oxide (BaO). The alkaline earth metal oxide may be magnesium oxide, calcium oxide, or a combination thereof.

將乾燥劑層的質量作為基準,乾燥劑層10中的氧化物粒子的含量可以係40~80質量%。若氧化物粒子的含量大,則吸水容量增加,因此即使在大氣氣氛下形成乾燥劑層10時,亦容易保持足夠的吸水能力。就相同的觀點而言,將乾燥劑層的質量作為基準,氧化物粒子的含量可以係50質量%以上、55質量%以上或60質量%以上。Using the mass of the desiccant layer as a reference, the content of oxide particles in the desiccant layer 10 may be 40 to 80% by mass. If the content of oxide particles is large, the water absorption capacity increases, so that even when the desiccant layer 10 is formed in an atmospheric atmosphere, it is easy to maintain sufficient water absorption capacity. From the same viewpoint, based on the mass of the desiccant layer, the content of the oxide particles may be 50% by mass or more, 55% by mass or more, or 60% by mass or more.

氧化物粒子的平均粒徑並無特別限制,但是例如可以係0.01~30μm。若氧化物粒子的平均粒徑為該範圍,則傾向於可獲得更加高的吸水性能。就相同的觀點而言,氧化物粒子的平均粒徑可以係0.1μm以上、0.5μm以上或1μm以上,可以係20μm以下、10μm以下或5μm以下。在本說明書中,氧化物粒子的平均粒徑係指藉由動態光散射式粒度分佈計測量出之體積分佈的中央值。該平均粒徑為利用使氧化物粒子分散於既定的分散介質中而製備之分散液測量出之值。The average particle diameter of the oxide particles is not particularly limited, but it may be, for example, 0.01 to 30 μm. If the average particle diameter of the oxide particles falls within this range, it tends to obtain higher water absorption performance. From the same viewpoint, the average particle diameter of the oxide particles may be 0.1 μm or more, 0.5 μm or more, or 1 μm or more, and may be 20 μm or less, 10 μm or less, or 5 μm or less. In this specification, the average particle size of oxide particles refers to the central value of the volume distribution measured by a dynamic light scattering particle size distribution meter. The average particle diameter is a value measured using a dispersion liquid prepared by dispersing oxide particles in a predetermined dispersion medium.

黏合劑樹脂例如可以包含聚矽氧樹脂。乾燥劑層中的黏合劑樹脂可以包含由聚合性化合物形成之交聯聚合物。聚合性化合物例如可以係具有(甲基)丙烯醯氧基之改質聚矽氧。若該改質聚矽氧聚合,則乾燥劑組成物硬化,其結果,形成包含作為聚矽氧樹脂之交聯聚合物之乾燥劑層。The binder resin may include polysiloxane resin, for example. The binder resin in the desiccant layer may contain a cross-linked polymer formed of a polymerizable compound. The polymerizable compound may be, for example, modified polysiloxane having (meth)acryloyloxy group. When the modified polysiloxane is polymerized, the desiccant composition hardens, and as a result, a desiccant layer containing a cross-linked polymer as polysiloxane resin is formed.

具有(甲基)丙烯醯氧基之改質聚矽氧,例如由下述式(I)表示。式(I)中,R3 及R4 分別獨立地表示2價的有機基,R5 及R6 分別獨立地表示氫原子或甲基,x表示1以上的整數。R3 及R4 可以係伸烷基。

Figure 02_image001
The modified polysiloxane with (meth)acryloyloxy group is represented by the following formula (I), for example. In formula (I), R 3 and R 4 each independently represent a divalent organic group, R 5 and R 6 each independently represent a hydrogen atom or a methyl group, and x represents an integer of 1 or more. R 3 and R 4 may be an alkylene group.
Figure 02_image001

乾燥劑組成物還可以含有能夠與具有(甲基)丙烯醯氧基之改質聚矽氧共聚之其他聚合性化合物。其他聚合性化合物可以係具有1個或2個以上的(甲基)丙烯醯基之(甲基)丙烯酸化合物。就黏度的穩定性提高效果的觀點而言,相對於改質聚矽氧及其他聚合性化合物的總量,改質聚矽氧的含量可以係80~100質量%或90~100質量%。The desiccant composition may further contain other polymerizable compounds that can be copolymerized with modified polysiloxane having a (meth)acryloyloxy group. The other polymerizable compound may be a (meth)acrylic compound having one or more (meth)acryloyl groups. From the viewpoint of the effect of improving the stability of viscosity, the content of modified polysiloxane may be 80 to 100% by mass or 90 to 100% by mass relative to the total amount of modified polysiloxane and other polymerizable compounds.

