KR20210158134A - Substrate structure and electronic device including the same - Google Patents

Abstract

a wiring board including an insulating layer and a wiring layer; and a heat dissipation member disposed on at least one side surface of the wiring board. It relates to a substrate structure and an electronic device including the same, wherein the heat dissipation member is disposed to extend to at least one of an upper surface and a lower surface of the wiring board.

Description

SUBSTRATE STRUCTURE AND ELECTRONIC DEVICE INCLUDING THE SAME

The present disclosure relates to a substrate structure and an electronic device including the same, for example, a substrate structure in which a heat dissipation member is disposed on a side using a dipping method, and an electronic device including the same.

With the expansion of 5G (5G) communication technology and the high integration and high performance of semiconductors, the importance of package substrate reliability is increasing. In particular, in order to stably drive an application processor (AP), a radio frequency integrated circuit (RFIC), and a power management semiconductor (PMIC) in the mobile sector, a package substrate with high heat dissipation, integration, and shielding characteristics is required. In semiconductors, which are essential for various IT devices, heat dissipation technology that discharges the heat of the chip to the outside is essential. Its importance is further emphasized because it is related not only to mechanical problems such as component lifespan and performance degradation, but also to safety problems due to the characteristics of portable devices that are kept close to the body. In addition, the operating frequency of mobile devices is increasing to a high frequency band, and the importance of electromagnetic interference (EMI) shielding technology is increasing in order to prevent malfunction and signal quality degradation due to noise.

One of several objects of the present disclosure is to provide a substrate structure excellent in heat dissipation performance by dissipating heat to the outside through a heat dissipation member provided on a side surface of a substrate, and an electronic device including the same.

One of several objects of the present disclosure is to diversify the direction of heat dissipation through a heat dissipation member disposed on the side surface of the substrate and extending to at least one of the upper and lower surfaces of the substrate, thereby providing a substrate structure having excellent heat dissipation performance and an electronic device including the same will provide

One of several objects of the present disclosure is to provide a substrate structure having an improved EMI (Electromagnetic Interference) shielding effect, and an electronic device including the same.

One of the various solutions proposed through the present disclosure is a substrate structure that is disposed on the side of the substrate to improve heat dissipation performance through a heat dissipation member coated with paste, and can shield EMI (Electromagnetic Interference) according to the composition of the paste; It is to implement an electronic device including this.

For example, a substrate structure according to an example proposed by the present disclosure may include a wiring board including an insulating layer and a wiring layer; and a heat dissipation member disposed on at least one side surface of the wiring board. Including, wherein the heat dissipation member is disposed to extend to at least one of the upper surface and the lower surface of the wiring board, the heat dissipation member may include a conductive powder and a thermosetting resin.

For example, the electronic device according to an example proposed in the present disclosure includes a wiring board including an insulating layer and a wiring layer, a heat dissipation member disposed on at least one side of the wiring board, an electronic component disposed on the upper surface of the wiring board, a substrate structure including a molding material disposed on an upper surface of the wiring board to cover at least a portion of the electronic component, and a metal layer disposed on at least one region of an outer surface of the molding material; and a main board connected to a lower surface of the wiring board. Including, wherein the heat dissipation member is disposed to extend to at least one of the upper surface and the lower surface of the wiring board, the heat dissipation member may include a conductive powder and a thermosetting resin.

As one effect of the various effects of the present disclosure, it is possible to provide a substrate structure having excellent heat dissipation performance and capable of dissipating heat in all directions, and an electronic device including the same.

As another effect of the present disclosure, it is possible to provide a substrate structure that is advantageous for process implementation and does not cause a warpage problem of the substrate and an electronic device including the same.

As another effect of the various effects of the present disclosure, it is possible to provide a substrate structure having an improved electromagnetic interference (EMI) shielding effect, and an electronic device including the same.

