KR102935337B1 - Organic light emitting display device - Google Patents

Abstract

The present specification discloses an organic light-emitting display device. The organic light-emitting display device may include: a substrate having a display area and a non-display area surrounding the display area; a first planarization layer that planarizes an upper portion of a thin film transistor included in a pixel of the display area; and a second planarization layer positioned on the first planarization layer and extending further in the non-display area toward an edge of the substrate than the first planarization layer.

Description

Organic light-emitting display device

This specification relates to an organic light-emitting display device.

Video display devices, which display diverse information on screens, are a core technology of the information and communication age and are evolving toward thinner, lighter, more portable, and higher performance. Accordingly, organic light-emitting diode (OLED) displays, which display images by controlling the amount of light emitted by organic light-emitting diodes (OLEDs), are gaining attention.

Organic light-emitting diodes (OLEDs) are self-luminous devices that utilize a thin light-emitting layer between electrodes, offering the advantage of being able to be manufactured in thin films. A typical OLED display device has a structure in which pixel driver circuits and OLEDs are formed on a substrate. Light emitted from the OLEDs passes through the substrate or barrier layer to display an image.

Because organic light-emitting diode displays can be implemented without a separate light source, they are easily implemented as flexible displays. Flexible materials such as plastic and metal foil can be used as substrates for organic light-emitting diode displays.

Because organic light-emitting diodes degrade in performance when exposed to moisture, moisture-proofing the exterior is crucial. Consequently, various moisture-proof designs are being applied to the exterior of display devices. Conversely, there is a growing demand for a smaller bezel for aesthetic reasons. While these two requirements are difficult to meet simultaneously, ongoing research and development is underway to harmoniously satisfy both.

The purpose of this specification is to propose an organic light-emitting display device and a bezel structure applicable to the organic light-emitting display device. The objectives of this specification are not limited to those mentioned above, and other unmentioned objectives will be clearly understood by those skilled in the art from the description below.

According to one embodiment of the present specification, an organic light-emitting display device is provided. The organic light-emitting display device may include: a substrate having a display area and a non-display area surrounding the display area; a first planarization layer that planarizes an upper portion of a thin film transistor included in a pixel of the display area; and a second planarization layer positioned on the first planarization layer and extending further in the non-display area toward an edge of the substrate than the first planarization layer.

The first planarization layer and the second planarization layer cover all of the display area and part of the non-display area, and the first planarization layer and the second planarization layer may be formed of the same material.

The second planarization layer may directly cover at least a portion of the driving circuit portion arranged in the non-display area. In this case, the driving circuit portion may be a gate driving circuit portion formed on the substrate.

The organic light-emitting display device further includes an organic light-emitting element on the second planarization layer; an encapsulation layer covering the organic light-emitting element, wherein the encapsulation layer may include a first inorganic film on the organic light-emitting element; an organic film on the first inorganic film; and a second inorganic film on the organic film. Since the second planarization layer extends further toward the edge of the substrate than the first planarization layer, a change in the height of the terminal portions of the planarization layers is alleviated, thereby suppressing overflow of the organic film.

The organic light-emitting display device may further include a bank on the second planarization layer. The bank may cover a side surface of the second planarization layer.

The organic light-emitting display device may further include a blocking structure in the non-display area, the blocking structure being configured to block the flow of the organic film included in the encapsulation layer. At this time, the blocking structure may include a first blocking structure closer to the second planarization layer; and a second blocking structure closer to an edge of the substrate. The first blocking structure may be formed of the same material as the second planarization layer, and the second blocking structure may be formed by sequentially stacking the same material as the second planarization layer and the bank.

The above organic light-emitting display device may further include a power wire disposed in the non-display area and transmitting a low-level power to the organic light-emitting element; and a metal layer connecting the power wire and the cathode electrode of the organic light-emitting element. The metal layer may extend along a side surface of the second planarization layer. The metal layer may be made of the same material as the anode electrode of the organic light-emitting element.

Specific details of other embodiments are included in the detailed description and drawings.