相對於乾燥劑組成物的總質量,乾燥劑組成物中的具有(甲基)丙烯醯氧基之改質聚矽氧及其他聚合性化合物的總量,可以係20~90質量%。若聚合性化合物的含量在該範圍內,則具有容易確保更加優異的塗佈性及吸水性能之傾向。就相同的觀點而言,相對於乾燥劑組成物的總質量,具有(甲基)丙烯醯氧基之改質聚矽氧及其他聚合性化合物的總量,可以係20質量%以上或50質量%以上,亦可以係90質量%以下或70質量%以下。Relative to the total mass of the desiccant composition, the total amount of modified polysiloxane and other polymerizable compounds having (meth)acryloyloxy groups in the desiccant composition may be 20 to 90% by mass. When the content of the polymerizable compound is within this range, there is a tendency that it is easier to ensure more excellent coatability and water absorption performance. From the same point of view, the total amount of modified polysiloxane and other polymerizable compounds having (meth)acryloyloxy groups can be 20% by mass or more or 50% by mass relative to the total mass of the desiccant composition % Or more, it may be 90% by mass or less or 70% by mass or less.

為了光硬化,乾燥劑組成物還可以含有光自由基聚合起始劑。作為光自由基聚合起始劑,例如,可舉出1-羥基-環己基-苯基-酮、2-苄基-2-二甲基胺基-1-(4-嗎啉代苯基)-1-丁酮、2,2-二甲氧基-1,2-二苯乙烷-1-酮、2-甲基-1[4-(甲基硫基)苯基]-2-嗎啉代丙烷-1-酮及1-[4-(2-羥乙氧基)-苯基]-2-羥基-2-甲基-1-丙烷-1-酮。在乾燥劑組成物包含光自由基聚合起始劑之情形下,相對於乾燥劑組成物中的聚合性化合物的質量,其含量例如可以係0.01~10質量%。For photo hardening, the desiccant composition may further contain a photo radical polymerization initiator. Examples of the photo-radical polymerization initiator include 1-hydroxy-cyclohexyl-phenyl-one and 2-benzyl-2-dimethylamino-1-(4-morpholinophenyl) -1-Butanone, 2,2-dimethoxy-1,2-diphenylethane-1-one, 2-methyl-1[4-(methylthio)phenyl]-2-? Porphyrin-1-one and 1-[4-(2-hydroxyethoxy)-phenyl]-2-hydroxy-2-methyl-1-propane-1-one. When the desiccant composition contains an optical radical polymerization initiator, the content of the polymerizable compound in the desiccant composition may be, for example, 0.01 to 10% by mass.

依需要,乾燥劑層及用於形成其之乾燥劑組成物還可以含有其他成分。例如,為了調節黏度或提高氧化物粒子的分散性等目的,乾燥劑層及乾燥劑組成物可以含有不具有聚合性基之聚矽氧化合物。The desiccant layer and the desiccant composition used to form it may contain other components as needed. For example, the desiccant layer and the desiccant composition may contain a polysiloxane compound having no polymerizable group for the purpose of adjusting viscosity or improving the dispersibility of oxide particles.

乾燥劑組成物能夠在25℃下為糊狀。乾燥劑組成物在25℃條件下的黏度可以係5~500Pa•s。若乾燥劑組成物在25℃條件下的黏度在該範圍內,則藉由塗佈能夠更輕易地形成乾燥劑層。此處的黏度為藉由B型黏度計、流變計等旋轉黏度計測量出之值。The desiccant composition can be paste-like at 25°C. The viscosity of the desiccant composition at 25°C can be 5 to 500 Pa•s. If the viscosity of the desiccant composition at 25°C is within this range, the desiccant layer can be formed more easily by coating. The viscosity here is the value measured by a rotating viscometer such as a B-type viscometer and a rheometer.