1 is a block diagram schematically showing an example of an electronic device system.
2 is a perspective view schematically illustrating an example of an electronic device.
3 is a cross-sectional view illustrating a substrate structure according to the present invention in which a heat dissipation member is disposed on a side surface of a wiring board.
4 is a partially enlarged cross-sectional view of FIG. 3A showing the internal configuration of the heat dissipation member.
5 is a cross-sectional view illustrating a substrate structure in which electronic components are mounted and molded on an upper surface of a wiring board on which a heat dissipation member is disposed.
6 is a cross-sectional view illustrating an electronic device in which a main board is coupled to a lower portion of the substrate structure of FIG. 5 .
7 is a cross-sectional view illustrating an electronic device in which the heat dissipation member of FIG. 6 and the main board are connected.
8 is a cross-sectional view showing the structure of a substrate structure in which electronic components are mounted on the upper surface of the wiring board and subjected to molding, and the heat dissipation member is extended to the side surface of the molding material and the upper surface of the metal layer.
9 is a cross-sectional view illustrating a structure of an electronic device in which a main board is coupled to a lower portion of the substrate structure of FIG. 8 .
10 is a cross-sectional view illustrating an electronic device in which the heat dissipation member of FIG. 9 and the main board are connected.
11A to 11D are cross-sectional views viewed from the top of a substrate structure in a state in which an electronic component is mounted after a heat dissipation member is applied to at least one side surface of the wiring board.
12 is a flowchart schematically illustrating a process of applying a material to the side of an object using a conventional dipping method.
13A to 13D are flowcharts schematically illustrating a process of applying a heat dissipation member to one side of a wiring board using a dipping method.

Hereinafter, the present disclosure will be described with reference to the accompanying drawings. The shapes and sizes of elements in the drawings may be exaggerated or reduced for clearer description.

1 is a block diagram schematically showing an example of an electronic device system.

Referring to the drawings, the electronic device 1000 accommodates the main board 1010 . A chip-related component 1020 , a network-related component 1030 , and other components 1040 are physically and/or electrically connected to the main board 1010 . These are also combined with other electronic components to be described later to form various signal lines 1090 .

The chip-related component 1020 includes a memory chip such as a volatile memory (eg, DRAM), a non-volatile memory (eg, ROM), and a flash memory; application processor chips such as a central processor (eg, CPU), a graphics processor (eg, GPU), a digital signal processor, an encryption processor, a microprocessor, and a microcontroller; Logic chips such as analog-to-digital converters and application-specific ICs (ASICs) are included. However, the present invention is not limited thereto, and other types of chip-related components may be included in addition to these chips. Also, these chip related parts may be combined with each other. The chip-related component 1020 may be in the form of a package including the above-described chip.

The network-related components 1030 include Wi-Fi (IEEE 802.11 family, etc.), WiMAX (IEEE 802.16 family, etc.), IEEE 802.20, long term evolution (LTE), Ev-DO, HSPA+, HSDPA+, HSUPA+, EDGE, GSM. , GPS, GPRS, CDMA, TDMA, DECT, Bluetooth, 3G, 4G, 5G and any other wireless and wired protocols designated thereafter, including, but not limited to, many other wireless or wired protocols. Any of the standards or protocols may be included. In addition, the network-related component 1030 may be combined with the chip-related component 1020 to be provided in the form of a package.

The other components 1040 include a high frequency inductor, a ferrite inductor, a power inductor, ferrite beads, low temperature co-firing ceramics (LTCC), an electro magnetic interference (EMI) filter, a multi-layer ceramic condenser (MLCC), and the like. . However, the present invention is not limited thereto, and in addition to this, a passive element in the form of a chip component used for various other purposes may be included. In addition, the other component 1040 may be provided in the form of a package in combination with the chip-related component 1020 and/or the network-related component 1030 .

Depending on the type of the electronic device 1000 , the electronic device 1000 may include other electronic components that may or may not be physically and/or electrically connected to the main board 1010 . Examples of other electronic components include a camera module 1050 , an antenna module 1060 , a display 1070 , and a battery 1080 . However, the present invention is not limited thereto, and an audio codec, a video codec, a power amplifier, a compass, an accelerometer, a gyroscope, a speaker, a mass storage device (eg, a hard disk drive), a compact disk (CD), a digital versatile disk (DVD), etc. may be In addition to this, it goes without saying that other electronic components used for various purposes may be included depending on the type of the electronic device 1000 .