Embodiments of the present disclosure can provide an organic light-emitting display device with improved overflow problems of the organic film in the encapsulation layer. More specifically, embodiments of the present disclosure can provide an organic light-emitting display device capable of appropriately controlling the flow of the organic film while having a narrow bezel. Accordingly, an organic light-emitting display device according to embodiments of the present disclosure can have improved moisture-proofing performance and production yield. The effects of the embodiments of the present disclosure are not limited to the contents exemplified above, and various other effects are included within the present disclosure.

FIG. 1 is a plan view showing an organic light-emitting display device according to an embodiment of the present specification.
FIGS. 2A and 2B are cross-sectional views showing a portion of a display area and a non-display area of an organic light-emitting display device according to one embodiment of the present specification.
FIG. 3 is a drawing showing an outer structure applied to an organic light-emitting display device according to another embodiment of the present specification.

The advantages and features of this specification, and the methods for achieving them, will become clearer with reference to the embodiments described in detail below together with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below, but may be implemented in various different forms. These embodiments are provided solely to ensure that the disclosure of the present invention is complete and to fully inform those skilled in the art of the scope of the invention, and the present invention is defined solely by the scope of the claims.

The shapes, sizes, ratios, angles, numbers, etc. disclosed in the drawings for explaining the embodiments of the present specification are illustrative and are not limited to the matters illustrated in the present specification. Like reference numerals refer to like components throughout the specification. In addition, in describing the present invention, if a detailed description of a related known technology is judged to unnecessarily obscure the gist of the present invention, the detailed description thereof will be omitted. When the terms “include,” “have,” and “consist of” are used in this specification, other parts may be added unless “only” is used. When a component is expressed in the singular, it includes a case where the plural is included unless specifically stated otherwise. When interpreting a component, it is interpreted to include a range of error even if there is no separate explicit description.

When describing a positional relationship, for example, when the positional relationship between two parts is described as "on", "above", "below", "next to", etc., one or more other parts may be located between the two parts, unless "directly" or "directly" is used. When an element or layer is referred to as "on" another element or layer, it includes both cases where it is directly on the other element or layer, or where another layer or other element is interposed. When a component is described as being "connected", "coupled", or "connected" to another component, it should be understood that the component may be directly connected or connected to the other component, but it should also be understood that other components may be "interposed" between each component, or each component may be "connected", "coupled", or "connected" through the other component.

Although terms like "first" and "second" are used to describe various components, these components are not limited by these terms. These terms are used merely to distinguish one component from another. Therefore, a "first" component referred to below may also be a "second" component within the technical scope of the present invention.

The sizes and thicknesses of each component shown in the drawings are for convenience of explanation, and the present invention is not necessarily limited to the sizes and thicknesses of the components shown. Hereinafter, various embodiments of the present invention will be described in detail with reference to the attached drawings.

FIG. 1 is a plan view showing an organic light-emitting display device according to an embodiment of the present specification.

Referring to FIG. 1, the organic light-emitting display device (100) includes at least one display area (active area, A/A), and an array of pixels is arranged in the display area. One or more non-display areas (inactive areas, I/A) may be arranged around the display area. That is, the non-display area may be adjacent to one or more side surfaces of the display area. In FIG. 1, the non-display area surrounds the display area in a rectangular shape. However, the shape of the display area and the shape/arrangement of the non-display area adjacent to the display area are not limited to the example illustrated in FIG. 1. The display area and the non-display area may have shapes suitable for the design of an electronic device equipped with the display device (100). Exemplary shapes of the display area include a pentagon, a hexagon, a circle, an oval, etc.

Each pixel within the display area (A/A) may be associated with a pixel circuit. The pixel circuit may include one or more switching transistors and one or more driving transistors. Each pixel circuit may be electrically connected to a signal line (gate line, data line, etc.) to communicate with a gate driver, data driver, etc. located in the non-display area.

The above gate driver and data driver may be implemented as a TFT (thin film transistor) in the non-display area (I/A). Such a driver may be referred to as a GIP (gate-in-panel). In addition, some components, such as a data driver IC, may be mounted on a separate printed circuit board and connected to a connection interface (pad, bump, pin, etc.) placed in the non-display area through a circuit film, such as a flexible printed circuit board (FPCB), chip-on-film (COF), tape-carrier-package (TCP), etc. The printed circuit (COF, PCB, etc.) may be located at the back of the display device (100).

