KR102929876B1 - Wafer processing method - Google Patents

Abstract

An invention for a substrate processing method is disclosed. The substrate processing method of the present invention is characterized by including: a step of seating a wafer portion on a chuck table; a step of loading a ring cover portion onto the chuck table to restrain the wafer portion on the chuck table; a step of treating the wafer portion by spraying a treatment liquid onto the wafer portion by a spray suction arm module; a step of unloading the ring cover portion from the chuck table; and a step of treating the wafer portion by spraying a cleaning liquid onto the wafer portion by a spray arm module.

Description

Wafer processing method

The present invention relates to a substrate processing method, and more specifically, to a substrate processing method capable of shortening the processing time of a wafer portion and improving the processing and cleaning performance of a wafer portion.

Typically, semiconductor manufacturing involves an etching process to etch the wafer, a singulation process to cut the wafer into multiple dies, and a cleaning process to clean the wafer. Substrate processing equipment is used in the wafer etching and cleaning processes.

The substrate processing device is installed so as to be rotatable and is composed of a rotary table on which a wafer portion is mounted on the upper portion, and a sealing ring that is connected in a ring shape to the edge area of the rotary table. While the rotary table is rotating, a processing solution is supplied to the wafer portion mounted on the rotary table.

The background technology of the present invention is disclosed in Korean Patent Publication No. 10-2016-0122067 (published on October 21, 2016, title: Wafer processing device and sealing ring for wafer processing device).

The present invention was created to improve the above-mentioned problems, and the purpose of the present invention is to provide a substrate processing method that can shorten the processing time of a wafer portion and improve the processing and cleaning performance of the wafer portion.

A substrate processing method according to the present invention is characterized by including: a step of seating a wafer portion on a chuck table; a step of loading a ring cover portion onto the chuck table to restrain the wafer portion to the chuck table; a step of treating the wafer portion by spraying a treatment liquid onto the wafer portion by a spray suction arm module; a step of unloading the ring cover portion from the chuck table; and a step of treating the wafer portion by spraying a cleaning liquid onto the wafer portion by the spray arm module.

The step of seating the wafer portion on the chuck table may include a step of the transfer device holding the wafer portion transferred from the second transfer module; and a step of seating the wafer portion on the chuck table as the transfer device is lowered.

The step of loading the ring cover part onto the chuck table to restrain the wafer part to the chuck table may include the step of restraining the ring cover part to a gripping unit of a tilting device; the step of the tilting device coupling the ring cover part to an upper side of the chuck table; the step of the chucking module of the chuck table restraining the ring cover part; the step of the gripping unit releasing restraint of the ring cover part; and the step of the tilting device moving to the outside of the chuck table.

The step of treating the wafer portion by spraying the treatment liquid onto the wafer portion by the spray suction arm module may include a step of moving the spray suction arm module upwards of the wafer portion; and a step of spraying the treatment liquid onto the wafer portion by the spray suction arm module within a certain range.

The step of unloading the ring cover part from the chuck table may include a step of rotating the tilting device to be positioned above the ring cover part; a step of a gripping unit of the tilting device to restrain the recovery part; a step of a chucking module of the chuck table to release restraint of the ring cover part; and a step of rotating the ring cover part by the tilting device to move it to the outside of the chuck table.

The step of using the spray arm module to spray a cleaning solution onto the wafer portion to clean the wafer portion may include a step of moving the spray arm module upwards of the wafer portion; and a step of using the spray arm module to swing within a certain angle range to spray a cleaning solution onto the wafer portion to clean the wafer portion.

The method may further include a step of the injection arm module spraying a cleaning solution onto the wafer portion to perform intermediate cleaning of the wafer portion before the step of unloading the ring cover portion from the chuck table.

The step of the spray arm module spraying a cleaning solution onto the wafer portion to intermediately clean the wafer portion may include a step of the spray suction arm module moving to the outside of the wafer portion; a step of the spray arm module moving to the upper side of the wafer portion; and a step of spraying the cleaning solution onto the wafer portion while the spray arm module swings within a certain angle range.

After the step of the above-mentioned spray arm module spraying the cleaning solution onto the wafer portion to intermediately clean the wafer portion, the step of first drying the wafer portion on the chuck table may be further included.

After the step of the above-mentioned spray arm module spraying the cleaning solution onto the wafer portion to clean the wafer portion, the step of secondary drying the wafer portion on the chuck table may be further included.

According to the present invention, the transfer device can receive a wafer portion from a second transfer module even in a narrow space, place it on a chuck table, and discharge the processed wafer portion from the chuck table.

Furthermore, according to the present invention, the ring cover part can be easily secured and released from the chuck table device as the tilting device rotates. Furthermore, the chucking module of the chuck table device can quickly secure and release the ring cover part. Therefore, the processing and cleaning time of the wafer can be shortened.

Furthermore, according to the present invention, since the injection arm module and the injection suction arm module process the wafer portion, the wafer portion can be processed using various types of processing liquids or cleaning liquids. Accordingly, the wafer portion processing process can be implemented in various ways.

In addition, according to the present invention, the chuck table device includes a wafer restraint portion that restrains a retaining portion of a wafer portion, a cover restraint portion that restrains a ring cover portion, and a moving module that moves a vacuum chuck portion to pull the wafer portion in a radial direction. Therefore, a wafer expanding process is possible in which the wafer restraint portion restrains the retaining portion of the wafer portion to the chuck table, and the moving module moves the vacuum chuck portion to widen the gap between the dies of the wafer portion. In addition, a debonding cleaning process is possible in which the wafer portion is processed in a state in which the cover restraint portion restrains the ring cover portion on the upper side of the vacuum chuck portion.

Figure 1 is a plan view schematically illustrating a wafer portion according to one embodiment of the present invention.
FIG. 2 is a block diagram schematically illustrating a substrate processing device according to one embodiment of the present invention.
FIG. 3 is a plan view schematically illustrating a vision aligner in a substrate processing device according to one embodiment of the present invention.
FIG. 4 is a plan view schematically illustrating a first processing chamber and a second processing chamber in a substrate processing device according to one embodiment of the present invention.
FIG. 5 is a side view schematically illustrating a transfer device in a substrate processing device according to one embodiment of the present invention.
FIG. 6 is a plan view schematically illustrating a transfer device in a substrate processing device according to one embodiment of the present invention.
FIG. 7 is a side view schematically illustrating a gripper portion of a transfer device of a substrate processing device according to one embodiment of the present invention.
FIG. 8 is a side view schematically illustrating a state in which a gripper portion is withdrawn from a transfer device of a substrate processing device according to one embodiment of the present invention.
FIG. 9 is a side view schematically illustrating a tilting device in a substrate processing device according to one embodiment of the present invention.
FIG. 10 is a side view schematically illustrating a state in which a gripping unit is lowered in a tilting device of a substrate processing device according to one embodiment of the present invention.
FIG. 11 is a plan view schematically illustrating a grip unit of a tilting device in a substrate processing device according to one embodiment of the present invention.
FIG. 12 is a rear view schematically illustrating a grip unit of a tilting device in a substrate processing device according to one embodiment of the present invention.
FIG. 13 is an enlarged view schematically illustrating a grip unit of a tilting device in a substrate processing device according to one embodiment of the present invention.
FIG. 14 is a cross-sectional view schematically illustrating a chuck table device in a substrate processing device according to one embodiment of the present invention.
FIG. 15 is a plan view schematically illustrating a chucking module of a chuck table device in a substrate processing device according to one embodiment of the present invention.
FIG. 16 is an enlarged view schematically illustrating a chucking module in a chuck table device of a substrate processing device according to one embodiment of the present invention.
FIG. 17 is a cross-sectional view schematically illustrating a state in which a chucking module restrains a ring cover portion in a chuck table device of a substrate processing device according to one embodiment of the present invention.
Figure 18 is a plan view schematically illustrating a treatment liquid spraying device of a substrate treatment device according to one embodiment of the present invention.
FIG. 19 is a perspective view schematically illustrating a spray arm module in a treatment liquid spray device of a substrate treatment device according to one embodiment of the present invention.
FIG. 20 is an enlarged view schematically illustrating a first injection nozzle section of a spray arm module in a treatment liquid injection device of a substrate treatment device according to one embodiment of the present invention.
FIG. 21 is an enlarged view schematically illustrating a second injection nozzle section and a second suction nozzle section of a spray suction arm module in a treatment liquid spray device of a substrate treatment device according to one embodiment of the present invention.
FIG. 22 is a schematic drawing of a suction tank unit connected to a second suction nozzle unit of a spray suction arm module in a treatment liquid spray device of a substrate treatment device according to one embodiment of the present invention.
Figure 23 is a drawing schematically illustrating a substrate processing method according to one embodiment of the present invention.
Figure 24 is a flowchart schematically illustrating a substrate processing method according to one embodiment of the present invention.

