KR20150075493A - Adhesive tape for electronic components - Google Patents

Abstract

The present invention provides a pressure-sensitive adhesive tape for protecting a semiconductor package, which comprises a heat-resistant substrate and a pressure-sensitive adhesive layer coated with the pressure-sensitive adhesive composition on the heat-resistant substrate, wherein the pressure-sensitive adhesive composition comprises a phenoxy resin, an energy ray curable acrylic resin and a thiol- And the pressure-sensitive adhesive layer is cured by thermal curing and energy ray casting. The adhesive tape for electronic parts according to the present invention has no bleeding-out or flash of the sealing resin due to excellent adhesion and adhesiveness to the lead frame, and the temperature at which the adhesive force is developed in the lead frame can be adjusted by controlling the degree of curing. In addition, the thiol-based additive has excellent adhesion to NiPdAu leadframe and PPF lead frame, which have lower adhesion than AgCu leadframe, and retains sticky residue on leadframe or sealing resin surface after detaching with good cohesive force. Can be solved.

Description

{ADHESIVE TAPE FOR ELECTRONIC COMPONENTS}

The present invention relates to a pressure-sensitive adhesive tape for electronic parts, and more particularly to a pressure-sensitive adhesive tape for electronic parts, which has excellent adhesion to a NiPdAu lead frame and a PPF lead frame by including a thiol- will be.

BACKGROUND ART [0002] In recent years, an electronic component manufacturing company manufactures a semiconductor in a quad flat no-lead package (QFN) method without a lead. In the case of QFN, the lead is not extended but is exposed to the bottom of the package in the form of a land around the die, so soldering to the circuit board is possible. Therefore, the package can be made significantly smaller and thinner than the package having the lead, and the area occupied by the circuit board is reduced by about 40% as compared with the conventional package. The heat radiation surface is also different from the conventional method in which the lead frame on which the chip is mounted is stacked by the sealing resin so that the lead frame is on the bottom of the package and the die pad is directly exposed to the outside. Thus, the electrical characteristics are superior to those of the lead-out packages, and the self-inductance is only about half.

Since the interface between the lead frame and the encapsulating resin surface coexists with the bottom of the package, when the general metal molding frame is used, the encapsulating resin easily escapes between the lead frame and the molding die and the surface of the land portion or the die pad is contaminated with resin Causing problems. Thus, it is essential to laminate the lead frame by using an adhesive tape, and then to perform the QFN manufacturing process and the resin encapsulation process, thereby preventing the bleed-out or flash of the encapsulating resin during the resin process. have.

In general, a semiconductor device manufacturing process includes a tape lamination process for adhering an adhesive tape to one side of a lead frame, a die attach process for bonding a semiconductor device to a die pad of a lead frame, Wire bonding process for electrically connecting the land portion of the semiconductor chip to the die bonding process, encapsulation of the lead frame having the die bonding process and wire bonding in a molding die using a sealing resin, EMC molding, And a detaching process in which the lead frame is detached from the sealed lead frame.

As described above, in order to comprehensively summarize the required characteristics of the adhesive tape used in the semiconductor device manufacturing process, it is necessary to adhere to the lead frame according to the lamination method of each laminator and to adhere to the lead frame without forming bubbles after the lamination. . In addition, there should be no physical chemical change of the tape for the temperature range mentioned and during the process time so that the die adhesion and wire bondability are excellent. In other words, a part of the pressure-sensitive adhesive layer should escape in the form of outgas and not adsorb on the surface of the semiconductor device element to lower the bonding force of the interface to be bonded. During the encapsulation resin encapsulation process, the tape should be kept in tight contact with the lead frame so that the encapsulation resin does not penetrate through the interfaces to contaminate the lead frame surface. Of course, it is possible to add a deflash process after the detaching process, but ultimately it is recommended to be efficient and economically free from the additional washing process. After detaching, there is no specific reaction between the adhesive and the encapsulating resin so that the surface of the encapsulating resin can be realized as intended with the original design of the encapsulating resin, and the adhesive should not remain on the surface. In addition, the residue of the adhesive should not remain on the surface of the lead frame.

