KR101031239B1 - Capacitive IMD SLR Injection Touch Screen Panel - Google Patents

Abstract

The present invention relates to a capacitive-type In-Mould Decoration Slim (IMDSL) injection touch screen panel.
To this end, the present invention, in the In-Mould Decoration Slim Touch Screen Panel (Capacitive Type) of the capacitive type, the panel is disposed at regular intervals with the second substrate, the window IMDSL injection molding step By inserting a transparent (Indium Tin Oxide (ITO)) film printed a desired pattern in the IMDSL injection ITO deposit 210 formed by low temperature sputtering at the same time by the pattern etching on the bottom of the IMDSL injection ITO deposit A first substrate 200 having a first electrode 220 patterned by an electrical wiring circuit and printed with silver powder; A flexible printed circuit (FPC) bonding (230) bonded to the electrical wiring circuit terminal portion of the first substrate 200, the circuit is formed on a flexible insulating film, Is disposed at a predetermined interval from the first substrate, the lower portion of the transparent (ITO) film 320, the heat treatment for preventing the occurrence of stress or cracking of the adhesive portion due to rapid heating or rapid cooling of the product 331 And a second, in which an electrical wiring circuit is patterned and printed with silver powder by wet etching 332 which forms a thin film on a substrate (or ITO film) and forms a circuit pattern through chemical etching. A second substrate 300 having a coating film layer including an electrode 330, and the first substrate 200 and the second substrate 300 are attached to each other, and patterned on an indium tin oxide (ITO) film. Transparent adhesive that complements the eye invisibly (Optical Clear A dhesive: OCA, 400) provides a capacitive IMDSL injection touch screen panel characterized in that it is included.
Therefore, the present invention has a thinner thickness and sufficient durability, and at the same time, the design of the panel is freed by the slimming of the panel, and the light transmittance is greatly improved by the slimming, thereby realizing the same performance as the conventional products even at a low display brightness, thereby reducing power consumption. And the use time of the battery can be significantly increased. In addition, it is resistant to external pollution, does not require a separate UV process, and can be expected to reduce the cost as each component can be integrated while there is little color change due to thickness difference. In addition, since the sensing electrode is directly formed on the IMDSL injection, there is no need for a separate lamination process such as an OCA, so there is a unique effect of shortening the manufacturing process and promoting low carbon green growth.

Description

In-Mould Decoration Slim Touch Screen Panel for Capacitive Type}

The present invention relates to an In-Mould Decoration Slim (IMDSL) capacitive touch screen panel, and more particularly, to reduce the number of parts of a capacitive touch screen panel using low temperature sputtering and IMD injection, thereby improving light transmittance by slimming. It is about capacitive IMDSL injection touch screen panel that can express design freely and promote low carbon green growth.

Recently, with the launch of the Touch Screen Panel (TSP) in which transparent electrodes are integrated into display and tempered glass, the competition for the touch screen market is intensifying.

The touch screen panel (TSP) has various advantages of flat panel display devices such as electronic organizers, liquid crystal display devices (LCDs), plasma display panels (PDPs), electroluminescense (EL), and cathode ray tubes (CRTs). It is a flat-panel-display and a tool used to allow users to select the information they want through the display. It is largely resistive and resistive-multi. Type), capacitive type, and the like.

The resistive type is formed by coating a resistive material on a glass or plastic plate and covering a polyethylene film thereon. Can be. The high resolution and the fastest response speed have the disadvantages of only one point and the risk of breakage.

The resistive-multi-touch type refers to an implementation that can be implemented in the same way as the capacitive method by compensating for and improving the maximum disadvantage of the resistive film method that can be executed by only one point.

Capacitive type is made by coating transparent special conductive metal (TAO) on both sides of heat treated glass. When a voltage is applied to the four corners of the screen, the high frequency spreads in front of the sensor. When a finger touches the screen, the flow of electrons changes and the change is detected to find the coordinates. Capacitive type has the advantage of being able to execute by pressing several points at the same time, high resolution and good durability, while low response speed and difficult to install.

