KR200320855Y1 - Thermal treatment unit for electric and electronic elemnt - Google Patents

Abstract

The present invention relates to a heat treatment apparatus for an electric element, and more particularly, to a heat treatment apparatus for firing and sintering a multilayer ceramic element or a semiconductor component, the gas supply apparatus having a flow control means 110, and the control A reactor (kiln) 100 having a castle heating means 120 and a temperature sensing means 130 and connected to the gas supply device to receive gas, and for controlling the amount of gas discharged from the reactor. A heat treatment apparatus provided with an exhaust valve (140), comprising a display means for displaying the opening and closing degree of the exhaust valve. It is possible to precisely control the discharge rate so that the pressure, temperature and gas residence time of the reactor can be controlled stably, and energy and gas consumption can be controlled. One can.

Description

Heat treatment device for device {THERMAL TREATMENT UNIT FOR ELECTRIC AND ELECTRONIC ELEMNT}

The present invention relates to a heat treatment apparatus for an element, and more particularly, to a heat treatment apparatus for firing and sintering a multilayer ceramic element or a semiconductor component, the gas supply apparatus having a flow control means, a controllable heating means and A heat treatment apparatus having a temperature sensing means and connected to the gas supply device to receive a gas, and a exhaust valve for adjusting the amount of gas discharged from the reactor, wherein the exhaust valve Providing a heat treatment apparatus for an element, characterized in that it comprises a display means for displaying the opening and closing degree of the, it is possible to precisely control the exhaust gas emissions by quantifying the opening and closing degree of the exhaust valve to be able to precisely control the pressure and temperature of the reactor And heat for device that can stably control gas residence time and reduce consumption of energy and gas It provides the Physical Unit.

In general, when a device such as a laminated ceramic capacitor or a semiconductor wafer is subjected to heat treatment such as sintering and sintering in a general atmosphere, it is impossible to produce a high quality product, thereby providing an inert gas atmosphere to perform heat treatment. The heat treatment is carried out with the reaction gas as necessary, and the heat treatment may be performed by varying the amount of gas, residence time, pressure and temperature depending on the type of device and the purpose to be achieved.

However, in order to control the amount and pressure of the gas to a stable and appropriate level according to the above object, although the flow control device must be provided at both the gas supply port and the discharge port, the conventional heat treatment apparatus is provided with a means for adjusting the displacement The system could not be built. This is because it is difficult to use the flow control device on the exhaust port because the temperature of the exhaust gas is too high because the heat treatment temperature of the device is carried out at a temperature of several hundred degrees to 1,000 ℃ or more. Therefore, the gas amount was controlled only through the supply port, and thus, the temperature control and the gas amount injected into the furnace were not stable. Patent Publication No. 2002-0063805 discloses a semiconductor wafer surface treatment apparatus having a controllable valve at a gas supply port and an outlet port, respectively, but the device is only operated at a low temperature and is difficult to use in a high temperature heat treatment apparatus.

In order to improve this problem, the present inventors studied a method of controlling exhaust gas emissions by installing a general manual valve in the exhaust port. However, the general manual valve has a disadvantage in that reproducibility and reliability are poor because it is difficult to precisely control and difficult to control numerically.

Accordingly, a technical problem to be achieved by the present invention is a gas supply device having a flow control means, a reaction furnace having controllable heating means and a temperature sensing means and connected to the gas supply device to receive gas, and the reaction. A heat treatment apparatus having an exhaust valve for adjusting the amount of gas discharged from a furnace, the heat treatment apparatus comprising a display means for displaying the opening and closing degree of the exhaust valve, thereby providing a heat treatment apparatus for the exhaust gas. It is possible to precisely control the amount of discharge, to provide stable heat, pressure, temperature and gas residence time, and to provide an economical heat treatment device that can reduce energy and gas consumption.