Accordingly, there is a demand for development of a pressure-sensitive adhesive tape suitable for a laminator in which lamination is performed using a hot press in the laminating system while satisfying the required characteristics of the pressure-sensitive adhesive tape for an electronic part as described above. In this case, The tape must be adhered to the lead frame. In the detaching step, the adhesive residue should not remain on the surface of the sealing resin or the surface of the lead frame after the tape is removed. However, the conventional adhesive tape has low adhesion in NiPdAu and PPF lead frames (Pre-Plated Lead Flame), so lamination through hot press has not been achieved. In this case, the lead frame is limited in use and many flashes or bleed-outs occur in which the sealing resin flows into the die surface of the lead frame in the molding process due to low adhesive force.

An object of the present invention is to provide an adhesive tape for electronic parts having excellent adhesion even to a NiPdAu lead frame and a PPF lead frame which have a lower adhesive force than existing AgCu lead frames.

The pressure-sensitive adhesive tape for electronic parts according to the present invention comprises a heat-resistant substrate and a pressure-sensitive adhesive layer coated with the pressure-sensitive adhesive composition on the heat-resistant substrate, wherein the pressure-sensitive adhesive composition comprises a phenoxy resin, And a thiol-based pressure-sensitive adhesive property improving agent, wherein the pressure-sensitive adhesive layer is cured by thermal curing and energy ray casting.

The pressure-sensitive adhesive composition preferably comprises 1 to 40 parts by weight of an energy ray-curable acrylic resin per 100 parts by weight of the phenoxy resin, and 0.01 to 10 parts by weight of a tackifier having a thiol group.

Wherein the pressure-sensitive adhesive composition comprises 0.1 to 40 parts by weight of a thermosetting agent relative to 100 parts by weight of a phenoxy resin; And 0.5 to 10 parts by weight of a photoinitiator per 100 parts by weight of an energy ray curable acrylic resin.

The thiol adhesiveness improver may be at least one selected from the group consisting of 1,3,4-thiadiazole-2,5-dithiol, glycol di (3-mercaptopropionate), pentaerythritol (3-mercaptopropionate) Methylmercapto capto-5-mercapto-1,2,4-thiadiazole.

The thickness of the pressure-sensitive adhesive layer is preferably 1 to 10 μm, and the glass transition temperature of the pressure-sensitive adhesive composition is preferably 80 to 150 ° C.

The adhesive force of the adhesive tape to the NiPdAu lead frame is 15 gf / cm or more, and the adhesive force to the PPF lead frame is 10 gf / cm or more.

The adhesive tape for electronic parts according to the present invention has no bleeding-out or flash of the sealing resin due to excellent adhesion and adhesiveness to the lead frame, and the temperature at which the adhesive force is developed in the lead frame can be adjusted by controlling the degree of curing.

In addition, thiol-based additives have excellent adhesion to NiPdAu leadframes and PPF lead frames, which have lower adhesion than conventional AgCu leadframes, and have excellent cohesive strength, which allows the adhesive to remain on the lead frame or sealing resin surface after detaching. The adhesive residual problem can be solved.

The present invention provides a pressure-sensitive adhesive tape for protecting a semiconductor package, which comprises a heat-resistant substrate and a pressure-sensitive adhesive layer coated with the pressure-sensitive adhesive composition on the heat-resistant substrate, wherein the pressure-sensitive adhesive composition comprises a phenoxy resin, an energy ray curable acrylic resin and a thiol- And the pressure-sensitive adhesive layer is cured by thermal curing and energy ray casting.

1. Heat-resistant substrate

The heat-resistant substrate on which the pressure-sensitive adhesive composition is applied and the pressure-sensitive adhesive layer is formed on the pressure-sensitive adhesive tape for electronic parts according to the present invention may be a polymer film having excellent heat resistance. Such a heat-resistant substrate can be processed into a film form, and there should be no physical-chemical change during the temperature range and time during which the adhesive tape is exposed during the manufacturing process of the semiconductor device. Preferably, the temperature at which the weight reduction is 5% is at least 300 ° C or more, and the coefficient of thermal expansion at 50 to 200 ° C is preferably 1 to 35 ppm / ° C or so.