The touch screen panel (TSP), as well as the problem of signal amplification, the difference in resolution, the difficulty of design and processing technology, as well as the characteristic optical, electrical, mechanical, environmental resistance, input characteristics, It is selected for individual electronic products in consideration of durability and economical efficiency, and resistive type and capacitive type are widely used in electronic notebooks, PDAs, portable PCs, and mobile phones (cell phones). .

The future direction of the touch screen manufacturing technology, it is necessary to manufacture a thinner thickness of the touch screen panel to have sufficient durability even if the conventional complex process as much as possible. The reason is that even if the display brightness is increased by lowering the light transmittance, the same performance as the existing product can be achieved, thereby reducing the power consumption and increasing the battery usage time.

Meanwhile, a capacitive touch screen panel has been proposed in FIG. 1A, and FIG. 1B shows a process of manufacturing a capacitive touch screen panel in FIG. 1A. .

1, an optical clear adhesive (OCA) 103 is adhered between the tempered glass 101 and the ITO film 102 on one surface of the liquid crystal display, and a general silver P / T and coating film 110 is provided. ) To form a layer.

However, this technique is very complicated in manufacturing process, in particular, forming a silver P / T (104) layer on the bottom of a single substrate made of tempered glass 101, ITO film 102 and light transparent adhesive 103, A flexible printed circuit (FPC) 105 having a coating film layer formed on a lower terminal portion of a single substrate is bonded. Tempered glass is one of the important parts for manufacturing touch screen panel (TSP), but it is mainly supplied by Chinese companies due to the problem of pollutant treatment, and it is caused by low yield, frequent defects and scattering due to external impact.

Therefore, in order to solve the scattering problem, the present invention minimizes the predicted small risk by fundamentally blocking the scattering problem caused by the use of conventional tempered glass by incorporating an application-modified IMD (In-Mould Decoration) injection material, which is an injection molding simultaneous transfer surface treatment technique. In addition, the present invention provides a new capacitive touch screen panel technology that can make the touch screen panel thinner and provide more freedom of design and greatly reduce the number of parts due to panel manufacturing.

Therefore, the present invention has been made to solve the above problems, more specifically, instead of laminating the ITO FILM using a separate optical transparent adhesive (OCA) to attach a conventional reinforced glass layer. By molding IMDSL ITO by integrating IMD injection by low temperature sputtering, which has excellent uniformity of resistance value, permeability and adhesion of base material into one, 1) touch screen panel is thinner and has sufficient durability. It is possible to design freely by slimming. 2) It can reduce the power consumption by improving the light transmittance and increase the use time of the battery. 3) It can shorten the working time and promote low carbon green growth by reducing adhesive material by eliminating lamination An object of the present invention is to provide a capacitive IMDSL injection touch screen panel.

According to a feature of the present invention for achieving the above object, in the In-Mould Decoration Slim Touch Screen Panel (Capacitive Type) of the capacitive type, the panel at regular intervals from the second substrate The IMDSL injection ITO deposit 210 and the IMDSL injection ITO are formed by inserting a transparent (Indium Tin Oxide (ITO)) film printed with a desired pattern in the window IMDSL injection mold step and simultaneously formed by low temperature sputtering. A first substrate 200 having a first electrode 220 patterned on the bottom of the deposit by pattern etching and printed with silver powder; A flexible printed circuit (FPC) bonding (230) bonded to the electrical wiring circuit terminal portion of the first substrate 200, the circuit is formed on a flexible insulating film, Is disposed at a predetermined interval from the first substrate, the lower portion of the transparent (ITO) film 320, the heat treatment for preventing the occurrence of stress or cracking of the adhesive portion due to rapid heating or rapid cooling of the product 331 And a second, in which an electrical wiring circuit is patterned and printed with silver powder by wet etching 332 which forms a thin film on a substrate (or ITO film) and forms a circuit pattern through chemical etching. A second substrate 300 having a coating film layer including an electrode 330, and the first substrate 200 and the second substrate 300 are attached to each other, and patterned on an indium tin oxide (ITO) film. Transparent adhesive that complements the eye invisibly (Optical Clear A dhesive: OCA, 400) provides a capacitive IMDSL injection touch screen panel characterized in that it is included.

