SG10201802469PA - Substrate Cutting Control and Inspection - Google Patents

Substrate Cutting Control and Inspection

Info

Publication number
SG10201802469PA
SG10201802469PA SG10201802469PA SG10201802469PA SG10201802469PA SG 10201802469P A SG10201802469P A SG 10201802469PA SG 10201802469P A SG10201802469P A SG 10201802469PA SG 10201802469P A SG10201802469P A SG 10201802469PA SG 10201802469P A SG10201802469P A SG 10201802469PA
Authority
SG
Singapore
Prior art keywords
substrate
inspection
cutting control
stage
supported
Prior art date
Application number
SG10201802469PA
Inventor
Maykel Richard Van Der Stam Karel
Knippels Guido
Rifovich SUBKHANGULOV Ruslan
Original Assignee
Asm Tech Singapore Pte Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asm Tech Singapore Pte Ltd filed Critical Asm Tech Singapore Pte Ltd
Publication of SG10201802469PA publication Critical patent/SG10201802469PA/en

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03—Observing, e.g. monitoring, the workpiece
    • B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/362—Laser etching
    • B23K26/364—Laser etching for making a groove or trench, e.g. for scribing a break initiation groove
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B23K26/402—Removing material taking account of the properties of the material involved involving non-metallic material, e.g. isolators
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/22—Measuring arrangements characterised by the use of optical techniques for measuring depth
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • G01N21/9505—Wafer internal defects, e.g. microcracks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P54/00—Cutting or separating of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0428—Apparatus for mechanical treatment or grinding or cutting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/20—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by the properties tested or measured, e.g. structural or electrical properties
    • H10P74/203—Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/23—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by multiple measurements, corrections, marking or sorting processes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/27—Structural arrangements therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic materials other than metals or composite materials
    • B23K2103/56—Inorganic materials other than metals or composite materials being semiconducting

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Dicing (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Laser Beam Processing (AREA)
  • Manufacturing & Machinery (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Abstract

Substrate Cutting Control and Inspection A wafer substrate is inspected by illuminating it on both sides, and imaging light which has both been reflected from and transmitted through the substrate. The substrate is supported on a stage, and first and second illumination sources are arranged to respectively illuminate the first surface of the substrate supported by the stage and to illuminate the second surface of the substrate supported by the stage in use. At least one camera is adapted to image light received from the substrate when it is illuminated by the first illumination source and/or the second illumination source. Inspection may occur during a cutting process. (Figure 1A)
SG10201802469PA 2017-04-26 2018-03-26 Substrate Cutting Control and Inspection SG10201802469PA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US15/497,754 US20180311762A1 (en) 2017-04-26 2017-04-26 Substrate cutting control and inspection

Publications (1)

Publication Number Publication Date
SG10201802469PA true SG10201802469PA (en) 2018-11-29

Family

ID=62062788

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10201802469PA SG10201802469PA (en) 2017-04-26 2018-03-26 Substrate Cutting Control and Inspection

Country Status (9)

Country Link
US (1) US20180311762A1 (en)
EP (1) EP3396706A1 (en)
JP (1) JP2018185309A (en)
KR (1) KR20180120115A (en)
CN (1) CN108788487A (en)
HK (1) HK1256117A1 (en)
PH (1) PH12018000113A1 (en)
SG (1) SG10201802469PA (en)
TW (1) TWI686603B (en)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018098398A1 (en) * 2016-11-25 2018-05-31 Glowforge Inc. Preset optical components in a computer numerically controlled machine
US12420355B2 (en) 2016-11-25 2025-09-23 Glowforge Inc. Laser fabrication with beam detection
JP2019040919A (en) * 2017-08-22 2019-03-14 株式会社ディスコ Cutting apparatus and groove detection method
US10919111B2 (en) * 2018-12-05 2021-02-16 Robert Bosch Tool Corporation Laser engraver mirror adjustment system
KR102648920B1 (en) * 2018-12-07 2024-03-19 삼성디스플레이 주식회사 Laser polycrystallization apparatus and method of laser polycrystallization using the same
KR102021033B1 (en) * 2019-03-25 2019-09-11 (주)제이스텍 Cutting method of CF film or TFT film using aligned rotary cutters and cutting of display panels for CF film or TFT film cuttin
KR102273359B1 (en) * 2020-12-04 2021-07-06 (주)네온테크 Dicing Device Capable, Manufacturing Method Thereof And Inspecting Method of Step Cut Electronic Chips
ES2921930A1 (en) * 2021-02-19 2022-09-02 Fund Tekniker MICRO-DRILLING MACHINE AND METHOD FOR MONITORING AND CONTROLLING SINGLE-PULSE LASER MICRO-DRILLING PROCESSES (Machine-translation by Google Translate, not legally binding)
JP2024034443A (en) * 2022-08-31 2024-03-13 キオクシア株式会社 Positioning method and semiconductor device manufacturing method
TW202505656A (en) * 2023-07-20 2025-02-01 亞亞科技股份有限公司 Detection equipment for defects after wafer dicing or arrangement
CN119688708A (en) * 2025-02-25 2025-03-25 苏州高视半导体技术有限公司 System, method and computer readable storage medium for detecting wafer cracks