Hereinafter, an embodiment of a substrate processing method according to the present invention will be described with reference to the attached drawings. In the process of explaining the substrate processing method, the thickness of lines and the sizes of components depicted in the drawings may be exaggerated for clarity and convenience. Furthermore, the terms described below are defined based on their functions in the present invention and may vary depending on the intentions or practices of the user or operator. Therefore, the definitions of these terms should be based on the contents throughout this specification.

FIG. 1 is a plan view schematically illustrating a wafer portion according to one embodiment of the present invention, FIG. 2 is a block diagram schematically illustrating a substrate processing apparatus according to one embodiment of the present invention, and FIG. 3 is a plan view schematically illustrating a vision aligner in a substrate processing apparatus according to one embodiment of the present invention.

Referring to FIGS. 1 to 3, a substrate processing device (1) according to one embodiment of the present invention processes a wafer portion (10). The ring frame wafer portion (10) etched in an etching process is cut into a matrix shape in a singulation process. The ring frame wafer portion (10) includes a wafer (11) including a plurality of dies cut and arranged in a matrix shape, an adhesive sheet (12) to which the wafer (11) is attached, and a retaining portion (13) connected to the periphery of the adhesive sheet (12) to tautly support the adhesive sheet (12). The adhesive sheet (12) is formed of a material that can be stretched in the horizontal direction. As the adhesive sheet (12) is tautly pulled by the retaining portion (13), the plurality of dies are fixed in position, and the thin die maintains a flat plate shape. Hereinafter, the ring frame wafer portion (10) will be referred to as a wafer portion (10).

A wafer cassette (20) is a front-opening unified pod (FOUP) that loads a plurality of wafer sections (10) into an internal space that is sealed from the outside and moves the wafer sections (10) between unit process facilities. The wafer cassette (20) transferred to the unit process facility is placed on the upper surface of a load port module (not shown) arranged on one side of the unit process facility, and the wafer section cassette door (not shown) is opened while sealing the internal space of the wafer cassette (20) from the outside. Accordingly, the wafer section (10) can be moved between unit process facilities while preventing contamination from the external environment.

The wafer portion (10) loaded from the wafer cassette (20) is absorbed by the first transfer module (50) and loaded into the buffer unit (30). The buffer unit (30) includes two free slots (not shown) and two post slots (not shown). A vacuum suction robot that absorbs the wafer portion (10) by vacuum pressure can be applied to the first transfer module (50).

The wafer portion (10) loaded on the buffer unit (30) is mounted on the vision aligner (40) by the first transfer module (50). The vision aligner (40) includes an aligner table (41) on which the wafer portion (10) is placed, and a vision portion (not shown) that irradiates light onto the aligner table (41) to read the wafer portion (10). The vision aligner (40) can rotate about 4° around the center of the aligner table (41) and move about 7 mm left and right around the center of the aligner table (41). The vision portion can read the position of the wafer portion (10) and the center of the wafer (11) to align the position of the wafer portion (10). At this time, the vision portion reads whether the center of the wafer (11) and the center of the retaining portion (13) are aligned, and aligns the wafer portion (10) so that the center of the wafer (11) is aligned in the correct position.

The wafer portion (10) aligned in the vision aligner (40) is fed into the first processing chamber (70) and the second processing chamber (80) by the second transport module (60). In the first processing chamber (70), the wafer portion (10) is processed while spraying the processing liquid onto the wafer portion (10). A plurality of second processing chambers (80) are installed. In the second processing chamber (80), the wafer portion (10) is processed while simultaneously spraying the processing liquid onto the wafer portion (10) and sucking up foreign substances floating on the upper side of the processing liquid.

FIG. 4 is a plan view schematically illustrating a first processing chamber and a second processing chamber in a substrate processing device according to one embodiment of the present invention.

Referring to FIG. 4, an ionizer (102), a transfer device (100), a tilting device (200), a chuck table device (300), a spray device (400), and a suction device (500) are installed in the first processing chamber (70). An ionizer (102), a transfer device (100), a tilting device (200), a chuck table device (300), and a spray device (400) are installed in the second processing chamber (80).

An ionizer (102) is installed on the upper side of each of the first processing chamber (70) and the second processing chamber (80). The ionizer (102) removes static electricity generated during the processing and non-processing processes of the wafer section (10). Since the ionizer (102) prevents static electricity from being generated inside the wafer section (10), the first processing chamber (70), and the second processing chamber (80), it is possible to prevent foreign substances from being reattached to the wafer section (10) due to static electricity.

When air is supplied as a supply gas to the ionizer (102) and purified water (DI water) is supplied as a cleaning solution, the positive and negative ions ionized through the ionizer (102) can be sprayed onto the upper portion of the wafer section (10) together with the cleaning solution.

Before purified water containing positive and negative ions was sprayed onto the upper portion of the wafer portion (10), the electrostatic potential of the wafer portion (10) was measured to be approximately 3.6 KV. On the other hand, after purified water containing positive and negative ions was sprayed onto the upper portion of the wafer portion (10), the electrostatic potential was measured to be approximately -0.10 to -0.17 KV. This negative voltage is indicated by the fact that by increasing the amount of (+) ions generated by the ionizer (102), the electrostatic potential of the wafer portion (10) can be controlled to be close to the ideal value of "0".

FIG. 5 is a side view schematically illustrating a transfer device in a substrate processing apparatus according to an embodiment of the present invention, FIG. 6 is a plan view schematically illustrating a transfer device in a substrate processing apparatus according to an embodiment of the present invention, FIG. 7 is a side view schematically illustrating a gripper part in a transfer device of a substrate processing apparatus according to an embodiment of the present invention, and FIG. 8 is a side view schematically illustrating a state in which a gripper part is withdrawn in a transfer device of a substrate processing apparatus according to an embodiment of the present invention.

Referring to FIGS. 5 to 8, the transfer device (100) is located on both sides of the chuck table device (300). It is installed. The transfer device (100) places the wafer portion (10) transferred from the second transfer module (60) on the upper side of the chuck table device (300).

The transfer device (100) includes a lifting unit (120), a transfer unit (130), and a gripper unit (140).

The lifting unit (120) is installed on the outside of the chuck table (320, 330). A pair of lifting units (120) are installed on both sides of the chuck table (320, 330) in the diametric direction. The lifting unit (120) is installed on the lower side of the base unit (110). The lifting unit (120) can be applied in various forms, such as a ball screw type, a linear motor type, and a belt drive type.

The transfer unit (130) is connected to the lifting unit (120) so that it can be raised and lowered by the lifting unit (120), and is placed on the outside of the chuck table (320, 330). The transfer unit (130) is installed on each of the lifting units (120). The transfer unit (130) is placed on the upper side of the base unit (110).

The gripper part (140) is installed to be reciprocally movable on the transfer part (130) so as to hold or release the wafer part (10). The gripper parts (140) are installed on each of the pair of transfer parts (130). The pair of gripper parts (140) support both sides of the ring frame part (15) of the wafer part (10). The gripper part (140) receives the wafer part (10) transferred by the second transfer module (60), and as it is lowered by the lifting part (120), the gripper part (140) is placed on the chuck table (320, 330).

Since the lifting unit (120) and the transfer unit (130) are arranged on the outside of the chuck table (320, 330), and the gripper unit (140) is arranged vertically parallel to the lifting unit (120) and the transfer unit (130), the installation space of the gripper unit (140) and the movement trajectory of the gripper unit (140) can be significantly reduced. Accordingly, even in a narrow space, the wafer unit (10) can be received from the second transfer module (60), placed on the chuck table (320, 330), and the processed wafer unit (10) can be discharged from the chuck table (320, 330).

The lifting unit (120) includes an lifting arm drive unit (402) disposed on the lower side of the transfer unit (130), a power transmission unit (123) connected to the lifting arm drive unit (402), and a linear guide unit (124) connected to the power transmission unit (123) to elevate the transfer unit (130). The lifting arm drive unit (402) may be disposed outside the case unit (121), and the power transmission unit (123) and the linear guide unit (124) may be disposed inside the case unit (121). When the lifting arm drive unit (402) transmits power to the power transmission unit (123), the linear guide unit (124) is elevated in the case unit (121), thereby allowing the transfer unit (130) to move up and down.

A motor unit can be applied to the lifting arm drive unit (402). The power transmission unit (123) can be a ball screw rotated by the lifting arm drive unit (402).

The linear guide part (124) includes a fixed guide part (125) arranged vertically parallel to the lifting arm drive part (402), a moving guide part (126) that is connected to the power transmission part (123) so as to be moved by the power transmission part (123) and an lifting rod part (127) that is connected to the moving guide and the transfer part (130). The fixed guide part (125) may be a fixed rail part arranged vertically parallel to the inside of the case part (121). The moving guide part (126) may be slidably connected to the fixed guide part (125). The lifting rod part (127) is installed in the case part (121) so as to be moved vertically. When the lifting arm drive unit (402) is driven, the moving guide unit (126) moves along the fixed guide unit (125), and the lifting load unit (127) is moved by the moving guide unit (126). Therefore, the up-down stroke of the transfer unit (130) can be accurately controlled.

The gripper part (140) includes a gripper driving part (141), one or more pinion parts (142), a plurality of rack gear parts (145, 146), and a finger part (147).