Preferably, the IMDSL injection is characterized in that it is made of polycarbonate (PC) having flexibility to enable the desired design design.

Preferably, the low temperature sputtering, after completion of the first low temperature Nb205 sputtering and the second low temperature SiO2 sputtering on the lower surface of the IMDSL injection to maintain the permeability and adhesion on the window IMDSL injection, ITO sputtering again to the electrical shape Characterized in making.

Preferably, the first electrode is characterized in that the electrical wiring circuit is previously patterned on the bottom edge of the IMDSL injection ITO deposit and printed with silver powder.

Preferably, the first substrate, a window printing layer (not shown) for inserting a letter or logo can be formed on the lower surface of the first substrate, the window printing layer is embedded in the IMDSL injection ITO deposit layer It is done.

Preferably, the second electrode is characterized in that the electrical wiring circuit is pre-patterned in the edge portion of the ITO film 320 layer is printed with silver powder.

Preferably, the capacitive IMDSL injection touch screen panel has a thickness of 0.6 to 0.968T.

According to the capacitive IMDSL injection touch screen panel of the present invention has the following effects.

The present invention implements a touch screen panel using an IMDSL injection ITO deposit integrated by a low temperature sputtering without the need for a separate optical transparent adhesive (OCA) to attach a conventional tempered glass and ITO film,

(1) The IMDSL injection touch screen panel can be molded into one integrated IMDSL injection ITO deposit by low temperature sputtering, so that it is thinner and has sufficient durability.

(2) IMDSL injection touch screen panel is a technique that can produce various designs by changing pattern film while maintaining the existing injection. This is free.

(3) The IMDSL injection touch screen panel is slimmer, so the light transmittance is greatly improved. Therefore, even if the display brightness is reduced, the same performance as the existing products can be realized, and the power consumption and battery life can be greatly increased.

(4) IMDSL injection touch screen panel is resistant to external pollution, does not need to take extra UV means, and it can expect cost-saving effect by integrating each component with little color change by thickness difference. have.

(5) Since the IMDSL injection touch screen panel forms a sensing electrode (or ITO film) directly on the IMDSL injection, it does not require a separate adhesive material such as an optical transparent adhesive (OCA) for lamination, thereby reducing the adhesion material due to lamination and It has a unique effect of shortening the time and promoting low carbon green growth.

1 (a) is a view schematically showing the configuration of a conventional capacitive touch screen panel
1 (b) is a view showing a detailed configuration and process for the (a) of FIG.
Figure 2 (a) is a diagram schematically showing the configuration of a capacitive IMDSL injection touch screen panel according to an embodiment of the present invention
2 (b) is a view showing a detailed configuration and process for the (a) of FIG.
FIG. 3 is a real photograph of a first substrate formed by low temperature sputtering of an IMDSL injection ITO deposit for a capacitive IMDSL injection touch screen panel according to a preferred embodiment of the present invention
4 is a diagram illustrating an OCA lamination structure for a capacitive IMDSL injection touch screen panel according to an exemplary embodiment of the present invention.
5 is a real picture comparing the thickness of the capacitive IMDSL injection touch screen panel according to an embodiment of the present invention with conventional products
6 is a real picture showing that the free design of the capacitive IMDSL injection touch screen panel according to an embodiment of the present invention is possible

Hereinafter, a capacitive type IMDSL injection touch screen panel according to a preferred embodiment of the present invention will be described in detail with reference to the accompanying drawings.

First, in adding reference numerals to the elements of each drawing, it should be noted that the same reference numerals are used to refer to the same elements even though they are shown in different drawings. In describing the present invention, when it is determined that the detailed description of the related well-known configuration or function may obscure the gist of the present invention, the detailed description thereof will be omitted.

2 to 6, a key technical solution according to an embodiment of the present invention is to form a first substrate 200 having an IMDSL injection ITO deposit layer and a terminal portion of an electrical wiring circuit of the first substrate. Flexible Printed Circuit (FPC) Bonding 230, a second substrate 300 having a coating film layer and an optical clear adhesive for attaching the first / second substrate (Optical Clear Adhesive) : OCA) 400.