The organic light-emitting display device (100) may include various additional elements for generating various signals or driving pixels within a display area. The additional elements for driving the pixels may include an inverter circuit, a multiplexer, an electro static discharge (ESD) circuit, etc. The organic light-emitting display device (100) may also include additional elements associated with functions other than pixel driving. For example, the organic light-emitting display device (100) may include additional elements that provide a touch detection function, a user authentication function (e.g., fingerprint recognition), a multi-level pressure detection function, a tactile feedback function, etc. The above-mentioned additional elements may be located in the non-display area and/or an external circuit connected to the connection interface.

An organic light-emitting display device according to the present specification may include a substrate (101) on which thin film transistors and organic light-emitting elements are arranged, an encapsulating layer (120), a polarizing film (145), etc.

The substrate (101) supports various components of the organic light-emitting display device (100). The substrate (101) may be formed of a transparent insulating material, for example, an insulating material such as glass or plastic. The substrate (array substrate) is also referred to as a concept including elements and functional layers formed thereon, for example, a switching TFT, a driving TFT connected to the switching TFT, an organic light-emitting element connected to the driving TFT, a protective film, etc.

An organic light-emitting device is disposed on a substrate (101). The organic light-emitting device includes an anode, an organic light-emitting layer, and a cathode. The organic light-emitting device may be configured with a single light-emitting layer structure that emits a single light, or may be configured with a structure that emits white light by being composed of multiple light-emitting layers. When the organic light-emitting device emits white light, a color filter may be further provided. The organic light-emitting device may be formed in a central portion of the substrate (101) so as to correspond to a display area.

An encapsulation layer (120) can cover the organic light-emitting device. The encapsulation layer protects the organic light-emitting device from external moisture or oxygen.

The above organic light-emitting display device (100) is composed of a plurality of pixels, and one pixel may include a plurality of sub-pixels. In this case, a sub-pixel is the minimum unit for expressing one color.

A single sub-pixel circuit may include multiple transistors, capacitors, and multiple wires. The sub-pixel circuit may be composed of two transistors and one capacitor (2T1C), but is not limited thereto and may be implemented as a sub-pixel circuit using 4T1C, 7T1C, 6T2C, etc. In addition, the sub-pixel may be implemented to be suitable for a top-emission type organic light-emitting display device (100).

FIGS. 2A and 2B are cross-sectional views showing a portion of a display area and a non-display area of an organic light-emitting display device according to one embodiment of the present specification.

The organic light-emitting display device of Fig. 2 has an exemplary structure consisting of two planarization layers. In the organic light-emitting display device (100), thin film transistors (102, 104, 106, 108), organic light-emitting elements (112, 114, 116), and various functional layers are positioned on a substrate (or array substrate).

The substrate (101) may be a glass or plastic substrate. In the case of a plastic substrate, a polyimide-based or polycarbonate-based material may be used to provide flexibility. In particular, polyimide is widely used as a plastic substrate because it can be applied to high-temperature processes and is a material that can be coated.

The buffer layer (130) is a functional layer for protecting electrodes/wires from impurities such as alkaline ions leaking from the substrate (101) or lower layers. The buffer layer may be formed of silicon oxide (SiOx), silicon nitride (SiNx), or a multilayer thereof. The buffer layer (130) may include a multi-buffer (131) and/or an active buffer (132). The multi-buffer (131) may be formed by alternately stacking silicon nitride (SiNx) and silicon oxide (SiOx), and may delay the diffusion of moisture and/or oxygen that has penetrated the substrate (101). The active buffer (132) protects the semiconductor layer (102) of the transistor and functions to block various types of defects that flow in from the substrate (101). The active buffer (132) may be formed of amorphous silicon (a-Si), etc.