Family Cites Families (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08264488A (en) * 1995-03-22 1996-10-11 Nec Corp Wafer scribing apparatus and method
US6175645B1 (en) * 1998-01-22 2001-01-16 Applied Materials, Inc. Optical inspection method and apparatus
DE60019573T2 (en) * 1999-04-27 2006-03-23 Gsi Lumonics Inc., Kanata LASER CALIBRATION DEVICE AND METHOD
JP2001165632A (en) * 1999-12-03 2001-06-22 Sony Corp Inspection device and inspection method
JP2003098677A (en) * 2001-09-25 2003-04-04 Pentax Corp Exposure system
JP4049723B2 (en) * 2003-09-04 2008-02-20 沖電気工業株式会社 Nitride semiconductor device manufacturing method and nitride semiconductor device manufacturing apparatus
DE102004029212B4 (en) * 2004-06-16 2006-07-13 Leica Microsystems Semiconductor Gmbh Apparatus and method for optical inspection and / or transmitted light inspection of microstructures in the IR
WO2007005636A2 (en) * 2005-06-30 2007-01-11 Controlled Semiconductor, Inc. Semiconductor failure analysis tool
US7494900B2 (en) * 2006-05-25 2009-02-24 Electro Scientific Industries, Inc. Back side wafer dicing
JP2008109015A (en) * 2006-10-27 2008-05-08 Disco Abrasive Syst Ltd Wafer dividing method and dividing apparatus
US20080220590A1 (en) * 2007-03-06 2008-09-11 Texas Instruments Incorporated Thin wafer dicing using UV laser
JP2009266636A (en) * 2008-04-25 2009-11-12 Imac Co Ltd Lighting system
TWM350825U (en) * 2008-06-06 2009-02-11 Universal Optoelectronics Co Ltd Cutting, measurement, and classification integration mechanism of light emitting element
US7972552B1 (en) * 2008-11-12 2011-07-05 Hrl Laboratories, Llc Method to locate and eliminate manufacturing defects in a quartz resonator gyro
KR101024932B1 (en) * 2008-12-29 2011-03-31 주식회사 포스코 Fault detection device
US20110132885A1 (en) 2009-12-07 2011-06-09 J.P. Sercel Associates, Inc. Laser machining and scribing systems and methods
WO2012115013A1 (en) 2011-02-25 2012-08-30 株式会社ニコン Inspecting apparatus and method for manufacturing semiconductor device
JP5789802B2 (en) * 2011-03-22 2015-10-07 株式会社ソシオネクスト Manufacturing method of semiconductor chip
CN202079354U (en) * 2011-05-04 2011-12-21 苏州天弘激光股份有限公司 Laser cutting machine with CCD (Charge Coupled Device) automatic focusing system
US20130050468A1 (en) * 2011-08-22 2013-02-28 Camtek Ltd. Inspection system and a method for inspecting multiple wafers
FR2981161B1 (en) * 2011-10-10 2014-06-13 Altatech Semiconductor BLACK FIELD SEMICONDUCTOR PLATELET INSPECTION DEVICE
US9266192B2 (en) 2012-05-29 2016-02-23 Electro Scientific Industries, Inc. Method and apparatus for processing workpieces
WO2014050609A1 (en) * 2012-09-28 2014-04-03 Ｊｘ日鉱日石エネルギー株式会社 Device for inspecting substrate having irregular rough surface and inspection method using same
JP2014154708A (en) * 2013-02-08 2014-08-25 Disco Abrasive Syst Ltd Method and device for detecting crack of wafer
JP6236348B2 (en) * 2014-04-17 2017-11-22 株式会社ディスコ Processing method
CN105643096B (en) * 2016-03-28 2017-07-21 大族激光科技产业集团股份有限公司 Target localization method, device and Laser Processing board based on Laser Processing board

Also Published As

Publication number Publication date
CN108788487A (en) 2018-11-13
KR20180120115A (en) 2018-11-05
PH12018000113A1 (en) 2019-05-15
US20180311762A1 (en) 2018-11-01
TW201839386A (en) 2018-11-01
JP2018185309A (en) 2018-11-22
EP3396706A1 (en) 2018-10-31
HK1256117A1 (en) 2019-09-13
TWI686603B (en) 2020-03-01

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