First, referring to FIG. 2, the first substrate 200 is disposed on one surface of a liquid crystal display such as a mobile phone (mobile phone) to provide information to a liquid crystal display module (not shown) in which an image is formed. In order to electrically input, an IMDSL injection product 211 protecting an indium tin oxide film 214 and the ITO film 214 having a sensing electrode function are integrated into one and formed by low temperature sputtering. The electrical wiring circuit by pattern etching is patterned on the lower surface of the IMDSL injection ITO deposit 210 and the lower surface of the IMDSL injection ITO deposit 210 to be printed on AG The first electrode 220 is included.

Here, the first substrate 200 according to the embodiment of the present invention is disposed at regular intervals from the second substrate 300 to be described later.

In addition, performing pattern etching on the lower surface of the IMDSL injection ITO deposit 210 layer solves problems such as a failure in tensioning or a failure in lamination of the semiconductor thin film resist layer.

Indium Tin Oxide (ITO) refers to tin oxide and refers to a transparent and electrically conductive material. In general, ITO (Indium Tin Oxide) is Sn doped In₂O₃ at the ratio of In₂O₃: SnO₂ = 90: 10 ~ 95: 5, and ITO has similar characteristics to ATO, a new nano material, but has higher electrical conductivity and higher band-width than ATO. Since the gap is 2.5eV or more and shows high transmittance in the visible region, it is used in various display panels, electromagnetic wave shielding films, and organic EL. In addition, it has excellent electrode pattern workability compared to other transparent electrode materials, excellent chemical and thermal stability, and low resistance during coating.

The IMDSL injection product 211 according to an embodiment of the present invention may include one made of polycarbonate (PC) having flexibility to enable a desired design design.

Here, IMDSL injection product is a term that combines In-Mould Decoration (IMD), which is an injection molding simultaneous transfer surface treatment technique that has flexibility such as plastic, and Slimed, which manufactures a thinner touch screen panel. Refers to a surface treatment technique that can compress plastic injection, painting, printing, and coating that have been separately processed into one process and at the same time realize various colors and patterns.

In addition, the IMDSL injection product 211 is a means of protecting the transparent (ITO) film 214 having a sensing electrode function, and is made of polycarbonate (PC) resin, and the PC is manufactured by Bayer of Germany in 1956. A resin produced for the first time is generally a polycarbonate ester produced by the reaction of bisphenol A and phosgene. In addition, polycarbonate has a melting point of 230 ℃, heat deformation temperature of 120 ~ 140 ℃, high mechanical strength and excellent water resistance. Chemical resistance is strong in acid but weak in alkali and stable in aliphatic hydrocarbons, higher alcohols and fats and oils, but soluble in other organic solvents. In particular, it is characterized by high impact resistance and high modulus of elasticity. It is excellent in light resistance and does not decolor even when irradiated with ultraviolet rays for 72 hours or in air at 150 ° C. for 26 weeks and in air at 170 ° C. for 8 weeks, and its physical properties do not age. And it requires heat resistance, transparency and printability, and is molded by extrusion or solution casting. It is mainly used for film materials such as sign plates, computers, office equipment, household electrical appliances, nameplates, automobile instrument panels, membrane switches, etc.

On the other hand, the low temperature sputtering according to an embodiment of the present invention, when the primary low temperature Nb205 sputtering is completed on the lower surface of the IMDSL injection to maintain the permeability and adhesion on the window IMDSL injection (or background), the secondary low temperature SiO2 sputtering After that, it may include ITO sputtering again to make an electrical shape.

In addition, the deposition method of the IMDSL injection ITO deposit 210 layer according to an embodiment of the present invention includes 1) vacuum plating (Vacuum Plating, Evaporation), 2) ion plating, 3) low temperature sputtering (Low Temperature Sputtering) ) And the like. Among them, in the embodiment of the present invention, the low-temperature sputtering is excellent in the permeability and adhesion of the base material having the uniformity of the capacitance-type touch screen panel resistance and the flexibility of the IMDSL injection plastic, and the most suitable for forming the IMDSL injection ITO deposit layer. This is used.

