KR102542873B1 - Display device - Google Patents

Abstract

The present invention provides a display device capable of preventing moisture from entering an organic light emitting device. A display device according to an exemplary embodiment of the present invention includes a substrate including a display area on which pixels are disposed and a pad area including a first pad, and a first power supply supplying a first power supply voltage input from the first pad to the pixels. A line and a first dam disposed between the display area and the pad area. The first power line includes a first pad connection portion connected to the first pad, and a first connection portion electrically connected to the first pad connection portion through a first contact hole. The first contact hole overlaps the first dam.

Description

Display device {DISPLAY DEVICE}

The present invention relates to a display device.

As the information society develops, demands for display devices for displaying images are increasing in various forms. Accordingly, recently, various display devices such as a liquid crystal display (LCD), a plasma display panel (PDP), and an organic light emitting display (OLED) have been utilized.

Among the display devices, the organic light emitting display device is a self-emission type, and has an excellent viewing angle and contrast ratio compared to a liquid crystal display (LCD), and is lightweight and thin as it does not require a separate backlight, and has advantages in power consumption. . In addition, the organic light emitting display device can be driven at low DC voltage, has a fast response speed, and has low manufacturing cost.

The organic light emitting display device includes pixels each including an organic light emitting element, and a bank partitioning the pixels to define the pixels. The bank may serve as a pixel defining layer. The organic light emitting device includes an anode electrode, a hole transporting layer, an organic light emitting layer, an electron transporting layer, and a cathode electrode. In this case, when a high potential voltage is applied to the anode electrode and a low potential voltage is applied to the cathode electrode, holes and electrons move to the organic light emitting layer through the hole transport layer and the electron transport layer, respectively, and combine with each other in the organic light emitting layer to emit light.

The organic light emitting device has a disadvantage in that deterioration easily occurs due to external factors such as external moisture and oxygen. To prevent this, the organic light emitting display device forms an encapsulation film to prevent external moisture and oxygen from penetrating the organic light emitting element. The encapsulation layer includes at least one inorganic layer and at least one organic layer.

In general, the inorganic film may be deposited using a chemical vapor deposition (CVD) technique. At this time, when the surface on which the inorganic film is deposited has a step and is not flat, there is a problem in that it is difficult to deposit a uniform thickness. In particular, in the vicinity of the boundary where the step occurs, a seam having a form in which the inorganic film is broken may be issued. When an inorganic membrane seam is generated, oxygen or moisture may permeate through the inorganic membrane seam. Moisture penetrates into the organic light emitting layer and the cathode electrode and oxidizes the organic light emitting device, thereby deteriorating the organic light emitting device.

The organic film is generally composed of a polymer, and is formed through a curing process after being applied on a substrate in a liquid form. Since such an organic film has fluidity until the curing process, it may overflow outside the area where the encapsulation film is to be formed. In order to solve this problem, recently, a dam blocking the flow of an organic film has been formed along the outer edge of the organic light emitting device. Dams are generally made of organic material. When such a dam comes into contact with another organic layer disposed in the non-display area, it may provide a moisture permeation path to the organic light emitting device.

The present invention provides a display device capable of preventing moisture from entering an organic light emitting device.

A display device according to an exemplary embodiment of the present invention includes a substrate including a display area on which pixels are disposed and a pad area including a first pad, and a first power supply supplying a first power supply voltage input from the first pad to the pixels. A line and a first dam disposed between the display area and the pad area. The first power line includes a first pad connection portion connected to the first pad, and a first connection portion electrically connected to the first pad connection portion through a first contact hole. The first contact hole overlaps the first dam.

According to the present invention, by forming an organic passivation film covering the edge of the power line, it is possible to reduce the level difference generated by the power line. Accordingly, the present invention can prevent a seam from occurring at the edge of the power line when forming the inorganic film constituting the encapsulation film.

In addition, since the power line is formed on the same layer as the gate electrode between the first dam and the second dam, an organic passivation layer may not be formed between the first dam and the second dam. Accordingly, the present invention can prevent moisture from entering the organic light emitting device of the display area through the organic passivation layer even when moisture penetrates into the organic passivation layer extending from the pad area to the first dam.

In addition, by forming the height of the dam high, the present invention can prevent the organic film constituting the encapsulation film from overflowing to the outside of the dam even if the distance between the dam and the display area is shortened. Accordingly, the present invention can implement a narrow bezzel.

In addition, the present invention can prevent moisture from entering the organic light emitting device of the display area through the organic passivation layer even when the dam is damaged and moisture penetrates into the dam.

In addition, according to the present invention, contact holes for connection with a connecting portion disposed between the first dam and the second dam may be formed to overlap the first dam and the second dam. In the present invention, the inorganic film constituting the encapsulation film is not directly formed on the contact hole by covering the level difference generated by the contact holes with the first dam and the second dam. As a result, the present invention can prevent inorganic film seams from being generated by contact holes.

The effects obtainable in the present invention are not limited to the effects mentioned above, and other effects not mentioned will be clearly understood by those skilled in the art from the description below. .

1 is a perspective view showing a display device according to an exemplary embodiment of the present invention.
FIG. 2 is a plan view illustrating a first substrate, a source drive IC, a flexible film, a circuit board, and a timing controller of FIG. 1 .
3 is a plan view schematically showing a first substrate.
4 is a cross-sectional view showing an example of a pixel of the display area of FIG. 3 .
FIG. 5 is an enlarged view showing area A of FIG. 3 .
FIG. 6 is a cross-sectional view schematically illustrating a cross-section along line II-II′ shown in FIG. 5 .
FIG. 7 is a cross-sectional view schematically illustrating a cross section along line III-III′ shown in FIG. 5 .

Advantages and features of the present invention, and methods for achieving them, will become clear with reference to the embodiments described below in detail in conjunction with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below, but will be implemented in a variety of different forms, only the present embodiments make the disclosure of the present invention complete, and those skilled in the art in the art to which the present invention belongs It is provided to fully inform the person of the scope of the invention, and the invention is only defined by the scope of the claims.