The electronic device 1000 includes a smart phone, a personal digital assistant, a digital video camera, a digital still camera, a network system, and a computer ( computer), monitor, tablet, laptop, netbook, television, video game, smart watch, automotive, and the like. However, the present invention is not limited thereto, and may be any other electronic device that processes data in addition to these.

2 is a perspective view schematically illustrating an example of an electronic device.

Referring to the drawings, the electronic device may be, for example, a smartphone 1100 . A motherboard 1110 is accommodated inside the smartphone 1100 , and various electronic components 1120 are physically and/or electrically connected to the motherboard 1110 . In addition, a camera module 1130 and/or a speaker 1140 are accommodated therein. A part of the electronic component 1120 may be the aforementioned chip-related component, for example, the electronic component embedded board 1121, but is not limited thereto. The electronic component embedded board 1121 may have an electronic component embedded in the multilayer printed circuit board, but is not limited thereto. On the other hand, the electronic device is not necessarily limited to the smart phone 1100, and of course, it may be another electronic device as described above.

3 is a cross-sectional view illustrating a substrate structure according to the present invention in which a heat dissipation member is disposed on a side surface of a wiring board.

Referring to the drawings, the wiring board 10 includes an insulating material and a wiring layer 110 , and the insulating material may again be composed of a core insulating layer 11 and an insulating layer 100 , and vias connecting the wiring layers 100 . A reference numeral 120 may be disposed inside the wiring board 10 . FIG. 3 discloses a substrate structure 500 including the wiring board 10 and the heat dissipation member 200 . The number of stacked insulating layers 100 , wiring layers 110 , and vias 120 is merely illustrative, and any structure that can be used in a general substrate structure is applicable.

The via 120 may include a bar-via type via having high thermal conductivity, and as shown in FIG. 3 , the wiring layer 110 is electrically connected to the heat dissipation member 200 , The heat of the wiring board 10 may be directly discharged to the outside by conducting it to the side surface, the upper surface, and the lower surface to which the heat dissipation member 200 is applied. Accordingly, by improving the heat dissipation performance in the vertical direction compared to the structure of the substrate structure in which the heat dissipation member is disposed only on the side surface, it is possible to achieve the effect of improving the heat dissipation performance in the expanded direction.

The heat dissipation member 200 is disposed on at least one side of the wiring board 10 , and extends from the side to at least one of an upper surface or a lower surface of the wiring board 10 . The heat dissipation member 200 may be disposed on an outer surface or an edge portion of the wiring board 10 using a dipping method, which will be described later. According to the dipping method mainly used when applying the external electrode of MLCC (Multilayer Ceramic Capacitors), the heat dissipation member 200 is extended to the upper or lower surface of the wiring board 10 depending on the nature of the pasted material. , an increase in the heat dissipation effect can be expected due to the heat dissipation member disposed in a wider range.

The dipping method refers to a method in which the paste is applied to the outside of the substrate by the viscosity and surface tension of the paste through the process of dipping the carrier on which the substrate is mounted on a surface plate coated with paste of a certain thickness.

4 is a partially enlarged cross-sectional view of FIG. 3A showing the internal configuration of the heat dissipation member.

The heat dissipation member 200 may be composed of a cured conductive paste 230, and 0.1 to 5 μm of spherical copper (Cu) as a conductive powder (micro-particle, 220) in the paste, a thermosetting acrylic resin, a solvent, etc. may be included, and sometimes ceramic powder or the like may be included, and it is also possible to use aluminum (Al) particles to replace copper. In addition, in order to further improve the heat dissipation characteristics, it is possible to add graphene or a graphite composite. Due to the large surface area of the conductive powder 220 , the substrate structure of the present invention can rapidly exchange heat, and the electronic shielding and magnetic shielding properties can be changed according to a change in the constituent material of the conductive paste 230 .