A film having a glass transition temperature of 110 to 450 DEG C is also preferable. Stable and excellent high-temperature heat resistance can maintain the flatness of the substrate during high-temperature laminating, uniform lamination is possible, and high wire-bonding property can be ensured. The dimensional stability of the film held even at a high temperature is not deformed in the molding die even during the resin sealing process, so that leakage of the resin can be suppressed. In addition, the modulus of elasticity is preferably 1 to 10 GPa at room temperature, and preferably 100 to 5000 MPa even in the range of 100 to 300 占 폚. The use of substrate films with too low a modulus of elasticity or a high degree of folding can result in the handling of the tape, the loading of the tape into the lamination equipment, and the wrinkling that can occur during the feeding of the tape to the equipment Which may cause delamination at a later time and cause uneven wire bonding and resin bleed-out, which is undesirable.

Examples of the substrate that satisfies the above-mentioned required characteristics include a heat-resistant polymer film and films processed with heat-resistant polyethylene terephthalate, polyethylene naphthalate, polyphenylene sulfide, polyimide, polyester, polyamide, polyetherimide, .

The thickness of the heat resistant substrate is not particularly limited and is determined by the application limitations of the lamination equipment and the resin sealing equipment. Generally, it is preferably from 5 to 100 mu m, but it is more preferably from 20 to 50 mu m in order to suppress wrinkles caused by external force, maintain proper heat resistance, and facilitate handling. If necessary, a sand matting treatment, a corona treatment, a plasma treatment and a primer treatment are also possible in order to improve the adhesive strength between the pressure-sensitive adhesive and the base film.

2. Adhesive layer

The pressure-sensitive adhesive layer to be laminated on the heat-resistant substrate is formed by applying a pressure-sensitive adhesive composition. The pressure-sensitive adhesive composition includes an energy ray curable acrylic resin as a photo-curable resin for maintaining heat resistance while controlling excessive curing shrinkage of the phenoxy resin, based on a thermoplastic phenoxy resin having excellent heat resistance and excellent adhesive strength. And a thiol adhesiveness improver for increasing the adhesion between NiPdAu and the PPF lead frame. The composition may further comprise a thermosetting agent for phenoxy resin and a photoinitiator for photopolymerization.

2.1. Thermoplastic phenoxy resin

Examples of the phenoxy resin as the main thermoplastic resin include bisphenol A type phenoxy, bisphenol A type / bisphenol F type phenoxy, brominated phenoxy, phosphorous phenoxy, bisphenol A / bisphenol S type phenoxy and caprolactone Modified phenoxy and the like. Of these, bisphenol A-type phenoxy resins are more preferable because they are excellent in heat resistance, environment friendliness, compatibility of curing agent, and curing speed. The phenoxy resin preferably has a weight average molecular weight of 1,000 to 500,000. In this case, the problem of residue of the adhesive can be minimized during detaching by improving the heat resistance due to the increase of the internal cohesive force. If the molecular weight is less than 1,000, the internal cohesive force is lowered and the required heat resistance property is not realized. If the molecular weight exceeds 500,000, the workability coming from the high viscosity may be decreased, but it may be difficult to uniformly come out on the coated surface even after coating. It is difficult to control the mixing property of the resin.

Examples of the organic solvent capable of dissolving the phenoxy resin include ketones, alcohols, glycol ethers, and esters. Some examples of the solvent include cyclohexanone, methyl ethyl ketone, benzyl alcohol, diethylene glycol alkyl ether, phenoxy propanol, propylene glycol methyl ether acetate, tetrahydrofuran, N-methylpyrrolidone, etc. Or a mixture of two or more of them may be used. When an organic solvent is used, 5 to 40 parts by weight of a phenoxy resin is more preferably used in an amount of 20 to 35 parts by weight based on 100 parts by weight of the organic solvent. If necessary, an aromatic hydrocarbon solvent such as toluene, xylene, aromatic 100 or hexane may be added as a diluent in order to improve the coating defects and adhesion to the substrate film. It is preferable that the amount of the diluent is not more than 40% with respect to the solvent.

