KR101680219B1 - Proving chamber and proving method - Google Patents

Abstract

A probing chamber according to an embodiment of the present invention includes a chuck; A carrier disposed on the chuck; A carrier handling unit operable to operate the carrier so that the object is exposed to a space inside the chamber in a vacuum state; And a probe capable of contacting an object exposed in the chamber interior space.

Description

[0001] PROBING CHAMBER AND PROBING METHOD [0002]

The present invention relates to a probing chamber and a probing method.

The probing chamber can supply a specific electrical signal to the object through the probe and measure the characteristics according to the specific electrical signal.

The probing chamber may maintain a vacuum in the chamber interior to reduce or minimize the effects of oxygen or foreign matter.

However, during the placement of the object in the probing chamber, the object may be exposed to oxygen or other foreign objects, which may contaminate or oxidize the object and degrade the accuracy and reliability of the probing operation.

Accordingly, research on a probing chamber that can prevent the object from being exposed to oxygen or other foreign substances is underway.

Patent No. 10-0655689 (Date of Notification: December 08, 2006)

A probing chamber and probing method according to an embodiment of the present invention is for probing an object in a vacuum state.

The probing chamber and probing method according to an embodiment of the present invention is for more accurately measuring the characteristic of the object temperature in a vacuum state.

The task of the present application is not limited to the above-mentioned problems, and another task which is not mentioned can be clearly understood by a person skilled in the art from the following description.

According to an aspect of the present invention, A carrier disposed on the chuck; A carrier handling unit operable to operate the carrier so that the object is exposed to a space inside the chamber in a vacuum state; And a probe capable of contacting an object exposed in the chamber interior space.

The chuck can supply heat to the carrier, which can transfer the heat to the object.

A sealing material may be applied between the chuck and the one side of the carrier facing each other, and between the object and the inner side of the carrier.

The sealing material may be a vacuum grease.

The carrier includes a mounting portion on which the object is placed and a cap covering the mounting portion, and the cap may be formed with a hole into which the carrier handling portion is inserted.

The carrier handling portion may be inserted into the hole to separate the cap from the mounting portion in the chamber interior space.

According to another aspect of the present invention, there is provided a method comprising: introducing a closed carrier having an object disposed therein into a probing chamber; Maintaining a chamber interior space of the probing chamber in a vacuum; Exposing the object disposed in the carrier to the chamber interior space; And performing probing on the object.

The carrier may be hermetically sealed after the object is placed in a vacuum state space separate from the internal space of the chamber.

And heat can be applied to the carrier while the space inside the chamber is maintained in a vacuum state.

Applying a seal material between the object and the inner side surface of the carrier according to another aspect of the present invention, and applying a seal material between the chucks facing one another and the one side surface of the carrier.

Probing Chamber and Probing Method According to an Embodiment of the Present Invention Since a probing operation can be performed after exposing an object to a space inside a chamber in a vacuum state, more accurate measurement can be performed on the object.

The probing chamber and the probing method according to the embodiment of the present invention can more accurately measure the temperature characteristics of the object under vacuum through the carrier and the sealing material.

The effects of the present application are not limited to the effects mentioned above, and other effects not mentioned can be clearly understood by those skilled in the art from the following description.

1 shows a probing chamber according to an embodiment of the present invention.
Figures 2 and 3 illustrate a carrier of a probing chamber according to an embodiment of the present invention.
FIG. 4 shows probing work on an object in a probing chamber according to an embodiment of the present invention.
5 is a flowchart of a probing method according to an embodiment of the present invention.
6 shows an example in which the carrier moves to the probing chamber.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. It is to be understood, however, that the appended drawings illustrate the present invention in order to more easily explain the present invention, and the scope of the present invention is not limited thereto. You will know.

Also, the terms used in the present application are used only to describe certain embodiments and are not intended to limit the present invention. The singular expressions include plural expressions unless the context clearly dictates otherwise.

In the present application, the terms "comprises" or "having" and the like are used to specify that there is a feature, a number, a step, an operation, an element, a component or a combination thereof described in the specification, But do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, or combinations thereof.

1 shows a probing chamber according to an embodiment of the present invention. 1, a probing chamber according to an embodiment of the present invention includes a chuck 110, a carrier 120, a carrier handling portion 130, and a probe 140 .

The carrier 120 is disposed on the chuck 110. The chuck 110 may apply heat to the carrier 120 and the object 10 such as a chip, a circuit board, a flexible battery or a solar cell may be disposed within the carrier 120, But is not limited thereto.