Since the shape, size, ratio, angle, number, etc. disclosed in the drawings for explaining the embodiment of the present invention are exemplary, the present invention is not limited to the matters shown. Like reference numbers designate like elements throughout the specification. In addition, in describing the present invention, if it is determined that a detailed description of related known technologies may unnecessarily obscure the subject matter of the present invention, the detailed description will be omitted.

When 'includes', 'has', 'consists', etc. mentioned in this specification is used, other parts may be added unless 'only' is used. In the case where a component is expressed in the singular, the case including the plural is included unless otherwise explicitly stated.

In interpreting the components, even if there is no separate explicit description, it is interpreted as including the error range.

In the case of a description of a positional relationship, for example, 'on top of', 'on top of', 'at the bottom of', 'next to', etc. Or, unless 'directly' is used, one or more other parts may be located between the two parts.

In the case of a description of a temporal relationship, for example, 'immediately' or 'directly' when a temporal precedence relationship is described in terms of 'after', 'following', 'next to', 'before', etc. It can also include non-continuous cases unless is used.

Although first, second, etc. are used to describe various components, these components are not limited by these terms. These terms are only used to distinguish one component from another. Therefore, the first component mentioned below may also be the second component within the technical spirit of the present invention.

"X-axis direction", "Y-axis direction", and "Z-axis direction" should not be interpreted only as a geometric relationship in which the relationship between each other is made upright, and may be broader within the range in which the configuration of the present invention can function functionally. It can mean having a direction.

The term “at least one” should be understood to include all possible combinations from one or more related items. For example, "at least one of the first item, the second item, and the third item" means not only the first item, the second item, or the third item, respectively, but also two of the first item, the second item, and the third item. It may mean a combination of all items that can be presented from one or more.

Each feature of the various embodiments of the present invention can be partially or entirely combined or combined with each other, technically various interlocking and driving are possible, and each embodiment can be implemented independently of each other or can be implemented together in an association relationship. may be

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

1 is a perspective view showing a display device according to an exemplary embodiment of the present invention. FIG. 2 is a plan view illustrating a first substrate, a source drive IC, a flexible film, a circuit board, and a timing controller of FIG. 1 .

Hereinafter, the display device according to an exemplary embodiment of the present invention has been mainly described as an organic light emitting display (OLED), but is not limited thereto. That is, the display device according to an embodiment of the present invention includes not only an organic light emitting display device, but also a liquid crystal display device, a field emission display device, and a quantum dot light emitting display device. ) and an electrophoresis display.

1 and 2, a display device 100 according to an embodiment of the present invention includes a display panel 110, a source drive integrated circuit (hereinafter referred to as "IC") 140, and a flexible film. 150, a circuit board 160, and a timing controller 170.

The display panel 110 includes a first substrate 111 and a second substrate 112 . The second substrate 112 may be an encapsulation substrate. The first substrate 111 may be a plastic film or a glass substrate. The second substrate 112 may be a plastic film, a glass substrate, or an encapsulation film.

Gate lines, data lines, and pixels are formed on one surface of the first substrate 111 facing the second substrate 112 . Pixels are provided in an area defined by a cross structure of gate lines and data lines.

Each of the pixels may include an organic light emitting device including a thin film transistor, a first electrode, an organic light emitting layer, and a second electrode. Each of the pixels uses a thin film transistor to supply a predetermined current to the organic light emitting device according to the data voltage of the data line when a gate signal is input from the gate line. Due to this, the organic light emitting device of each of the pixels may emit light with a predetermined brightness according to a predetermined current. A description of the structure of each of the pixels will be described later with reference to FIG. 4 .

The display panel 110 may be divided into a display area DA where pixels are formed to display images and a non-display area NDA where images are not displayed. Gate lines, data lines, and pixels may be formed in the display area DA. A gate driver and pads may be formed in the non-display area NDA.

The gate driver supplies gate signals to the gate lines according to the gate control signal input from the timing controller 170 . The gate driver may be formed in the non-display area DA outside one or both sides of the display area DA of the display panel 110 in a gate driver in panel (GIP) method. Alternatively, the gate driver may be manufactured as a driving chip, mounted on a flexible film, and attached to the non-display area DA on one side or both sides of the display area DA of the display panel 110 by a tape automated bonding (TAB) method. may be

The source drive IC 140 receives digital video data and a source control signal from the timing controller 170. The source drive IC 140 converts digital video data into analog data voltages according to a source control signal and supplies them to data lines. When the source drive IC 140 is manufactured as a driving chip, it may be mounted on the flexible film 150 in a chip on film (COF) or chip on plastic (COP) method.

Pads such as data pads may be formed in the non-display area NDA of the display panel 110 . Wires connecting pads and the source drive IC 140 and wires connecting pads and wires of the circuit board 160 may be formed on the flexible film 150 . The flexible film 150 is attached to the pads using an anisotropic conducting film, so that the pads and wires of the flexible film 150 can be connected.

The circuit board 160 may be attached to the flexible films 150 . A plurality of circuits implemented as driving chips may be mounted on the circuit board 160 . For example, the timing controller 170 may be mounted on the circuit board 160 . The circuit board 160 may be a printed circuit board or a flexible printed circuit board.

The timing controller 170 receives digital video data and timing signals from an external system board through a cable of the circuit board 160 . The timing controller 170 generates a gate control signal for controlling the operation timing of the gate driver and a source control signal for controlling the source drive ICs 140 based on the timing signal. The timing controller 170 supplies a gate control signal to the gate driver and supplies a source control signal to the source drive ICs 140 .

3 is a plan view schematically showing a first substrate.

Referring to FIG. 3 , the first substrate 111 is divided into a display area DA and a non-display area NDA, and the pad area PA in which pads PAD1 and PAD2 are formed is formed in the non-display area NDA. , The dam 310, the first power line 320, and the second power line 330 may be formed.

Data lines and gate lines crossing the data lines are formed in the display area DA. Also, in the display area DA, pixels P displaying an image in a matrix form are formed at intersections of the data lines and the gate lines. Each of the pixels P supplies a predetermined current to the light emitting device according to the data voltage of the data line when the gate signal of the gate line is input. Due to this, the light emitting device of each of the pixels P may emit light with a predetermined brightness according to a predetermined current. In addition, power voltage is supplied to the first power line 320 and the second power line 330 . The first power line 320 and the second power line 330 supply a power voltage to each of the pixels P.