Further, the phenoxy resin can be used together with a suitable thermosetting agent (or crosslinking agent). The above-mentioned thermosetting agent may be any as long as it can cure a resin having a hydroxyl group as a functional group. Melamine, urea-formaldehyde, isocyanate functional prepolymer, phenol curing agent, amino-based curing agent and the like.

The amount of the thermosetting agent is preferably 0.1 to 40 parts by weight, more preferably 5 to 20 parts by weight, based on 100 parts by weight of the phenoxy resin. If the amount of the curing agent is too small to be less than 0.1 part by weight and a sufficient crosslinked structure is formed, the pressure-sensitive adhesive layer is retreated (relative glass transition temperature is decreased and loss elastic modulus is decreased) And the adhesive pushed by the lead frame is raised around the die pad or the land portion of the lead frame, so that it may be caught between the sealing resin and the lead frame during the resin sealing process, thereby causing adhesive residue during detaching. If the amount of the curing agent is more than 40 parts by weight, the adhesive strength and wettability of the pressure-sensitive adhesive layer may be too low to cause delamination, and a problem that the pressure-sensitive adhesive layer is broken during the lamination process due to excessively increased strength In addition, it is not preferable because the tape may be bent due to excessive curing shrinkage during drying and curing process after application of the pressure-sensitive adhesive to the substrate film, which may result in lowered lamination workability.

2.2. Energy ray curable acrylic resin

The energy ray-curable acrylic resin to form a crosslinking structure in addition to the crosslinking structure of the phenoxy resin may be an acrylic polymer having carbon-carbon double bonds, an acryl oligomer, an acrylic monomer, etc., and has at least one unsaturated bond . This acrylic group functions as a functional group that forms a crosslinked structure through a free radical reaction, and the reactivity, crosslinking structure, and degree of curing can be controlled according to the number of the functional groups. As the number of functional groups increases, the reaction (crosslinking) speed increases, the glass transition temperature increases, and the heat resistance increases, but the flexibility and adhesion of the pressure-sensitive adhesive layer decrease.

In selecting an acrylic resin having an appropriate number of functional groups, a balance between adhesive strength and rigidity should be used as well as selection of a thermosetting agent for curing the phenoxy resin. Examples of the acrylic compound used for such energy ray curing include epoxy acrylate, aromatic urethane acrylate, aliphatic urethane acrylate, polyether acrylate, polyester acrylate, acryl acrylate, etc., It can also be used in combination with other oligomers. Among oligomers of each kind, oligomers having a functional group of about 2 to 9 can be used depending on the number of functional groups. In order to suppress the adhesion of the pressure-sensitive adhesive layer to the surface of the sealing resin and the lead frame at the time of detaching the wire bonding property due to the increase in the cohesive strength, strength and glass transition temperature of the pressure-sensitive adhesive layer through high curing density, Oscillating oligomers are preferred. The content of the energy ray-curable acrylic compound is 1 to 40 parts by weight, preferably 5 to 30 parts by weight, based on 100 parts by weight of the phenoxy resin.

The photoinitiator used to initiate the curing by the energy ray of the energy ray curable acrylic compound may be selected from benzophenone, chitosan, alpha hydroxy ketone, alpha amino ketone, phenylglyoxylate, Takeover. The photoinitiator may be used alone, but two or more photoinitiators may be used depending on the efficiency and characteristics of the photoinitiator for the purpose of forming a uniform cross-linked structure depending on the thickness of the adhesive layer or the intensity of energy rays. The content of the photoinitiator may be 0.5 to 10 parts by weight, preferably 1 to 5 parts by weight based on 100 parts by weight of the energy ray curable acrylic resin.

2.3. Adhesion improver

Finally, the pressure-sensitive adhesive composition includes a pressure-sensitive adhesive property improving agent containing a functional group having polarity capable of enhancing a bonding force with a metal. Among them, NiPdAu and PPF lead frames and a thiol adhesiveness improving agent having a thiol group at the terminal thereof having excellent adhesive strength are added to obtain excellent adhesion. Specific examples of the thiol adhesiveness improver include 1,3,4-thiadiazole-2,5-dithiol, glycol di (3-mercaptopropionate), pentaerythritol (3-mercaptopropionate) 3-methylmercapto capto-5-mercapto-1,2,4-thiadiazole, and the like. The content of such an additive is 0.01 to 10 parts by weight, preferably 0.1 to 5 parts by weight based on 100 parts by weight of the phenoxy resin. When the amount of the additive is less than 0.01 parts by weight, it is difficult to expect an improvement in adhesion strength. When the amount of the additive is more than 10 parts by weight, side reactions such as reaction of the polar additive with the curing agent become more serious, have.