The thin film transistor may be formed by sequentially arranging a semiconductor layer (102), a gate insulating film (103), a gate electrode (104), an interlayer insulating film (105), and source and drain electrodes (106, 108). The semiconductor layer (102) is positioned on the buffer layer (130). The semiconductor layer (102) may be made of polysilicon (p-Si), in which case a certain region may be doped with an impurity. In addition, the semiconductor layer (102) may be made of amorphous silicon (a-Si), or may be made of various organic semiconductor materials such as pentacene. Furthermore, the semiconductor layer (102) may be made of an oxide. The gate insulating film (103) may be formed of an insulating inorganic material such as silicon oxide (SiOx) or silicon nitride (SiNx), or may be formed of an insulating organic material. The gate electrode (104) can be formed of various conductive materials, such as magnesium (Mg), aluminum (Al), nickel (Ni), chromium (Cr), molybdenum (Mo), tungsten (W), gold (Au), or alloys thereof.

The interlayer insulating film (105) may be formed of an insulating material such as silicon oxide (SiOx) or silicon nitride (SiNx), and may also be formed of an insulating organic material. By selectively removing the interlayer insulating film (105) and the gate insulating film (103), a contact hole exposing the source and drain regions may be formed.

The source and drain electrodes (106, 108) are formed in a single layer or multilayer shape using electrode materials on an interlayer insulating film (105). If necessary, a passivation layer made of an inorganic insulating material may cover the source and drain electrodes (106, 108).

A first planarization layer (107-1) may be positioned on a thin film transistor. The first planarization layer (107-1) protects the thin film transistor and planarizes the upper portion thereof. The first planarization layer (107-1) may be configured in various forms and may be formed of one or more of an acrylic resin, an epoxy resin, a phenol resin, a polyamide resin, a polyimide resin, an unsaturated polyester resin, a polyphenylene resin, and a polyphenylene sulfide resin, but is not limited thereto. Various metal layers (108-2) that serve as wires/electrodes may be disposed on the first planarization layer (107-1).

The second planarization layer (107-2) is positioned on top of the first planarization layer (107-1). The reason there are two planarization layers in this embodiment is because the number of signal wires has increased as display devices have evolved to high resolution. Therefore, it has become difficult to arrange all wires on one layer while ensuring a minimum spacing, so an additional layer has been created. This additional layer (the second planarization layer) provides room for wiring arrangement, making wire/electrode arrangement design easier. In addition, when a dielectric material is used as the planarization layers (107-1, 107-2), the planarization layers (107-1, 107-2) can also be utilized to form capacitance between metal layers.

The organic light-emitting device may be in the form of a first electrode (112), an organic light-emitting layer (114), and a second electrode (116) sequentially arranged. That is, the organic light-emitting device may be composed of a first electrode (112) formed on a second planarization layer (107-2), an organic light-emitting layer (114) positioned on the first electrode (112), and a second electrode (116) positioned on the organic light-emitting layer (114).

The first electrode (112) can be electrically connected to the drain electrode (108D) of the driving thin film transistor through the connection electrode (108-2). When the organic light-emitting display device (100) is of a top emission type, the first electrode (112) can be made of an opaque conductive material with high reflectivity. For example, the first electrode (112) can be formed of silver (Ag), aluminum (Al), gold (Au), molybdenum (Mo), tungsten (W), chromium (Cr), or an alloy thereof.

The bank (110) is formed in the remaining area excluding the light-emitting area. Accordingly, the bank (110) has an opening area that exposes the first electrode (112) corresponding to the light-emitting area. The bank (110) can be made of an inorganic insulating material such as a silicon nitride film (SiNx) or a silicon oxide film (SiOx), or an organic insulating material such as BCB, an acrylic resin, or an imide resin.

An organic light-emitting layer (114) is positioned on the first electrode (112) exposed by the bank (110). The organic light-emitting layer (114) may include a light-emitting layer, an electron injection layer, an electron transport layer, a hole transport layer, a hole injection layer, etc.

The second electrode (116) is positioned on the organic light-emitting layer (114). When the organic light-emitting display device (100) is of a top emission type, the second electrode (116) is formed of a transparent conductive material such as indium tin oxide (ITO) or indium zinc oxide (IZO), thereby emitting light generated in the organic light-emitting layer (114) to the upper portion of the second electrode (116).