Hereinafter, the structure of the pixel P of the display area DA according to the exemplary embodiments will be described in detail with reference to FIG. 4 .

4 is a cross-sectional view showing an example of a pixel of the display area of FIG. 3 .

Referring to FIG. 4 , thin film transistors 210 and capacitors 220 are formed on one surface of the first substrate 111 .

A buffer film (not shown) may be formed on the first substrate 111 to protect the thin film transistors 210 from moisture penetrating through the first substrate 111 , which is vulnerable to moisture permeation.

Each of the thin film transistors 210 includes an active layer 211 , a gate electrode 212 , a source electrode 213 and a drain electrode 214 . In FIG. 4 , it is illustrated that the gate electrodes 212 of the thin film transistors 210 are formed in a top gate (top gate) method located above the active layer 211, but it should be noted that the present invention is not limited thereto. That is, the thin film transistor 210 is a bottom gate (bottom gate) method in which the gate electrode 212 is positioned below the active layer 211 or the gate electrode 212 is located above and below the active layer 211. It may be formed in a double gate method located in both.

An active layer 211 is formed on the buffer layer of the first substrate 111 . The active layer 211 may be formed of a silicon-based semiconductor material or an oxide-based semiconductor material. A light blocking layer may be formed on the first substrate 111 to block external light incident on the active layer 211 .

A gate insulating layer 230 may be formed on the active layer 211 . The gate insulating layer 230 may be formed of an inorganic layer, for example, a silicon oxide layer, a silicon nitride layer, or a multilayer thereof.

A gate electrode 212 may be formed on the gate insulating layer 230 . The gate electrode 212 is any one of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd) and copper (Cu) or these It may be a single layer or multi-layer made of an alloy of, but is not limited thereto.

An interlayer insulating layer 240 may be formed on the gate electrode 212 . The interlayer insulating layer 240 may be formed of an inorganic layer, for example, a silicon oxide layer, a silicon nitride layer, or a multilayer thereof.

A source electrode 213 and a drain electrode 214 may be formed on the interlayer insulating layer 240 . Each of the source electrode 213 and the drain electrode 214 may be connected to the active layer 211 through contact holes CH1 and CH2 penetrating the gate insulating layer 230 and the interlayer insulating layer 240 . The source electrode 213 and the drain electrode 214 are composed of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), and copper ( Cu) may be a single layer or a multi-layer made of any one or an alloy thereof, but is not limited thereto.

Each of the capacitors 220 includes a lower electrode 221 and an upper electrode 222 . The lower electrode 221 is formed on the gate insulating layer 230 and may be formed of the same material as the gate electrode 212 . The upper electrode 222 is formed on the interlayer insulating layer 240 and may be formed of the same material as the source electrode 223 and the drain electrode 224 .

A planarization layer 260 may be formed on the thin film transistor 210 and the capacitor 220 to flatten a step difference caused by the thin film transistor 210 and the capacitor 220 . The planarization layer 260 may be formed of an organic layer such as acryl resin, epoxy resin, phenolic resin, polyamide resin, or polyimide resin. there is.

An organic light emitting diode 280 , a bank 284 , and a spacer 285 are formed on the planarization layer 260 . The organic light emitting device 280 includes a second electrode 282 , an organic light emitting layer 283 , and a first electrode 281 . The second electrode 282 may be a cathode electrode, and the first electrode 281 may be an anode electrode. An area in which the second electrode 282 , the organic light emitting layer 283 , and the first electrode 281 are stacked may be defined as the light emitting unit EA.

The first electrode 281 may be formed on the planarization layer 260 . The first electrode 281 is connected to the source electrode 213 or the drain electrode 214 of the thin film transistor 210 through the contact hole CH3 penetrating the passivation layer and the planarization layer 260 . The first electrode 281 may include a stacked structure of aluminum and titanium (Ti/Al/Ti), a stacked structure of aluminum and ITO (ITO/Al/ITO), an APC alloy, and a stacked structure of APC alloy and ITO (ITO/APC /ITO) may be formed of a metal material with high reflectivity. An APC alloy is an alloy of silver (Ag), palladium (Pd), and copper (Cu).

The bank 284 may be formed to cover the edge of the first electrode 281 on the planarization layer 260 to partition the light emitting units EA. The bank 284 may be formed of an organic layer such as acryl resin, epoxy resin, phenolic resin, polyamide resin, or polyimide resin. .

A spacer 285 may be formed on the bank 284 . The spacer 285 may be formed of an organic layer such as acrylic resin, epoxy resin, phenolic resin, polyamide resin, or polyimide resin. . The spacer 285 may be omitted.

An organic emission layer 283 is formed on the first electrode 281 , the bank 284 and the spacer 285 . The organic light emitting layer 283 may include a hole transporting layer, at least one light emitting layer, and an electron transporting layer. In this case, when a voltage is applied to the first electrode 281 and the second electrode 282, holes and electrons move to the light emitting layer through the hole transport layer and the electron transport layer, respectively, and combine with each other in the light emitting layer to emit light.

The organic light emitting layer 283 may include a white light emitting layer that emits white light. In this case, it may be formed to cover the first electrode 281 and the bank 284 . In this case, a color filter (not shown) may be formed on the second substrate 112 .

Alternatively, the organic light emitting layer 283 may include a red light emitting layer emitting red light, a green light emitting layer emitting green light, or a blue light emitting layer emitting blue light. In this case, the organic emission layer 283 may be formed in an area corresponding to the first electrode 281 , and the color filter may not be formed on the second substrate 112 .

The second electrode 282 is formed on the organic light emitting layer 283 . When the organic light emitting display device is formed with a top emission structure, the second electrode 282 is a transparent conductive material (TCO) such as ITO or IZO that can transmit light, or magnesium (Mg). ), silver (Ag), or a semi-transmissive conductive material such as an alloy of magnesium (Mg) and silver (Ag). A capping layer may be formed on the second electrode 282 .