The operation stability of the object 10 with respect to temperature is very important as the area in which the object 10 is used extends to a high-performance electronic device or an energy generating device as well as an automobile.

Therefore, the test for the object 10 is performed for a long time in the desired temperature range, and the heat required at this time can be supplied from the chuck 110.

The temperature of the carrier 120 due to the heat applied by the chuck 110 to the carrier 120 may be from -190 degrees Celsius to 300 degrees Celsius or less, but is not limited thereto.

The carrier handling part 130 operates the carrier 120 so that the object 10 is exposed to the space inside the chamber in a vacuum state. Factors other than temperature must be reduced or minimized so that the properties of the object 10 against the temperature can be accurately tested.

For example, oxygen in the chamber interior may oxidize the object 10 so that the properties of the object 10 with respect to temperature may not be accurately measured.

Accordingly, the probing chamber according to the embodiment of the present invention can maintain the chamber interior space in a vacuum after the carrier 120 is disposed on the chuck 110, Lt; RTI ID = 0.0 > chamber. ≪ / RTI > Whereby the characteristic of the object 10 with respect to the temperature in the vacuum state can be measured.

Meanwhile, the probe 140 of FIG. 1 can contact the object 10 exposed in the space inside the chamber. The probe 140 can contact an electrode pad (not shown) or a terminal of the object 10 and can supply an electrical signal for measurement to the electrode pad.

The driving of the probe 140 is common to those of ordinary skill in the art, and a description thereof will be omitted.

2 and 3, the object 10 can be exposed to the space inside the chamber in a vacuum state. That is, the carrier 120 may include a mounting portion 121 on which the object 10 is placed, and a cap 123 covering the mounting portion 121. At this time, the cap 123 may be formed with a hole into which the carrier handling part 130 is inserted.

The cap 123 can cover the mounting portion 121 after the object 10 is placed on the mounting portion 121. [ In this state, the carrier 120 can be placed on the chuck 110 inside the probing chamber. The carrier 120 can be fixed to the chuck 110 by the fastening portion 115 after the carrier 120 is disposed on the chuck 110. [

Once the carrier 120 is disposed within the probing chamber, the interior of the probing chuck can be evacuated by a vacuum pump (not shown) or the like.

As shown in FIGS. 2 and 3, the carrier handling portion 130 is inserted into the hole of the cap 123, and the cap 123 can be lifted from the holder. That is, the carrier handling part 130 can be inserted into the hole, and the cap 123 can be separated from the mounting part 121 in the chamber interior space. Accordingly, the object 10 can be exposed to the space inside the chamber in a vacuum state.

A driving unit (not shown) for the carrier handling unit 130 may be provided inside or outside the probing chamber. The driving unit may drive the carrier handling unit 130 in the axial direction of the carrier handling unit 130 and the height direction of the space in the chamber, but the present invention is not limited thereto. The operation of the carrier handling unit 130 may vary depending on the structure of the driving unit .

Meanwhile, as described above, the chuck 110 supplies heat to the carrier 120, and the carrier 120 can transfer heat to the object 10. The sealing material 150 may be applied between the chuck 110 facing one another and one side of the carrier 120 and between the object 10 and the inside side of the carrier 120. Such a sealing material 150 may be a vacuum grease.

The carrier 120 may be disposed on the chuck 110 so that there may be a slight gap between the carrier 120 and the chuck 110 which prevents the transfer of heat from the chuck 110 to the carrier 120 can do. The heat supplied from the chuck 110 may not be uniformly transferred to the carrier 120 because heat is less transmitted to the carrier 120 in the region having the voids.

The sealant 150 is applied between the chuck 110 and the carrier 120 to eliminate the air gap between the chuck 110 and the carrier 120 so that heat can be uniformly transferred to the carrier 120. [ For the same reason, the sealing material 150 is applied between the object 10 and the mounting part 121 so that heat can be uniformly transmitted from the mounting part 121 to the object 10. [

As described above, since the chuck 110 transfers heat of a few hundreds of degrees to the carrier 120 at the zero-th hundred degrees, the sealing material 150 must also be able to withstand such temperature range heat, The heat can withstand.

4, after the cap 123 is separated from the mounting portion 121 by the carrier handling portion 130, the object 10 is exposed to the space inside the chamber in the vacuum state, and the probe 140 is exposed to the object (10) and the probing operation can be performed.

As described above, the probing chamber according to the embodiment of the present invention can perform the probing operation after exposing the object 10 to the space inside the chamber in a vacuum state, thereby performing a more accurate measurement on the object 10 can do.