Specifically, the composition of the conductive paste 230 may include the conductive powder 220 and the thermosetting resin 210 including a glass frit, a binder resin, polyamine amide (PAA), and a solvent. Conductive powder 220 in the present invention may be used to include at least one of Cu, Ag, Pd, Pt, Ni, Ag-Cu, Ag-Pd, but it can be used in addition to the above, and the type of conductive powder The scope of the present invention is not limited by As described above, since the heat dissipation member 200 includes high thermal conductivity powder (micro-particle), faster heat exchange is possible.

The glass frit of the thermosetting resin 210 is for providing bonding strength during sintering of the paste composition in the dipping method, and the material is not particularly limited. The binder resin is also added to increase the bonding force between the wiring board and the conductive paste 230 composition in the dipping method, and there is no need to specifically limit the material. Polyamine amide (PAA) in the thermosetting resin 210 is to form a three-dimensional dispersed structure having an amine group and an amide group at the same time, which is a group having an affinity for the conductive powder 220 has an amine group and an amide group at the same time It is not limited to one part of the polymer, and by distributing it in several places of the polymer, a link can be formed between the particles of the conductive powder 220 . Due to this three-dimensional dispersion structure, flowability and sedimentation are prevented in the paste state, and after the conductive paste 230 is dried, it acts as a link between the particles of the conductive powder 220 to improve the strength of the dried film. Polyamine amide (PAA) has excellent affinity with an acrylic or methacrylic resin used as a binder resin, so when used in the conductive paste 230 for a heat dissipation member, a very excellent effect is obtained in increasing strength. can

In addition, an EMI shielding effect is generated according to a change in the type and size of the metal in the conductive paste 230 to protect the side and lower surfaces of the substrate, and magnetic shielding is possible using a high-k material.

The conductive paste 230 including the thermosetting resin 210 and the conductive powder 220 may be disposed on at least one surface of the substrate structure 500 or the molding part 330 to be described later as the heat dissipation member 200 after curing treatment. Also, even after curing, the thermosetting resin 210 may remain between the conductive powders 220 as a binder to be included in the heat dissipation member 220 .

5 is a cross-sectional view illustrating a substrate structure in which electronic components are mounted and molded on an upper surface of a wiring board on which a heat dissipation member is disposed.

As shown in FIG. 5 , an electronic component 300 , for example, an integrated circuit (IC) chip, etc. may be mounted on the wiring board 10 on which the heat dissipation member 200 is disposed on at least one side surface. The substrate structure 600A according to the present invention is for the purpose of effectively dissipating heat generated from the electronic component 300 , and the wiring layer 110 and the via 120 connected to the electronic component 300 are formed of a high-conductivity conductive powder 220 . ) by disclosing a structure connected to the heat dissipating member 200 including the, rapid heat exchange can occur.

After the electronic component 300 is mounted, a molding material 310 covering at least a portion of the electronic component 300 through a molding process using an epoxy resin to protect the electronic component 300 . may be formed, and the metal layer 320 may be disposed on at least one of the outer surfaces of the molding material 310 .

The epoxy resin may be an insulating material used as an interlayer insulating material of a heat dissipation substrate when manufacturing a build-up multilayer circuit board for heat dissipation. To this end, it may be preferable to use the epoxy resin having excellent heat resistance, chemical resistance, and electrical properties. For example, the epoxy resin may include at least one heterocyclic epoxy resin of bisphenol A type epoxy resin, bisphenol F type epoxy resin, phenol novolak type epoxy resin, dicyclopentadiene type epoxy resin, and triglycidyl isocyanate. have. Alternatively, the epoxy resin may include a bromine-substituted epoxy resin.

After the molding material 310 is interposed, a metal layer 320 may be disposed on an exposed region of the outer surface of the molding material 310 . The molding part 330 is collectively referred to as the molding material 310 , the molding material 310 , and the metal layer 320 . Due to the metal layer 320 , an electromagnetic interference (EMI) shielding function with respect to the electronic component 300 may be improved, and the metal layer 320 may be disposed by sputtering or plating. Meanwhile, the heat dissipation member 200 disposed on the side of the wiring board 10 also contributes to EMI (Electromagnetic Interference) shielding, thereby limiting electromagnetic wave interference.