The gripper drive unit (141) is installed in the transfer unit (130). The gripper drive unit (141) can be applied in various forms, such as a hydraulic cylinder, a ball screw, or a belt-driven motor unit.

At least one pinion part (142) is installed and connected to the gripper drive part (141) so that it is moved by the gripper drive part (141).

A plurality of rack gear parts (145, 146) are installed to mesh with the pinion part (142) and are moved by the rotation of the pinion part (142). The rack gear parts (145, 146) are installed to be movable on both sides of the pinion part (142). When one pinion part (142) is installed, two rack gear parts (145, 146) can be installed to mesh with both sides of the pinion part (142). When two pinion parts (142) are installed, three rack gear parts (145, 146) can be installed to mesh with the two pinion parts (142).

The finger portion (147) extends from one rack gear portion (146) to hold the wafer portion (10). At this time, the finger portion (147) is installed on one rack gear portion (146) that moves furthest from the transfer portion (130) when the gripper drive portion (141) is driven.

Below, the gripper part (140) in which one pinion part (142) and two rack gear parts (145, 146) are installed will be described.

A pinion tooth portion (not shown) is formed on the outer surface of the pinion portion (142). At this time, the plurality of rack gear portions (145, 146) include a first rack gear portion (145) that is installed to mesh with the pinion portion (142), and a second rack gear portion (146) that is installed to mesh with the pinion portion (142), reciprocates by the rotation of the pinion portion (142), and has a finger portion (147) that extends. At this time, the pinion portion (142) is arranged between the first rack gear portion (145) and the second rack gear portion (146). In addition, the pinion tooth portion of the pinion portion (142) is installed to mesh with the upper side of the first rack gear portion (145) and the lower side of the second rack gear portion (146).

The first rack gear part (145) is fixed to the housing part (131) of the transfer part (130), and the second rack gear part (146) is moved by the translation and rotation of the pinion part (142). When the gripper drive part (141) is driven, the pinion part (142) simultaneously performs the translational and rotational movements along the first rack gear part (145), so the second rack gear part (146) is moved by a distance equal to the translational distance and rotational movement of the pinion part (142). Accordingly, the second rack gear part (146) can be moved about twice the distance by which the gripper drive part (141) moves the pinion part (142), so the stroke of the finger part (147) can be significantly increased compared to the stroke of the gripper drive part (141).

The pinion part (142) is connected to the gripper driving part (141), and includes a slider part (143) that is installed so as to be reciprocally movable between the first rack gear part (145) and the second rack gear part (146), and a pinion gear part (144) that is rotatably coupled to the slider part (143) and moves the second rack gear part (146) while moving together with the slider part (143). The slider part (143) is arranged parallel to the first rack gear part (145) and the second rack gear part (146). The pinion gear part (144) performs a linear translational movement together with the slider part (143) when the gripper driving part (141) is driven, and performs a rotational movement by engaging with the first rack gear part (145).

The gripper driving unit (141) includes a cylinder unit (141a) installed in the transfer unit (130), a movable rod unit (141b) movably installed in the cylinder unit (141a), and a connecting link unit (141c) connected to the movable rod unit (141b) and the slider unit (143). The connecting link unit (141c) extends upward from the movable rod unit (141b) of the cylinder unit (141a) and is connected to the slider unit (143). The connecting link unit (141c) is moved in a linear direction by the movable rod unit (141b) of the cylinder unit (141a). As the movable rod unit (141b) moves, the slider unit (143) moves.

The finger portion (147) includes a vacuum suction portion (148) that holds the wafer portion (10) by vacuum suction. The finger portion (147) may be provided with two or more vacuum suction portions (148). The vacuum suction portion (148) vacuum-suctions the ring frame portion (15) of the wafer portion (10). A vacuum path portion (not shown) may be formed inside the finger portion (147) to form a vacuum in the vacuum suction portion (148).

FIG. 9 is a side view schematically illustrating a tilting device in a substrate processing apparatus according to an embodiment of the present invention, FIG. 10 is a side view schematically illustrating a state in which a gripping unit is lowered in a tilting device of a substrate processing apparatus according to an embodiment of the present invention, FIG. 11 is a plan view schematically illustrating a gripping unit of a tilting device in a substrate processing apparatus according to an embodiment of the present invention, FIG. 12 is a rear view schematically illustrating a gripping unit of a tilting device in a substrate processing apparatus according to an embodiment of the present invention, and FIG. 13 is an enlarged view schematically illustrating a gripping unit of a tilting device in a substrate processing apparatus according to an embodiment of the present invention.

Referring to FIGS. 9 to 13, the tilting device (200) includes a tilting motor unit (210), a tilting unit (220), an elevating unit (230), and a gripping unit (240).

A chuck table device (300) is installed on the lower side of the tilting device (200). The chuck table device (300) is installed to be rotatable by a chuck drive unit (310). A motor unit of a belt drive type or a gear drive type can be applied to the chuck drive unit (310).

The chuck table device (300) is installed on the upper side of the rotary shaft part (311) so as to be rotated by the rotary shaft part (311). A wafer part (10), such as a wafer part (10), is mounted on the vacuum chuck part (330). A plurality of chuck pin parts (303) are installed to protrude around the periphery of the vacuum chuck part (330) so as to fix the ring cover part (201).

The tilting device (200) grips the ring cover portion (201) and connects it to the chuck table device (300). A plurality of fixing holes (202) are formed on the lower side of the circumference of the ring cover portion (201) so that the ring cover portion (201) can be inserted into a plurality of chuck pin portions (303) when the ring cover portion (201) is mounted on the chuck table device (300). In addition, a plurality of restraining groove portions (203: see Fig. 17) are formed on the outer surface of the circumference of the ring cover portion (201) so that the ring cover portion (201) can be gripped by the gripping unit (240). The plurality of restraining groove portions (203) are formed to face the locking pin portion (259) of the gripping unit (240). The ring cover part (201) seals the perimeter of the wafer part (10) mounted on the vacuum chuck part (330) to prevent the processing liquid from penetrating into the perimeter of the wafer part (10) and the inside of the ring cover part (201) when processing the wafer part (10).

The tilting unit (220) is rotatably connected to the tilting shaft portion (212) of the tilting motor portion (210). The tilting unit (220) is provided with a tilting arm portion (222) so as to be connected to the tilting shaft portion (212) of the tilting motor portion (210). The tilting unit (220) maintains an upwardly erected state in a standby state. The tilting motor portion (210) rotates the tilting unit (220) horizontally toward the upper side of the vacuum chuck portion (330) when the ring cover portion (201) is coupled to the periphery of the vacuum chuck portion (330). The tilting unit (220) is provided with a setting module (not shown) that can set the horizontal initial position of the gripping unit (240) so that the gripping unit (240) can be positioned horizontally at the coupling position of the ring cover portion (201).

The lifting unit (230) is installed in the tilting unit (220). The lifting unit (230) is installed in the center of the tilting unit (220). The lifting rod part (233) of the lifting unit (230) is installed to move through the center of the tilting unit (220). A plurality of lifting guide parts (235) are installed in the tilting unit (220) to guide the lifting of the lifting unit (230).

The gripping unit (240) is connected to the lifting unit (230) so that it can be raised and lowered by the lifting unit (230) and grips the ring cover part (201). Before the wafer part (10) is placed on the vacuum chuck part (330), the gripping unit (240) is positioned in a standby state in which it is vertically erected while gripping the ring cover part (201).

When the wafer unit (10) is placed on the vacuum chuck unit (330), the tilting motor unit (210) is driven to cause the tilting unit (220) and the gripping unit (240) to rotate horizontally. When the rotation of the tilting unit (220) and the gripping unit (240) is completed, the lifting unit (230) is driven to cause the gripping unit (240) to move downward of the tilting unit (220). At this time, the tilting unit (220) does not descend together with the lifting unit (230) and remains horizontal.

As the gripping unit (240) is lowered, the ring cover part (201) is seated on the vacuum chuck part (330). The gripping unit (240) is maintained in a lowered state by the lifting unit (230) so as to continuously maintain the state in which the ring cover part (201) is coupled to the vacuum chuck part (330) until the ring cover part (201) is completely positioned (chucking) on the chucking module (350: see FIG. 15) of the vacuum chuck part (330).

When the coupling of the ring cover part (201) to the vacuum chuck part (330) is completed, the lifting unit (230) is driven so that the gripping unit (240) moves upward and comes into contact with or is slightly separated from the lower side of the tilting unit (220). When the gripping unit (240) is completely moved upward, the tilting motor part (210) is driven so that the tilting unit (220) and the gripping unit (240) are rotated to a standby state in which they are vertically or nearly vertically erected.

The position correction unit (260) is installed so as to have a gap (float) between the lifting unit (230) and the gripping unit (240) to correct the coupling deviation of the gripping unit (240) when the gripping unit (240) couples the ring cover part (201) to the vacuum chuck part (330). The coupling deviation refers to the deviation in which the locking pin part (259) of the gripping unit (240) is misaligned with the restraining groove part (203) of the ring cover part (201) when the gripping unit (240) is coupled to the ring cover part (201).