撥水層11可以係包含各種撥水性材料之層。作為撥水性材料的例子,可舉出氟樹脂等有機氟化合物及聚二甲基矽氧烷等聚矽氧。有機氟化合物可以係具有全氟烷基之化合物。例如,可以使用AGC Inc.的CYTOP(商品名稱,氟樹脂)、AGC SEIMI CHEMICAL CO., LTD製造的SFCOAT(商品名稱)等市售的塗佈劑來形成撥水層11。The water-repellent layer 11 may be a layer containing various water-repellent materials. Examples of the water-repellent material include organic fluorine compounds such as fluororesins and polysiloxanes such as polydimethylsiloxane. The organic fluorine compound may be a compound having a perfluoroalkyl group. For example, a commercially available coating agent such as CYTOP (trade name, fluororesin) of AGC Inc., SFCOAT (trade name) manufactured by AGC SEIMI CHEMICAL CO., LTD can be used to form the water-repellent layer 11.

構成有機電致發光元件20之元件基板1並無特別限定,但是典型地為具有絕緣性及透光性且具有矩形主表面之玻璃基板。藉由透明導電材料(例如,ITO(Indium Tin Oxide:氧化銦錫)),在元件基板1上形成有電極51。電極51例如藉由如下方法形成,該方法包含:藉由真空沉積法、濺射法等PVD(物理氣相沉積:Physical Vapor Deposition)法在元件基板1上形成ITO膜之步驟;及,藉由利用光刻法之蝕刻將ITO膜形成為既定的圖案形狀之步驟。電極51可以被引出至氣密空間30的外側,藉此電極51可以與驅動電路連接。The element substrate 1 constituting the organic electroluminescence element 20 is not particularly limited, but it is typically a glass substrate having insulating and translucent properties and a rectangular main surface. The electrode 51 is formed on the element substrate 1 by a transparent conductive material (for example, ITO (Indium Tin Oxide)). The electrode 51 is formed by, for example, a method including: a step of forming an ITO film on the element substrate 1 by a PVD (Physical Vapor Deposition) method such as vacuum deposition method or sputtering method; and, by The step of forming the ITO film into a predetermined pattern shape by etching using photolithography. The electrode 51 can be drawn out to the outside of the airtight space 30, whereby the electrode 51 can be connected to the driving circuit.

發光部7,具有:對置配置之一對電極51、52;及,在電極51及電極52之間設置的有機層40。電極51可以係陽極,且電極52可以係陰極。有機層40具有電洞注入層41、電洞傳輸層42、發光層43及電子傳輸層44,且從電極51側依次積層有該等。The light-emitting section 7 includes: a pair of electrodes 51 and 52 disposed opposite to each other; and an organic layer 40 provided between the electrode 51 and the electrode 52. The electrode 51 may be an anode, and the electrode 52 may be a cathode. The organic layer 40 has a hole injection layer 41, a hole transport layer 42, a light-emitting layer 43, and an electron transport layer 44, and these are sequentially stacked from the electrode 51 side.

電洞注入層41例如由數10nm的膜厚的銅酞青(CuPc)形成。電洞傳輸層42例如由數10nm的膜厚的雙[N-(1-萘基)-N-苯基]聯苯胺(bis[N-(1-naphthyl)-N-phenyl]benzidine)(α-NPD)形成。發光層43例如由數10nm的膜厚的三(8-羥基喹啉)鋁(Alq3)形成。電子傳輸層44例如由數nm的膜厚的氟化鋰(LiF)形成。The hole injection layer 41 is formed of, for example, copper phthalocyanine (CuPc) with a film thickness of several 10 nm. The hole transport layer 42 is made of, for example, bis[N-(1-naphthyl)-N-phenyl]benzidine (bis[N-(1-naphthyl)-N-phenyl]benzidine) (α -NPD) formed. The light-emitting layer 43 is formed of, for example, tris(8-hydroxyquinoline) aluminum (Alq3) with a film thickness of several 10 nm. The electron transport layer 44 is formed of, for example, lithium fluoride (LiF) with a thickness of several nm.