2.4. The pressure-

The composition is applied on a heat-resistant substrate by a known method, and then dried and cured to form a pressure-sensitive adhesive layer. Coating may be performed by a method such as Meyer bar coating, gravure coating, knife coating, roll coating or the like.

On the other hand, the thickness of the pressure-sensitive adhesive layer formed by the above method is preferably 1 to 10 mu m. If the thickness is less than 1 탆, the adhesive force with the substrate may be lowered, and if it exceeds 10 탆, the adhesive residue may be generated on the substrate.

The adhesive strength at room temperature to the Cu-foil of the pressure-sensitive adhesive layer is 40 gf / cm or more, the adhesion to the NiPdAu lead frame is 15 gf / cm, and the adhesion to the PPF lead frame is 10 gf / cm or more. According to the repeated experiments of the present inventors It is confirmed that the adhesive strength can be increased or decreased depending on the content of the thiol adhesiveness improver. However, the upper limit of the adhesive force is about 60 gf / cm in any case. When the adhesive force exceeds 60 gf / cm, a phenomenon that the pressure-sensitive adhesive is applied to the sealing resin starts to occur.

The pressure-sensitive adhesive layer of the pressure-sensitive adhesive tape for electronic parts according to the present invention preferably has a glass transition temperature of 80 to 150 ° C. When the glass transition temperature is lower than 80 캜, the physical properties of the pressure-sensitive adhesive at high temperature are excessively changed due to the thermal history during the QFN process. When the temperature exceeds 150 캜, the lamination temperature of the tape becomes 170 캜 or more, warpage phenomenon becomes severe. This is due to the fact that the thermal expansion of the lead frame becomes worse and the degree of thermal expansion with the tape becomes larger, resulting in an increase in warpage.

3. Adhesive tape

The adhesive tape for electronic parts according to the present invention relates to a pressure-sensitive adhesive tape for electronic parts which is required for a process for manufacturing a semiconductor device and which satisfies the required properties, and which is excellent in heat resistance, Resin is used as a mainstay. Therefore, there is no bleed-out or flash of the sealing resin due to excellent adhesion to the lead frame, and the temperature at which the adhesive force is developed in the lead frame can be adjusted by controlling the degree of curing. In addition, Thiol-based additives have excellent adhesion to NiPdAu leadframes and PPF leadframes, which have lower adhesion than conventional AgCu leadframes. The problem of residual adhesive remaining on the lead frame or the sealing resin surface of the adhesive after taping can be solved.

In the present invention, the adhesive tape for electronic parts is exemplified by a semiconductor packaging process. However, the adhesive tape is not necessarily limited to this, but may be applied to a mask tape at the top of a high-temperature manufacturing process of various electronic parts.

Hereinafter, the present invention will be described in more detail with reference to Examples. The present invention is intended to more specifically illustrate the present invention, and the scope of the present invention is not limited to these embodiments.

Example  One

Phenoxy resin (Yuko Chemical Co., Ltd., YP50) (Dow Corning, CE138), 15 g of polyisocyanate thermosetting agent (Dow Corning, CE138), polyurethane acrylate (Japan synthesis, UV7600B80) which is an energy ray curable compound, (CYTEC, DAROCUR TPO) and 0.1 g of glycol di (3-mercaptopropionate) were mixed and stirred for 1 hour.

The agitated pressure-sensitive adhesive composition was applied to a polyimide film (manufactured by SKC Kolon) having a corona treatment of 25 탆 in thickness and dried in a dryer at 150 캜 for about 3 minutes. Then, ultraviolet rays were further applied to the pressure- A tape was prepared.