A sealing layer (120) is positioned on the second electrode (116). The sealing layer (120) blocks the infiltration of oxygen and moisture from the outside to prevent oxidation of the light-emitting material and electrode material. If the organic light-emitting element is exposed to moisture or oxygen, a pixel shrinkage phenomenon in which the light-emitting area shrinks may occur, or dark spots may appear within the light-emitting area.

A touch panel (film), a polarizing film (145), a cover glass (140), etc. may be further positioned on the bag layer (120).

The non-display area (I/A) may be located outside the display area (A/A) as illustrated in FIG. 2b, and a driving circuit (e.g., GIP), power wiring, etc. may be placed thereon.

Electrodes/wires connected to the driving circuit arranged in the non-display area can be made of a gate metal (104') and a source/drain metal (108-1, 108-2). The gate metal (104') is formed in the same process with the same material as the gate electrode of the TFT, and the source/drain metal (108-1, 108-2) is formed in the same process with the same material as the source/drain electrode of the TFT. Meanwhile, power can be supplied to the cathode electrode (116) through the connection with the source/drain metal (108-1, 108-2) and the anode metal (112'). This connection structure is illustrated on the left side of Fig. 2b.

In the illustrated embodiment, the planarization layer is provided in two layers (107-1 and 107-2). This is to accommodate the wiring structure that stretches to fit the high-resolution screen, as described above.

The first planarization layer (107-1) planarizes the upper portion of various circuit elements (thin film transistors, capacitors, wires, etc.) on the substrate. A protective layer (109) made of an inorganic material may be positioned between the first planarization layer (107-1) and the circuit elements. Various functional metal layers may be disposed on the first planarization layer (107-1). Organic light-emitting elements (112, 114, 116) may be disposed on the second planarization layer (107-2). At this time, a metal layer (112') connected to the organic light-emitting elements may be disposed on the second planarization layer (107-2).

An encapsulating layer (120) covers the upper part of the organic light-emitting element. The encapsulating layer may be composed of an inorganic film made of glass, metal, aluminum oxide (AlOx), or silicon (Si)-based material, or may have a structure in which organic films and inorganic films are alternately laminated. The inorganic films (121-1, 121-2) serve to block the penetration of moisture or oxygen, and the organic film (122) serves to flatten the surface of the inorganic films (121-1, 121-2). The reason for forming the encapsulating layer as multiple thin film layers is to make the migration path of moisture or oxygen longer and more complex compared to a single layer, thereby making it difficult for moisture/oxygen to penetrate to the organic light-emitting element.

The organic film (122) has a certain degree of fluidity and can flow to the outside of the non-display area during application. Accordingly, blocking structures (190-1, 190-2) are arranged to control the organic film (122) from spreading to the non-display area (I/A). Although two blocking structures (dams) are illustrated in FIG. 2B, one or more dams (190-1, 190-2) may be arranged. In addition, the dams (190-1, 190-2) may be arranged to surround the display area (A/A) or may be arranged within the display area (A/A). The dams (190-1, 190-2) may be formed in multiple layers using at least one material. For example, the dams (190-1, 190-2) may be made using a material used to form the bank (110) and the spacer.

The inventors discovered vulnerabilities in the outer structure of an organic light-emitting display device, as illustrated in Fig. 2b. One of these vulnerabilities is that, because the planarization layer is composed of two layers, a sharp height difference occurs at the ends of the two planarization layers compared to adjacent portions.

An encapsulating layer (120) is laminated on top of the planarization layers (107-1, 107-2), and the organic film (122) included in the encapsulating layer (120) is fluid, so it covers the entire planarization layers (107-1, 107-2) and spreads to the outer edge (corner) of the substrate. However, if the planarization layers (107-1, 107-2) disappear abruptly at a certain point, it becomes difficult to prevent the organic film (122) from spreading far to the edge of the substrate. As can be seen in Fig. 2b, if the planarization layers (107-1, 107-2) are high, the organic film (122) thereon may spread directly over the dam.