An encapsulation film 290 is formed on the organic light emitting device 280 . The encapsulation film 290 serves to prevent penetration of oxygen or moisture into the organic light emitting layer 283 and the second electrode 282 . To this end, the encapsulation layer 290 may include at least one inorganic layer and at least one organic layer.

For example, the encapsulation film 290 may include a first inorganic film 291 , an organic film 292 , and a second inorganic film 293 . In this case, the first inorganic layer 291 is formed to cover the second electrode 282 . An organic layer 292 is formed on the first inorganic layer 291 . The organic layer 292 is preferably formed to a thickness sufficient to prevent particles from penetrating the first inorganic layer 291 and being injected into the organic emission layer 283 and the second electrode 282 . The second inorganic layer 293 is formed to cover the organic layer 292 .

First to third color filters (not shown) and a black matrix (not shown) may be formed on the encapsulation film 290 . A red color filter may be formed in the red light emitting unit, a blue color filter may be formed in the blue light emitting unit, and a green color filter may be formed in the green light emitting unit.

The encapsulation film 290 of the first substrate 111 and the color filters (not shown) of the second substrate 112 are bonded using an adhesive layer (not shown). The substrate 112 may be bonded. The adhesive layer may be a transparent adhesive resin.

Referring back to FIG. 3 , the pad area PA may be disposed on one edge of the first substrate 111 . The pad area PA includes a plurality of pads PAD1 and PAD2, and the plurality of pads PAD1 and PAD2 are electrically connected to wires of the flexible film 150 by using an anisotropic conducting film. can

The dam 310 is disposed between the display area DA and the pad area PA to prevent the organic film 292 constituting the encapsulation film 290 of the pixel P from invading the pad area PA. Block the flow of (292). The dam 310 may include a second dam 312 and a first dam 311 .

The first power line 320 is disposed in the non-display area NDA to apply a first power voltage to the pixel P disposed in the display area DA. The second power line 330 is disposed in the non-display area NDA to apply a second power voltage to the pixel P disposed in the display area DA.

Hereinafter, with reference to FIGS. 5 to 7, the encapsulation film 290, the dam 310, the first power line 320, the second power line 330, and the organic passivation film 340 according to an embodiment of the present invention look at in detail.

FIG. 5 is an enlarged view showing area A of FIG. 3 . FIG. 6 is a cross-sectional view schematically showing a cross-section along line II-II' shown in FIG. 5, and FIG. 7 is a cross-sectional view schematically showing a cross-section along line III-III' shown in FIG.

5 to 7 , the display device according to an exemplary embodiment of the present invention includes an encapsulation film 290 formed on a first substrate 111, a dam 310, a first power line 320, a second A power line 330 and an organic passivation layer 340 are included. In this case, the first substrate 111 includes a display area DA in which pixels P are formed and a non-display area NDA surrounding the display area DA. The non-display area NDA includes a pad area PA in which a plurality of pads PAD1 and PAD2 are formed.

The encapsulation film 290 is formed to cover the organic light emitting device 280 formed in the display area DA and prevents oxygen or moisture from permeating the organic light emitting device 280 . In this case, the encapsulation film 290 includes at least one inorganic film and at least one organic film. For example, the encapsulation film 290 may include a first inorganic film 291 , an organic film 292 , and a second inorganic film 293 . In this case, the first inorganic layer 291 is formed to cover the second electrode 282 . An organic layer 292 is formed on the first inorganic layer 291 , and a second inorganic layer 293 is formed to cover the organic layer 292 . In this case, the second inorganic layer 293 may be formed on the dam 310 , the first power line 320 , the second power line 330 and the organic passivation layer 340 .

Each of the first and second inorganic layers 291 and 293 may be formed of silicon nitride, aluminum nitride, zirconium nitride, titanium nitride, hafnium nitride, tantalum nitride, silicon oxide, aluminum oxide, or titanium oxide. The first and second inorganic layers 291 and 293 may be deposited using a chemical vapor deposition (CVD) technique or an atomic layer deposition (ALD) technique, but are not limited thereto.

The organic layer 292 may be transparent to pass light emitted from the organic light emitting layer 283 . The organic layer 292 is formed of an organic material capable of passing 99% or more of the light emitted from the organic light emitting layer 283, such as acrylic resin, epoxy resin, phenolic resin, or polyamide. It may be formed of a polyamide resin or a polyimide resin. The organic layer 292 may be formed by vapor deposition using an organic material, printing, or slit coating, but is not limited thereto, and the organic layer 292 may be formed using an ink-jet jet) process.

The dam 310 is formed to surround the periphery of the display area DA and blocks the flow of the organic layer 292 constituting the encapsulation layer 290 . The dam 310 is disposed between the display area DA and the pad area PA to prevent the flow of the organic film 292 constituting the encapsulation film 290 from invading the pad area PA. block Through this, the dam 310 may prevent the organic layer 292 from being exposed to the outside of the display device or from invading the pad area PA.

The dam 310 may include a second dam 312 and a first dam 311 . The second dam 312 may be formed to surround the periphery of the display area DA and primarily block the flow of the organic layer 292 constituting the encapsulation layer 290 . In addition, the second dam 312 is disposed between the display area DA and the pad area PA to prevent the organic film 292 constituting the encapsulation film 290 from invading the pad area PA. 292) can be primarily blocked.

The second dam 312 is preferably formed spaced apart from the region where the organic light emitting device 280 is formed so that the organic layer 292 can sufficiently cover the organic light emitting device 280 formed on the first substrate 111. . In addition, the second dam 312 is preferably formed to be spaced apart from components such as the planarization film 260 and the bank 284 made of an organic material vulnerable to the external environment.

The second dam 312 may be formed on the first power line 320 and the second power line 330 supplying power voltage to each of the pixels P. The second dam 312 may include a second lower layer 312a and a second upper layer 312b. The second lower layer 312a may be formed on the first power line 320 and the second power line 330 .