1 is a schematic explanatory diagram of a heat treatment apparatus for a device according to the present invention

Figure 2 is a front view of the exhaust valve of the heat treatment device for a device according to the present invention

* Brief description of the major reference symbols

100: reactor 110: flow control means

120: controllable heating means 130: temperature sensing means

140: exhaust valve 150: heat treatment element

141: first gear 142: second gear

143: counter

In order to achieve the above technical problem, the present invention includes a gas supply device having a flow control means, a control furnace having controllable heating means and a temperature sensing means, and connected to the gas supply device to receive gas and In the heat treatment apparatus having an exhaust valve for adjusting the amount of gas discharged from the reactor, it provides a device heat treatment apparatus comprising a display means for displaying the opening and closing degree of the exhaust valve. .

Hereinafter, with reference to the accompanying drawings for the subject innovation will be described in more detail.

1 is a schematic explanatory view of a heat treatment apparatus for a device according to the present invention. As shown in the figure, the heat treatment apparatus for a device according to the present invention includes a gas supply device having a flow control device 110. The flow control device is generally controlled by a program together with the controllable heating means 120 of the reactor.

In addition, the heat treatment apparatus for a device according to the present invention is provided with a control heating means and a temperature sensing means and is provided with a reactor 100 is connected to the gas supply device to receive the gas. The controllable heating means 120 is controlled by a program together with the flow control device 110 as described above. The temperature sensing means 130 is used to measure the temperature of the inside of the reactor, in particular near the heat treatment object 150, and used to measure the temperature of the object, and the temperature measured by the temperature sensing means is transmitted to a computer to control the flow rate control device and Feedback control of the controllable heating means. The temperature sensing means 130 may be used in plurality. In addition, the reactor may be further provided with a pressure sensing means as necessary.

In addition, the device heat treatment apparatus according to the present invention includes an exhaust valve including a display means for displaying the opening and closing degree of the exhaust valve 140 for adjusting the amount of gas discharged from the reactor. Figure 2 is a specific example of the exhaust valve according to the present invention, the first gear 141 installed on the opening and closing control shaft of the valve, the second gear 142 is engaged with the first gear and the second gear The front view of the exhaust valve which is connected to the rotating shaft and includes the counter 143 which displays the rotation speed of the rotating shaft is shown. The operator can numerically confirm the opening and closing degree of the valve through the counter 143 and perform precise valve operation. In addition, even when it is necessary to change the opening and closing degree of the valve because the heat treatment conditions are different, it is possible to appropriately adjust the opening and closing degree of the valve by using the value displayed on the counter 143. Although the shape of the exhaust valve 140 is not limited, it is also applicable to high temperature and high pressure, and a sluice valve is preferable for precise operation. Those skilled in the art will be able to calculate and quantify the degree of opening and closing required for various situations.

The embodiment of the present invention discloses only the exhaust valve 140 having a counter 143 using a gear device, but those skilled in the art to which the present invention belongs to modify the gear device or the counter of the present invention Since it can be easily seen that the same purpose can be achieved, the scope of the present invention is not limited thereto.

As described above, the present invention includes a gas supply device having a flow control means, a reactor having controllable heating means and a temperature sensing means, and connected to the gas supply device to receive gas, and A heat treatment apparatus having an exhaust valve for adjusting an amount of gas discharged from a reactor, the exhaust valve being provided by providing a heat treatment apparatus for an element, characterized by including display means for displaying the opening and closing degree of the exhaust valve. It is possible to precisely control the emission of exhaust gas by quantifying the degree of opening and closing of the gas, so that it is possible to stably control the pressure, temperature, and gas residence time of the reactor, and to reduce energy and gas consumption.

Claims (2)

A gas supply device having a flow rate control means 110, a reaction furnace 100 having controllable heating means 120 and a temperature sensing means 130, and connected to the gas supply device to receive gas, and In the heat treatment apparatus having an exhaust valve 140 for adjusting the amount of gas discharged from the reactor, Heat treatment apparatus for a device, characterized in that it comprises a display means for displaying the opening and closing degree of the exhaust valve (140). The method of claim 1, The display means is the first gear 141 is provided on the opening and closing control shaft of the valve, A second gear 142 meshed with the first gear, And a counter (143) connected to the rotating shaft of the second gear and displaying the number of rotations of the rotating shaft.