In order to suppress the distance over which the organic film (122) flows, the dams (190-1, 190-2) must be raised higher, or the distance between the end of the flattening layer and the dams (190-1, 190-2) must be sufficiently large. However, increasing the distance is a difficult design to adopt because it increases the non-display area (bezel). Therefore, the inventors of the present invention devised a structure that prevents the overflow of the organic film caused by increasing the height of the flattening layer.

FIG. 3 is a drawing showing an outer structure applied to an organic light-emitting display device according to another embodiment of the present specification.

Among the components of FIG. 3, duplicate descriptions of the same components as in FIGS. 1 and 2 are omitted. An organic light-emitting display device according to one embodiment of the present specification may include a structure in which overflow of an organic film of an encapsulating layer is suppressed. The organic film overflow suppression structure may be provided by controlling the application ranges of the first planarization layer (307-1) and the second planarization layer (307-2). For example, the organic film overflow suppression structure may be provided by applying the second planarization layer (307-2) to an outer edge further than the first planarization layer (307-1).

An organic light-emitting display device according to the present embodiment includes a substrate (301) having a display area (A/A) and a non-display area (I/A) surrounding the display area; a first planarization layer (307-1) that planarizes an upper portion of a thin film transistor included in a pixel of the display area (A/A); and a second planarization layer (307-2) positioned on the first planarization layer (307-1) and extending further in the non-display area (I/A) toward an edge of the substrate (301) than the first planarization layer (307-1). The first planarization layer (307-1) and the second planarization layer (307-2) may be formed of the same material.

The first planarization layer (307-1) and the second planarization layer (307-2) may cover the entirety of the display area (A/A) and a portion of the non-display area (I/A). In particular, the second planarization layer (307-2) may directly cover at least a portion of the driving circuit portion arranged in the non-display area (I/A). The first planarization layer (307-1) may also directly cover a portion of the driving circuit portion. The driving circuit portion may be a gate driving circuit portion (GIP) formed on the substrate (301).

The above organic light-emitting display device further includes an organic light-emitting element (312, 314, 316) on the second planarization layer (307-2); and an encapsulating layer (120) covering the organic light-emitting element (312, 314, 316). At this time, the encapsulating layer (120) may include a first inorganic film on the organic light-emitting element (312, 314, 316); an organic film (322) on the first inorganic film (321-1); and a second inorganic film (321-2) on the organic film (322). In the organic light-emitting display device according to the present embodiment, since the second planarization layer (307-2) extends further toward the edge of the substrate (301) than the first planarization layer (307-1), the change in the height of the end portions of the planarization layers is alleviated, thereby suppressing the overflow of the organic film (322). That is, the organic light-emitting display device according to the present embodiment has a stepped structure in which the stacking height is high in the portion where the first planarization layer (307-1) is finished, and the stacking height is low in the portion where only the second planarization layer (307-2) is present, thereby reducing the spreading range of the organic film (322).

The above organic light emitting display device may further include a bank (310) on the second planarization layer (307-2). The bank (310) demarcates a boundary between (sub) pixels. That is, an area where the bank (310) is open becomes a light emitting area and a single light emitting unit. The bank (310) may cover the side surface of the second planarization layer (307-2). The bank (310) may also be used to form a blocking structure.

The above organic light-emitting display device may further include a blocking structure (190-1, 190-2) provided to block the flow of the organic film (322) included in the encapsulation layer (120) in the non-display area (I/A). A plurality of the blocking structures (190-1, 190-2) may be provided. For example, the blocking structures (190-1, 190-2) may include a first blocking structure (190-1) that is closer to the second planarization layer (307-2); and a second blocking structure (190-2) that is closer to the edge of the substrate (301). In this case, the first blocking structure (190-1) may have a relatively lower height and may be made of the same material as the second planarization layer (307-2). In addition, the second blocking structure (190-2) may be relatively taller and may be formed by sequentially stacking the same material as the second flattening layer (307-2) and the bank (310).

At the end of the planarization layer in the non-display area (I/A), a power wiring (308-1) for transmitting a low-level power (V _SS ) to the organic light-emitting element may be arranged. The power wiring (308-1) may be formed of the same material as the source or drain electrode of the thin film transistor.