The position correction unit (260) includes a thrust member (261) and an elastic member (268).

The trust member (261) is connected to the lifting member (135) and the floating plate (243) by multiple means so that the floating plate (243) has a gap equal to the engagement deviation when the ring cover member (201) is locked. The elastic member (268) is installed in the core member (241) and applies elastic force to the floating plate (243) so that the floating plate (243) returns to its original position when the ring cover member (201) is unlocked.

When the gripping unit (240) is lowered by the lifting unit (230) to couple the ring cover part (201) to the vacuum chuck part (330), a coupling deviation may occur as the fixing hole part (202) of the ring cover part (201) is slightly misaligned with the chuck pin part (303) of the vacuum chuck part (330). At this time, the position correction unit (260) allows the gripping unit (240) to move horizontally within the coupling deviation range.

As described above, since the tilting unit (220) and the gripping unit (240) are rotated by the tilting motor unit (210), the rotation angle of the tilting motor unit (210) can be precisely controlled to precisely set the height (level) of the gripping unit (240) and the sealing ring joining position. In addition, the gripping unit (240) and the tilting unit (220) are initially set to the joining position of the ring cover unit (201). Therefore, the time for setting the gripping position of the gripping unit (240) can be significantly shortened.

Since the tilting unit (220) is rotatably installed on the tilting motor unit (210), when a breakdown or power outage occurs in the tilting motor unit (210), the tilting motor unit (210) maintains its current state. Therefore, when a breakdown or power outage occurs, the tilting unit (220) and the gripping unit (240) can be prevented from falling and colliding with the vacuum chuck unit (330).

In addition, since the gripping unit (240) is installed with a gap in the lifting unit (230) by the position correction unit (260), when the ring cover part (201) is coupled to the vacuum chuck part (330) in a state where the gripping unit (240) is slightly misaligned, the position correction unit (260) allows the gripping unit (240) to correct the coupling deviation. Accordingly, by preventing wear due to the coupling deviation of the chuck pin part (303) of the ring cover part (201) and the vacuum chuck part (330), it is possible to prevent foreign substances from being generated in the chuck pin part (303) and the ring cover part (201). In addition, since it is possible to prevent foreign substances from being introduced into the wafer part (10) processed below the gripping unit (240) and the ring cover part (201), it is possible to minimize contamination or defects in the wafer part (10).

In addition, since the tilting motor unit (210) tilts and rotates the tilting unit (220) and the gripping unit (240), the number of drive elements to be installed can be reduced. Accordingly, the manufacturing cost of the wafer unit (10) processing device can be reduced.

The lifting unit (230) includes an lifting drive unit (231) and an lifting member (235).

The lifting drive unit (231) is installed in the tilting unit (220). The lifting drive unit (231) includes an lifting cylinder unit (232) and an lifting rod unit (233) that is installed to be able to be lifted on the lifting cylinder unit (232). An lifting member (235) is fixed to the lower side of the lifting rod unit (233). When fluid is introduced into the lifting cylinder unit (232), the lifting rod unit (233) moves downward, and when fluid is discharged from the lifting cylinder unit (232), the lifting rod unit (233) moves upward.

The lifting member (235) is connected to the lifting drive unit (231) and the gripping unit (240) so that it is lifted by the lifting drive unit (231), and a position correction unit (260) is installed so that the gripping unit (240) is spaced apart. The lifting member (235) includes an lifting panel portion (236) that is installed spaced apart from the gripping unit (240). A coupling groove portion (237) is formed at the center of the lifting panel portion (236) so that the lifting rod portion (233) of the lifting drive unit (231) is coupled thereto.

The phage unit (240) includes a core member (241), a floating plate (243), a plurality of cam link parts (251), a link driving part (255), and a locking part (256).

The core member (241) is arranged on the lower side of the lifting member (235). The core member (241) is spaced apart from the lower side of the lifting member (235) and is arranged at the center of the lifting member (235). A plurality of core ribs (not shown) are formed to protrude radially around the periphery of the core member (241). The core member (241) is installed so as to be rotatable at a certain angle in the circumferential direction of the floating plate (243).

The floating plate (243) is coupled to the lower side of the core member (241) and connected to the position correction unit (260). The floating plate (243) is formed in a circular shape so as to face the vacuum chuck (330). The floating plate (243) is installed so as to contact the lower side of the lifting member (235). A guide hole (246) is formed through the periphery of the floating plate (243) so that the locking part (256) moves linearly in the radial direction of the floating plate (243) when the cam link part (251) rotates.

A plurality of cam link parts (251) are radially connected to the core member (241). The cam link parts (251) are each connected to the core member (241). The cam link parts (251) are fixed to the core member (241) by a plurality of fastening bolts (not shown). The cam link parts (251) are formed in a linear panel shape.

The link driving unit (255) is connected to the cam link unit (251) and the floating plate (243) to move the cam link units (251). One side of the link driving unit (255) is fixed to the floating plate (243), and the other side of the link driving unit (255) is connected to one cam link unit (251). The link driving unit (255) includes a link cylinder unit (255a) and a link rod unit (255b) movably installed in the link cylinder unit (255a). As fluid flows into the link cylinder unit (255a), the link rod unit (255b) is pulled out from the link cylinder unit (255a), and as fluid flows out from the link cylinder unit (255a), the link rod unit (255b) is drawn into the link cylinder unit (255a).

The locking parts (256) are installed in each of the cam link parts (251) and lock and unlock the ring cover part (201) when the cam link parts (251) move. The locking parts (256) are connected to each cam link part (251) on the periphery of the floating plate (243).

The core member (241) rotates together with the plurality of cam link members (251) when the link driving member (255) is driven. That is, as the link driving member (255) is driven, one cam link member (251) connected to the link driving member (255) rotates at a certain angle around the center of the floating plate (243). As one cam link member (251) rotates at a certain angle, the core member (241) rotates in the circumferential direction of the floating plate (243), so that the plurality of cam link members (251) rotate at a certain angle in the circumferential direction simultaneously. As the plurality of cam link members (251) rotate, the plurality of locking members (256) simultaneously lock and unlock the ring cover member (201) to hold the ring cover member (201). At this time, the floating plate (243) does not rotate.

The cam link part (251) includes a cam rod part (252) radially connected to the core member (241), and a cam part (253) connected to the cam rod part (252) and having a long part (254) formed so that the locking part (256) moves. At this time, the cam part (253) is formed in a plate shape, and the long part (254) is formed to be inclined with respect to the rotation radius of the cam part (253). A link rod part (255b) of a link driving part (255) is connected to the cam rod part (252). As the link driving part (255) is driven, the cam rod part (252) and the cam part (253) rotate at a certain angle. As the cam (253) rotates, the locking part (256) moves along the long part (254) and moves linearly in the radial direction of the floating plate (243), so that the ring cover part (201) can be locked and unlocked by the linear movement of the locking part (256).

The locking part (256) includes a slide part (257) that is movably connected to the long part (254), a locking guide part (258) that is connected to the slide part (257) so that the slide part (257) moves linearly, and a locking pin part (259) that is installed in the locking guide part (258) so that the ring cover part (201) is locked and unlocked when the locking guide part (258) moves. The slide part (257) is a slide roller that comes into cloud contact with the long part (254). The locking guide part (258) is installed in a guide hole part (246) formed on the periphery of the floating plate (243) so that it can move linearly. The locking pin part (259) protrudes and extends from the inside of the locking guide part (258). The end of the locking pin portion (259) is formed in various shapes, such as a cone shape, so as to be inserted into the restraining groove portion (203) of the ring cover portion (201).

The locking guide part (258) includes a guide shaft part (258a) that is connected to the slide part (257) and movably installed in the guide hole part (246) of the floating plate (243), a guide member (258b) that is connected to the guide shaft part (258a) and has a locking pin part (259) installed therein, and a plurality of guide roller parts (258c) that are installed to support both sides of the guide member (258b). The guide shaft part (258a) is axially coupled to the slide part (257), the guide member (258b) is formed in a rectangular plate shape, and two or more guide roller parts (258c) are arranged on both sides of the guide member (258b). An insertion groove part (not shown) is formed on the periphery of the guide roller part (258c) so that a side part of the guide member (258b) is inserted therein. As the link driving unit (255) moves the cam link unit (251), the slide unit (257) and the guide shaft unit (258a) move linearly in the radial direction, and as the guide shaft unit (258a) moves, the guide member (258b) moves along the guide hole unit (246). At this time, the guide roller units (258c) rotate when the guide member (258b) moves and support the guide member (258b).

The long part (254) of the locking part (256) is formed to be inclined in the circumferential direction of the floating plate (243), the slide part (257) is inserted into the long part (254), and the guide shaft part (258a) is inserted into the straight guide hole part (246). Accordingly, as the cam link part (251) rotates to one side, the slide part (257) and the guide shaft part (258a) move toward one end of the long part (254), and as the guide member (258b) moves toward the center of the floating plate (243), the locking pin part (259) is inserted into the restraining groove part (203) of the ring cover part (201) to lock (hold) the ring cover part (201). In addition, as the cam link part (251) rotates to the other side, the slide part (257) and the guide shaft part (258a) move toward the other end of the long part (254), and as the guide member (258b) moves to the outside of the floating plate (243), the locking pin part (259) is separated from the restraining groove part (203) of the ring cover part (201), thereby unlocking the ring cover part (201).