And in order to stably mold the IMDSL injection ITO deposit according to an embodiment of the present invention, low temperature sputtering may be performed, and the temperature may include 80 ° C. or less.

Here, sputtering is a technique of attaching a film to the surface of an object, that is, in the case of forming a thin film or a thick film by evaporating a solid in a high vacuum state to make an electronic circuit in a ceramic or semiconductor material. Used for

On the other hand, the low temperature sputtering method according to an embodiment of the present invention is used for low-temperature deposition, such as injection molding simultaneous transfer surface treatment method of IMD (In-Mould Decoration) injection molding having flexibility such as plastic Nb205 (Niobium205), a acceptor additive (or low temperature sintering), and a high-quality SiO2 thin film used to form an insulating film on a flexible substrate (or electronic device), such as the IMD injection, are manufactured by a coating method at a processing temperature of 100 ° C or lower. Speaks of technology.

Therefore, embodiments of the present invention to improve the problems such as light transmittance degradation and design design limitations generated when laminating the conventional tempered glass 101 and ITO film 102 in a separate OCA (103) It utilizes the characteristics of low temperature sputtering. That is, by integrating the IMDSL injection product 211 and the ITO film 214 into one by low temperature sputtering, the thickness of the touch screen panel can be made thinner from one slimmer IMDSL injection ITO deposit 210 layer. Rather, there is a feature that can freely design the design as the designer intended.

According to an embodiment of the present invention, the first electrode 220 includes an electrical wiring circuit that is pre-patterned on the bottom edge of the IMDSL injection ITO deposit layer and AG-printed with silver powder. can do.

In other words, the first electrode 220 is a means by which an electrical wiring circuit is patterned in advance and printed in silver powder, and the lower surface of the IMDSL injection ITO deposit 210 is molded in a touch screen panel. According to the present invention, an ITO patterning layer of a sensing electrode, such as a specific type of ITO film, may be formed, wherein the first electrode 220 is formed on a lower edge of the IMDSL injection ITO deposit (film) 210. Is printed, and the printing method of the first electrode 220 is AG printed 222 using silver powder having excellent electrical conductivity.

In the first substrate according to the embodiment of the present invention, a window printing layer (not shown) capable of inserting a letter or a logo is formed on a lower surface of the first substrate, and the window printing layer is embedded in the IMDSL injection ITO deposit layer. It may include being.

This embodiment of the present invention is because the above-mentioned In-Mould Decoration (IMD) injection mold can insert various patterns on the surface of the molded article by molding at the same time by inserting a transparent film printed pattern.

Referring to FIG. 2, the flexible printed circuit (FPC) bonding 230 is bonded to an electrical wiring circuit terminal of the first substrate 200, and the circuit is formed on a flexible insulating film. It is a circuit board. In other words, it is a substrate using heat-resistant plastic film such as polyester (PET) or polyimide (PI), which is a flexible material, and is bent, overlapped, folded, or curled in the heads of video cameras, car stereos, computers, and printers. Due to the flexibility of twisting and the like, effective use of space and three-dimensional wiring are possible. In addition, it is widely used in thin electronic components such as liquid crystal displays (LCDs) such as mobile phones, and is also used as a raw material for tape automated bonding (TAB) or tape ball grid array (BGA).

Referring to FIG. 2, the second substrate 300 is disposed on one surface of a liquid crystal display such as a mobile phone to electrically input information to a liquid crystal display module (not shown) in which an image is formed. , A kind of coating film layer disposed at regular intervals from the first substrate 200, the lower portion of the transparent (ITO) film 320, the stress of the adhesive portion due to the rapid heating or rapid cooling of the product or cracking of the adhesive portion, etc. The electrical wiring circuit is patterned by the electrothermal treatment 331 and the wet etching 332 which forms a thin film on the substrate (or ITO film) and forms a circuit pattern through chemical etching to prevent silver. Silver) has a coating film layer having a second electrode 330 printed with powder.

In this case, like the first substrate 200 described above, the second substrate 300 may be sputtered at the same time with the ITO film and the second electrode 330.

Referring to FIG. 2, the second electrode 330 according to the exemplary embodiment of the present invention may be formed of silver powder by patterning an electrical wiring circuit in advance on a lower edge of the ITO film 320 layer. May include being printed.