The second lower layer 312a and the second upper layer 312b of the second dam 312 may be formed simultaneously with at least one of the planarization layer 260, the bank 284, and the spacer 285 of the pixel P, , at least one of the planarization layer 260, the bank 284, and the spacer 285 may be made of the same material. For example, the second lower layer 312a of the second dam 312 may be formed of the same material as the planarization film 260, and the second upper layer 312b of the second dam 312 may be formed of the bank 284 ) and can be formed simultaneously with the same material. For another example, the second lower layer 312a of the second dam 312 may be formed of the same material as the bank 284, and the second upper layer 312b of the second dam 312 may be formed of the spacer 285 ) and can be formed simultaneously with the same material. In this case, the second lower layer 312a of the second dam 312 is made of acrylic resin, epoxy resin, phenolic resin, polyamide resin, or polyimide resin. (polyimide resin) or the like.

6 and 7, the second dam 312 is described as including a second lower layer 312a and a second upper layer 312b, but is not limited thereto. In another embodiment, the second dam 312 may be formed in a three-layer structure of a lower layer, a middle layer, and an upper layer. In another embodiment, the second dam 312 may be formed in a single layer structure with only the lower layer.

The first dam 311 is formed outside the second dam 312 to secondarily block the organic layer 292 overflowing to the outside of the second dam 312 . Through this, the second dam 312 and the first dam 311 can more effectively block the organic layer 292 from being exposed to the outside of the display device or from invading the pad area PA.

The first dam 311 may be formed on the first power line 320 and the second power line 330 that supply power voltage to each of the pixels P. The first dam 311 may include a first lower layer 311a, a middle layer 311b, and a first upper layer 311c. The first lower layer 311a may be formed on the first power line 320 and the second power line 330, the intermediate layer 311b may be formed on the first lower layer 311a, and the first upper layer (311c) may be formed on the intermediate layer (311b).

The first lower layer 311a, the middle layer 311b, and the first upper layer 311c of the first dam 311 are at least one of the planarization layer 260, the bank 284, and the spacer 285 of the pixel P and It may be formed at the same time, and may be made of the same material as at least one of the planarization layer 260 , the bank 284 and the spacer 285 . For example, the first lower layer 311a of the first dam 311 may be simultaneously formed of the same material as the planarization film 260 . The middle layer 311b of the first dam 311 may be formed of the same material as the bank 284 at the same time. The first upper layer 311c of the first dam 311 may be simultaneously formed of the same material as the spacer 285 . In this case, the first lower layer 311a, the middle layer 311b, and the first upper layer 311c of the first dam 311 are made of acrylic resin, epoxy resin, or phenolic resin. , It may be formed of an organic material such as polyamide resin or polyimide resin.

In FIGS. 6 and 7 , the first dam 311 is described as including a first lower layer 311a, a middle layer 311b, and a first upper layer 311c, but is not limited thereto. In another embodiment, the first dam 311 may be formed as a single layer structure as a lower layer. In another embodiment, the first dam 311 may be formed in a two-layer structure with a lower layer and an upper layer.

The first power line 320 applies a first power voltage supplied from an external power supply to each pixel P disposed in the display area DA. More specifically, the first power line 320 may extend from the pad area PA to the display area DA. In this case, the first power line 320 may extend to a first side of the display area DA adjacent to the pad area PA. The first power line 320 is connected to the first pad PAD1 in the pad area PA and receives the first power voltage through the first pad PAD1. The first power line 320 may be connected to the pixel P in the display area DA to apply the first power voltage to the pixel P. For example, the first power line 320 may be connected to the first electrode 281 of the organic light emitting device 280 in the display area DA, and apply a first power voltage to the first electrode 281 . In this case, the first power line 320 may be directly connected to the first electrode 281 of the organic light emitting element 280 through a contact hole or indirectly connected through a separate link line (not shown).

The first power line 320 includes a first pad connection part 322 , a first connection part 324 and a first power supply part 326 as shown in FIGS. 5 and 6 .

The first pad connection part 322 is disposed between the pad area PA and the first dam 311 . The first pad connection part 322 is connected to the first pad PAD1 disposed in the pad area PA and receives the first power supply voltage from the first pad PAD1 . The first pad connection part 322 may extend from the pad area PA to the area where the first dam 311 is formed. At this time, the first pad connection part 322 is formed to overlap the first dam 311 and is connected to the first connection part 324 in the area overlapping the first dam 311 . Specifically, the first pad connection part 322 is connected to the first connection part 324 through the first contact hole CT1 exposing the first connection part 324 through the interlayer insulating layer 240 . Accordingly, the first pad connection part 322 may be electrically connected to the first connection part 324 .

The first pad connection portion 322 may be formed of the same material as the source electrode 213 and the drain electrode 214 . Also, the first pad connection 322 may be formed on the same layer as the source electrode 213 and the drain electrode 214 . The first pad connection portion 322 may be simultaneously formed of the same material as the source electrode 213 and the drain electrode 214, for example, molybdenum (Mo), aluminum (Al), chromium (Cr), or gold (Au). , Titanium (Ti), nickel (Ni), neodymium (Nd), and copper (Cu) may be a single layer or a multi-layer made of any one or alloys thereof.

The first connection part 324 is disposed between the first dam 311 and the second dam 312 . The first connection portion 324 may extend from an area overlapping the first dam 311 to an area overlapping the second dam 312 . At this time, the first connection part 324 is formed to overlap with the first dam 311 and is connected to the first pad connection part 322 through the first contact hole CT1 in the area overlapping the first dam 311. do. In addition, the first connection part 324 is formed to overlap the second dam 312 and is connected to the first power supply 326 through the second contact hole CT2 in the area overlapping the second dam 312. do. The first connection part 324 may be electrically connected to the first pad connection part 322 and the first power supply part 326 . Accordingly, the first connection unit 324 may electrically connect the first pad connection unit 322 and the first power supply unit 326 .

The first connection portion 324 may be formed of the same material as the gate electrode 212 . Also, the first connection portion 324 may be formed on the same layer as the gate electrode 212 . The first connection portion 324 may be simultaneously formed of the same material as the gate electrode 212, for example, molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), or nickel. It may be a single layer or multiple layers made of any one of (Ni), neodymium (Nd) and copper (Cu) or an alloy thereof.