在有機層40的上表面上積層有電極52。電極52可以係藉由真空蒸鍍法等PVD法形成之金屬薄膜。作為金屬薄膜的材料,例如可舉出Al、Li、Mg、In等功函數小的金屬單質及Al-Li、Mg-Ag功函數小的合金。電極52例如以數10nm~數100nm或50nm~200nm的膜厚形成。電極52可以被引出至元件基板2的端部,藉此電極52可以與驅動電路連接。An electrode 52 is stacked on the upper surface of the organic layer 40. The electrode 52 may be a metal thin film formed by a PVD method such as vacuum evaporation. Examples of the material of the metal thin film include metal elements with small work functions such as Al, Li, Mg, and In, and alloys with small work functions of Al-Li and Mg-Ag. The electrode 52 is formed with a film thickness of, for example, several 10 nm to several 100 nm or 50 nm to 200 nm. The electrode 52 can be drawn out to the end of the element substrate 2, whereby the electrode 52 can be connected to the driving circuit.

密封基板3可以係玻璃基板。大氣中的水分相對容易附著於玻璃基板的表面上。因此,在大氣氣氛下在作為密封基板3的玻璃基板上形成乾燥劑層10之情形下,如本實施形態那樣設置乾燥劑層10及撥水層11的利益大。The sealing substrate 3 may be a glass substrate. Moisture in the atmosphere is relatively easy to adhere to the surface of the glass substrate. Therefore, in the case where the desiccant layer 10 is formed on the glass substrate as the sealing substrate 3 in the atmosphere, it is of great interest to provide the desiccant layer 10 and the water-repellent layer 11 as in the present embodiment.

密封劑5能夠使用通常用於有機電致發光元件的密封之材料來形成。例如,能夠由紫外線硬化性樹脂形成密封劑5。The sealant 5 can be formed using materials commonly used for sealing organic electroluminescent elements. For example, the sealant 5 can be formed of ultraviolet curable resin.

有機電致發光元件20例如能夠藉由如下方法來製造,該方法包括:在密封基板3的主表面3S上形成包含乾燥劑層10及撥水層11之複合層15之步驟;在密封基板3的主表面3S上形成乾燥劑層10之步驟;在元件基板1上形成發光部7之步驟;及,以主表面3S與元件基板1對置之方向,將密封基板3黏接於元件基板1上之步驟。密封基板3藉由介於元件基板1與密封基板3之間之密封劑5黏接於元件基板1上。可形成由元件基板1、密封基板3及密封劑5包圍之氣密空間30。在氣密空間30內配置發光部7及複合層15。The organic electroluminescent element 20 can be manufactured by, for example, a method including: a step of forming a composite layer 15 including a desiccant layer 10 and a water-repellent layer 11 on the main surface 3S of the sealing substrate 3; The step of forming the desiccant layer 10 on the main surface 3S of the step; the step of forming the light-emitting portion 7 on the element substrate 1; and, in the direction in which the main surface 3S faces the element substrate 1, the sealing substrate 3 is adhered to the element substrate 1 The steps above. The sealing substrate 3 is adhered to the element substrate 1 by the sealant 5 interposed between the element substrate 1 and the sealing substrate 3. An airtight space 30 surrounded by the element substrate 1, the sealing substrate 3, and the sealant 5 can be formed. The light emitting section 7 and the composite layer 15 are arranged in the airtight space 30.