Since the electronic component 300 and the molding material 310 are disposed after the heat dissipation member 200 is extended to the upper or lower surface of the wiring board 10, the molding material 310 or the metal layer ( A partial region of the 320 may be disposed on the upper surface of the heat dissipation member 200 .

6 is a cross-sectional view illustrating an electronic device in which a main board is coupled to a lower portion of the substrate structure of FIG. 5, and FIG. 7 is a cross-sectional view illustrating an electronic device in which the heat dissipation member and the main board of FIG.

* As shown in FIG. 6 , the main board 400 is coupled to the lower portion of the substrate structure 600A in which the heat dissipation member 200 is disposed on the side surface of the wiring board 10 , and the wiring layer 110 of the wiring board 10 and It can be connected to configure the electronic device (600B). As described above, the configuration in which the substrate structure 600A is coupled to the main board 400 may be applied to the electronic device described with reference to FIGS. 1 and 2 .

The heat generated in the electronic component 300 can be effectively transferred not only through the wiring layer 110 and the via 120 , but also through the connection part 430 on the main board 300 and the heat dissipation via 420 inside the main board 400 . have. In addition, since heat is transferred through more passages to the main board 400 , internal heat saturation of the electronic device 600B may be prevented.

7 discloses a structure of an electronic device 600C in which the main board 400 and the heat dissipation member 200 of the substrate structure 600A are connected. The connection between the heat dissipation member 200 and the main board 400 is optional, but when connected, the heat dissipation characteristic of the heat dissipation member 200 may be further improved through the heat dissipation via 420 .

8 is a cross-sectional view illustrating a structure of a substrate structure in which electronic components are mounted on the upper surface of a wiring board and subjected to molding, and a heat dissipation member is extended to a side surface of a molding material and an upper surface of a metal layer.

Unlike the substrate structure 600A of FIG. 5 , in the substrate structure 700A of FIG. 8 , before the heat dissipation member 200 is disposed, the electronic component 300 is first installed on the wiring board 10 of the wiring board 10 . It is mounted on the upper surface and connected to the wiring board 10 , and then a molding material 310 is formed through a molding process, and a metal layer 320 may be disposed on a portion of the outer surface of the molding material 310 . Thereafter, the heat dissipation member 200 is disposed on the side surface of the molding part 330 , and a structure for forming the substrate structure 700A is disclosed. In addition, the heat dissipation member 200 may be disposed to extend to a side surface of the molding unit 310 or an upper surface of the metal layer 320 .

Through the structure of FIG. 8, the heat dissipation member 200 can be applied over a wider area, and the heat dissipation member 200 is extended not only on the side surface of the molding unit 330 but also on the upper surface of the molding unit 330, and the EMI (Electromagnetic Interference) The shielding effect can be further improved. Meanwhile, the metal layer 320 may be disposed on at least one region of the upper surface and the side surface of the molding material 310 through a sputtering or plating process to further improve the EMI shielding function.

In this case, the heat dissipation member 200 is disposed to extend in contact with at least one region of the metal layer 320 in the region where the metal layer 320 is disposed, thereby further improving the electromagnetic interference (EMI) shielding effect.

In addition, as shown in FIG. 8 , the heat dissipation member 200 may be disposed to extend along the side surface of the molding material 310 to cover a portion of the upper surface of the metal layer 320 and extend to the metal layer 320 .

In addition, according to a change in the material of the conductive paste 230 constituting the heat dissipation member 200 , the electronic shielding and magnetic shielding properties may be changed according to the purpose.

9 is a cross-sectional view illustrating a structure of an electronic device in which a main board is coupled to a lower portion of the substrate structure of FIG. 8, and FIG. 10 is a cross-sectional view illustrating an electronic device in which the heat dissipation member of FIG.

As shown in FIG. 9 , the main board 400 is coupled to the lower portion of the substrate structure 700A in which the heat dissipation member 200 is disposed on the side surface of the molding part 330 of the wiring board 10 , and the wiring layer of the wiring board 10 . The structure of the electronic device 700B connected to 110 may be disclosed. As a matter of course, the configuration in which the substrate structure 700A is coupled to the main board 400 may also be applied to the electronic devices described with reference to FIGS. 1 and 2 .