The first power supply 326 is disposed between the second dam 312 and the display area DA. The first power supply 326 may extend from the area where the second dam 312 is formed to the display area DA, and may be connected to the pixel P disposed in the display area DA. At this time, the first power supply unit 326 is formed to overlap the second dam 312 and is connected to the first connection unit 324 in the area overlapping the second dam 312 . Specifically, the first power supply unit 326 is connected to the first connection unit 324 through the second contact hole CT2 exposing the first connection unit 324 through the interlayer insulating film 240 . Accordingly, the first power supply unit 326 may be electrically connected to the first connection unit 324 .

The first power supply 326 may be formed of the same material as the source electrode 213 and the drain electrode 214 . Also, the first power supply 326 may be formed on the same layer as the source electrode 213 and the drain electrode 214 . The first power supply 326 may be simultaneously formed of the same material as the source electrode 213 and the drain electrode 214, for example, molybdenum (Mo), aluminum (Al), chromium (Cr), or gold (Au). , Titanium (Ti), nickel (Ni), neodymium (Nd), and copper (Cu) may be a single layer or a multi-layer made of any one or alloys thereof.

The second power line 330 applies a second power voltage supplied from an external power supply to each pixel P disposed in the display area DA. More specifically, the second power line 330 may extend from the pad area PA to the display area DA. In this case, the second power line 330 may extend to the second and third sides perpendicular to the first side of the display area DA. The second power line 330 is connected to the second pad PAD2 in the pad area PA and receives the second power voltage through the second pad PAD2. The second power line 330 is connected to the pixel P in the display area DA, and may apply the second power voltage to the pixel P. For example, the second power line 330 may be connected to the second electrode 282 of the organic light emitting diode 280 in the display area DA, and apply a second power voltage to the second electrode 282 . In this case, the second power line 330 may be directly connected to the second electrode 282 of the organic light emitting element 280 through a contact hole or indirectly connected through a separate link line (not shown).

The second power line 330 includes a second pad connection part 332 , a second connection part 334 and a second power supply part 336 as shown in FIGS. 5 and 7 .

The second pad connection part 332 is disposed between the pad area PA and the first dam 311 . The second pad connection part 332 is connected to the second pad PAD2 disposed in the pad area PA and receives the second power supply voltage from the second pad PAD2 . The second pad connection part 332 may extend from the pad area PA to the area where the first dam 311 is formed. At this time, the second pad connection part 332 is formed to overlap the first dam 311 and is connected to the second connection part 334 in the area overlapping the first dam 311 . Specifically, the second pad connection part 332 is connected to the second connection part 334 through the third contact hole CT3 exposing the second connection part 334 through the interlayer insulating layer 240 . Accordingly, the second pad connection part 332 may be electrically connected to the second connection part 334 .

The second pad connection portion 332 may be formed of the same material as the source electrode 213 and the drain electrode 214 . Also, the second pad connection part 332 may be formed on the same layer as the source electrode 213 and the drain electrode 214 . The second pad connection portion 332 may be simultaneously formed of the same material as the source electrode 213 and the drain electrode 214, for example, molybdenum (Mo), aluminum (Al), chromium (Cr), or gold (Au). , Titanium (Ti), nickel (Ni), neodymium (Nd), and copper (Cu) may be a single layer or a multi-layer made of any one or alloys thereof.

The second connection part 334 is disposed between the first dam 311 and the second dam 312 . The second connection portion 334 may extend from an area overlapping the first dam 311 to an area overlapping the second dam 312 . At this time, the second connection portion 334 is formed to overlap the first dam 311 and is connected to the second pad connection portion 332 through the third contact hole CT3 in the area overlapping the first dam 311. do. In addition, the second connection portion 334 is formed to overlap the second dam 312 and is connected to the second power supply 336 through the fourth contact hole CT4 in the area overlapping the second dam 312. do. The second connection part 334 may be electrically connected to the second pad connection part 332 and the second power supply part 336 . Accordingly, the second connection unit 334 may electrically connect the second pad connection unit 332 and the second power supply unit 336 .

The second connection portion 334 may be formed of the same material as the gate electrode 212 . Also, the second connection portion 334 may be formed on the same layer as the gate electrode 212 . The second connection portion 334 may be formed of the same material as the gate electrode 212 at the same time, for example, molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), or nickel. It may be a single layer or multiple layers made of any one of (Ni), neodymium (Nd) and copper (Cu) or an alloy thereof.

The second power supply 336 is disposed between the second dam 312 and the display area DA. The second power supply 336 may extend from the area where the second dam 312 is formed to the display area DA, and may be connected to the pixel P disposed in the display area DA. At this time, the second power supply unit 336 is formed to overlap the second dam 312 and is connected to the second connection unit 334 in the area overlapping the second dam 312 . Specifically, the second power supply unit 336 is connected to the second connection unit 334 through the fourth contact hole CT4 exposing the second connection unit 334 through the interlayer insulating film 240 . Accordingly, the second power supply unit 336 may be electrically connected to the second connection unit 334 .

The second power supply 336 may be formed of the same material as the source electrode 213 and the drain electrode 214 . Also, the second power supply 336 may be formed on the same layer as the source electrode 213 and the drain electrode 214 . The second power supply 336 may be formed of the same material as the source electrode 213 and the drain electrode 214, for example, molybdenum (Mo), aluminum (Al), chromium (Cr), or gold (Au). , Titanium (Ti), nickel (Ni), neodymium (Nd), and copper (Cu) may be a single layer or a multi-layer made of any one or alloys thereof.

The organic passivation layer 340 is formed to cover the edges of the first power line 320 and the second power line 330 in the non-display area NDA. In the display device according to the exemplary embodiment of the present invention, the protective film formed on the thin film transistor 210 and the capacitor 220 is omitted. In this case, on the first power line 320 and the second power line 330 formed in the non-display area NDA, as shown in FIGS. 6 and 7 , the first inorganic film 291 constituting the encapsulation film 290 is formed. Alternatively, the second inorganic layer 293 is directly formed. At this time, the first inorganic film 291 or the second inorganic film 293 may have a seam due to a step generated by the first power line 320 and the second power line 330, and the seam ( Moisture can penetrate through the seam. To prevent this, the display device according to the exemplary embodiment of the present invention forms an organic passivation layer 320 to cover edges of the first power line 320 and the second power line 330 .