Meanwhile, a metal layer (312') may be provided to transmit power supplied through the power wire (308-1) to the organic light-emitting element. The metal layer (312') connects the power wire (308-1) and the cathode electrode (316) of the organic light-emitting element. At this time, the metal layer (312') may extend along the side (side wall) of the second planarization layer (307-2). The metal layer (312') may be made of the same material as the anode electrode (312) of the organic light-emitting element. The metal layer (312') may be provided with an outgassing hole to discharge gas generated in the planarization layer thereunder.

When the organic film overflow suppression structure is provided as described above, a narrow bezel can be implemented by suppressing an increase in the non-display area (I/A). In addition, the organic film overflow suppression structure can increase production yield by reducing manufacturing defects in the encapsulation layer (120).

Although the embodiments of the present specification have been described in detail with reference to the attached drawings, the present specification is not necessarily limited to these embodiments, and various modifications may be implemented without departing from the technical spirit thereof. Therefore, the embodiments disclosed in this specification are not intended to limit the technical spirit of the present invention, but to explain it, and the scope of the technical spirit of the present invention is not limited by these embodiments. Each feature of the various embodiments of the present invention may be partially or wholly combined or combined with each other, and may be technically linked and operated in various ways by those skilled in the art, and each embodiment may be implemented independently of each other or may be implemented together in a related relationship.

The scope of protection of the present invention should be interpreted by the claims below, and all technical ideas within the scope equivalent thereto should be interpreted as being included in the scope of the rights of the present invention.

Claims (16)

A substrate having a display area and a non-display area surrounding the display area;
A first planarizing layer that planarizes the upper portion of the thin film transistor included in the pixel of the display area;
A second planarization layer positioned on the first planarization layer and extending further in the edge direction of the substrate than the first planarization layer in the non-display area;
An organic light-emitting element on the second planarization layer; and
Including a sealing layer covering the above organic light-emitting element,
The encapsulating layer comprises a first inorganic film on the organic light-emitting element; an organic film on the first inorganic film; and a second inorganic film on the organic film.
The second planarization layer covers the exposed area from the first planarization layer within the non-display area to planarize the exposed area,
An organic light-emitting display device in which the upper surface of the second flattening layer in the exposed area overlaps the organic film. delete In the first paragraph,
An organic light-emitting display device in which the second planarization layer extends further toward the edge of the substrate than the first planarization layer, thereby alleviating changes in the height of the terminal portions of the planarization layers and suppressing overflow of the organic film. In the first paragraph,
An organic light-emitting display device further comprising a bank on the second planarization layer. In the fourth paragraph,
The above bank is an organic light-emitting display device covering a side surface of the second flattening layer. In the fourth paragraph,
An organic light-emitting display device further comprising a blocking structure in the non-display area, the blocking structure being configured to block the flow of an organic film included in the above-described encapsulation layer. In paragraph 6,
An organic light-emitting display device, wherein the blocking structure comprises a first blocking structure closer to the second planarization layer; and a second blocking structure closer to an edge of the substrate. In paragraph 7,
An organic light-emitting display device in which the first blocking structure is made of the same material as the second planarization layer. In paragraph 7,
The above second blocking structure is an organic light-emitting display device formed by sequentially stacking the same material as the second planarization layer and the bank. In the first paragraph,
A power wiring arranged in the non-display area and transmitting low-level power to the organic light-emitting element;
An organic light-emitting display device further comprising a metal layer connecting the power wiring and the cathode electrode of the organic light-emitting element. In Article 10,
An organic light-emitting display device in which the metal layer extends along the side of the second planarization layer. In Article 10,
An organic light-emitting display device in which the metal layer is made of the same material as the anode electrode of the organic light-emitting element. In the first paragraph,
An organic light-emitting display device in which the second planarization layer directly covers at least a portion of the driving circuit portion disposed in the non-display area. In the 13th paragraph,
An organic light-emitting display device in which the above driving circuit unit is a gate driving circuit unit formed on the substrate. In the first paragraph,
An organic light-emitting display device in which the first planarization layer and the second planarization layer cover all of the display area and part of the non-display area. In Article 15,
An organic light-emitting display device in which the first planarization layer and the second planarization layer are formed of the same material.