In other words, the second electrode 330 is printed with silver powder after the electrical wiring circuit is patterned in advance, and AG printing printed with silver powder has a lower edge of the ITO film 320. It is formed in the (Edge) part.

In addition, after the second electrode 330 printed with silver powder is dried, the second substrate is fully cut to a preset standard.

Meanwhile, referring to FIG. 3, an actual photograph of a first substrate formed by low temperature sputtering of an IMDSL ejection ITO deposit on a capacitive IMDSL ejection touch screen panel according to an embodiment of the present invention is shown. Hereinafter, a detailed description of the first substrate is omitted because it was mentioned above.

Referring to FIG. 4, an optical clear adhesive (OCA, 400) may be used to form a first substrate 200 and a second substrate during molding of a capacitive IMDSL injection touch screen panel according to an embodiment of the present invention. 300), and is a means for invisibly supplementing the patterning on the indium tin oxide (ITO) film.

In other words, the light transparent adhesive (OCA, 400) is invisibly complementary and insulating patterning on the ITO film 320, the first electrode 220 of the first substrate and the sensing electrode of the second substrate. It is a means for bonding the layer of the coating film 300 having a first electrode 220 of the first substrate 200 and the second electrode 330 of the second substrate as an adhesive member to be attached to each other. At this time, OCA is not laminated on the FPC bonding terminal part.

After the fabrication of the first and second substrates 200 and 300 is completed and the OCA lamination of the first and second substrates 200 and 300 is completed, the first and second substrates 200 and 300 are cut to fit the cell size of the film. Computer Numerical Control (CNC) can also be performed to determine if the cutting was successful.

On the other hand, the capacitive IMDSL injection touch screen panel according to an embodiment of the present invention has a two-layer structure, the thickness may include 0.6 ~ 0.968T.

Here, with reference to FIG. 5, the thickness of the capacitive IMDSL injection touch screen panel according to an exemplary embodiment of the present invention will be described in detail with a real picture so as to easily compare the thickness of the capacitive touch screen panel. .

Looking through the real picture, the present invention is the first substrate 200 to be the IMDSL injection ITO deposit 210 and the first electrode 220, and the second substrate of the ITO film 320 and the second electrode 330 A two-layer structure having a 300 has a thickness of 0.6 to 0.968T, whereas the general capacitance type touch screen panel according to FIG. 1 is made of tempered glass 101, ITO film 102, or the like. It consists of a three-layer structure which has the 1st board | substrate 100 and the 2nd board | substrate 110 provided with an ITO film, a 2nd electrode, etc., and the thickness is 0.65-1.268T. Therefore, the thickness difference between 0.05 and 0.3T is shown between the present invention and the general capacitive touch screen panel.

Referring to Figure 6, the present invention by molding the IMDSL injection ITO deposits by the injection molding simultaneous transfer surface treatment method to have a flexibility, such as plastic, to produce products of various designs by replacing the pattern film while maintaining the existing injection And design change is possible by replacing the film, so it is easy to apply additional design, and the design of the design is more freely by slimming the panel.

As described above, the capacitive IMDSL injection touch screen panel according to the embodiment of the present invention is a flexible substrate formed on the first substrate 200 having the IMDSL injection ITO deposit layer and the electrical wiring circuit terminal portion of the first substrate. An optical transparent adhesive for attaching the first / second substrate with a second substrate 300 having a flexible printed circuit (FPC) bonding 230 and having a coating film layer Clear Adhesive: By forming the OCA (400), there is no need for a separate OCA (Optical Clear Adhesive, 103) to form a lamination by forming a sensing electrode such as ITO film 102 in the conventional tempered glass 101 In addition, the thinner panel, which is thinner and more durable, allows for more freedom in design design. In addition, the slimness greatly improves the light transmittance and realizes the same performance as the existing products even when the display brightness is reduced, which can significantly reduce power consumption and increase battery usage time. There is no need to change the color due to the difference in thickness, and each component can be integrated, so the cost reduction effect can be expected. In addition, by integrating the sensing electrode (or ITO film) directly into the IMDSL injection by low temperature sputtering, lamination using a separate adhesive material such as OCA is not necessary. Therefore, it is possible to reduce the adhesive material due to lamination and to shorten the working time to achieve low carbon green growth. It has a unique feature.

