KR20040073999A - Low cost antennas and electromagnetic(EMF) absorption in electronic circuit packages or transceivers using conductive loaded resin-based materials - Google Patents

Abstract

The present invention relates to an inexpensive antenna and an electromagnetic absorbing portion formed of a conductive resin-based material. The conductive imparting resin-based material includes conductive fibers, conductive powders or combinations thereof in the resin base host, wherein the weight of the conductor fiber, conductor powder or combination of conductor fibers and conductor powder with respect to the weight of the base resin host is given. The ratio is between about 0.20 and 0.40. The conductive fiber or conductive powder may be stainless steel, nickel, copper, silver, carbon, graphite, plated fibers or particles, and the like. Antenna elements may be formed using methods such as injection molding or extrusion. Substantially any antenna, ground plane or shielding package conventionally made of metal can be made using a conductive imparting resin-based material. The conductive imparting resin-based material used to form the antenna element, the EMF absorbing element, or the ground plane may be in the form of a thin flexible material that can be easily cut into the desired shape.

Description

Low cost antennas and electromagnetic (EMF) absorption in electronic circuit packages or transceivers using conductive loaded resin-based materials}

Field of invention

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to antennas, EMF / RFI absorbers, and the like, molded from a conductivity giving resin-based material comprising micron conductive powder, micron conductive fibers or combinations thereof homogenized in a base resin during molding.

Description of the related technology

U. S. Patent No. 4,134, 120 to DeLoach et al. Describes an antenna formed from a fiber reinforced resin material.

U. S. Patent No. 5,771, 027 to Marks et al. Describes a composite antenna having a grating composed of electrical conductors woven from a warp of fiber-reinforced fabric forming a layer of a multilayer stack of antennas.

Solberg, Jr. U.S. Patent No. 6,249,261 B1, et al. Describes aroma-sensing material composed of an electrically conductive polymer composite.

US Pat. No. 6,531,983 B1 to Hirose et al. Describes a dielectric antenna in which the circuit pattern is formed of a conductive film or resin.

US Pat. No. 6,320,753 B1 to Launay describes antenna formation using silk-screen printing of conductive links or conductive resins.

US Pat. No. 6,617,976 B1 to Walden et al. Teaches that the antenna can be formed of a conductive plastic without providing a detailed description.

Patent Application No. 10 / 075,778 dated February 14, 2002 and US Patent Application No. 10 / 309,429 dated December 4, 2002, assigned to the same assignee, describe a low-cost antenna using a conductive imparting resin-based material.

Antennas and EMF absorbers are an integral part of electronic communications systems, including radio links and electronic manufacturing capabilities. Low cost molded antennas and EMF absorbers provide these systems with significant advantages not only in terms of manufacturing, but also in terms of 2D, 3D, 4D, and 5D electronic properties, which can lead to the physical physics and physical component Physical advantages that can be achieved by the molding process.

Antennas and electromagnetic absorbers are essential components of electronic devices and wireless hydronic units. Such applications as communication and navigation require the isolation of electronic components with reliable sensitivity antennas and material isolation by appropriate chipset and shielding or via EMF absorbers. Antennas and shields (chip / component insulation) are usually made of a wide range of metal structures. The reduction in material and / or manufacturing costs combined with the added performance for the antenna and / or absorber / shield (shield as known to be made as metal) can be made from the antenna or electromagnetic absorber (conductive imparting resin-based material). As is often the case for a number of system design applications.

It is a primary object of the present invention for wireless communication device (s) and / or transceiver (s) using next-generation moldable antenna (s) and / or electromagnetic absorber (s) that can be designed and manufactured from a conductive imparting resin-based material. To provide a case or shell. The antenna (s) and absorber (s) may be used integrally with all or part of the circuit board design, manufacture and assembly of these devices, or when all or part of the structure of the body or case of the device may be molded.

Another object is to provide a package for an electronic circuit device using a next generation electromagnetic absorber that can be designed and manufactured from a conductivity giving resin based material. These absorbers can be molded or extruded, can be all or part of the structure of the package, and can be used integrally with some or all of the design, manufacture and assembly of these packages.

