SG10201510099RA - Coating method, computer storage medium and coating apparatus - Google Patents
Coating method, computer storage medium and coating apparatusInfo
- Publication number
- SG10201510099RA SG10201510099RA SG10201510099RA SG10201510099RA SG10201510099RA SG 10201510099R A SG10201510099R A SG 10201510099RA SG 10201510099R A SG10201510099R A SG 10201510099RA SG 10201510099R A SG10201510099R A SG 10201510099RA SG 10201510099R A SG10201510099R A SG 10201510099RA
- Authority
- SG
- Singapore
- Prior art keywords
- storage medium
- computer storage
- coating
- coating method
- coating apparatus
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B15/00—Systems controlled by a computer
- G05B15/02—Systems controlled by a computer electric
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D1/00—Processes for applying liquids or other fluent materials
- B05D1/002—Processes for applying liquids or other fluent materials the substrate being rotated
- B05D1/005—Spin coating
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/16—Coating processes; Apparatus therefor
- G03F7/162—Coating on a rotating support, e.g. using a whirler or a spinner
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/04—Apparatus for manufacture or treatment
- H10P72/0448—Apparatus for applying a liquid, a resin, an ink or the like
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
- B05D3/04—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to gases
- B05D3/0406—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to gases the gas being air
- B05D3/042—Directing or stopping the fluid to be coated with air
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
- B05D3/04—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to gases
- B05D3/0466—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to gases the gas being a non-reacting gas
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
- B05D3/10—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by other chemical means
- B05D3/104—Pretreatment of other substrates
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Automation & Control Theory (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Coating Apparatus (AREA)
- Materials For Photolithography (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014250571A JP5886935B1 (en) | 2014-12-11 | 2014-12-11 | Coating processing method, computer storage medium, and coating processing apparatus |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SG10201510099RA true SG10201510099RA (en) | 2016-07-28 |
Family
ID=55523973
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG10201510099RA SG10201510099RA (en) | 2014-12-11 | 2015-12-09 | Coating method, computer storage medium and coating apparatus |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US10048664B2 (en) |
| JP (1) | JP5886935B1 (en) |
| KR (1) | KR102355809B1 (en) |
| CN (1) | CN105702604B (en) |
| SG (1) | SG10201510099RA (en) |
| TW (1) | TWI603377B (en) |
Families Citing this family (29)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5096849B2 (en) * | 2007-09-13 | 2012-12-12 | 株式会社Sokudo | Substrate processing apparatus and substrate processing method |
| JP6212066B2 (en) * | 2015-03-03 | 2017-10-11 | 東京エレクトロン株式会社 | Coating processing method, computer storage medium, and coating processing apparatus |
| JP6316768B2 (en) * | 2015-03-26 | 2018-04-25 | 東京エレクトロン株式会社 | Adhesion layer forming method, adhesion layer forming system, and storage medium |
| JP6475123B2 (en) * | 2015-09-01 | 2019-02-27 | 株式会社Screenホールディングス | Substrate processing apparatus and substrate processing method |
| WO2017195549A1 (en) * | 2016-05-13 | 2017-11-16 | 東京エレクトロン株式会社 | Coating film forming device, coating film forming method, and storage medium |
| JPWO2017221683A1 (en) * | 2016-06-24 | 2019-04-04 | 東京エレクトロン株式会社 | Substrate processing method, readable computer storage medium, and substrate processing system |
| KR101909188B1 (en) | 2016-06-24 | 2018-10-18 | 세메스 주식회사 | Apparatus and method for treating substrate |
| CN106076759A (en) * | 2016-07-25 | 2016-11-09 | 铜陵海源超微粉体有限公司 | Powder coating device |
| KR101927696B1 (en) * | 2016-08-31 | 2019-02-27 | 세메스 주식회사 | Apparatus and method for treating substrate |
| US11065639B2 (en) * | 2016-12-22 | 2021-07-20 | Tokyo Electron Limited | Coating treatment method, computer storage medium and coating treatment apparatus |
| JP6899265B2 (en) | 2017-06-27 | 2021-07-07 | 東京エレクトロン株式会社 | Coating treatment method, coating treatment equipment and storage medium |
| KR102204885B1 (en) * | 2017-09-14 | 2021-01-19 | 세메스 주식회사 | Apparatus for treating substrate |
| JP7117366B2 (en) * | 2018-02-16 | 2022-08-12 | 東京エレクトロン株式会社 | Substrate processing equipment |
| KR102772974B1 (en) * | 2018-08-23 | 2025-02-27 | 도쿄엘렉트론가부시키가이샤 | Substrate processing method and substrate processing system |
| TWI884963B (en) * | 2019-07-04 | 2025-06-01 | 日商東京威力科創股份有限公司 | Coating method and coating device |
| US11163235B2 (en) * | 2019-08-22 | 2021-11-02 | Taiwan Semiconductor Manufacturing Company Ltd. | Apparatus for forming a photoresist layer, method for forming a masking layer, and method for forming a photoresist layer |
| JP2021077702A (en) * | 2019-11-06 | 2021-05-20 | 東京エレクトロン株式会社 | Substrate processing method and substrate processing apparatus |