Accordingly, heat generated from the electronic component 300 is effectively transferred through the wiring layer 110 and the via 120 as well as the connection part 430 on the main board 400 and the heat dissipation via 420 inside the main board 400 . can be In addition, since heat is transferred to the main board 400 through more passages, internal heat saturation of the electronic device 700B can be prevented.

FIG. 10 discloses a structure of an electronic device 700C in which the main board 400 and the heat dissipation member 200 of the substrate structure 600A are connected. The connection between the heat dissipation member 200 and the main board 400 is optional, but when connected, the heat dissipation characteristics of the heat dissipation member 200 may be improved.

11A to 11D are cross-sectional views viewed from the top of the substrate structure in a state in which an electronic component is mounted after a heat dissipation member is applied to at least one side surface of the wiring board.

When viewing the cross-section of the upper surface before the molding process, the heat dissipation member 200 including the conductive powder 220 is disposed on at least one side surface of the wiring board 10 and the corresponding upper or lower surface. The inside of the heat dissipation member 200 may be composed of a compound of a material with high thermal conductivity, such as copper (Cu), aluminum (Al), graphene, graphite, and carbon nanotube, and heat dissipation An additional heat sink can be attached to the outside of the member. As such, since the heat dissipation member 200 includes a thermally conductive powder (micro-particle), faster heat exchange is possible. On the side where the heat dissipation member 200 is not disposed, an additional metal layer 320 may be disposed so as not to be connected to the internal wiring layer 110 to perform an EMI shielding function.

12 is a flowchart schematically illustrating a process of applying a material to the side of an object using a conventional dipping method.

As described above, the dipping method is a process of dipping a carrier on which a substrate is mounted on a surface plate coated with paste of a certain thickness, and then applying the paste to the outside of the substrate using the viscosity and surface tension of the paste. say the technique

13A to 13D are flowcharts schematically illustrating a process of applying a heat dissipation member to one side of a wiring board using a dipping method.

In consideration of the arrangement with the surrounding components and the direction of heat dissipation, the heat dissipation member 200 may be disposed on at least one side of the wiring board 10 corresponding thereto according to the design, and the heat dissipation member 200 may be disposed using a dipping method. Improvement of heat dissipation characteristics in the arrangement direction and improvement of electromagnetic interference shielding effect can be expected.

After the dipping process, a blotting process may be additionally performed to control and planarize the thickness distribution of the conductive paste 230 constituting the heat dissipation member 200 . Blotting refers to dipping the wiring board 10 or the substrate structure 700A on which the heat dissipation member 200 is formed by dipping on a surface plate containing a small amount of the conductive paste 230, and then dipping the wiring board or the substrate. It means removing the conductive paste 230 for forming a heat dissipation member that is adhered to the side. For example, the heat dissipation member 200 may be formed by blotting within a time of 3 seconds or more and 20 seconds or less, and the height of the conductive paste 230 for forming the heat dissipation member 200 contained in a surface plate is 30 It may be more than μm and less than or equal to 100 μm.

Through this, when the viscosity of the conductive paste 230 for forming the heat dissipation member is thin, the flatness is prevented from being deteriorated, and the flatness can be maintained even when an existing method is used due to the viscosity of the paste.

After the dipping and blotting process, the external heat dissipation member 200 may be completed through the curing process of the thermosetting resin 210, which is the wiring layer 110 and the via 120 through the internal heat dissipation wire. ) is connected to the inside of the back so that the direction of heat transfer takes place in the entire X, Y, and Z directions. In addition, due to the large surface area of the conductive powder 220, heat exchange can be performed quickly, and the electronic shielding and magnetic shielding properties can be changed according to the change of the constituent material of the conductive paste 230, and the external heat dissipation member 200 is air The heat may be transferred by contact with the , or the heat may be transferred by being soldered to the lower main board 400 . In addition, excellent reliability can be expected by suppressing liquid penetration in the subsequent process due to the heat dissipation member 200 .