These objects are achieved by molding an EMF chip insulation design and / or antenna element and / or electronic device, which may be required in the wireless communication device (s) or electronic device (s) with a conductive imparting resin based material. These materials are base resins to which a conductive material is provided, and this conductive material can make the base resin into a conductor other than an insulator. The resin provides structural integrity to the molded part. Micron conductive fibers, micron conductive powders or combinations thereof are homogenized in the resin during the molding process.

Certain types of antennas can be made of a conductive imparting resin-based material. Examples of common antennas are dipole antennas, unipolar antennas, planar antennas, inverted F antennas, pifa, and the like. These antennas can be tuned using a set of mathematical equations to achieve the desired frequency range.

The conductivity giving resin-based material can be processed by molding, extrusion, or the like to provide almost any desired shape or size. The molded conductive imparting resin-based material may also be molded into a thin plate or portion processed by injection molded thin plate or portion, overmolding, lamination, milling or the like to provide a desired antenna or absorber shape and size. The electrical properties of an antenna fabricated using a conductive muer resin-based material depend on the composition of the conductivity-imparting resin-based material whose loading parameters can be adjusted to help achieve the desired antenna and / or structural and / or electrical properties. do.

1 is a perspective view of a bipolar antenna formed of a conductive resin-based material.

2A is a front view of the dipole antenna of FIG. 1 showing an insulating material between the radiating antenna element and the ground plane.

FIG. 2B is a front view of the dipole antenna of FIG. 1 showing an insulating material between both the radiating antenna element and the balanced antenna element and the ground plane; FIG.

2C shows an amplifier inserted between the coaxial cable center conductor and the radiating antenna element for the dipole antenna of FIG.

3 shows a section of an antenna element formed of a conductive imparting resin-based material showing a metal insert for connecting cable elements.

4A is a perspective view of a patch antenna comprising a radiating antenna element and a ground plane, through which a coaxial cable enters through the ground plane;

4B is a perspective view of a patch antenna including a radiating antenna element and a ground plane, through which a coaxial cable enters between the ground plane and the radiation antenna;

5 shows an amplifier inserted between the coaxial cable center conductor and the radiating antenna element of the patch antenna of FIGS. 4A and 4B.

Fig. 6 is a perspective view of a monopole antenna formed of an electrically conductive resin-based material.

Fig. 7 is a perspective view of a monopole antenna formed of a conductive imparting resin-based material having an amplifier between a coaxial cable center conductor and a radiating antenna element.

8A is a top view of an antenna having a single L-type antenna element formed of a conductivity giving resinous material.

8B is a cross-sectional view of the antenna element of FIG. 8A taken along line 8B-8B ′ in FIG. 8A.

8C is a cross-sectional view of the antenna element of FIG. 8A taken along line 8C-8C ′ in FIG. 8A.

Fig. 9A is a top view of an antenna formed of an electrically conductive resin-based material embedded in an automobile bumper.

Fig. 9B is a front view of an antenna formed of a conductive imparting resin-based material embedded in an automobile bumper formed of an insulator such as rubber.

10A is a schematic diagram of an antenna formed of a conductive imparting resin-based material embedded in molding of a vehicle window.

10B is a schematic diagram of an antenna formed of a conductive imparting resin-based material implemented in a portable electronic device.

11 is a cross-sectional view of a conductivity providing resin-based material containing powder of a conductor material.

12A is a cross-sectional view of a conductively imparting resin-based material containing conductor fibers.

12B is a cross-sectional view of a conductivity giving resin-based material including both micron conductor powder and micron conductor fibers.

13 is a simplified schematic diagram of an apparatus for forming an injection molded antenna element.

14 is a simplified schematic diagram of an apparatus for forming an extruded antenna element.

Fig. 15A is a top view of a fiber of a conductively imparting resin-based material woven with a conductive fabric.

15B is a top view of fibers of a conductively imparting resin-based material randomly woven into a conductive fabric.

16A, 16B and 16C are top, side and cross-sectional views, respectively, of a casing for a wireless electronic communication system.