The tilting device (200) further includes a docking unit (270) that is movably installed on one side of the chuck table (320, 330) to prevent the tilting device (200) from being lifted when the wafer unit (10) is fixedly coupled to the chuck table (320, 330). The docking unit (270) is installed on the docking frame unit (271). The tilting device (200) includes an extension arm unit (224) that extends from the tilting device (200) and a pressure unit (225) that is installed at an end of the extension arm unit (224). The pressure unit (225) is formed with a pressure rib that protrudes at the lower side toward the docking unit (270).

Accordingly, since the docking unit (270) restrains the pressurized portion (225) of the tilting device (200) to prevent the tilting device (200) from being lifted, the wafer portion (10) can be prevented from changing position when the gripping unit (240) is lowered by the lifting unit (130) and the wafer portion (10) is coupled to the chuck table (320, 330). Furthermore, by preventing wear of the fixing hole portion (202) and the chuck pin portion (303) of the wafer portion (10), the generation of foreign substances can be prevented.

The docking unit (270) includes a docking drive unit (173) installed in the docking frame unit (271), and a docking pressure unit (175) moved by the docking drive unit (173) to restrain the tilting device (200). The docking drive unit (173) is installed to be movable forward and backward and up and down so as to press the pressured unit (225) of the tilting unit downward after the tilting device (200) is completely lowered by the lifting unit (130). Various forms may be applied to the docking drive unit (173) as long as it moves the docking pressure unit (175) to restrain the tilting device (200).

FIG. 14 is a cross-sectional view schematically illustrating a chuck table device in a substrate processing apparatus according to an embodiment of the present invention, FIG. 15 is a plan view schematically illustrating a chucking module of a chuck table device in a substrate processing apparatus according to an embodiment of the present invention, FIG. 16 is an enlarged view schematically illustrating a chucking module in a chuck table device of a substrate processing apparatus according to an embodiment of the present invention, and FIG. 17 is a cross-sectional view schematically illustrating a state in which a chucking module restrains a ring cover portion in a chuck table device of a substrate processing apparatus according to an embodiment of the present invention.

Referring to FIGS. 14 to 17, the chuck table device (300) includes a chuck unit (310) and a chuck table (320, 330).

The chuck unit (310) includes a rotation shaft (311) connected to the rotation center of the rotary table (320, 330) and a chuck motor unit (313) installed on the rotation shaft (311). The chuck motor unit (313) includes a stator (not shown) installed inside a housing (not shown) and a rotor (not shown) arranged inside the stator and installed to surround the rotation shaft (311). In addition, a belt drive method that rotates the rotation shaft (311) using a belt or a chain drive method that rotates the rotation shaft (311) using a chain may be applied to the chuck unit (310).

A vacuum passage (315) is formed on the rotating shaft (311) to evacuate the vacuum chuck (330). The vacuum passage (315) is formed along the longitudinal direction of the rotating shaft (311). A vacuum chamber (335) is formed on the vacuum chuck (330) to be connected to the vacuum passage (315).

The chuck table (320, 330) includes a rotary chuck part (320) and a vacuum chuck part (330).

The rotary chuck (320) is installed rotatably on the chuck body (310). The rotary chuck (320) may be formed in the shape of a circular plate as a whole.

The vacuum chuck unit (330) is mounted on the rotary chuck unit (320). The wafer unit (10) is mounted on the vacuum chuck unit (330). The vacuum chuck unit (330) is formed in an overall circular shape so as to be mounted on the upper portion of the rotary chuck unit (320). The vacuum chuck unit (330) rotates together with the rotary chuck unit (320) when the chuck drive unit (310) is driven.

The vacuum chuck unit (330) includes a first vacuum chuck (331) and a second vacuum chuck (333). The first vacuum chuck (331) is installed on the rotary chuck unit (320) so as to rotate together with the rotary chuck unit (320), and a vacuum chamber (335) is formed. The first vacuum chuck (331) forms a vacuum pressure so as to adsorb the wafer unit (10). The second vacuum chuck (333) is mounted on the first vacuum chuck (331), has a ring cover unit (201) installed, and is installed so as to be moved by a moving module (not shown).

The second vacuum chuck (333) is formed with a plurality of suction holes (not shown) that are connected to the medium passage (315) of the first vacuum chuck (331) to suction the wafer portion (10). The plurality of suction holes may be arranged in a concentric shape along the circumference of the second vacuum chuck (333). When vacuum pressure is formed in the medium passage (315), the wafer portion (10) can be closely adhered to the upper surface of the second vacuum chuck (333) by the vacuum suction force of the suction holes.

The ring cover part (201) is installed on the periphery of the vacuum chuck part (330). The ring cover part (201) presses the adhesive sheet (12) of the wafer part (10) to seal the periphery side of the vacuum chuck part (330). The ring cover part (201) is fixed to the rotary chuck part (320) by the chucking module (350). Since the ring cover part (201) is formed in a circular ring shape to press the adhesive sheet (12) of the wafer part (10) to seal the periphery of the vacuum chuck part (330), damage to the adhesive sheet (12) by the etchant can be minimized, and the rotary chuck part (320) and the vacuum chuck part (330) can be prevented from being contaminated or damaged by the etchant.

The chuck table device (300) is installed on a rotary chuck unit (320), and further includes a chucking module (350) that secures the wafer unit (10) to a vacuum chuck unit (330) and secures the ring cover unit (201) to the rotary chuck unit (320).

The chucking module (350) includes a chucking base (351), a chucking rotation part (355), a plurality of first chucking link parts (360), a plurality of wafer restraint parts (370), a plurality of second chucking link parts (380), and a plurality of cover restraint parts (390).

The chucking base (351) is installed on the rotary chuck unit (320). The chucking rotary unit (355) is connected to the chucking base (351) to rotate the chucking base (351). A plurality of first chucking link units (360) are each radially connected to the chucking base (351) and move when the chucking base (351) rotates. A plurality of wafer restraint units (370) are each connected to the first chucking link units (360) to fix the retaining unit (13) of the wafer unit (10) to the vacuum chuck unit (330) when the first chucking link unit (360) moves. The chucking base (351) is installed to be concentric with the rotary chuck unit (320). The chucking base (351), the chucking rotation part (355), and the first chucking link part (360) are arranged inside the rotation chuck part (320), and the wafer restraint part (370) is arranged around the rotation chuck part (320) and the vacuum chuck part (330).

When the chucking rotation part (355) is driven, the chucking base (351) rotates at a certain angle, and thus a plurality of first chucking link parts (360) move in the radial direction of the chucking base (351). As the plurality of first chucking link parts (360) move simultaneously, a plurality of wafer restraint parts (370) press and fix the retaining part (13) of the wafer part (10) to the periphery of the first vacuum chuck (331).

The chucking base (351) includes a base body portion (352), a plurality of guide portions (353) and a base gear portion (354).

The base body part (352) is formed in an annular shape to be concentric with the rotation axis (311) of the rotary chuck part (320). The base body part (352) is arranged inside the rotary chuck part (320). A plurality of guide parts (353) are formed in the base body part (352) so that the first chucking link part (360) can be movably coupled. The number of the plurality of guide parts (353) is formed twice the number of the first chucking link parts (360), and are formed at equal intervals along the circumference of the base body part (352). The first chucking link part (360) is coupled to the plurality of guide parts (353) one by one. The base gear part (354) is formed in the base body part (352) and is connected to the chucking rotation part (355). The base gear part (354) is arranged in an arc shape on the inner circumference of the base body part (352). As the chucking rotation part (355) is driven, the base gear part (354) rotates, and as the base body part (352) rotates together with the base gear part (354), the first chucking link part (360) moves in the radial direction of the base body part (352).

The guide portion (353) is formed to be inclined with respect to the radius of the base body portion (352). The guide portion (353) may be a guide hole portion. The guide portion (353) may be a guide groove or a guide protrusion portion. Since the guide portion (353) is formed to be inclined with respect to the radius of the base body portion (352), as the base body portion (352) is rotated at a certain angle, the first chucking link portion (360) moves linearly in the radial direction of the base body portion (352).

The first chucking link part (360) includes a first guide slider (361), a first link member (362), and a first link gear part (363). The first guide slider (361) is movably coupled to the guide member (353). The first link member (362) is connected to the first guide slider (361), and moves linearly along the radial direction of the base body part (352) when the first guide slider (361) moves. The first link member (362) is formed in the shape of a straight bar. The first link gear part (363) is formed on the first link member (362) so as to move while engaging with the wafer restraint part (370). The first link gear part (363) is formed in the shape of a rack gear parallel to the longitudinal direction of the first link member (362).