可以在大氣氣氛下在主表面3S上或撥水層11上形成乾燥劑層10。在本說明書中提及之“大氣氣氛”可以係藉由一般的空調設備控制溫度及濕度之環境。例如,大氣氣氛可以係15~30℃、相對濕度40~80%的氣氛。在該情形下,在大氣氣氛下將乾燥劑組成物塗佈於密封基板3的主表面3S上。然後,依需要,使乾燥劑組成物的塗膜在大氣氣氛下硬化。乾燥劑組成物例如能夠使用分注器來進行塗佈。The desiccant layer 10 may be formed on the main surface 3S or on the water repellent layer 11 in an atmospheric atmosphere. The "atmospheric atmosphere" mentioned in this specification can be an environment in which temperature and humidity are controlled by general air-conditioning equipment. For example, the atmospheric atmosphere may be an atmosphere of 15 to 30°C and a relative humidity of 40 to 80%. In this case, the desiccant composition is applied on the main surface 3S of the sealing substrate 3 in an atmospheric atmosphere. Then, if necessary, the coating film of the desiccant composition is hardened in an air atmosphere. The desiccant composition can be applied using a dispenser, for example.

可以在大氣氣氛下在主表面3S上或主表面3S及乾燥劑層10上形成撥水層11。在該情形下,在大氣氣氛下將包含撥水性材料之塗佈劑塗佈於密封基板3的主表面3S或主表面3S及乾燥劑層10上。然後,依需要,使塗佈劑的塗膜在大氣氣氛下進行乾燥或硬化。塗佈劑例如能夠使用分注器來進行塗佈。The water repellent layer 11 may be formed on the main surface 3S or on the main surface 3S and the desiccant layer 10 in an atmospheric atmosphere. In this case, the coating agent containing the water-repellent material is applied to the main surface 3S or the main surface 3S of the sealing substrate 3 and the desiccant layer 10 in an atmospheric atmosphere. Then, if necessary, the coating film of the coating agent is dried or hardened in an air atmosphere. The coating agent can be applied using a dispenser, for example.

圖2及圖3的實施形態之複合層15能夠藉由如下步驟來形成,該步驟包括:形成與主表面3S接觸之撥水層11;及,在撥水層11的與主表面3S相反的一側的面上形成乾燥劑層10。可以在大氣氣氛下進行該等的一部分或全部。The composite layer 15 of the embodiment of FIGS. 2 and 3 can be formed by the steps including: forming a water-repellent layer 11 in contact with the main surface 3S; and, in the water-repellent layer 11 opposite to the main surface 3S The desiccant layer 10 is formed on one side. Part or all of these can be performed in an atmospheric atmosphere.

圖3或圖4的實施形態之複合層15能夠藉由如下步驟來形成,該步驟包括:形成包括與主表面3S接觸的線狀部之乾燥劑層10;及,形成覆蓋主表面3S中的未被乾燥劑層10覆蓋之部分和依情形覆蓋乾燥劑層10之撥水層11。可以在大氣氣氛下進行該等的一部分或全部。The composite layer 15 of the embodiment of FIG. 3 or FIG. 4 can be formed by the steps including: forming a desiccant layer 10 including a linear portion in contact with the main surface 3S; and, forming a layer covering the main surface 3S The part not covered by the desiccant layer 10 and the water-repellent layer 11 covering the desiccant layer 10 according to circumstances. Part or all of these can be performed in an atmospheric atmosphere.

其他步驟能夠依據在有機電致發光元件之製造中通常採用之方法來進行。將密封基板黏接於元件基板上之步驟,通常在經除濕之乾燥氣氛下進行。The other steps can be performed according to a method generally used in the manufacture of organic electroluminescent elements. The step of adhering the sealing substrate to the element substrate is usually carried out under a dehumidified dry atmosphere.

依本發明的一方案,可提供一種即使在藉由包括在大氣氣氛下形成乾燥劑層的步驟之方法來製造時,亦能夠保持足夠的初始發光面積比率之有機電致發光元件。According to an aspect of the present invention, it is possible to provide an organic electroluminescent device capable of maintaining a sufficient initial light-emitting area ratio even when it is manufactured by a method including a step of forming a desiccant layer in an atmospheric atmosphere.