17A and 17B are top and cross-sectional views, respectively, of an integrated circuit package.

* Description of the symbols for the main parts of the drawings *

10 balanced antenna element 12 radiated antenna element

14 center conductor 15 metal insert

20: ground plane 22: insulating material layer

50: coaxial cable 72: amplifier

The following embodiments are examples of antennas, ground planes and electromagnetic absorber isolation manufactured using conductive loaded resin-based materials. In some examples above, the ground plane may be formed from a combination with a metal, such as a conductive substrate resin or a circuit board trace embedded in the device as a counterpoise. The use of a conductive imparting resin-based material in the manufacture of the antenna, the ground plane, and the electromagnetic absorption package significantly reduces the material and manufacturing costs, and facilitates the formation of such a material into a desired shape. Such materials may be used to fabricate any combination of receive or transmit antennas and antennas and / or absorbers. The antenna, the ground plane and the EMF absorber are injection molded, over-molded, thermo-set, extrusion, extrusion of post homogenized conductive imparting resin-based material. It can be formed into various shapes using conventional methods such as compression and the like.

The electroconductive resin-based material at the time of molding typically does not produce only the desired available conductivity range of <5 to> 25 ohms per square. The materials or EMF materials selected for fabricating the antenna are homogenized together using molding techniques and / or methods such as injection molding, dual injection, thermoforming, extrusion, extrusion, compression, and the like.

The electroconductivity imparting resin-based material includes micron conductive powder, micron conductive fiber, or any combination thereof. These are homogenized together in the resin during the molding process, thereby facilitating the fabrication of parts or circuits manufactured with low cost, electrical conductivity and close tolerances. The micron conductive powder may be made of a material such as carbon, graphite, amine, and / or metal powder such as nickel, copper, silver, or a plating material. The use of other types of powders, such as carbon or graphite (s), can produce additional low activity levels of electron exchange and combination with micron conductive fibers, micron fillers in the micron conductive network of fiber (s). When used in, it not only acts as a lubricant for forming equipment, but also creates additional electrical conductivity. The micron conductive fiber may be nickel plated carbon fiber, stainless steel fiber, copper fiber, silver fiber, or the like. The structural material is a material such as any polymer resin. Structural materials given by way of example and not of limitation are polymer polymers made by GE PLASTICS, Pittsfield, Massachusetts, other resins made by GE PLASTICS, Pittsfield, Massachusetts, other resins made by other manufacturers, United States Silicone from GE SILICONES, Waterford, NY, or other flexible resin compounds manufactured by other manufacturers.

The resin-based structural material containing the micron conductive powder, the micron conductive fiber, or a combination thereof can be molded into a desired shape using a method such as injection molding or double injection, or extrusion. The molded electroconductive resin-based material may be stamped, cut or milled as needed to form a desired antenna element. The composition and directivity of the inclusion material can affect the properties of the antenna (s) and can be precisely controlled during the molding process. When properly designed with metal content and shape, laminated composite materials with random webbed micron stainless steel fibers or other micron conductive fibers forming a woven material that can be used to realize ultra-high performance flexible woven antennas May be made. The textile antenna may be embedded in a garment as well as in an insulating material such as rubber or plastic. The random web type conductive fiber may be laminated to a material such as techron, polyester, or any resin-based flexible or rigid material polymer. Using conductive fibers such as web-like conductive materials as part of the stack, the fibers range from approximately 3 to 12 microns, typically approximately 8 to 12 microns, or 10 microns in length (s) that can be seamless. It may have a diameter of.

Now, an example of an antenna manufactured using the conductivity giving resin-based material will be described with reference to FIGS. 1 to 10B. Such an antenna may be a receive or transmit antenna. FIG. 1 shows a perspective view of a two-pole antenna having a balanced antenna element 10 and a radiating antenna element 12 formed of a conductive imparting resin-based material. The antenna comprises a radiating antenna element 12 and a balanced antenna element 10 each having a length 24 and a rectangular cross section perpendicular to the length 24. The length 24 is greater than 3 times the square root of the cross-sectional area. The center conductor 14 of the coaxial cable 50 is electrically connected to the radiation antenna element 12 using a solderable metal insert 15 formed in the radiation antenna element 12. The shield 52 of the coaxial cable 50 is connected to the balanced antenna element 10 using a solderable metal insert formed in the balanced antenna element 10 or an insert molded therein. The metal insert in the balanced antenna element 10 is the same as the metal insert 15 in the radiating antenna element 12, although not shown in FIG. The length 24 is a multiple of one quarter wavelength of the optimum frequency of detection or transmission of the antenna. The impedance of the antenna at resonance should be made approximately equal to the impedance of the coaxial cable 50 to ensure maximum power transfer between the cable and the antenna.