The first chucking link portion (360) further includes a first guide block (364) to which the first link member (362) is coupled so as to be able to move linearly. The first guide block (364) prevents the first link member (362) from rotating in the circumferential direction of the base body portion (352) when the base body portion (352) rotates. Therefore, when the first guide slider (361) moves along the guide portion (353) when the base body portion (352) rotates, the first link member (362) can move linearly without rotating.

The wafer restraint unit (370) includes a pressure gripper unit (175) that rotates to pressurize and release the retaining unit (13) of the wafer unit (10) when the gripper link unit (173) moves. The pressure gripper unit (175) is formed in an arc shape to pressurize and fix the retaining unit (13) of the wafer unit (10) along the circumferential direction.

A plurality of second chucking link parts (380) are radially connected to the chucking base (351) and move when the chucking base (351) rotates. A plurality of cover restraint parts (390) are connected to the second chucking link parts (380) to fix the ring cover part (201) to the rotary chuck part (320) when the second chucking link parts (380) move. As the chucking rotation part (355) is driven, the base gear part (354) rotates, and as the base body part (352) rotates together with the base gear part (354), the second chucking link parts (380) move in the radial direction of the base body part (352). At this time, when the base body part (352) of the chucking base (351) rotates, the plurality of first chucking link parts (360) and the plurality of second chucking link parts (380) move simultaneously. As the first chucking link part (360) moves, the retaining part (13) of the wafer part (10) is fixed to the vacuum chuck part (330), and as the second chucking link part (380) moves, the ring cover part (201) is fixed to the rotary chuck part (320). Therefore, since the wafer part (10) and the ring cover part (201) are simultaneously fixed to the vacuum chuck part (330) and the rotary chuck part (320) using one chucking base (351) and one chucking rotation part (355), the structure of the chuck table device (300) can be simplified.

The second chucking link part (380) includes a second guide slider (381) and a second link member (382).

The second guide slider (381) is movably connected to the guide portion (353). The second link member (382) is connected to the second guide slider (381) and moves linearly along the radial direction of the base body portion (352) when the second guide slider (381) moves. The second link gear portion (392) is formed on the second link member (382) so as to move while engaging with the cover restraint portion (390). The second link member (382) is formed in the shape of a straight bar. The second link gear portion (392) is formed in the shape of a rack gear parallel to the longitudinal direction of the second link member (382).

The second chucking link part (380) further includes a second guide block (384) to which the second link member (382) is coupled so as to be able to move linearly. The second guide block (384) prevents the second chucking link part (380) from rotating in the circumferential direction of the base body part (352) when the base body part (352) rotates. Therefore, when the second guide slider (381) moves along the guide part (353) when the base body part (352) rotates, the second link member (382) can move linearly without rotating.

The cover restraint (390) is connected to the second chucking link (380) so as to fix the restraint jaw (not shown) of the ring cover (201) to the rotary chuck (320) when the second chucking link (380) moves.

As described above, the chuck table device (300) includes a wafer restraint unit (370) that restrains the retaining unit (13) of the wafer unit (10), a cover restraint unit (390) that restrains the ring cover unit (201), and a moving module (325) that moves the vacuum chuck unit (330) to pull the wafer unit (10) in the radial direction. Therefore, a wafer expanding process is possible in which the wafer unit (10) is processed in a state in which the wafer restraint unit (370) restrains the retaining unit (13) of the wafer unit (10) to the vacuum chuck unit (330) and the vacuum chuck unit (330) is moved to widen the gap between the dies (11) of the wafer unit (10). In addition, a debonding cleaning process is possible in which the wafer portion (10) is processed while the cover restraint portion (390) restrains the ring cover portion (201) on the upper side of the vacuum chuck portion (330).

FIG. 18 is a plan view schematically illustrating a treatment liquid injection device of a substrate treatment device according to an embodiment of the present invention, FIG. 19 is a perspective view schematically illustrating a spray arm module in a treatment liquid injection device of a substrate treatment device according to an embodiment of the present invention, FIG. 20 is an enlarged view schematically illustrating a first spray nozzle part of a spray arm module in a treatment liquid injection device of a substrate treatment device according to an embodiment of the present invention, and FIG. 21 is an enlarged view schematically illustrating a second spray nozzle part and a second suction nozzle part of a spray suction arm module in a treatment liquid injection device of a substrate treatment device according to an embodiment of the present invention.

Referring to FIGS. 18 to 21, the treatment liquid injection device (400) is installed on the outside of the chuck table device (300). The treatment liquid injection device (400) includes a female driving unit (402), an injection arm module (410), and an injection suction arm module (420).

The injection arm module (410) is connected to the female driving unit (402). The injection arm module (410) is moved up and down on the chuck table device (300) by the female driving unit (402) and is installed so as to be rotatable from the outside to the inside of the chuck table device (300).

The spray arm module (410) includes a first spray arm section (411) and a first spray nozzle section (413). The first spray arm section (411) is positioned approximately halfway up the diameter of the wafer section (10). The first spray nozzle section includes one or more first spray nozzles (414, 415) connected to a plurality of treatment liquid supply pipe sections (not shown). The first spray nozzles (414, 415) can spray a cleaning liquid such as a plurality of chemicals to chemically treat the wafer section (10).

The number of first injection nozzles (414, 415) can be varied depending on the shape of the treatment liquid injection device (400) or the treatment method of the wafer portion (10). The treatment method of the wafer portion (10) includes an etching method or a cleaning method of the wafer portion (10).

The injection suction arm module (420) is connected to the female driving unit (402). The injection suction arm module (420) is moved up and down the chuck table device (300) by the female driving unit (402) and is installed so as to be rotatable from the outside to the inside of the chuck table device (300).

The injection suction module (420) includes a second injection arm (421), a second injection nozzle unit (423), and a second suction nozzle unit (426). The second injection arm unit (421) is positioned at about half the upper side of the wafer unit (10) in the diameter direction. The second injection nozzle unit (423) includes a second injection nozzle (424) and a third injection nozzle (425). The second suction nozzle unit (426) is immersed in the treatment liquid so as to suck up the treatment liquid contained in the chuck table device (300) and foreign substances such as sludge and particles. In addition, the second injection nozzle unit (423) is positioned at a certain height apart from the treatment liquid so as to spray the treatment liquid onto the wafer unit (10) mounted on the chuck table device (300). The second injection nozzle (424) sprays a cleaning solution mixed with pure water and nitrogen onto the wafer portion (10). The third injection nozzle (425) sprays a treatment solution, such as thinner, onto the wafer portion (10). When the wafer portion (10) is treated by spraying the treatment solution from either the second injection nozzle (424) or the third injection nozzle (425), the second suction nozzle portion (426) sucks up foreign substances, such as sludge and particles, floating in the treatment solution.

FIG. 22 is a schematic drawing of a suction tank unit connected to a second suction nozzle unit of a spray suction arm module in a treatment liquid spray device of a substrate treatment device according to one embodiment of the present invention.

Referring to Fig. 22, sludge sucked from the second suction nozzle section (426) of the injection suction module (420) is discharged to the suction tank section (440) through the flow line section (430).

The fluid line section (430) is connected to the second suction nozzle section (426) so that foreign substances and the treatment liquid flow. When suction pressure is generated in the fluid line section (430), the second suction nozzle section (426) sucks in foreign substances floating on the upper side of the treatment liquid. The foreign substances and the treatment liquid sucked into the second suction nozzle section (426) flow in the fluid line section (430).

The suction tank section (440) is connected to the flow line section (430) so that foreign substances and treatment liquid can be introduced. A negative pressure lower than atmospheric pressure is formed inside the suction tank section (440) so that foreign substances and treatment liquid can be sucked in.

The ejector part (450) is installed in the flow line part (430) to form suction pressure in the second suction nozzle part (426) and the flow line part (430). Since the ejector part (450) is installed in the flow line part (430), the second suction nozzle part (426) can be expanded compared to a structure in which the ejector part (450) is installed in the second suction nozzle part (426). In addition, the size of the ejector part (450) can be increased. Therefore, the second suction nozzle part (426) and the ejector part (450) can be prevented from being clogged by foreign substances.

The ejector unit (450) can be driven for a preset period of time after the wafer unit (10) processing process is completed. For example, the ejector unit (450) is driven for approximately 3-5 minutes after the wafer unit (10) processing process is completed. Accordingly, foreign substances and processing liquid remaining in the second suction nozzle unit (426) and the flow line unit (430) are completely discharged to the suction tank unit (440), thereby preventing the processing liquid from falling from the second suction nozzle unit (426) and re-contaminating the wafer unit (10).

The ejector unit (450) includes an ejector body unit (451) and a gas supply unit (453). Foreign substances and a treatment liquid that are sucked into the flow line unit (430) are introduced into the ejector body unit (451). The gas supply unit (453) is connected to the ejector body unit (451) to supply gas to the ejector body unit (451). As the gas, hydrogen gas is suggested to prevent explosion or chemical bonding with the treatment liquid. Since the gas supply unit (453) supplies gas to the ejector body unit (451), a suction pressure lower than atmospheric pressure is generated inside the ejector body unit (451). In addition, since the gas of the ejector body unit (451) is introduced into the suction tank unit (440) and then exhausted, a negative pressure is formed inside the suction tank unit (440).