1:元件基板 3:密封基板 3A:密封基板的頂板部 3B:密封基板的側壁部 3S:密封基板的主表面 5:密封劑 7:發光部 10:乾燥劑層 11:撥水層 15:複合層 20:有機電致發光元件 30:氣密空間 40:有機層 51、52:電極 1: component substrate 3: sealed substrate 3A: Seal the top part of the substrate 3B: Seal the side wall of the substrate 3S: Seal the main surface of the substrate 5: Sealant 7: Light emitting part 10: Desiccant layer 11: Water-repellent layer 15: Composite layer 20: Organic electroluminescence element 30: Airtight space 40: Organic layer 51, 52: electrode

圖1係表示有機電致發光元件的一實施形態之剖面圖。 圖2係表示密封基板及複合層的一實施形態之俯視圖。 圖3係沿圖2的II-II線之剖面圖。 圖4係表示密封基板及複合層的一實施形態之剖面圖。 圖5係表示密封基板及複合層的一實施形態之剖面圖。 圖6係表示密封基板及複合層的一實施形態之俯視圖。FIG. 1 is a cross-sectional view showing an embodiment of an organic electroluminescence device. 2 is a plan view showing an embodiment of a sealing substrate and a composite layer. FIG. 3 is a cross-sectional view taken along line II-II of FIG. 2. 4 is a cross-sectional view showing an embodiment of a sealing substrate and a composite layer. 5 is a cross-sectional view showing an embodiment of a sealing substrate and a composite layer. 6 is a plan view showing an embodiment of a sealing substrate and a composite layer.

國內寄存資訊 (請依寄存機構、日期、號碼順序註記) 無Domestic storage information (please note in order of storage institution, date, number) no

國外寄存資訊 (請依寄存國家、機構、日期、號碼順序註記) 無Overseas hosting information (please note in order of hosting country, institution, date, number) no

1:元件基板 1: component substrate

3:密封基板 3: sealed substrate

3A:密封基板的頂板部 3A: Seal the top part of the substrate

3B:密封基板的側壁部 3B: Seal the side wall of the substrate

3S:密封基板的主表面 3S: Seal the main surface of the substrate

5:密封劑 5: Sealant

7:發光部 7: Light emitting part

10:乾燥劑層 10: Desiccant layer

11:撥水層 11: Water-repellent layer

15:複合層 15: Composite layer

20:有機電致發光元件 20: Organic electroluminescence element

30:氣密空間 30: Airtight space

40:有機層 40: Organic layer

51、52:電極 51, 52: electrode

Claims (11)