FIG. 3 shows in detail the metal insert 15 formed in the segment 11 of the antenna element. The metal insert can be copper or other metal (s). Screws 17 may be used in the metal insert 15 to assist with electrical connections. Soldering or other electrical connection methods may also be used.

1 shows a bipolar antenna having a radiating antenna element 12 located on an insulating material layer 22 located on a ground plane 20 and a corresponding antenna element 10 located directly on the ground plane 20. An example is shown. The ground plane 20 is optional, and if the ground plane is not used, the insulating material layer 22 may not be necessary. As another option, the corresponding antenna element 10 may be located on the insulating material layer 22, as shown in FIG. 2A. If the ground plane 20 is used, it can also be formed of a conductive imparting resin-based material.

2A shows a ground plane 20, an insulating material layer 22 between the radiating antenna element 12 and the ground plane 20, and a corresponding antenna element 10 located directly on the ground plane 20. FIG. 1 shows a front view of the dipole antenna of FIG. FIG. 2B shows a front view of the dipole antenna of FIG. 1 for an example of an insulating material layer 22 between the ground plane 20 and the radiating antenna element 12 and the corresponding antenna element 10.

As shown in FIG. 2C, an amplifier 72 may be inserted between the center conductor 14 of the coaxial cable and the radiating antenna element 12. The wire 70 connects the metal insert 15 in the radiating antenna element 12 to the amplifier 72. To receive the antenna, the input of the amplifier 72 is connected to the center conductor 14 of the coaxial cable 50. For the transmit antenna, the output of the amplifier 72 is connected to the radiating antenna element 12 and the input of the amplifier 72 is connected to the center conductor 14 of the coaxial cable 50.

In one embodiment of the antenna, the length 24 is about 1.5 inches having a square cross section of about 0.09 square inches. The antenna has a center frequency of about 900 MHz.

4A and 4B are perspective views of a patch antenna having a radiation antenna element 40 and a ground plane 42 formed from a conductive imparting resin-based material. The antenna is provided by a radiating antenna element 40, a ground plane 52, and an insulating standoff 60, each having the shape of a rectangular plate with a thickness 44. It includes a separation between. The rectangular root of the rectangular plate region forming the radiating antenna element 40 is greater than three times the thickness 44. In one embodiment of the antenna in which the rectangular plate has a 1.4 inch side and a 0.41 inch thick portion, the patch antenna provides good performance in a Global Position System, GPS having a frequency of about 1.5 GHz.

4A shows an example of a patch antenna through which the coaxial cable 50 enters through the ground plane 42. The coaxial cable shield 52 is connected to the ground plane 42 by a metal insert 15 at the ground plane. The coaxial cable center conductor 14 is connected to the radiating antenna element 40 by means of a metal insert 15 in the radiating antenna element 40. 4B shows an example of a patch antenna into which the coaxial cable 50 enters between the radiating antenna element 40 and the ground plane 42. The coaxial cable shield is connected to the ground plane 42 by a metal insert 15 at ground plane 42. The coaxial cable center conductor 14 is connected to the radiating antenna element 40 by means of a metal insert 15 in the radiating antenna element 40.

As shown in FIG. 5, an amplifier 72 may be inserted between the coaxial cable center conductor 14 and the radiating antenna element 40. Wire 70 connects the amplifier 72 to the metal insert 15 at the radiating antenna element 40. To receive the antenna, the input of the amplifier 72 is connected to the radiating antenna element 40 and the output of the amplifier 72 is connected to the center conductor 14 of the coaxial cable 50. For the transmit antenna, the output of the amplifier 72 is connected to the radiating antenna element 40 and the input of the amplifier 72 is connected to the center conductor 14 of the coaxial cable 50.