The organic passivation layer 340 may be formed simultaneously with at least one of the planarization layer 260, the bank 284, and the spacer 285 of the pixel P, and the planarization layer 260, the bank 284, and the spacer ( 285) may be made of the same material as at least one of them. For example, the organic passivation layer 340 and the bank 284 may be simultaneously formed of the same material. In this case, the organic passivation layer 340 is made of an organic material such as acrylic resin, epoxy resin, phenolic resin, polyamide resin, or polyimide resin. can be formed as

As described above, the organic passivation layer 340 is formed along the edges of the first power supply line 320 and the second power supply line 330 . Since the first power line 320 and the second power line 330 extend from the pad area PA toward the display area DA, the organic passivation layer 340 is formed on the first power line 320 and the second power line 330 . It may be formed in a direction from the pad area PA to the display area DA along the edge of the second power line 330 . At this time, the organic passivation layer 340 may contact the second dam 312 and the first dam 311 disposed between the pad area PA and the display area DA.

Specifically, the organic passivation layer 340 includes the first organic passivation layer 342 formed to cover the edge of the first pad connection portion 322 of the first power line 320 . The first organic passivation layer 342 may be formed along the edge of the first pad connection part 322 of the first power line 320 in a direction from the pad area PA to the display area DA. At this time, the first organic passivation layer 342 may contact the first dam 311 .

The organic passivation layer 340 includes a second organic passivation layer 344 formed to cover an edge of the first power supply unit 326 of the first power line 320 . The second organic passivation layer 344 may be formed along the edge of the first power supply 326 of the first power line 320 in a direction from the pad area PA to the display area DA. At this time, the second organic passivation layer 344 may contact the second dam 312 .

Meanwhile, the organic passivation layer 340 is not formed on the edge of the first connection portion 324 of the first power line 320 . The first connection portion 324 of the first power line 320 is formed on the same layer as the gate electrode 212, and its edge is covered by the interlayer insulating film 240. Since the first connection portion 324 of the first power line 320 is not exposed when the first inorganic film 291 or the second inorganic film 293 constituting the encapsulation film 290 is formed, a step is formed at the edge. It is not necessary to form the organic passivation layer 340 in order to reduce it.

In addition, the organic passivation layer 340 includes a third organic passivation layer 346 formed to cover an edge of the second pad connection portion 332 of the second power line 330 . The third organic passivation layer 346 may be formed along the edge of the second pad connection part 332 of the second power line 330 in a direction from the pad area PA to the display area DA. At this time, the third organic passivation layer 346 may contact the first dam 311 .

The organic passivation layer 340 includes a fourth organic passivation layer 348 formed to cover an edge of the second power supply unit 336 of the second power line 330 . The fourth organic passivation layer 348 may be formed along an edge of the second power supply 336 of the second power line 330 in a direction from the pad area PA to the display area DA. At this time, the fourth organic passivation layer 348 may contact the second dam 312 .

Meanwhile, the organic passivation layer 340 is not formed on the edge of the second connection portion 334 of the second power line 330 . The second connection portion 334 of the second power line 330 is formed on the same layer as the gate electrode 212, and its edge is covered by the interlayer insulating film 240. Since the second connection portion 334 of the second power line 330 is not exposed when the first inorganic film 291 or the second inorganic film 293 constituting the encapsulation film 290 is formed, a step is formed at the edge. It is not necessary to form the organic passivation layer 340 in order to reduce it.

In the display device according to the exemplary embodiment of the present invention, an organic passivation layer 340 covering edges of the first power line 320 and the second power line 330 is formed. In the display device according to the exemplary embodiment of the present invention, a level difference generated by the first power line 320 and the second power line 330 can be reduced by forming the organic passivation layer 340 . Accordingly, in the display device according to the embodiment of the present invention, when the first inorganic film 291 or the second inorganic film 293 constituting the encapsulation film 290 is formed, the first power line 320 and the second power supply It is possible to prevent a seam from occurring at the edge of the line 330 .

Meanwhile, in the display device according to the embodiment of the present invention, despite the formation of the organic passivation layer 340, moisture penetrating from the outside flows into the organic light emitting device 280 of the display area DA through the organic passivation layer 340. can prevent

In a display device according to an exemplary embodiment of the present invention, a first power line 320 includes a first pad connection part 322 , a first connection part 324 , and a first power supply part 326 . In the display device according to the exemplary embodiment of the present invention, the first connection part 324 formed on the same layer as the gate electrode 212 is disposed between the second dam 312 and the first dam 311, and the first connection part 324 ) is connected to the first pad connection part 322 and the first power supply part 326 through the first and second contact holes CT1 and CT2. That is, in the display device according to the exemplary embodiment of the present invention, the organic passivation layer 340 may not be formed between the second dam 312 and the first dam 311 . The display device according to the exemplary embodiment of the present invention includes an organic passivation layer 340 extending from the pad area PA to the first dam 311 and an organic passivation layer 340 extending from the second dam 312 to the display area DA. ) may be spaced apart from each other. In the display device according to the embodiment of the present invention, moisture penetrating into the organic passivation layer 340 extending from the pad area PA to the first dam 311 extends from the second dam 312 to the display area DA. Inflow into the organic passivation layer 340 may be prevented. As a result, the display device according to the exemplary embodiment of the present invention can prevent moisture penetrating into the organic passivation layer 340 extending from the pad area PA to the first dam 311 from flowing into the display area DA. there is.

In the display device according to the exemplary embodiment of the present invention, the second power line 330 includes a second pad connection part 332 , a second connection part 334 , and a second power supply part 336 . In the display device according to the exemplary embodiment of the present invention, a second connection portion 334 formed on the same layer as the gate electrode 212 is disposed between the second dam 312 and the first dam 311, and the second connection portion 334 ) is connected to the second pad connection part 332 and the second power supply part 336 through the third and fourth contact holes CT3 and CT4. That is, in the display device according to the exemplary embodiment of the present invention, the organic passivation layer 340 may not be formed between the second dam 312 and the first dam 311 . The display device according to the exemplary embodiment of the present invention includes an organic passivation layer 340 extending from the pad area PA to the first dam 311 and an organic passivation layer 340 extending from the second dam 312 to the display area DA. ) may be spaced apart from each other. In the display device according to the embodiment of the present invention, moisture penetrating into the organic passivation layer 340 extending from the pad area PA to the first dam 311 extends from the second dam 312 to the display area DA. Inflow into the organic passivation layer 340 may be prevented. As a result, the display device according to the exemplary embodiment of the present invention can prevent moisture penetrating into the organic passivation layer 340 extending from the pad area PA to the first dam 311 from flowing into the display area DA. there is.