The suction tank section (440) includes a suction tank body section (441), a filter section (444), and a drain section (446).

The suction tank body (441) is connected to the flow line (430). The treatment liquid, foreign substances, and gas flowing from the flow line (430) are introduced into the suction tank body (441). As the gas is discharged through the discharge line (467), a negative pressure lower than the atmospheric pressure is formed in the suction tank body (441). The bottom surface of the suction tank body (441) is formed to be inclined toward the center so that the treatment liquid is collected.

A window (443) is installed on the upper side of the suction tank body (441) so that the inside of the suction tank can be viewed from the outside. Accordingly, a worker can inspect the internal condition of the suction tank body (441) by looking at the window (443).

The filter unit (444) is placed inside the suction tank body unit (441) so that foreign substances discharged from the flow line unit (430) are filtered. The filter unit (444) is supported by the support unit (445).

The filter section (444) includes a plurality of filters (444a) that are stacked between the flow line section (430) and the drain section (446), and the plurality of filters (444a) have meshes that become smaller as they go toward the drain section (446). Therefore, foreign substances with larger particles are filtered in the upper filter (444a), and foreign substances with smaller particles are filtered in the lower filter (444a). The plurality of filters (444a) are detachably installed in the support section (445). Therefore, when the filter (444a) is clogged, the filter (444a) can be separated from the support section (445), the filter (444a) can be washed, and the washed filter (444a) can be installed again in the support section (445).

The drain unit (446) is connected to the suction tank body (441) so that the treatment liquid filtered in the filter unit (444) is discharged. The drain unit (446) is connected to the lowest part of the bottom surface (442) of the suction tank body (441). The drain unit (446) may be connected to a treatment liquid recovery unit (not shown) or a chuck table device (300). Since the drain unit (446) is connected to the lowest part of the bottom surface (442) of the suction tank body (441), it is possible to prevent the treatment liquid from remaining inside the suction tank body (441).

The substrate treatment device (1) further includes an overflow line (461) connected to the suction tank body (441) and the drain section (446). The overflow line section (461) is connected to the upper side of the filter section (444) in the suction tank section (440). If the filter section (444) is clogged by foreign substances, the treatment liquid may overflow to the upper side of the suction tank body section (441). At this time, the overflowed treatment liquid is discharged to the drain section (446) through the overflow line section (461).

The substrate treatment device (1) further includes an overflow detection unit (463) that detects that the treatment liquid of the suction tank body (441) flows into the overflow line unit (461). The overflow detection unit (463) may be a level detection sensor that detects the level of the treatment liquid. When the overflow detection unit (463) detects that the treatment liquid overflows, the overflow detection unit (463) transmits a signal to the control unit (470). The control unit (470) controls the alarm unit (465) to generate an alarm and controls the supply of the treatment liquid from the second injection nozzle unit (423) to be stopped. The operator opens the suction tank body unit (441) and then replaces or cleans the filter unit (444).

The substrate treatment device (1) further includes a discharge line section (467) connected to the suction tank section (440) to discharge the treatment liquid fume and gas inside the suction tank section (440). The discharge line section (467) may be connected to a recovery device (not shown). As the treatment liquid evaporates, treatment liquid fume is generated, and the treatment liquid fume and gas are discharged through the discharge line section (467), so that a negative pressure is formed inside the suction tank section (440). Accordingly, the treatment liquid, foreign substances, and gas in the flow line section (430) are sucked into the inside of the suction tank section (440).

A substrate processing method of a substrate processing device according to one embodiment of the present invention configured as described above will be described.

FIG. 23 is a drawing schematically illustrating a substrate processing method according to one embodiment of the present invention, and FIG. 24 is a flowchart schematically illustrating a substrate processing method according to one embodiment of the present invention.

Referring to FIGS. 23 and 24, the wafer portion (10) is placed on the chuck table (320, 330) (see FIG. 23(a)) (S11). At this time, the transfer device (100) holds the wafer portion (10) transferred from the second transfer module (60), and as the transfer device (100) is lowered, the wafer portion (10) is placed on the chuck table (320, 330).

As the lifting unit (120) is driven, the transfer unit (130) is raised, and the gripper unit (140) is withdrawn from the transfer unit (130). At this time, the first rack gear unit (145) is fixed to the housing unit (131) of the transfer unit (130), and the second rack gear unit (146) is moved by the translation and rotation of the pinion unit (142). When the gripper driving unit (141) is driven, the pinion unit (142) simultaneously performs translational and rotational motions along the first rack gear unit (145), so the second rack gear unit (146) is moved by a distance by the translational and rotational motions of the pinion unit (142). When the second transfer module (60) transfers the wafer portion (10) to the finger portion (147) of the gripper portion (140), the finger portion (147) vacuum-absorbs the wafer portion (10) by vacuum suction force.

Next, when the transfer unit (130) is lowered as the lifting unit (120) is driven, the wafer unit (10) mounted on the finger unit (147) is seated on the vacuum chuck unit (330) of the chuck table (320, 330). As a vacuum is formed in the electric chuck unit (330), the wafer unit (10) is vacuum-absorbed on the vacuum chuck unit (330).

In addition, the docking unit (270) restrains the pressure portion (225) of the tilting device (200) to prevent the tilting device (200) from being lifted when the wafer unit (10) is fixedly coupled to the chuck table (320, 330).

The ring cover part (201) is loaded onto the chuck table (320, 330) to restrain the wafer part (10) to the chuck table (320, 330) (S12). At this time, the ring cover part (201) is restrained by the gripping unit (240) of the tilting device (200), the tilting device (200) couples the ring cover part (201) to the upper side of the chuck table (320, 330), the chucking module (350) of the chuck table (320, 330) restrains the ring cover part (201), the gripping unit (240) of the tilting device (200) releases the restraint of the ring cover part (201), and the tilting device (200) moves to the outside of the chuck table (320, 330).

The steps of loading the ring cover part (201) onto the chuck table (320, 330) are described in detail as follows. The gripping unit (240) is positioned in a standby state in which it is vertically erected while gripping the ring cover part (201). When the wafer part (10) is placed on the vacuum chuck part (330), the tilting motor part (210) is driven so that the tilting unit (220) and the gripping unit (240) rotate horizontally. When the rotation of the tilting unit (220) and the gripping unit (240) is completed, the lifting unit (230) is driven so that the gripping unit (240) moves to the lower side of the tilting unit (220). At this time, the tilting unit (220) does not descend together with the lifting unit (230) but maintains a horizontal state.

As the gripping unit (240) descends, the ring cover part (201) is coupled to the vacuum chuck part (330). At this time, the gripping unit (240) continuously maintains the state in which the ring cover part (201) is coupled to the vacuum chuck part (330) until the ring cover part (201) is completely positioned (chucking) on the chucking module (350) of the vacuum chuck part (330).

When the coupling of the ring cover part (201) to the vacuum chuck part (330) is completed, the lifting unit (230) is driven so that the gripping unit (240) moves upward and comes into contact with or is slightly separated from the lower side of the tilting unit (220). When the gripping unit (240) is completely moved upward, the docking unit (270) releases the pressurized part (225) of the tilting device (200). Then, as the tilting motor part (210) is driven, the tilting unit (220) and the gripping unit (240) are rotated to a standby state in which they are erected vertically or nearly vertically.

The spray suction arm module (420) sprays the treatment liquid onto the wafer portion (10) to treat the wafer portion (10) (see FIG. 23(b)) (S13). At this time, the spray suction arm module (420) moves above the wafer portion (10), and the spray suction arm module (420) swings within a certain angle range to spray the treatment liquid onto the wafer portion (10). As the treatment liquid is sprayed onto the wafer portion (10), the wafer portion (10) is chemically treated. In addition, the chuck table (320, 330) rotates the wafer portion (10). When the treatment process of the wafer portion (10) is completed, the supply of the treatment liquid to the spray suction arm module (420) is stopped.

The spray arm module (410) sprays a cleaning solution onto the wafer portion (10) to perform an intermediate cleaning (primary cleaning) of the wafer portion (10) (see FIG. 23(c)) (S14). At this time, the spray suction arm module (420) moves to the outside of the wafer portion (10), the spray arm module (410) moves to the upper side of the wafer portion (10), and the spray arm module (410) swings within a certain angle range to spray the cleaning solution onto the wafer portion (10). In addition, the chuck table (320, 330) rotates the wafer portion (10). Thinner is suggested as the cleaning solution. Intermediate cleaning means cleaning the wafer portion (10) during the processing of the wafer portion (10). This intermediate cleaning of the wafer portion (10) may be performed before the ring cover portion (201) is unloaded or may be omitted.

The wafer portion (10) is first dried on the chuck table (320, 330) (see Fig. 23(d)) (S15). At this time, the spray arm module (410) is moved to the outside of the chuck table (320, 330), and the wafer portion (10) is first dried while the chuck table (320, 330) rotates. As the chuck table (320, 330) rotates, the cleaning liquid attached to the wafer portion (10) flows radially by centrifugal force and is discharged. Therefore, the first drying time of the wafer portion (10) can be significantly shortened.