6 shows an example of a unipolar antenna having a height 71 aligned perpendicular to the ground plane 68. The radiating antenna element 64 and the ground plane 68 are formed of a conductive imparting resin-based material. An insulating material layer 66 separates the radiating antenna element 64 from the ground plane 68. The height 71 of the radiating antenna element 64 is such that the radiating antenna element 64 is larger than three times the square root of the cross-sectional area. An example of such an antenna having a height 71 of 1.17 inches performs well at a GPS frequency of 1.575.42 GHz.

FIG. 7 shows an example of the above-described monopole antenna with an amplifier 72 inserted between the center conductor 14 of the coaxial cable 50 and the radiating antenna element 64. For the receiving antenna, the inlet of the amplifier 72 is connected to the radiating antenna element 64 and the outlet of the amplifier 72 is connected to the center conductor 14 of the coaxial cable 50. For the transmit antenna, the outlet of the amplifier 72 is connected to the radiating antenna element 64 and the inlet of the amplifier 72 is connected to the center conductor 14 of the coaxial cable 50.

8A-8C illustrate an example of an L-type antenna having a radiating antenna element 80 over a ground plane 98. The radiation antenna element 80 and the ground plane 98 are formed of a conductive imparting resin material. Insulating material layer 96 separates radiating antenna element 64 from ground plane 98. The radiation antenna element 80 consists of a first leg 82 and a second leg 84. 8A is a top view of the antenna. 8B shows a cross-sectional view of the first leg 82. 8C is a cross sectional view of the second leg 84. 8B and 8C show ground plane 98 and insulating material layer 96. The cross-sectional areas of the first leg 82 and the second leg 84 are not the same. Antennas of this type are typically manufactured using overmolding techniques to bond conductive resin-based materials to insulating materials.

This type of antenna has many uses. 9A and 9B show a bipolar antenna embedded in an automobile bumper 100 formed of an electrically conductive imparting resin-based material and formed of an insulating material. The dipole antenna includes a radiating antenna element 102 and a counterweight antenna element 104. 9A is a top view of a bumper 100 with a buried antenna. 9B is a front view of a bumper 100 with a buried antenna.

Antennas of the present invention formed from a conductive imparting resin-based material can be used for a number of additional applications. This type of antenna is embedded in the window shaping of vehicles such as automobiles or airplanes. 10A is a schematic diagram of the window 106. Antenna 110 is embedded in shaping 108. This type of antenna may be embedded in a plastic housing or may be part of the plastic shell itself of a portable electronic device such as a mobile phone, personal computer or the like. 10B is a schematic diagram of a segment 112 of a plastic housing having an antenna 110 molded or inserted into the housing 112.

Conductivity imparting resin-based materials typically include powder of conductor particles, fibers of conductor material, or a combination thereof in a base resin host. 11 is a cross-sectional view of an example of a conductively imparting resin-based material 212 having a powder of conductor particles 202 in a base resin host 204. 12A is a cross-sectional view of an example of a conductively imparting resin-based material 212 having conductor fibers 210 in a base resin host 204. FIG. 12B is a cross-sectional view of an example of an electrically conductive resin-based material 212 having a powder of conductor particles 202 and a conductor fiber 210 in a base resin host 204. In these examples, the diameter of the conductor particles 202 in the powder is about 3 to 12 microns. In these embodiments, the conductor fiber 210 has a diameter of about 3 to 12 microns, typically 10 micro or 8 to 12 microns, and a length of about 12 to 14 millimeters. The conductor used for these conductor particles 202 or conductor fibers 210 may be stainless steel, nickel, copper, silver, graphite, plated particles, or other suitable metal or resin. Conductor particles or fibers are homogeneous in the base resin. As described above, the conductivity giving resin-based material has conductivity of less than about 5 ohms per square and up to 25 ohms per square. To achieve this conductivity, the ratio of the weight of the conductor material, conductor particle 202 or conductor fiber 210 to the weight of the base resin host 204 is about 0.20 to 0.40. Stainless steel fibers 4-6 mm long and 8-11 micron diameter with fiber weight to a base resin weight ratio of 0.30 exhibit very high conductive parameter effects in certain EMP spectra.