In addition, the display device according to the embodiment of the present invention can prevent moisture penetrating into the first dam 311 from flowing into the organic passivation layer 340 extending from the second dam 312 to the display area DA. there is. Recently, the bezel has been narrowed, so the distance between the dam 310 and the display area DA is shortened. For this reason, the organic film 292 constituting the encapsulation film 290 easily overflows to the outside of the dam 310 . In order to prevent this, it is preferable to form the first dam 311 high in height by forming a three-layer structure of a lower layer, a middle layer, and an upper layer. However, when the height of the first dam 311 is formed high in this way, the possibility of damage to the first dam 311 increases during the process. In the display device according to the exemplary embodiment of the present invention, since the organic passivation layer 340 is spaced apart from the first dam 311 and extends from the second dam 312 to the display area DA, penetration into the damaged first dam 311 occurs. Inflow of moisture into the display area DA through the organic passivation layer 340 may be prevented.

In addition, in the display device according to the embodiment of the present invention, the contact holes CT1 , CT2 , CT3 , and CT4 to be connected to the first connection part 324 and the second connection part 334 are connected to the second dam 312 or the second dam 312 . 1 formed to overlap with the dam 311. The second dam 312 or the first dam 311 may cover the level difference generated by the contact holes CT1 , CT2 , CT3 , and CT4 . Accordingly, since the encapsulation film 290 is not formed on the contact holes (CT1, CT2, CT3, and CT4) in the display device according to the embodiment of the present invention, the contact holes (CT1, CT2, CT3, and CT4) It is possible to prevent inorganic membrane seams from occurring.

Although the embodiments of the present invention have been described in more detail with reference to the accompanying drawings, the present invention is not necessarily limited to these embodiments, and may be variously modified and implemented without departing from the technical spirit of the present invention. . Therefore, the embodiments disclosed in the present invention are not intended to limit the technical idea of the present invention, but to explain, and the scope of the technical idea of the present invention is not limited by these embodiments. Therefore, the embodiments described above should be understood as illustrative in all respects and not limiting. The protection scope of the present invention should be construed according to the claims, and all technical ideas within the equivalent range should be construed as being included in the scope of the present invention.

100: display device 110: display panel
111: first substrate 112: second substrate
140: source drive IC 150: flexible film
160: circuit board 170: timing control unit
210: thin film transistor 211: active layer
212: gate electrode 213: source electrode
214: drain electrode 220: capacitor
221: lower electrode 222: upper electrode
230: gate insulating film
260: planarization film 280: organic light emitting device
281: first electrode 283: organic light emitting layer
282 second electrode 284 bank
285: spacer 290: sealing film
291: first inorganic layer 292: organic layer
293: second inorganic film 310: dam
320: first power line 330: second power line
340: organic protective film

Claims (16)

a substrate including a display area on which pixels are disposed, and a pad area including a first pad;
a first power line supplying the first power voltage input from the first pad to the pixel; and
a first dam disposed between the display area and the pad area;
The first power line includes a first pad connection portion connected to the first pad, and a first connection portion electrically connected to the first pad connection portion through a first contact hole, wherein the first contact hole includes the first contact hole. 1 A display device characterized in that it overlaps with the dam. According to claim 1,
The display device further comprising a second dam disposed between the display area and the first dam. According to claim 2,
The display device of claim 1 , further comprising a first power supply unit electrically connected to the first connection unit through a second contact hole to supply the first power supply voltage to the pixel. According to claim 3,
The display device, characterized in that the second contact hole overlaps the second dam. According to claim 3,
The fire,
a gate electrode disposed on the substrate;
an interlayer insulating film disposed on the gate electrode; and
A display device comprising a source electrode and a drain electrode disposed on the interlayer insulating film. According to claim 5,
The first pad connection part and the first power supply part are made of the same material as the source electrode and the drain electrode, and the first connection part is made of the same material as the gate electrode. According to claim 3,
a first organic passivation layer formed to cover an edge of the first pad connection portion; and
The display device further comprising a second organic passivation layer formed to cover an edge of the first power supply unit. According to claim 7,
The display device according to claim 1 , wherein the first organic passivation layer and the second organic passivation layer are spaced apart from each other. According to claim 7,
The display device according to claim 1 , wherein the first organic passivation layer is directly formed on the first pad connection part, and the second organic passivation layer is directly formed on the first power supply part. According to claim 7,
Further comprising an encapsulation film covering the display area and including at least one inorganic film,
The at least one inorganic layer is directly formed on the first organic passivation layer and the second organic passivation layer. According to claim 2,
The display device, characterized in that the first connection portion is formed from an area overlapping the first dam to an area overlapping the second dam. According to claim 1,
The first dam includes a first lower layer, a middle layer, and a first upper layer. According to claim 2,
The pad area further includes a second pad,
and a second power supply line supplying the second power supply voltage input from the second pad to the pixel. According to claim 13,
The second power line includes a second pad connection portion connected to the second pad, and a second connection portion electrically connected to the second pad connection portion through a third contact hole, wherein the third contact hole comprises the first contact hole. 1 A display device characterized in that it overlaps with the dam. According to claim 14,
The second power supply line may further include a second power supply part electrically connected to the second connection part through a fourth contact hole to supply the second power voltage to the pixel, the fourth contact hole having the second power supply voltage. A display device characterized in that it overlaps with the dam. According to claim 13,
The pixel includes a first electrode, an organic light emitting layer and a second electrode,
The first power line supplies the first power voltage to the first electrode of the pixel, and the second power line supplies the second power voltage to the second electrode of the pixel. Device.

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