In the present disclosure, expressions such as side, side, etc. are used to mean a direction or a plane in the direction toward the X or Y direction for convenience, and expressions such as upper side, upper side, upper surface, etc. are used for convenience in the Z direction or a plane in the direction It was used as meaning, and the lower side, lower side, lower surface, etc. were used to mean a direction facing the direction opposite to the Z direction for convenience, or a surface in that direction. In addition, to be positioned on the side, upper, upper, lower, or lower side means that the target component not only directly contacts the reference component in the corresponding direction, but also includes a case where the target component is positioned in the corresponding direction but does not directly contact was used as However, this is a definition of the direction for convenience of explanation, and the scope of the claims is not particularly limited by the description of this direction, and the concept of upper/lower, etc. may be changed at any time.

The meaning of being connected in the present disclosure is a concept including not only directly connected, but also indirectly connected through an adhesive layer or the like. In addition, the meaning of being electrically connected is a concept including both the case of being physically connected and the case of not being connected. In addition, expressions such as first, second, etc. are used to distinguish one component from another, and do not limit the order and/or importance of the corresponding components. In some cases, without departing from the scope of rights, the first component may be referred to as the second component, and similarly, the second component may be referred to as the first component.

The expression “an example” used in the present disclosure does not mean the same embodiment, and is provided to emphasize and explain different unique features. However, the examples presented above are not excluded from being implemented in combination with features of other examples. For example, even if a matter described in one specific example is not described in another example, it may be understood as a description related to another example unless a description contradicts or contradicts the matter in another example.

The terminology used in the present disclosure is used to describe an example only, and is not intended to limit the present disclosure. In this case, the singular expression includes the plural expression unless the context clearly indicates otherwise.

1000: electronic device
1110: motherboard
10: wiring board
11: Core insulating layer
100: insulating layer
110: wiring layer
120: via
200: heat dissipation member
210: thermosetting resin
220: conductive powder
230: conductive paste
300: electronic component
310: molding material
320: metal layer
330: molding unit
400: main board
410: circuit layer
420: heat dissipation via
430: connection
500, 600A, 700A: substrate structure
600B, 600C, 700B, 700C: Electronic devices

Claims (10)

a wiring board including an insulating layer and a wiring layer; and
a heat dissipation member disposed on at least one side surface of the wiring board; includes,
The heat dissipation member is disposed to extend to at least one of an upper surface and a lower surface of the wiring board.
According to claim 1,
an electronic component disposed on the upper surface of the wiring board;
a molding material disposed on the upper surface of the wiring board to cover at least a portion of the electronic component; and
a metal layer disposed on at least one region of an outer surface of the molding material; Further comprising, the substrate structure.
3. The method of claim 2,
The heat dissipation member is disposed to extend to at least one side surface of the molding material, the substrate structure.
3. The method of claim 2,
The heat dissipation member is arranged to extend to contact at least one region of the metal layer, the substrate structure.
3. The method of claim 2,
The heat dissipation member is disposed to extend to cover a portion of the upper surface of the metal layer.
According to claim 1,
At least a portion of the wiring layer is connected to the heat dissipation member, the substrate structure.
According to claim 1,
The heat dissipation member is a substrate structure comprising a conductive powder and a thermosetting resin.
A wiring board including an insulating layer and a wiring layer, a heat dissipation member disposed on at least one side of the wiring board, an electronic component disposed on an upper surface of the wiring board, and at least a portion of the electronic component disposed on the upper surface of the wiring board a substrate structure including a molding material covering the molding material and a metal layer disposed on at least one region of an outer surface of the molding material; and
a main board disposed on a lower surface of the wiring board and electrically connected to the wiring board;
including, wherein the heat dissipation member is disposed to extend to at least one of an upper surface and a lower surface of the wiring board.
9. The method of claim 8,
The heat dissipation member is arranged to extend to contact at least one region of the metal layer, the electronic device.
9. The method of claim 8,
The main board includes a heat dissipation via,
The electronic device, wherein the heat dissipation via and the heat dissipation member are electrically connected.

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