The package element, antenna element, or EMF absorbing element formed of the conductive imparting resin-based material may be formed or molded by a number of other methods including injection molding, extrusion, or chemical induction molding. 13 is a simplified schematic diagram of injection molding showing the lower portion 230 and the upper portion 231 of the mold. The raw material conductivity providing mixed resin-based material is injected into the molding cavity 237 through the injection opening 235, and then homogenized with the conductivity providing material to be chemically cured. The upper portion 231 and the lower portion 230 of the mold are separated and then the conductive antenna element is removed.

14 is a simplified schematic diagram of an extruder for forming antenna elements using extrusion. In the hopper 239 of the extrusion unit 234, the raw material (s) conductivity providing resin-based material is disposed. A piston, screw, press, or other means 236 is then used to pass the thermally melted or chemically induced cured conductivity imparting resin-based material into the extrusion opening 240 that molds the material into the desired shape. The electrically conductive imparting resin-based material is then completely processed by chemical reaction or thermal reaction to be in a hardened state or a flexible state, ready for use.

Referring now to FIGS. 15A and 15B, the preferred composition of the conductivity giving resin-based material is shown. The conductive imparting resin-based material is formed of a plurality of fibers and then woven or web formed into a conductive fabric. The conductive imparting resin-based material is formed of strands that can be woven as shown. 15A shows a conductive fabric 230 in which multiple fibers are woven two-dimensionally together. FIG. 15B shows conductive fabric 232 formed in an arrangement in which a plurality of fibers are web formed. In a web-formed arrangement, one or more continuous conductive fiber strands randomly overlap within the resin. The resulting conductive fabric 230 (FIG. 15A), 232 (FIG. 15B) can be made very thin.

Likewise, a group of polyester or the like can be formed using a plurality of micron stainless steel fibers or other micron conductive fibers that are woven or web formed to produce a metallic but cloth-like material. These woven or webed conductive lands can also be laminated to one or more layers of material, such as polyester, Teflon or other resin-based materials. This conductive fabric can then be cut into the desired shape.

Fig. 16A is a plan view of a casing for an electronic communication device such as a cell phone in which all or part thereof is formed of a conductive resin resin material. 16A shows the upper element 304 of the casing. FIG. 16B is a side view of the casing showing the sidewall element 306 and the lower element 302, viewed from line 16B-16B 'in FIG. 16A. All or part of the upper element 304, lower element 302, and sidewall element 306 may be made of a conductivity giving resin-based material. 16C is a cross sectional view taken along line 16C-16C ′ of FIG. 16B showing various segments of sidewall element 306. As shown in FIG. 16C, the antenna element 308 and the EMF absorbing element 310 may be embedded in the sidewall element 306. As shown in FIG. 16C, an isolation element 309 should be used to insulate the antenna element 308 from the EMF absorbing element 310.

FIG. 17A is a plan view of an EMF absorption integrated circuit package formed of a conductive imparting resin-based material, and FIG. 17B is a cross-sectional view taken along line 17B-17B 'of FIG. 17A. 17A and 17B show a first package element 318 in which an insulating substrate 324 is embedded. A plurality of integrated circuit elements 326 are mounted on the substrate 324. In the example shown in FIG. 17B, three integrated circuit elements are shown as an example, but the number of integrated circuits may be three or more or less. An electronic circuit trace 324, not shown, may be formed on the substrate 324 to interconnect the integrated circuit elements 326. Multiple input / output leads 314 are used to input and output electrical signals to the integrated circuit device 326. A second package element 312 then covers the assembly and is bonded to the first package element 318 as shown in FIG. 17B. An insulating material 320 must be used to insulate the input / output leads 314 from the first package element 318 and the second package element 312. The first package element 318 and the second package element 312, both formed of a conductive imparting resin-based material, provide electromagnetic absorption to the assembly in the package.