Example  2

100 g of phenoxy resin (YP50) was dissolved in 200 g of methyl ethyl ketone as a solvent and 15 g of a polyisocyanate thermosetting agent (Dow Corning, CE138), polyurethane acrylate (Japan Synthesis, UV7600B80) (CYTEC, DAROCUR TPO) and 0.2 g of glycol di (3-mercaptopropionate) were mixed and stirred for 1 hour. The agitated adhesive composition was applied to a polyimide film (manufactured by SKC Kolon) having a corona treatment of 25 탆 in thickness at a thickness of about 3 탆, dried in a dryer at 150 캜 for about 3 minutes, and further irradiated with ultraviolet light to produce an adhesive tape .

Comparative Example  One

100 g of phenoxy resin (YP50) was dissolved in 200 g of methyl ethyl ketone as a solvent and 15 g of a polyisocyanate thermosetting agent (Dow Corning, CE138), polyurethane acrylate (Japan Synthesis, UV7600B80) (CYTEC, DAROCUR TPO) were mixed and stirred for 1 hour. The agitated adhesive composition was applied to a polyimide film (manufactured by SKC Kolon) having a corona treatment of 25 탆 in thickness at a thickness of about 3 탆, dried in a dryer at 150 캜 for about 3 minutes, and further irradiated with ultraviolet light to produce an adhesive tape .

Comparative Example  2

100 g of phenoxy resin (YP50) was dissolved in 200 g of methyl ethyl ketone as a solvent and 15 g of a polyisocyanate thermosetting agent (Dow Corning, CE138), polyurethane acrylate (Japan Synthesis, UV7600B80) (CYTEC, DAROCUR TPO) and 0.1 g of silsesquioxane were mixed and stirred for 1 hour. The agitated adhesive composition was applied to a polyimide film (manufactured by SKC Kolon) having a corona treatment of 25 탆 in thickness at a thickness of about 3 탆, dried in a dryer at 150 캜 for about 3 minutes, and further irradiated with ultraviolet light to produce an adhesive tape .

Comparative Example  3

100 g of phenoxy resin (YP50) was dissolved in 200 g of methyl ethyl ketone as a solvent and 15 g of a polyisocyanate thermosetting agent (Dow Corning, CE138), polyurethane acrylate (Japan Synthesis, UV7600B80) (CYTEC, DAROCUR TPO) and 0.1 g of tetraazole were mixed and stirred for 1 hour. The agitated adhesive composition was applied to a polyimide film (manufactured by SKC Kolon) having a corona treatment of 25 탆 in thickness at a thickness of about 3 탆, dried in a dryer at 150 캜 for about 3 minutes, and further irradiated with ultraviolet light to produce an adhesive tape .

Comparative Example  4

100 g of phenoxy resin (YP50) was dissolved in 200 g of methyl ethyl ketone as a solvent and 15 g of a polyisocyanate thermosetting agent (Dow Corning, CE138), polyurethane acrylate (Japan Synthesis, UV7600B80) (CYTEC, DAROCUR TPO) and 0.1 g of 4,4-diaminodiphenylsulfone were mixed and stirred for 1 hour. The agitated adhesive composition was applied to a polyimide film (manufactured by SKC Kolon) having a corona treatment of 25 탆 in thickness at a thickness of about 3 탆, dried in a dryer at 150 캜 for about 3 minutes, and further irradiated with ultraviolet light to produce an adhesive tape .

Comparative Example  5

100 g of phenoxy resin (YP50) was dissolved in 200 g of methyl ethyl ketone as a solvent and 15 g of a polyisocyanate thermosetting agent (Dow Corning, CE138), polyurethane acrylate (Japan Synthesis, UV7600B80) , 1 g of an alkylphosphine-based photoinitiator (CYTEC, DAROCUR TPO) and 0.1 g of 4-tert-butylphenol were mixed and stirred for 1 hour. The agitated adhesive composition was applied to a polyimide film (manufactured by SKC Kolon) having a corona treatment of 25 탆 in thickness at a thickness of about 3 탆, dried in a dryer at 150 캜 for about 3 minutes, and further irradiated with ultraviolet light to produce an adhesive tape .

Experimental Example

The properties of the adhesive tape samples for electronic parts manufactured in Examples and Comparative Examples were evaluated for each of the following items, and the results are shown in Table 1 below.