In addition, before the ring cover part (201) is unloaded from the chuck table (320, 330), the treatment liquid or cleaning liquid attached to or around the ring cover part (201) can be cleanly removed, and the liquid can be prevented from dripping from the ring cover part (201) when the ring cover part (201) is unloaded.

The ring cover part (201) is unloaded from the chuck table (320, 330) (see Fig. 23(e)) (S16). At this time, the tilting device (200) is rotated and positioned above the ring cover part (201), the gripping unit (240) of the tilting device (200) restrains the ring cover part (201), the chucking module (350) of the chuck table (320, 330) releases the restraint of the ring cover part (201), and the tilting device (200) rotates the ring cover part (201) to move it to the outside of the chuck table (320, 330).

The steps of unloading the ring cover part (201) onto the chuck table (320, 330) are described in detail as follows. The gripping unit (240) is positioned in a standby state in which it is vertically erected. As the tilting motor part (210) is driven, the tilting unit (220) and the gripping unit (240) are rotated horizontally. The docking part (270) restrains the pressurized part (225) of the tilting device (200). Then, as the lifting unit (230) is driven, the gripping unit (240) moves to the lower side of the tilting unit (220). At this time, the tilting unit (220) does not descend together with the lifting unit (230) but maintains a horizontal state.

After the gripping unit (240) is lowered, the ring cover part (201) is restrained as the gripping unit (240) is driven. In addition, as the chucking module (350) of the chucking table (320, 330) is driven, the ring cover part (201) is released from the chucking module (350).

When the ring cover part (201) is released from the chucking module (350), the lifting unit (230) is driven so that the gripping unit (240) moves upward together with the ring cover part (201) and comes into contact with or is slightly separated from the lower side of the tilting unit (220). In addition, the docking unit (270) releases the pressurized part (225) of the tilting device (200) from its restraint.

When the docking unit (270) releases the pressure unit (225) of the tilting device (200), the tilting motor unit (210) is driven, and the tilting unit (220) and the gripping unit (240) are rotated to a standby state where they are erected vertically or nearly vertically.

Meanwhile, after the spray gun module (410) sprays the cleaning solution onto the wafer portion (10) to perform the first cleaning of the wafer portion (10), the ring cover portion (201) can be unloaded from the chuck table (320, 330) without first drying the wafer portion (10) on the chuck table (320, 330).

The spray arm module (410) sprays a cleaning solution onto the wafer portion (10) to perform a secondary cleaning of the wafer portion (10) (see FIG. 23(f)) (S17). At this time, the spray arm module (410) moves upwards of the wafer portion (10), and the spray arm module (410) swings within a certain angle range to spray the cleaning solution onto the wafer portion (10) to perform a secondary cleaning of the wafer portion (10). Thinner is suggested as the cleaning solution sprayed from the spray arm module (410). When the secondary cleaning of the wafer portion (10) is completed, the supply of the cleaning solution to the spray arm module (410) is stopped.

The wafer portion (10) is dried for the second time on the chuck table (320, 330) (see Fig. 23(g)) (S18). The injection suction arm module (410) is moved to the outside of the chuck table (320, 330), and the chuck table (320, 330) is rotated to dry the wafer portion (10) for the second time. As the chuck table (320, 330) rotates, the cleaning liquid attached to the wafer portion (10) flows radially by centrifugal force and is discharged. When the secondary drying of the wafer portion (10) is completed, the rotation of the chuck table (320, 330) is stopped. Therefore, the secondary drying time of the wafer portion (10) can be significantly shortened.

Meanwhile, after the spray gun module (410) sprays the cleaning solution onto the wafer portion (10) to perform secondary cleaning of the wafer portion (10), secondary drying of the wafer portion (10) may be omitted.

As described above, since the injection arm module (410) and the injection suction arm module (420) process the wafer portion (10), the wafer portion (10) can be processed using various types of processing liquids or cleaning liquids. Accordingly, the processing process of the wafer portion (10) can be implemented in various ways depending on the type of processing liquid or cleaning liquid.

Although the present invention has been described with reference to the embodiments shown in the drawings, these are merely exemplary, and those skilled in the art will understand that various modifications and equivalent other embodiments are possible therefrom.

Therefore, the true technical protection scope of the present invention should be determined by the claims.

10: Wafer section 11: Wafer
12: Adhesive sheet 13: Retaining ring
20: Wafer cassette 30: Buffer unit
40: Vision Aligner 41: Aligner Table
50: First transport module 60: Second transport module
70: First processing chamber 80: Second processing chamber
102: Ionizer 100: Transfer device
120: Lift 130: Transfer
140: Gripper part 141: Gripper drive part
142: Pinion section 145: First rack gear section
146: Second rack gear section 147: Finger section
200: Tilting device 201: Ring cover
202: Fixed hole 203: Restraint hole
210: Tilting motor unit 220: Tilting unit
230: Lifting unit 240: Grab unit
241: Core member 243: Floating plate
251: Cam link part 255: Link drive part
256: Locking part 300: Chuck table device
310: Chuck East 320: Rotating Chuck
330: Vacuum chuck 350: Chucking module
360: First chucking link 370: Wafer restraint
380: Second chucking link 390: Cover restraint
400: Treatment liquid injection device 402: Female drive unit
410: Injection arm module 420: Injection suction arm module
440: Suction tank section 450: Ejector section

Claims (10)

Step of placing the wafer portion on the chuck table;
A step of loading a ring cover portion onto the chuck table to restrain the wafer portion to the chuck table;
A step of treating the wafer portion by having the injection suction arm module spray the treatment liquid onto the wafer portion;
A step in which the ring cover part is unloaded from the chuck table; and
The spray gun module includes a step of spraying a cleaning solution onto the wafer portion to clean the wafer portion,
The step of placing the wafer portion on the chuck table is as follows:
A step of the transfer device catching the wafer portion transferred from the second transfer module; and
Including a step of settling the wafer portion on the chuck table as the transfer device is lowered,
The step of the above transfer device holding the wafer portion transferred from the second transfer module is:
A substrate processing method characterized by including a step of withdrawing a gripper portion from a transfer portion.
delete In the first paragraph,
The step of loading the ring cover part onto the chuck table to restrain the wafer part to the chuck table is as follows:
A step in which the above ring cover part is restrained to the grip unit of the tilting device;
A step of the tilting device connecting the ring cover part to the upper side of the chuck table;
A step in which the chucking module of the chuck table restrains the ring cover part;
The step of the above-mentioned phage unit releasing the restraint of the above-mentioned ring cover part; and
A substrate processing method characterized in that it includes a step in which the tilting device moves to the outside of the chuck table.
In the first paragraph,
The step of processing the wafer portion by spraying the processing liquid onto the wafer portion by the above injection suction arm module is as follows:
A step in which the above injection suction arm module moves to the upper side of the wafer portion; and
A substrate processing method characterized by including a step of spraying a processing liquid onto the wafer portion while the injection suction arm module swings within a certain angle range.
In the first paragraph,
The step of unloading the above ring cover part from the chuck table is:
A step in which the tilting device is rotated and positioned on the upper side of the ring cover portion;
A step in which the grip unit of the above tilting device restrains the above ring cover part;
A step of releasing the restraint of the ring cover part by the chucking module of the chuck table; and
A substrate processing method characterized in that the tilting device includes a step of rotating the ring cover part to move it to the outside of the chuck table.
In the first paragraph,
The step of the above-mentioned spraying module spraying a cleaning solution onto the wafer portion to clean the wafer portion is as follows:
A step in which the above injection module moves to the upper side of the wafer portion; and
A substrate processing method characterized in that the above-mentioned spray arm module includes a step of spraying a cleaning solution onto the wafer portion within a certain range to clean the wafer portion.
In the first paragraph,
Before the step of unloading the above ring cover part from the chuck table,
A substrate processing method characterized in that the above-mentioned injection arm module further includes a step of performing intermediate cleaning of the wafer portion by spraying a cleaning solution onto the wafer portion.
In paragraph 7,
The step of the above-mentioned spraying module spraying a cleaning solution onto the wafer portion to intermediately clean the wafer portion is as follows:
A step in which the above injection suction arm module moves to the outside of the wafer portion;
A step in which the above injection module moves to the upper side of the wafer portion; and
A substrate processing method characterized by including a step of spraying a cleaning solution onto the wafer portion while the spray arm module swings within a certain angle range.
In the first paragraph,
After the step of the above-mentioned spraying module spraying the cleaning solution onto the wafer portion to intermediately clean the wafer portion,
A substrate processing method characterized in that it further includes a step of first drying the wafer portion on the chuck table.
In paragraph 9,
After the step of the above-mentioned spraying module spraying the cleaning solution onto the wafer portion to clean the wafer portion,
A substrate processing method characterized in that it further includes a step of secondary drying of the wafer portion on the chuck table.