一種有機電致發光元件,其具備: 元件基板; 發光部,其設置在前述元件基板上,且具有對置配置之一對電極及在該等之間設置的有機層; 密封基板,其具有與前述元件基板對置之主表面; 複合層,其包含設置在前述主表面上之乾燥劑層及撥水層;及, 密封劑,其介於前述元件基板與前述密封基板之間,藉此將前述元件基板和前述密封基板進行黏接; 其中,形成由前述元件基板、前述密封基板及前述密封劑包圍之氣密空間,且在該氣密空間內配置有前述發光部及前述複合層。An organic electroluminescence element, which has: Component substrate A light-emitting portion, which is provided on the aforementioned element substrate, and has a pair of electrodes arranged oppositely and an organic layer provided between these; A sealing substrate having a main surface opposite to the aforementioned element substrate; A composite layer comprising a desiccant layer and a water repellent layer provided on the aforementioned main surface; and, A sealant interposed between the element substrate and the sealing substrate, thereby bonding the element substrate and the sealing substrate; Among them, an airtight space surrounded by the element substrate, the sealing substrate, and the sealant is formed, and the light emitting portion and the composite layer are arranged in the airtight space. 如請求項1所述之有機電致發光元件,其中,前述密封基板為玻璃基板。The organic electroluminescence device according to claim 1, wherein the sealing substrate is a glass substrate. 如請求項1或2所述之有機電致發光元件,其中,前述撥水層與前述主表面接觸而設置,在前述撥水層的與前述主表面相反的一側的面上設置有前述乾燥劑層。The organic electroluminescence element according to claim 1 or 2, wherein the water-repellent layer is provided in contact with the main surface, and the drying layer is provided on a surface of the water-repellent layer opposite to the main surface剂层。 Agent layer. 如請求項1或2所述之有機電致發光元件,其中,前述乾燥劑層包括與前述主表面接觸而設置之線狀部,前述撥水層包括覆蓋前述主表面中的未被前述乾燥劑層覆蓋的部分之部分。The organic electroluminescent element according to claim 1 or 2, wherein the desiccant layer includes a linear portion provided in contact with the main surface, and the water repellent layer includes a non-desiccant covering the main surface. Part of the part covered by the layer. 如請求項1至4中任一項所述之有機電致發光元件,其中,前述乾燥劑層含有包含鹼土金屬的氧化物之氧化物粒子及黏合劑樹脂, 將前述乾燥劑層的質量作為基準,前述氧化物粒子的含量為40~80質量%。The organic electroluminescence device according to any one of claims 1 to 4, wherein the desiccant layer contains oxide particles containing an oxide of alkaline earth metal and a binder resin, Taking the mass of the desiccant layer as a reference, the content of the oxide particles is 40 to 80% by mass. 一種用於製造有機電致發光元件之方法,該方法具備: 在密封基板的主表面上形成包含乾燥劑層及撥水層之複合層之步驟; 在元件基板上形成具有對置配置之一對電極及在該等之間設置的有機層之發光部之步驟;及, 以前述主表面與前述元件基板對置之方向,藉由介於前述元件基板與前述密封基板之間之密封劑,將前述密封基板黏接於前述元件基板上之步驟,在該步驟中,形成由前述元件基板、前述密封基板及前述密封劑包圍之氣密空間,在該氣密空間內配置前述發光部及前述複合層。A method for manufacturing an organic electroluminescent element, the method having: The step of forming a composite layer including a desiccant layer and a water-repellent layer on the main surface of the sealing substrate; A step of forming a light-emitting portion having a pair of electrodes arranged oppositely and an organic layer disposed between the element substrates; and, The step of adhering the sealing substrate to the element substrate with the sealant interposed between the element substrate and the sealing substrate in the direction in which the main surface faces the element substrate, in this step, forming An airtight space surrounded by the element substrate, the sealing substrate, and the sealant, and the light emitting portion and the composite layer are arranged in the airtight space. 如請求項6所述之方法,其中,在大氣氣氛下形成前述乾燥劑層。The method according to claim 6, wherein the desiccant layer is formed under an atmospheric atmosphere. 如請求項6或7所述之方法,其中,在大氣氣氛下形成前述撥水層。The method according to claim 6 or 7, wherein the water repellent layer is formed under an atmospheric atmosphere. 如請求項6至8中任一項所述之方法,其中,在前述密封基板的主表面上形成前述複合層之步驟,包括: 形成與前述主表面接觸之前述撥水層;及, 在前述撥水層的與前述主表面相反的一側的面上形成前述乾燥劑層。The method according to any one of claims 6 to 8, wherein the step of forming the composite layer on the main surface of the sealing substrate includes: Forming the water repellent layer in contact with the main surface; and, The desiccant layer is formed on the surface of the water-repellent layer opposite to the main surface. 如請求項6至8中任一項所述之方法,其中,在前述密封基板的主表面上形成前述複合層之步驟,包括: 形成包括與前述主表面接觸的線狀部之前述乾燥劑層;及, 形成包括覆蓋前述主表面中的未被前述乾燥劑層覆蓋的部分之部分之前述撥水層。The method according to any one of claims 6 to 8, wherein the step of forming the composite layer on the main surface of the sealing substrate includes: Forming the desiccant layer including the linear portion in contact with the main surface; and, The aforementioned water repellent layer including a portion covering the portion of the aforementioned main surface that is not covered by the aforementioned desiccant layer is formed. 如請求項6至10中任一項所述之方法,其中,前述乾燥劑層含有包含鹼土金屬的氧化物之氧化物粒子及黏合劑樹脂, 將前述乾燥劑層的質量作為基準,前述氧化物粒子的含量為40~80質量%。The method according to any one of claims 6 to 10, wherein the desiccant layer contains oxide particles containing an oxide of alkaline earth metal and a binder resin, Taking the mass of the desiccant layer as a reference, the content of the oxide particles is 40 to 80% by mass.
TW108126455A 2018-07-30 2019-07-26 Organic el element and method of producing same TW202013787A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018-142576 2018-07-30
JP2018142576A JP6855418B2 (en) 2018-07-30 2018-07-30 Organic EL device and its manufacturing method