The above description is merely illustrative of the technical idea of the present invention, and those skilled in the art to which the present invention pertains may make various modifications and changes without departing from the essential characteristics of the present invention. Therefore, the embodiments disclosed in the present invention are not intended to limit the technical idea of the present invention but to describe the present invention, and the scope of the technical idea of the present invention is not limited by these embodiments. The scope of protection of the present invention should be construed according to the following claims, and all technical ideas within the scope of equivalents should be construed as falling within the scope of the present invention.

100, 200: first substrate 101: reinforced glass
102: OCA 103, 320: ITO FILM
104: Silver P / T 105, 230: FPC bonding
110, 300: second substrate (coating film) 210: IMDSL injection ITO deposition
211: IMDSL injection 212: low temperature Nb205 sputtering
213: low temperature SiO2 sputtering 214: ITO film sputtering
220: first electrode 221: pattern etching
222, 333: AG print 223: Low temperature AG dry
331: electrothermal treatment 332: wet etching
334: AG dry 340: Full cutting
400: OCA lamination

Claims (8)

In In-Mould Decoration Slim Touch Screen Panel for Capacitive Type,
The panel is disposed at regular intervals from the second substrate, and the IMDSL is formed by low temperature sputtering at the same time by inserting an indium tin oxide (ITO) film that prints a desired pattern in a window IMDSL injection molding step. The first substrate 200 having a first electrode 220 which is patterned and printed with silver powder by patterning the electrical wiring circuit by the pattern etching at the bottom of the injection ITO deposit 210 and the IMDSL injection ITO deposit. )and;
It is bonded to the electrical wiring circuit terminal portion of the first substrate 200, and includes a flexible printed circuit (FPC) bonding (230) formed on the flexible insulating film,
In addition, the first substrate is disposed at regular intervals, the lower portion of the transparent (ITO) film 320, the heat treatment to prevent the occurrence of stress or the cracking of the adhesive portion due to the rapid heating or rapid cooling of the product The electrical wiring circuit by the wet etching 332 which forms a thin film on the 331 and the substrate (or ITO film) and forms a circuit pattern through chemical etching is patterned and printed with silver powder. A second substrate 300 having a coating film layer having a second electrode 330,
An optical clear adhesive (OCA, 400) is attached to the first substrate 200 and the second substrate 300, and invisibly compensates for patterning on an indium tin oxide (ITO) film. Capacitive IMDSL injection touch screen panel characterized in that it is included.
The method according to claim 1,
The IMDSL injection is a capacitive IMDSL injection touch screen panel, characterized in that made of a PC (Polycarbonate) having flexibility to enable a desired design design.
delete The method according to claim 1,
The low temperature sputtering, after completion of the first low temperature Nb205 sputtering and the second low temperature SiO2 sputtering on the lower surface of the IMDSL injection in order to maintain the permeability and adhesion on the window IMDSL injection, ITO sputtering again to form an electrical shape Capacitive IMDSL injection touch screen panel.
The method according to claim 1,
The first electrode is a capacitive IMDSL injection touch screen panel, characterized in that the electrical wiring circuit is pre-patterned on the lower edge (Edge) of the IMDSL injection ITO deposit and printed with silver powder.
The method according to claim 1,
The first substrate, a window printing layer (not shown) for inserting a letter or logo can be formed on the lower surface of the first substrate, the window printing layer is characterized in that it is embedded in the IMDSL injection ITO deposit layer IMDSL injection touch screen panel.
The method according to claim 1,
The second electrode is a capacitive IMDSL injection touch screen panel, characterized in that the electrical wiring circuit is pre-patterned on the bottom edge of the ITO film 320 layer and printed with silver powder. .
The method according to claim 1,
The capacitive IMDSL injection touch screen panel is a capacitance IMDSL injection touch screen panel, characterized in that the thickness is 0.6 ~ 0.968T.

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