Antennas formed from the electrically conductive resin-based material may be designed to operate at frequencies of approximately 2 kHz to 300 kHz or any other assigned radio frequency. The geometric scale of the linear relationship with respect to the applied frequencies is smaller in dimension with higher frequencies. Antennas formed of the electrically conductive resin-based material may accommodate signals that are horizontally, vertically, circularly, or crossed and polarized.

In addition, the conductivity giving resin-based material may be formed as a probe for oscilloscopes and other electronic devices in place of the metal probe.

While the invention has been specifically illustrated and described in connection with the preferred embodiments thereof, those skilled in the art will understand that various changes may be made in shape and detail without departing from the spirit and scope of the invention.

Claims (40)

A lower element, a sidewall element, and an upper element, An antenna element formed in the sidewall element, A system having interconnected electronic devices disposed in the upper element, the sidewall element and the lower element, and An electrical connection from the antenna element to the system having the interconnected electronic device, Part or all of the lower element, or part or all of the sidewall element and part or all of the upper element are formed of a conductive imparting resin-based material, and the conductive imparting resin-based material is formed of a conductive fiber, a conductive powder in a base resin host. Or a combination of the conductor fiber and the conductor powder, wherein the ratio of the weight of the conductor fiber, the conductive powder or the combination of the conductive fiber and the conductive powder to the weight of the base resin host is about 0.20 and 0.40. Between, The antenna element is a case or shell for an electronic device formed of the electrically conductive resin-based material. The case or sheath of claim 1, wherein the conductor fibers have a cylindrical shape. The case or sheath of claim 1, wherein the conductor fibers have a diameter between about 3 and 12 μm. The case or sheath of claim 1, wherein the conductor fibers are between about 2 and 14 mm in length. The case or shell according to claim 1, wherein the conductor powder comprises conductor particles having a spherical shape. The case or sheath of claim 1, wherein the conductor powder comprises conductor particles having a diameter between about 3 and 12 μm. The case or sheath of claim 1, wherein the system having the interconnected electronic device is a wireless telephone. The case or sheath of claim 1, wherein a portion of the lower element, the sidewall element, and the upper portion of the imparting resin-based material that is not part of the antenna element provides electromagnetic absorption. The case or sheath of claim 1, wherein the conductor fibers are stainless steel, nickel, copper, silver, carbon, graphite, or plated fibers. The case or sheath of claim 1, wherein the conductor powder comprises particles of stainless steel, nickel, copper, silver, carbon, graphite, or plated particles. The case or sheath of claim 1, wherein the antenna can be designed to operate effectively at frequencies between about 2 KHz and 300 GHz or any available radio frequency. A first package element formed of an electrically conductive resin-based material, A substrate which is an insulator formed in the first package, An integrated circuit element attached to the substrate, A second package element formed of the conductivity-imparting resin-based material, A conductive electrode between the substrate and the sheath of the protective sheath, An insulation portion between the conductive electrode and the first package element; An insulating portion between the conductive electrode and the second package element, The electrically conductive imparting resin-based material includes a conductor fiber, a conductor powder or a combination of the conductor fiber and the conductor powder in a base resin host, wherein the conductor fiber and the conductor powder with respect to the weight of the base resin host. Or the ratio of the combination of conductive fibers and conductive powder is between about 0.20 and 0.40, The second package element on the first package element covering the substrate and the integrated circuit element such that the first package element and the second package element form a protective envelope and an electromagnetic absorber around the substrate and the integrated circuit element; Circuit package to which is attached. The electronic circuit package of claim 12, wherein the conductor fiber has a cylindrical shape. 13. The electronic circuit package of claim 12, wherein the conductor fiber has a diameter between about 3 and 12 [mu] m. 13. The electronic circuit package of claim 12, wherein the conductor fibers are between about 2 and 14 mm in length. The electronic circuit package of claim 12, wherein the conductor powder comprises conductor particles having a spherical shape. The electronic circuit package of claim 12, wherein the conductor powder comprises conductor particles having a diameter between about 2 and 12 μm. 13. The electronic circuit package of claim 12, wherein the conductor fiber comprises stainless steel, nickel, copper, silver, carbon, graphite or plated fiber. 