Publications (1)

Publication Number Publication Date
TW202013787A true TW202013787A (en) 2020-04-01

Family

ID=69383884

Family Applications (1)

Application Number Title Priority Date Filing Date
TW108126455A TW202013787A (en) 2018-07-30 2019-07-26 Organic el element and method of producing same

Country Status (3)

Country Link
JP (1) JP6855418B2 (en)
CN (1) CN110783477A (en)
TW (1) TW202013787A (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2021170434A (en) * 2020-04-14 2021-10-28 双葉電子工業株式会社 Organic EL device
JP7391000B2 (en) * 2020-10-09 2023-12-04 双葉電子工業株式会社 Desiccant composition, sealing structure, organic EL device, and method for manufacturing an organic EL device
CN112490389A (en) * 2020-12-09 2021-03-12 中国乐凯集团有限公司 Organic light emitting diode packaging structure, packaging method and lighting device
CN112820839B (en) * 2021-01-07 2022-08-23 深圳市华星光电半导体显示技术有限公司 Display panel and preparation method thereof
CN114709320A (en) * 2022-03-30 2022-07-05 Tcl华星光电技术有限公司 Tiled display device

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19959957A1 (en) * 1999-12-13 2001-06-21 Sued Chemie Ag Platelet-shaped compacts
JP4090253B2 (en) * 2002-03-08 2008-05-28 三洋電機株式会社 Display device
JP2003317936A (en) * 2002-04-24 2003-11-07 Sanyo Electric Co Ltd Electroluminescence display device
JP4118099B2 (en) * 2002-07-22 2008-07-16 三洋電機株式会社 Electroluminescence display device
JP4050972B2 (en) * 2002-10-16 2008-02-20 株式会社 日立ディスプレイズ Display device
JP2004186048A (en) * 2002-12-04 2004-07-02 Sanyo Electric Co Ltd Display and desiccant
JP2013127932A (en) * 2011-12-19 2013-06-27 Tokai Rubber Ind Ltd Organic semiconductor element sealing body
JP6612130B2 (en) * 2013-12-27 2019-11-27 Jxtgエネルギー株式会社 Light emitting element
JP6649243B2 (en) * 2016-12-27 2020-02-19 双葉電子工業株式会社 Desiccant composition, sealing structure, and organic EL device

Also Published As

Publication number Publication date
JP2020021559A (en) 2020-02-06
CN110783477A (en) 2020-02-11
JP6855418B2 (en) 2021-04-07

Similar Documents

Publication Publication Date Title
TW202013787A (en) Organic el element and method of producing same
JP6649243B2 (en) Desiccant composition, sealing structure, and organic EL device
CN105085559B (en) Compound, drier, sealing structure and organic electroluminescent device
TWI762711B (en) Drying agent, sealing structure and organic el element
JP6216517B2 (en) Manufacturing method of organic light emitting device
TWI707933B (en) Organic el element and method of producing same
CN1535079A (en) Electroluminescent device
TWI671113B (en) Desiccant, sealing structure and organic electroluminescent element
JP7391000B2 (en) Desiccant composition, sealing structure, organic EL device, and method for manufacturing an organic EL device
JP7312153B2 (en) Desiccant composition, sealing structure, and organic EL element
TW202239871A (en) Desiccant composition, sealed structure, organic EL device, and method of producing organic EL device including a water-catching component and a binder
JP4506753B2 (en) Organic EL device and method for manufacturing the same
CN113522223A (en) Desiccant, sealing structure, and organic EL element
JP6603614B2 (en) Desiccant composition, sealing structure, and organic EL device
JP6654505B2 (en) Desiccant, sealing structure, and organic EL device
TWI680166B (en) Drying agent composition, sealing structure and organic el element
CN119730639A (en) Display panel and display device