| JP7356896B2 (en) * | 2019-12-24 | 2023-10-05 | 東京エレクトロン株式会社 | Liquid processing device, liquid processing method, and computer-readable recording medium |
| CN113050377A (en) * | 2019-12-26 | 2021-06-29 | 沈阳芯源微电子设备股份有限公司 | Method for coating photoresist |
| KR102677969B1 (en) * | 2020-12-30 | 2024-06-26 | 세메스 주식회사 | Nozzel standby port, apparatus for treating substrate including the same and method for treating substrate using the same |
| JP7628434B2 (en) | 2021-02-15 | 2025-02-10 | 株式会社Screenホールディングス | Substrate processing apparatus and method for processing cylindrical guard |
| JP7598821B2 (en) * | 2021-05-20 | 2024-12-12 | 株式会社Screenホールディングス | Coating treatment method and coating treatment apparatus |
| CN113471108B (en) * | 2021-07-06 | 2022-10-21 | 华海清科股份有限公司 | Vertical rotatory processing apparatus of wafer based on marangoni effect |
| CN114038769B (en) * | 2021-11-18 | 2025-11-07 | 苏州康沃斯智能装备有限公司 | Wafer source coating machine |
| US12288698B2 (en) | 2023-02-21 | 2025-04-29 | Tokyo Electron Limited | Methods for retaining a processing liquid on a surface of a semiconductor substrate |
| JP2025047908A (en) * | 2023-09-22 | 2025-04-03 | 株式会社Screenホールディングス | Substrate processing method and substrate processing device |
| JP2025047907A (en) * | 2023-09-22 | 2025-04-03 | 株式会社Screenホールディングス | Substrate processing method and substrate processing device |
| US12506019B2 (en) | 2024-03-11 | 2025-12-23 | Tokyo Electron Limited | Wafer chuck designs and methods for retaining a processing liquid on a surface of a semiconductor wafer |
| US20250308977A1 (en) * | 2024-03-28 | 2025-10-02 | Tokyo Electron Limited | Eccentricity based wafer shape control |
Family Cites Families (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3337150B2 (en) * | 1993-01-20 | 2002-10-21 | シャープ株式会社 | Spin type coating equipment |
| JPH0899057A (en) * | 1994-09-29 | 1996-04-16 | Dainippon Screen Mfg Co Ltd | Method for applying resist solution to substrate and apparatus for applying resist solution for substrate |
| JPH0985155A (en) * | 1995-09-28 | 1997-03-31 | Nippon Precision Circuits Kk | Spin coating apparatus and spin coating method |
| TW442336B (en) * | 1997-08-19 | 2001-06-23 | Tokyo Electron Ltd | Film forming method |
| JPH11207250A (en) * | 1998-01-23 | 1999-08-03 | Tokyo Electron Ltd | Film formation method |
| US6332723B1 (en) * | 1999-07-28 | 2001-12-25 | Tokyo Electron Limited | Substrate processing apparatus and method |
| JP2001307991A (en) * | 2000-04-25 | 2001-11-02 | Tokyo Electron Ltd | Film formation method |
| JP4353626B2 (en) * | 2000-11-21 | 2009-10-28 | 東京エレクトロン株式会社 | Coating method and coating apparatus |
| JP2003136010A (en) | 2001-11-01 | 2003-05-13 | Tokyo Electron Ltd | Coating apparatus and coating method |
| JP2003145016A (en) * | 2001-11-07 | 2003-05-20 | Tokyo Electron Ltd | Coating method and coating apparatus |
| US20040084144A1 (en) * | 2002-08-21 | 2004-05-06 | Dainippon Screen Mfg. Co., Ltd. | Substrate processing apparatus and substrate processing method |
| DE102005011107A1 (en) * | 2005-03-10 | 2006-09-21 | Infineon Technologies Ag | Method and device for processing wafers on mounting supports |
| US7470638B2 (en) * | 2006-02-22 | 2008-12-30 | Micron Technology, Inc. | Systems and methods for manipulating liquid films on semiconductor substrates |
| JP4805758B2 (en) * | 2006-09-01 | 2011-11-02 | 東京エレクトロン株式会社 | Coating processing method, program, computer-readable recording medium, and coating processing apparatus |
| JP5090089B2 (en) * | 2006-10-19 | 2012-12-05 | 大日本スクリーン製造株式会社 | Substrate processing equipment |
| JP5091764B2 (en) * | 2008-05-20 | 2012-12-05 | 東京エレクトロン株式会社 | Coating processing method, program, computer storage medium, and coating processing apparatus |
| JP2014050803A (en) * | 2012-09-07 | 2014-03-20 | Toshiba Corp | Rotary application equipment and rotary application method |
| JP5900370B2 (en) * | 2013-02-06 | 2016-04-06 | 東京エレクトロン株式会社 | Coating film forming method, coating film forming apparatus, and storage medium |
| JP6044428B2 (en) * | 2013-04-04 | 2016-12-14 | 東京エレクトロン株式会社 | Substrate processing method, substrate processing apparatus, and storage medium |
| JP6032189B2 (en) * | 2013-12-03 | 2016-11-24 | 東京エレクトロン株式会社 | Coating film forming apparatus, coating film forming method, and storage medium |
-
2014
- 2014-12-11 JP JP2014250571A patent/JP5886935B1/en active Active
-
2015
- 2015-12-09 SG SG10201510099RA patent/SG10201510099RA/en unknown
- 2015-12-09 KR KR1020150174905A patent/KR102355809B1/en active Active
- 2015-12-09 US US14/963,802 patent/US10048664B2/en active Active
- 2015-12-09 TW TW104141226A patent/TWI603377B/en active
- 2015-12-11 CN CN201510919166.8A patent/CN105702604B/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| JP5886935B1 (en) | 2016-03-16 |
| KR102355809B1 (en) | 2022-01-27 |
| US10048664B2 (en) | 2018-08-14 |
| CN105702604B (en) | 2019-11-05 |
| KR20160071330A (en) | 2016-06-21 |
| US20160167079A1 (en) | 2016-06-16 |
| TW201637076A (en) | 2016-10-16 |
| CN105702604A (en) | 2016-06-22 |
| JP2016115693A (en) | 2016-06-23 |
| TWI603377B (en) | 2017-10-21 |
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