13. The electronic circuit package of claim 12, wherein the conductor powder comprises particles of stainless steel, nickel, copper, silver, carbon, graphite or plated particles. Forming a lower element, a sidewall element and an upper element; Forming an antenna element in the sidewall element; Disposing a system having an electronic device interconnected within said upper element, said sidewall element and said lower element, and Forming an electrical connection from the antenna element to a system having the interconnected electronic device, Part or all of the lower element, or part or all of the sidewall element and part or all of the upper element are formed of a conductive imparting resin-based material, and the conductive imparting resin-based material is formed of a conductive fiber, a conductive powder in a base resin host. Or a combination of the conductor fiber and the conductor powder, wherein the ratio of the weight of the conductor fiber, the conductive powder or the combination of the conductive fiber and the conductive powder to the weight of the base resin host is about 0.20 and 0.40. Between, The antenna element is an electronic device case or shell forming method formed of the conductive resin-based material. The method of claim 20, wherein the conductor fiber has a cylindrical shape. The method of claim 20, wherein the conductor fiber is between about 3 and 12 μm. The method of claim 20, wherein the conductor fiber is between about 2 and 14 mm. 21. The method of claim 20, wherein the conductor powder comprises conductor particles having a spherical shape. The method of claim 20, wherein the conductor powder comprises conductor particles having a diameter between about 3 and 12 μm. 21. The method of claim 20, wherein the system having the interconnected electronic device is a wireless telephone. 21. The electronic device of claim 20, wherein a portion of the lower element, the sidewall element, and the upper element formed of the electrically conductive resin-based material and not part of the antenna element provides electromagnetic absorption for a system having the electronic device. How to form a case or shell for use. The method of claim 20, wherein the conductor fiber is stainless steel, nickel, copper, silver, carbon, graphite, or plated fiber. The method of claim 20, wherein the conductor powder comprises particles of stainless steel, nickel, copper, silver, carbon, graphite, or plated particles. 21. The method of claim 20, wherein the antenna can be designed to operate effectively at frequencies between about 2 KHz and 300 GHz or any available radio frequency. 21. The method of claim 20, wherein the lower element, the sidewall element and the upper element are molded using molding, overmolding or extrusion. Forming a first package element of the conductivity giving resin-based material, Disposing an insulator substrate in the first package element; Attaching an integrated circuit device to the substrate; Forming a second package element of the conductivity-imparting resin-based material; Attaching a conductive electrode between the substrate and the sheath of the protective sheath; Disposing an insulation portion between the conductive electrode and the first package element; and Disposing an insulation portion between the conductive electrode and the second package element, The electrically conductive imparting resin-based material includes a conductor fiber, a conductor powder or a combination of the conductor fiber and the conductor powder in a base resin host, wherein the conductor fiber and the conductor powder with respect to the weight of the base resin host. Or the ratio of the combination of conductive fibers and conductive powder is between about 0.20 and 0.40, The second package element on the first package element covering the substrate and the integrated circuit element such that the first package element and the second package element form a protective envelope and an electromagnetic absorber around the substrate and the integrated circuit element; Electronic circuit package forming method to which the 33. The method of claim 32, wherein the conductor fiber has a cylindrical shape. 33. The method of claim 32 wherein the diameter of the conductor fiber is between about 3 and 12 [mu] m. 33. The method of claim 32 wherein the conductor fiber is between about 2 and 14 mm in length. 33. The method of claim 32, wherein the conductor powder comprises conductor particles having a spherical shape. 33. The method of claim 32 wherein the conductor powder comprises conductor particles having a diameter between about 3 and 12 microns. 33. The method of claim 32 wherein the conductor fiber is stainless steel, nickel, copper, silver, carbon, graphite, or plated fiber. 33. The method of claim 32 wherein the conductor powder comprises particles of stainless steel, nickel, copper, silver, carbon, graphite or plated particles. 33. The method of claim 32 wherein the first package element and the second package element are formed using molding, overmolding or extrusion.