1. Adhesion measurement

The produced adhesive tape is measured after lamination with a polyimide film in a hot press. If the adhesive strength exceeds 60 gf, there is a high possibility that the adhesive resin adheres to the sealing resin.

2. Confirm Residue

The samples were peeled off from the Cu foil, NiPdAu, and PPF lead frames with a thickness of 25 μm and laminated, and the residue of the adhesive was observed under a microscope. And `missing` when the part of the adhesive material was observed in the shape of a point or a surface was recorded as` no`.

3. Confirm chemical resistance

The sample was immersed in acetone and wiped off with a bolt to confirm whether the adhesive was damaged. `Bad` when the adhesive was erased or scratches, and` good` when it was not damaged.

4. Sealing resin leakage

The adhesive tape was peeled off from the lead frame after the sealing resin process, and the sealing resin and the lead frame portion were observed with a microscope. When a large amount of the sealing resin is leaked, it can be confirmed by a microscope that the black sealing resin is present on the die or the lead portion of the lead frame, and it is noted that the sealing resin has a gray or transparent color seal The resin was able to confirm the leakage, recorded it as `fine`, and recorded` No` when the above phenomena were not found.

division Example 1 Example 2 Comparative Example 1 Comparative Example 2 Comparative Example 3 Comparative Example 4 Comparative Example 5 additive
Kinds Thiol Thiol not used silicon Amine group Amine /
Sulphone Hydroxyl point
Cling
Power
(gf / cm) Cu foil 41 52 29 28 30 103 34 NiPdAu 20 25 2 3 2 45 9 PPF 15 20 3 5 7 43 5 adhesive
Residue none none none has exist none has exist none Sealing resin
leakage none none has exist has exist minuteness none minuteness Chemical resistance good good good Poor Poor Poor good

As can be seen from Examples 1 and 2 in Table 1, it can be seen that the use of the additive increases the adhesion in the NiPdAu and PPF lead frames.

On the other hand, Comparative Examples 1, 2, 3, and 5 using additives with silicon, amine, and hydroxyl groups did not increase adhesiveness. In Comparative Example 4, the increase of the adhesive strength was high, but the chemical resistance deteriorated and the adhesive residue remained. This seems to be due to the increase in physical adhesion on the lead frame and adhesive surface.

Claims (7)

A pressure-sensitive adhesive tape for protecting a semiconductor package, comprising a heat-resistant substrate and a pressure-sensitive adhesive layer coated with the pressure-
The pressure-sensitive adhesive composition includes a phenoxy resin, an energy ray-curable acrylic resin, and a thiol adhesiveness improver,
Wherein the pressure-sensitive adhesive layer is cured by heat curing and energy ray casting. The pressure-sensitive adhesive composition according to claim 1, wherein the pressure-sensitive adhesive composition comprises 1 to 40 parts by weight of an energy ray-curable acrylic resin per 100 parts by weight of a phenoxy resin, and 0.01 to 10 parts by weight of a tackiness- tape. The pressure-sensitive adhesive composition according to claim 1, wherein the pressure-sensitive adhesive composition comprises 0.1 to 40 parts by weight of a thermosetting agent relative to 100 parts by weight of a phenoxy resin; And 0.5 to 10 parts by weight of a photoinitiator per 100 parts by weight of an energy ray curable acrylic resin. 2. The composition of claim 1, wherein the thiol-based tackifier is selected from the group consisting of 1,3,4-thiadiazole-2,5-dithiol, glycol di (3-mercaptopropionate), pentaerythritol Propionate), and 3-methylmercaptocotato-5-mercapto-1,2,4-thiadiazole. The pressure-sensitive adhesive tape for electronic parts according to claim 1, wherein the pressure-sensitive adhesive layer has a thickness of 1 to 10 탆, and the pressure-sensitive adhesive composition has a glass transition temperature of 80 to 150 캜. The adhesive tape for electronic parts according to claim 1, wherein the electronic component is a NiPdAu lead frame or a PPF lead frame. The adhesive tape for electronic parts according to claim 6, wherein the adhesive force to the NiPdAu lead frame is 15 gf / cm or more, and the adhesive force to the PPF lead frame is 10 gf / cm or more.