Next, a probing method according to an embodiment of the present invention will be described with reference to the drawings.

5, a probing method according to an embodiment of the present invention includes a step (S110) of inserting a sealed carrier 120 in which a target 10 is disposed into a probing chamber (S110) (S130) of exposing the object (10) placed in the carrier (120) to the space inside the chamber (S140), and performing a probing for the object (10) (S140).

Steps S110 to S140 have been described in detail earlier, and a description thereof will be omitted.

On the other hand, as shown in FIG. 6, the carrier 120 may be sealed after the object 10 is placed in a separate vacuum state space different from the internal space of the chamber. For example, the carrier 120 may be capped after the object 10 is placed on a cradle in a glove box 200 in a vacuum or nitrogen atmosphere.

With the cap 123 closed, the carrier 120 can be transferred from the glove box to the probing chamber and the probing chamber can be evacuated after the carrier 120 is placed on the chuck 110 of the probing chamber .

The object 10 is placed in the carrier 120 and the impact on the object 10 in the atmosphere in the course of the carrier 120 being placed on the chuck 110 of the probing chamber can be minimized.

As described above, after the carrier 120 is transferred into the probing chamber, heat can be applied to the carrier 120 while the chamber interior space is maintained in a vacuum state. Accordingly, a probing operation for measuring the influence of the temperature of the object 10 can be more accurately performed.

The probing method according to an embodiment of the present invention includes a step of applying a sealing material 150 between the object 10 and the inner side surface of the carrier 120 and the step of applying a sealing material 150 between the object 110 and the side surface of the carrier 120 And then applying the sealing material 150 to the sealing material 150.

In this case, the step of applying the sealing material 150 between the object 10 and the inner side surface of the carrier 120 may be performed in a vacuum state space separate from the space inside the chamber, such as a glove box.

The carrier 120 having the cap 123 closed may be disposed on the chuck 110 after the sealing material 150 is applied between the chuck 110 and the carrier 120 facing each other. After the probing chamber is then evacuated, the cap 123 may be removed and a probing operation for the object 10 may be performed.

It will be apparent to those skilled in the art that the present invention may be embodied in other specific forms without departing from the spirit or scope of the invention as defined in the appended claims. . Therefore, the above-described embodiments are to be considered as illustrative rather than restrictive, and the present invention is not limited to the above description, but may be modified within the scope of the appended claims and equivalents thereof.

The object (10)
The chuck 110,
The coupling part 115,
A carrier 120,
The mounting portion 121,
The cap (123)
The carrier handling unit 130,
The probes 140,
Sealing material 150
The glove box (200)

Claims (10)

chuck;
A carrier disposed on the chuck;
A carrier handling unit operable to operate the carrier so that the object is exposed to a chamber interior space in a vacuum state; And
And a probe capable of contacting the object exposed in the chamber interior space,
Wherein the carrier includes a mounting portion on which the object is placed and a cap covering the mounting portion,
Wherein the carrier handling portion separates the cap from the mounting portion in the chamber interior space.
The method according to claim 1,
Wherein the chuck supplies heat to the carrier,
Wherein the carrier transfers the heat to the object.
3. The method of claim 2,
Characterized in that a sealing material is applied between the chuck and the one side of the carrier facing each other and between the object and the inner side of the carrier.
The method of claim 3,
Wherein the sealing material is a vacuum grease.
The method according to claim 1,
Wherein the cap is formed with a hole into which the carrier handling portion is inserted.
6. The method of claim 5,
Wherein the carrier handling portion is inserted into the hole to separate the cap from the mounting portion in the chamber interior space.
Introducing a closed carrier having an object disposed therein into a probing chamber;
Maintaining a chamber interior space of the probing chamber in a vacuum;
Exposing the object disposed in the carrier to the chamber interior space; And
And performing probing on the object,
Wherein the carrier includes a mounting portion on which the object is placed and a cap covering the mounting portion,
Wherein the cap is separated from the mounting portion in the chamber interior space so that the object is exposed in the chamber interior space.
8. The method of claim 7,
Wherein the carrier is hermetically sealed after the object is placed in a separate vacuum space separate from the chamber interior space.
8. The method of claim 7,
And heating the carrier in a state in which the space inside the chamber is maintained in a vacuum state.
10. The method of claim 9,
Applying a sealing material between the object and the inner side surface of the carrier, and applying a sealing material between one side of the chuck facing each other and one side of the carrier.

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